Miniature thermoelectric refrigeration device-body packaging equipment

Abstract

The invention discloses miniature thermoelectric refrigeration device-body packaging equipment which comprises a three-axis module and at least one grabbing unit arranged at the working end of the three-axis module, and each grabbing unit comprises a fixing base arranged at the working end of the three-axis module; the voice coil motor is arranged in the fixed seat; the movable seat is slidably arranged on one side of the fixed seat and is connected with the working end of the voice coil motor; the suction nozzle is rotationally arranged in the movable seat; the servo motor is arranged on the fixed seat; the magnetic railing ruler is arranged on one side of the movable seat; the magnetic grid reading head and the magnetic grid ruler are correspondingly arranged; the grabbing unit is driven by the three-axis module to grab and chip scattered crystals, the voice coil motor drives the movable base and the suction nozzle to ascend and descend, the magnetic grid ruler and the magnetic grid reading head are used for accurately measuring the movement distance of the suction nozzle, the suction nozzle is finely adjusted, and the chip is prevented from being damaged; the angle of the chip is adjusted to adapt to detection and mounting of scattered chips; automatic bulk crystal patching is integrally realized, and the rejection rate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging equipment, and in particular to a micro thermoelectric cooling device-body packaging equipment. Background Art

[0002] Micro semiconductor refrigeration chip is an advanced refrigeration technology with the advantages of high efficiency, compactness, reliability and environmental protection. It is widely used in various fields such as medical, aerospace, communications, automobiles, etc.

[0003] During the packaging process of micro semiconductor refrigeration chips, the chips need to be arranged or arrayed in a predetermined order first, and then the chip is picked up by a die bonder and placed on a substrate at a fixed position for mounting. However, this fixed-position picking and mounting method has the problem of low production efficiency. If the chips are not arranged in a predetermined order, the picking and mounting of scattered chips cannot be achieved, and the substrate cannot achieve automatic feeding, positioning and transportation.

[0004] And because the chip is small in size, brittle in material, and thin in thickness, the existing die bonder cannot make fine adjustments during chip contact when picking up the chip, and the angle of the chip cannot be corrected during mounting, which can easily cause chip breakage and increase the chip scrap rate. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention aims to provide a micro thermoelectric cooling device-body packaging device to solve the problems raised in the above background technology. To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] The micro thermoelectric cooling device-body packaging device includes a patch mechanism, the patch mechanism includes a three-axis module and at least one grabbing unit arranged at the working end of the three-axis module, the grabbing unit includes:

[0007] A fixing seat, arranged at the working end of the three-axis module;

[0008] A voice coil motor is disposed in the fixing seat;

[0009] A movable seat, slidably disposed on one side of the fixed seat and connected to the working end of the voice coil motor;

[0010] A suction nozzle, rotatably disposed in the movable seat;

[0011] A servo motor is arranged on one side of the fixing seat and is used to drive the suction nozzle to rotate;

[0012] A magnetic scale, arranged on one side of the movable seat;

[0013] The magnetic grating reader corresponds to the magnetic grating scale and is arranged on the fixing seat.

[0014] Optionally, it also includes a crystal bonding workbench arranged within the working range of the patch mechanism, the crystal bonding workbench includes a linear module, a fixed frame, a base, a carrier platform and a lifting cylinder, the fixed frame is arranged at the working end of the linear module, the base is arranged in the fixed frame, the carrier platform is slidably arranged in the base, the lifting cylinder is arranged on one side of the base, and the working end of the cylinder is connected to the carrier platform, a vacuum suction cup is arranged on the carrier platform, a material transfer channel is provided on the top surface of the fixed frame, and the fixed frame and the carrier platform are used to clamp the carrier.

[0015] Optionally, it also includes a carrier feeding mechanism arranged at one end of the crystal bonding workbench, the carrier feeding mechanism includes a linear slide, a bearing seat, a silo and a pushing device, the bearing seat is arranged at the working end of the linear slide, the silo is detachably arranged on the bearing seat, a multi-layer carrier channel is penetrated in the silo, and limit rods are detachably provided on the silos at both ends of the carrier channel, and the pushing device is arranged on the linear slide away from the side of the crystal bonding workbench, and its working end penetrates the silo.

[0016] Optionally, the pushing device includes a support seat, a pushing rod, a pushing motor, a driving wheel, a supporting wheel and a pressure wheel. The support seat is arranged on one side of the linear slide, the pushing motor is arranged on one side of the support seat, the driving wheel is arranged at the working end of the pushing motor, the supporting wheel is rotatably arranged on the supporting seat corresponding to the driving wheel, the pushing rod is arranged on the driving wheel and the supporting wheel, and there is at least one pressure wheel, which is elastically and adjustably rotatably arranged on the support seat and is rollingly connected to the pushing rod.

[0017] Optionally, it also includes a docking platform arranged between the carrier feeding mechanism and the crystal bonding workbench, the docking platform includes a docking seat and a docking rail, there are two docking rails, which are arranged on the docking seat opposite to and parallel to each other, and each of the docking rails is provided with a limit platform near one end of the crystal bonding workbench, and a rear limit assembly is provided in the middle, and the limit platform and the rear limit assembly are used to position the carrier.

[0018] Optionally, the rear limit assembly includes a pin shaft and a limit plate, a receiving groove is opened on the docking rail, the pin shaft is arranged in the receiving groove, and the limit plate is close to one end of the carrier feeding mechanism and is always located in the receiving groove in a natural state, and the limit plate is kept extended out of the receiving groove at one end away from the carrier feeding mechanism.

[0019] Optionally, it also includes a first visual inspection device arranged within the working range of the patch mechanism, the first visual inspection device includes a bracket, a second linear slide, a loose crystal positioning camera and a patch camera, the second linear slide is arranged on the bracket, the loose crystal positioning camera is arranged at one end of the bracket, and is used to detect the state of the loose crystals before the grabbing unit picks up the material, and the patch camera is arranged at the working end of the second linear slide, and is used to detect each patch station.

[0020] Optionally, it also includes a second visual inspection device arranged in the working range of the patch mechanism, the second visual inspection device includes a chip inspection camera, the chip inspection camera and the patch camera work in opposite directions, and are used to inspect the bottom of the chip after the grasping unit grasps the chip.

[0021] Optionally, it also includes a material receiving docking station and a material receiving mechanism. The material receiving docking station is arranged at one end of the solid crystal workbench away from the carrier feeding mechanism, and its structure is the same as that of the docking station. The material receiving mechanism is arranged on the side of the material receiving docking station away from the feeding mechanism, and its structure is the same as that of the carrier feeding mechanism and is symmetrically arranged.

[0022] Optionally, a push rod is provided on a side of the carrier platform away from the carrier feeding mechanism, and the push rod is used to deliver the carrier on the material receiving docking station into the material receiving mechanism.

[0023] Compared with the prior art, the beneficial effect is that, by adopting the above scheme, the grabbing unit of the chip mounting mechanism of the present invention drives at least one grabbing unit to grab and mount loose crystals through a three-axis module, drives the movable seat and the suction nozzle to rise and fall through a voice coil motor, accurately measures the movement distance of the suction nozzle through a magnetic scale and a magnetic reading head, and fine-tunes the suction nozzle when picking up the chip to prevent chip damage. The suction nozzle is driven to rotate by a servo motor to adjust the chip angle to adapt to the detection and mounting of scattered chips; and the automatic feeding of the substrate is realized through the carrier feeding mechanism, the positioning and transportation of the substrate is realized through the solid crystal workbench, and the finished product is automatically received and stored through the receiving docking station and the receiving mechanism, so as to realize the automated production of loose crystal solid crystal mounting, improve work efficiency, and reduce the scrap rate at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the patch mechanism of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the grabbing unit of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the crystal bonding workbench of the present invention;

[0028] Figure 5 It is a structural schematic diagram of the carrier feeding mechanism of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the material pushing device of the present invention;

[0030] Figure 7 It is a schematic diagram of the docking station structure of the present invention;

[0031] Figure 8 It is a schematic diagram of the structure of the rear limit assembly of the present invention;

[0032] Fig. 9 It is a schematic diagram of the structure of the first visual detection device and the second visual detection device of the present invention;

[0033] Fig.10 It is a structural schematic diagram of the loose crystal feeding mechanism of the present invention;

[0034] As shown in the above drawings: 1. SMT mechanism; 2. Solid crystal workbench; 3. Carrier feeding mechanism; 4. Docking station; 5. Loose crystal feeding mechanism; 6. First visual inspection device; 7. Second visual inspection device; 8. Material receiving mechanism; 11. Three-axis module; 12. Grabbing unit; 121. Fixed seat; 122. Voice coil motor; 123. Movable seat; 124. Suction nozzle; 125. Servo motor; 126. Magnetic scale; 127. Magnetic scale reader; 129. Groove type photoelectric sensor; 21. Linear module; 22. Fixed frame; 23. Base; 24. Carrier; 25. Lifting cylinder; 26. Positioning pin; 27. Push rod; 28. Vacuum suction cup; 31. Linear slide; 32. Carrier Seat; 33. Bin; 34. Pushing device; 331. Carrier channel; 332. Limit rod; 341. Support seat; 342. Pushing rod; 343. Pushing motor; 344. Driving wheel; 345. Support wheel; 346. Pressing wheel; 347. Slot-type photoelectric sensor; 348. Front limit hole; 349. Rear limit hole; 41. Docking seat; 42. Docking rail; 43. Limiting platform; 44. Rear limit assembly; 441. Pin shaft; 442. Limiting plate; 61. Bracket; 62. Second linear slide; 63. Loose crystal positioning camera; 64. SMD camera; 71. Chip detection camera; 51. Two-axis module; 52. Flexible vibrator; 53. Material tray; 54. Lifting cylinder. DETAILED DESCRIPTION

[0035] To facilitate the understanding of the present invention, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments; the accompanying drawings show preferred embodiments of the present application; however, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification; on the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive.

[0036] It should be noted that, unless otherwise clearly stipulated and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two elements; for ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances; the terms "vertical", "horizontal", "left", "right", "front", "rear" and similar expressions used in this specification are for illustrative purposes only.

[0037] At the same time, it should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence; it should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0038] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not used to limit this application.

[0039] like Figure 1-3 As shown, an embodiment of the present invention is: the micro thermoelectric refrigeration device-body packaging equipment includes a chip mounting mechanism 1, a crystal bonding workbench 2, a carrier feeding mechanism 3, a docking station 4, a loose crystal feeding mechanism 5, a first visual inspection device 6, a second visual inspection device 7 and a material receiving mechanism 8 arranged on a workbench, the crystal bonding workbench 2 is arranged on the workbench along the front-to-back direction, the chip mounting mechanism 1 is arranged above the crystal bonding workbench 2 along the left-right direction, the loose crystal feeding mechanism 5 is arranged on the workbench on the right side of the crystal bonding workbench 2, and is located within the working range of the chip mounting mechanism 1 and the first visual inspection device 6, the carrier feeding mechanism 3 is arranged on the workbench at the front end of the crystal bonding workbench 2, the docking station 4 is arranged between the carrier feeding mechanism 3 and the crystal bonding workbench 2, the material receiving mechanism 8 is arranged on the workbench at the rear end of the crystal bonding workbench 2, and the first visual inspection device 6 and the second visual inspection device 7 are respectively arranged on the workbench on the front side of the chip mounting mechanism 1;

[0040] The carrier feeding mechanism 3 transports the carrier carrying the substrate to the docking table 4 individually, the crystal bonding workbench 2 takes out the carrier on the docking table 4 and transports it to the working range of the patch mechanism 1, the crystal bonding workbench 2 fixes the carrier, the loose crystal feeding mechanism 5 feeds the loose crystal into the working range of the patch mechanism 1, the first visual inspection device 6 detects the position and state of each loose crystal, and is located to detect the position and state of each patch station in the carrier on the crystal bonding workbench 2, the patch mechanism 1 grabs the loose crystal, moves it to the working range of the second visual inspection device 7, inspects the loose crystal, and after the inspection is completed, continues to move above the crystal bonding workbench 2, and places the loose crystal into the patch station in the carrier.

[0041] It is understandable that if multiple chips need to be installed, multiple chip mounting mechanisms 1, multiple docking stations 4, multiple crystal bonding workstations 2, multiple visual inspection devices and loose crystal feeding mechanisms 5 are sequentially arranged between the rear end of the crystal bonding workstation 2 and the material receiving mechanism 8.

[0042] The patch mechanism 1 includes a three-axis module 11 and at least one grabbing unit 12 disposed at the working end of the three-axis module 11, and the grabbing unit 12 includes:

[0043] A fixing seat 121 is disposed at the working end of the three-axis module 11;

[0044] The voice coil motor 122 is disposed in the fixing seat 121;

[0045] The movable seat 123 is slidably disposed on the left side of the front end of the fixed seat 121 and connected to the working end of the voice coil motor 122;

[0046] The suction nozzle 124 is rotatably disposed in the movable seat 123 and is connected to an external vacuum generating device;

[0047] The servo motor 125 is arranged at the rear side of the fixing seat 121, and a first synchronous wheel is arranged at the working end thereof, and a second synchronous wheel is arranged on the suction nozzle 124, and the first synchronous wheel and the second synchronous wheel are connected by a synchronous belt;

[0048] The magnetic scale 126 is arranged on the right side of the movable seat 123;

[0049] The magnetic grid reader 127 is disposed at the front end of the fixing base 121 , and its working end corresponds to the magnetic grid scale 126 .

[0050] When grabbing loose crystals, the position and height of the grabbable loose crystals are determined based on the state and position of each loose crystal detected by the first visual inspection mechanism. The three-axis module 11 drives the fixed seat 121 to move in the left-right, front-back, up-down directions to above the position of the loose crystal to be grabbed. The voice coil motor 122 drives the movable seat 123 to move vertically. The magnetic scale 126 is used to accurately measure the height of the suction nozzle 124 and fine-tune the position of the suction nozzle 124. The suction nozzle 124 grabs the chip, and the servo motor 125 drives the suction nozzle 124 to rotate and adjust the chip to a predetermined angle. The three-axis module 11 drives the suction nozzle 124 to move to the working range of the second visual inspection mechanism for inspection. After the inspection is completed, it moves to the top of the carrier on the solid crystal workbench 2, and adjusts the chip angle by rotating the suction nozzle 124 as needed to perform mounting work.

[0051] In this embodiment, in order to improve work efficiency, two grabbing units 12 are set at the working end of the three-axis module 11, which can grab two loose crystals each time. When grabbing loose crystals, each grabbing unit 12 controls the height of the suction nozzle 124 through the voice coil motor 122 to grab them separately.

[0052] In one embodiment, a detection sheet is disposed around the suction nozzle 124 , a groove-type photoelectric sensor 129 is disposed on the front side of the movable seat 123 , and the detection sheet is located within the working range of the groove-type photoelectric sensor 129 for detecting the rotation angle of the suction nozzle 124 .

[0053] The present application uses a three-axis module 11 to drive at least one grasping unit 12 to grasp and mount scattered crystals, uses a voice coil motor 122 to drive the movable seat 123 and the suction nozzle 124 to rise and fall, uses a magnetic scale 126 and a magnetic reader 127 to accurately measure the movement distance of the suction nozzle 124, and fine-tunes the suction nozzle 124 when picking up the chip to prevent chip damage. The servo motor 125 drives the suction nozzle 124 to rotate and adjusts the chip angle to adapt to the detection and mounting of scattered chips.

[0054] In one embodiment, Figure 4 As shown, the crystal bonding workbench 2 includes a linear module 21, a fixed frame 22, a base 23, a carrier platform 24 and a lifting cylinder 25. The linear module 21 is horizontally arranged on the workbench, the fixed frame 22 is arranged at the working end of the linear module 21, the base 23 is arranged in the fixed frame 22, the carrier platform 24 is placed horizontally, and its bottom is slidably connected to the base 23. The lifting cylinder 25 is arranged on one side of the base 23, and its working end is connected to the carrier platform 24. The lifting cylinder 25 is used to drive the carrier platform 24 to rise and fall vertically. A vacuum suction cup 28 is arranged on the top of the carrier platform 24, and a material passing channel is provided on the top surface of the fixed frame 22. The fixed frame 22 and the carrier platform 24 are used to clamp the carrier.

[0055] In this embodiment, the linear module 21 drives the fixed frame 22 to move linearly between the docking platform 4, the patch mechanism 1, and the material receiving mechanism 8. When receiving the carrier, the linear module 21 drives the fixed frame 22 to run within the working range of the docking platform 4 in front. At this time, the carrier on the docking platform 4 is located between the fixed frame 22 and the carrier platform 24. The lifting cylinder 25 drives the carrier platform 24 to rise, lifts up the carrier on the docking platform 4, and the vacuum suction cup 28 sucks the carrier tightly. The linear module 21 drives the fixed frame 22 to move backward, and the lifting cylinder 25 continues to rise to raise the carrier. The fixed frame 22 and the carrier platform 24 clamp the carrier, and the material transfer channel is used for the grasping unit 12 of the patch mechanism 1 to pass through.

[0056] In one embodiment, Figure 4 As shown, a positioning pin 26 is provided on the top surface of the carrier platform 24 for positioning the carrier, and there are two lifting cylinders 25, which are respectively arranged on the front and rear sides of the base 23, and the working ends of the two lifting cylinders 25 are respectively connected to the carrier platform 24.

[0057] In one embodiment, Figure 5 As shown, the carrier feeding mechanism 3 includes a linear slide 31, a bearing seat 32, a silo 33 and a pushing device 34. The linear slide 31 is vertically arranged at the front end of the workbench, the bearing seat 32 is horizontally arranged at the working end of the linear slide 31, and the silo 33 is detachably arranged on the bearing seat 32. The silo 33 has openings at the front and rear sides. A multi-layer carrier channel 331 is arranged through the silo 33. Each layer of the carrier channel 331 can accommodate a carrier and allow the carrier to pass through. The carrier channel 331 has two sides. The silo 33 at the two ends is respectively provided with a limit rod 332 which is detachable, and the limit rod 332 is used to limit the multiple carriers in the silo 33 when the silo 33 is replaced. The pushing device 34 is arranged on the front side of the linear slide 31, and its working end passes through the silo 33; when working, the silo 33 is loaded into the supporting seat 32, and the linear slide 31 drives the supporting seat 32 to rise gradually, and the pushing device 34 is used to send the carriers in each layer of the carrier channel 331 in the silo 33 into the docking station 4 respectively.

[0058] In one embodiment, Figure 6As shown, the pushing device 34 includes a support seat 341, a pushing rod 342, a pushing motor 343, a driving wheel 344, a supporting wheel 345 and a pressing wheel 346. The support seat 341 is arranged at the front side of the linear slide 31, the pushing motor 343 is horizontally arranged at the rear side of the support seat 341, and its working end passes through the support seat 341. The driving wheel 344 is arranged at the working end of the pushing motor 343. The supporting wheel 345 is arranged on the right side of the supporting seat 341 of the driving wheel 344. The top surfaces of the driving wheel 344 and the supporting wheel 345 are located at the same level. The push rod 342 is arranged on the driving wheel 344 and the supporting wheel 345. There is at least one pressure wheel 346, which is elastically and adjustably rotatably arranged on the support seat 341 and is rollingly connected with the push rod 342; the driving wheel 344 and the supporting wheel 345 are used to support the push rod 342, and the pressure wheel 346 keeps the push rod 342 in contact with the driving wheel 344 and the supporting wheel 345. The pushing motor 343 drives the driving wheel 344 to rotate forward and reverse, thereby controlling the push rod 342 to move forward and backward, and pushing the supporting seat 32 out of the silo 33.

[0059] In this embodiment, there are two pressure wheels 346, which are respectively arranged above the driving wheel 344 and the supporting wheel 345. If there is only one pressure wheel 346, it is arranged on the support seat 341 between the driving wheel 344 and the supporting wheel 345; the pressure wheel 346 is rotatably arranged on the support seat 341 through the shaft seat, and a spring is connected to the top of the shaft seat, and a bolt is arranged on the top of the spring. The bolt is threadedly connected to the support seat 341, and the pressure of the pressure wheel 346 can be adjusted by adjusting the height of the bolt.

[0060] In one embodiment, Figure 6 As shown, two slot-type photoelectric sensors 347 are arranged on the support seat 341 between the driving wheel 344 and the supporting wheel 345, and the push rod 342 passes through the working ends of the two slot-type photoelectric sensors 347. The push rod 342 is respectively provided with a front limit hole 348 and a rear limit hole 349. The two slot-type photoelectric sensors 347 are respectively used to detect the front limit hole 348 and the rear limit hole 349 to detect the position of the push rod 342.

[0061] In one embodiment, Figure 7-8 As shown, the docking platform 4 includes a docking seat 41 and a docking rail 42. The docking seat 41 is arranged on the workbench at the front end of the linear module 21. There are two docking rails 42, which are arranged along the front and rear directions and relatively on the left and right sides of the top surface of the docking seat 41. A limiting platform 43 is arranged at the rear end of each docking rail 42, and a rear limiting assembly 44 is arranged in the middle of each docking rail 42. The limit platform 43 and the rear limiting assembly 44 are used to position the carrier.

[0062] During operation, the push rod 342 pushes the carrier out of the silo 33, into the two docking tracks 42, and runs along the two docking tracks 42 to the rear end, where the two rear limit assemblies 44 and the two limit platforms 43 position the carrier.

[0063] In one embodiment, Figure 8 As shown, the rear limit assembly 44 includes a pin shaft 441 and a limit plate 442. A receiving groove 421 is opened on the connecting rail 42. The pin shaft 441 is arranged in the receiving groove 421. The limit plate 442 is rotatably arranged on the pin shaft 441. The length of the limit plate 442 at the front end of the pin shaft 441 is greater than the length of the limit plate 442 at the rear end of the pin shaft 441. In the initial state, the rear end of the limit plate 442 always extends out of the receiving groove 421.

[0064] It can be understood that when the carrier passes through the rear end of the limit plate 442, under the action of its pressure, the rear end of the limit plate 442 moves downward, and the limit plate 442 is located as a whole in the receiving groove 421, allowing the carrier to pass smoothly. After the carrier passes through the limit plate 442, the front end of the limit plate 442 moves downward under the action of its own gravity, and its rear end extends out of the receiving groove 421, limiting the rear end of the carrier.

[0065] In one embodiment, Fig. 9 As shown, in one embodiment, the first visual inspection device 6 includes a bracket 61, a second linear slide 62, a loose crystal positioning camera 63 and a patch camera 64. The bracket 61 is arranged on the workbench on the front side of the patch mechanism 1, and extends to above the solid crystal workbench 2 and the loose crystal feeding mechanism 5. The second linear slide 62 is horizontally arranged on the rear side of the bracket 61 along the left and right directions. The loose crystal positioning camera 63 is arranged at the right end of the bracket 61, corresponding to the loose crystal feeding mechanism 5, and is used to detect the state of the loose crystals before the grabbing unit 12 picks up the materials. The patch camera 64 is arranged at the working end of the second linear slide 62, and is used to detect the position and state of each patch station on the carrier.

[0066] In one embodiment, Fig. 9 As shown, in one embodiment, the second visual inspection device 7 includes a chip inspection camera 71, which is vertically arranged on a workbench between the loose crystal feeding mechanism 5 and the solid crystal workbench 2. The working directions of the chip inspection camera 71 and the patch camera 64 are opposite. The working direction of the chip inspection camera 71 is upward, and is used for inspecting the chip pins after the grasping unit 12 grasps the chip. A waste box is arranged on one side of the chip inspection camera 71, and the patch mechanism 1 puts unqualified chips into the waste box.

[0067] In one embodiment, it also includes a material receiving docking station, which is arranged at the rear end of the crystal bonding workbench 2 and has the same structure as the docking station 4. The material receiving mechanism 8 is arranged on the workbench at the rear side of the material receiving docking station and has the same structure as the carrier feeding mechanism 3 and is symmetrically arranged. When the patch is completed, the crystal bonding workbench 2 transports the carrier to the working range of the material receiving docking station and places the carrier into the material receiving docking station.

[0068] In one embodiment, Figure 4 As shown, a push rod 27 is provided at the rear end of the carrier platform 24. When the carrier platform 24 moves backward, the push rod 27 delivers the carrier on the receiving docking station into the receiving mechanism 8 to complete the entire work process.

[0069] In one embodiment, Fig.10 As shown, the loose crystal feeding mechanism 5 includes a two-axis module 51, a flexible vibrator 52, a material tray 53 and a lifting cylinder 54. The working end of the two-axis module 51 is provided with a base plate, the flexible vibrator 52 is arranged on the base plate, there are two lifting cylinders 54, which are respectively arranged on the base plates at both ends of the flexible vibrator 52, and the material tray 53 is arranged at the working ends of the two lifting cylinders 54.

[0070] During operation, the two-axis module 51 is used to drive the material tray 53 to move in the front-to-back and left-to-right directions, and is used for receiving the loose crystals, detecting their posture, and feeding the patch mechanism 1. The lifting cylinder 54 is used to drive the material tray 53 to contact or separate from the flexible vibrator 52. If all the loose crystals in the material tray 53 are not in a posture that can be grasped by the grasping unit 12, the lifting cylinder 54 drives the material tray 53 to contact the flexible vibrator 52, and the flexible vibrator 52 works to change the posture of the loose crystals in the material tray 53. The loose crystal positioning camera 63 is used for detecting the posture of the loose crystals in the material tray 53.

[0071] The present application realizes automatic feeding of substrates through the carrier feeding mechanism 3, positioning and conveying of substrates through the solid crystal workbench 2, and automatic collection of finished products into warehouses through the collection docking station 9 and the collection mechanism 8, thereby realizing the automated production of loose crystal solid crystal bonding wafers, improving work efficiency, and reducing scrap rate.

[0072] It should be noted that the above-mentioned technical features are further combined with each other to form various embodiments not listed above, which are all deemed to be within the scope of the present invention; and, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A micro thermoelectric cooling device-body packaging device, characterized in that: The device comprises a patch mechanism, wherein the patch mechanism comprises a three-axis module and at least one grabbing unit arranged at a working end of the three-axis module, wherein the grabbing unit comprises: A fixing seat, arranged at the working end of the three-axis module; A voice coil motor is disposed in the fixing seat; A movable seat, slidably disposed on one side of the fixed seat and connected to the working end of the voice coil motor; A suction nozzle, rotatably disposed in the movable seat; A servo motor is arranged on one side of the fixing seat and is used to drive the suction nozzle to rotate; A magnetic scale, arranged on one side of the movable seat; The magnetic grating reader corresponds to the magnetic grating scale and is arranged on the fixing seat.

2. A micro thermoelectric cooling device-body packaging device according to claim 1, characterized in that: It also includes a crystal bonding workbench arranged within the working range of the patch mechanism, the crystal bonding workbench includes a linear module, a fixed frame, a base, a carrier platform and a lifting cylinder, the fixed frame is arranged at the working end of the linear module, the base is arranged in the fixed frame, the carrier platform is slidably arranged in the base, the lifting cylinder is arranged on one side of the base, and the working end of the cylinder is connected to the carrier platform, a vacuum suction cup is arranged on the carrier platform, a material passing channel is provided on the top surface of the fixed frame, and the fixed frame and the carrier platform are used to clamp the carrier.

3. A micro thermoelectric cooling device-body packaging device according to claim 2, characterized in that: It also includes a carrier feeding mechanism arranged at one end of the crystal bonding workbench, the carrier feeding mechanism includes a linear slide, a bearing seat, a silo and a pushing device, the bearing seat is arranged at the working end of the linear slide, the silo is detachably arranged on the bearing seat, a multi-layer carrier channel is penetrated in the silo, and limit rods are detachably arranged on the silos at both ends of the carrier channel, and the pushing device is arranged on the linear slide away from the side of the crystal bonding workbench, and its working end penetrates the silo.

4. The micro thermoelectric cooling device-body packaging device according to claim 3, characterized in that: The pushing device includes a support seat, a pushing rod, a pushing motor, a driving wheel, a supporting wheel and a pressure wheel. The support seat is arranged on one side of the linear slide, the pushing motor is arranged on one side of the support seat, the driving wheel is arranged on the working end of the pushing motor, the supporting wheel is rotatably arranged on the support seat corresponding to the driving wheel, the pushing rod is arranged on the driving wheel and the supporting wheel, and there is at least one pressure wheel, which is elastically and adjustably rotatably arranged on the support seat and is rollingly connected to the pushing rod.

5. The micro thermoelectric cooling device-body packaging device according to claim 3, characterized in that: It also includes a docking platform arranged between the carrier feeding mechanism and the crystal bonding workbench, the docking platform includes a docking seat and a docking rail, there are two docking rails, which are respectively arranged on the docking seat opposite to and parallel to each other, and each of the docking rails is provided with a limit platform near one end of the crystal bonding workbench, and a rear limit assembly is provided in the middle, and the limit platform and the rear limit assembly are used to position the carrier.

6. The micro thermoelectric cooling device-body packaging device according to claim 5, characterized in that: The rear limit assembly includes a pin shaft and a limit plate. A receiving groove is opened on the docking rail. The pin shaft is arranged in the receiving groove. The limit plate is close to one end of the carrier feeding mechanism and is always located in the receiving groove in a natural state. The limit plate is kept extending out of the receiving groove at one end away from the carrier feeding mechanism.

7. The micro thermoelectric cooling device-body packaging device according to claim 1, characterized in that: It also includes a first visual inspection device arranged within the working range of the patch mechanism, the first visual inspection device includes a bracket, a second linear slide, a loose crystal positioning camera and a patch camera, the second linear slide is arranged on the bracket, the loose crystal positioning camera is arranged at one end of the bracket, and is used to detect the state of the loose crystals before the grabbing unit picks up the material, and the patch camera is arranged at the working end of the second linear slide, and is used to detect each patch station.

8. The micro thermoelectric cooling device-body packaging device according to claim 1, characterized in that: It also includes a second visual inspection device arranged in the working range of the patch mechanism, and the second visual inspection device includes a chip inspection camera. The chip inspection camera and the patch camera work in opposite directions and are used to inspect the bottom of the chip after the grasping unit grasps the chip.

9. The micro thermoelectric cooling device-body packaging device according to claim 3, characterized in that: It also includes a material receiving docking station and a material receiving mechanism. The material receiving docking station is arranged at one end of the solid crystal workbench away from the carrier feeding mechanism, and its structure is the same as that of the docking station. The material receiving mechanism is arranged on the side of the material receiving docking station away from the feeding mechanism, and its structure is the same as that of the carrier feeding mechanism and is symmetrically arranged.

10. The micro thermoelectric cooling device-body packaging device according to claim 9, characterized in that: A push rod is provided on one side of the carrier platform away from the carrier feeding mechanism, and the push rod is used to send the carrier on the material receiving docking platform into the material receiving mechanism.

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