Novel antioxidant contact
By using a silver conductive layer in the conductive contacts and covering the oxidation-resistant ruthenium-based resistive layer, the problems of easy oxidation and expensive gold and silver are solved, and the effect of reducing production costs and suitable for large-scale production is achieved.
Patent Information
- Application Number
- CN202510067428.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2025-03-21
AI Technical Summary
In the prior art, gold and silver, as conductive contact materials, have problems such as expensive and easy oxidation, and it is difficult to meet the needs of mass production.
A silver conductive layer is adopted and covered with a ruthenium-based resistive layer with antioxidant properties. The contact between silver and air is isolated through the resistance layer, thereby reducing the possibility of oxidation of silver, and reducing the overall resistance through the parallel structure of the ruthenium-based resistive paste.
It effectively reduces the oxidation possibility of the silver conductive layer, reduces production costs, is suitable for large-scale production, and the ruthenium-based resistive paste meets the requirements of conductive materials through parallel structure.
Smart Images
Figure CN119676943A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of conductive contact manufacturing, and in particular to a novel anti-oxidation contact. Background Art
[0002] Conductive contacts refer to the contact points between two or more electrical components in the electronics industry for electrical connection.
[0003] In the related art, gold or silver is usually used as the contact material on the circuit board substrate. Although gold and silver have excellent conductivity, gold is relatively expensive and silver is easily oxidized. Therefore, there are obvious shortcomings in using these two materials as contacts. Summary of the invention
[0004] In order to improve the problem that gold or silver has obvious defects as contacts, the present application provides a new type of anti-oxidation contact.
[0005] The novel anti-oxidation contact provided in this application adopts the following technical solution: A novel anti-oxidation contact comprises a silver conductive layer arranged on a circuit board substrate, wherein the silver conductive layer is covered with a resistor layer having an anti-oxidation property.
[0006] By adopting the above technical solution, the resistance layer isolates the contact between the silver conductive layer and the air, reducing the possibility of silver oxidation. Compared with using gold as a contact, the price of silver is relatively cheap, so it is suitable for mass production of conductive contacts.
[0007] Optionally, the resistor layer is made of ruthenium-based resistor paste.
[0008] By adopting the above technical solution, the ruthenium-based resistor slurry has strong oxidation resistance and strong acid corrosion resistance, stable structure and low price.
[0009] In summary, the present application includes at least one of the following beneficial technical effects: 1. The resistance layer isolates the silver conductive layer from the air, reducing the possibility of oxidation of the silver conductive layer. Compared with gold as a contact, silver is relatively cheap, so it is suitable for mass production of conductive contacts; 2. Since the ruthenium resistor paste is conductive and covers the silver conductive layer, a parallel connection is formed between the two, thereby reducing the resistance in disguise, so that the ruthenium resistor paste with higher resistivity can be used as a conductive material for contacts. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a schematic diagram of the structure of an embodiment of the present application.
[0011] Figure 2It is a cross-sectional view showing the positional relationship between the circuit board substrate, the silver conductive layer and the resistor layer in the embodiment of the present application.
[0012] Explanation of reference numerals: 1. circuit board substrate; 2. silver conductive layer; 3. resistor layer. DETAILED DESCRIPTION
[0013] The following is combined with Figure 1-2 This application is described in further detail.
[0014] The embodiment of the present application discloses a novel anti-oxidation contact.
[0015] Reference Figure 1 and Figure 2 The novel anti-oxidation contact comprises a silver conductive layer 2 arranged on a circuit board substrate 1 and made of metallic silver, the silver conductive layer 2 is covered with a resistor layer 3, and the resistor layer 3 has strong anti-oxidation performance.
[0016] Reference Figure 2 The resistance layer 3 isolates the contact between silver and air, reducing the possibility of silver oxidation. Compared with gold as a contact, silver is relatively cheap, so it is suitable for mass production of conductive contacts.
[0017] Reference Figure 2 During the production process, the resistor layer 3 is made of ruthenium resistor slurry. The ruthenium resistor slurry has a stable structure, strong oxidation resistance and strong acid corrosion resistance, and is suitable for mass production of conductive contacts, which greatly reduces the production cost of conductive contacts.
[0018] However, the prior art generally does not use ruthenium-based resistor paste as a conductive material because the ruthenium-based resistor paste has a high resistivity, which consumes a large amount of power and generally generates a large amount of heat during operation.
[0019] Reference Figure 2 In the present application, the ruthenium resistor paste is covered on the silver conductive layer 2, and the two form a parallel state, which reduces the overall resistance of the contact in disguise, thereby making the ruthenium resistor paste meet the requirements as a conductive material.
[0020] It can be seen that the ruthenium-based resistor paste used as the conductive material for contacts in the present application breaks the ideological barriers in the prior art and expands the application of ruthenium-based resistor paste in the field of conductive contacts.
[0021] The implementation principle of a new type of anti-oxidation contact in the embodiment of the present application is: Ruthenium resistor paste has a stable structure, strong anti-oxidation and strong acid corrosion resistance, and its covering effect on silver isolates the contact between silver and air, reducing the possibility of silver oxidation.
[0022] The covering effect of ruthenium resistor paste on silver makes the two form a parallel connection, thereby reducing the overall resistance of the contact in disguise. Therefore, ruthenium resistor paste meets the requirements as a conductive material. In addition, the price of silver and ruthenium resistor paste is relatively cheap, which reduces the production cost of conductive contacts and is suitable for mass production of conductive contacts.
[0023] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A new type of anti-oxidation contact, characterized by: The invention comprises a silver conductive layer (2) arranged on a circuit board substrate (1); the silver conductive layer (2) is covered with a resistance layer (3) having an anti-oxidation property.
2. The novel anti-oxidation contact according to claim 2 is characterized in that: The resistor layer (3) is made of ruthenium-based resistor paste.