Camera module packaging process

Abstract

The invention relates to the field of camera module packaging, and particularly discloses a camera module packaging process. Comprising the following steps that 1, an L-shaped groove is formed in the lower portion of a support, and the depth of the L-shaped groove is 2-5 mm; assembling the camera module to obtain a semi-finished product; 2, glue is injected to the periphery of the semi-finished support, and the glue is made to make contact with the support and the substrate at the same time; and step 3, packaging can be completed after the glue is cured. According to the camera module packaging process, the problem that the length and the width of the camera module are large can be solved.

Description

Technical Field

[0001] The present invention relates to the field of camera module packaging, and in particular to a camera module packaging process. Background Art

[0002] The camera module is an indispensable part in current mobile phones. The current mobile phone camera module, as shown in the patent camera module and electronic device disclosed in application number CN202010411953.2, includes a lens, a mounting frame, a base, a photosensitive chip, a circuit substrate and a bracket. The mounting frame is provided with a mounting hole, the lens is arranged in the mounting hole of the mounting frame, the base is arranged at the bottom of the mounting frame, the base is provided with a through hole connected to the mounting hole, the circuit substrate is arranged at the bottom of the base, the photosensitive chip is electrically connected to the circuit substrate, the photosensitive chip corresponds to the lens, the bracket cooperates with the mounting frame and surrounds the outer side wall of the mounting frame, the outer periphery of the base is provided with a boss that cooperates with the bracket, and the bracket is installed on the boss.

[0003] During the assembly of the camera module, it is also necessary to dispense glue at the bottom of the bracket to fix the bracket when installing it. However, the space in the current camera module is small. In order to avoid the glue needle from contacting the electronic components and causing damage to the electronic components, in the current camera module, a space of about 0.5 cm is usually reserved between the side wall of the bracket and the closest electronic component, which results in the length and width of the bracket being at least 1 cm larger. At present, the requirements for the thickness and other dimensions of mobile phones are getting higher and higher, so the requirements for the dimensions of various components in mobile phones are also getting higher and higher, and the size of the camera module needs to be further reduced. Summary of the invention

[0004] The present invention intends to provide a camera module packaging process to solve the problem of large length and width of the camera module.

[0005] To achieve the above object, the present invention adopts the following technical solution: a camera module packaging process, comprising the following steps:

[0006] Step 1: An L-shaped groove is provided at the bottom of the bracket, and the depth of the L-shaped groove is 2 to 5 mm; the camera module is assembled to obtain a semi-finished product;

[0007] Step 2: Inject glue around the semi-finished product bracket and make the glue contact with the bracket and the substrate at the same time;

[0008] Step 3: After the glue solidifies, the packaging is completed.

[0009] The beneficial effects of this program are:

[0010] An L-shaped groove is provided at the bottom of the bracket in this solution, and a space for accommodating glue is formed between the L-shaped groove and the substrate. When the glue is injected into the periphery of the bracket in step 2, the glue will enter the L-shaped groove to fix the bracket to the substrate. The space for accommodating glue can accommodate more glue, so that the glue can fully fix the bracket to the substrate. Therefore, after the camera module is packaged using the packaging process in this solution, the bracket and the substrate no longer need to be fixed by dispensing glue.

[0011] Compared with the traditional glue dispensing method, in this solution, the side walls of the bracket serve to shield the electronic components inside during packaging, so there is no risk of the glue needle contacting the electronic components and causing damage to them. Therefore, there is no need to reserve a 5mm protective gap between each side wall of the bracket and the electronic components inside. The side walls of the bracket can be closer to the electronic components inside. Therefore, when the space occupied by the electronic components inside is the same, the width and length of the bracket in this solution are smaller.

[0012] Secondly, during the actual packaging process, because there is no risk of the glue needle damaging the electronic components inside, workers do not need to slow down the glue injection speed to avoid the glue needle moving too far and causing contact with the electronic components. Therefore, the workers' glue injection speed is faster, making the packaging efficiency higher.

[0013] Finally, the glue formed by the encapsulation of this solution is wrapped around the outer side of the lower part of the bracket, which can protect and buffer the bracket, increase the strength of the bracket, and avoid damage to the bracket during movement and use. At the same time, the encapsulation process of the present invention produces fewer particles and will not cause damage to the electronic components inside the camera module.

[0014] Furthermore, in step 1, the chip is cleaned before assembling the camera module.

[0015] The beneficial effect of this solution is that cleaning can remove stains and dust on the chip, preventing stains and dust from entering the inside of the camera module and causing electronic component failure.

[0016] Furthermore, in step 1, after completing the assembly of the camera module, the gold wire is first welded to the outside of the bracket.

[0017] The beneficial effects of this solution are as follows: welding the gold wire first and then performing the glue injection in step 2 can prevent the glue from blocking the substrate and causing the gold wire to be unable to be installed; and arranging the gold wire on the outside of the bracket can further reduce the number of electronic components in the bracket, thereby reducing the length and width of the bracket. Although the gold wire is located on the outside of the bracket, when performing the glue injection in step 2, the glue will cover the gold wire and protect the gold wire, so the gold wire in this solution will not fall off or be damaged during use.

[0018] Furthermore, in step 2, a mold is used for glue injection, and the mold is provided with an annular groove, a glue inlet and a glue outlet, and the glue inlet and the glue outlet are both connected to the annular groove. When injecting glue, the semi-finished product is first placed in the mold; the glue is injected into the annular groove through the glue inlet until glue flows out of the glue outlet; in step 3, after the glue solidifies, the camera module is removed from the mold to complete the packaging.

[0019] The beneficial effect of this solution is: using a mold for packaging, when performing glue injection in step 2, the mold can limit the glue to ensure that the glue is completely wrapped around the outside of the camera module, thereby improving the packaging effect.

[0020] Furthermore, in step 3, after the camera module is taken out of the mold, the material heads formed by the glue at the glue inlet and glue outlet are removed.

[0021] The beneficial effect of this solution is that after removing the material head, the camera module is smaller in size and easier to install.

[0022] Furthermore, an upper cover is provided above the mold, two lower grooves are provided on the top of the mold, and two upper grooves are provided on the bottom of the upper cover, the two upper grooves are respectively opposite to the two lower grooves, one of the lower grooves and the corresponding upper groove form a glue inlet, and the other lower groove and the corresponding upper groove form a glue outlet; in step 3, when taking out the camera module, first open the upper cover, and then move the camera module upward relative to the mold to take it out.

[0023] The beneficial effect of this solution is: in step 3 of this solution, when taking out the camera module, the upper cover is opened, and the material head formed by the glue inlet and outlet is no longer blocked by the upper cover, so the camera module can be quickly taken out by directly turning it upward, which is simple to operate and more efficient to take out.

[0024] Furthermore, in step 1, when assembling the camera module, the capacitor is welded to the outside of the bracket, and a glue injection space is formed between the capacitor and the side wall of the bracket.

[0025] The beneficial effect of this solution is that when performing glue injection in step 2, the capacitor can limit the glue so that the glue is first wrapped around the outside of the bracket, thereby improving the packaging effect.

[0026] Furthermore, in step 1, a through hole penetrating the side wall of the bracket is provided on the side wall of the bracket before assembly.

[0027] The beneficial effect of this solution is that when performing the glue injection in step 2, the glue enters the inner side of the bracket through the through hole, and fixes the bracket to the substrate from the inner and outer sides of the bracket, thereby improving the packaging effect. At the same time, the glue entering the bracket can also fix the electronic components on the inner side of the bracket, so that it is no longer necessary to fix several electronic components one by one, further improving the packaging efficiency, and after the glue solidifies, the entire camera module is connected as a whole. During the use of the camera module, the glue plays a buffering and fixing effect, avoiding damage or displacement of electronic components, and improving the service life of the camera module.

[0028] Secondly, after the glue in the present invention is wrapped on the camera module, it can prevent foreign matter such as dust from the outside from falling into the camera module and causing damage to the electronic components in the camera module.

[0029] Further, step 3 includes a first baking at 880000-920000 mj / cm 2 , bake at 100-110℃ for 4-6 hours.

[0030] The beneficial effect of this solution is that the glue can be quickly cured through the first baking, and the camera module can be initially fixed, thereby accelerating the packaging efficiency.

[0031] Further, step 3 also includes a second baking at 880000-920000 mj / cm 2 , bake at 130-130℃ for 2-4 hours.

[0032] The beneficial effect of this solution is that the second baking can further improve the curing speed and curing effect of the glue. The glue filling in this solution can be completed at low temperature and low pressure, the chip is subjected to less stress and is not easily damaged during the packaging process, so it can also improve the production qualification rate of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a packaging schematic diagram of Embodiment 1 of the present invention;

[0034] Figure 2 This is a schematic diagram of the packaging of Comparative Example 1 in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of packaging of Comparative Example 2 in an embodiment of the present invention;

[0036] Figure 4 This is a schematic diagram of the structure of the mold in Example 1 of the present invention. DETAILED DESCRIPTION

[0037] The following is further described in detail through specific implementation methods:

[0038] The reference numerals in the drawings of the specification include: a bracket 1 , an L-shaped groove 11 , a capacitor 2 , a mold 3 , a glue inlet 31 , a glue outlet 32 ​​, and an upper cover 4 .

[0039] Example 1

[0040] A camera module packaging process comprises the following steps:

[0041] Step 1: Figure 1 As shown, an LL-shaped groove 11 is provided at the lower part of the bracket 1, and the depth of the LL-shaped groove 11 is 2-5 mm, so that the vertical cross-section of the bracket 1 is T-shaped; a through hole penetrating the side wall of the bracket 1 is provided on the side wall of the bracket 1; the chip is first cleaned, and then the camera module is assembled, and finally the gold wire and the capacitor 2 are welded to the substrate outside the bracket 1, and the gold wire is located between the capacitor 2 and the bracket 1, and a semi-finished product is obtained, and at this time, a glue injection space is formed between the capacitor 2 and the bracket 1;

[0042] Step 2: Use mold 3 to inject glue and combine Figure 4 As shown, the mold 3 is provided with an annular L-shaped groove 11, a glue inlet 31 and a glue outlet 32, and the glue inlet 31 and the glue outlet 32 ​​are both connected to the annular L-shaped groove 11; then the camera module is placed into the mold 3 with the substrate facing downward, and then the upper cover 4 of the mold 3 is closed, and glue is injected into the mold 3 through the glue inlet 31, so that the glue is wrapped around the outer periphery of the semi-finished bracket 1, until glue flows out of the glue outlet 32, and the injected glue contacts the bracket 1 and the substrate at the same time;

[0043] Step 3: First baking, at 880000~920000mj / cm 2 , bake at 100-110℃ for 5 hours; the second bake at 880000-920000mj / cm 2 , bake at 130-130°C for 3 hours, open the upper cover 4 after the glue is solidified, take the camera module out of the mold 3, remove the glue head formed at the glue inlet 31 and the glue outlet 32, and complete the packaging. The glue used in the embodiment of the present invention is the glue of model A97-1DB of Henkel Company. In actual implementation, according to different glues, the glue curing step of step 3 in this embodiment is changed accordingly.

[0044] The mold 3 used in the above step 2 includes a sealing block, an opening for the substrate to pass through is formed between the sealing block and the mold 3, and an upper cover 4 is also provided. The upper cover 4 is pressed on the mold 3 and the sealing block. The top of the left side wall of the mold 3 and the top of the sealing block are both provided with a lower groove. The bottom of the upper cover 4 is provided with two upper grooves, and the two upper grooves are respectively opposite to the two lower grooves. One of the opposite upper grooves and the lower groove together constitutes a glue inlet 31, and the other opposite upper groove and the lower groove together constitute a glue outlet 32. The glue inlet 31 and the glue outlet 32 ​​in the mold 3 used in this embodiment are located on the two opposite side walls of the mold 3. When taking out the camera module in step 3, open the upper cover 4, and the material head formed by the glue in the glue inlet 31 and the glue outlet 32 ​​is no longer blocked by the upper cover 4, so the camera module can be directly taken out upwards.

[0045] The present invention discloses comparative example 1: Figure 3 As shown, the camera module is packaged in the MOC packaging method. During packaging, the glue dispensed is located on the outside of the bracket to fix the bracket.

[0046] The present invention also discloses comparative example 2: Figure 4 As shown, the camera module is packaged in a COM packaging manner, and the glue dispensed during packaging is also located on the outside of the bracket to fix the bracket.

[0047] After the glue is cured, the length and width, heat dissipation effect, structural strength, module flatness, and reliability of the camera module packaged by the present invention and the camera module packaged by Comparative Examples 1 and 2 are tested, and the packaging cost is tested and calculated. The test results and the calculation results are converted to "★" for representation, with five "★" as the full score. The larger the data, the more "★" there are. The results are shown in the following table:

[0048]

[0049] The present invention discloses a COM packaging method. From the above test results, it can be seen that the camera module packaged by the packaging process of this embodiment 1 is smaller in size and has a larger structural precision than the camera module packaged by the comparative example 2 which also adopts the COM packaging method. Even compared with the camera module packaged by the comparative example 1 which adopts the MOC packaging method, the camera module has better flatness and reliability. Moreover, compared with the packaging method of the comparative example 1, the packaging cost of the present invention is lower.

[0050] The above is only an embodiment of the present invention, and the common knowledge such as the known specific technical solutions and / or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the technical solution of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A camera module packaging process, characterized in that: The following steps are involved: Step 1: An L-shaped groove is provided at the bottom of the bracket, and the depth of the L-shaped groove is 2 to 5 mm; the camera module is assembled to obtain a semi-finished product; Step 2: Inject glue around the semi-finished product bracket and make the glue contact with the bracket and the substrate at the same time; Step 3: After the glue solidifies, the packaging is completed.

2. The camera module packaging process according to claim 1, characterized in that: Step 1: Before assembling the camera module, clean the chip first.

3. The camera module packaging process according to claim 1, characterized in that: Step 1: After completing the assembly of the camera module, first solder the gold wire to the outside of the bracket.

4. The camera module packaging process according to claim 1, characterized in that: In step 2, glue is injected into a mold, wherein the mold is provided with an annular groove, a glue inlet and a glue outlet, and both the glue inlet and the glue outlet are connected to the annular groove. When injecting glue, first place the semi-finished product into the mold; inject glue into the annular groove through the glue inlet until glue flows out of the glue outlet; in step 3, after the glue solidifies, remove the camera module from the mold to complete the packaging.

5. A camera module packaging process according to claim 4, characterized in that: Step 3: After taking the camera module out of the mold, remove the glue heads formed at the glue inlet and glue outlet.

6. The camera module packaging process according to claim 4, characterized in that: An upper cover is provided above the mold, two lower grooves are provided on the top of the mold, and two upper grooves are provided at the bottom of the upper cover. The two upper grooves are respectively opposite to the two lower grooves, one of the lower grooves and the corresponding upper groove form a glue inlet, and the other lower groove and the corresponding upper groove form a glue outlet; in step 3, when taking out the camera module, first open the upper cover, and then move the camera module upward relative to the mold to take it out.

7. The camera module packaging process according to claim 1, characterized in that: Step 1: When assembling the camera module, weld the capacitor to the outside of the bracket and form a glue injection space between the capacitor and the side wall of the bracket.

8. The camera module packaging process according to claim 1, characterized in that: Step 1: Before assembly, a through hole is set on the side wall of the bracket to penetrate the side wall of the bracket.

9. The camera module packaging process according to claim 1, characterized in that: Step 3 includes the first bake, at 880,000 to 920,000 mj / cm 2 , bake at 100-110℃ for 4-6 hours.

10. The camera module packaging process according to claim 9, characterized in that: Step 3 also includes a second baking at 880,000 to 920,000 mj / cm 2 , bake at 130-130℃ for 2-4 hours.

Images