Automatic unloading type thin-plate butterfly valve disc stamping equipment

Abstract

The present application relates to stamping equipment technical field, specifically to a kind of automatic unloading type sheet butterfly valve vane stamping equipment, including workbench and base, workbench is fixedly connected to base, drive assembly is provided on base, drive assembly includes press and mould, press is fixedly connected to workbench, mould is fixedly connected to press, heating assembly is provided on workbench, heating assembly includes support, conducting sheet, fixed cylinder, lifting seat, rubber air bag, first power supply, fixed rod, first conducting block and first conducting rod, support is fixedly connected to workbench, two conducting sheets are fixedly connected to support, fixed cylinder is fixedly connected to base, lifting seat is slidably connected to fixed cylinder, cooling assembly is provided on base;The present application can heat raw material before stamping and soften, so that raw material can be more fitted with mould in stamping process, so that the valve piece produced at subtle feature is more satisfied with production demand.

Description

Technical Field

[0001] The invention relates to the technical field of stamping equipment, in particular to an automatic unloading type thin-film butterfly valve disc stamping device. Background Art

[0002] Butterfly valve discs are usually in the form of thin sheets, so in mass production, they can be produced by stamping. Compared with butterfly valve discs produced by cutting and other methods, butterfly valve discs produced by stamping have smoother edges, so they can have better sealing when used.

[0003] However, depending on the type of butterfly valve, some butterfly valve discs have subtle features in shape, that is, the shape of the butterfly valve disc is irregular, so that the valve disc is subject to less resistance when in use. When the butterfly valve disc has these subtle features in shape, the butterfly valve disc produced by conventional stamping methods is prone to form dimensional errors at these subtle features, resulting in poor sealing when the valve disc is put into use. Therefore, a new stamping equipment is needed to solve this problem. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention proposes an automatic unloading type thin-film butterfly valve plate stamping equipment, which can heat and soften the raw materials before stamping, so that the raw materials can fit better with the mold during the stamping process, so that the produced valve plates can better meet production requirements in terms of subtle features.

[0005] The technical solution to achieve the purpose of the present invention is: an automatic unloading type thin-film butterfly valve valve sheet stamping equipment, including a workbench and a base, the workbench is fixedly connected to the base, a driving assembly is provided on the base, the driving assembly includes a press and a mold, the press is fixedly connected to the workbench, the mold is fixedly connected to the press, a heating assembly is provided on the workbench, the heating assembly includes a bracket, a conductive sheet, a fixed cylinder, a lifting seat, a rubber airbag, a first power supply, a fixed rod, a first conductive block and a first conductive rod, the bracket is fixedly connected to the workbench, and the two The conductive sheet is fixedly connected to the bracket, the fixed tube is fixedly connected to the base, the lifting seat is slidably connected to the fixed tube, the rubber airbag is fixedly connected between the inner wall of the fixed tube and the inner wall of the lifting seat, the first power supply is fixedly connected to the inside of the lifting seat, the fixed rod is fixedly connected to the lifting seat, the two first conductive blocks are fixedly connected to the fixed rod, the two first conductive blocks are respectively electrically connected to the positive and negative poles of the first power supply, the two first conductive rods are fixedly connected to the bracket, the two first conductive rods are respectively fixedly connected to the two conductive sheets, and a cooling component is provided on the base.

[0006] Preferably, the driving assembly further comprises a sliding frame, two clamping plates and springs, the sliding frame is slidably connected to the workbench, the two clamping plates are slidably connected to the sliding frame, and the springs are provided in two groups and are fixedly connected between the corresponding clamping plates and the sliding frame.

[0007] Preferably, the driving assembly further comprises a motor, a rotating rod and a sliding block, the motor is fixedly connected to the workbench, the sliding block is slidably connected to the sliding frame, one end of the rotating rod is fixedly connected to the output shaft of the motor, and the other end of the rotating rod is rotatably connected to the sliding block.

[0008] Preferably, the heating assembly further comprises a first through hole and a second through hole, the first through hole is formed in the support, the second through hole is formed in the workbench, the lifting seat is located in the second through hole, and the first through hole is located below the mold.

[0009] Preferably, the cooling assembly comprises a semiconductor refrigerator and two second conductive blocks, the semiconductor refrigerator is arranged in the lifting seat, the two second conductive blocks are fixedly connected to the fixing rod, and the two second conductive blocks are electrically connected to the positive and negative electrodes of the semiconductor refrigerator, respectively.

[0010] Preferably, the cooling assembly further comprises a second power supply and two second conductive rods, the second power supply is fixedly connected to the base, the two second conductive rods are fixedly connected to the second power supply, and the two second conductive rods are electrically connected to the positive and negative electrodes of the second power supply, respectively.

[0011] Preferably, the cooling assembly further comprises a telescopic rod and a third through hole, the telescopic rod is fixedly connected to the inner wall of the fixing cylinder, and the third through hole is formed in the lifting seat.

[0012] Preferably, the two first conductive blocks and the two second conductive blocks are located at the top and the bottom of the fixing rod, respectively, and the two first conductive rods and the two second conductive rods are located above and below the fixing rod, respectively.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] Firstly, in the present application, the raw metal plate for stamping can be placed on the workbench, and the metal plate can be placed between the two clamping plates, the two clamping plates have elastic expansion function under the action of the springs, so that the metal plate can be clamped even if the size of the metal plate is not fixed;

[0015] Secondly, in the present invention, after the metal plate is clamped, the motor can be started to push the metal plate fixed inside the slide forward. When the metal plate is moved to the bottom of the mold, the metal plate will contact the two conductive sheets. At this time, a complete circuit will be formed between the two conductive sheets, the metal plate and the first power supply. Therefore, current will flow into the metal plate. At this time, the metal plate will generate heat due to its own internal resistance. As the temperature of the metal plate continues to rise, the hardness of the metal plate will decrease. At this time, the press can be started to move the mold downward. During the downward movement of the mold, the metal plate will be stamped. During this process, a part of the metal plate will be filled into the mold. Because the metal plate has been heated and softened, the metal can be better filled into the mold. Compared with the ordinary stamping process, the shape of the metal in the mold can better fit the required shape, especially in subtle features. Errors are less likely to occur.

[0016] Thirdly, in the present invention, when the mold is pressed downward, it will press against the lifting seat below, and then press the lifting seat downward together. When the lifting seat moves downward, the rubber airbag will be compressed and folded, and the telescopic rod will be squeezed and shortened. At the same time, the two first conductive rods will be separated from the two first conductive blocks. At this time, the first power supply no longer generates current, so the metal plate is no longer heated, until the lifting seat is lowered to a certain height. At this time, the two second conductive blocks will contact the two second conductive rods. At this time, the circuit between the second power supply and the semiconductor refrigerator is connected, and the semiconductor refrigerator is started. The semiconductor refrigerator can cool quickly and generate low temperature in a very short time, so that the lifting seat and the mold are cooled. Therefore, the metal valve sheet in the mold will also cool down quickly and be shaped. Since the metal valve sheet in the mold cools down quickly, it will automatically complete demolding from the mold.

[0017] Fourthly, when the valve disc in the mold is demolded, the press can be started to raise and reset the mold. The demolded valve disc will remain on the top of the lifting seat. During the reset of the mold, since the lifting seat is no longer squeezed, the rubber airbag and the telescopic rod will reset due to their own elasticity. However, a compression spring is provided in the telescopic rod, so the reset speed is faster than the reset speed of the rubber airbag. Therefore, the top of the telescopic rod will protrude from the third through hole, thereby pushing the valve disc on the lifting seat open and completing the unloading of the valve disc. After that, the rubber airbag slowly resets and pushes the lifting seat upward, causing the lifting seat to slowly reset, so that the top of the telescopic rod is again inside the lifting seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further explained below in conjunction with the accompanying drawings and examples:

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention Figure One ;

[0020] Figure 2It is a schematic diagram of the three-dimensional structure of the present application Figure Two ;

[0021] Figure 3 It is an exploded view of the connecting structure of the carriage and the clamping plate in the present application

[0022] Figure 4 It is a cross-sectional view of the internal structure of the present application

[0023] Figure 5 It is an enlarged view of the A part structure shown in the present application Figure 2

[0024] Figure 6 It is an enlarged view of the B part structure shown in the present application Figure 4

[0025] Explanation of reference signs:

[0026] 1, workbench; 2, base; 3, driving assembly; 31, press; 32, mold; 33, carriage; 34, clamping plate; 35, spring; 36, motor; 37, rotating rod; 38, sliding block; 4, heating assembly; 41, support; 42, first through hole; 43, conductive sheet; 44, fixed cylinder; 45, lifting seat; 46, rubber air bag; 47, first power supply; 48, fixed rod; 49, first conductive block; 410, first conductive rod; 411, second through hole; 5, cooling assembly; 51, semiconductor cooler; 52, second conductive block; 53, second power supply; 54, second conductive rod; 55, telescopic rod; 56, third through hole. DETAILED DESCRIPTION

[0027] The present application will be described in detail below, and the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] The present application provides an automatic unloading type sheet butterfly valve disc stamping equipment, and the technical scheme of the present application is:

[0029] As Figures 1-6 ​​As shown, an automatic unloading type sheet butterfly valve disc stamping equipment, including workbench 1 and base 2, workbench 1 is fixedly connected to base 2, base 2 is provided with drive assembly 3, drive assembly 3 includes press 31 and die 32, press 31 is fixedly connected to workbench 1, die 32 is fixedly connected to press 31, workbench 1 is provided with heating assembly 4, heating assembly 4 includes support 41, conducting sheet 43, fixed cylinder 44, lifting seat 45, rubber air bag 46, first power supply 47, fixed rod 48, first conducting block 49 and first conducting rod 410, support 41 is fixedly connected to workbench 1, two conducting sheets 43 are fixedly connected to support 41, fixed cylinder 44 is fixedly connected to base 2, lifting seat 45 is slidingly connected to fixed cylinder 44, rubber air bag 46 is fixedly connected between the inner wall of fixed cylinder 44 and the inner wall of lifting seat 45, first power supply 47 is fixedly connected to the inside of lifting seat 45, fixed rod 48 is fixedly connected to lifting seat 45, two first conducting blocks 49 are fixedly connected to fixed rod 48, two first conducting blocks 49 are electrically connected with the positive and negative electrodes of first power supply 47 respectively, two first conducting rods 410 are fixedly connected to support 41, two first conducting rods 410 are fixedly connected with two conducting sheets 43 respectively, base 2 is provided with cooling assembly 5, rubber air bag 46 has the same effect as spring 35, it can be compressed and can restore shape by its elasticity, but its elasticity is weaker than spring 35, so after being squeezed, its reset speed is slower, so after lifting seat 45 descends, it will reset at a slow speed.

[0030] Further, drive assembly 3 further includes slide 33, clamping plate 34 and spring 35, slide 33 is slidingly connected to workbench 1, two clamping plates 34 are slidingly connected to slide 33, spring 35 is provided with two groups and each group of spring 35 is fixedly connected between the corresponding clamping plate 34 and slide 33, the metal plate is placed between the two clamping plates 34, then the two clamping plates 34 have elastic expansion function under the action of spring 35, so even if the size of the metal plate is not fixed, it can also be placed between the two clamping plates 34, and the metal plate is clamped by the elastic force of spring 35.

[0031] Further, drive assembly 3 further includes motor 36, rotating rod 37 and sliding block 38, motor 36 is fixedly connected to workbench 1, sliding block 38 is slidingly connected to slide 33, one end of rotating rod 37 is fixedly connected to the output shaft of motor 36, the other end of rotating rod 37 is rotatably connected with sliding block 38, rotating rod 37 is rotated by motor 36, which can control slide 33 to translate on workbench 1, and the raw metal plate is placed between the two clamping plates 34, so the raw metal plate can be moved by the movement of slide 33.

[0032] Furthermore, the heating assembly 4 also includes a first through hole 42 and a second through hole 411. The first through hole 42 is opened on the bracket 41, and the second through hole 411 is opened on the workbench 1. The lifting seat 45 is located inside the second through hole 411, and the first through hole 42 is located below the mold 32.

[0033] Furthermore, the cooling component 5 includes a semiconductor cooler 51 and a second conductive block 52. The semiconductor cooler 51 is arranged inside the lifting seat 45. The two second conductive blocks 52 are fixedly connected to the fixed rod 48. The two second conductive blocks 52 are electrically connected to the positive and negative poles of the semiconductor cooler 51 respectively. The semiconductor cooler 51 can generate low temperature in a very short time and conduct the low temperature to the entire lifting seat 45. When the mold 32 moves downward and is stamped, the mold 32 and the lifting seat 45 will come into contact. Therefore, when the lifting seat 45 is cooled by the semiconductor cooler 51, the low temperature will also be quickly conducted to the mold 32, so that the valve sheet in the mold 32 can be demolded.

[0034] Furthermore, the cooling component 5 also includes a second power supply 53 and a second conductive rod 54. The second power supply 53 is fixedly connected to the base 2. The two second conductive rods 54 are fixedly connected to the second power supply 53. The two second conductive rods 54 are electrically connected to the positive and negative poles of the second power supply 53 respectively. The second power supply 53 is used to power the semiconductor refrigerator 51.

[0035] Furthermore, the cooling component 5 also includes a telescopic rod 55 and a third through hole 56. The telescopic rod 55 is fixedly connected to the inner wall of the fixed cylinder 44. The third through hole 56 is opened on the lifting seat 45. There is a compression spring inside the telescopic rod 55. It can be shortened when squeezed and will restore its original length when not squeezed.

[0036] Furthermore, the two first conductive blocks 49 and the two second conductive blocks 52 are respectively located at the top and bottom of the fixed rod 48, and the two first conductive rods 410 and the two second conductive rods 54 are respectively located above and below the fixed rod 48. When the lifting seat 45 is in the initial position, the first conductive block 49 and the first conductive rod 410 can be made to contact. At this time, the first power supply 47 and the conductive sheet 43 are energized, and then the metal plate is energized so that the metal plate is heated and softened. When the lifting seat 45 moves downward to a certain distance, the second conductive block 52 and the second conductive rod 54 are in contact. At this time, the second power supply 53 supplies power to the semiconductor cooler 51.

[0037] The specific working method is: first place the raw metal plate for stamping on the workbench 1, and put the metal plate between the two clamps 34. The two clamps 34 have elastic expansion and contraction functions under the action of the spring 35. Therefore, even if the size of the metal plate is not fixed, it can be placed between the two clamps 34 and the elastic force of the spring 35 is used to clamp the metal plate.

[0038] After the metal plate is clamped, the motor 36 can be started, and the output shaft of the motor 36 will drive the rotating rod 37 to rotate. When the rotating rod 37 rotates, it will push the slider 38, so that the slider 38 drives the slide 33 to move horizontally on the workbench 1, thereby pushing the metal plate fixed inside the slide 33 forward. When the metal plate is moved to the bottom of the mold 32, the metal plate will contact the two conductive sheets 43. At this time, a complete circuit will be formed between the two conductive sheets 43, the metal plate and the first power supply 47, so current will flow into the metal plate. At this time, the metal plate will The internal resistance generates heat. As the temperature of the metal plate continues to rise, the hardness of the metal plate will decrease. At this time, the press 31 can be started to move the mold 32 downward. During the downward movement of the mold 32, the metal plate will be stamped. During this process, a part of the metal plate will be filled into the mold 32, and because the metal plate has been heated and softened, the metal can be better filled into the mold 32. Compared with the ordinary stamping process, the shape of the metal in the mold 32 at this time can better fit the required shape, especially in subtle features, it is not easy to produce errors.

[0039] During the downward stamping process of the mold 32, it will press against the lifting seat 45 below, and then press the lifting seat 45 downward together. When the lifting seat 45 moves downward, the rubber airbag 46 will be compressed and folded, and the telescopic rod 55 will be squeezed and shortened. At the same time, the two first conductive rods 410 will be separated from the two first conductive blocks 49. At this time, the first power supply 47 no longer generates current, so the metal plate is no longer heated until the lifting seat 45 is lowered to a certain height. At this time, the two second conductive blocks 52 will contact the two second conductive rods 54. At this time, the circuit between the second power supply 53 and the semiconductor refrigerator 51 is connected, and the semiconductor refrigerator 51 is started. The semiconductor refrigerator 51 can quickly cool down and generate low temperature in a very short time, so that the lifting seat 45 and the mold 32 are cooled. Therefore, the metal valve sheet in the mold 32 will also quickly cool down and take shape. , and since the metal valve sheet in the mold 32 cools down quickly, it will automatically complete demoulding from the mold 32. At this time, the press 31 can be started to make the mold 32 rise and reset, and the demoulded valve sheet will remain on the top of the lifting seat 45. During the resetting process of the mold 32, since it no longer squeezes the lifting seat 45, the rubber airbag 46 and the telescopic rod 55 will be reset due to their own elasticity. However, a compression spring is provided in the telescopic rod 55, so the reset speed is faster than the reset speed of the rubber airbag 46. Therefore, the top of the telescopic rod 55 will protrude from the third through hole 56, thereby pushing the valve sheet on the lifting seat 45 open and completing the unloading of the valve sheet. After that, the rubber airbag 46 slowly resets, pushing the lifting seat 45 upward, causing the lifting seat 45 to slowly reset, so that the top of the telescopic rod 55 is again inside the lifting seat 45.

[0040] Afterwards, by controlling the motor 36 and the press 31 , the above process can be repeated continuously to produce valve sheets in batches.

[0041] The technical means disclosed in the technical scheme of the present application is not limited to the technical means disclosed in the above technical means, but also includes the technical scheme composed of the equivalent replacement of the above technical features. The unfinished matters of the present application belong to the common knowledge of the person skilled in the art.

Claims

1. An automatic unloading type thin-film butterfly valve plate stamping device, comprising a workbench (1) and a base (2), wherein the workbench (1) is fixedly connected to the base (2), and is characterized in that: A driving assembly (3) is provided on the base (2), and the driving assembly (3) includes a press (31) and a mold (32). The press (31) is fixedly connected to the workbench (1), and the mold (32) is fixedly connected to the press (31). A heating assembly (4) is provided on the workbench (1), and the heating assembly (4) includes a bracket (41), a conductive sheet (43), a fixed cylinder (44), a lifting seat (45), a rubber airbag (46), a first power supply (47), a fixed rod (48), a first conductive block (49) and a first conductive rod (410). The bracket (41) is fixedly connected to the workbench (1), the two conductive sheets (43) are fixedly connected to the bracket (41), and the fixed cylinder (44) is fixed. Connected to the base (2), the lifting seat (45) is slidably connected to the fixed cylinder (44), the rubber airbag (46) is fixedly connected between the inner wall of the fixed cylinder (44) and the inner wall of the lifting seat (45), the first power supply (47) is fixedly connected to the inside of the lifting seat (45), the fixed rod (48) is fixedly connected to the lifting seat (45), the two first conductive blocks (49) are fixedly connected to the fixed rod (48), the two first conductive blocks (49) are respectively electrically connected to the positive and negative poles of the first power supply (47), the two first conductive rods (410) are fixedly connected to the bracket (41), the two first conductive rods (410) are respectively fixedly connected to the two conductive sheets (43), and a cooling component (5) is provided on the base (2); The driving assembly (3) further comprises a slide (33), a clamping plate (34) and a spring (35); the driving assembly (3) further comprises a motor (36), a rotating rod (37) and a slider (38), wherein the motor (36) is fixedly connected to the workbench (1), the slider (38) is slidably connected to the slide (33), one end of the rotating rod (37) is fixedly connected to the output shaft of the motor (36), and the other end of the rotating rod (37) is rotatably connected to the slider (38).

2. The automatic unloading type thin-film butterfly valve disc stamping equipment according to claim 1 is characterized by: The slide (33) is slidably connected to the workbench (1), the two clamps (34) are slidably connected to the slide (33), and the springs (35) are provided in two groups, and each group of springs (35) is fixedly connected between the corresponding clamps (34) and the slide (33).

3. The automatic unloading type thin-film butterfly valve disc stamping equipment according to claim 1 is characterized by: The heating component (4) further comprises a first through hole (42) and a second through hole (411), wherein the first through hole (42) is provided on the bracket (41), and the second through hole (411) is provided on the workbench (1); the lifting seat (45) is located inside the second through hole (411), and the first through hole (42) is located below the mold (32).

4. The automatic unloading type thin-film butterfly valve disc stamping equipment according to claim 1 is characterized by: The cooling component (5) includes a semiconductor cooler (51) and a second conductive block (52). The semiconductor cooler (51) is arranged inside the lifting seat (45). Two second conductive blocks (52) are fixedly connected to the fixing rod (48). The two second conductive blocks (52) are electrically connected to the positive and negative poles of the semiconductor cooler (51), respectively.

5. The automatic unloading type thin-film butterfly valve disc stamping equipment according to claim 4 is characterized in that: The cooling component (5) further includes a second power supply (53) and a second conductive rod (54), wherein the second power supply (53) is fixedly connected to the base (2), and two second conductive rods (54) are fixedly connected to the second power supply (53), and the two second conductive rods (54) are electrically connected to the positive and negative poles of the second power supply (53), respectively.

6. The automatic unloading type thin-film butterfly valve disc stamping equipment according to claim 5 is characterized by: The cooling assembly (5) further comprises a telescopic rod (55) and a third through hole (56), wherein the telescopic rod (55) is fixedly connected to the inner wall of the fixed cylinder (44), and the third through hole (56) is provided on the lifting seat (45).

7. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 5 is characterized by: The two first conductive blocks (49) and the two second conductive blocks (52) are respectively located at the top and bottom of the fixed rod (48), and the two first conductive rods (410) and the two second conductive rods (54) are respectively located above and below the fixed rod (48).

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