A chip testing device

Abstract

This application provides a chip testing device, relating to the field of testing equipment technology. It includes a chassis with a backplate arranged along a first direction, dividing the chassis into a first zone and a second zone arranged side-by-side along a second direction. In the first zone, at least two liquid cooling modules and at least two chip-under-test (DUT) modules are stacked from bottom to top along a third direction. The DUT modules are pull-out connected to the chassis, and the liquid cooling modules dissipate heat from the DUT modules. The first and second zones are communicatively connected via the backplate, ensuring that the DUT modules can complete high and low temperature tests while operating normally. In the second zone, a drive module and an auxiliary module are stacked from bottom to top along a third direction. A control module is arranged on the same layer as the drive module. The drive module is connected to the liquid cooling modules, and the auxiliary module is connected to the DUT modules. The control module is electrically connected to the DUT modules, the liquid cooling modules, the drive module, and the auxiliary module, respectively. The first, second, and third directions are perpendicular to each other.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, specifically to a chip testing device. Background Technology

[0002] With the continuous development and advancement of AI (Artificial Intelligence) technology, AI chips have become a crucial component in its development. High and low temperature testing is a routine procedure when performing performance testing on AI chips. Current testing equipment suffers from low efficiency, primarily due to the complex loading process of changing the chip under test and the low degree of automation in the testing process, which affects efficiency. Furthermore, current testing methods rely heavily on human operators, increasing instability and impacting accuracy. Summary of the Invention

[0003] The purpose of this application is to provide a chip testing device that can improve the automation level, efficiency, and accuracy of testing.

[0004] In one aspect of this application, a chip testing device is provided, including a chassis. A backplate is provided inside the chassis along a first direction to divide the chassis into a first area and a second area arranged side by side along a second direction. At least two lifting liquid cooling modules and at least two chip modules under test are stacked from bottom to top in the first area along a third direction. The chip modules under test are pulled out and connected to the chassis. The lifting liquid cooling modules dissipate heat from the chip modules under test. The first area and the second area are communicatively connected through the backplate to ensure that the chip modules under test can complete high and low temperature tests while operating normally.

[0005] The second region has a drive module and an auxiliary module stacked from bottom to top along the third direction. The drive module has a control module on the same layer. The drive module is connected to the lifting liquid cooling module to realize the lifting of the lifting liquid cooling module. The auxiliary module is connected to the chip under test module to ensure the normal operation of the chip under test module. The control module is electrically connected to the chip under test module, the lifting liquid cooling module, the drive module and the auxiliary module respectively. The first direction, the second direction and the third direction are perpendicular to each other.

[0006] Optionally, the chip under test module includes a test carrier, on which a mounting plate and a chip under test are disposed. The chip under test module has one side facing the lifting liquid cooling module. A first connector is disposed at the end of the mounting plate facing the back plate, and a second connector is disposed at the end of the back plate facing the mounting plate. The first connector and the second connector are plugged into each other to realize the communication connection between the chip under test module and the back plate.

[0007] Optionally, a power connector is provided on the side of the backplane facing the chip module under test, and a power interface is provided on the side of the chip module under test facing the backplane. The power interface of the chip module under test is plugged into the power connector of the backplane to realize the electrical connection of the chip module under test.

[0008] Optionally, the lifting liquid cooling module includes a lifting carrier, a lifting mechanism disposed on the lifting carrier, and a liquid cooling module disposed on the lifting mechanism. The lifting mechanism lifts the liquid cooling module to make the liquid cooling module and the chip under test come into contact.

[0009] Optionally, the lifting mechanism is further provided with a jumper module. The chip module under test includes a PCB board. The jumper module connects the PCB board and the buckle plate. The lifting mechanism performs a first-stage synchronous lifting of the liquid cooling module and the jumper module, and then performs a second-stage lifting of the jumper module, so that the jumper module and the PCB board can be connected.

[0010] Optionally, the PCB board of the chip module under test is provided with a third connector, the buckle is provided with a fourth connector, the jumper module is provided with a jumper board, one end of the jumper board is used to be plugged into the fourth connector, and the other end is used to be plugged into the third connector.

[0011] Optionally, the lifting carrier is pulled out and connected to the chassis. The lifting carrier is equipped with pulleys, and the chassis has holes. The pulleys cooperate with the holes to fix the relative position of the lifting liquid cooling module and the chassis.

[0012] Optionally, the driving module also has an interface board on the same layer for connecting external devices, located at one end away from the chip module under test along the second direction, with the interface board protruding from the auxiliary module.

[0013] Optionally, the chassis is provided with a guide rail on one side along the second direction, and the chassis and the cabinet are engaged by pushing and pulling through the guide rail.

[0014] Optionally, the auxiliary module is also provided with a heat dissipation module on the same layer, the heat dissipation module dissipates heat from the control module, and the control module is electrically connected to the heat dissipation module.

[0015] The chip testing device provided in this application is an independent chassis design. The chassis is a standard 4U chassis size, which can be placed in a standard ORv3 rack. A single chassis can perform performance testing on at least two chip modules under test. When multiple chassis are stacked in a rack, multiple sets of chip modules under test can be tested, which can greatly improve testing efficiency. The chassis is easy to stack in a rack and can be flexibly configured according to actual needs to meet different testing requirements. The chip modules under test adopt a pull-out design, which facilitates the replacement of different chips under test for testing. The lifting liquid cooling module adopts an automatic lifting mode, which greatly improves testing efficiency; the lifting liquid cooling module dissipates heat from the chip modules under test, ensuring the normal operation of the chip modules under test. The auxiliary module ensures the normal operation of the chip modules under test, and the drive module is used to realize the lifting and lowering of the lifting liquid cooling module. This application adopts a modular design, and the modules are reasonably arranged in the chassis to ensure that the chip modules under test can complete high and low temperature tests while operating normally in a limited space. It also facilitates disassembly, simplifies the original complex loading process, and reduces the skill requirements of the operators. Meanwhile, the control module enables automated control of each module and the entire machine, further enhancing the overall automation of the device, improving testing efficiency, and increasing testing accuracy. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the appearance of the chip testing device provided in this embodiment;

[0018] Figure 2 This is one of the schematic diagrams of the chassis structure of the chip testing device provided in this embodiment;

[0019] Figure 3 This is the second schematic diagram of the chassis structure of the chip testing device provided in this embodiment;

[0020] Figure 4 This is a schematic diagram of the chip module under test in the chip testing device provided in this embodiment, showing its pulled-out state.

[0021] Figure 5 This is a schematic diagram of the pull-out state of the lifting liquid cooling module of the chip testing device provided in this embodiment;

[0022] Figure 6This is a schematic diagram of the structure of the first region of the chip testing device provided in this embodiment;

[0023] Figure 7 This is one of the structural schematic diagrams of the second area of ​​the chip testing device provided in this embodiment;

[0024] Figure 8 This is a schematic diagram of the structure of the second area of ​​the chip testing device provided in this embodiment. Figure 2 ;

[0025] Figure 9 This is a partial structural diagram of the chip module under test in the chip testing device provided in this embodiment;

[0026] Figure 10 This is a schematic diagram of the test carrier structure of the chip testing device provided in this embodiment;

[0027] Figure 11 This is a schematic diagram of the chip testing device cover plate structure provided in this embodiment;

[0028] Figure 12a This is one of the schematic diagrams of the backplane structure of the chip testing device provided in this embodiment;

[0029] Figure 12b This is the second schematic diagram of the backplane structure of the chip testing device provided in this embodiment;

[0030] Figure 13 This is a schematic diagram of the connection structure between the backplane and the buckle of the chip testing device provided in this embodiment;

[0031] Figure 14 This is a schematic diagram of the lifting mechanism structure of the chip testing device provided in this embodiment;

[0032] Figure 15 This is a schematic diagram of the lifting carrier structure of the chip testing device provided in this embodiment.

[0033] Icons: 10-Chassis; 10A-Section 1; 10B-Section 2; 101-Top Plate; 102-Bottom Plate; 102a-Hole; 103-Side Plate; 104-Dustproof Screen; 105-Guide Rail; 106-Back Plate; 106a-Second Connector; 106b-Power Connector; 106c-Guide Pin; 106d-Functional Interface; 11-DUT Module; 110-Test Carrier; 111-Snap-on Plate; 112-First Connector; 1 13-PCB board; 114-Third connector; 12-Lifting liquid cooling module; 120-Handle; 121-Front panel; 122-Display screen; 123-Button; 124-Lifting mechanism; 125-Lifting carrier; 126-Pulley; 13-Auxiliary module; 14-Heat dissipation module; 15-Drive module; 16-Control module; 17-Interface board; 18-Water shut-off switch; F1-First direction; F2-Second direction; F3-Third direction. Detailed Implementation

[0034] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0035] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] It should also be noted that, unless otherwise explicitly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] Please refer to Figure 1As shown, this application provides a chip testing device, including: a chassis 10, a backplate 106 disposed inside the chassis 10 along a first direction F1 to divide the chassis 10 into a first area 10A and a second area 10B along a second direction F2. At least two lifting liquid cooling modules 12 and at least two chip modules 11 under test are stacked from bottom to top in the first area 10A along a third direction F3. The chip modules 11 under test are pulled out and connected to the chassis 10. The lifting liquid cooling modules 12 dissipate heat from the chip modules 11 under test. The first area 10A and the second area 10B are communicatively connected through the backplate 106 to ensure that the chip modules 11 under test can complete high and low temperature tests while operating normally.

[0038] In the second zone 10B, a drive module 15 and an auxiliary module 13 are stacked from bottom to top along the third direction F3. A control module 16 is arranged on the same layer as the drive module 15, and a heat dissipation module 14 is arranged on the same layer as the auxiliary module 13. The drive module 15 is connected to the lifting liquid cooling module 12 to realize the lifting of the lifting liquid cooling module 12. The auxiliary module 13 is connected to the chip under test module 11 to ensure the normal operation of the chip under test module 11. The heat dissipation module 14 dissipates heat from the control module 16. The control module 16 is electrically connected to the chip under test module 11, the lifting liquid cooling module 12, the drive module 15, the auxiliary module 13, and the heat dissipation module 14 respectively. The first direction F1, the second direction F2, and the third direction F3 are perpendicular to each other.

[0039] like Figure 2 , Figure 3 As shown, the chassis 10 is a standard 4U chassis size to fit with server racks, allowing for easy stacking within the rack. This application allows multiple chip testing devices to be stacked in a rack, with each device capable of cooling at least two chip modules 11 under test. Stacking multiple chip testing devices saves space; furthermore, stacked devices can simultaneously cool multiple sets of chip modules 11 under test, improving testing efficiency.

[0040] For example, the chassis 10 includes a base plate 102, a side plate 103, and a top plate 101. The base plate 102, side plate 103, and top plate 101 are connected by screws, providing good structural stability. The chassis 10 is a semi-enclosed structure with openings at the front and rear ends along the second direction F2. The front opening of the chassis 10 facilitates the pushing and pulling of the chip under test module 11 and the lifting liquid cooling module 12, while the rear opening facilitates setup. Figure 7 The interface board 17 is used to interface with the customer's equipment.

[0041] The side panel 103 can be configured as a perforated plate, which can relieve stress, reduce the weight of the chassis 10, and facilitate heat dissipation. A dustproof mesh 104 is covered on the outside of the side panel 103 for dust protection; a guide rail 105 is installed on the outside of the dustproof mesh 104 so that the chassis 10 can be easily pushed into the rack. The bottom plate 102 has holes 102a to accommodate the pulleys 126 for lifting the liquid cooling module 12. Figure 13 The relative positions of the chassis 10 and the lifting liquid cooling module 12 are fixed by the cooperation of the pulley 126 and the hole 102a, and the lifting liquid cooling module 12 can be pushed into the chassis 10 by the pulley. The pulley 126 at the bottom of the lifting liquid cooling module 12 cooperates with the chassis 10, and the guide rail 105 on the side plate 103 of the chassis 10 cooperates with the cabinet. This reduces the manual load when pushing the lifting liquid cooling module 12 into the chassis 10 and the chip testing device as a whole into the cabinet, and makes the chip testing device structurally stable. Through testing, the chassis 10 is subjected to a force of 1600N on one side, the maximum deformation is about 0.03mm, and the average deformation of the middle part is about 0.023mm.

[0042] like Figure 3 As shown, a back panel 106 is provided inside the chassis 10. The back panel 106 is arranged along the first direction F1 of the chassis 10. The back panel 106 divides the interior of the chassis 10 into a first area 10A and a second area 10B along both sides of the back panel 106. The first area 10A and the second area 10B are arranged side by side along the second direction F2. For example, in this application, the first direction F1 is the width direction of the chassis 10, the second direction F2 is the length direction of the chassis 10, the first area 10A is located at the front end of the chassis 10, and the second area 10B is located at the rear end of the chassis 10.

[0043] During high and low temperature testing of AI chips, it is crucial to ensure the chip's normal operation while simultaneously addressing its heat dissipation to prevent damage. This is because current testing equipment typically uses a heat sink for cooling, and contact between the heat sink and the chip under test (DUT) is usually achieved through a pressing mechanism, which presses the heat sink onto the DUT. However, the pressing mechanism itself has weight, posing a risk of damaging the DUT.

[0044] In this application, as Figures 4-6As shown, within the first zone 10A, a lift-up liquid cooling module 12 and a chip under test (DUT) module 11 are stacked along the third direction F3, i.e., the height direction of the chassis 10. The lift-up liquid cooling module 12 dissipates heat from the DUT module 11. Thermally conductive material is installed on the contact surface between the lift-up liquid cooling module 12 and the DUT module 11. This material fills the tiny gaps between them, enhancing heat dissipation. The DUT module 11 is located above the lift-up liquid cooling module 12. Therefore, this arrangement facilitates the replacement of the thermally conductive material and avoids the weight of the lift-up liquid cooling module 12 from putting pressure on the DUT module 11, reducing the likelihood of damage.

[0045] like Figure 4 In this application, the chip under test (DUT) module 11 is connected to the chassis 10 via a pull-out mechanism. This allows the DUT module 11 to be easily removed from the chassis 10 for performance testing of different DUT chips. For example, the DUT module 11 and the backplane 106 can be communicatively connected for performance testing of the DUT module 11.

[0046] The lift-up liquid cooling module 12 can be raised and lowered within the chassis 10 along the third direction F3. When the lift-up liquid cooling module 12 is raised to a position where it is in contact with the chip under test (DUT) module 11, it can dissipate heat from the DUT module 11. When the lift-up liquid cooling module 12 is lowered to a position where there is a gap between it and the DUT module 11, it is easy to pull the DUT module 11 out of the chassis 10, allowing for the replacement of different DUT modules for performance testing. After replacing the DUT module, the DUT module 11 is pushed back into the chassis 10, and the lift-up liquid cooling module 12 is raised again to a position where it is in contact with the DUT module 11 to dissipate heat. This process is repeated, achieving both performance testing and heat dissipation of the DUT module 11.

[0047] The present application has at least two chip-under-test modules 11 and two liquid cooling modules 12. The chip-under-test modules 11 and liquid cooling modules 12 are set in a one-to-one correspondence. When there are multiple chip-under-test modules 11 and liquid cooling modules 12, multiple sets of chip-under-test modules 11 can be tested for performance and heat dissipation at the same time, so as to improve the testing efficiency in a limited space.

[0048] like Figure 4 , Figure 5 As shown, there are two of each of the chip under test (DUT) module 11 and the lifting liquid cooling module 12, symmetrically arranged along the first direction F1. These two DUT modules 11 and lifting liquid cooling modules 12 can share resources. Figure 7 , Figure 8 The control module 16 and interface board 17.

[0049] In the second zone 10B, a drive module 15 and an auxiliary module 13 are stacked along the third direction F3. A heat dissipation module 14 is arranged on the same layer as the auxiliary module 13, and a control module 16 is arranged on the same layer as the drive module 15.

[0050] The auxiliary module 13 works in conjunction with the chip under test module 11 to ensure its normal operation. The drive module 15 is connected to the lifting liquid cooling module 12 and drives it to move up and down. The heat dissipation module 14 can be a cooling fan used to dissipate heat from the motherboard within the control module 16. The control module 16 is electrically connected to the chip under test module 11, the auxiliary module 13, the lifting liquid cooling module 12, and the heat dissipation module 14 to automatically control these modules and the entire device, enabling them to work in coordination. A water cut-off switch 18 is also provided on one side of the control module 16 along the first direction F1. The control module 16 is electrically connected to the water cut-off switch 18, which controls the water circuit operation of the chip testing device.

[0051] In addition, the module of this application is laid out in two layers along the third direction F3. The two layers are designed with a step difference, with the lower layer protruding from the upper layer. The protruding part of the lower layer is the interface board 17. The chip testing device of this application interfaces with the customer's equipment through the interface board 17.

[0052] The interface board 17 is set on the same layer as the driver module 15. Along the second direction F2, at the end away from the chip module 11 under test, the interface board 17 protrudes from the auxiliary module 13 to form a step-type design. The step-type design can be perfectly integrated with the customer's equipment in a limited space.

[0053] In summary, the chip testing device provided in this application is designed with an independent chassis 10. The chassis 10 has standard 4U chassis dimensions in both width and height, and can be placed in a standard ORv3 rack. A single chassis 10 can perform performance testing on at least two chip modules 11 under test. When multiple chassis 10 are stacked in a rack, multiple sets of chip modules 11 under test can be tested, which greatly improves testing efficiency. The chassis 10 is easy to stack in a rack and can be flexibly configured according to actual needs to meet different testing requirements. The lifting liquid cooling module 12 adopts an automatic lifting mode to dissipate heat from the chip modules 11 under test, greatly improving testing efficiency; by dissipating heat from the chip modules 11 under test, the normal operation of the chip modules 11 under test is ensured. This application adopts a modular design and reasonable layout within the chassis 10, which ensures that the chip modules 11 under test can complete high and low temperature tests while operating normally in a limited space. It also facilitates disassembly, simplifies the original complex loading process, and reduces the skill requirements for operators. Meanwhile, the control module 16 enables automated control of other modules and the entire machine, further enhancing the overall automation of the device, improving testing efficiency, and increasing testing accuracy.

[0054] Specifically, refer to Figures 9-11 As shown, the chip under test module 11 includes a test carrier 110, on which a test chip and a mounting plate 111 are disposed. The chip side of the chip under test module 11 faces the lifting liquid cooling module 12, so that the chip under test module 11 is pushed into the chassis 10 with the test chip facing down, so as to fit with the lifting liquid cooling module 12 and dissipate heat from the chip under test.

[0055] like Figure 12a , Figure 13 As shown, a first connector 112 is provided at the end of the buckle 111 facing the back plate 106, and a second connector 106a is provided at the end of the back plate 106 facing the buckle 111. When the chip module under test 11 is pushed into the chassis 10, the first connector 112 is inserted into the second connector 106a of the back plate 106 to realize the communication connection between the chip module under test 11 and the back plate 106 for performance testing of the chip under test.

[0056] The connection between the backplate 106 and the buckle plate 111 can save cables, increase the internal space of the chassis 10, and facilitate the installation of multiple sets of chip under test modules 11 and corresponding lifting liquid cooling modules 12 inside the chassis 10, while also dissipating heat from multiple sets of chips under test.

[0057] A power connector 106b and a guide pin 106c are also provided on the side of the backplate 106 facing the chip module under test 11. A power interface is correspondingly provided on the side of the chip module under test 11 facing the backplate 106. When the first connector 112 and the second connector 106a are blindly inserted, the power interface of the chip module under test 11 is also inserted into the power connector 106b of the backplate 106 to achieve electrical connection to the chip module under test 11. The guide pin 106c facilitates the alignment and precise insertion of the chip module under test 11 with the backplate 106.

[0058] like Figure 12b As shown, the backplate 106 is designed with a variety of different functional interfaces 106d on the side away from the chip module 11 under test, that is, the side of the backplate 106 facing the second area 10B. This allows the modules in the first area 10A and the second area 10B on the front and back of the backplate 106 to communicate with each other, thereby saving most of the cables used in the existing cable connection, increasing the internal space of the chassis 10, making the inside of the chassis 10 neater, and reducing risk points.

[0059] For the lifting liquid cooling module 12, such as Figure 14 , Figure 15 As shown, it includes a lifting carrier 125, a lifting mechanism 124, a liquid cooling module, and a jumper module. The lifting carrier 125 can push the entire lifting liquid cooling module 12 into the chassis 10 or pull it out from the chassis 10. The lifting mechanism 124 is mounted on the lifting carrier 125 and is used to lift the liquid cooling module so that the liquid cooling module and the chip under test can come into contact to achieve the best heat dissipation effect.

[0060] In some embodiments, the liquid cooling module includes a heat dissipation plate. The purpose of the lifting mechanism 124 is to lift the heat dissipation plate. The heat dissipation plate is positioned relative to the chip under test and is of similar size. When the lifting mechanism 124 lifts the heat dissipation plate, the chip under test can be cooled in a targeted manner, resulting in good heat dissipation effect.

[0061] The lifting mechanism 124 is also equipped with a jumper module, which is used to connect to the interface of the PCB board 113 in the chip under test module 11. For example, the interface of the PCB board 113 of the chip under test module 11 is provided with a third connector 114, and the corresponding fourth connector is provided on the buckle plate 111. The jumper module is designed with multiple jumper boards. The rear end of the jumper board is fixedly connected to the fourth connector that needs to be connected by a cable, and the front end is plugged into the third connector 114, so that the connection or disconnection between the PCB board 113 in the chip under test module 11 and the buckle plate 111 can be realized.

[0062] This application achieves two-stage lifting via the lifting mechanism 124. The lifting mechanism 124 performs a single-stage lifting for the liquid cooling module and a two-stage lifting for the jumper module. In specific applications, the lifting mechanism 124 first drives the liquid cooling module and the jumper module to rise synchronously in a single-stage lifting motion, bringing the liquid cooling module into contact with the chip under test. At this point, the jumper module is not yet plugged into the interface of the PCB board 113 of the chip under test module 11. Then, the motor inside the jumper module drives the jumper module itself to rise in a second-stage lifting motion, completing the plugging of the jumper module into the interface of the PCB board 113 of the chip under test module 11.

[0063] There can be multiple jumper modules. When performing performance testing on the chip under test, some or all of the jumper modules can be raised as needed to connect with the interface of the PCB board 113 of the chip under test module 11.

[0064] Specifically, the chip under test (DUT) module 11 establishes a communication connection between the backplate 111 and the PCB board 113 via a jumper module. The backplate 111 is also connected to the backplane 106. The auxiliary module 13 is connected to both the backplane 106 and the interface board 17 to export the signals from the DUT module 11 via the interface board 17, thereby enabling performance testing of the DUT module 11. Other modules follow the same setup and will not be described further.

[0065] In addition, since the push-pull operation of the lifting liquid cooling module 12 is a low-frequency operation, it only needs to be pulled out of the chassis 10 when the heat-conducting material is replaced or when the lifting liquid cooling module 12 fails. In order to facilitate the replacement of the heat-conducting material, the lifting liquid cooling module 12 is designed as a push-pull mechanism. When the lifting liquid cooling module 12 is pulled out and connected to the chassis 10, a handle 120 is installed on the front panel 121 of the lifting liquid cooling module 12 at the front end along the second direction F2 to facilitate the pull-out operation.

[0066] The front panel 121 is also equipped with a display screen 122 for displaying pressure values, a button 123 for starting and resetting the chip testing device, and other functional accessories to perform corresponding functions.

[0067] The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A chip testing apparatus characterized by comprising: The application relates to a cabinet, wherein a backboard is arranged in the cabinet along a first direction to divide the cabinet into a first area and a second area side by side along a second direction; at least two lifting liquid cooling modules and at least two chip modules to be tested are stacked from bottom to top along a third direction in the first area; the chip modules to be tested are connected to the cabinet in a drawing manner; the lifting liquid cooling modules are used for heat dissipation of the chip modules to be tested; and the first area and the second area are connected in communication through the backboard to ensure that the chip modules to be tested are in normal operation while completing high-low temperature tests. The second area is stacked from bottom to top along the third direction with a driving module and an auxiliary module; the driving module is arranged with a control module in the same layer; the driving module is connected with the lifting liquid cooling module to realize lifting of the lifting liquid cooling module; the auxiliary module is connected with the chip modules to be tested to ensure normal operation of the chip modules to be tested; the control module is electrically connected with the chip modules to be tested, the lifting liquid cooling module, the driving module and the auxiliary module respectively; and the first direction, the second direction and the third direction are perpendicular to each other. The chip modules to be tested comprise a test carrier, the test carrier is provided with a buckle plate and a chip to be tested; the lifting liquid cooling module comprises a lifting carrier, a lifting mechanism arranged on the lifting carrier and a liquid cooling module arranged on the lifting mechanism; the lifting mechanism lifts the liquid cooling module to make the liquid cooling module and the chip to be tested contact; a jumper module is further arranged on the lifting mechanism; the chip modules to be tested comprise a PCB (printed circuit board); the jumper module connects the PCB and the buckle plate; the lifting mechanism realizes one-stage synchronous lifting of the liquid cooling module and the jumper module and realizes two-stage lifting of the jumper module to make the jumper module and the PCB realize plug-in connection.

2. The chip testing apparatus according to claim 1, wherein One side of the chip modules to be tested provided with the chip to be tested faces the lifting liquid cooling module; a first connector is arranged on the end of the buckle plate facing the backboard; a second connector is arranged on the end of the backboard facing the buckle plate; the first connector and the second connector are plugged in to realize communication connection of the chip modules to be tested and the backboard.

3. The chip testing apparatus according to claim 2, wherein A power connector is further arranged on the side of the backboard facing the chip modules to be tested; a power interface is correspondingly arranged on the side of the chip modules to be tested facing the backboard; the power interface of the chip modules to be tested and the power connector of the backboard are plugged in to realize electrical connection of the chip modules to be tested.

4. The chip testing apparatus according to claim 1, wherein A third connector is arranged on the PCB of the chip modules to be tested; a fourth connector is arranged on the buckle plate; a jumper plate is arranged on the jumper module; one end of the jumper plate is used for plugging in the fourth connector and the other end is used for plugging in the third connector.

5. The chip testing apparatus according to claim 1, wherein The lifting carrier is connected to the cabinet in a drawing manner; a pulley is arranged on the lifting carrier; a hole is arranged in the cabinet; the relative position of the lifting liquid cooling module and the cabinet is fixed through cooperation of the pulley and the hole.

6. The chip testing apparatus according to claim 1, wherein The driving module is further provided with an interface plate outside the equipment along the second direction away from one end of the chip module to be tested, and the interface plate protrudes from the auxiliary module.

7. The chip testing apparatus according to claim 1, wherein A guide rail is arranged on one side of the cabinet along the second direction, and the cabinet is matched with the cabinet through the guide rail.

8. The chip testing apparatus according to any one of claims 1 to 7, characterized by The auxiliary module is further provided with a heat dissipation module on the same layer, the heat dissipation module dissipates heat of the control module, and the control module is electrically connected with the heat dissipation module.

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