Preparation method of high-stability electron carrier tape base paper with square holes at high temperature and high humidity

By using the method of high-temperature and high-humidity lower holes and high-stability electronic carrier tape base paper in the preparation process of high-temperature and high humidity, the problem of the carrier tape hole size shrinking due to water absorption is solved, the stability and packaging effect of the carrier tape are improved, and the fault phenomenon during the packaging process is reduced.

CN119686151AInactive Publication Date: 2025-03-25SHANDONG XIANHUA NEW MATERIAL TECH CO LTD
View PDF 8 Cites 0 Cited by

Patent Information

Application Number
CN202510205891.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2025-03-25
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The carrier tape needs to be drilled and molded before braiding. The size of the hole behind the drill shrinks due to water absorption, resulting in a decrease in the hole area, affecting the packaging of electronic components, and prone to side-standing or clamping.

Method used

The preparation method of high-stability electronic carrier tape base paper at high temperature and high humidity is adopted, including dissolution, pulping and mixing of slurry, slurrying and interlayer spraying starch composite, glue application in-slurry and surface application, and super calendering treatment.

Benefits of technology

It improves the bonding strength and water resistance of the carrier tape base paper, stabilizes the size of the square holes, reduces the side-standing or clamping of electronic components during packaging, and reduces the paper frost phenomenon when the cover tape is peeled off.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a preparation method of high-stability electronic carrier tape body paper with square holes at high temperature and high humidity, and relates to the technical field of carrier tape body paper preparation processes. Defibering, pulping and mixing the pulp; the method comprises the following steps: defibering and pulping bleached softwood commercial pulp and bleached hardwood commercial pulp respectively, and then mixing together to form mixed pulp; s2; sizing in the mixed slurry, molding and drying; carrying out papermaking on the mixed pulp through a three-layer rotary screen paper machine, and spraying starch between layers for compounding; (S3); sizing and calendaring the surface of the dried paper sample; the paper sample is subjected to infiltration and film transfer sizing, and then the paper sample is subjected to super calendering to prepare the electronic carrier tape body paper. The problems that in the prior art, punching forming operation needs to be carried out on a carrier tape before braiding, the size of a hole after punching is changed due to water absorption of carrier tape paper, and consequently electronic components stand laterally or are clamped in the packaging process are solved.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Electronic component carrier tape body paper and preparation method thereof

    CN114892436A

  • Paper for packaging carrier tape and preparation method thereof

    CN104088199A

  • Waterproof and damp-proof raw paper dedicated for electronic paper tape, and preparation method thereof

    CN105350375A

  • Electron carrier board body paper and production method thereof

    CN107503227A

  • High-air-permeability light medical protection special paper and manufacturing method thereof

    CN111549554A