Laser repair monitoring device and method, storage medium and program product

Abstract

The invention discloses a laser repair monitoring device and method, a storage medium and a program product, and relates to the technical field of laser repair. The pulse laser is in communication connection with the industrial control system, and the industrial control system controls the pulse laser to emit repairing laser; the repair laser is converged to the sample through the laser repair light path to repair the sample; the detection module is in communication connection with the industrial control system, and detection light emitted by the detection module reaches the repair position of the sample through the laser repair light path and is reflected back to the detection module from the repair position through the laser repair light path; the detection module comprises a detector, and the detector detects reflected detection light in real time. Real-time monitoring of the laser repairing process can be achieved, and the laser repairing effect is improved.

Description

Technical Field

[0001] The present application relates to the field of laser repair technology, and in particular to a laser repair monitoring device, method, storage medium and program product. Background Art

[0002] Laser repair technology is a technology that uses high-energy laser beams to heat, melt, solidify, and other processes on the surface of materials to repair surface defects or improve performance. This technology can achieve local modification of materials at the micron or even nanometer scale by precisely controlling laser parameters, and is applicable to a variety of materials such as metals, ceramics, and plastics. Laser repair technology has the advantages of non-contact, small heat-affected zone, high precision, and automated operation. It has been applied in many industries, such as display panel repair, semiconductor panel repair, and optical component repair.

[0003] In order to ensure the quality and efficiency of the repair, real-time monitoring of the repair effect during the laser repair process becomes particularly important. This not only helps to immediately discover and correct problems, but also reduces material waste and improves production efficiency. Although existing technologies can meet some basic monitoring needs, in some cases, especially for the detection of tiny defects or deep defects, the accuracy and resolution of existing technologies are still insufficient. At the same time, due to slow processing speeds or data transmission delays, real-time monitoring cannot be achieved. Summary of the invention

[0004] The main purpose of this application is to provide a laser repair monitoring device, method, storage medium and program product, aiming to solve the technical problem that the existing laser repair monitoring technology has insufficient accuracy and cannot achieve real-time monitoring.

[0005] To achieve the above objectives, the present application proposes a laser repair monitoring device, which includes:

[0006] Industrial control systems;

[0007] A pulse laser, wherein the pulse laser is in communication connection with the industrial control system, and the industrial control system controls the pulse laser to emit a repair laser, wherein the repair laser is a pulse laser;

[0008] A laser repair optical path, wherein the repair laser converges to the sample through the laser repair optical path to repair the sample;

[0009] A detection module, wherein the detection module is in communication connection with the industrial control system, and the detection light emitted by the detection module passes through the laser repair optical path to reach the repair position of the sample, and is reflected from the repair position through the laser repair optical path back to the detection module;

[0010] The detection module includes a detector, and the detector detects the reflected detection light in real time.

[0011] In some embodiments, the detection module further comprises a laser pointer, a beam splitter prism and a first converging lens;

[0012] The laser pointer emits the detection light, and the detection light enters the laser repair optical path after passing through the beam splitter prism;

[0013] The reflected detection light reaches the beam splitter prism through the laser repair optical path, is reflected by the beam splitter prism to the first converging mirror, and is converged to the detector.

[0014] In some embodiments, the detection light emitted by the laser pointer is a continuous laser with a diameter less than 1 mm.

[0015] In some embodiments, the laser repair optical path includes a first reflector, an x-direction galvanometer, a y-direction galvanometer, a first beam splitter, a z-direction driver, and a second converging mirror;

[0016] The x-direction galvanometer controls the deflection of the light beam in the x-direction, the y-direction galvanometer controls the deflection of the light beam in the y-direction, and the z-direction driver drives the second converging mirror to move in the z-direction;

[0017] The repair laser is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and reaches the second converging mirror through the first beam splitter plate, and converges to the sample;

[0018] The detection light is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and reaches the second converging mirror through the first beam splitter plate, is obliquely incident on the sample, is reflected at the repair position, and returns to the detection module.

[0019] In some embodiments, the laser repair monitoring device further includes a microscopic imaging module, which includes an imaging light source, a collimating beam expander lens group, a second beam splitter, a tube lens, and a camera;

[0020] The imaging light source emits imaging light, which passes through the collimating beam expander group and the second beam splitter plate into the laser repair optical path, reaches the sample, is reflected by the sample to the second beam splitter plate, and enters the tube lens under the reflection of the second beam splitter plate, and reaches the camera for imaging.

[0021] In some embodiments, the laser repair monitoring device further includes a beam shaping module, a second reflector, and a third beam splitter plate;

[0022] The beam shaping module shapes the pulse laser into a flat-top pulse laser, and the flat-top pulse laser is reflected to the third beam splitter plate by the second reflector, and is reflected by the third beam splitter plate into the laser repair optical path.

[0023] In some embodiments, the laser repair monitoring device further includes a moving platform, the moving platform is communicatively connected to the industrial control system, the moving platform carries the sample, and moves under the control of the industrial control system.

[0024] In addition, to achieve the above-mentioned purpose, the present application also proposes a laser repair monitoring method, which is applied to the laser repair monitoring device as described above, comprising:

[0025] Determine the repair location of the sample;

[0026] The laser repair parameters are set by the industrial control system to control the pulse laser to emit the repair laser, and the repair laser is converged to the repair position through the laser repair optical path for repair;

[0027] The detection module detects the axial height change of the repair position in real time;

[0028] When the height of the repair position reaches a preset height, the repair is stopped, or the next repair position of the sample is determined.

[0029] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the laser repair monitoring method described above are implemented.

[0030] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the laser repair monitoring method described above are implemented.

[0031] The laser repair monitoring device proposed in this application includes: an industrial control system; a pulse laser, which is connected to the industrial control system in communication, and the industrial control system controls the pulse laser to emit a repair laser; a laser repair optical path, and the repair laser converges to the sample through the laser repair optical path to repair the sample; a detection module, which is connected to the industrial control system in communication, and the detection light emitted by the detection module reaches the repair position of the sample through the laser repair optical path, and is reflected back to the detection module from the repair position through the laser repair optical path; the detection module includes a detector, and the detector detects the reflected detection light in real time. As the laser repair process proceeds, the repair position of the sample gradually changes from a defective state to a complete state, and with the change in the height of the defective position, the detection light emitted by the detection module is converged to the repair position, and the height change of the repair position will cause the change in the final reflection position of the detection light, and the detector can convert and calculate the height change of the repair position through the detected position change, thereby realizing the repair state monitoring in the depth direction of the sample, improving the monitoring accuracy, and realizing real-time detection at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 An overall framework diagram of a laser repair monitoring device provided in an embodiment of the present application;

[0034] Figure 2 A schematic diagram of the structure of a laser repair monitoring device provided in an embodiment of the present application;

[0035] Figure 3 This is a flow chart of an embodiment of the laser repair monitoring method of the present application;

[0036] Figure 4 A schematic diagram of a detection module provided in an embodiment of the present application for detecting axial height changes of a repair position;

[0037] Figure 5 Schematic diagram of the equipment structure of the hardware operating environment involved in the laser repair monitoring method in the embodiment of the present application.

[0038] Description of Figure Numbers:

[0039] 10. Laser repair monitoring device;

[0040] 100. Industrial control system; 200. Pulse laser;

[0041] 300, laser repair optical path; 310, first reflector; 320, x-direction galvanometer; 330, y-direction galvanometer; 340, first beam splitter; 350, z-direction driver; 360, second converging mirror;

[0042] 400, detection module; 410, detector; 420, laser pointer; 430, beam splitter prism; 440, first converging lens;

[0043] 500, microscopic imaging module; 510, imaging light source; 520, collimating beam expander group; 530, second beam splitter plate; 540, tube lens; 550, camera;

[0044] 600, beam shaping module; 700, second reflector; 800, third beam splitter plate; 900, motion stage;

[0045] S. Sample.

[0046] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0048] Current laser repair monitoring technologies include optical imaging, laser scattering detection, infrared thermal imaging, etc. These technologies have their own advantages and disadvantages. For example, optical imaging technology is very effective for detecting surface defects, but its ability to detect deep defects is limited; laser scattering detection can detect subtle surface changes, but its application on complex surfaces may be limited. Although existing related technologies can meet some basic monitoring needs, in some cases, especially for the detection of tiny defects or deep defects, the accuracy and resolution of existing technologies are still insufficient. At the same time, due to slow processing speeds or data transmission delays, real-time monitoring cannot be achieved.

[0049] The main solution of the embodiment of the present application is to provide a laser repair monitoring device and method, which can detect the axial height change of the sample repair position in real time through the detection module in the laser repair monitoring device, monitor the change of the laser repair position in real time in situ, feedback the laser repair process, and improve the laser repair accuracy.

[0050] The present application embodiment provides a laser repair monitoring device, Figure 1 The overall framework diagram of a laser repair monitoring device provided in an embodiment of the present application is as follows: Figure 1As shown, the laser repair monitoring device 10 includes: an industrial control system 100; a pulse laser 200, which is communicatively connected to the industrial control system 100, and the industrial control system 100 controls the pulse laser 200 to emit a repair laser, which is a pulse laser; a laser repair optical path 300, and the repair laser converges to the sample S through the laser repair optical path 300 to repair the sample S; a detection module 400, which is communicatively connected to the industrial control system 100, and the detection light emitted by the detection module 400 passes through the laser repair optical path 300 to reach the repair position of the sample S, and is reflected from the repair position through the laser repair optical path 300 back to the detection module 400; the detection module 400 includes a detector 410, and the detector 410 detects the reflected detection light in real time.

[0051] The industrial control system 100 is connected in communication with the pulse laser 200, and can control the pulse laser 200 to emit a repair laser to repair the defects of the sample S. The industrial control system 100 is also connected in communication with the detection module 400, and can adjust the detection parameters of the detection module 400 on the one hand, and can also receive the data collected by the detection module 400, analyze and process it, and monitor the repair status of the sample S on the other hand. The industrial control system 100 can be an electronic device with data analysis and processing capabilities, and the embodiment of the present application does not specifically limit the form of the electronic device.

[0052] The pulse laser 200 is used to emit a repair laser in the form of a pulse laser to repair the sample S. Optical devices with different functions are arranged in the laser repair optical path 300 to form an optical path capable of propagating a light beam to the position of the sample S.

[0053] The detection module 400 is used to monitor the repair status of the sample repair position in real time. The detection module 400 includes a detector 410. As the depth position of the sample changes, the position of the reflected detection light on the surface of the detector 410 also changes. The detector 410 can detect the change in the reflection position of the detection light emitted from the detection module 400, and convert and calculate the height change of the sample repair position corresponding to the change in the reflection position of the detection light in combination with the setting of the optical device in the laser repair optical path 300.

[0054] It is understandable that the detector 410 can realize the function of detecting the position change of the detection light in the linear direction. Specifically, any optical detector that can realize the above function can be used as the detector 410, such as a linear array sensor or a planar array sensor. The detection light reflected back to the detection module 400 can form a light spot on the surface of the detector 410, and the change in the position of the light spot can reflect the height change of the repair position of the sample S. Both the linear array sensor and the planar array sensor can detect the position change of the light spot in one-dimensional direction. For cost considerations, the linear array sensor can be used preferentially.

[0055] In some embodiments, referring to Figure 2 , Figure 2 This is a schematic diagram of the structure of a laser repair monitoring device provided in an embodiment of the present application. The detection module 400 also includes a laser pointer 420, a beam splitter prism 430 and a first converging lens 440. The laser pointer 420 emits a detection light, which enters the laser repair optical path 300 after passing through the beam splitter prism 430. The reflected detection light passes through the laser repair optical path 300 to the beam splitter prism 430, is reflected by the beam splitter prism 430 to the first converging lens 440, and converges to the detector 410.

[0056] In the process of the pulse laser 200 emitting a repair laser to repair the sample S, the laser pointer 420 can also emit a detection light, which also reaches the repair position of the sample S through the laser repair optical path 300. It can be understood that the repair laser has a large light diameter, so that the energy is focused on the repair position of the sample S through the converging effect of the laser repair optical path 300 to perform additive or subtractive processing. When designing the optical path of the detection light, the detection light is incident from the position of the axis where the focus is located in the offset laser repair optical path 300, so that after being reflected back to the detection module 400, it is reflected by the dichroic prism 430 to the first converging mirror 440, and reaches the detector 410 under the converging effect of the first converging mirror 440.

[0057] In some practicable embodiments, the detection light emitted by the laser pointer 420 is a continuous laser with a diameter less than 1 mm. For example, the diameter of the continuous laser can be 0.5 mm, 0.6 mm or 0.8 mm. It is understood that a continuous laser with a smaller diameter can meet the needs of real-time monitoring and has high detection accuracy. The wavelength of the continuous laser can be a common laser wavelength, for example, the wavelength can be 405 nm, 532 nm, 633 nm or 1064 nm.

[0058] In some practicable embodiments, the laser repair optical path 300 includes a first reflector 310, an x-direction galvanometer 320, a y-direction galvanometer 330, a first beam splitter 340, a z-direction driver 350, and a second converging lens 360. The laser repair optical path 300 is configured so that light incident from different positions can be converged to the sample S to meet different requirements for repairing, observing, and monitoring the sample S. The second converging lens 360 can be a microscope objective lens.

[0059] The x-direction galvanometer 320 can control the deflection of the light beam in the x-direction, the y-direction galvanometer 330 can control the deflection of the light beam in the y-direction, and the z-direction driver 350 can drive the second converging mirror 360 to move in the z-direction. It can be understood that the x-direction, y-direction and z-direction in the embodiment of the present application are three directions perpendicular to each other in space, and the z-direction usually represents the direction perpendicular to the ground, while the specific directions of the x-direction and the y-direction can be arbitrarily selected. The focal length of the second converging mirror 360 is relatively fixed, and the z-direction driver 350 drives the second converging mirror 360 to move in the z-direction, so that the focus position coincides with the repair position of the sample S, making full use of the energy of the laser.

[0060] In the optical path of the laser repair process, the repair laser is reflected by the first reflector 310 to the x-direction galvanometer 320 after being incident, reflected by the x-direction galvanometer 320 to the y-direction galvanometer 330, reflected by the y-direction galvanometer 330, and reaches the second converging mirror 360 through the first beam splitter 340, and converges to the sample S.

[0061] In the monitoring optical path, after the detection light is incident, it is reflected by the first reflector 310 to the x-direction galvanometer 320, reflected by the x-direction galvanometer 320 to the y-direction galvanometer 330, reflected by the y-direction galvanometer 330, and passes through the first beam splitter 340 to reach the second converging mirror 360, obliquely incident on the sample S, reflected at the repair position, and returned to the detection module 400 along the original optical path.

[0062] It can be understood that in the embodiment of the present application, the repair laser and the detection light are both incident on the laser repair light path 300 from the position of the first reflector 310, but it is not limited to this. Other optical devices with similar functions can also be arranged in the laser repair light path 300, so that the repair laser and the detection light can be incident on the laser repair light path 300 from different positions and finally propagate to the sample S.

[0063] In some practicable embodiments, the laser repair monitoring device 10 further includes a microscopic imaging module 500, which includes an imaging light source 510, a collimating beam expander lens group 520, a second beam splitter plate 530, a tube lens 540, and a camera 550. The microscopic imaging module 500 is used to perform microscopic observation on the sample S, to assist in judging the repair status of the sample S and to determine the repair position of the sample S.

[0064] In the microscopic observation optical path, the imaging light source 510 emits imaging light, which enters the laser repair optical path 300 through the collimating beam expander lens group 520 and the second beam splitter plate 530, reaches the sample S, is reflected by the sample S to the second beam splitter plate 530, and enters the tube lens 540 under the reflection of the second beam splitter plate 530, and reaches the camera 550 for imaging. The collimating beam expander lens group 520 can expand the diameter of the imaging light, reduce the divergence angle, and adjust the imaging light to a parallel state to improve the imaging quality. The imaging light can enter the laser repair optical path 300 from the first beam splitter plate 340, and after being reflected at the sample S, it is reflected by the first beam splitter plate 340 along the original optical path to the second beam splitter plate 530, and returns to the microscopic imaging module 500.

[0065] In some practicable embodiments, the laser repair monitoring device 10 further includes a beam shaping module 600, a second reflector 700, and a third spectroscopic plate 800. The beam shaping module 600 shapes the pulsed laser into a flat-top pulsed laser, which is reflected to the third spectroscopic plate 800 by the second reflector 700 and then reflected to the laser repair optical path 300 by the third spectroscopic plate 800. The spot of the flat-top pulsed laser after shaping is similar to a square spot, has a large single pulse energy, and is suitable for use in laser repair scenarios.

[0066] In some practicable embodiments, the laser repair monitoring device 10 further includes a moving stage 900, which is in communication connection with the industrial control system 100, and the moving stage 900 carries the sample S and moves under the control of the industrial control system 100. The moving stage 900 may have the freedom of movement in the three directions of front and back, left and right, and up and down, and may also be configured with a rotation axis to rotate within a certain angle range to cooperate with the repair of the sample S.

[0067] In this embodiment, as the laser repair process proceeds, the repair position of sample S gradually changes from a defective state to a complete state. As the height of the defective position changes, the detection light emitted by the detection module 400 is converged to the repair position. The height change of the repair position will cause the change in the final reflection position of the detection light. The detector 410 can calculate the height change of the repair position by converting the detected position change, thereby realizing the repair status monitoring of sample S in the depth direction, improving the monitoring accuracy, and realizing real-time detection.

[0068] The present application also provides a laser repair monitoring method, which is applied to the laser repair monitoring device 10 described in the present application embodiment. Figure 3 , Figure 3 This is a flow chart of an embodiment of the laser repair monitoring method of the present application.

[0069] In this embodiment, the laser repair monitoring method includes steps S10 to S40:

[0070] Step S10, determining the repair position of the sample;

[0071] It is understandable that the laser repair monitoring device 10 can be provided with a moving stage or other components capable of carrying the sample S, so that the sample S is close to the exit position of the laser repair optical path 300. The laser repair in the embodiment of the present application may include different repair methods such as additive and subtractive repair methods, which are achieved by controlling the wavelength, energy and other parameters of the laser. The position of the sample S can be observed by the microscopic imaging module 500 or other components with imaging functions to determine the repair position of the sample S. The sample S can also be moved so that the repair position is in the center of the imaging field of view.

[0072] Step S20, setting laser repair parameters through the industrial control system, controlling the pulse laser to emit repair laser, and the repair laser converges to the repair position through the laser repair optical path for repair;

[0073] Laser repair parameters refer to the relevant parameters of the repair laser emitted by the pulse laser 200, which may include the wavelength, energy and other parameters of the repair laser. The industrial control system 100 is in communication connection with the pulse laser 200 and the detection module 400, and can control the pulse laser 200 to emit the repair laser and the detection module 400 to start monitoring.

[0074] Step S30, the detection module detects the axial height change of the repair position in real time;

[0075] It is understandable that both the addition and subtraction of the sample S will produce height changes, and the detection light emitted by the detection module 400 can detect such changes in real time. Figure 4 A schematic diagram of a detection module 400 provided in an embodiment of the present application for detecting axial height changes of a repair position, such as Figure 4 As shown, assuming that during the laser repair process, the axial height change caused by the addition or subtraction of the sample S is s, the change in the center position of the light spot detected by the detector 410 is p, the focal length of the second converging mirror 360 is f1, the focal length of the first converging mirror 440 is f2, the vertical distance between the detector 410 and the focus of the first converging mirror 440 is d, and the distance of the incident light relative to the optical axis is h. According to ray tracing, the following formula 1 can be derived.

[0076] Formula 1:

[0077] Therefore, according to the change p of the center position of the light spot detected by the detector 410, the axial height change of the sample S can be obtained in real time by referring to the following formula 2.

[0078] Formula 2:

[0079] Step S40, when the height of the repair position reaches a preset height, stop the repair, or determine the next repair position of the sample.

[0080] The preset height refers to the target height that the sample S needs to reach for material addition or subtraction. Referring to the above formulas 1 and 2, when s reaches the preset target value s0, and the height of the repair position also reaches the preset height, you can choose to stop the laser repair according to the overall repair situation of the sample S, or determine the next repair position of the sample S, and repeat the above repair process with reference to the above steps.

[0081] The laser repair monitoring method provided in this embodiment is combined with the laser repair monitoring device 10. As the laser repair process proceeds, the repair position of the sample S gradually changes from a defective state to a complete state. As the height of the defective position changes, the detection light emitted by the detection module 400 is converged to the repair position. The height change of the repair position will cause the change in the final reflection position of the detection light. The detector 410 can calculate the height change of the repair position by converting the detected position change, thereby realizing the repair status monitoring of the sample S in the depth direction, improving the monitoring accuracy, and realizing real-time detection.

[0082] The present application also provides an electronic device that can be used as an industrial control system 100, and the electronic device includes: at least one processor; and a memory that is communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the laser repair monitoring method in the above-mentioned embodiment.

[0083] Reference below Figure 5 , which shows a schematic diagram of the structure of an electronic device suitable for implementing the embodiments of the present application. The electronic devices in the embodiments of the present application may include but are not limited to mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 5 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0084] like Figure 5As shown, the electronic device may include a processing device 1001 (e.g., a central processing unit, a graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM: Read Only Memory) 1002 or a program loaded from a storage device 1003 to a random access memory (RAM: Random Access Memory) 1004. In RAM1004, various programs and data required for the operation of the electronic device are also stored. The processing device 1001, ROM1002, and RAM1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows an electronic device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have alternatively.

[0085] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0086] The electronic device provided by the present application adopts the laser repair monitoring method in the above embodiment, which can solve the technical problem that the existing laser repair monitoring technology is insufficient in accuracy and cannot achieve real-time monitoring. Compared with the prior art, the beneficial effects of the electronic device provided by the present application are the same as the beneficial effects of the laser repair monitoring method provided by the above embodiment, and the other technical features in the electronic device are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0087] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0088] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0089] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the laser repair monitoring method in the above-mentioned embodiment.

[0090] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM: Random Access Memory), a read-only memory (ROM: Read Only Memory), an erasable programmable read-only memory (EPROM: Erasable Programmable Read Only Memory or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM: CD-Read Only Memory), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency: Radio Frequency), etc., or any suitable combination of the above.

[0091] The computer-readable storage medium may be included in the electronic device, or may exist independently without being installed in the electronic device.

[0092] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by an electronic device, the electronic device: determines a repair position of the sample; sets laser repair parameters through an industrial control system, controls a pulsed laser to emit a repair laser, and the repair laser converges to the repair position through a laser repair optical path for repair; a detection module detects the axial height change of the repair position in real time; stops repairing when the height of the repair position reaches a preset height, or determines the next repair position of the sample.

[0093] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0094] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0095] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0096] The readable storage medium provided in this application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned laser repair monitoring method, and can solve the technical problem that the existing laser repair monitoring technology is insufficient in accuracy and cannot achieve real-time monitoring. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as the beneficial effects of the laser repair monitoring method provided in the above-mentioned embodiment, and will not be repeated here.

[0097] The present application also provides a computer program product, including a computer program, which implements the steps of the laser repair monitoring method as described above when executed by a processor.

[0098] The computer program product provided by the present application can solve the technical problem that the existing laser repair monitoring technology is insufficiently accurate and cannot achieve real-time monitoring. Compared with the prior art, the beneficial effects of the computer program product provided by the present application are the same as the beneficial effects of the laser repair monitoring method provided by the above embodiment, and will not be elaborated here.

[0099] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A laser repair monitoring device, characterized in that: The laser repair monitoring device comprises: Industrial control systems; A pulse laser, wherein the pulse laser is in communication connection with the industrial control system, and the industrial control system controls the pulse laser to emit a repair laser, wherein the repair laser is a pulse laser; A laser repair optical path, wherein the repair laser converges to the sample through the laser repair optical path to repair the sample; A detection module, wherein the detection module is in communication connection with the industrial control system, and the detection light emitted by the detection module passes through the laser repair optical path to reach the repair position of the sample, and is reflected from the repair position through the laser repair optical path back to the detection module; The detection module includes a detector, and the detector detects the reflected detection light in real time.

2. The laser repair monitoring device according to claim 1, characterized in that: The detection module also includes a laser pointer, a beam splitter prism and a first converging lens; The laser pointer emits the detection light, and the detection light enters the laser repair optical path after passing through the beam splitter prism; The reflected detection light reaches the beam splitter prism through the laser repair optical path, is reflected by the beam splitter prism to the first converging mirror, and is converged to the detector.

3. The laser repair monitoring device according to claim 2, characterized in that: The detection light emitted by the laser indicator is a continuous laser with a diameter less than 1 mm.

4. The laser repair monitoring device according to any one of claims 1 to 3, characterized in that: The laser repair optical path includes a first reflector, an x-direction galvanometer, a y-direction galvanometer, a first beam splitter, a z-direction driver, and a second converging mirror; The x-direction galvanometer controls the deflection of the light beam in the x-direction, the y-direction galvanometer controls the deflection of the light beam in the y-direction, and the z-direction driver drives the second converging mirror to move in the z-direction; The repair laser is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and reaches the second converging mirror through the first beam splitter plate, and converges to the sample; The detection light is reflected by the first reflector to the x-direction galvanometer, reflected by the x-direction galvanometer to the y-direction galvanometer, reflected by the y-direction galvanometer, and reaches the second converging mirror through the first beam splitter plate, is obliquely incident on the sample, is reflected at the repair position, and returns to the detection module.

5. The laser repair monitoring device according to any one of claims 1 to 3, characterized in that: The laser repair monitoring device also includes a microscopic imaging module, which includes an imaging light source, a collimating beam expander lens group, a second beam splitter, a tube lens and a camera; The imaging light source emits imaging light, which passes through the collimating beam expander group and the second beam splitter plate into the laser repair optical path, reaches the sample, is reflected by the sample to the second beam splitter plate, and enters the tube lens under the reflection of the second beam splitter plate, and reaches the camera for imaging.

6. The laser repair monitoring device according to any one of claims 1 to 3, characterized in that: The laser repair monitoring device also includes a beam shaping module, a second reflector and a third beam splitter plate; The beam shaping module shapes the pulse laser into a flat-top pulse laser, and the flat-top pulse laser is reflected to the third beam splitter plate by the second reflector, and is reflected by the third beam splitter plate into the laser repair optical path.

7. The laser repair monitoring device according to any one of claims 1 to 3, characterized in that: The laser repair monitoring device also includes a moving stage, which is communicatively connected to the industrial control system. The moving stage carries the sample and moves under the control of the industrial control system.

8. A laser repair monitoring method, characterized in that: The laser repair monitoring device used in any one of claims 1 to 7 comprises: Determine the repair location of the sample; The laser repair parameters are set by the industrial control system to control the pulse laser to emit the repair laser, and the repair laser is converged to the repair position through the laser repair optical path for repair; The detection module detects the axial height change of the repair position in real time; When the height of the repair position reaches a preset height, the repair is stopped, or the next repair position of the sample is determined.

9. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the laser repair monitoring method according to claim 8 are implemented.

10. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the laser repair monitoring method according to claim 8 are implemented.

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