Method and device for determining height of laser processing head and related product

Abstract

The invention discloses a method and device for determining the height of a laser machining head and a related product. The method comprises the following steps: acquiring a plurality of processing images of a laser processing head of a laser after processing a to-be-processed material based on a plurality of groups of position information; one processing image corresponds to one group of position information; determining the processing image with the thinnest line width of the cutting line from the plurality of processing images as a first target image; and determining a first target height of the to-be-processed material processed by the laser processing head according to the height in the group of position information corresponding to the first target image based on the corresponding relationship between the processing image and the position information. According to the technical scheme, the height of the laser processing head is adjusted for multiple times based on the focal depth of the laser, the appropriate processing height is determined by comparing the images after cutting, and compared with a mode of manually determining the height of the laser processing head, the method is more efficient, intelligent and automatic, semiconductor manufacturing and material processing efficiency improvement and yield improvement are facilitated, and the product quality is improved. And excessive dependence on manpower is reduced.

Description

Technical Field

[0001] The present application relates to the field of material processing technology, and in particular to a method and device for determining the height of a laser processing head and related products. Background Art

[0002] In semiconductor manufacturing and material processing scenarios, lasers are often required as processing tools. The height of the laser processing head in the laser determines the process effect of laser processing. If the laser processing head is too high or too low relative to the material being processed, it may cause the laser to defocus. Taking laser surface cutting as an example, the height of the laser processing head is not suitable, resulting in laser defocus, and then the cutting line formed by the laser processing on the surface of the material is very wide. In severe cases, the body of the processed material may even be damaged due to the thermal effect of the laser. Therefore, selecting a suitable height for the laser processing head is of great significance to improving the yield of laser processing. At present, this aspect mainly relies on multiple manual tests and comparing the processing effects with the naked eye. It is urgent to propose a more efficient, intelligent and automated solution to determine the height of the laser processing head. Summary of the invention

[0003] Based on the above problems, the present application provides a method, device and related products for determining the height of a laser processing head, with the aim of determining the height of the laser processing head more efficiently, intelligently and automatically, and reducing excessive reliance on manual labor.

[0004] The embodiments of the present application disclose the following technical solutions:

[0005] The first aspect of the present application provides a method for determining the height of a laser processing head, the method comprising:

[0006] Acquire multiple processed images of the material to be processed by the laser processing head of the laser based on multiple sets of position information; wherein one processed image corresponds to one set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser;

[0007] Determine a processing image with the thinnest cutting line width from the multiple processing images as the first target image; wherein the cutting line is a processing mark of the laser processing head on the material to be processed;

[0008] Based on the correspondence between the processed image and the position information, a first target height of the material to be processed by the laser processing head is determined according to the height in a set of position information corresponding to the first target image.

[0009] In an optional implementation, a set of the position information is a set of position offset parameters, the position offset parameters include a height offset, the height offset is used to indicate the relative height between the laser processing head and an imaging reference height; the imaging reference height is determined based on the imaging clarity of the material to be processed by the image acquisition device;

[0010] Determining a first target height of the material to be processed by the laser processing head according to a height in a set of position information corresponding to the first target image includes:

[0011] The sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height for the laser processing head to process the material to be processed.

[0012] In an optional implementation, the height offset in multiple sets of position offset parameters is a×△H; in the multiple sets of position offset parameters, a takes values ​​between 0, 1, 2, 3…N; or, the height offset in multiple sets of position offset parameters is ±b×△H; in the multiple sets of position offset parameters, b takes values ​​between 0, 1, 2, 3…N; wherein △H represents the depth of focus and N is a positive integer.

[0013] In an optional implementation, after determining the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed, the method further includes:

[0014] Acquire a plurality of new processed images after the laser processing head processes the material to be processed based on a plurality of new sets of position offset parameters; the height of the laser processing head is different in each set of new position offset parameters, and the different heights are set based on 0.5 times the focal depth;

[0015] Determine a processed image with the thinnest cutting line width from the multiple new processed images as the second target image;

[0016] Based on the correspondence between the new processing image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height is determined as the second target height for the laser processing head to process the material to be processed.

[0017] In an optional implementation, the new position offset parameters include a height offset for indicating the relative height between the laser processing head and the first target height; the height offset in multiple sets of new position offset parameters is ±c×△h; in the multiple sets of new position offset parameters, c takes values ​​between 0, 1, 2, 3…S; △h=0.5×△H, S is a positive integer.

[0018] In an optional implementation, determining the imaging reference height based on the imaging clarity of the material to be processed by an image acquisition device includes:

[0019] Moving a processing stage on which a preset material template is placed to the right below the image acquisition device;

[0020] adjusting the height of the image acquisition device multiple times;

[0021] According to the imaging clarity of the preset template material by the image acquisition device at different heights, determining the height at which the image acquisition device can image the preset material template most clearly;

[0022] Removing the preset material template from the processing platform, and placing the material to be processed on the processing platform;

[0023] Based on the height at which the image acquisition device images the preset material template most clearly, the image acquisition device is controlled to shift up and down, and according to the imaging clarity of the material to be processed by the image acquisition device at different heights, the height at which the image acquisition device images the material to be processed most clearly is determined as the imaging reference height.

[0024] In an optional implementation, the method further includes:

[0025] Obtaining thickness information of the material to be processed and thickness information of the new product material;

[0026] Determining whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device;

[0027] If the absolute value is greater than the depth of field, an alarm is issued;

[0028] If the absolute value is less than or equal to the depth of field, a third target height for processing the new product material by the laser processing head is determined based on the difference and a first target height for processing the material to be processed by the laser processing head.

[0029] In an optional implementation, each set of position offset parameters includes a relative offset in an X direction and a relative offset in a Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two directions perpendicular to each other and perpendicular to the height direction;

[0030] The laser processing head of the laser processes the material to be processed based on multiple sets of position information, including:

[0031] Controlling the laser processing head to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches a corresponding height;

[0032] Controlling the processing stage carrying the material to be processed to move according to the X-direction movement starting offset and the Y-direction offset, so that the material to be processed reaches the corresponding processing starting position, and controlling the laser to emit light;

[0033] Controlling the processing stage to move in the X direction according to the X direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and turning off the laser;

[0034] The X-direction movement start offset and the X-direction movement end offset are both set based on the X-direction relative offset, and the Y-direction offset is set based on the Y-direction relative offset.

[0035] In an optional implementation, among the multiple sets of position offset parameters, the starting offset of X-direction movement is the same, and the ending offset of X-direction movement is the same; and the Y-direction offsets in a set of position offset parameters corresponding to two adjacent laser processing operations differ by a preset interval.

[0036] A second aspect of the present application provides a device for determining the height of a laser processing head, the device comprising:

[0037] An image acquisition module, used for acquiring a plurality of processed images of the material to be processed after the laser processing head of the laser processes the material to be processed based on a plurality of sets of position information; wherein one processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser;

[0038] An image detection module, used to determine a processed image with the thinnest cutting line width from the multiple processed images as a first target image; wherein the cutting line is a processing mark of the laser processing head on the material to be processed;

[0039] The height determination module is used to determine the first target height of the material to be processed by the laser processing head based on the correspondence between the processed image and the position information and according to the height in a set of position information corresponding to the first target image.

[0040] The third aspect of the present application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method for determining the height of the laser processing head as introduced in the first aspect is implemented.

[0041] A fourth aspect of the present application provides an electronic device for determining the height of a laser processing head, the electronic device comprising: a processor and a memory;

[0042] The memory stores a computer program;

[0043] The processor is used to read the computer program stored therein and run the computer program, and when the program is run, the method for determining the height of the laser processing head as introduced in the first aspect is executed.

[0044] In a fifth aspect, the present application provides a laser processing system, which includes the electronic device for determining the height of the laser processing head provided in the fourth aspect, and also includes a laser, a distance sensor, an image acquisition device, a first Z-axis motion component and a second Z-axis motion component; the laser includes a laser processing head, and the laser processing head, the distance sensor, the image acquisition device, the first Z-axis motion component and the second Z-axis motion component are all connected to a processor in the electronic device; the laser processing head is mounted on the first Z-axis motion component, and the image acquisition device is mounted on the second Z-axis motion component;

[0045] The processor is further used to send a first motion control instruction to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction to change the height of the laser processing head;

[0046] The processor is further used to send a second motion control instruction to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction to change the height of the image acquisition device;

[0047] The distance measuring sensor is used to detect the thickness of the material carried on the processing platform.

[0048] Compared with the prior art, this application has the following beneficial effects:

[0049] In the technical solution of the present application, a plurality of processed images of the material to be processed after the laser processing head of the laser is processed based on a plurality of sets of position information; wherein, one processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser; from the plurality of processed images, a processed image with the thinnest line width of the cutting line is determined as the first target image; wherein, the cutting line is the processing trace of the laser processing head on the material to be processed; based on the correspondence between the processed image and the position information, according to the height in a set of position information corresponding to the first target image, the first target height of the laser processing head for processing the material to be processed is determined. Since the height of the laser processing head is set based on the focal depth, each laser processing is to explore the appropriate height of the laser processing head with the focal depth as the granularity. When the laser power remains unchanged, the thinner the line width of the cutting line formed by the laser processing, the better the laser focusing effect; conversely, the wider the line width of the cutting line, the more significant the phenomenon of laser defocusing, and the less it meets the processing expectations. The technical solution of the present application adjusts the height of the laser processing head multiple times based on the focal depth of the laser, and determines the appropriate processing height by comparing the images after cutting. Compared with the manual method of determining the height of the laser processing head, this is more efficient, intelligent, and automated, which is beneficial to improving the efficiency and yield of semiconductor manufacturing and material processing, and reducing excessive reliance on manual labor. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0051] Figure 1 A flow chart of a method for determining the height of a laser processing head provided in an embodiment of the present application;

[0052] Figure 2 A flow chart of another method for determining the height of a laser processing head provided in an embodiment of the present application;

[0053] Figure 3 A flowchart for determining an imaging reference height provided in an embodiment of the present application;

[0054] Figure 4 A schematic diagram of a cutting calibration interface provided in an embodiment of the present application;

[0055] Figure 5 A schematic diagram of the structure of a device for determining the height of a laser processing head provided in an embodiment of the present application. DETAILED DESCRIPTION

[0056] In semiconductor manufacturing and material processing scenarios, if the height of the laser processing head is not suitable and the laser is out of focus, it is possible to damage the processed material, or the laser processing effect is not ideal. Currently, the selection of the height of the laser processing head mainly relies on manual testing, which is inefficient. After research, the inventor proposed a technical solution to obtain multiple processing images formed after processing the material at different heights of the laser processing head, and then analyze the images and compare the cutting line width to determine the appropriate height. This solution can effectively solve the current problem and determine the height of the laser processing head in a more efficient, intelligent and automated way, reducing excessive reliance on manual labor.

[0057] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0058] See also Figure 1 , which is a flow chart of a method for determining the height of a laser processing head provided in an embodiment of the present application. Figure 1 As shown, the method includes:

[0059] S101, obtaining a plurality of processed images of a material to be processed after being processed by a laser processing head of a laser based on a plurality of sets of position information.

[0060] Among them, one processing image corresponds to a set of position information. Each set of position information includes the height of the laser processing head and the position of the material to be processed. The height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser. As an example, in the position information used for two adjacent laser processes, the height difference is a focal depth.

[0061] For ease of understanding, an exemplary explanation is given below. Assume that there are 5 sets of position information, in which the heights of the laser processing heads are h1, h2, h3, h4 and h5 respectively. The laser processing head processes the same material to be processed based on the heights h1, h2, h3, h4 and h5 in these 5 sets of position information. After each processing, the cutting line formed by the processing is photographed by the image acquisition device to obtain the collected processing images, which are the first image, the second image, the third image, the fourth image and the fifth image respectively. The cutting line is the processing trace of the laser processing head on the material to be processed. In this step, these 5 processing images are obtained and the subsequent image analysis process is carried out.

[0062] In practical applications, taking the laser surface cutting process as an example, the material to be processed can be a wafer. In one embodiment, the multiple laser processing mentioned above can be completed on different cutting lanes of the same wafer, that is, there will be no situation where the laser processing head repeats multiple laser processing at multiple different heights in the same interval of the same cutting lane. In practical applications, for example, the processing stage can be moved along the X direction during laser processing to form a cutting line parallel to the X direction. After one laser processing and before the next laser processing, the processing stage can be controlled to move a certain distance along the Y direction (for example, move a grain step), and then adjust the height of the laser processing head and turn on the laser for laser processing. Thus, the cutting lines formed by the laser processing head at different heights are parallel to each other.

[0063] S102: Determine, from among the multiple processed images, a processed image with the thinnest cutting line width as a first target image.

[0064] In a possible implementation, in order to avoid difficulty in distinguishing and identifying cutting lines formed by different laser processing head heights in the processing image, the position of the processing stage can be adjusted before shooting so that the cutting line formed by the latest processing is in the center of the field of view of the image acquisition device.

[0065] The thickness of the cutting line reflects the utilization rate of the laser heating energy efficiency and whether the focusing of the laser processing head is ideal during laser processing. Compared with the thicker cutting line, the thinner the line width, the higher the utilization rate of the laser heating energy efficiency, the more ideal the focusing of the laser processing head, and the higher the yield rate. To this end, after obtaining multiple processing images through S101, the width of the cutting line in each processing image can be identified and analyzed by image processing and analysis techniques. Thereby, a processing image with the thinnest line width of the cutting line is determined, and the image is used as the first target image. In practical applications, if it is not the first laser processing, the processing image may contain cutting lines formed by historical processing within the field of view of the image acquisition device. To this end, in order to accurately identify the line width of the current cutting line, the cutting line formed by the current processing can be placed in an easily identifiable position or area in advance by position calibration and alignment.

[0066] S103, based on the correspondence between the processed image and the position information, and according to the height in a set of position information corresponding to the first target image, determining a first target height of the laser processing head for processing the material to be processed.

[0067] As mentioned above, multiple sets of position information are provided in the present application, and the height of the laser processing head contained in each set of position information is different, and each processing image corresponds to a set of position information. In other words, if a processing image is locked, a laser processing head height can be uniquely locked. Based on this, on the basis of the first target image determined in S102, a unique corresponding height can be determined. Since this height makes the cutting line formed by the processing reach the thinnest, the height corresponding to the first target image is determined as the first target height of the laser head processing the material to be processed. It can be considered that in the multiple laser processing that has been realized, the use of a laser processing head of this height can achieve the best focusing effect.

[0068] In the technical solution of the present application, a plurality of processed images of the material to be processed after the laser processing head of the laser is processed based on a plurality of sets of position information; wherein, one processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser; from the plurality of processed images, a processed image with the thinnest line width of the cutting line is determined as the first target image; wherein, the cutting line is the processing trace of the laser processing head on the material to be processed; based on the correspondence between the processed image and the position information, according to the height in a set of position information corresponding to the first target image, the first target height of the laser processing head for processing the material to be processed is determined. Since the height of the laser processing head is set based on the focal depth, each laser processing is to explore the appropriate height of the laser processing head with the focal depth as the granularity. When the laser power remains unchanged, the thinner the line width of the cutting line formed by the laser processing, the better the laser focusing effect; conversely, the wider the line width of the cutting line, the more significant the phenomenon of laser defocusing, and the less it meets the processing expectations. The technical solution of the present application adjusts the height of the laser processing head multiple times based on the focal depth of the laser, and determines the appropriate processing height by comparing the images after cutting. Compared with the manual method of determining the height of the laser processing head, this is more efficient, intelligent, and automated, which is beneficial to improving the efficiency and yield of semiconductor manufacturing and material processing, and reducing excessive reliance on manual labor.

[0069] In practical applications, in order to more accurately determine a more suitable height, the height of the laser processing head can be further fine-tuned based on the first target height, thereby obtaining a better laser processing effect. This is explained below with examples. Figure 2 A flow chart of another method for determining the height of a laser processing head provided in an embodiment of the present application. Figure 2 As shown, the method includes:

[0070] S201, obtaining a plurality of processed images of a material to be processed after being processed by a laser processing head of a laser based on a plurality of sets of position information.

[0071] Here, a specific form of position information is introduced: a set of position information is a set of position offsets, and the position offsets include a height offset. The height offset is used to indicate the relative height of the laser processing head and the imaging reference height. As mentioned earlier, the height of the laser processing head contained in each set of position information is different. Here, it can be understood that the height offset contained in each set of position information is different, and the imaging reference height is unified.

[0072] For ease of understanding, the imaging reference height is described below. In the embodiment of the present application, the imaging reference height is determined based on the imaging clarity of the material to be processed by the image acquisition device. Figure 3 A flowchart for determining an imaging reference height is provided in an embodiment of the present application, such as Figure 3 , an example way of determining an imaging reference height includes:

[0073] S301, moving the processing stage with the preset material template placed thereon to the position directly below the image acquisition device.

[0074] Here, the preset material template may be a material that is the same or similar to the material to be processed, and has a thickness that is the same or close to the thickness of the material to be processed. For example, here, close thickness may mean that the difference in thickness does not exceed 200 μm.

[0075] For example, if the material to be processed is a wafer, the preset material template can be a wafer template with the same thickness as the wafer to be processed. In order to determine an imaging reference height, the preset material template is moved to the bottom of the image acquisition device through the processing stage to prepare for subsequent imaging acquisition.

[0076] S302, adjusting the height of the image acquisition device multiple times.

[0077] After the preset material template is directly under the image acquisition device, the height of the image acquisition device is adjusted several times. The purpose of this action is to compare the clarity of images acquired at different heights, so as to determine the imaging reference height that can achieve clear imaging.

[0078] S303, determining the height at which the image acquisition device can image the preset material template most clearly according to the imaging clarity of the preset template material at different heights by the image acquisition device.

[0079] After imaging the preset template material, the clarity of the resulting image can be evaluated by the subjective evaluation index of the detail visibility index. In addition, the clarity of the image can also be evaluated by objective evaluation indicators such as grayscale variance, edge gradient, information entropy, spectral entropy, and structural similarity. The indicators used for the evaluation of imaging clarity are not limited here. In short, the height at which the preset material template is shot to make the image clearest can be determined by comparison. Next, it is necessary to further determine the height at which the image of the material to be processed is clearest, and for this purpose, S304 to S305 are executed.

[0080] S304, removing the preset material template from the processing platform, and placing the material to be processed on the processing platform.

[0081] Since a preset material template is originally placed on the processing platform, in order to accurately determine the clearest imaging height for the material to be processed, it is necessary to remove the preset material template from the processing platform and then place the material to be processed on the processing platform.

[0082] S305. Based on the height at which the image acquisition device images the preset material template most clearly, control the image acquisition device to shift up and down, and determine the height at which the image acquisition device images the material to be processed most clearly as the imaging reference height according to the imaging clarity of the image acquisition device at different heights of the material to be processed.

[0083] Since the thickness of the preset material template is the same as or close to the thickness of the material to be processed, a height at which the image of the material to be processed is clearest can be determined near the height at which the image of the preset material template is clearest, which has been determined in S303. In specific implementation, when the material to be processed on the processing stage is directly below the image acquisition device, the image acquisition device is controlled to shift up and down near the height at which the image of the preset material template is clearest, and the material to be processed is imaged multiple times at different heights and the image clarity is analyzed, and finally the height at which the image acquisition device images the material to be processed most clearly can be determined, and it is used as the imaging reference height.

[0084] In a possible implementation, the height offset in the multiple sets of position offset parameters is a×△H; in the multiple sets of position offset parameters, a takes values ​​in 0, 1, 2, 3…N. For example, the height offset in the first set of position offset parameters is 0, the height offset in the second set of position offset parameters is △H, the height offset in the third set of position offset parameters is 2×△H, the height offset in the fourth set of position offset parameters is 3×△H, …, and so on.

[0085] In another possible implementation, the height offset in the multiple sets of position offset parameters is ±b×△H; in the multiple sets of position offset parameters, b takes values ​​in 0, 1, 2, 3…N. For example, the height offset in the first set of position offset parameters is -2×△H, the height offset in the second set of position offset parameters is -△H, the height offset in the third set of position offset parameters is 0, the height offset in the fourth set of position offset parameters is △H, the height offset in the fifth set of position offset parameters is 2×△H, …, and so on.

[0086] Wherein, △H represents the focal depth, and N is a positive integer. The focal depth is determined by the laser wavelength of the laser and the properties of the focusing lens, and is an inherent property of the laser. The calculation method of the focal depth is well known in the art and will not be described in detail here.

[0087] Each set of position offset parameters includes the relative offset in the X direction and the relative offset in the Y direction relative to the image acquisition device; the height direction corresponding to the height offset is the Z direction. The relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two directions perpendicular to each other and perpendicular to the height direction. It can be understood that the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0088] The laser processing head of the laser processes the material to be processed based on multiple sets of position information. It can be to control the laser processing head to adjust the height according to the height offset in the position information so that the height of the laser processing head reaches the corresponding height; control the processing stage carrying the material to be processed to move according to the X-direction starting offset and the Y-direction offset so that the material to be processed reaches the corresponding processing starting position, and control the laser to emit light; control the processing stage to move in the X direction according to the X-direction ending offset so that the material to be processed reaches the corresponding processing ending position, and turn off the laser. In this way, a laser processing flow of the material to be processed based on a set of position information is completed.

[0089] The X-direction starting offset and the X-direction ending offset are both set based on the relative offset in the X direction, and the Y-direction offset is set based on the relative offset in the Y direction. For example, if the relative offset in the Y direction is set to 10 μm, before each processing, the processing stage needs to move the material to be processed 10 μm along the Y direction compared to the previous processing.

[0090] For example, in multiple sets of position offset parameters, the starting offset of the X-direction movement is the same, and the ending offset of the X-direction movement is the same. The Y-direction offsets in a set of position offset parameters corresponding to two adjacent laser processes differ by a preset interval (for example, a difference of 10 μm, i.e., 0.01 mm). Thus, the cutting lines formed by multiple laser processes are aligned with each other at both ends in the X-direction, and the spacing in the Y-direction is the same.

[0091] S202: Determine, from among the multiple processed images, a processed image with the thinnest cutting line width as a first target image.

[0092] After each line width detection of the image, the line width of the cutting line formed by the processing can be recorded. For example, the first line width is detected as W1, the second line width is detected as W2, the third line width is detected as W3, ..., and so on. Finally, the thinnest line width is determined, and then the first target image is determined.

[0093] S203, based on the correspondence between the processed image and the position information, and according to the height in a set of position information corresponding to the first target image, determining a first target height for the laser processing head to process the material to be processed.

[0094] Since the height offset is relative to the imaging reference height, in order to determine the height offset in the position offset parameter as △H, the imaging reference height needs to be combined. When S203 is implemented, the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height of the laser processing head for processing the material to be processed.

[0095] The above steps S201 to S203 can be understood as completing the first round of laser processing and height determination work of the laser processing head. In the embodiment of the present application, based on the first round of laser processing and height determination work, the second round of laser processing and height determination work is further performed through the following steps. It should be noted that the second round of laser processing and height determination work is performed based on the first target height determined by the first round of laser processing and height determination work.

[0096] S204, obtaining a plurality of new processed images after the laser processing head processes the material to be processed based on a plurality of sets of new position offset parameters.

[0097] In the second round of laser processing and height determination, similarly, it is also necessary to finally determine the appropriate height by changing the height of the laser processing head. For the sake of distinction, the position offset parameters used here are referred to as multiple sets of new position offset parameters. The height of the laser processing head is different in each set of new position offset parameters, and the different heights are set based on 0.5 times the depth of focus. By reducing the height difference to a finer granularity, that is, 0.5 times the depth of focus, it is convenient to determine the height (i.e., the second target height hereinafter referred to) with a further improved accuracy compared to the first target height through the second round of laser processing and height determination.

[0098] In one example, the new position offset parameter includes a height offset for indicating the relative height of the laser processing head and the first target height. The height offset in multiple sets of new position offset parameters is ±c×△h; in multiple sets of new position offset parameters, c takes values ​​in 0, 1, 2, 3…S; △h=0.5×△H, S is a positive integer. For example, a total of 11 sets of new position offset parameters are configured, in which the height offsets are: -5×△h, -4×△h, -3×△h, -2×△h, -△h, 0, △h, 2×△h, 3×△h, 4×△h, 5×△h.

[0099] S205 , determining a processed image with the thinnest cutting line width from the multiple new processed images as the second target image.

[0100] The specific implementation of this step can refer to step S102 in the previous embodiment, and will not be described in detail here.

[0101] S206. Based on the correspondence between the new processed image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height is determined as the second target height for the laser processing head to process the material to be processed.

[0102] Since there is a corresponding relationship between the line width, the new processing image and the new position offset parameter (including the height offset), based on this corresponding relationship, the height offset corresponding to the second target image can be locked, and the height offset means determining a more accurate and suitable laser processing head height compared to the first target height. In addition, since the height offset in the new position offset parameter is relative to the first target height, in order to determine the height at which the laser processing head should be located, the height offset and the first target height are summed to obtain the second target height for the laser processing head to process the material to be processed.

[0103] In the embodiment of the present application, by performing two rounds of laser processing and height determination work in succession, the accuracy of the determined laser processing head height is improved in an intelligent, automated and efficient manner, thereby further improving the yield of semiconductor manufacturing and material processing.

[0104] In the above embodiments, the height at which the laser processing head should be located during laser processing of the product to be processed is determined. It is understandable that the items on the processing platform will change according to the actual processing requirements. For example, when the material to be processed is processed, new product materials need to be placed on the processing platform and laser processed by the laser processing head. In order to effectively use the previously determined height of the laser processing head, this application also proposes that Figure 1 In the embodiment of the process shown, it may further include:

[0105] Obtain thickness information of the material to be processed and thickness information of the new product material; determine whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; if the absolute value is greater than the depth of field, issue an alarm; if the absolute value is less than or equal to the depth of field, determine the third target height for the laser processing head to process the new product material based on the difference and the first target height for the laser processing head to process the material to be processed.

[0106] Similarly, in order to effectively use the previously determined laser processing head height, the present application also proposes that Figure 2 In the embodiment of the process shown, it may further include:

[0107] Obtain thickness information of the material to be processed and thickness information of the new product material; determine whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; if the absolute value is greater than the depth of field, issue an alarm; if the absolute value is less than or equal to the depth of field, determine the fourth target height for the laser processing head to process the new product material based on the difference and the second target height for the laser processing head to process the material to be processed.

[0108] In the above introduction, by obtaining the thickness information of the material to be processed and the new product material, the difference in thickness between the two can be compared. The absolute value of the difference is compared with the depth of field of the image acquisition device in relative size in order to determine whether the height of the laser processing head for the material to be processed determined by implementing the method steps described above is suitable as a reference value for determining the height of the laser processing head for the new product material. If the absolute value of the thickness difference is greater than the depth of field of the image acquisition device, it is considered that the height of the laser processing head for the material to be processed is not suitable as a reference value, and an alarm prompt is required. After receiving the alarm prompt, the method in the embodiment can be used again to use a preset material template that matches the thickness of the material to determine the imaging reference height, and finally determine the appropriate height of the laser processing head. If the absolute value of the thickness difference is less than or equal to the depth of field of the image acquisition device, it is considered that the height of the laser processing head for the material to be processed is suitable as a reference value. Furthermore, based on the height as a reference value and the thickness difference between the two materials, a suitable height of the laser processing head can be determined for the new processing material, that is, the third target height (corresponding to Figure 1 The implementation method of performing a round of laser processing and height determination shown in FIG. 1) or the fourth target height (corresponding to Figure 2 Implementation method for performing two rounds of laser processing and height determination as shown).

[0109] By determining the height of the laser processing head for new product materials in the above manner, the process of determining the height of the laser processing head for product materials of various thicknesses is simplified, the complexity is reduced, and the efficiency and yield of laser processing are improved.

[0110] To facilitate understanding of the implementation process of two rounds of laser processing and height determination in the technical solution of the present application, the process during this period is described in detail below through an example.

[0111] In the example, after the laser processing head and the image acquisition device are installed, they can be moved up and down along the Z axis (also called the Z direction or height direction). Place the preset material template on the processing stage, control the processing stage to drive the preset material template to move, and when the preset material template moves to the bottom of the image acquisition device, adjust the height of the image acquisition device multiple times to image the preset material template multiple times at different heights (which can be understood as imaging distances). By analyzing the clarity of each image, a height that can image the preset material template most clearly is finally determined. Record the height.

[0112] Then, based on this height, the image acquisition device is moved up and / or down along the Z axis for multiple times. At this time, the object on the processing stage has been replaced by the material to be processed from the preset material template. After moving the image acquisition device multiple times, the material to be processed is imaged multiple times at different heights until the height at which the image of the material to be processed is the clearest is found. This height is called the imaging reference height. The subsequent search for the most suitable height of the laser processing head for the material to be processed is searched and finally determined based on the imaging reference height.

[0113] Next, the focal depth of the laser is determined based on the inherent parameters of the laser, and the relative position between the light-emitting point of the laser processing head and the image acquisition device is obtained. The calibration method for the relative position between the light-emitting position of the laser processing point and the image acquisition device can be: first, the bare chip material used for calibration is moved under the laser processing head, and the laser processing head is made to emit laser to form a laser cutting point on the bare chip material. The position information of the point is read, and the horizontal and vertical coordinates are used as the light-emitting point of the laser processing head. Afterwards, the processing stage is controlled to move so that the cutting point moves to the center of the field of view of the image acquisition device, and the position information of the point in the field of view is read. Through the above operation, two sets of position information are read, and the horizontal and vertical coordinates are respectively subtracted to obtain the relative position between the light-emitting point of the laser processing head and the image acquisition device. The above calibration process is expressed by the formula example as follows: △x=X-X1,△y=Y-Y1. Among them, X and Y are the coordinates of the light-emitting point of the laser processing head in the X direction and Y direction respectively; X1 and Y1 are the coordinates of the image acquisition device in the X direction and Y direction respectively. (△x, △y) represents the relative position between the light-emitting point of the laser processing head and the image acquisition device.

[0114] For the preset material template, multiple positions of the laser processing head height are determined along the Z direction, recorded as position 0, position 1, position 2...position 10, where the laser processing point corresponding to position 0 is the position where the camera imaging is clearest, and the height of position 0 is the imaging reference height. For example, the imaging reference height is 17.5mm, and the Z-axis value of position 0 is 17.5mm. Other positions are upper and lower offsets relative to position 0. The initial position of the material to be processed is (100, 200) in the X-axis and Y-axis coordinates, in mm. The meaning of Y offset is the offset relative to 200mm (initial position) along the Y direction in the horizontal plane; Z offset is the offset relative to 17.5mm above and below; Z offset 0 means that the laser processing head cuts the material to be processed at a height of 17.5mm.

[0115] The offset of the Z axis is set to an integer multiple of △H, such as 0*△H, 1*△H, 2*△H..., and so on. The offset of the Y axis is set to a fixed value of 0.01mm, that is, a deviation of 10um, which is accumulated to 10um, 20um, 30um..., and so on. The cutting length is set to 5mm (in the X direction).

[0116] When cutting the first line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 200+△y+0.01mm, and the Z axis moves to the position of 17.5mm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The first line cutting is completed.

[0117] When cutting the second line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 200+△y+0.02mm, and the Z axis moves to the position of 17.5+1*△Hmm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The second line cutting is completed.

[0118] When cutting the third line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 200+△y+0.03mm, and the Z axis moves to the position of 17.5+2*△Hmm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The cutting of the third line is completed.

[0119] By analogy, after all the lines are cut, move each line to the center of the field of view of the image acquisition device and detect the width of each line. When detecting the first line, the X axis moves to the position of 100, the Y axis moves to 200+0.01mm, and the Z axis moves to the position of 17.5. The width of the first line is: W1. When detecting the second line, the X axis moves to the position of 100, the Y axis moves to 200+0.02mm, and the Z axis moves to the position of 17.5. The width of the second line is: W2. By analogy, detect all the line widths W1, W2, W3, W4, ...; find the Z axis position corresponding to the thinnest line width, and count the position as the first target height.

[0120] Based on the first target height obtained initially, a more accurate second target height is obtained through the following operations. Set the offset of the Z axis to △h = △H / 2. Set the center position of X to 100, the starting position of the Y axis to 210 (you can also set other Y values ​​to form a Y direction interval with the previous round of cutting), and the starting position of the Z axis is the first target height (expressed as Z2).

[0121] First, the offset of the Z axis is set to an integer multiple of △h, such as -5*△h, -4*△h, -3*△h...4*△h, 5*△h, etc. The offset of the Y axis is set to a fixed value of 0.01mm, that is, a deviation of 10um, which is accumulated to 10um, 20um, 30um... and so on. The cutting length is set to 5mm.

[0122] When cutting the first line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 210+△y+0.01mm, and the Z axis moves to the position of Z2-5*△hmm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The first line cutting is completed.

[0123] When cutting the second line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 210+△y+0.02mm, and the Z axis moves to the position of Z2-4*△hmm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The second line cutting is completed.

[0124] When cutting the third line, the X axis moves to the position of 100+△x-2.5, the Y axis moves to 210+△y+0.03mm, and the Z axis moves to the position of Z2-3*△hmm. Then, the laser is turned on, the X axis moves to the position of 100+△x+2.5, and the laser is turned off. The cutting of the third line is completed.

[0125] By analogy, after all the lines are cut, move each line to the center of the field of view of the image acquisition device and detect the width of each line. When detecting the first line, the X axis moves to the position of 100, the Y axis moves to 210+0.01mm, and the Z axis moves to the position of 17.5. The width of the first line is: W11; when detecting the second line, the X axis moves to the position of 100, the Y axis moves to 210+0.02mm, and the Z axis moves to the position of 17.5. The width of the second line is: W21; and so on, detect all the line widths W11, W21, W13, W41, ...; find the Z axis position corresponding to the line with the thinnest line width, and count it: Z3. Z3 is the second target height of the laser processing head for processing the material to be processed.

[0126] Figure 4 A schematic diagram of a cutting calibration interface provided in an embodiment of the present application. Figure 4 , 7 groups of position information are displayed. Different Z offsets in different groups of position information indicate different heights of the corresponding laser processing heads. When you need to obtain the specific coordinates of the light-emitting point, click Get; when you need to obtain the center position of the field of view of the image acquisition device, click Get. The cutting frequency and cutting power can be set separately.

[0127] The present application also provides a device for determining the height of a laser processing head. Figure 5 The structure of the device is shown, and the device includes:

[0128] An image acquisition module 501 is used to acquire multiple processed images of the material to be processed by the laser processing head of the laser based on multiple sets of position information; wherein one processed image corresponds to one set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser;

[0129] An image detection module 502 is used to determine a processed image with the thinnest cutting line width from the multiple processed images as a first target image; wherein the cutting line is a processing mark of the laser processing head on the material to be processed;

[0130] The height determination module 503 is used to determine a first target height of the material to be processed by the laser processing head based on the correspondence between the processing image and the position information and according to the height in a set of position information corresponding to the first target image.

[0131] Optionally, a set of the position information is a set of position offset parameters, the position offset parameters include a height offset, the height offset is used to indicate the relative height between the laser processing head and an imaging reference height; the imaging reference height is determined based on the imaging clarity of the material to be processed by the image acquisition device;

[0132] The height determination module 503 is specifically used to determine the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed.

[0133] Optionally, the height offset in multiple sets of position offset parameters is a×△H; in the multiple sets of position offset parameters, a takes values ​​between 0, 1, 2, 3…N; or, the height offset in multiple sets of position offset parameters is ±b×△H; in the multiple sets of position offset parameters, b takes values ​​between 0, 1, 2, 3…N; wherein △H represents the depth of focus and N is a positive integer.

[0134] The image acquisition module 501 is also used to acquire a plurality of new processed images after the laser processing head processes the material to be processed based on a plurality of new position offset parameters; the height of the laser processing head is different in each new position offset parameter, and the different heights are set based on 0.5 times the focal depth;

[0135] The image detection module 502 is further used to determine a processed image with the thinnest cutting line width from the multiple new processed images as the second target image;

[0136] The height determination module 503 is also used to determine the second target height of the laser processing head for processing the material to be processed by taking the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height based on the correspondence between the new processing image and the new position offset parameters.

[0137] Optionally, the new position offset parameters include a height offset for indicating the relative height between the laser processing head and the first target height; the height offset in multiple sets of new position offset parameters is ±c×△h; in the multiple sets of new position offset parameters, c takes values ​​among 0, 1, 2, 3…S; △h=0.5×△H, S is a positive integer.

[0138] Optionally, the device further comprises an imaging reference height determination module, configured to determine the imaging reference height by:

[0139] Move a processing stage on which a preset material template is placed to the right below the image acquisition device; adjust the height of the image acquisition device multiple times; determine the height at which the image acquisition device can image the preset material template most clearly according to the imaging clarity of the preset template material at different heights by the image acquisition device; remove the preset material template from the processing stage, and place the material to be processed on the processing stage; based on the height at which the image acquisition device can image the preset material template most clearly, control the image acquisition device to deflect up and down, and determine the height at which the image acquisition device can image the material to be processed most clearly according to the imaging clarity of the image acquisition device at different heights as the imaging reference height.

[0140] Optionally, the device further comprises:

[0141] A thickness acquisition module, used to acquire the thickness information of the material to be processed and the thickness information of the new product material;

[0142] A judging module, used for judging whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device;

[0143] An alarm prompt module, used for issuing an alarm prompt if the absolute value is greater than the depth of field;

[0144] The height determination module 503 is further used to determine a third target height for processing the new product material by the laser processing head based on the difference and the first target height for processing the material to be processed by the laser processing head if the absolute value is less than or equal to the depth of field.

[0145] Optionally, each group of position offset parameters includes a relative offset in an X direction and a relative offset in a Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two directions perpendicular to each other and perpendicular to the height direction;

[0146] Optionally, the above device further comprises: a processing control module, configured to:

[0147] Controlling the laser processing head to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches a corresponding height;

[0148] Controlling the processing stage carrying the material to be processed to move according to the X-direction movement starting offset and the Y-direction offset, so that the material to be processed reaches the corresponding processing starting position, and controlling the laser to emit light;

[0149] Controlling the processing stage to move in the X direction according to the X direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and turning off the laser;

[0150] The X-direction movement start offset and the X-direction movement end offset are both set based on the X-direction relative offset, and the Y-direction offset is set based on the Y-direction relative offset.

[0151] Optionally, in the multiple sets of position offset parameters, the starting offset of X-direction movement is the same, and the ending offset of X-direction movement is the same; and the Y-direction offsets in a set of position offset parameters corresponding to each of two adjacent laser processes differ by a preset interval.

[0152] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method for determining the height of a laser processing head as described in the method embodiment is implemented.

[0153] The embodiment of the present application also provides an electronic device for determining the height of a laser processing head, the electronic device comprising: a processor and a memory;

[0154] The memory stores a computer program;

[0155] The processor is used to read the computer program stored therein and run the computer program. When the program is run, the method for determining the height of the laser processing head as described in the method embodiment is executed.

[0156] The embodiment of the present application also provides a laser processing system, which includes the above-mentioned electronic device for determining the height of a laser processing head, and also includes a laser, a distance sensor, an image acquisition device, a first Z-axis motion component and a second Z-axis motion component; the laser includes a laser processing head, and the laser processing head, the distance sensor, the image acquisition device, the first Z-axis motion component and the second Z-axis motion component are all connected to a processor in the electronic device; the laser processing head is mounted on the first Z-axis motion component, and the image acquisition device is mounted on the second Z-axis motion component;

[0157] The processor is further used to send a first motion control instruction to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction to change the height of the laser processing head;

[0158] The processor is further used to send a second motion control instruction to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction to change the height of the image acquisition device;

[0159] The distance measuring sensor is used to detect the thickness of the material carried on the processing platform.

[0160] It should be noted that each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device, equipment and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. The device, equipment and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components indicated as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0161] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for determining the height of a laser processing head, characterized in that: include: Acquire multiple processed images of the material to be processed by the laser processing head of the laser based on multiple sets of position information; wherein one processed image corresponds to one set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser; Determine a processing image with the thinnest cutting line width from the multiple processing images as the first target image; wherein the cutting line is a processing mark of the laser processing head on the material to be processed; Based on the correspondence between the processed image and the position information, a first target height of the material to be processed by the laser processing head is determined according to the height in a set of position information corresponding to the first target image.

2. The method according to claim 1, characterized in that A set of the position information is a set of position offset parameters, wherein the position offset parameters include a height offset, and the height offset is used to indicate a relative height between the laser processing head and an imaging reference height; the imaging reference height is determined based on the imaging clarity of the material to be processed by the image acquisition device; Determining a first target height of the material to be processed by the laser processing head according to a height in a set of position information corresponding to the first target image includes: The sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height for the laser processing head to process the material to be processed.

3. The method according to claim 2, characterized in that The height offset in the multiple sets of position offset parameters is a×△H; in the multiple sets of position offset parameters, a takes values ​​from 0, 1, 2, 3…N; or, the height offset in the multiple sets of position offset parameters is ±b×△H; in the multiple sets of position offset parameters, b takes values ​​from 0, 1, 2, 3…N; wherein △H represents the depth of focus, and N is a positive integer.

4. The method according to claim 2, characterized in that: After determining the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed, the method further includes: Acquire a plurality of new processed images after the laser processing head processes the material to be processed based on a plurality of new sets of position offset parameters; the height of the laser processing head is different in each set of new position offset parameters, and the different heights are set based on 0.5 times the focal depth; Determine a processed image with the thinnest cutting line width from the multiple new processed images as the second target image; Based on the correspondence between the new processing image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height is determined as the second target height for the laser processing head to process the material to be processed.

5. The method according to claim 4, characterized in that The new position offset parameters include a height offset used to indicate the relative height between the laser processing head and the first target height; the height offset in multiple sets of new position offset parameters is ±c×△h; in the multiple sets of new position offset parameters, c takes values ​​from 0, 1, 2, 3...S; △h=0.5×△H, S is a positive integer.

6. The method according to any one of claims 2 to 5, characterized in that: Determining the imaging reference height based on the imaging clarity of the material to be processed by the image acquisition device includes: Moving a processing stage on which a preset material template is placed to the right below the image acquisition device; adjusting the height of the image acquisition device multiple times; According to the imaging clarity of the preset template material by the image acquisition device at different heights, determining the height at which the image acquisition device can image the preset material template most clearly; Removing the preset material template from the processing platform, and placing the material to be processed on the processing platform; Based on the height at which the image acquisition device images the preset material template most clearly, the image acquisition device is controlled to shift up and down, and according to the imaging clarity of the material to be processed by the image acquisition device at different heights, the height at which the image acquisition device images the material to be processed most clearly is determined as the imaging reference height.

7. The method according to claim 6, characterized in that The method further comprises: Obtaining thickness information of the material to be processed and thickness information of the new product material; Determining whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; If the absolute value is greater than the depth of field, an alarm is issued; If the absolute value is less than or equal to the depth of field, a third target height for processing the new product material by the laser processing head is determined based on the difference and a first target height for processing the material to be processed by the laser processing head.

8. The method according to claim 2, characterized in that: Each set of position offset parameters includes a relative offset in the X direction and a relative offset in the Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two directions perpendicular to each other and perpendicular to the height direction; The laser processing head of the laser processes the material to be processed based on multiple sets of position information, including: Controlling the laser processing head to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches a corresponding height; Controlling the processing stage carrying the material to be processed to move according to the X-direction movement starting offset and the Y-direction offset, so that the material to be processed reaches the corresponding processing starting position, and controlling the laser to emit light; Controlling the processing stage to move in the X direction according to the X direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and turning off the laser; The X-direction movement start offset and the X-direction movement end offset are both set based on the X-direction relative offset, and the Y-direction offset is set based on the Y-direction relative offset.

9. The method according to claim 8, characterized in that In the plurality of sets of position offset parameters, the starting offset of X-direction movement is the same, and the ending offset of X-direction movement is the same; and the Y-direction offsets in a set of position offset parameters corresponding to two adjacent laser processes differ by a preset interval.

10. A device for determining the height of a laser processing head, characterized in that: include: An image acquisition module, used for acquiring a plurality of processed images of the material to be processed after the laser processing head of the laser processes the material to be processed based on a plurality of sets of position information; wherein one processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are set based on the focal depth of the laser; An image detection module, used to determine a processed image with the thinnest cutting line width from the multiple processed images as a first target image; wherein the cutting line is a processing mark of the laser processing head on the material to be processed; The height determination module is used to determine the first target height of the material to be processed by the laser processing head based on the correspondence between the processed image and the position information and according to the height in a set of position information corresponding to the first target image.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for determining the height of a laser processing head according to any one of claims 1 to 9 is implemented.

12. An electronic device for determining the height of a laser processing head, characterized in that: The electronic device comprises: a processor and a memory; The memory stores a computer program; The processor is used to read the computer program stored therein and run the computer program, and when the program is run, the method for determining the height of the laser processing head according to any one of claims 1 to 9 is executed.

13. A laser processing system, characterized in that: An electronic device for determining the height of a laser processing head according to claim 12, further comprising a laser, a distance sensor, an image acquisition device, a first Z-axis motion assembly and a second Z-axis motion assembly; the laser comprises a laser processing head, and the laser processing head, the distance sensor, the image acquisition device, the first Z-axis motion assembly and the second Z-axis motion assembly are all connected to a processor in the electronic device; The laser processing head is mounted on the first Z-axis motion assembly, and the image acquisition device is mounted on the second Z-axis motion assembly; The processor is further used to send a first motion control instruction to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction to change the height of the laser processing head; The processor is further used to send a second motion control instruction to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction to change the height of the image acquisition device; The distance measuring sensor is used to detect the thickness of the material carried on the processing platform.

Images