An etching forming method and system based on a laser scanning strategy

Abstract

The present invention discloses an etching forming method and system based on a laser scanning strategy, which relates to the technical field of computer platform load balancing. It includes hierarchically dividing a three-dimensional etching model imported into a coordinate system to generate a two-dimensional planar etching pattern for regional division; dynamically adjusting the laser energy input for each etching area; performing additive manufacturing to supplement materials in real time, and controlling the etching depth and surface quality. The etching forming method based on the laser scanning strategy provided by the present invention dynamically adjusts the laser energy input for each etching area, is applicable to deep etching and microfabrication of complex structures, and realizes more precise depth control and surface quality optimization. By combining curvature and local laser energy requirements for path optimization, the minimization of the laser etching path and the maximization of energy efficiency are achieved. In the field of microstructures and complex surface processing, the overall performance of laser etching can be significantly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser etching, and specifically provides an etching forming method and system based on a laser scanning strategy. Background Art

[0002] With the continuous development of laser technology, laser etching and additive manufacturing technologies have gradually been widely used in the field of precision machining. As a high-precision and high-efficiency surface processing method, laser etching plays an important role in multiple fields such as microelectronics, aerospace, and medical devices. By focusing a laser beam on the material surface for energy transfer, laser etching can accurately remove materials to form the required microstructures and complex geometric shapes. In addition, significant progress has been made in additive manufacturing technologies (such as laser spraying or local material deposition), which can thicken or repair the material surface in real time to optimize defects or depth problems during the processing. In recent years, the combination of laser etching and additive manufacturing technologies has become a new trend, aiming to overcome the limitations of traditional laser processing methods to achieve more efficient and precise surface treatment.

[0003] However, existing laser etching methods still have certain technical bottlenecks in precision control, energy distribution, and material deposition. Traditional laser etching technologies usually rely on simple two-dimensional planar etching patterns, ignoring the differences in curved surface geometries and local energy requirements, which leads to uneven etching effects on complex surfaces or non-uniform materials. Especially in regions with large curvatures, over-etching is likely to occur. On the other hand, the input of laser energy lacks a flexible dynamic adjustment mechanism, resulting in a fixed mode of laser power and scanning path that cannot adapt to the needs of different regions. In addition, in existing technologies, additive manufacturing is usually used as a post-processing method, only for repairing or supplementing materials, and it is unable to dynamically adjust the deposition amount of additive manufacturing in real time during the etching process, resulting in low precision in controlling etching depth and surface quality. Therefore, it is difficult for existing technologies to effectively solve the problems of uneven energy distribution in different regions, insufficient etching depth, or uneven surface, and there is an urgent need for a new technical solution to comprehensively optimize the laser etching process and the real-time feedback control of additive manufacturing, thereby improving etching precision, material utilization rate, and surface quality. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed.

[0005] Therefore, the technical problems solved by the present invention are: existing laser etching methods have problems of uneven energy distribution, inaccurate etching depth, and difficult surface quality control, and how to optimize the etching effect by dynamically adjusting the laser energy input and supplementing materials in real time with additive manufacturing.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: an etching forming method based on a laser scanning strategy, comprising: importing a three-dimensional etching model into a coordinate system for hierarchical division, generating a two-dimensional plane etching pattern for regional division. Dynamically adjusting the laser energy input of each etching area. Performing additive manufacturing to replenish materials in real time, and controlling etching depth and surface quality.

[0007] As a preferred solution of the etching forming method based on laser scanning strategy described in the present invention, wherein: the hierarchical division by importing the three-dimensional etching model into the coordinate system includes importing the three-dimensional etching model to be processed into the coordinate system, and the coordinate system includes a working coordinate system and a Cartesian coordinate system.

[0008] The working coordinate system is consistent with the machine tool coordinate system of the laser etching equipment.

[0009] The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

[0010] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, the generation of two-dimensional plane etching graphics for area division includes dividing the surface of the three-dimensional model in the working coordinate system, and each divided layer will become the basic layer for laser etching path planning.

[0011] Calculate the normal direction of each surface point, divide the 3D model into several layers based on the normal direction, and for a given surface point, the curvature radius It is expressed as:

[0012] in, is the curvature of the point. The curvature is calculated by the second-order derivative of the surface. If the surface is parameterized as ,but:

[0013]

[0014] in, They are The first and second order partial derivatives of .

[0015] Calculate the area of ​​each two-dimensional plane etching pattern and distribute the laser energy to the area. The area is obtained by numerical integration and is expressed as:

[0016]

[0017] in, is the domain of the planar etching pattern, is the height of the shape, and are the boundary coordinates of the shape.

[0018] By extracting the contours on each layer, a two-dimensional etching pattern is generated, and the planar etching pattern is used for the planning of the laser etching path.

[0019] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, wherein: the generation of the two-dimensional planar etching pattern for region division further includes, according to the requirements of laser energy distribution and path optimization, the goal of path optimization is to minimize the total path length, and a target function is constructed by combining the radius of curvature and the local laser energy requirement, expressed as:

[0020]

[0021] Wherein, is the optimized path length, is the coordinate of the th point, is the radius of curvature of the th point, is the curvature influence coefficient.

[0022] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, wherein: the dynamic adjustment of the laser energy input for each etching region includes determining the laser energy input, expressed as:

[0023]

[0024] Wherein, is the power of the laser beam, is the spacing between the scanning paths, is the scanning speed.

[0025] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, wherein: the dynamic adjustment of the laser energy input for each etching region further includes obtaining the curvature and surface roughness of the path region, and determining the adjustment coefficient of the path region, expressed as:

[0026]

[0027] Wherein, is the radius of curvature of the path region, is the surface roughness of the path region, is the average roughness of the entire processing region, and are the curvature adjustment coefficient and the roughness adjustment coefficient respectively.

[0028] As a preferred embodiment of the etching forming method based on a laser scanning strategy according to the present invention, wherein: during the laser etching process, material thickening is performed by laser spraying or local material deposition, and materials are replenished in real time through additive manufacturing to control the etching depth and surface quality.

[0029] Another object of the present invention is to provide an etching forming system based on a laser scanning strategy, which can perform hierarchical division by importing a three-dimensional etching model into a specific coordinate system, and combine dynamic laser energy adjustment and real-time material replenishment through additive manufacturing to solve the problem that the current traditional laser etching system cannot accurately control the energy input of complex geometric surfaces, resulting in inconsistent etching depths and poor surface quality.

[0030] As a preferred embodiment of the etching forming system based on a laser scanning strategy according to the present invention, wherein: it includes a model division module, an energy input module, and an etching processing module. The model division module is used to perform hierarchical division by importing a three-dimensional etching model into a coordinate system to generate a two-dimensional planar etching pattern for regional division. The energy input module is used to dynamically adjust the laser energy input for each etching area. The etching processing module is used to replenish materials in real time through additive manufacturing to control the etching depth and surface quality.

[0031] A computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the etching forming method based on a laser scanning strategy are implemented.

[0032] A computer-readable storage medium stores a computer program thereon, and when the computer program is executed by a processor, the steps of the etching forming method based on a laser scanning strategy are implemented.

[0033] Advantages of the present invention: The etching forming method based on a laser scanning strategy provided by the present invention dynamically adjusts the laser energy input for each etching area, is suitable for deep etching and microfabrication of complex structures, and realizes more precise depth control and surface quality optimization. By combining curvature and local laser energy requirements for path optimization, the minimization of the laser etching path and the maximization of energy efficiency are achieved, and in the field of microstructures and complex surface processing, the overall performance of laser etching can be significantly improved. The present invention achieves better effects in terms of applicability, refinement, and overall performance. Description of the Drawings

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0035] Figure 1 This is the overall flowchart of an etching forming method based on a laser scanning strategy provided for the first embodiment of the present invention. Specific embodiments

[0036] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the specific embodiments of the present invention in detail with reference to the drawings of the specification. Obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0037] Embodiment 1, referring to Figure 1 , which is an embodiment of the present invention, provides an etching forming method based on a laser scanning strategy, including:

[0038] S1: Generate a two-dimensional planar etching pattern for region division by importing a three-dimensional etching model into a coordinate system for hierarchical division.

[0039] Furthermore, importing the three-dimensional etching model into the coordinate system for hierarchical division includes importing the three-dimensional etching model to be processed into the coordinate system, and the coordinate system includes a working coordinate system and a Cartesian coordinate system.

[0040] The working coordinate system is consistent with the machine coordinate system of the laser etching equipment and is defined according to the working principle and spatial limitations of the equipment to ensure that the equipment can accurately perform the etching operation. To accurately convert and process data, the three-dimensional model is first imported into this coordinate system. The purpose of doing this is to ensure that all subsequent operations are based on a unified coordinate reference and errors will not be caused by coordinate system differences.

[0041] The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

[0042] It should be noted that generating a two-dimensional planar etching pattern for region division includes, in the working coordinate system, dividing the surface of the three-dimensional model. Each divided layer will become the basic layer for laser etching path planning.

[0043] Calculate the normal direction of each surface point, divide the three-dimensional model into several layers based on the normal direction. For a given surface point, the radius of curvature Expressed as:

[0044] Wherein, is the curvature of the point, and the curvature is calculated through the second derivative of the surface. If the surface is parameterized as , then:

[0045]

[0046] Wherein, are respectively the first and second partial derivatives.

[0047] Calculate the area of each two-dimensional planar etching pattern, and perform regional distribution of laser energy. The area is obtained through numerical integration and is expressed as:

[0048]

[0049] Wherein, is the domain of definition of the planar etching pattern, is the height of the pattern, and are the boundary coordinates of the pattern.

[0050] Generate two-dimensional etching patterns by extracting contours on each layer. The planar etching patterns are used for the planning of laser etching paths.

[0051] It should also be noted that generating two-dimensional planar etching patterns for regional division further includes, according to the requirements of laser energy distribution and path optimization, the goal of path optimization is to minimize the total path length, and a target function is constructed by combining the radius of curvature and local laser energy requirements, which is expressed as:

[0052] Wherein, is the optimized path length, is the coordinate of the th point, is the radius of curvature of the th point, is the curvature influence coefficient.

[0053] S2: Dynamically adjust the laser energy input for each etching region.

[0054] Furthermore, dynamically adjusting the laser energy input for each etching region includes determining the laser energy input, which is expressed as:

[0055]

[0056] Wherein, is the power of the laser beam, is the spacing between scanning paths, is the scanning speed.

[0057] It should be noted that dynamically adjusting the laser energy input for each etching area also includes obtaining the curvature and surface roughness of the path area, and determining the adjustment coefficient of the path area, expressed as:

[0058]

[0059] Among them, is the radius of curvature of the path area. The larger the curvature, the smaller it is, which means that the laser energy input will decrease. is the surface roughness of the path area, is the average roughness of the entire processing area, and are the curvature adjustment coefficient and the roughness adjustment coefficient respectively.

[0060] According to Adjusting the laser parameters specifically includes:

[0061] By adjusting and , the present invention can achieve precise control of the laser energy input. Each parameter is directly related to the input amount of laser energy and the processing effect.

[0062] Laser power is the direct source of the energy output of the laser beam. When dividing the area, according to the curvature and the surface roughness adjust the power to adapt to the etching requirements of each area.

[0063] Larger curvature ( smaller): In the area with a larger curvature (such as the edge or corner of the model), because it is necessary to avoid over-etching, the power will be reduced. At this time, the laser power is inversely proportional to the adjustment coefficient to ensure that the energy distribution will not be too high.

[0064] Larger surface roughness ( larger): In the rough area, the laser energy needs to be increased to compensate for the surface non-uniformity. Therefore, when increases, the laser power will increase accordingly.

[0065] According to these principles, the following relationship is used to adjust the laser power:

[0066] Among them, is the initial laser power, is the laser power adjusted according to the regional characteristics.

[0067] Scanning speed is the speed at which the laser beam moves over the surface of the material. A higher scanning speed means that the laser covers a larger area per unit time, thus reducing the energy input. A lower scanning speed increases the energy input.

[0068] Larger ( smaller) curvature: Areas with larger curvature require lower laser energy, so the corresponding scanning speed will decrease. By slowing down the scanning speed, the present invention can concentrate the laser beam on areas with larger curvature, thus avoiding over-etching.

[0069] Larger surface roughness ( larger): Rougher areas of the surface require more energy to ensure uniform etching, so the scanning speed will increase. By increasing the scanning speed, the laser energy is more evenly distributed over the rough areas.

[0070] Based on these principles, the scanning speed can be adjusted according to the following relationship:

[0071]

[0072] where, is the initial scanning speed, is the scanning speed adjusted according to the regional characteristics.

[0073] Scanning pitch is the distance between each point of the laser beam on the scanning path. A smaller pitch means a higher energy density of the laser, and a larger pitch will disperse the laser energy.

[0074] Larger ( smaller) curvature: In areas with larger curvature, less laser energy is required, so the scanning pitch will increase to reduce the concentration of laser energy and prevent over-etching.

[0075] Larger surface roughness ( larger): In rougher areas of the surface, the laser requires higher energy, so the scanning pitch will decrease to ensure a higher energy density and overcome surface non-uniformity.

[0076] Based on these principles, the present invention uses the following relationship to adjust the scanning pitch:

[0077]

[0078] where, is the initial scanning pitch. is the scanning pitch adjusted according to the regional characteristics.

[0079] Combined with the above adjustment rules, the present invention can dynamically adjust three key parameters of the laser according to the curvature and surface roughness of each region: power , scanning speed and scanning spacing , so as to achieve the optimal distribution of energy. The specific steps are as follows:

[0080] For each region, first calculate according to the curvature and surface roughness to obtain .

[0081] For regions with large curvature (such as edge or sharp corner regions), reduce the power , decrease the scanning speed , and increase the scanning spacing .

[0082] For rough surface regions, increase the power , increase the scanning speed , and decrease the scanning spacing .

[0083] According to the adjusted parameters, perform the laser etching operation, and monitor the surface temperature and etching depth through real-time feedback to further optimize the energy input and ensure that the etching effect of each region meets the expectations.

[0084] S3: Perform real-time additive manufacturing to supplement materials and control the etching depth and surface quality.

[0085] Furthermore, performing real-time additive manufacturing to supplement materials and control the etching depth and surface quality includes, during the laser etching process, thickening the material by laser spraying or local material deposition and supplementing materials in real time through additive manufacturing.

[0086] It should be noted that when additional contour requirements appear during etching, during the etching process, additional contours are added to the outer contour of the original etching pattern, and these additional contours will help optimize the energy distribution in the deep etching region.

[0087] According to the addition of the additional contour, re-divide the region and adjust the input of laser energy.

[0088] According to the influence of the additional contour, the regional energy filling is changed to:

[0089]

[0090] Among them, is the energy filling amount of the additional contour region, is the laser power of the additional contour, is the adjustment coefficient of energy filling, It is the change in the area of the additional contour region.

[0091] Example 2, an embodiment of the present invention, provides an etching forming method based on a laser scanning strategy. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments.

[0092] First, the test object is a group of metal alloy parts with a certain curvature and surface roughness on the surface, representing a typical industrial processing scenario. In order to verify the effectiveness of the present invention, we used the three-dimensional etching path planning and energy distribution method described in the present invention, and evaluated the advantages of this method in terms of accuracy, efficiency, and surface quality control by comparing with the prior art.

[0093] First, import the three-dimensional etching model to be processed into the working coordinate system and the Cartesian coordinate system. During this process, the machine coordinate system of the laser etching equipment is consistent with the working coordinate system to ensure the accuracy of the coordinates. By hierarchically dividing the three-dimensional model, a two-dimensional plane etching pattern is obtained, and the curvature of each region is calculated and surface roughness .

[0094] According to the curvature of each region and surface roughness , the formula is used to dynamically adjust the laser power , scanning speed and scanning spacing to ensure that each region obtains the optimal energy input. In this step, through real-time feedback and adjustment of the region, it is ensured that the laser energy input is consistent with the requirements of the region.

[0095] During the etching process, for the deep etching region, additive manufacturing technology is used for local material replenishment to ensure that the etching depth and surface quality meet the expectations. By adjusting the laser energy distribution and additive manufacturing strategy, the depth control of the etching is optimized.

[0096] After the experiment, by recording the laser parameters and surface quality of each region during the experiment, data analysis is carried out. The differences between the method of the present invention and the prior art in terms of etching depth control, surface quality, and processing efficiency are mainly compared.

[0097]

[0098] For regions with a small curvature (such as region 3 and region 6), the laser power is relatively low (10W and 11W respectively) because the curvature of these regions is small and the demand for energy input is low. This is consistent with the formula in the adjustment formula of the present invention, and the laser power is reduced in regions with a large curvature.

[0099] For regions with a large curvature (such as Region 2 and Region 4), the laser power is relatively high ( and 15 W respectively), ensuring that the energy can cover the surface with a larger curvature and optimizing the processing depth.

[0100] In regions with a large surface roughness (such as Region 2 and Region 4), the scanning speed is relatively low (800 mm / s and 150 mm / s respectively). This is to ensure sufficient laser energy concentration on the irregular surface and avoid over-etching.

[0101] In regions with a relatively smooth surface (such as Region 1 and Region 3), the scanning speed is relatively high (100 mm / s and 120 mm / s respectively) because the surface irregularity is low, and the laser energy can be effectively and evenly distributed through a higher scanning speed.

[0102] In regions with a large surface roughness, the scanning pitch is small (such as Region 2 and Region 4). This is to ensure laser energy concentration and enhance the etching effect. While in regions with a smooth surface, the scanning pitch is large (such as Region 1 and Region 3) to avoid excessive energy concentration.

[0103] By comparing the etching depths and surface quality of different regions, it can be seen that the method of the present invention significantly optimizes the control of the etching depth and maintains good surface quality by precisely adjusting the laser power, scanning speed, and scanning pitch. For example, the etching depth of Region 1 is 0.15 mm, and the surface quality is , while the etching depth of Region 4 is 0.25 mm, and the surface quality is . Although the etching depth is relatively deep, the surface quality is still well controlled.

[0104] Example 3, an embodiment of the present invention, provides an etching forming system based on a laser scanning strategy, including a model division module, an energy input module, and an etching processing module.

[0105] Among them, the model division module is used to perform hierarchical division by importing a three-dimensional etching model into a coordinate system to generate a two-dimensional planar etching pattern for regional division. The energy input module is used to dynamically adjust the laser energy input for each etching region. The etching processing module is used to perform additive manufacturing to supplement materials in real time and control the etching depth and surface quality.

[0106] If a function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes: USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs, etc., all kinds of media that can store program codes.

[0107] The logic and / or steps represented in the flowchart or described in other ways herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch instructions from the instruction execution system, apparatus, or device and execute the instructions), or used in combination with these instruction execution systems, apparatuses, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device.

[0108] More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection parts with one or more wirings (electronic devices), portable computer disk cartridges (magnetic devices), random access memories (RAMs), read-only memories (ROMs), erasable programmable read-only memories (EPROMs or flash memories), optical fiber devices, and portable compact disc read-only memories (CDROMs). Additionally, a computer-readable medium can even be paper or other suitable media on which a program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other suitable processing as necessary, and then stored in a computer memory.

[0109] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc. It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

[0110] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. An etching forming method based on a laser scanning strategy, characterized in that: include: By importing the three-dimensional etching model into the coordinate system for hierarchical division, a two-dimensional plane etching pattern is generated for regional division; Dynamically adjust the laser energy input to each etching area; Perform additive manufacturing to replenish materials in real time and control etching depth and surface quality; The generating of the two-dimensional planar etching pattern for area division also includes requirements for laser energy distribution and path optimization. The goal of path optimization is to minimize the total path length. The objective function is constructed by combining the curvature radius and the local laser energy requirement, which is expressed as: in, is the optimized path length, It is The coordinates of the points, It is The radius of curvature of a point, is the curvature influence coefficient; The dynamic adjustment of the laser energy input to each etching area includes determining the energy input of the laser, which is expressed as: in, is the power of the laser beam, is the spacing between scan paths, is the scanning speed; The dynamic adjustment of the laser energy input to each etching area also includes obtaining the curvature and surface roughness of the path area and determining the adjustment coefficient of the path area, which is expressed as: in, is the radius of curvature of the path area, is the surface roughness of the path area, is the average roughness of the entire processing area, and They are the curvature adjustment coefficient and the roughness adjustment coefficient; The method of performing additive manufacturing to replenish materials in real time and control etching depth and surface quality includes, during the laser etching process, using laser spraying or local material deposition to thicken the material and replenishing materials in real time through additive manufacturing.

2. The etching forming method based on the laser scanning strategy as claimed in claim 1, characterized in that: The step of performing hierarchical division by importing the three-dimensional etching model into a coordinate system includes importing the three-dimensional etching model to be processed into a coordinate system, wherein the coordinate system includes a working coordinate system and a Cartesian coordinate system; The working coordinate system is consistent with the machine tool coordinate system of the laser etching equipment; The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

3. The etching forming method based on laser scanning strategy as claimed in claim 2, characterized in that: The generating of the two-dimensional plane etching pattern for region division includes dividing the surface of the three-dimensional model in the working coordinate system, and each divided layer will become the basic layer of the laser etching path planning; Calculate the normal direction of each surface point, divide the 3D model into several layers based on the normal direction, and for a given surface point, the curvature radius It is expressed as: in, is the curvature of the point. The curvature is calculated by the second-order derivative of the surface. If the surface is parameterized as ,but: in, They are The first and second order partial derivatives of ; Calculate the area of ​​each two-dimensional plane etching pattern and distribute the laser energy to the area. The area is obtained by numerical integration and is expressed as: in, is the domain of the planar etching pattern, is the height of the shape, and are the boundary coordinates of the figure; By extracting the contour on each layer, a two-dimensional etching pattern is generated, and the planar etching pattern is used for planning the laser etching path.

4. A system using the etching forming method based on the laser scanning strategy as claimed in any one of claims 1 to 3, characterized in that: Including model division module, energy input module, etching processing module; The model division module is used to generate a two-dimensional plane etching pattern for regional division by importing the three-dimensional etching model into a coordinate system for hierarchical division; The energy input module is used to dynamically adjust the laser energy input of each etching area; The etching processing module is used to perform additive manufacturing to replenish materials in real time and control etching depth and surface quality.

5. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the etching and shaping method based on the laser scanning strategy described in any one of claims 1 to 3 are implemented.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the etching and shaping method based on the laser scanning strategy described in any one of claims 1 to 3 are implemented.

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