Hybrid PCB with planar antenna

Abstract

A printed circuit board is formed of at least two layers. The first layer is thermally conductive and the second layer is thermally insulating. Both layers provide structural support and / or mechanical stiffness for the printed circuit board. A planar antenna is provided on the second layer.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit boards, in particular to printed circuit boards with planar antennas mounted thereon. Background Art

[0002] Printed circuit boards are a widely used and popular part of modern electronic devices. Typically, a printed circuit board provides structural support for the electronic components of an electronic device and defines the electrical interconnections between the electronic components coupled thereto.

[0003] Electronic devices often include multiple printed circuit boards, for example, each printed circuit board is designed for a different function of the electronic device.For example, a connected lighting arrangement may include a printed circuit board for each of the following functions: lighting; control; and radio / external communications.

[0004] There is a continuing desire to reduce the size and / or number of printed circuit boards to make electronic devices more compact. Summary of the invention

[0005] The invention is defined by the claims.

[0006] According to an example of one aspect of the present invention, there is provided a printed circuit board, comprising: a first layer, a second layer and a planar antenna on the second layer, wherein the first layer provides a core for the printed circuit board, the first layer is formed of a thermally conductive material for diffusing or dissipating heat and providing structural support for the printed circuit board, the second layer is formed of an electrically insulating and mechanically rigid material, the second layer is at least partially mounted on the first layer, and is suitable for supporting one or more electronic components that require heat dissipation, wherein at least one electronic component mounted on the first portion dissipates heat via the first layer.

[0007] The present invention provides a printed circuit board for performing multiple functions, including external communication (via a planar antenna) and at least one other function (via electronic components on the first part of the second layer). This provides a more compact and space-saving solution for electronic devices.

[0008] A heat sink / heat spreader is integrated into a printed circuit board by providing a first (thermally conductive) layer for spreading or dissipating heat from electronic components. For example, the first layer may dissipate the heat directly to the external environment, or spread / conduct the heat to a (further) heat sink (e.g., the housing of the printed circuit board).

[0009] A mechanically rigid (but electrically insulating) material forms a second layer mounted on the first layer. The second layer serves the dual function of providing additional structural support for the printed circuit board and electrically insulating the electronic components from the first layer and / or any other layers between the first and second layers (if present).

[0010] Thus, these approaches provide a more compact printed circuit board as multiple layers or components perform dual functions in an efficient manner.

[0011] In some embodiments, the second layer includes: a first part and a second part that is not installed on the first layer, the first part is installed on the first layer and is used to support one or more electronic components that require heat dissipation, wherein any electronic component installed on the first part dissipates heat through the first layer; and the planar antenna is located on the second part of the second layer.

[0012] It has been recognized that such layers near the antenna, in particular thermally and / or electrically conductive layers, may affect the efficiency and / or sensitivity of the antenna.Based on this realization, it has been proposed to remove or not provide the first layer below the antenna.

[0013] This approach therefore increases the sensitivity and accuracy of the planar antenna, thereby improving the operation of any PCB assembly that includes the disclosed printed circuit board.

[0014] Optionally, the second portion of the second layer is not completely surrounded by the first portion of the second layer. This approach improves the efficiency and / or sensitivity of the antenna by reducing the amount of material surrounding the antenna to increase sensitivity to incoming / outgoing electromagnetic waves.

[0015] The first layer may be formed of metal. This provides a mechanically strong core with good thermal conductivity for the printed circuit board. It has been recognized that among commercially available and reliable materials, metals provide the most suitable properties for performing the dual functions of heat diffusion / dissipation and structural support. Suitable example metals include aluminum (preferably heavy), iron and / or steel.

[0016] The second layer is formed from FR4 material. This provides the printed circuit board with a mechanically strong core with good insulation properties.

[0017] The planar antenna is preferably a meander antenna.

[0018] The printed circuit board may further include a first interconnect layer located between the first layer and the second layer, the first interconnect layer being formed of a conductive material. The first interconnect layer may be appropriately patterned to connect any relevant electronic components.

[0019] The printed circuit board may include an insulating layer between the first interconnect layer and the first layer, the insulating layer being formed of an electrically insulating material.

[0020] In some examples, the electrically insulating material is formed of a dielectric material.

[0021] Preferably, the thickness of the first layer is not less than 1 mm. For example, the thickness of the first layer is preferably not less than 2 mm, more preferably not less than 5 mm. In some examples, the thickness of the first layer is not less than 10 mm. Increasing the thickness of the first layer (e.g., to 1 mm or more) can increase the structural support of the rest of the printed circuit board.

[0022] The printed circuit board may include a second interconnect layer mounted on the second layer such that at least a portion of the second layer is located between the second interconnect layer and the first layer, the second interconnect layer being formed of a conductive material. The second interconnect layer may be appropriately patterned to connect any relevant electronic components.

[0023] The second interconnect layer may provide a ground plane for the planar antenna.

[0024] The planar antenna may be a radio frequency planar antenna, ie a planar antenna sized and shaped to provide and / or receive radio frequency communications.

[0025] A printed circuit board (PCB) assembly is also provided, the PCB assembly comprising the previously described printed circuit board and one or more electronic components mounted on the second layer. If the second layer is formed to have a first portion and a second portion, the one or more electronic components are preferably mounted on the second portion.

[0026] For example, the one or more electronic components may include control logic, radio frequency communication processing equipment, etc. The one or more electronic components may, for example, include one or more of the following: resistors, inductors, capacitors, microprocessors, transistors, transformers, diodes, etc.

[0027] The printed circuit board assembly may also include a housing that houses the printed circuit board and one or more electronic components. In some examples, the housing is thermally coupled to the first layer and is configured to dissipate and / or diffuse heat from the first layer. In some examples, the housing is formed of a thermally conductive material such as a metal.

[0028] A method for manufacturing a printed circuit board as disclosed herein is also proposed. The method includes: providing a first layer, the first layer providing a core for the printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat; providing a second layer formed of an electrically insulating and mechanically rigid material on top of the first layer; removing at least some of the first layer, thereby defining in the second layer: a first portion mounted on the first layer for supporting one or more electronic components that require heat dissipation, and a second portion not mounted on the first layer; and providing a planar antenna on the second portion of the second layer.

[0029] The method may further include providing a first interconnect layer on the first layer and the second layer, the first interconnect layer being formed of a conductive material, wherein the step of providing the second layer includes providing the second layer over the first interconnect layer.

[0030] Another method for manufacturing a printed circuit board as disclosed herein is also proposed. The method includes: providing a first layer, the first layer provides a core for the printed circuit board, the first layer is formed of a thermally conductive material for spreading or dissipating heat; providing a first portion of a second layer formed of an electrically insulating and mechanically rigid material on the first layer; forming a second portion of the second layer separately from the first layer and the first portion of the second layer; coupling the second portion of the second layer to the first portion of the second layer, thereby defining a second layer, the second layer including: a first portion mounted on the first layer for supporting one or more electronic components that need to dissipate heat, and a second portion not mounted on the first layer; and providing a planar antenna on the second portion of the second layer.

[0031] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment(s) described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] For a better understanding of the invention, and to show more clearly how it may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings, in which:

[0033] Figure 1 A cross-sectional view of a portion of a printed circuit board is provided;

[0034] Figure 2 A printed circuit board is conceptually illustrated;

[0035] Figure 3 is a flow chart illustrating a method for producing a printed circuit board; and

[0036] Figure 4 is a flow chart illustrating another method for producing a printed circuit board. DETAILED DESCRIPTION

[0037] The present invention will be described with reference to the accompanying drawings.

[0038] It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the apparatus, system, and method, are for illustrative purposes only and are not intended to limit the scope of the invention. These and other features, aspects, and advantages of the apparatus, system, and method of the invention will be better understood through the following description, the appended claims, and the accompanying drawings. It should be understood that the drawings are merely schematic and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the drawings to indicate the same or similar components.

[0039] A printed circuit board formed of at least two layers is provided. The first layer is thermally conductive and the second layer is thermally insulating. Both layers provide structural support and / or mechanical rigidity to the printed circuit board. A planar antenna is provided on the second layer.

[0040] Embodiments are based on the recognition that the thermally conductive core of a printed circuit board, while providing good heat spreading / dissipation, can affect the operation of the antenna and may not provide adequate structural support. The present invention proposes further providing an additional (second) layer of thermally insulating but structurally rigid material for mounting electronic components and the planar antenna.

[0041] Other embodiments also recognize that a conductive core near the planar antenna will affect its operation, such as reducing its sensitivity and / or accuracy. It is proposed to split the second layer into a first portion located on the core and a second portion not mounted on the core, so that the planar antenna is kept at a certain distance from the core. The second layer provides sufficient structural support for the planar antenna.

[0042] The disclosed method may be used with any suitable printed circuit board configuration utilizing a planar antenna, and has particular application in radio frequency printed circuit board assemblies.

[0043] In the context of this disclosure, if one layer is mounted "on top of" another layer, the structure of the layers is designed so that one layer structurally supports the other layer. Additional layers may be present between the layers where one layer is mounted "on top of" another layer.

[0044] In particular, if after manufacturing a printed circuit board including a first assumed layer and a second assumed layer, the first assumed layer is immediately vertically located above the second assumed layer, for example, so that a vertical assumed line (a line parallel to the direction of gravity) will pass through the first assumed layer and the second assumed layer, then the first assumed layer can be regarded as being "above" the second assumed layer.

[0045] Figure 1 A cross-sectional view of a printed circuit board 100 according to an embodiment is conceptually provided. Figure 1 It is used to conceptually illustrate the proposed method and is for illustration only.

[0046] The printed circuit board includes a first layer 110 that provides a core for the printed circuit board 100. The first layer 110 is formed of a thermally conductive material that is configured to spread or dissipate heat. The first layer also provides structural support for the printed circuit board.

[0047] Suitable example materials for performing the necessary functions will be apparent to those skilled in the art, and include metals such as aluminum, iron or steel, and other materials such as ceramics (e.g., aluminum oxide or aluminum oxide (Al2O3) or aluminum nitride). Preferably, the first layer is made of a thermal conductivity of not less than 20 Wm -1 K -1 (For example, at 20° C.) and a material having a Young's modulus of not less than 50 GPa.

[0048] The first layer can be appropriately sized to achieve its desired function, for example, to provide structural support for at least the printed circuit board. For example, the thickness of the first layer can be no less than 1 mm. In some examples, the thickness of the first layer is preferably no less than 2 mm, and more preferably no less than 5 mm. In some examples, the thickness of the first layer is no less than 10 mm. Increasing the thickness of the first layer (e.g., to 1 mm or more) can increase the structural support of the rest of the printed circuit board.

[0049] Thus, the first layer 110 acts as both a structural support and a heat sink / heat spreader or heat spreader for the printed circuit board 100 .

[0050] The printed circuit board 100 also includes a second layer 120 at least partially mounted on the first layer. In the example shown, the second layer is only partially mounted on the first layer. The thickness of the second layer 120 can be 0.1 mm to 4 mm, such as 0.1 mm to 2 mm, such as 0.1 mm to 1 mm, such as 0.5 mm.

[0051] The second layer is formed of an electrically insulating and mechanically rigid material. Example materials include FR4 (or FR-4) material or other similar materials with a high dielectric constant or relative dielectric constant, such as ceramics.

[0052] The second layer is configured to support one or more electronic components that need to dissipate heat. At least one electronic component 125 mounted on the first portion dissipates heat via the first layer. Therefore, the first layer can directly dissipate heat from at least one electronic component 125 and / or diffuse / conduct heat to one / another heat sink for dissipation.

[0053] The second layer provides additional structural support for the printed circuit board, and in particular the components located thereon.The second layer also serves to electrically insulate the electronic components from the first layer and / or any other layers between the first and second layers (if present).

[0054] The printed circuit board 100 further includes a planar antenna 130, which is a planar antenna located on the second layer. For example, the planar antenna 130 may be a meander antenna.

[0055] The planar antenna may be a radio frequency planar antenna, i.e. a planar antenna that is sized and shaped to provide and / or receive radio frequency communications. Thus, the planar antenna may be configured to generate an electrical signal that changes in response to an incoming radio frequency wave, and / or to generate a radio frequency wave in response to a provided electrical signal. Methods for configuring a planar antenna for this purpose are well known in the art.

[0056] In other embodiments of the present invention, other forms of planar antennas (ie, non-RF planar antennas) may also be used.

[0057] Figure 1 A particularly advantageous version of a printed circuit board is shown. In this version, the second layer can be conceptually divided into a first portion 121 and a second portion 122. This division is conceptually indicated by a dashed line.

[0058] The first part 121 is mounted on the first layer and is configured to support one or more electronic components 125 that need to dissipate heat. As mentioned above, any electronic components mounted on the first part dissipate heat through the first layer.

[0059] The second portion 122 is not mounted on the first layer. Instead, it is structurally supported by the first layer 110 via the first portion 121. Therefore, the second portion 122 is structurally supported by the first portion 121 of the second layer.

[0060] The planar antenna 130 is located on the second portion 122 of the second layer. The material of the second layer 120 provides mechanical rigidity for supporting the antenna in the second portion 122 of the second layer. In particular, the second portion 122 of the second layer provides mechanical stability for the planar antenna 130.

[0061] In this manner, there is no area of ​​the first layer 110 near the planar antenna and the second portion 122 of the second layer. Thus, the first layer does not provide direct structural support for the second portion 122 of the second layer 120 or the planar antenna 130 (rather, support is provided only via the first portion 121 of the second layer).

[0062] Preferably, the second portion 122 of the second layer 120 is not completely surrounded by the first portion of the second layer. Thus, the second portion 122 can effectively overhang the first layer 110. This approach reduces the amount of material near the antenna, which can increase the antenna's sensitivity to electromagnetic radiation.

[0063] It should be understood that the printed circuit board 100 may include one or more electronic components 125 that require heat dissipation to form a printed circuit board assembly. However, this is not required, and the printed circuit board 100 may instead include one or more electronic components 125 that can then be coupled or connected to a location or area, as is known in the art.

[0064] although Figure 1 Only one electronic component 125 is shown in FIG. 1 , but for the sake of understanding, this is purely schematic. In practice, the printed circuit board can be configured to mount any number of electronic components, for example, more than 10 components or more than 100 components.

[0065] Other optional features of the printed circuit board 100 are also Figure 1 Medium picture.

[0066] Some electronic components, such as LEDs, generate a lot of heat. Therefore, it is preferred to thermally couple these components more closely to the first layer 110 (which acts as a heat sink).

[0067] Thus, in some examples, one or more additional electrical components 140 may be mounted on the first layer 110, but not mounted on the second layer 120. Thus, one or more electrical components may be structurally supported directly by the first layer 110, but not by the second layer 120 (i.e., when the first layer is placed on a flat surface).

[0068] This thermally couples the one or more additional electrical components more closely to the first layer, thereby improving heat dissipation of such components with respect to the printed circuit board.

[0069] As previously mentioned, it should be understood that the printed circuit board 100 may include one or more additional electronic components 140. However, this is not required, and the printed circuit board 100 may instead include locations or areas to which one or more additional electronic components 140 may then be coupled or connected, as is known in the art.

[0070] although Figure 1 Only one additional electronic component 140 is illustrated in FIG. 1 , but for the sake of understanding, this is purely schematic. In practice, the printed circuit board may be configured to mount any number of additional electronic components, for example, more than 10 additional components or more than 100 additional components.

[0071] It is often desirable to provide interconnects on the printed circuit board 100 to connect components supported thereon to perform desired functions. The printed circuit board may thus include one or more interconnect layers 151, 152, 153 formed of conductive material.

[0072] For example, the printed circuit board may include a first interconnect layer 151 located between the first layer 110 and the second layer 120. For example, the first interconnect layer 151 may provide electrical connections to any (multiple) additional electronic components 140 mounted on the first layer 110 (but not the second layer 120). The first interconnect layer 151 is formed of a conductive material.

[0073] The printed circuit board 100 may include a second interconnect layer 152 mounted on the second layer 120. In particular, the second interconnect layer is positioned such that at least a portion of the second layer is located between the second interconnect layer and the first layer. The second interconnect layer 152 is also formed of a conductive material.

[0074] The second interconnect layer may also provide a ground plane for the planar antenna.

[0075] It should be understood that the second interconnect layer 152 need not be located below the planar antenna 130. Figure 1Instead, both the second interconnect layer 152 and the planar antenna 130 may be (directly) mounted on the second layer 120. In particular, the planar antenna 130 may effectively form a part of the second interconnect layer 130 and / or the second interconnect layer may provide an electrical connection for the planar antenna 130.

[0076] The printed circuit board 100 may include a third interconnect layer 153 mounted between the first interconnect layer 151 and the second layer 120. The third interconnect layer 152 facilitates assembly or manufacture of the printed circuit board (e.g., allowing the first layer and the second layer to be produced separately before being coupled together via the first interconnect layer and the second interconnect layer). The third interconnect layer 153 is also formed of a conductive material.

[0077] Example conductive materials for use as the first interconnect layer, the second interconnect layer and / or the third interconnect layer (where relevant) include copper, gold or silver. Copper is generally preferred because of its low cost and ease of manufacture (eg, for performing soldering, etc.).

[0078] Each interconnect layer 151, 152, 153 (if / when present) can be constructed in the form of one or more electrical traces, for example, for connecting locations to which electronic components are or will be coupled. The electrical traces can form a predetermined connection pattern for achieving the desired communication goals. Methods for forming such traces are well known in the printed circuit board art.

[0079] To prevent components from providing current to the first layer 110 (which acts as a heat sink), the printed circuit board may further include an insulating layer 160 between the first interconnect layer 151 and the first layer 110. The thickness of the insulating layer may be between 0.05 mm and 1 mm, for example 0.1 mm.

[0080] The insulating layer is formed of an electrically insulating material, such as a dielectric material (eg, aluminum nitride or silicon carbide). Preferably, the thermal conductivity of the insulating material is not less than 20 Wm -1 K -1 (e.g., at 20°C) to improve heat dissipation.

[0081] The use of an insulating layer is particularly advantageous when the first layer is formed from a conductive material, such as a metal (eg, aluminum). This may prevent the first layer from becoming electrically charged and potentially dangerous to an object that (eg, accidentally) contacts the first layer.

[0082] The printed circuit board 100 may also include one or more vias 170 or interconnects through the second layer 120. This allows components mounted on the second layer 120 to electrically communicate with any components not mounted on the first layer through the via(s) and the first / second interconnect layers.

[0083] Each via(s) is a hole through the second layer 120 that is filled or coated with a conductive material, such as a metal (eg, copper, gold, or silver).

[0084] The via(s) are also used to provide heat dissipation for components mounted on the second layer, for example by conducting heat through the vias to the first layer 110. This approach is particularly advantageous when the second layer is thermally insulating, for example formed of FR4 material or the like.

[0085] Each via can include a plug of thermally conductive material, such as to completely or partially fill the via to improve heat dissipation. Example thermally conductive materials include metals and some ceramics. In some examples, each via is a hole coated with metal (for providing an electrical connection) and is filled with a plug of thermally conductive material such as ceramic.

[0086] Although only one via is shown, it will be apparent to those skilled in the art that the printed circuit board may include any number of vias.

[0087] Figure 2 A perspective view is provided of an example printed circuit board 100. For clarity, only two electronic components are illustrated, but those skilled in the art will readily appreciate that, in practice, such a printed circuit board 100 may be configured to mount any number of electronic components.

[0088] Figure 2 It more clearly illustrates how the planar antenna 130 is mounted on the second portion 122 of the second layer 120, which is not mounted by the first layer 110 (eg, not directly structurally supported by the first layer).

[0089] The figure also more clearly illustrates how additional electronic components 140 may be mounted to the first layer 110 without being mounted on the second layer 120. In particular, the second layer 120 may include one or more cavities 129 into which any such additional electronic components may be positioned.

[0090] To make it clear, Figure 2 Other layers, such as (multiple) interconnect layers and / or insulating layers, are not directly illustrated. In particular, Figure 2 It helps to understand the spatial relationship between the first and second layers.

[0091] Figure 3 is a flow chart illustrating a method 300 for manufacturing a printed circuit board as disclosed herein.

[0092] Method 300 includes step 310 of providing a first layer, the first layer providing a core for a printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat. For example, step 310 may be performed using a deposition technique or a cutting / slicing technique.

[0093] The method 300 also includes step 320 of providing a second layer formed of an electrically insulating and mechanically rigid material over the first layer. For example, step 320 can be performed by depositing the second layer over the first layer. As another example, step 320 can be performed by separately producing the second layer and bonding or otherwise mounting the second layer to the first layer.

[0094] As an alternative example, steps 310 and 320 may be performed by depositing the first layer on the second layer, or by mounting or bonding together the first layer and the second layer that are produced separately.

[0095] After performing steps 310 and 320 , the first layer and the second layer may have the same cross-sectional area (eg, when viewed from above).

[0096] The method further includes step 330: removing at least some of the first layer. Thus, the second layer is defined as: a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation; and a second portion not mounted on the first layer.

[0097] Method 300 also includes step 340 of providing a planar antenna on the second portion of the second layer. Methods for performing this step will be clear to those skilled in the art and may include using a deposition or printing technique, followed by an etching step if necessary, to form the planar antenna. Of course, some deposition techniques do not require an etching step to produce the shape or form of the planar antenna.

[0098] Steps 330 and 340 may be performed in reverse order such that at least some of the first layer is removed after providing the planar antenna on the second portion of the second layer.

[0099] Of course, method 300 may be appropriately modified to include providing other optional layers of the printed circuit board.

[0100] For example, method 300 may further include step 350 of providing a first interconnect layer between the first layer and the second layer, the first interconnect layer being formed of a conductive material. Thus, step 320 may be modified to include providing the second layer above the first interconnect layer.

[0101] Similarly, method 300 may further include step 360: providing a second interconnect layer on the second layer (such that the second layer is located between the first layer and the second interconnect layer). This may be performed after performing step 320 and / or may be integrated into the performance of step 340. Thus, the planar antenna and the second interconnect layer may be produced or provided simultaneously or in the same process (e.g., the same deposition and optional etching process).

[0102] The method 300 may further comprise step 370: providing an insulating layer between the first interconnect layer and the first layer. For example, this may be achieved using a deposition technique. Of course, when step 370 is performed, the first interconnect layer may not yet exist.

[0103] Figure 4 is a flow chart illustrating an alternative method 400 for manufacturing a printed circuit board as disclosed herein.

[0104] The method 400 includes step 410 of providing a first layer, the first layer providing a core for a printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat.

[0105] The method 400 further comprises providing a first portion of a second layer formed of an electrically insulating and mechanically rigid material over the first layer at step 420. The portion of the second layer provided on the first layer in this way may serve as the first portion.

[0106] Steps 410 and 420 may be performed in the same manner as any of the previously described steps 310, 320 (see Figure 3 ) is executed in a similar manner.

[0107] The method 400 also includes step 430 of forming a second portion of the second layer separately from the first layer and the first portion of the second layer.

[0108] The method then proceeds to step 440 of coupling the second portion of the second layer to the first portion of the second layer. This may be accomplished using any suitable bonding technique.

[0109] The execution of step 440 thus defines a second layer, which includes a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation; and a second portion not mounted on the first layer.

[0110] The method 400 further comprises a step 450 of providing a planar antenna on the second portion of the second layer. This may be performed in any manner similar to the previously described step 340. Step 450 may be performed before or after step 440.

[0111] In one variation of method 400, step 450 is performed as part of steps 420 and 440. In the method, step 420 includes: step 421 of providing an initial second layer above the first layer; step 422 of providing a planar antenna on the second layer and step 423 of etching or removing portions of the first layer and the second layer near the planar antenna. The remaining (unremoved) portion of the second layer forms the first portion of the second layer. The second portion (generated in step 430) is then coupled to the first portion to perform both steps 440 and 450.

[0112] As with the previously described method 300 , the method 400 may be appropriately modified to include providing other optional layers of the printed circuit board.

[0113] For example, method 400 may further include step 460 of providing a first interconnect layer between the first layer and the second layer, the first interconnect layer being formed of a conductive material. Thus, step 420 may be modified to include providing the second layer above the first interconnect layer.

[0114] Similarly, method 400 may further include step 465: providing a second interconnect layer on the second layer (such that the second layer is located between the first layer and the second interconnect layer). This may be performed after performing step 420, and / or may be integrated into the performance of step 450 (where appropriate). Thus, the planar antenna and the second interconnect layer may be produced or provided simultaneously or in the same process (e.g., the same deposition and optional etching process).

[0115] The method 400 may further comprise step 470: providing an insulating layer between the first interconnect layer and the first layer. For example, this may be achieved using a deposition technique. Of course, when performing step 470, the first interconnect layer may not yet exist.

[0116] Other variations and modifications to the printed circuit board manufacturing methods described herein will be apparent to those skilled in the art.

[0117] Suitable deposition techniques for the proposed embodiments are well known in the art of circuit fabrication and are not described here for the sake of clarity. Example deposition techniques include physical or chemical vapor deposition techniques, sputtering techniques, and the like.

[0118] Variations to the disclosed embodiments may be understood and effected by those skilled in the art in practicing the claimed invention by studying the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.

[0119] The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0120] If the term "adapted to" is used in the claims or description, it should be noted that the term "adapted to" is intended to be equivalent to the term "configured to". If the term "arranged" is used in the claims or description, it should be noted that the term "arranged" is intended to be equivalent to the term "system", and vice versa.

[0121] Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A printed circuit board, comprising: a first layer, the first layer providing a core for the printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat and providing structural support for the printed circuit board; The second layer includes: a first portion, mounted on the first layer, for supporting one or more electronic components that require heat dissipation, wherein any electronic component mounted on the first portion dissipates heat through the first layer; and The second part, not installed on the first layer, wherein the second layer is formed of an electrically insulating and mechanically rigid material, the second layer is at least partially mounted on the first layer, and is suitable for supporting one or more electronic components that require heat dissipation, wherein at least one electronic component mounted on the first portion dissipates heat via the first layer; and A planar antenna is located on the second portion of the second layer. 2 . The printed circuit board of claim 1 , wherein the second portion of the second layer is not completely surrounded by the first portion of the second layer.

3. The printed circuit board according to any one of claims 1 to 2, wherein the first layer is formed of metal.

4. The printed circuit board according to any one of claims 1 to 3, wherein the second layer is formed of FR4 material.

5. The printed circuit board according to any one of claims 1 to 4, wherein the planar antenna is a meander antenna. 6 . The printed circuit board according to claim 1 , further comprising a first interconnection layer located between the first layer and the second layer, the first interconnection layer being formed of a conductive material. 7 . The printed circuit board according to claim 6 , further comprising an insulating layer between the first interconnect layer and the first layer, the insulating layer being formed of an electrically insulating material.

8. The printed circuit board of claim 7, wherein the electrically insulating material is formed of a dielectric material.

9. The printed circuit board according to any one of claims 1 to 8, wherein the thickness of the first layer is not less than 1 mm.

10. The printed circuit board of claim 6, further comprising a second interconnect layer mounted on the second layer such that at least a portion of the second layer is located between the second interconnect layer and the first layer, the second interconnect layer being formed of a conductive material.

11. The printed circuit board of claim 10, wherein the second interconnect layer provides a ground plane for the planar antenna.

12. A method for manufacturing a printed circuit board according to any one of claims 1 to 11, the method comprising: providing a first layer, the first layer providing a core for the printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat; providing a second layer formed of an electrically insulating and mechanically rigid material over the first layer; removing at least some of the first layer, thereby defining in the second layer: A first part, mounted on the first layer, for supporting one or more electronic components that need to dissipate heat; as well as a second portion, not installed above the first layer; as well as A planar antenna is provided on the second portion of the second layer.

13. The method according to claim 12, further comprising providing a first interconnect layer on the first layer and the second layer, the first interconnect layer being formed of a conductive material, wherein The step of providing a second layer comprises providing the second layer over the first interconnect layer.

14. A method for manufacturing a printed circuit board according to any one of claims 1 to 11, the method comprising: providing a first layer, the first layer providing a core for the printed circuit board, the first layer being formed of a thermally conductive material for spreading or dissipating heat; providing a first portion of a second layer formed of an electrically insulating and mechanically rigid material over the first layer; forming a second portion of the second layer separately from the first layer and the first portion of the second layer; coupling the second portion of the second layer to the first portion of the second layer, thereby defining a second layer, the second layer comprising: The first part is mounted on the first layer and is used to support one or more electronic components that need to dissipate heat; and the second portion is not installed on the first layer; and A planar antenna is provided on the second portion of the second layer.

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