Preparation method of high-stability electron carrier tape base paper with square holes at high temperature and high humidity
By using the method of high-temperature and high-humidity lower holes and high-stability electronic carrier tape base paper in the preparation process of high-temperature and high humidity, the problem of the carrier tape hole size shrinking due to water absorption is solved, the stability and packaging effect of the carrier tape are improved, and the fault phenomenon during the packaging process is reduced.
Patent Information
- Application Number
- CN202510205891.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2025-03-25
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The carrier tape needs to be drilled and molded before braiding. The size of the hole behind the drill shrinks due to water absorption, resulting in a decrease in the hole area, affecting the packaging of electronic components, and prone to side-standing or clamping.
The preparation method of high-stability electronic carrier tape base paper at high temperature and high humidity is adopted, including dissolution, pulping and mixing of slurry, slurrying and interlayer spraying starch composite, glue application in-slurry and surface application, and super calendering treatment.
It improves the bonding strength and water resistance of the carrier tape base paper, stabilizes the size of the square holes, reduces the side-standing or clamping of electronic components during packaging, and reduces the paper frost phenomenon when the cover tape is peeled off.
Abstract
Citation Information
Patent Citations
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