A heat dissipation assembly, an air conditioner and a control method

Abstract

The application belongs to the technical field of machine room air conditioners, and discloses a heat dissipation assembly, an air conditioner and a control method. The heat dissipation assembly comprises a heat exchange component and a heat exchange flow path set. The heat exchange component can generate heat exchange with a driving plate through a first heat exchange surface. The heat exchange flow path set is arranged on the side of a second heat exchange surface, so that the heat exchange flow path set can generate heat exchange with the heat exchange component. The heat exchange flow path set comprises a first flow path and a second flow path. The first flow path uses condensed water as a heat exchange medium, and the second flow path uses refrigerant as a heat exchange medium. The condensed water is used as the heat exchange medium in the first flow path and is circulated, so that the heat exchange with the heat exchange component can be realized. By arranging the heat exchange flow path set and controlling the heat exchange flow path set to generate heat exchange in different modes, the working energy consumption of the heat dissipation assembly can be reduced under the premise of ensuring the effective cooling of the driving plate, so that the driving plate can work in good working conditions when it is in a standard load state or a higher load state.

Description

Technical Field

[0001] This invention relates to the field of computer room air conditioning technology, and in particular to a heat dissipation component, an air conditioner, and a control method. Background Technology

[0002] Currently, in the related technologies of data center air conditioning, data center air conditioners are widely used in environments such as data centers, base stations, and power cabinets to cool down units or batteries. Data center air conditioners need to use refrigerant as a heat exchange medium, and cool down the units or batteries by absorbing heat when the refrigerant evaporates. However, since the temperature of the refrigerant when evaporating and absorbing heat is lower than the dew point temperature of water, the surface temperature of the drive board of the data center air conditioner is easily too low when cooling the units or batteries. This can lead to condensation on the surface of the drive board, which can affect the normal operation of the drive board and increase the failure risk of the data center air conditioner. Summary of the Invention

[0003] The technical problem to be solved by the present invention is that when the air conditioner in the computer room cools the unit or battery, the surface temperature of the drive board of the air conditioner is easily too low, which makes the surface of the drive board risk of condensation. To this end, a heat dissipation component, an air conditioner and a control method are provided.

[0004] This invention aims to provide a heat dissipation assembly for heat dissipation of the drive plate of an air conditioner. The heat dissipation assembly includes a heat exchange element and a heat exchange flow path assembly. The heat exchange element has a first heat exchange surface and a second heat exchange surface opposite each other along the thickness direction, with the second heat exchange surface abutting against the drive plate. The heat exchange flow path assembly is disposed on the first heat exchange surface and includes a first flow path and a second flow path. The first flow path uses at least the condensate generated by the evaporator of the air conditioner as the heat exchange medium, and the second flow path uses refrigerant as the heat exchange medium. The heat exchange flow path assembly is configured to control the operating mode of the heat exchange flow path assembly according to the temperature value of the drive plate. The operating modes of the heat exchange flow path assembly include a first operating mode in which both the first and second flow paths are open, and a second operating mode in which the first flow path is open and the second flow path is closed.

[0005] In some technical solutions, the heat dissipation assembly also includes a backplate, which is connected to the heat exchange component to form a heat exchange cavity, and the heat exchange flow path group runs through the heat exchange cavity.

[0006] In some technical solutions, both the first flow path and the second flow path are provided with reversing ends; the heat dissipation assembly also includes a limiting plate, which abuts against the reversing ends of the first flow path and the second flow path.

[0007] In some technical solutions, the first heat exchange surface is in contact with the first flow path and / or the second flow path.

[0008] In some technical solutions, the backplane is attached to the first flow path and / or the second flow path.

[0009] In some technical solutions, the heat dissipation component also includes: a shut-off valve and a controller. The shut-off valve is located in the second flow path and is used to control the opening and closing of the second flow path. The shut-off valve is electrically connected to the controller and is used to control the opening and closing of the shut-off valve. The controller is configured to: control the shut-off valve to close under normal temperature conditions to disconnect the second flow path, and control the shut-off valve to open under the first working mode to allow the second flow path to flow.

[0010] In some technical solutions, the heat dissipation component also includes a temperature sensing module. The temperature sensing module is located on the drive board and electrically connected to the controller. It is used to acquire the temperature value of the drive board and feed it back to the controller. The controller is configured to: when the temperature value of the drive board is equal to or greater than a first preset value, the controller controls the shut-off valve to open, so that the second flow path can be circulated; when the temperature value of the drive board is equal to or less than the second preset value, the controller controls the shut-off valve to close, so that the second flow path is disconnected, and the first preset value is greater than the second preset value.

[0011] In some technical solutions, an air conditioner is provided for humidifying a computer room, including a drive board and a heat dissipation component as described above.

[0012] In some technical solutions, the air conditioner also includes a water storage tank and a heating element. The outlet of the first flow path is connected to the water storage tank. The heating element is located in the water storage tank and is used to evaporate the water in the water storage tank to humidify the computer room.

[0013] In some technical solutions, the heat exchange flow path group further includes a third flow path, the outlet end of which is connected to the water storage tank, and the inlet end of which is connected to the water supply source of the water storage tank. The third flow path is disposed on the first heat exchange surface; or, the inlet end of the first flow path is connected to the water supply source of the water storage tank.

[0014] In some technical solutions, the heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid surface of the water tank.

[0015] In some technical solutions, a control method is provided for controlling the heat dissipation component as described above, including:

[0016] Continuously acquire the temperature value of the driver board;

[0017] The operating mode of the heat exchange flow path group is controlled according to the temperature value of the drive board.

[0018] In some technical solutions, the operating modes of the heat exchange flow path assembly are controlled based on the temperature value of the drive board, including:

[0019] Determine if the temperature of the driver board is lower than the first preset value;

[0020] If so, control the flow in the first flow path to cool the drive board;

[0021] If not, control the flow in the second flow path while maintaining the flow in the first flow path to cool the driver board together.

[0022] Determine if the driver board temperature is higher than the second preset value;

[0023] If so, maintain the flow in both the first and second flow paths to cool the driver board together;

[0024] If not, disconnect the second flow path and keep the first flow path open to cool the drive board;

[0025] Wherein, the first preset value is greater than the second preset value.

[0026] The technical solution provided by this invention has the following advantages compared with related technologies:

[0027] Using condensate as the heat exchange medium in the first flow path, the heat exchange between the first flow path and the heat exchanger at room temperature is sufficient to meet the cooling requirements of the drive plate. This saves energy consumption generated by the second flow path and avoids the risk of condensation on the drive plate surface caused by excessively low temperatures in the second flow path. In the first operating mode, due to the high load on the drive plate, a large amount of heat is generated, requiring rapid cooling. In this case, the first flow path is kept open, and the second flow path is opened, allowing the refrigerant to also participate in cooling the drive plate. The combined cooling of the drive plate by the first and second flow paths ensures that the drive plate can operate under good conditions even under high load. Attached Figure Description

[0028] The accompanying drawings, as part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention, but do not constitute an undue limitation of the invention. Obviously, the drawings described below are merely some embodiments, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In the drawings:

[0029] Figure 1 This is a schematic diagram of the heat dissipation assembly shown in an embodiment of the present invention;

[0030] Figure 2 This is one of the flowcharts of the control method shown in the embodiments of the present invention;

[0031] Figure 3 This is the second flowchart of the control method shown in the embodiment of the present invention.

[0032] In the diagram: 100-Drive board, 200-Heat dissipation component, 210-Heat exchanger, 212-First heat exchange surface, 220-Heat exchange flow path group, 222-First flow path, 224-Second flow path, 230-Back plate, 232-Heat exchange cavity, 240-Limiting plate.

[0033] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the invention in any way, but rather to illustrate the concept of the invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0034] In the description of this invention, it should be noted that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0035] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "contact," and "communication" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0036] In the related technologies of data center air conditioning, data center air conditioners are commonly used in environments such as data centers, base stations, and power cabinets to cool down units or batteries. Data center air conditioners need to use refrigerant as a heat exchange medium. They cool down the units or batteries by absorbing heat during the evaporation of the refrigerant. However, since the temperature of the refrigerant when evaporating and absorbing heat is lower than the dew point temperature of water, the surface temperature of the drive board of the data center air conditioner is easily too low when cooling the units or batteries. This can lead to condensation on the surface of the drive board, which can affect the normal operation of the drive board and increase the failure risk of the data center air conditioner.

[0037] Based on this technical problem, the following embodiments are proposed.

[0038] Example 1

[0039] like Figure 1 As shown, this embodiment proposes a heat dissipation component 200 for heat dissipation of the drive board 100 of an air conditioner. The heat dissipation component 200 includes:

[0040] The heat exchanger 210 has a first heat exchange surface 212 and a second heat exchange surface that are opposite each other along the thickness direction, and the second heat exchange surface is attached to the drive plate 100.

[0041] Heat exchange flow path group 220 is disposed on the first heat exchange surface 212. Heat exchange flow path group 220 includes a first flow path 222 and a second flow path 224. The first flow path 222 uses at least the condensate generated by the evaporator of the air conditioner as the heat exchange medium, and the second flow path 224 uses refrigerant as the heat exchange medium.

[0042] The heat exchange flow path group 220 is configured to control the working mode of the heat exchange flow path group 220 according to the temperature value of the drive plate 100. The working modes of the heat exchange flow path group 220 include a first working mode in which both the first flow path 222 and the second flow path 224 are open, and a second working mode in which the first flow path 222 is open and the second flow path 224 is closed.

[0043] In this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 includes a heat exchanger 210 and a heat exchange flow path assembly 220. The heat exchanger 210 has a first heat exchange surface 212 and a second heat exchange surface, which can perform heat exchange. The first heat exchange surface 212 and the second heat exchange surface are arranged opposite to each other along the thickness direction of the heat exchanger 210, and the second heat exchange surface is attached to the drive plate 100, so that the heat exchanger 210 can exchange heat with the drive plate 100 through the second heat exchange surface, transferring the heat on the drive plate 100 to the heat exchanger 210, thereby cooling the drive plate 100. The heat exchange flow path assembly 220 is disposed on one side of the second heat exchange surface, so that the heat exchange flow path assembly 220 can exchange heat with the heat exchanger 210, thereby cooling the heat exchanger 210. The heat exchange flow path assembly 220 includes a first flow path 222 and a second flow path 224, both of which can perform heat exchange with the heat exchanger 210. Because the condensate produced by the evaporator of the air conditioner during the cooling process is at an extremely low temperature, this condensate is collected and circulated as at least one of the heat exchange media in the first flow path 222, allowing it to exchange heat with the heat exchange element 210. Besides using condensate as the heat exchange medium in the first flow path 222, it can also be used as the heat exchange medium by connecting to a water supply source, or both condensate and water supply can be used simultaneously as the heat exchange medium in the first flow path 222.

[0044] When the drive board 100 is under standard load, it generates less heat, and its temperature is at normal operating temperature. In this case, the heat dissipation assembly 200 will dissipate heat from the drive board 100 in the second operating mode. When the drive board 100 is under high load, it generates more heat, causing its temperature to become too high. In this case, the heat dissipation assembly 200 will dissipate heat from the drive board 100 in the first operating mode. Since the temperature of the refrigerant during evaporation and heat absorption is lower than that of the condensate, the heat exchange flow path group 220 is configured such that the first flow path 222 flows in both the second and first operating modes, while the second flow path 224 is disconnected in the second operating mode but flows in the first operating mode. Since the temperature of the drive board 100 is at its normal operating temperature when the drive board 100 is under standard load, the heat exchange flow path group 220 is adjusted to the second operating mode. At this time, it is only necessary to open the first flow path 222 and disconnect the second flow path 224. The heat exchange between the first flow path 222 and the heat exchange element 210 can meet the cooling requirements of the drive board 100. This can save the energy consumption generated by the operation of the second flow path 224 and avoid the risk of condensation on the surface of the drive board 100 caused by the low temperature of the second flow path 224. When the load on the drive board 100 is high, the heat generated by the drive board 100 is large, and it needs to be cooled down as soon as possible. The heat exchange flow path group 220 is adjusted to the first working mode. At this time, the first flow path 222 is kept open and the second flow path 224 is opened so that the refrigerant can also participate in cooling the drive board 100. The first flow path 222 and the second flow path 224 work together to cool the drive board 100, so that the drive board 100 can work in good working condition even when it is under high load.

[0045] Preferably, in the first operating mode, the heat exchange flow path group 220 can also disconnect the first flow path 222 and control the flow of only the second flow path 224.

[0046] By utilizing the collected condensate as the heat exchange medium in the first flow path 222, both the condensate itself and its low-temperature characteristics are fully utilized, the drive plate 100 achieves stable heat dissipation, and the risk of condensation on the surface of the drive plate 100 due to excessive temperature difference between the refrigerant and the drive plate 100 during evaporation and heat absorption is reduced. Using the refrigerant as the heat exchange medium in the second flow path 224, the refrigerant enters the evaporator of the air conditioner and begins to evaporate and absorb heat. At this time, the refrigerant efficiently exchanges heat with the heat exchange element 210 in the second flow path 224, quickly removing heat from the heat exchange element 210 at a lower temperature, thereby achieving rapid cooling of the drive plate 100. By setting up the heat exchange flow path group 220 and controlling the first flow path 222 and the second flow path 224 to flow together or alternately to cool down the drive board 100, the working energy consumption of the heat dissipation component 200 can be reduced while ensuring effective cooling of the drive board 100. This allows the drive board 100 to work in good condition whether it is under standard load or high load.

[0047] Optionally, in one implementation of this embodiment, such as Figure 1 As shown, the heat dissipation assembly 200 also includes:

[0048] A back plate 230 is connected to a heat exchanger 210 to form a heat exchange cavity 232, and a heat exchange flow path assembly 220 passes through the heat exchange cavity 232.

[0049] In this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 also includes a back plate 230, which is connected to the heat exchanger 210. There is a distance between the back plate 230 and the heat exchanger 210, forming a heat exchange cavity 232. The heat exchange flow path assembly 220 is arranged in the heat exchange cavity 232 and passes through the heat exchange cavity 232, which enables the heat exchange flow path assembly 220 to exchange heat with the heat exchange cavity 232, thereby reducing the temperature of the drive board 100. By setting the back plate 230 and forming a heat exchange cavity 232 between it and the heat exchange element 210, the heat exchange space of the heat exchange flow path group 220 is reduced, the temperature loss of the heat exchange flow path group 220 is reduced, and the heat exchange efficiency between the heat exchange flow path group 220 and the heat exchange element 210 is improved. Furthermore, by setting the heat exchange flow path group 220 in the heat exchange cavity 232, the back plate 230 limits the maximum radial displacement of the heat exchange flow path group 220, reducing the risk that the first flow path 222 and the second flow path 224 will move away from the heat exchange element 210 due to large radial displacement.

[0050] Preferably, the area of ​​the back plate 230 can be equal to or less than the area of ​​the heat exchanger 210.

[0051] Optionally, in one implementation of this embodiment, such as Figure 1As shown, both the first flow path 222 and the second flow path 224 are provided with reversing terminals;

[0052] The heat dissipation assembly 200 also includes a limiting plate 240, which abuts against the reversing end of the first flow path 222 and the reversing end of the second flow path 224.

[0053] In this embodiment, as Figure 1 As shown, both the first flow path 222 and the second flow path 224 are provided with reversing ends, with the reversing end of the first flow path being A and the reversing end of the second flow path being B. The condensate in the first flow path 222 and the refrigerant in the second flow path 224, after entering the heat exchange chamber 232 and flowing through the reversing ends, will flow out of the heat exchange chamber 232 in opposite directions, thus completing the heat exchange cycle. The heat dissipation assembly 200 also includes a limiting plate 240, which abuts against the reversing ends of the first flow path 222 and the second flow path 224. When the heat dissipation assembly 200 is working, it will vibrate. During the vibration, the first flow path 222 and the second flow path 224 will move back and forth in a direction perpendicular to the limiting plate 240, thus forming a sway. By abutting the limiting plate 240 against the reversing end of the first flow path 222 and the reversing end of the second flow path 224, the first flow path 222 and the second flow path 224 can be prevented from moving towards the limiting plate 240, thereby reducing the risk of the heat exchange flow path assembly 220 swaying back and forth in a direction perpendicular to the limiting plate 240.

[0054] Preferably, the reversing ends of the first flow path 222 and the second flow path 224 are both set to protrude from the first heat exchange surface 212 of the heat exchanger 210, so that the limiting plate 240 will not encroach on the heat exchange area of ​​the heat exchanger 210 and avoid affecting the heat exchange effect of the heat exchanger 210.

[0055] Optionally, in one implementation of this embodiment, such as Figure 1 As shown, the first heat exchange surface 212 is in contact with the first flow path 222 and / or the second flow path 224.

[0056] In this embodiment, as Figure 1 As shown, the first flow path 222 and / or the second flow path 224 are attached to the first heat exchange surface 212. Through the contact between the first heat exchange surface 212 and the first flow path 222 and / or the second flow path 224, the temperature loss caused by the heat exchange flow path group 220 and the air heat exchange is reduced, and the heat exchange efficiency between the heat exchange element 210 and the heat exchange flow path group 220 is improved through direct contact, thereby further improving the cooling effect of the drive plate 100.

[0057] Preferably, in this embodiment, the first heat exchange surface 212 may only be in contact with the first flow path 222, or the first heat exchange surface 212 may only be in contact with the second flow path 224, or the first heat exchange surface 212 may be in contact with both the first flow path 222 and the second flow path 224.

[0058] Optionally, in one implementation of this embodiment, such as Figure 1 As shown, the backplate 230 is abutted against the first flow path 222 and / or the second flow path 224.

[0059] In this embodiment, as Figure 1 As shown, by attaching the first flow path 222 and / or the second flow path 224 to the back plate 230, the heat exchange space of the heat exchange flow path assembly 220 can be further reduced and the heat can be concentrated, thereby further reducing the temperature loss of the heat exchange flow path assembly 220 and further improving the heat exchange efficiency between the heat exchange flow path assembly 220 and the heat exchange element 210. Furthermore, by attaching the back plate 230 to the first flow path 222 and / or the second flow path 224, displacement of the first flow path 222 and the second flow path 224 in the direction perpendicular to the drive plate during vibration can be prevented, thus allowing the first flow path 222 and / or the second flow path 224 to be more stably fixed in the heat exchange cavity 232.

[0060] Preferably, in this embodiment, the back plate 230 may only be in contact with the first flow path 222, or the back plate 230 may only be in contact with the second flow path 224, or the back plate 230 may be in contact with both the first flow path 222 and the second flow path 224.

[0061] Optionally, in one implementation of this embodiment, such as Figure 1 As shown, the heat dissipation assembly 200 also includes:

[0062] A shut-off valve is installed in the second flow path 224 to control the opening and closing of the second flow path 224;

[0063] The controller and the shut-off valve are electrically connected to the controller and are used to control the opening and closing of the shut-off valve.

[0064] The controller is set to: close the shut-off valve in the second operating mode to disconnect the second flow path 224, and open the shut-off valve in the first operating mode to allow the second flow path 224 to flow.

[0065] In this embodiment, as Figure 1 As shown, the heat dissipation assembly 200 also includes a shut-off valve and a controller. The shut-off valve is disposed on the second flow path 224 and is electrically connected to the controller. The controller controls the opening and closing of the shut-off valve by sending signal commands to the shut-off valve, and the shut-off valve can control the on / off of the second flow path 224 by opening and closing.

[0066] When the driver board 100 is under standard load, the heat generated by the driver board 100 is relatively small, and the heat dissipation component 200 is adjusted to the second working mode. At this time, it is only necessary to allow the first flow path 222 to flow to meet the cooling requirements of the driver board 100. When the driver board 100 is under high load, the heat generated by the driver board 100 is relatively large, and the temperature of the driver board 100 is relatively high. At this time, the heat dissipation component 200 is adjusted to the first working mode, and it is necessary to open both the first flow path 222 and the second flow path 224 so that the first flow path 222 and the second flow path 224 can cool the driver board 100 at the same time.

[0067] Therefore, the controller needs to be set as follows: In the second working mode, the controller controls the shut-off valve to close, thereby disconnecting the second flow path 224. At this time, only the first flow path 222 cools the drive board 100. In the first working mode, the controller controls the shut-off valve to open, thereby allowing the second flow path 224 to flow. At this time, the first flow path 222 and the second flow path 224 simultaneously cool the drive board 100.

[0068] Preferably, the shut-off valve can be a solenoid valve, hydraulic valve, throttle valve, or other valve that can be controlled to open and close via electrical connection.

[0069] By setting a shut-off valve in the second flow path 224 and electrically connecting it to the controller, the heat dissipation component 200 can automatically control the opening and closing of the flow path in the heat exchange flow path group 220 according to the heat dissipation requirements of the drive board 100 when the drive board 100 is under different load conditions, thereby reducing the energy consumption of the heat dissipation component 200 when cooling the drive board 100.

[0070] Optionally, in one implementation of this embodiment, such as Figure 1 As shown, the heat dissipation assembly 200 also includes:

[0071] A temperature sensing module is installed on the driver board 100 and electrically connected to the controller. It is used to acquire the temperature value of the driver board 100 and feed it back to the controller.

[0072] The controller is set to: when the temperature value of the drive board 100 is equal to or greater than the first preset value, the controller controls the shut-off valve to open, allowing the second flow path 224 to flow; when the temperature value of the drive board 100 is equal to or less than the second preset value, the controller controls the shut-off valve to close, causing the second flow path 224 to disconnect, and the first preset value is greater than the second preset value.

[0073] In this embodiment, as Figure 1As shown, the heat dissipation assembly 200 also includes a temperature sensing module, which is mounted on the drive board 100 and electrically connected to the controller. Since the drive board 100 can transfer heat to the temperature sensing module, the temperature sensing module can continuously detect the temperature of the drive board 100 and acquire the temperature value, and convert the temperature value of the drive board 100 into a signal to be fed back to the controller.

[0074] Since the heat dissipation assembly 200 needs to determine the temperature value of the drive board 100 in order to switch between standard mode and overheat mode, a first preset value and a second preset value are set within the temperature range of the drive board 100. When the temperature value of the drive board 100 is equal to or greater than the first preset value, the heat exchange flow path assembly 220 operates in the first working mode; when the temperature value of the drive board 100 is equal to or less than the second preset value, the heat exchange flow path assembly 220 operates in the second working mode. Furthermore, the controller is set to indicate that when the temperature value of the drive board 100 obtained by the temperature sensing module is equal to or greater than the first preset value, it indicates that the temperature value of the drive board 100 is high. The heat exchange flow path assembly 220 needs to operate in the first working mode. The controller controls the shut-off valve to open, allowing the second flow path 224 to flow. At this time, the first flow path 222 and the second flow path 224 work together to cool the drive plate 100. When the temperature value of the drive plate 100 obtained by the temperature sensing module is equal to or less than the second preset value, it means that the temperature value of the drive plate 100 has dropped to the normal working temperature. At this time, the heat exchange flow path assembly 220 only needs to operate in the second working mode to meet the cooling requirements of the drive plate 100. Therefore, the controller controls the shut-off valve to close, causing the second flow path 224 to disconnect. At this time, only the first flow path 222 remains in flow to cool the drive plate 100.

[0075] Setting the first preset value to be greater than the second preset value can prevent the temperature of the drive board 100 from fluctuating repeatedly around the first preset value during the cooling process, which would cause the controller to frequently open and close the shut-off valve, thereby reducing the risk of damage to various components.

[0076] Preferably, the temperature sensing module can be an IPM module (Intelligent Power Module).

[0077] By setting a temperature sensing module electrically connected to the controller, a first preset value, a second preset value, and a first preset value greater than the second preset value, the heat dissipation assembly 200 can automatically detect the temperature value of the drive board 100 and adjust the operating mode of the heat exchange flow path group 220 according to the change in the temperature value of the drive board 100. At the same time, it avoids the frequent opening and closing of the shut-off valve caused by the change in the temperature value of the drive board 100, thereby reducing the risk of damage to the components in the heat dissipation assembly 200.

[0078] Example 2

[0079] This embodiment provides an air conditioner for humidifying a computer room. The air conditioner includes:

[0080] Driver board 100,

[0081] As in Example 1, the heat dissipation component 200.

[0082] In this embodiment, the air conditioner includes a drive board 100 and a heat dissipation component 200 as in Embodiment 1. By providing the heat dissipation component 200 in the air conditioner, the energy consumption required for heat dissipation can be reduced while ensuring effective cooling of the drive board 100. This allows the drive board 100 to operate in good condition regardless of whether it is under standard load or high load.

[0083] Optionally, in one implementation of this embodiment, the air conditioner further includes:

[0084] The water storage device has its outlet end connected to the water storage device via the first flow path 222.

[0085] The heating element is installed in the water storage tank to evaporate the water in the tank to humidify the computer room.

[0086] In this embodiment, the air conditioner also includes a water storage tank and a heating element. The water storage tank is connected to the outlet of the first flow path 222 in the heat exchange flow path group 220 at normal operating temperature. The condensate after flowing through the heat dissipation component 200 can flow into the water storage tank from the outlet of the first flow path 222. The heating element is installed on the water storage tank. When it is necessary to humidify the environment such as the computer room, the heating element is activated. The heating element can heat the water in the water storage tank, causing the water in the water storage tank to evaporate, thereby realizing the humidification function.

[0087] Because the condensate in the first flow path 222 absorbs heat after flowing through the heat exchange chamber 232, the condensate flows into the water storage tank at a higher temperature. By connecting the water storage tank to the outlet of the first flow path 222 in the cooling flow path group, the heating time of the heating element on the condensate in the water storage tank is shortened, allowing the condensate to evaporate more quickly and humidify the environment such as the computer room, thereby improving the humidification efficiency of the air conditioner and reducing the humidification energy consumption of the air conditioner.

[0088] Optionally, in one implementation of this embodiment, the heat exchange flow path assembly 220 of the air conditioner further includes:

[0089] The third flow path has an outlet end connected to the water storage device and an inlet end connected to the water supply source of the water storage device. The third flow path is located on the first heat exchange surface 212.

[0090] Alternatively, the inlet end of the first flow path 222 is connected to the water supply source of the water storage device.

[0091] In this embodiment, the heat exchange flow path group 220 of the air conditioner may also include a third flow path, or the water inlet end of the first flow path 222 may be connected to the water supply source of the water storage tank.

[0092] When the heat exchange flow path group 220 of the air conditioner includes a third flow path, the outlet end of the third flow path is connected to the water storage tank, and the inlet end of the third flow path is connected to the water supply source of the water storage tank. When the amount of condensate collected in the water storage tank is insufficient, the third flow path can replenish the water in the water storage tank, so that the heating element can continuously heat the water in the water storage tank and make it evaporate. By setting the third flow path on the first heat exchange surface 212, the third flow path can flow through the first heat exchange surface 212 and exchange heat with the first heat exchange surface 212, which can further improve the heat exchange efficiency of the heat exchange component 210 to the drive plate 100. The water in the third flow path absorbs heat after flowing through the first heat exchange surface 212, so the water in the third flow path will flow into the water storage tank at a higher temperature, thereby increasing the temperature of the water entering the water storage tank, shortening the heating time of the heating component to the water in the water storage tank, and enabling the water in the water storage tank to evaporate at a faster speed and humidify the environment such as the computer room, thereby improving the humidification efficiency of the air conditioner, reducing the humidification energy consumption of the air conditioner, and achieving the effect of energy saving.

[0093] When the heat exchange flow path assembly connects the inlet of the first flow path 222 to the water supply source of the water storage tank, the heat exchange flow path assembly can use condensate as the heat exchange medium in the first flow path 222, or it can use the supply water as the heat exchange medium in the first flow path 222 by connecting to the water supply source. It can also use both condensate and supply water simultaneously as the heat exchange medium in the first flow path 222. By connecting the inlet of the first flow path 222 to the water supply source of the water storage tank, not only can the condensate be fully utilized, but the supply water can also be introduced into the first flow path 222 to participate in the heat exchange between the heat exchange elements 210. This allows the water in the first flow path to flow into the water storage tank at a higher temperature, thereby increasing the temperature of the water entering the water storage tank, shortening the heating time of the water in the water storage tank, and enabling the water in the water storage tank to evaporate faster and humidify the environment such as the computer room. This improves the humidification efficiency of the air conditioner, reduces the humidification energy consumption of the air conditioner, and achieves energy-saving effects.

[0094] Optionally, in one implementation of this embodiment, the heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid surface of the water reservoir.

[0095] In this embodiment, the heating element is an infrared heating element, which heats the water using infrared rays, thereby raising the water temperature and causing it to evaporate, thus achieving the humidification function. A certain gap needs to be maintained between the infrared heating element and the liquid surface of the water tank to prevent the infrared heating element from directly contacting the water and thus blocking the radiation of the infrared rays, ensuring the heating efficiency of the water by the infrared heating element.

[0096] Preferably, the infrared heating element can be an infrared heating lamp tube.

[0097] Example 3

[0098] This embodiment provides a control method, such as Figure 2 As shown, the control method for controlling the heat dissipation component 200 as described in Embodiment 1 above includes:

[0099] Continuously acquire the temperature value of the driver board at its normal operating temperature of 100°C;

[0100] The operating mode of the heat exchange flow path group 220 is controlled according to the normal operating temperature value of the drive board 100.

[0101] In this embodiment, as Figure 2 As shown, by continuously acquiring the normal operating temperature value of the drive board 100, the operating mode of the heat exchange flow path assembly 220 is adjusted according to the normal operating temperature value of the drive board 100. When the normal operating temperature value of the drive board 100 is high, the heat exchange flow path assembly 220 is adjusted to the first operating mode; when the normal operating temperature value of the drive board 100 is low, the heat exchange flow path assembly 220 is adjusted to the second operating mode. By adjusting the operating mode of the heat exchange flow path assembly 220, the heat dissipation component 200 can automatically control the on / off state of the flow path in the heat exchange flow path assembly 220 according to the temperature change of the drive board 100 under different load conditions, thereby reducing the energy consumption of the heat dissipation component 200 when cooling the drive board 100.

[0102] like Figure 2 As shown, specifically, the control method includes:

[0103] Step 202: Continuously acquire the temperature value of the driver board 100;

[0104] Step 204: Control the working mode of the heat exchange flow path group 220 according to the temperature value of the drive board 100.

[0105] Optionally, in one implementation of this embodiment, such as Figure 3 As shown, the operating modes of the heat exchange flow path group 220 controlled according to the temperature value of the drive board 100 include:

[0106] Continuously acquire the temperature value of driver board 100;

[0107] Determine whether the temperature value of the driver board 100 is lower than the first preset value;

[0108] If so, control the flow of the first flow path 222 to cool down the drive board 100;

[0109] If not, control the flow of the second flow path 224 and keep the flow of the first flow path 222 to cool down the driver board 100 together;

[0110] Determine if the temperature of the driver board 100 is higher than the second preset value;

[0111] If so, keep the first flow path 222 flowing and the second flow path 224 flowing together to cool down the driver board 100;

[0112] If not, control the second flow path 224 to disconnect, and keep the first flow path 222 flowing to cool the drive board 100;

[0113] Wherein, the first preset value is greater than the second preset value.

[0114] In this embodiment, as Figure 3 As shown, this control method can be used to control both the heat dissipation component 200 in Embodiment 1 and the air conditioner in Embodiment 2. After starting the startup procedure, the control method continuously acquires the temperature value of the drive board 100. Since the heat generated by the drive board 100 changes with the load, a first preset value and a second preset value are set, with the first preset value being greater than the second preset value. When the temperature of the drive board 100 is equal to or higher than the first preset value, it indicates that the temperature of the drive board 100 is high, and the heat dissipation component 200 needs to enter an overheating mode to quickly cool the drive board 100. When the temperature of the drive board 100 is equal to or lower than the second preset value, it indicates that the drive board 100 is at its normal operating temperature, and the heat dissipation component 200 only needs to cool the drive board 100 at room temperature. The first preset value needs to be greater than the second preset value to prevent the temperature of the drive board 100 from fluctuating repeatedly around the first preset value during the cooling process, causing the controller to frequently open and close the shut-off valve, thereby reducing the risk of damage to the components in the heat dissipation component 200.

[0115] The heat dissipation assembly 200 compares the acquired temperature value of the drive board 100 with a first preset value and determines whether the temperature value of the drive board 100 is lower than the first preset value. When the temperature of the drive board 100 is lower than the first preset value, it means that the drive board 100 is at its normal operating temperature. The heat dissipation assembly 200 only needs to cool the drive board 100 at room temperature. Therefore, the controller controls the shut-off valve to close, disconnecting the second flow path 224, and controls the first flow path 222 to flow for cooling the drive board 100. When the temperature of the drive board 100 is equal to or higher than the first preset value, it means that the temperature value of the drive board 100 is too high. The heat dissipation assembly 200 needs to enter the overheating mode to quickly cool the drive board 100. Therefore, the heat exchange flow path group 220 keeps the first flow path 222 open and controls the shut-off valve to open, allowing the second flow path 224 to flow, so that the first flow path 222 and the second flow path 224 work together to cool the drive board 100. When the heat exchange flow path assembly 220 cools the drive board 100 in the first operating mode, the heat dissipation component 200 continuously acquires the temperature of the drive board 100 and compares the acquired temperature value of the drive board 100 with a second preset value to determine whether the temperature value of the drive board 100 is higher than the second preset value. When the temperature of the drive board 100 is higher than the second preset value, it indicates that the temperature value of the drive board 100 is still high, and the heat dissipation component 200 needs to continue cooling the drive board 100 in the first operating mode. Therefore, the heat exchange flow path assembly 220 keeps the first flow path 222 flowing and keeps the second flow path 224 flowing, so that the first flow path 222 and the second flow path 224 work together to cool the drive board 100. When the temperature of the drive board 100 is equal to or lower than the second preset value, it means that the temperature of the drive board 100 has dropped to the normal operating temperature range. The heat dissipation component 200 only needs to cool the drive board 100 at room temperature. At this time, the controller controls the shut-off valve to close, disconnects the second flow path 224, and controls the first flow path 222 to flow for cooling the drive board 100.

[0116] Setting the first preset value to be greater than the second preset value can prevent the temperature of the drive board 100 from fluctuating repeatedly around the first preset value during the cooling process, which would cause the controller to frequently open and close the shut-off valve, thereby reducing the risk of damage to various components.

[0117] This control method enables the heat dissipation assembly 200 to compare the temperature value of the drive board 100 with the first preset value and the second preset value when the drive board 100 is under different load conditions. Based on the comparison result, it determines the current required working mode and executes it, thereby realizing automatic control of the flow path in the heat exchange flow path group 220, thereby reducing the energy consumption of the heat dissipation assembly 200 when cooling the drive board 100.

[0118] like Figure 3 As shown, specifically, the control method includes:

[0119] Step 302: Continuously acquire the temperature value of the driver board 100;

[0120] Step 304: Determine whether the temperature value of the driver board 100 is lower than the first preset value;

[0121] Step 306: If so, control the flow of the first flow path 222 to cool down the drive board 100;

[0122] Step 308: If not, control the flow of the second flow path 224 and keep the flow of the first flow path 222 flowing together to cool down the driver board 100;

[0123] Step 310: Determine whether the temperature of the driver board 100 is higher than the second preset value;

[0124] Step 312: If so, keep the first flow path 222 open and the second flow path 224 open to cool down the driver board 100 together;

[0125] Step 314: If not, control the second flow path 224 to disconnect, and keep the first flow path 222 flowing to cool the drive board 100.

[0126] In summary, the ingenious design of the heat dissipation components and air conditioner lies in:

[0127] First, by utilizing the collected condensate as the heat exchange medium in the first flow path, both the condensate itself and its low-temperature characteristics are fully utilized, ensuring stable heat dissipation for the drive board. This also reduces the risk of condensation on the drive board surface caused by excessive temperature difference between the refrigerant and the drive board during evaporation and heat absorption. Using the refrigerant as the heat exchange medium in the second flow path allows it to enter the evaporator of the air conditioner and begin evaporating and absorbing heat. In this second flow path, the refrigerant efficiently exchanges heat with the heat exchange components, quickly removing heat from the components at a lower temperature, thus rapidly cooling the drive board. By setting up a heat exchange flow path group and controlling the first and second flow paths to flow together or alternately to cool the drive board, the energy consumption of the heat dissipation components can be reduced while ensuring effective cooling of the drive board. This allows the drive board to operate under good conditions whether under standard or high load conditions.

[0128] Secondly, by setting a shut-off valve in the second flow path and electrically connecting it to the controller, the heat dissipation component can automatically control the opening and closing of the flow path in the heat exchange flow path group according to the heat dissipation requirements of the drive board when the drive board is under different load conditions, thereby reducing the energy consumption of the heat dissipation component when cooling the drive board.

[0129] Third, by connecting the water storage tank to the outlet of the first flow path in the cooling flow path group, the heating time of the heating element on the condensate in the water storage tank is shortened, so that the condensate can evaporate at a faster speed and humidify the environment such as the computer room, thereby improving the humidification efficiency of the air conditioner and reducing the humidification energy consumption of the air conditioner.

[0130] Fourth, by setting the third flow path inside the heat exchange cavity, the third flow path can flow through the heat exchange cavity and exchange heat with it, which can further improve the heat exchange efficiency of the heat exchange components to the drive plate. The water in the third flow path absorbs heat after flowing through the heat exchange cavity, so the water in the third flow path will flow into the water storage tank at a higher temperature, thereby increasing the temperature of the water entering the water storage tank and shortening the heating time of the heating components to the water in the water storage tank. This allows the water in the water storage tank to evaporate at a faster rate and humidify the environment such as the computer room, thereby improving the humidification efficiency of the air conditioner, reducing the humidification energy consumption of the air conditioner, and achieving the effect of energy saving.

[0131] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0132] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0133] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0134] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0135] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipation assembly for heat dissipation of the drive board (100) of an air conditioner, characterized in that, include: A heat exchanger (210) has a first heat exchange surface (212) and a second heat exchange surface opposite each other in the thickness direction, the second heat exchange surface being attached to the drive plate (100); A heat exchange flow path assembly (220) is disposed on the first heat exchange surface (212). The heat exchange flow path assembly (220) includes a first flow path (222) and a second flow path (224). The first flow path (222) uses at least the condensate generated by the evaporator of the air conditioner as the heat exchange medium, and the second flow path (224) uses refrigerant as the heat exchange medium. The heat exchange flow path group (220) is configured to control the working mode of the heat exchange flow path group (220) according to the temperature value of the drive plate (100), wherein the working mode of the heat exchange flow path group (220) includes a first working mode in which both the first flow path (222) and the second flow path (224) are flowing and a second working mode in which the first flow path (222) is flowing and the second flow path (224) is disconnected; The heat dissipation assembly also includes a back plate (230), the projection of the back plate (230) on the heat exchanger (210) is located in the first heat exchange surface (212) of the heat exchanger (210), the back plate (230) is connected to the heat exchanger (210) to form a heat exchange cavity (232), and the heat exchange flow path assembly (220) passes through the heat exchange cavity (232).

2. The heat dissipation assembly as described in claim 1, characterized in that, Both the first flow path (222) and the second flow path (224) are provided with a reversing end; The heat dissipation assembly also includes a limiting plate (240), which abuts against the reversing end of the first flow path (222) and the reversing end of the second flow path (224).

3. The heat dissipation assembly as described in claim 1, characterized in that, The first heat exchange surface (212) is in contact with the first flow path (222) and / or the second flow path (224).

4. The heat dissipation assembly as described in claim 1, characterized in that, The back plate (230) is abutted against the first flow path (222) and / or the second flow path (224).

5. The heat dissipation assembly as described in claim 1, characterized in that, The heat dissipation component also includes: A shut-off valve is provided in the second flow path (224) and is used to control the opening and closing of the second flow path (224); A controller is provided, and the shut-off valve is electrically connected to the controller, which is used to control the opening and closing of the shut-off valve.

6. The heat dissipation assembly as described in claim 5, characterized in that, The heat dissipation component also includes: A temperature sensing module is disposed on the drive board (100) and electrically connected to the controller, for acquiring the temperature value of the drive board (100) and feeding it back to the controller; The controller is configured such that when the temperature value of the drive plate (100) is equal to or greater than a first preset value, the controller controls the shut-off valve to open, allowing the second flow path (224) to flow; when the temperature value of the drive plate (100) is equal to or less than a second preset value, the controller controls the shut-off valve to close, causing the second flow path (224) to disconnect. Wherein, the first preset value is greater than the second preset value.

7. An air conditioner for humidifying a computer room, characterized in that, include: Driver board (100), The heat dissipation assembly as described in claims 1-6.

8. The air conditioner as described in claim 7, characterized in that, The air conditioner also includes: A water storage device, wherein the outlet end of the first flow path (222) is connected to the water storage device; A heating element is disposed in the water storage tank and is used to evaporate the water in the water storage tank to humidify the machine room.

9. The air conditioner as described in claim 8, characterized in that, The heat exchange flow path group (220) further includes: a third flow path, the outlet end of the third flow path is connected to the water storage tank, the inlet end of the third flow path is connected to the water supply source of the water storage tank, and the third flow path is disposed on the first heat exchange surface (212); Alternatively, the inlet end of the first flow path (222) is connected to the water supply source of the water storage device.

10. The air conditioner as described in claim 8, characterized in that, The heating element is an infrared heating element, and there is a gap between the infrared heating element and the liquid surface of the water storage device.

11. A control method for controlling the heat dissipation assembly as described in claims 1 to 6, characterized in that, include: The temperature value of the drive board (100) is continuously acquired; The operating mode of the heat exchange flow path group (220) is controlled according to the temperature value of the drive plate (100).

12. The control method as described in claim 11, characterized in that, The operating mode of controlling the heat exchange flow path assembly (220) based on the temperature value of the drive plate (100) includes: Determine whether the temperature value of the drive board (100) is lower than a first preset value; If so, control the flow of the first flow path (222) to cool the drive board (100); If not, control the flow of the second flow path (224) and keep the flow of the first flow path (222) to cool down the drive board (100); Determine whether the temperature of the drive board (100) is higher than the second preset value; If so, keep the first flow path (222) open and keep the second flow path (224) open to cool the drive board (100) together; If not, the second flow path (224) is disconnected, while the first flow path (222) remains open to allow the drive board (100) to cool down. Wherein, the first preset value is greater than the second preset value.

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