Intelligent control method and device for totally-enclosed vacuum isothermal forging die changing system

Abstract

The invention provides an intelligent control method and device for a fully-closed vacuum isothermal forging die changing system, and relates to the field of high-end intelligent device manufacturing. The method comprises the steps that attribute information of a target die stack is obtained; the attribute information comprises the size of the target model heap and / or the hit rate of the target model heap; the hit rate is the probability that the target mold stack is called in the forging tasks; based on the attribute information of the target model stack, the target model stack is adjusted from a temperature change chamber during original filling to a temperature change chamber of a first temperature change area or a second temperature change area for temperature change; each of the first temperature changing area and the second temperature changing area comprises a plurality of groups of oppositely-opened temperature changing chambers which are oppositely arranged; the distance between the first variable temperature area and the vacuum forging chamber is smaller than that between the second variable temperature area and the vacuum forging chamber; the temperature change comprises heating or cooling. The method is applicable to the temperature change process of the mold stack, and is used for realizing mold change in a vacuum environment and dynamically adjusting a temperature change chamber of the mold stack.

Description

Technical Field

[0001] The present application relates to the field of high-end intelligent device manufacturing, and in particular to an intelligent control method and device for a fully enclosed vacuum isothermal forging die changing system. Background Art

[0002] Isothermal forging refers to an advanced forging method in which the die stack (or mold) is heated to the same or similar temperature as the forging for forging.

[0003] For hot-end parts of aircraft engines such as powder turbine disks, the forging temperature is very high, and conventional mold materials are difficult to meet the requirements. The mold material commonly used at present is molybdenum titanium zirconium alloy (TZM), but this material is easily oxidized in the atmosphere and must be forged in a vacuum environment.

[0004] However, in a fully enclosed vacuum environment, how to replace the mold stack and improve production efficiency has become a major problem. Summary of the invention

[0005] The present application provides an intelligent control method and device for a fully enclosed vacuum isothermal forging die changing system, which can realize die changing in a vacuum environment and dynamically adjust the temperature change chamber of the die stack.

[0006] In the first aspect, the present application provides an intelligent control method for a fully enclosed vacuum isothermal forging die changing system, which is applied to an intelligent control device of a fully enclosed vacuum isothermal forging die changing system, wherein the fully enclosed vacuum isothermal forging die changing system also includes a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber includes a plurality of groups of relatively open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; an intelligent platform vehicle track is laid between each group of relatively open temperature change chambers, running through the group of temperature change chambers; an intelligent robot track is laid in the vacuum transfer chamber perpendicular to the direction of the intelligent platform vehicle track and extending to the vacuum forging chamber; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intelligent platform vehicle track along the intelligent platform vehicle track The intersection with the intelligent robot track; the intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; the method includes: obtaining attribute information of the target mold stack; the attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack; the hit rate is the probability that the target mold stack is called in multiple forging tasks; based on the attribute information of the target mold stack, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; wherein the first temperature change zone and the second temperature change zone both include a plurality of groups of relatively arranged pair of opening temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is smaller than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

[0007] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the present application, the vacuum transfer chamber in the fully enclosed vacuum isothermal forging die changing system may include a plurality of sets of relatively open temperature change chambers. In this way, when one temperature change chamber heats or cools the die stack, other temperature change chambers can provide the die stack after heating or cooling, thereby ensuring the continuous execution of the forging task.

[0008] In addition, the intelligent control device in the present application can obtain the attribute information of the target mold pile, and based on the attribute information of the target mold pile, adjust the target mold pile from the temperature change chamber at the time of original loading to the first temperature change chamber or the second temperature change chamber, and the attribute information can specifically include the size and / or hit rate of the target mold pile. In this way, mold piles with different attribute information can be heated or cooled in different areas, which helps to reduce transportation time, optimize workflow connection, and improve the intelligence level of the fully enclosed isothermal forging mold changing system.

[0009] Optionally, based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change, including: in response to the completion of the loading of all mold stacks of the current batch of forging tasks, based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is the mold stack among all mold stacks of the current batch of forging tasks.

[0010] In this way, the step of executing the temperature change chamber of the target mold stack can be triggered after a batch of mold stacks are loaded.

[0011] Optionally, based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change, including: during the execution of the current batch of forging tasks, in response to the intelligent robot being in an idle state, based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is a mold stack that has not undergone temperature change in the current vacuum transfer chamber.

[0012] In this way, the steps of executing the target mold stack temperature change chamber can be triggered when the intelligent robot is idle during the forging task.

[0013] Optionally, the method further includes: determining that the intelligent robot is in an idle state based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track.

[0014] Optionally, the attribute information includes the size of the target mold stack; based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change, including: based on the size of the target mold stack being greater than a size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change; based on the size of the target mold stack being less than a size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone for temperature change.

[0015] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the present application, the intelligent control device can adjust the target die stack from the temperature change chamber at the time of original filling to the temperature change chamber of the first temperature change zone for temperature change based on the size of the target die stack being greater than the size threshold; and adjust the target die stack from the temperature change chamber at the time of original filling to the temperature change chamber of the second temperature change zone for temperature change based on the size of the target die stack being less than the size threshold. Larger die stacks usually dissipate heat faster, so that the larger die stacks with faster heat dissipation can be adjusted to the first temperature change zone closer to the vacuum forging chamber, and the smaller die stacks with slower heat dissipation can be adjusted to the second temperature change zone farther from the vacuum forging chamber, thereby reasonably allocating the temperature change zones to avoid excessive temperature drop of the larger die stacks in the process of entering the vacuum forging chamber, which affects the isothermal forging effect.

[0016] Optionally, the attribute information includes a hit rate of the target module stack; based on the attribute information of the target module stack, the target module stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change, including: based on the hit rate of the target module stack being greater than a hit rate threshold, the target module stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change; based on the hit rate of the target module stack being less than a hit rate threshold, the target module stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone for temperature change.

[0017] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the present application, the intelligent control device can adjust the target die stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change based on the hit rate of the target die stack being greater than the hit rate threshold; and adjust the target die stack from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change based on the hit rate of the target die stack being less than the hit rate threshold. The hit rate is the probability of the target die stack being called in multiple forging tasks. The higher the hit rate, the higher the probability of the target die stack being called. Adjusting the die stack with a higher probability of being called to the first temperature change zone closer to the vacuum forging chamber helps shorten the transfer distance of these die stacks when they are frequently called, thereby improving the forging efficiency.

[0018] Optionally, the attribute information includes the size and hit rate of the target mold stack; based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change, including: based on the size of the target mold stack being greater than a size threshold, and the hit rate of the target mold stack being greater than a hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change; based on the size of the target mold stack being less than a size threshold, and the hit rate of the target mold stack being less than a hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone for temperature change.

[0019] Optionally, the method further includes: during the process of adjusting the target mold stack to the temperature change chamber of the first temperature change zone or the second temperature change zone, stopping the movement of all intelligent platform vehicles in the temperature change chambers and locking the gates of all temperature change chambers.

[0020] In this way, the intelligent robot can be prevented from colliding with the intelligent platform vehicle or the mold stack when adjusting the temperature change zone of the mold stack.

[0021] In a second aspect, the present application provides an intelligent control device for a fully enclosed vacuum isothermal forging die changing system, the device comprising various functional modules for the method described in the first aspect above.

[0022] In the third aspect, the present application provides an intelligent control device for a fully enclosed vacuum isothermal forging die changing system, which also includes a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber includes a plurality of groups of relatively open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; an intelligent platform vehicle track is laid between each group of relatively open temperature change chambers and runs through the group of temperature change chambers; an intelligent robot track is laid in the vacuum transfer chamber perpendicular to the direction of the intelligent platform vehicle track and extends to the vacuum forging chamber; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; the intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; the intelligent control device includes: a processor and a memory; the memory stores instructions executable by the processor; when the processor is configured to execute the instructions, the intelligent control device implements the method described in the first aspect above.

[0023] In a fourth aspect, the present application provides a readable storage medium, comprising: software instructions; when the software instructions are executed in an intelligent control device, the intelligent control device implements the method described in the first aspect above.

[0024] In a fifth aspect, the present application provides a computer program product, comprising: computer instructions; when the computer instructions are executed in an intelligent control device, the intelligent control device implements the method described in the first aspect above.

[0025] The beneficial effects of the second to fifth aspects mentioned above can be referred to the first aspect and will not be elaborated on again. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the composition of a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application; Figure 2 A schematic flow chart of an intelligent control method for a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application; Figure 3 A schematic diagram of the composition of an intelligent control device for a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application; Figure 4 A schematic diagram of the composition of another intelligent control device for a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] It should be noted that, in the embodiments of the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0030] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish between identical items or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order.

[0031] Isothermal forging refers to an advanced forging method in which the die stack (or mold) is heated to the same or similar temperature as the forging for forging.

[0032] For hot-end parts of aircraft engines such as powder turbine disks, the forging temperature is very high, and conventional mold materials are difficult to meet the requirements. The mold material commonly used at present is molybdenum titanium zirconium alloy (TZM), but this material is easily oxidized in the atmosphere and must be forged in a vacuum environment.

[0033] However, in a fully enclosed vacuum environment, how to replace the mold stack and improve production efficiency has become a major problem.

[0034] Based on this, the embodiment of the present application provides an intelligent control method and device for a fully enclosed vacuum isothermal forging die changing system, which can realize die changing in a vacuum environment and dynamically adjust the temperature change chamber of the die stack.

[0035] The following is an introduction with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic diagram of the composition of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application. Figure 1 As shown, the fully enclosed vacuum isothermal forging die changing system includes: a vacuum transfer chamber 10 and a vacuum forging chamber 12. The vacuum transfer chamber 10 and the vacuum forging chamber 12 can be opened through a vacuum gate ( Figure 1 The black thick solid line between the vacuum transfer chamber 10 and the vacuum forging chamber 12 is used as an example to control the connection or isolation.

[0037] The vacuum transfer chamber 10 may include a plurality of pairs of relatively arranged opening temperature change chambers 1 ( Figure 1 In the figure, one group is taken as an example. In practice, multiple groups of temperature change chambers 1 can be understood as being arranged in the same direction. Figure 1 The left and right sides of a set of temperature change chambers 1 are shown, and the corresponding vacuum transfer chamber 10 can also be compared to Figure 1 The width is widened as shown), the intelligent platform vehicle 3 in each temperature change chamber 1, and the intelligent robot 8.

[0038] An intelligent platform vehicle track 7 is laid between each group of relatively open temperature change chambers 1 and runs through the group of temperature change chambers 1. The intelligent platform vehicle track 7 extends to the outside of the temperature change chamber 1 through the furnace door 2 of the temperature change chamber 1, and the mold stack can be loaded into the temperature change chamber 1 through the furnace door 2.

[0039] An intelligent robot track 11 extending to the vacuum forging chamber 12 is also laid in the vacuum transfer chamber 10 perpendicular to the direction of the intelligent platform vehicle track 7 .

[0040] The intelligent platform vehicle 3 can be used to transfer the mold stack in the temperature change chamber 1 along the intelligent platform vehicle track 7 to the intersection of the intelligent platform vehicle track 7 and the intelligent robot track 11.

[0041] In some embodiments, the smart platform vehicle 3 is further provided with an upper mold stack holder 5 and a lower mold stack holder 4. The smart platform vehicle 3 can fix the mold stack through the upper mold stack holder 5 and the lower mold stack holder 4.

[0042] In some embodiments, an ejection device 9 may be further provided at the intersection of the intelligent platform vehicle track 7 and the intelligent robot track 11. After the intelligent platform vehicle 3 transfers the mold stack to the intersection, the ejection device 9 may eject the mold stack, and then the intelligent platform vehicle 3 may return to the temperature change chamber 1 along the intelligent platform vehicle track 7.

[0043] The intelligent robot 8 can be used to transfer the mold stack between the aforementioned intersection and the vacuum forging chamber 12 along the intelligent robot track 11.

[0044] For example, the intelligent robot 8 can transfer the mold stack that has been heated in the temperature change chamber 1 at the aforementioned intersection along the intelligent robot track 11 to the vacuum forging chamber 12 for forging.

[0045] For another example, the intelligent robot 8 can also transfer the mold stack that has completed forging in the vacuum forging chamber 12 from the vacuum forging chamber 12 to the aforementioned intersection.

[0046] In some embodiments, the vacuum forging chamber 12 may include a workbench 13 , and an ejection mechanism is also provided at the workbench 13 . The intelligent robot 8 may specifically transfer the mold stack to the workbench 13 of the vacuum forging chamber 12 .

[0047] In some embodiments, the fully enclosed vacuum isothermal forging die changing system further includes a vacuum pumping unit ( Figure 1 (not shown in the figure), the vacuum unit may include a Roots pump and a diffusion pump, and is connected to each temperature change chamber 1, the vacuum transfer chamber 10, and the vacuum forging chamber 12 through a vacuum pipeline.

[0048] The vacuum unit may be used to evacuate each of the temperature change chamber 1 , the vacuum transfer chamber 10 , and the vacuum forging chamber 12 .

[0049] In some embodiments, a vacuum gate may also be provided between the temperature change chamber 1 and other spaces of the vacuum transfer chamber 10 .

[0050] In some embodiments, the fully enclosed vacuum isothermal forging die changing system further includes an intelligent control device ( Figure 1 The intelligent control device can be connected with the above Figure 1 The components shown are connected in communication. For example, the intelligent control device can be connected in communication with the intelligent robot 8, and the intelligent control device can control the intelligent robot 8 to dynamically adjust the temperature change chamber of the die stack. The specific process can be referred to the intelligent control method of the fully enclosed vacuum isothermal forging die changing system provided in the following embodiment, which will not be repeated here.

[0051] The execution subject of the intelligent control method of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application is an intelligent control device. The intelligent control device can be a computing device with computing and processing functions such as a computer or a server, or the intelligent control device can also be a control unit of the fully enclosed vacuum isothermal forging die changing system. Taking the aforementioned computing device and control unit collectively referred to as electronic devices as an example, the execution subject of the intelligent control method of the fully enclosed vacuum isothermal forging die changing system can also be a processor (such as a central processing unit (CPU)) in the aforementioned electronic device; or, the execution subject can also be a software system installed in the aforementioned electronic device for executing the intelligent control method; or, the execution subject can also be a functional module in the aforementioned electronic device for executing the intelligent control method, etc. The embodiment of the present application does not limit this.

[0052] For the sake of simplicity, the following is an introduction using the intelligent control method for a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application as an example in which the intelligent control device is used as the executor.

[0053] Figure 2 The figure is a flow chart of the intelligent control method of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application. Figure 2 As shown, the method includes the following steps: S101, obtaining attribute information of a target module stack.

[0054] The attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack. The hit rate is the probability that the target mold stack is called in multiple (unexecuted) forging tasks.

[0055] In some possible embodiments, the intelligent control device may obtain multiple forging tasks of the current batch, and the forging tasks may include (called) mold stacks and the size of the mold stack (in Figure 1Taking the die stack shown as an example, the size here can be understood as the axial length on the vertical axis after the die stack is combined), etc. The intelligent control device can statistically analyze the size and hit rate of each die stack based on multiple forging tasks of the current batch obtained.

[0056] In a possible implementation, the intelligent control device may include an input / output interface, which may include a mouse, a keyboard, or a touch screen, etc. The intelligent control device may receive a forging task inputted by a worker through the input / output interface.

[0057] In another possible implementation, the intelligent control device may also be connected to other devices or platforms for communication, and the intelligent control device may receive forging tasks sent from other devices or platforms.

[0058] S102, based on the property information of the target mold stack, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change.

[0059] The first temperature changing zone and the second temperature changing zone both include a plurality of pairs of relatively arranged open temperature changing chambers. The distance between the first temperature changing zone and the vacuum forging chamber is smaller than the distance between the second temperature changing zone and the vacuum forging chamber. The temperature change includes heating or cooling.

[0060] For example, taking a fully enclosed vacuum isothermal forging die changing system including N groups of relatively open temperature change chambers as an example, the N / 2 groups of temperature change chambers close to the vacuum forging chamber can be understood as the first temperature change zone, and the N / 2 groups of temperature change chambers far away from the vacuum forging chamber can be understood as the second temperature change zone, and N is a positive integer greater than 2.

[0061] It should be noted that the ratio of the temperature change chambers in the first temperature change zone and the second temperature change zone is only an example. In practice, 2 / 3 of the temperature change chambers can be set in the first temperature change zone and 1 / 3 of the temperature change chambers can be set in the second temperature change zone; or 3 / 4 of the temperature change chambers can be set in the first temperature change zone and 1 / 4 of the temperature change chambers can be set in the second temperature change zone. The embodiments of the present application do not limit the specific ratio values.

[0062] As an example, the intelligent control device may adjust the module stacks with larger size and / or higher hit rate in the attribute information to the first temperature change zone preferentially, and adjust the module stacks with smaller size and / or lower hit rate in the attribute information to the second temperature change zone preferentially.

[0063] Exemplarily, the intelligent control device can control the intelligent platform vehicle in the originally loaded temperature change chamber to transfer the target mold stack to the intersection of the intelligent platform vehicle track and the intelligent robot track, and then control the ejection device at the intersection to eject the target mold stack, and then control the intelligent robot to transfer the target mold stack to the intersection of the intelligent platform vehicle track and the intelligent robot track in the first temperature change zone or the second temperature change zone, and the intelligent platform vehicle in the temperature change chamber in the first temperature change zone or the second temperature change zone transfers the target mold stack into the temperature change chamber from the intersection, thereby completing the adjustment of the temperature change chamber.

[0064] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the embodiment of the present application, the vacuum transfer chamber in the fully enclosed vacuum isothermal forging die changing system may include a plurality of sets of relatively open temperature change chambers. In this way, when one temperature change chamber heats or cools the die stack, other temperature change chambers can provide the die stack after heating or cooling, thereby ensuring the continuous execution of the forging task.

[0065] In addition, the intelligent control device in the present application can obtain the attribute information of the target mold pile, and based on the attribute information of the target mold pile, adjust the target mold pile from the temperature change chamber at the time of original loading to the first temperature change chamber or the second temperature change chamber, and the attribute information can specifically include the size and / or hit rate of the target mold pile. In this way, mold piles with different attribute information can be heated or cooled in different areas, which helps to reduce transportation time, optimize workflow connection, and improve the intelligence level of the fully enclosed isothermal forging mold changing system.

[0066] The specific process of the above S102 is introduced below.

[0067] In some possible embodiments, the step of adjusting the temperature change chamber of the target mold stack may be triggered to execute after a batch of mold stacks are loaded. In this case, the above S102 may specifically include the following steps: Step 1a, in response to the completion of loading of all mold stacks for the current batch forging task, based on the property information of the target mold stack, the target mold stack is adjusted from the temperature change chamber during original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change.

[0068] The target mold pile is the mold pile among all mold piles of the current batch forging task.

[0069] For example, the intelligent control device can traverse all mold stacks loaded with the current batch forging task, and perform the above-mentioned adjustment operation of the temperature change chamber on each mold stack.

[0070] In some other possible embodiments, the step of adjusting the temperature change chamber of the target mold stack can be triggered and executed when the intelligent robot is idle during the forging task execution. In this case, the above S102 specifically includes the following steps: Step 1b. During the execution of the current batch of forging tasks, in response to the intelligent robot being in an idle state, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber during original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change.

[0071] The target mold stack is a mold stack in which the temperature in the current vacuum transfer chamber has not changed.

[0072] Optionally, the intelligent control device can also determine whether the intelligent robot is in an idle state according to the condition of the mold stack detected on the track of the intelligent robot and the position of the intelligent robot. In this case, before the above step 1b, the method can also include: Step 1c: Based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track, it is determined that the intelligent robot is in an idle state.

[0073] For example, a detection device may be provided at the intersection of the intelligent platform vehicle track and the intelligent robot track. The detection device may be, for example, a photoelectric sensor or a pressure sensor, etc. The intelligent control device may detect whether there is a mold pile at the intersection based on the detection device.

[0074] For another example, a detection device may also be provided at the starting position of the intelligent robot track, and the intelligent control device may detect whether the intelligent robot is located at the starting position based on the detection device.

[0075] Optionally, the intelligent control device can also determine that the intelligent robot is in a transporting state based on detecting the mold stack at the intersection of the intelligent platform vehicle track and the intelligent robot track between any group of temperature change chambers, and / or the intelligent robot is located outside the starting position of the intelligent robot track.

[0076] In some embodiments, the intelligent control device can adjust the larger mold stack to the first temperature change zone, and the smaller mold stack to the second temperature change zone. In this case, the above S102 can specifically include the following steps: Step 1d: Based on the fact that the size of the target mold stack is greater than the size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change.

[0077] Among them, as mentioned above, in the above Figure 1Taking the shape of the temperature change chamber as an example, the size of the target mold stack can also be understood as the axial length of the target mold stack.

[0078] Optionally, the intelligent control device can obtain the sizes of all mold piles of the current batch forging task (called) and take the average value or median as the size threshold.

[0079] Optionally, the intelligent control device may also receive a size threshold manually input by a worker.

[0080] Step 2d: based on the size of the target mold stack being smaller than the size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

[0081] It should be noted that, when the size of the target mold stack is equal to the size threshold, the intelligent control device can adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone, or the temperature change chamber of the first temperature change zone for temperature change. The embodiment of the present application is not limited to this.

[0082] For example, when the size of the target module stack is equal to the size threshold, the intelligent control device can determine the number of idle temperature change chambers or the utilization rate of the temperature change chambers in the current first temperature change zone and the second temperature change zone, and select a temperature change zone with a larger number of idle temperature change chambers or a lower utilization rate of the temperature change chambers from the first temperature change zone and the second temperature change zone, and adjust the target module stack to the temperature change chamber of the temperature change zone for temperature change.

[0083] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the embodiment of the present application, the intelligent control device can adjust the target die stack from the temperature change chamber at the time of original filling to the temperature change chamber of the first temperature change zone for temperature change based on the size of the target die stack being greater than the size threshold; and adjust the target die stack from the temperature change chamber at the time of original filling to the temperature change chamber of the second temperature change zone for temperature change based on the size of the target die stack being less than the size threshold. Larger die stacks usually dissipate heat faster, so that the larger die stacks with faster heat dissipation can be adjusted to the first temperature change zone closer to the vacuum forging chamber, and the smaller die stacks with slower heat dissipation can be adjusted to the second temperature change zone farther from the vacuum forging chamber, thereby reasonably allocating the temperature change zones to avoid excessive temperature drop of the larger die stacks during the process of entering the vacuum forging chamber, which affects the isothermal forging effect.

[0084] In some other embodiments, the intelligent control device may adjust the mold stack with a higher hit rate to the first temperature change zone, and adjust the mold stack with a lower hit rate to the second temperature change zone. In this case, the above S102 may specifically include the following steps: Step 1e: Based on the hit rate of the target mold stack being greater than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change.

[0085] Optionally, the intelligent control device may obtain the hit rates of all mold stacks of the current batch forging tasks (called), and take the average or median as the hit rate threshold.

[0086] Optionally, the intelligent control device may also receive a hit rate threshold manually input by a staff member.

[0087] Step 2e: based on the hit rate of the target mold stack being less than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

[0088] It should be noted that, when the hit rate of the target mold stack is equal to the hit rate threshold, the intelligent control device can adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone, or the temperature change chamber of the first temperature change zone for temperature change. The embodiment of the present application is not limited to this.

[0089] For example, when the hit rate of the target module stack is equal to the hit rate threshold, the intelligent control device can determine the number of idle temperature change chambers or the utilization rate of the temperature change chambers in the current first temperature change zone and the second temperature change zone, and select a temperature change zone with a larger number of idle temperature change chambers or a lower temperature change chamber utilization rate from the first temperature change zone and the second temperature change zone, and adjust the target module stack to the temperature change chamber of the temperature change zone for temperature change.

[0090] In the intelligent control method of the fully enclosed isothermal forging die changing system provided in the embodiment of the present application, the intelligent control device can adjust the target die stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change based on the hit rate of the target die stack being greater than the hit rate threshold; and adjust the target die stack from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change based on the hit rate of the target die stack being less than the hit rate threshold. The hit rate is the probability of the target die stack being called in multiple forging tasks. The higher the hit rate, the higher the probability of the target die stack being called. Adjusting the die stack with a higher probability of being called to the first temperature change zone closer to the vacuum forging chamber helps shorten the transfer distance when these die stacks are frequently called, thereby improving the forging efficiency.

[0091] In some other embodiments, the intelligent control device can also adjust the temperature change zone by combining the size and the hit rate. In this case, the above S102 can also specifically include the following steps: Step 1f: based on the size of the target mold stack being greater than the size threshold and the hit rate of the target mold stack being greater than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change.

[0092] Step 2f: based on the size of the target mold stack being smaller than the size threshold and the hit rate of the target mold stack being smaller than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

[0093] Steps 1f to 2f may refer to the above-mentioned steps 1d to 2d and steps 1e to 2e, and will not be repeated here.

[0094] In some possible embodiments, a locking device may be provided at the gate of the temperature change chamber. In order to avoid collision when the intelligent robot adjusts the temperature change zone of the mold stack, the intelligent control device may also suspend the transfer action in the temperature change chamber during the process of the intelligent robot adjusting the temperature change zone. In this case, the method may also include the following steps: Step 1g: When adjusting the target mold stack to the temperature change chamber of the first temperature change zone or the second temperature change zone, stop the operation of all intelligent platform vehicles in the temperature change chambers and lock the gates of all temperature change chambers (ie, the above-mentioned vacuum gates).

[0095] The above mainly introduces the solution provided by the embodiment of the present application from the perspective of the method. In order to realize the above functions, the intelligent control device may include hardware structures and / or software modules corresponding to the execution of each function. It should be easy for technical personnel in this field to realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed in this article, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical objectives can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0096] In an exemplary embodiment, the present application also provides an intelligent control device for a fully enclosed vacuum isothermal forging die changing system. Figure 3 This is a schematic diagram of the composition of the intelligent control device of the fully enclosed vacuum isothermal forging die changing system provided in the embodiment of the present application. Figure 3 As shown, the intelligent control device includes: an acquisition module 301 and a processing module 302 .

[0097] The acquisition module 301 is used to obtain the attribute information of the target mold stack; the attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack; the hit rate is the probability of the target mold stack being called in multiple forging tasks.

[0098] The processing module 302 is used to adjust the temperature of the target mold stack from the temperature change chamber when it is originally loaded to the temperature change chamber in the first temperature change zone or the second temperature change zone for temperature change based on the property information of the target mold stack.

[0099] Among them, the first temperature change zone and the second temperature change zone both include multiple groups of relatively open temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is smaller than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

[0100] In some possible embodiments, the processing module 302 is specifically used to respond to the completion of loading of all mold stacks of the current batch of forging tasks, and based on the attribute information of the target mold stack, adjust the target mold stack from the temperature change chamber during the original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is the mold stack among all mold stacks of the current batch of forging tasks.

[0101] In some other possible embodiments, the processing module 302 is specifically used to adjust the target mold stack from the temperature change chamber during original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change based on the attribute information of the target mold stack during the execution of the current batch of forging tasks, in response to the intelligent robot being in an idle state; the target mold stack is a mold stack that has not undergone temperature change in the current vacuum transfer chamber.

[0102] In some other possible embodiments, the processing module 302 is also used to determine that the intelligent robot is in an idle state based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track.

[0103] In some other possible embodiments, the attribute information includes the size of the target mold stack; the processing module 302 is specifically used to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change based on the size of the target mold stack being greater than a size threshold; and to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change based on the size of the target mold stack being less than a size threshold.

[0104] In some other possible embodiments, the attribute information includes a hit rate of the target module stack; the processing module 302 is specifically used to adjust the target module stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change based on the hit rate of the target module stack being greater than a hit rate threshold; based on the hit rate of the target module stack being less than a hit rate threshold, adjusting the target module stack from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

[0105] In some other possible embodiments, the attribute information includes the size and hit rate of the target mold stack; the processing module 302 is specifically used to adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change based on the size of the target mold stack being greater than the size threshold and the hit rate of the target mold stack being greater than the hit rate threshold; based on the size of the target mold stack being less than the size threshold and the hit rate of the target mold stack being less than the hit rate threshold, adjust the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the second temperature change zone for temperature change.

[0106] In some other possible embodiments, the processing module 302 is also used to stop the movement of all intelligent platform vehicles in the temperature change chambers and lock the doors of all temperature change chambers during the process of adjusting the target module stack to the temperature change chamber of the first temperature change zone or the second temperature change zone.

[0107] It should be noted that Figure 3 The division of modules in the example is schematic and is only a logical function division. There may be other division methods in actual implementation. For example, two or more functions may be integrated into one processing module. The above integrated modules may be implemented in the form of hardware or in the form of software functional units.

[0108] In an exemplary embodiment, the present application also provides an intelligent control device for a fully enclosed vacuum isothermal forging die changing system. Figure 4 A schematic diagram of another intelligent control device for a fully enclosed vacuum isothermal forging die changing system provided in an embodiment of the present application. Figure 4 As shown, the intelligent control device includes: a processor 10 , a memory 20 , a communication line 30 , a communication interface 40 and an input / output interface 50 .

[0109] The processor 10 , the memory 20 , the communication interface 40 and the input / output interface 50 may be connected via a communication line 30 .

[0110] The processor 10 is used to execute the instructions stored in the memory 20 to implement the intelligent control method of the fully enclosed vacuum isothermal forging die changing system provided in the above-mentioned embodiment of the present application. The processor 10 can be a CPU, a general-purpose processor network processor (network processor, NP), a digital signal processor (digital signal processing, DSP), a microprocessor, a microcontroller (micro control unit, MCU) / single chip microcomputer (single chip microcomputer) / single chip microcomputer, a programmable logic device (programmable logic device, PLD) or any combination thereof. The processor 10 can also be any other device with processing functions, such as a circuit, a device or a software module, which is not limited in the embodiments of the present application. In one example, the processor 10 may include one or more CPUs, such as Figure 3 As an optional implementation, the intelligent control device may include multiple processors, for example, in addition to the processor 10, it may also include a processor 60 ( Figure 3 ) is shown by the dotted line as an example.

[0111] The memory 20 is used to store instructions. For example, the instructions may be computer programs. Optionally, the memory 20 may be a read-only memory (ROM) or other types of static storage devices that can store static information and / or instructions, or a random access memory (RAM) or other types of dynamic storage devices that can store information and / or instructions, or an electrically erasable programmable read-only memory (EEPROM), a CD-ROM or other optical disk storage, an optical disk storage (including a compressed optical disk, a laser disk, an optical disk, a digital versatile disk, a Blu-ray disk, etc.), a magnetic disk storage medium or other magnetic storage devices, etc., and the embodiments of the present application are not limited to this.

[0112] It should be noted that the memory 20 may exist independently of the processor 10, or may be integrated with the processor 10. The memory 20 may be located inside the intelligent control device, or may be located outside the intelligent control device, which is not limited in the embodiment of the present application.

[0113] The communication line 30 is used to transmit information between the components included in the intelligent control device.

[0114] The communication interface 40 is used to communicate with other devices or other communication networks. The other communication networks may be Ethernet, radio access network (RAN), wireless local area network (WLAN), etc. The communication interface 40 may be a module, a circuit, a transceiver or any device capable of achieving communication.

[0115] The input / output interface 50 is used to implement human-computer interaction between the user and the intelligent control device, for example, to implement action interaction, text interaction, or voice interaction between the user and the intelligent control device.

[0116] For example, the input / output interface 50 may be a physical keyboard or a touch screen, etc. The physical keyboard or the touch screen may be used to implement motion interaction or text interaction between the user and the intelligent control device.

[0117] It should be noted that Figure 4 The structure shown in the figure does not constitute a limitation on the intelligent control device. Figure 4 In addition to the components shown, the intelligent control device may include more or fewer components than shown, or a combination of certain components, or a different arrangement of components.

[0118] In an exemplary embodiment, the embodiment of the present application further provides a computer program product, which includes computer instructions; when the computer instructions are executed in an intelligent control device, the intelligent control device implements the method described in the aforementioned method embodiment.

[0119] In an exemplary embodiment, the embodiment of the present application further provides a readable storage medium, which includes: software instructions. When the software instructions are executed in the intelligent control device, the intelligent control device implements the method described in the aforementioned method embodiment. The computer-readable storage medium may be a non-temporary computer-readable storage medium, for example, the non-temporary computer-readable storage medium may be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0120] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using a software program, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer-executable instructions. When the computer-executable instructions are loaded and executed on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer-executable instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer-executable instructions can be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center.

[0121] Although the present application is described herein in conjunction with various embodiments, in the process of implementing the claimed application, those skilled in the art may understand and implement other changes to the disclosed embodiments by viewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "one" or "an" does not exclude multiple situations. A single processor or other unit may implement several functions listed in a claim. Certain measures are recorded in different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0122] Although the present application has been described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Accordingly, this specification and the drawings are merely exemplary illustrations of the present application as defined by the appended claims, and are deemed to have covered any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, those skilled in the art may make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0123] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An intelligent control method for a fully enclosed vacuum isothermal forging die changing system, characterized in that: The method is applied to an intelligent control device of a fully enclosed vacuum isothermal forging die changing system, wherein the fully enclosed vacuum isothermal forging die changing system further comprises a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber comprises a plurality of relatively arranged pairs of open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; between each group of relatively arranged pairs of open temperature change chambers, an intelligent platform vehicle track running through the group of temperature change chambers is laid; in the vacuum transfer chamber, an intelligent robot track extending to the vacuum forging chamber is laid perpendicular to the direction of the intelligent platform vehicle track; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; The intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; The method comprises: Acquire attribute information of a target mold stack; the attribute information includes the size of the target mold stack and / or the hit rate of the target mold stack; the hit rate is the probability of the target mold stack being called in multiple forging tasks; Based on the property information of the target mold stack, adjusting the target mold stack from the temperature change chamber when originally loaded to the temperature change chamber of the first temperature change zone or the second temperature change zone to change the temperature; Among them, the first temperature change zone and the second temperature change zone both include multiple groups of relatively open temperature change chambers; the distance between the first temperature change zone and the vacuum forging chamber is smaller than the distance between the second temperature change zone and the vacuum forging chamber; the temperature change includes heating or cooling.

2. The method according to claim 1, characterized in that The step of adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone to change the temperature based on the property information of the target mold stack comprises: In response to the completion of loading of all mold stacks of the current batch of forging tasks, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber during the original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is the mold stack among all mold stacks of the current batch of forging tasks.

3. The method according to claim 1, characterized in that The step of adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone to change the temperature based on the property information of the target mold stack comprises: During the execution of the current batch of forging tasks, in response to the intelligent robot being in an idle state, based on the attribute information of the target mold stack, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone or the second temperature change zone for temperature change; the target mold stack is a mold stack that has not undergone temperature change in the current vacuum transfer chamber.

4. The method according to claim 3, characterized in that The method further comprises: Based on the fact that no mold stack is detected at the intersection of the intelligent platform vehicle track and the intelligent robot track between each group of temperature change chambers, and the intelligent robot is located at the starting position of the intelligent robot track, it is determined that the intelligent robot is in an idle state.

5. The method according to claim 1, characterized in that The attribute information includes the size of the target mold stack; and based on the attribute information of the target mold stack, adjusting the target mold stack from the temperature change chamber when originally loaded to the temperature change chamber in the first temperature change zone or the second temperature change zone to perform temperature change, comprising: Based on the size of the target mold stack being greater than a size threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber of the first temperature change zone for temperature change; Based on the size of the target mold stack being smaller than the size threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

6. The method according to claim 1, characterized in that The attribute information includes a hit rate of the target mold stack; and based on the attribute information of the target mold stack, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone or the second temperature change zone to perform temperature change, comprising: Based on the hit rate of the target mold stack being greater than a hit rate threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change; Based on the hit rate of the target mold stack being less than a hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

7. The method according to claim 1, characterized in that The attribute information includes the size and hit rate of the target mold stack; and based on the attribute information of the target mold stack, adjusting the target mold stack from the temperature change chamber when originally loaded to the temperature change chamber in the first temperature change zone or the second temperature change zone to perform temperature change, comprising: Based on the fact that the size of the target mold stack is greater than a size threshold and the hit rate of the target mold stack is greater than a hit rate threshold, adjusting the target mold stack from the temperature change chamber at the time of original loading to the temperature change chamber in the first temperature change zone for temperature change; Based on the size of the target mold stack being smaller than the size threshold and the hit rate of the target mold stack being smaller than the hit rate threshold, the target mold stack is adjusted from the temperature change chamber at the time of original loading to the temperature change chamber in the second temperature change zone for temperature change.

8. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: In the process of adjusting the target mold stack to the temperature change chamber of the first temperature change zone or the second temperature change zone, the actions of all intelligent platform vehicles in the temperature change chambers are stopped, and the gates of all temperature change chambers are locked.

9. An intelligent control device for a fully enclosed vacuum isothermal forging die changing system, characterized in that: The fully enclosed vacuum isothermal forging die changing system also includes a vacuum transfer chamber and a vacuum forging chamber; the vacuum transfer chamber includes a plurality of relatively open temperature change chambers, an intelligent platform vehicle in each temperature change chamber, and an intelligent robot; between each relatively open temperature change chamber, an intelligent platform vehicle track running through the temperature change chambers is laid; in the vacuum transfer chamber, an intelligent robot track extending to the vacuum forging chamber is laid perpendicular to the direction of the intelligent platform vehicle track; the intelligent platform vehicle is used to transfer the mold stack in the temperature change chamber to the intersection of the intelligent platform vehicle track and the intelligent robot track along the intelligent platform vehicle track; The intelligent robot is used to transfer the mold stack between the intersection and the vacuum forging chamber along the intelligent robot track; The intelligent control device comprises: a processor and a memory; The memory stores instructions executable by the processor; When the processor is configured to execute the instructions, the intelligent control device implements the method according to any one of claims 1 to 8.

10. A computer program product, characterized in that include: Computer instructions; When the computer instructions are executed in the intelligent control device, the intelligent control device implements the method according to any one of claims 1 to 8.

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