A multi-layer abrasive grinding wheel and a method of manufacturing the same

Abstract

The application discloses a kind of multilayer abrasive grinding wheel and its preparation method, adopt hole template as abrasive interval arrangement template, and the abrasive layer is prepared on the welding sheet;Welding sheet is set on single-layer blank working layer, then pore-forming agent is arranged on welding sheet to prepare single-layer blank working layer again, and the above-mentioned step is repeated to prepare multilayer superhard abrasive grinding wheel blank, the regular arrangement of abrasive makes the abrasive distribution in grinding wheel working layer present regular, ordered form, in the process of grinding wheel grinding processing, the regular arrangement of abrasive can ensure that each abrasive has enough chip space, thereby effectively avoiding the adhesion of grinding wheel surface grinding chip;Meanwhile, each abrasive is stressed more evenly, and wear is consistent, thereby improving the service life of grinding wheel.

Description

Technical Field

[0001] This invention belongs to the field of machining technology, specifically relating to a multi-layer abrasive grinding wheel and its preparation method. Background Technology

[0002] In sintered abrasive grinding wheels manufactured using existing technology, the distribution of abrasive particles in the brazing filler metal matrix exhibits a random and disordered characteristic. This distribution pattern means that during the actual grinding process, only a very small proportion of dynamically effective abrasive particles can truly participate in the material removal process, while the vast majority of abrasive particles fail to fully exert their cutting effect, resulting in a low overall abrasive utilization rate.

[0003] Due to the disordered distribution of abrasive particles within the grinding wheel, the size of the gaps between abrasive particles exhibits significant non-uniformity. This inconsistency in gap distribution directly leads to relatively narrow chip-holding spaces in certain localized areas of the grinding wheel's working layer. During high-speed grinding, the generation of grinding chips is continuous and abundant; these narrow chip-holding spaces undoubtedly hinder effective chip removal, causing chips to accumulate on the grinding wheel surface or within the working layer, thereby increasing the probability of chip adhesion between the chips and the grinding wheel surface.

[0004] Over time, the continuous accumulation of abrasive shavings not only reduces grinding efficiency but also accelerates the wear of the grinding wheel. More seriously, when the abrasive shavings adhere to a certain degree, it can cause clogging on the grinding wheel surface, leading to a sharp decline in the wheel's effective cutting ability. In some cases, it can even cause the grinding wheel to fail rapidly within a short period, severely impacting production efficiency and machining quality. Therefore, optimizing the distribution of abrasive within the grinding wheel, improving abrasive utilization, and enhancing the grinding wheel's chip-holding and chip-removal performance are key issues that urgently need to be addressed in current sintered abrasive grinding wheel technology. Summary of the Invention

[0005] The purpose of this invention is to provide a multi-layer abrasive grinding wheel and its preparation method, so as to overcome the problems of low abrasive utilization, chip adhesion, and unstable grinding performance in the prior art. This invention can improve the material removal rate and service life of superhard abrasive grinding wheels.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A method for preparing a multi-layer abrasive grinding wheel includes the following steps:

[0008] S1. A hole template is used as a template for abrasive spacing. Abrasives are arranged on the welding sheet to prepare a single-layer blank working layer. A welding sheet is set on the single-layer blank working layer. Then, a hole-forming agent is arranged on the welding sheet to prepare another single-layer blank working layer. The above steps are repeated to prepare a multi-layer superhard abrasive grinding wheel blank.

[0009] S2, multi-layer superhard abrasive wheel blanks are sintered in a vacuum environment to obtain multi-layer superhard abrasive wheels with regularly arranged abrasive particles.

[0010] Preferably, a hole template is made by distributing and arranging the abrasive according to a set abrasive pattern spacing. A layer of pressure-sensitive adhesive is applied to the first welding sheet, the hole template is attached to the first welding sheet, the abrasive is spread on the hole template, excess abrasive on the hole template is scraped off, and then the gaps between the abrasive particles are filled with a pore-forming agent to form the first unit blank working layer. A hole template is made by distributing and arranging the pore-forming agent according to a set pore-forming agent pattern spacing. The hole template is attached to the first unit blank working layer, the pore-forming agent particles are spread on the hole template, excess pore-forming agent on the hole template is scraped off, and then the gaps between the pore-forming agents are filled with abrasive to form the second unit blank working layer.

[0011] Preferably, the number of single-layer blank working layers stacked together is 5 to 50.

[0012] Preferably, the abrasive (or pore-forming agent) is arranged in a set regular spacing to form a hole template, and the regular spacing of the abrasive (or pore-forming agent) is obtained by mathematical modeling.

[0013] Preferably, the objective function for optimizing the abrasive grain arrangement spacing is to maximize the chip space V during the grinding wheel's machining of the workpiece material and maximize the workpiece material removal rate M.

[0014]

[0015]

[0016] and with , , As a constraint, the chip space corresponding to the critical chip adhesion on the grinding wheel surface was determined through grinding experiments. Solve the above mathematical model to obtain the abrasive grain spacing and arrangement, and abrasive grain size parameters; b, λ, h g a g These are the diameter of a single abrasive grain, the spacing between abrasive grains (or the spacing of the pore-forming agent), the abrasive distribution angle, the abrasive exposure height, and the maximum cutting thickness of a single abrasive grain; a p v s、 v w A, h g d c These are the grinding depth of the grinding wheel, linear speed, table speed, contact area between the grinding wheel and the workpiece, and equivalent diameter of the grinding wheel.

[0017] Preferably, the pore-forming agent is silicate hollow spheres or Ni-Cr alloy hollow spheres with a particle size of 30-300 mesh.

[0018] Preferably, the welding sheet is a Ni-Cr alloy or Cu-Sn-Ti alloy welding sheet, and the thickness of the welding sheet is 0.02 to 0.2 mm.

[0019] Preferably, the abrasive is diamond or CBN, and the abrasive particle size is 30-300 mesh.

[0020] Preferably, the abrasive particles on the welding sheet are arranged at regular intervals of 0.1 to 1 mm.

[0021] A multi-layer abrasive wheel is prepared by the above-described method for preparing multi-layer abrasive wheels.

[0022] Compared with the prior art, the present invention has the following beneficial technical effects:

[0023] This invention discloses a method for preparing a multi-layer abrasive grinding wheel. A hole template is used as the abrasive spacing template. Abrasives are arranged on a welding sheet to prepare a single-layer blank working layer. A welding sheet is then placed on the single-layer blank working layer, and a pore-forming agent is arranged on the welding sheet to prepare another single-layer blank working layer. This process is repeated to prepare a multi-layer superhard abrasive grinding wheel blank. The regular arrangement of the abrasives ensures a regular and orderly distribution of abrasives in the grinding wheel working layer. During the grinding process, the regular arrangement of the abrasives ensures that each abrasive has sufficient chip space, effectively preventing chip adhesion to the grinding wheel surface. Simultaneously, each abrasive experiences more uniform force and wear, thereby improving the service life of the grinding wheel. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the process structure for preparing the multi-layer abrasive wheel of the present invention.

[0025] Figure 2 This is a schematic diagram of the structure of the multi-layer superhard abrasive grinding wheel with regularly arranged abrasive particles according to the present invention.

[0026] Figure 3 This is a schematic diagram of adjacent unit blank working layers.

[0027] Figure 4 A schematic diagram of a multi-layered superhard abrasive grinding wheel blank with a regular arrangement of abrasive particles.

[0028] In the figure, matrix-1, binder-2, abrasive-3, and pore-forming agent-4 are shown. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] like Figure 1 As shown, the present invention provides a method for preparing a multi-layer abrasive grinding wheel, comprising the following steps:

[0032] S1. A hole template is used as a template for abrasive spacing. Abrasives are arranged on the welding sheet to prepare a single-layer blank working layer. A welding sheet is set on the single-layer blank working layer. Then, a hole-forming agent is arranged on the welding sheet to prepare another single-layer blank working layer. The above steps are repeated to prepare a multi-layer superhard abrasive grinding wheel blank.

[0033] S2, multi-layer superhard abrasive wheel blanks are sintered in a vacuum environment to obtain multi-layer superhard abrasive wheels with regularly arranged abrasive particles.

[0034] In a specific embodiment of this application, the abrasive is distributed and arranged in a predetermined abrasive spacing to form a hole template. The first welding sheet is coated with a layer of pressure-sensitive adhesive, and the hole template is attached to the first welding sheet. The abrasive is spread out on the hole template, and the excess abrasive on the hole template is scraped off to ensure that each hole can accommodate one abrasive. Then, the gaps between the abrasives are filled with a hole-forming agent to form the first unit blank working layer.

[0035] The second welding piece is neatly laid flat on the unit blank working layer of step 1. The hole template is attached to the second welding piece, and the hole-forming agent is spread on the hole template. Excess hole-forming agent on the hole template is scraped off to ensure that there is hole-forming agent in each hole. Then, abrasive is filled into the gaps between the hole-forming agents to form the second type of unit blank working layer.

[0036] Repeat the above steps, and the number of single-layer blank working layers stacked together is 5 to 50, forming a multi-layer superhard abrasive grinding wheel blank with a regular arrangement of abrasives, in which the abrasives of adjacent two layers in the height direction are staggered.

[0037] A hole template is made by distributing and arranging the abrasive (or pore-forming agent) in a set regular arrangement spacing. The regular arrangement spacing of the abrasive (or pore-forming agent) is obtained by mathematical modeling.

[0038] Specifically, a physical-mathematical modeling method is adopted, which takes maximizing the chip space V and maximizing the workpiece material removal rate M during the grinding wheel's machining process as the objective function for optimizing the abrasive pattern spacing:

[0039]

[0040]

[0041] and with , , As a constraint, the chip space corresponding to the critical chip adhesion on the grinding wheel surface was determined through grinding experiments. Solve the above mathematical model to obtain the spacing and arrangement of abrasive grains and the abrasive grain size parameters.

[0042] The pore-forming agent is made of silicate hollow spheres or Ni-Cr alloy hollow spheres with a particle size of 30-300 mesh. The welding sheet is made of Ni-Cr alloy or Cu-Sn-Ti alloy with a thickness of 0.02-0.2 mm. The abrasive is diamond or CBN with a particle size of 30-300 mesh.

[0043] The abrasive particles on the welding sheet are arranged regularly at intervals of 0.1 to 1 mm, and the size of the holes on the hole template matches the particle size of the abrasive and the pore-forming agent.

[0044] Within the working layer of a grinding wheel, there are gaps between the abrasive particles; these gaps are called chip spaces. The size and shape of the chip spaces depend on the grinding wheel's manufacturing process, the type of bonding agent and pore-forming agent, and the abrasive exposure height. Given a fixed grinding wheel manufacturing process and pore-forming agent material, the regular arrangement of the abrasive particles is the most important factor determining the size of the chip space for a single abrasive particle. The design parameters for the regular arrangement of abrasive particles include the axial distance, radial distance, and arrangement angle.

[0045] Combining the theory and practice of grinding, this invention provides a practical method for achieving regular abrasive arrangement in multi-layer superhard abrasive wheels: a physical-mathematical modeling method. This invention establishes a mathematical model based on fundamental physical principles under several simplifications, and then uses this model to achieve the regular abrasive arrangement. The objective function for optimizing the abrasive arrangement spacing is to maximize the chip space V and the workpiece material removal rate M during the grinding process.

[0046]

[0047]

[0048] Equation (I)

[0049] set up: , , As constraints, where b, λ, h g a g These are the diameter of a single abrasive grain, the spacing between abrasive grains, the abrasive grain distribution angle, the abrasive grain exposure height, and the maximum cutting thickness of a single abrasive grain, respectively; a p v s、 v w A, h g d c These are the grinding depth of the grinding wheel, linear speed, table speed, contact area between the grinding wheel and the workpiece, and equivalent diameter of the grinding wheel.

[0050] Furthermore, V represents the constraint condition determined by the chip space of the grinding wheel ( This indicates that the chip space on the grinding wheel surface cannot be less than the minimum chip space; otherwise, chip adhesion will occur on the grinding wheel surface. The critical chip space corresponding to chip adhesion on the grinding wheel surface was determined through grinding experiments. ), q and Ra represent the constraint conditions determined by the average heat flux density of the contact arc region and the surface roughness of the workpiece, respectively. , (The conditions are similar to those before).

[0051] Solving the above mathematical model, under given processing requirements and conditions, the spacing and angle of the abrasive grains and the abrasive particle size are obtained according to the properties of the material being processed. Multilayer superhard abrasive wheels made according to the optimal abrasive grain arrangement will have the highest material removal rate when grinding workpieces.

[0052] Reference Figures 2 to 4 The manufacturing process of a multi-layered superhard abrasive grinding wheel with regularly arranged abrasive particles is as follows:

[0053] Step 1: According to the abrasive rules, the abrasive distribution and arrangement are made into a hole template (the spacing between holes is 0.7mm, the hole arrangement is grid-like, that is, the arrangement angle is 45°). Take the first Ni-Cr alloy welding sheet (welding sheet thickness is 0.1mm) and coat it with a layer of pressure-sensitive adhesive. Attach the hole template to the first welding sheet. Spread diamond abrasive (50 / 60 mesh) on the hole template. Scrape off the excess diamond on the hole template to ensure that each hole can accommodate one diamond. Then fill the gaps between the diamonds with a pore-forming agent to form the first unit blank working layer.

[0054] Step 2: Lay the second welding piece neatly on the unit blank working layer of Step 1. Place the hole template on the second welding piece. Spread the hole-forming agent on the hole template. The hole-forming agent is Ni-Cr alloy hollow sphere particles (particle size of 50 / 60 mesh). Scrape off the excess hole-forming agent on the hole template to ensure that each hole has hole-forming agent. Then fill the gaps between the hole-forming agents with diamond to form the second type of unit blank working layer.

[0055] Step 3: Repeat steps 1 and 2. The number of stacked unit blank working layers is 30, forming a multi-layer superhard abrasive grinding wheel blank with a regular arrangement of abrasives. The abrasives of adjacent layers in the height direction are staggered.

[0056] Step 4: The multi-layer superhard abrasive wheel blank obtained in Step 3 is fed into a vacuum sintering furnace for sintering, and finally a multi-layer superhard abrasive wheel with regularly arranged abrasive particles is obtained.

[0057] This invention provides a multi-layer abrasive grinding wheel, prepared by the aforementioned method for preparing multi-layer abrasive grinding wheels. The specific structure is as follows: Figures 2 to 4 As shown.

[0058] The multi-layered superhard abrasive grinding wheel with regularly arranged abrasive particles, manufactured according to the present invention, has a large abrasive exposure height, reaching 40% to 60%, resulting in a high material removal rate and high processing efficiency. During processing, it can effectively avoid the adhesion of abrasive debris to the grinding wheel surface and the burning of the workpiece surface.

[0059] The above are merely specific embodiments of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial modifications made to the present invention using this concept shall be considered as infringing upon the protection scope of the present invention.

Claims

1. A method for preparing a multi-layer abrasive grinding wheel, characterized in that, Includes the following steps: S1. A hole template is used as a template for abrasive spacing. Abrasives are arranged on the welding sheet to prepare a single-layer blank working layer. A welding sheet is set on the single-layer blank working layer. Then, a hole-forming agent is arranged on the welding sheet to prepare another single-layer blank working layer. The above steps are repeated to prepare a multi-layer superhard abrasive grinding wheel blank. A hole template is created by distributing and arranging abrasive particles according to a set abrasive spacing. A pressure-sensitive adhesive is applied to the first welding sheet, and the hole template is attached to it. Abrasive particles are spread on the hole template, excess abrasive is scraped off, and then a pore-forming agent is filled into the gaps between the abrasive particles to form the first unit blank working layer. Similarly, a hole template is created by distributing and arranging pore-forming agents according to a set pore-forming agent spacing. The hole template is attached to the first unit blank working layer, pore-forming agent particles are spread on the hole template, excess pore-forming agent is scraped off, and then abrasive particles are filled into the gaps between the pore-forming agents to form the second unit blank working layer. A hole template is made by using a set regular arrangement spacing of abrasive or pore-forming agent to distribute and arrange the abrasive or pore-forming agent. The regular arrangement spacing of the abrasive or pore-forming agent is obtained by mathematical modeling. S2, multi-layer superhard abrasive wheel blanks are sintered in a vacuum environment to obtain multi-layer superhard abrasive wheels with regularly arranged abrasive particles.

2. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The number of single-layer blank working layers stacked together is 5 to 50.

3. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The objective function for optimizing the abrasive grain arrangement spacing is to maximize the chip space V and the workpiece material removal rate M during the grinding wheel's machining process. and with , , As a constraint, the chip space corresponding to the critical chip adhesion on the grinding wheel surface was determined through grinding experiments. Solve the above mathematical model to obtain the abrasive grain spacing and arrangement, and abrasive grain size parameters; b, λ, h g a g These are the diameter of a single abrasive grain on the grinding wheel, the spacing between abrasive grains or the spacing of the pore-forming agent, the abrasive distribution angle, the abrasive exposure height, and the maximum cutting thickness of a single abrasive grain; a p v s、 v w A, h g d c These are the grinding depth of the grinding wheel, linear speed, table speed, contact area between the grinding wheel and the workpiece, and equivalent diameter of the grinding wheel.

4. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The pore-forming agent is made of silicate hollow spheres or Ni-Cr alloy hollow spheres with a particle size of 30-300 mesh.

5. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The welding sheet is made of Ni-Cr alloy or Cu-Sn-Ti alloy and has a thickness of 0.02 to 0.2 mm.

6. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The abrasive is diamond or CBN, and the abrasive particle size is 30-300 mesh.

7. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that, The abrasive particles on the welding sheet are arranged in a regular pattern with a spacing of 0.1 to 1 mm.

8. A multi-layer abrasive wheel, prepared by the method described in any one of claims 1 to 7.

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