Processing apparatus and article manufacturing method

Abstract

The invention discloses a processing apparatus and an article manufacturing method. A processing apparatus performs a predetermined process on a substrate. The apparatus includes a driver configured to drive a stage holding a substrate, a first controller configured to operate at a first frequency and control the driver, a second controller configured to operate at a second frequency higher than the first frequency and generate a command based on a position of the stage, and a device configured to execute one of a predetermined process and a preparation process of the predetermined process in response to the command.

Description

Technical Field

[0001] The present invention relates to a processing device and an article manufacturing method. Background Art

[0002] In a substrate stage device, the position of the substrate can be detected based on the position of the stage and the position of a mark on the substrate detected using a scope (camera) (relative position within the field of view of the scope). Recently, in order to improve the throughput, the position of the substrate can be measured while the stage is moved.

[0003] However, when detecting the position of the substrate while moving the stage, the mark needs to be imaged immediately when it enters the field of view of the observer. When a high-power observer is used, the field of view becomes dark. Therefore, when the stage is moved at a higher speed, high-brightness illumination is required to detect the position of the substrate. Flash photography can be performed using multiple light emitting diodes (LEDs). When performing flash photography, misalignment may occur in the image due to the light emission timing error between multiple LED tubes. Japanese Patent Publication No. 2007-10734 discloses a method for correcting the timing of light emission triggering so that the emission timing of multiple LEDs is consistent with each other.

[0004] Moreover, when the position of the substrate is detected while the stage is moved, if the imaging time of the mark is long, the image of the mark is stretched. To solve this problem, Japanese Patent Publication No. 2015-233106 discloses a method of outputting a short-time gate signal when the mark falls within the detection range and capturing an instantaneous image of the mark. In addition, the mark may deviate from the field of view due to the substrate arrangement error and may not be imaged. To prevent this, Japanese Patent Publication No. 2007-10735 discloses a method of precalculating the average value of the substrate position error amount relative to the mark measurement unit, and when the position error amount deviates from the allowable value of the position error amount, adjusting the position of the camera unit.

[0005] However, when detecting the position of the substrate while moving the stage, conventional devices can only issue imaging commands in units of the stage control frequency of the stage control board, and the actual imaging command timing is offset relative to the ideal imaging command timing. Due to the offset of the imaging command timing, the mark deviates from the field of view of the observer and cannot be imaged. Conventionally, it is difficult to accurately process the substrate when the stage is moving. Summary of the invention

[0006] The present invention provides a technique that facilitates accurate processing of a substrate even when a stage is moved.

[0007] A first aspect of the present invention provides a processing device that performs a predetermined process on a substrate, the processing device comprising: a driver configured to drive a table that holds the substrate; a first controller configured to operate at a first frequency and control the driver; a second controller configured to operate at a second frequency and generate a command based on a position of the table, the second frequency being higher than the first frequency; and a device configured to perform one of a predetermined process and a preparatory process for the predetermined process in response to the command.

[0008] The second aspect of the present invention provides a method for manufacturing an article, comprising: a processing device, which is designated as the first aspect and is configured as an exposure device, wherein the exposure device is configured to print a pattern onto a substrate by projecting the pattern of a master onto the substrate; developing the substrate that has been exposed; and processing the substrate that has been developed to obtain an article.

[0009] The third aspect of the present invention provides a method for manufacturing an article, comprising: transferring a second substrate to a first substrate by a processing device as specified in the first aspect and configured to perform the transfer; and processing the structure of the second substrate transferred to the first substrate by the transfer, thereby obtaining the article.

[0010] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a view showing the arrangement of an exposure apparatus according to a first embodiment;

[0012] Figure 2 is a block diagram showing an arrangement associated with position control of a substrate stage in an exposure apparatus according to a first embodiment;

[0013] Figure 3 is a sequence diagram illustrating the sequence of a detection process for detecting the position of a mark in the exposure device according to the first embodiment;

[0014] Figure 4 is a block diagram showing an arrangement associated with position control of a substrate stage in an exposure apparatus according to a second embodiment;

[0015] Figure 5 is a block diagram showing an arrangement associated with position control of a substrate stage in an exposure apparatus according to a third embodiment;

[0016] Figure 6 is a diagram illustrating the relationship between the fields of view and the marks of the first mark detection system and the second mark detection system;

[0017] Figure 7is a view showing an arrangement example of a laser irradiation system as a processing apparatus according to a fourth embodiment; and

[0018] Figure 8 is a block diagram showing an arrangement associated with position control of a substrate stage in a laser irradiation system according to a fourth embodiment. DETAILED DESCRIPTION

[0019] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. A plurality of features are described in the embodiments, but the invention requiring all such features is not limited, and a plurality of such features may be appropriately combined. In addition, in the accompanying drawings, the same reference numerals are given to the same or similar configurations, and their repeated descriptions are omitted.

[0020] Figure 1 The arrangement of the exposure device 100 according to the first embodiment is shown. The exposure device 100 is an example of a processing device that performs a predetermined process on a substrate. The exposure device 100 performs an exposure process as the predetermined process. Here, the exposure device 100 will be described as an example of a processing device. However, the processing device may be configured as another device, such as a device that chemically or mechanically processes a substrate, a device that arranges or supplies a solid or liquid at a predetermined position on a substrate, or a device that inspects a substrate.

[0021] The exposure device 100 can be configured as a scanning exposure device, for example, but can also be configured as another type of exposure device. The exposure device 100 can be configured to print the pattern of the master 112 onto the substrate 114. More specifically, the exposure device 100 includes a projection optical system 120 that projects the pattern of the master 112 onto the substrate 114. A printed image corresponding to the pattern of the master 112 is formed on the substrate 114 by an exposure process. The substrate 114 has a photoresist, and the printed image can be formed on the photoresist as a latent image. The latent image can be converted into a resist pattern used as a physical pattern by a development step.

[0022] The exposure apparatus 100 may include a user interface 104. A user such as an operator may operate the user interface 104 to input various information to the exposure apparatus 100.

[0023] The arrangement of the exposure device 100 will be described in more detail below. Figure 1, the X-coordinate, the Y-coordinate, and the Z-coordinate are defined so that the direction parallel to the optical axis of the projection optical system 120 and toward the master 112 from the substrate 114 is used as the Z-axis, and the direction orthogonal to the Z-axis is used as the Y-axis and the X-axis. The light source 101 emits exposure light. The light source 101 can be controlled by a light source controller 102 controlled by a main controller 103. The exposure light emitted from the light source 101 is shaped into a predetermined beam shape by a shaping optical system (not shown) of the illumination optical system 122. The shaped beam enters an optical integrator (not shown), and the optical integrator forms a plurality of secondary light sources for illuminating the master 112 with a uniform illumination distribution.

[0024] The illumination optical system 122 may include an aperture stop 126 that determines the numerical aperture (NA) of the illumination optical system 122. The aperture stop 126 has a substantially circular aperture. The numerical aperture (NA) of the illumination optical system 122 is controlled by controlling the diameter of the aperture by the illumination optical system controller 105 controlled by the main controller 103. The ratio of the numerical aperture of the illumination optical system 122 to the numerical aperture of the projection optical system 120 is called a coherence factor (σ value). The optical system controller 105 can set the σ value by controlling the aperture stop 126 of the illumination optical system 122.

[0025] The half mirror 121 is inserted in the optical path of the illumination optical system 122. A portion of the exposure light for illuminating the master 112 can be reflected and extracted by the half mirror 121. The light sensor 123 is inserted in the optical path of the reflected light of the half mirror 121, and can detect the intensity (exposure energy) of the exposure light. The illumination optical system 122 may include a shutter unit 129 for controlling the irradiation of the exposure light to the substrate 114. The shutter unit 129 may be controlled by the optical system controller 105 controlled by the main controller 103.

[0026] The master 112 may be held by a master stage 113. For example, by driving the master stage 113 in the Y-axis direction by the driver 108, the master 112 may be driven in the Y-axis direction (scanning direction). A pattern of a device to be manufactured is formed on the master 112. The illumination optical system 122 illuminates the pattern of the master 112 with exposure light. The projection optical system 120 reduces the image of the pattern of the master 112 at a reduction ratio β, and projects the reduced image onto the substrate 114. Thus, the photoresist of the substrate is exposed, so that a printed image of the pattern of the master 112 is formed on the photoresist.

[0027] An aperture stop 124 having a substantially circular aperture is arranged on a pupil plane (a Fourier transform plane relative to an object plane serving as a plane on which the master 112 is arranged) of the projection optical system 120. The diameter of the aperture of the aperture stop 124 can be controlled by a driver 111 such as a motor. The projection optical system 120 includes one or more optical elements 125. The optical characteristics of the projection optical system 120 can be adjusted by driving the one or more optical elements 125 by the driver 110. The drivers 110 and 111 can be controlled by a projection system controller 106 controlled by the main controller 103.

[0028] The substrate 114 is held by a substrate stage 115. The substrate stage 115 can be driven by a driver 109 about the X-axis, Y-axis, and Z-axis directions and rotate around these axes. The driver 109 that drives the substrate stage 115 and the driver 108 that drives the master stage 113 are controlled by a stage controller 107 controlled by the main controller 103. When the exposure device 100 is configured as a scanning exposure device, the stage controller 107 controls the drivers 108 and 109 so as to synchronously scan the substrate stage 115 and the master stage 113. A moving mirror or a scale can be provided on the substrate stage 115 as a measurement target 117. By detecting the displacement of the measurement target 117 in the X-axis, Y-axis, and Z-axis directions by a laser interferometer or an encoder used as a measuring instrument 116, the position of the substrate stage 115 in the X-axis, Y-axis, and Z-axis directions and the rotation angle around these axes can be detected. The stage controller 107 can feedback control the position and rotation angle of the substrate stage 115 based on the detection result of the measuring instrument 116.

[0029] The exposure device 100 may include a focus detection system 118. The focus detection system 118 may include a light projection system, through which a plurality of light beams having a wavelength to which the photoresist of the substrate 114 is not sensitive to light enters the substrate 114 obliquely, and a light receiving system, which detects light reflected by the substrate 114. The light receiving system has a light receiving element that receives the plurality of light beams. By detecting the light receiving position of each light beam, the position of the substrate 114 in the Z-axis direction may be detected.

[0030] The exposure device 100 may include a first mark detection system 127 and / or a second mark detection system 128. The first mark detection system 127 may include one or more first scopes that detect the relative position between the mark of the master 112 and the mark of the substrate 114 via the projection optical system 120. The relative position between the mark of the master 112 and the mark of the substrate 114 may be detected using each first scope of the first mark detection system 127. The first mark detection system 127 may include a drive system that drives each first scope along the XY plane. The second mark detection system 128 is arranged between the projection optical system 120 and the substrate stage 115, and may include one or more second scopes that detect the position of the mark of the substrate 114. The second mark detection system 128 may include a drive system that drives each second scope along the XY plane. The exposure device 100 may detect the positions of a plurality of marks simultaneously using the first scope and the second scope. Based on the results detected using the first scope and the second scope, the main controller 103 may detect the position error and shape error between the substrate 114 and the master 112, the deformation of the substrate 114, and the like. Moreover, the main controller 103 can control the exposure process while adjusting the speed and position of the master stage 113 and the substrate stage 115, the projection magnification of the projection optical system 120, etc. based on the position error and shape error between the substrate 114 and the master 112, the deformation of the substrate 114, etc.

[0031] One or more first observers of the first mark detection system 127 and one or more second observers of the second mark detection system 128 may be understood as optical devices for performing a preparatory process (mark detection process) for a predetermined process (exposure process) on the substrate 114. Alternatively, the predetermined process for the substrate 114 may be regarded as a detection process for a mark of the substrate 114. In this case, one or more first observers of the first mark detection system 127 and one or more second observers of the second mark detection system 128 may be understood as optical devices for performing a predetermined process (mark detection process) on the substrate 114. Alternatively, the illumination optical system 122 or the shutter unit 129 (or the optical system controller 105 that controls the shutter unit 129) may be understood as a device for performing a predetermined process (exposure process) on the substrate 114. More specifically, the illumination optical system 122 or the shutter unit 129 may be understood as a device for controlling the start (timing) and end (timing) of exposure of the substrate 114. The second controller 136 may be configured to transmit commands to start and end exposure to the optical system controller 105 based on the position of the substrate stage 115 .

[0032] Figure 2 1 shows an arrangement associated with position control of the substrate stage 115 in the exposure apparatus 100. Figure 2Although not shown in FIG. 1 , the exposure device 100 may have a similar arrangement associated with position control of the master stage 113. More specifically, the stage controller 107 controlled by the main controller 103 may control the master stage 113 by controlling the driver 108. This arrangement may be Figure 2 The driver 109, substrate stage 115, and measuring instrument 116 in FIG. 1 are replaced with an arrangement of a driver 108, a master stage 113, and a measuring instrument (not shown; a measuring instrument that measures the position of the master stage 113).

[0033] As described above, the exposure device 100 used as a processing device may include the substrate stage 115 holding the substrate, the driver 109 driving the substrate stage 115, the stage controller 107 controlling the driver 109, and the measuring instrument 116. The exposure device 100 may further include the scope controller 131 which controls the first mark detection system 127 and the second mark detection system 128 as optical devices for performing a predetermined process or a preparatory process for the predetermined process on the substrate 114. The scope controller 131 may also be understood as a device for performing a preparatory process (mark detection process) for performing a predetermined process (exposure process) on the substrate 114. The exposure device 100 may further include the main controller 103 of the console controller 107. In addition to the stage controller 107, the main controller 103 may control the light source controller 102, the optical system controller 105, the projection system controller 106, the scope controller 131, the user interface 104, and the like.

[0034] The stage controller 107 may include a first controller 135 and a second controller 136. The first controller 135 operates at a first frequency and controls the driver 109. The fact that the first controller 135 operates at the first frequency means that the frequency of a clock for operating the first controller 135 is the first frequency. The second controller 136 operates at a second frequency higher than the first frequency, and generates a command based on the position of the substrate stage 115. The fact that the second controller 136 operates at the second frequency means that the frequency of a clock for operating the second controller 136 is the second frequency. The observer controller 131 is an example of a device for performing a preparation process in response to a command generated by the second controller 136.

[0035] The main controller 103 inputs a position target value to the first controller 135. Based on the difference (control deviation) between the position target value input from the main controller 103 and the position information of the substrate stage 115 input from the measuring instrument 116, the first controller 135 can generate a command value (e.g., a current command value) to be input to the driver 109. The first controller 135 may include, for example, a subtractor 201 and a compensator (e.g., a PID compensator) 202. The subtractor 201 calculates the difference (control deviation) between the position target value input from the main controller 103 and the position information of the substrate stage 115 input from the measuring instrument 116. The compensator 202 generates a command value for the driver 109 based on the output from the subtractor 201. The first controller 135 may receive the output (position information) from the measuring instrument 116 at a first frequency and generate a command value for the driver 109 at the first frequency. From another point of view, the first controller 135 may receive the output (position command value) from the main controller 103 and the output (position information) from the measuring instrument 116 at a first frequency, and generate a command value to the driver 109 at the first frequency based on these outputs. The first frequency may be determined based on the control frequency band of the substrate stage 115. If the first frequency is too high, the above-described operation cannot be completed within each cycle of the first frequency, and the substrate stage 115 cannot be properly controlled.

[0036] The main controller 103 may be configured to send the mark detection position to the second controller 136 via the first controller 135. Alternatively, the main controller 103 may be configured to send the mark detection position directly to the second controller 136. The mark detection position is the position of the substrate stage 115 at the timing at which the mark needs to be detected by the first mark detection system 127 (the first observer) and / or the second mark detection system 128 (the second observer). The timing at which the mark needs to be detected may be the timing in the period when the substrate stage 115 (substrate 114) is accelerated, or may be the timing in the period when the substrate stage 115 (substrate 114) is driven at a constant speed.

[0037] The second controller 136 operates at a second frequency higher than the first frequency at which the first controller 135 operates. The second controller 136 receives the output (position information of the substrate stage 115) from the measuring instrument 116 at the second frequency, and generates a detection command to the observer controller 131 based on the output. That is, since the second controller 136 operating at the second frequency generates the detection command, the detection command can be generated with a higher time resolution than the arrangement in which the first controller 135 operating at the first frequency generates the measurement command. The second frequency (the value) can be determined based on the detection command so that the first mark detection system 127 (the first observer) and / or the second mark detection system 128 (the second observer) can perform imaging.

[0038] In response to the detection command, the observer controller 131 controls the first mark detection system 127 (the first observer) and / or the second mark detection system 128 (the second observer) to perform a mark detection process (preparation process). Since the detection command generated with a high time resolution is input to the observer controller 131, the observer controller 131 can control the first mark detection system 127 and / or the second mark detection system 128 (the second observer) to perform imaging at a precise timing. That is, the first mark detection system 127 (the first observer) and / or the second mark detection system 128 (the second observer) can image the mark at the timing when the mark falls within the field of view.

[0039] The observer controller 131 may be configured to detect the position of the mark imaged by the first mark detection system 127 (the first observer) and / or the second mark detection system 128 (the second observer), and send the detection result to the main controller 103. The main controller 103 generates a position command value based on the output (mark position information) from the observer controller 131 to drive the substrate 114 to the target position, and sends the position command value to the first controller 135. Thus, the master 112 having a pattern to be printed on the substrate 114 is aligned with the substrate 114.

[0040] The second controller 136 may be configured to send detection parameter values ​​such as brightness, magnification, and accumulation time to the observer controller 131 in addition to the detection command. These detection parameter values ​​may be sent to the observer controller 131 together with the detection command, or may be sent to the observer controller 131 at a timing different from the timing of the detection command. The measurement parameter values ​​may be determined according to the driving conditions of the substrate stage 115. For example, when the driving speed of the substrate stage 115 is changed after a given mark is detected and before the next mark is detected, the brightness and accumulation time need to be changed to the brightness and accumulation time suitable for the driving speed of the substrate stage 115 when the next mark is detected. This can reduce the mark position detection error.

[0041] The main controller 103 can correct the mark position output from the observer controller 131 by using the position target value (mark detection position) of the substrate stage 115 at the timing of detecting the position of the mark and the position information of the substrate stage 115 at the time of the detection command. The corrected mark position P can be given by equation (1):

[0042] P=Pm+(Ps-Pt)...(1)

[0043] Wherein Pm is the mark position output from the scope controller 131 , Pt is the mark detection position, and Ps is the position of the substrate stage 115 at the timing when the detection command is generated.

[0044] Figure 3 The sequence of the detection process for detecting the position of the marker is illustrated. Figure 3 An example of the detection process is described. In step S212, the main controller 103 transmits a movement command to move the substrate stage 115 to the mark detection position (Pt) to the first controller 135. In step S232, the first controller 135 transmits the mark detection position to the second controller 136. In step S233, the first controller 135 moves the substrate stage 115 to the mark detection position.

[0045] In step S241, the second controller 136 monitors the position of the substrate stage 115 based on the output from the measuring instrument 116. In step S245, the second controller 136 stores the mark detection position received from the first controller 135 in step S232. In step S242, the second controller 136 waits until the position of the substrate stage 115 reaches the mark detection position. After the position of the substrate stage 115 reaches the mark detection position, the second controller 136 transmits an accumulation start signal to the observer controller 131 in step S243. Moreover, the second controller 136 transmits a detection parameter value to the observer controller 131. Note that the detection parameter value transmitted to the observer controller 131 can be optimized according to the driving state of the substrate stage 115.

[0046] In step S221, the observer controller 131 starts the mark detection process in response to the reception of the accumulation start signal transmitted from the second controller 136 in step S243. In step S222, the observer controller 131 starts the accumulation process (imaging) of the electric signal (charge) corresponding to the optical image of the mark according to the detection parameter value. In step S223, the observer controller 131 ends the accumulation process (imaging) according to the detection parameter value. In step S224, the observer controller 131 calculates the mark position (Pm) based on the obtained mark image, and transmits the mark position information (calculation result) to the main controller 103.

[0047] In step S213, the main controller 103 stores the marker position information received from the observer controller 131. In step S225, the observer controller 131 notifies the main controller 103 of the end of the marker detection process. In step S226, the observer controller 131 waits for the next detection command from the second controller 136 (step S243).

[0048] In step S214, the main controller 103 waits for a mark detection process end notification from the observer controller 131 (step S225), and after receiving the mark detection process end notification, ends the mark detection process. In step S246, the second controller 136 transmits the position (Ps) of the substrate stage 115 at the time of transmitting the detection command to the first controller 135. In step S244, the second controller 136 waits for a command from the first controller 135 to move to the next mark detection position (step S232).

[0049] In step S235, the first controller 135 transmits the position information of the substrate stage 115 to the main controller 103. In step S234, the first controller 135 waits for a command for driving to the next mark detection position transmitted from the main controller 103 (step S212).

[0050] In step S216, the main controller 103 stores the position information of the substrate stage 115 received from the first controller 135. In step S217, the main controller 103 calculates the corrected mark position based on the mark position (Pm) output from the observer controller 131, the mark detection position (Pt), and the position (Ps) of the substrate stage 115 when the detection command is transmitted. Moreover, the main controller 103 can determine the absolute position of the mark based on the corrected mark position (i.e., the mark position (relative position) within the field of view of the observer) and the position of the substrate stage 115 when the mark position is detected. In step S215, the main controller 103 transfers to the detection of the position of the next mark (step S212). The above process is repeatedly performed to detect the positions of multiple marks to be detected.

[0051] Figure 4 An arrangement associated with position control of the substrate stage 115 in the exposure device 100 according to the second embodiment is shown. Matters not mentioned in the second embodiment may be in accordance with the first embodiment. In the second embodiment, a stage position monitor 200 is provided to monitor the position of the substrate stage 115, and a second controller 136 is incorporated in the stage position monitor 200. The measuring instrument 116 includes, for example, an encoder that outputs a pulse signal when driving the substrate stage 115. The second controller 136 counts the pulse signal to measure the position of the substrate stage 115. The stage position monitor 200 (second controller 136) can be configured to operate at a frequency equal to or higher than the frequency of the pulse signal output from the encoder. Therefore, the position of the substrate stage 115 can be monitored at the minimum time resolution that the encoder can measure, and the mark can be imaged in a state where the mark falls within the field of view of the detection system (observer).

[0052] Figure 5The arrangement associated with the position control of the substrate stage in the exposure apparatus 100 according to the third embodiment is shown. Matters not mentioned in the third embodiment may be in accordance with the first embodiment or the second embodiment. In the third embodiment, the stage position monitor 200 is provided to monitor the position of the substrate stage 115, and the second controller 136 and the measuring instrument 116 are incorporated in the stage position monitor 200.

[0053] In the first to third embodiments, the first controller 135 may be configured to receive a detection parameter set for detecting the position of the mark from the main controller 103, and set the detection parameter set in the second controller 136. The detection parameter set may include information indicating the above-mentioned mark detection position. The second controller 136 may be configured to obtain the position of the substrate 114 from the measuring instrument 116 that measures the position of the substrate stage 115, and output a detection command to the observer controller 131 according to the detection parameter set set from the first controller 135.

[0054] The first controller 135 may be configured to receive a drive parameter set from the main controller 103 and output a command value to the driver 109 according to the drive parameter set. The drive parameter set may include, for example, the position, velocity, and acceleration of the substrate stage 115. The first controller 135 may feedback-control the substrate stage 115 based on the position target value of the substrate stage 115 and the current position of the substrate stage 115 measured by the measuring instrument 116. The current position of the substrate stage 115 measured by the measuring instrument 116 may be directly provided to the first controller 135 via the second controller 136, or directly provided to the first controller 135 from the measuring instrument 116.

[0055] A method of deciding the frequency of the clock at which the second controller 136 operates, that is, the second frequency, will be described. Figure 6 The relationship between the mark ccc and the field of view 500 of the observer of each of the first mark detection system 127 and the second mark detection system 128 is illustrated. Dx represents the amount of position error that can be allowed when the substrate stage 115 is driven in the X-axis direction. Dy represents the amount of position error that can be allowed when the substrate stage 115 is driven in the Y-axis direction. That is, Dx and Dy represent the amount of mark measurement position error that allows accurate detection of the position of the mark when the substrate stage 115 is driven in the X-axis direction or the Y-axis direction. Note that Dx and Dy represent the distance from the end of the mark ccc to the end of the field of view 500 when the mark ccc is arranged at the center of the field of view 500.

[0056] When the position of the mark is detected while the substrate stage 115 is moved, the allowable position error amounts Dx and Dy change according to the driving speed of the substrate stage 115. That is, if the driving speed of the substrate stage 115 is low, then even when the operating frequency (second frequency) of the second controller 136 is set to low, the position of the mark can be accurately detected. In contrast, if the driving speed of the substrate stage 115 is high, then the operating frequency (second frequency) of the second controller 136 needs to be set high. When determining the allowable position error amounts Dx and Dy, it is necessary to consider the movement amount of the mark within the field of view 500 during the accumulation period.

[0057] According to this, in order to accurately detect the position of the mark while moving the substrate stage 115, the second frequency f used as the operating frequency of the second controller 136 may be decided as follows.

[0058] First, the mark position error amount of both Dx and Dy is defined as D, the mark arrangement error is defined as Ep, the substrate arrangement error is defined as Es, the mark movement amount in the imaging period (accumulation period) is defined as Ds, and the driving speed of the substrate stage 115 is defined as v.

[0059] Then, setting v as the driving speed of the substrate stage 115, the position measurement period T of the substrate stage 115 desirably satisfies the condition given by the following relationship:

[0060] v×T<D-(Ds+Ep+Es)...(2)

[0061]

[0062] Therefore, the position measurement frequency f desirably satisfies the condition given by the following relationship. That is, the second frequency f used as the operating frequency of the second controller 136 is desirably determined according to the relationship (4):

[0063]

[0064] Figure 7 An arrangement example of a laser irradiation system LS as a processing device according to the fourth embodiment is shown. Figure 8 An example of the arrangement of a control system incorporated in the laser irradiation system LS is shown. In the fourth embodiment, the laser irradiation system LS is configured as a mass transfer device. The laser irradiation system LS may include a stage base 600, a first substrate stage 601, a second substrate stage 602, and a laser head 603. The first substrate stage 601 may hold a target substrate (first substrate) TS and be driven by a first driver (not shown). The second substrate stage 602 has a plurality of openings 602h and may be configured to hold a micro device substrate (second substrate) MDS in each opening 602h.

[0065] Each microdevice substrate MDS can have a plurality of microdevices. The second substrate stage 602 can be driven by a second driver (not shown). The laser beam emitted from the laser head 603 irradiates the microdevice to be transferred (not shown), and then the microdevice to be transferred can be separated from the microdevice substrate SB and transferred to the target substrate TS. That is, the laser irradiation system LS (mass transfer device) in this arrangement example adopts laser lift-off (LLO) technology to transfer microdevices. The laser irradiation system LS can be understood as a processing device that performs a predetermined process on the target substrate (first substrate) TS, and more specifically, performs a transfer process for transferring microdevices on the target substrate (first substrate) TS. The laser head 603 can be understood as a device that performs a predetermined process (transfer process).

[0066] The first substrate stage 601 is arranged on the stage base 600. The first substrate stage 601 holds the target substrate TS and is driven by the driver 109 to move and rotate on the stage base 600. The first substrate stage 601 is configured to be movable two-dimensionally along, for example, moving axes X and Y, and can move in, for example, a direction X1 (or direction X2) and a direction Y1 (or direction Y2). The axial direction of the moving axis X (for example, direction X1 or X2) intersects with the axial direction of the moving axis Y (for example, direction Y1 or Y2).

[0067] The second substrate stage 602 is disposed separately from the stage base 600, and is configured to hold the micro device substrate MDS and to be movable and rotatable relative to the first substrate stage 601. In the fourth embodiment, the second substrate stage 602 can move three-dimensionally along the movement axes X, Y, and Z so as to move in, for example, the direction X1 (or direction X2), the direction Y1 (or direction Y2), and the direction Z1 (or direction Z2).

[0068] The laser head 603 is disposed separately from the first substrate stage 601 and can emit a laser beam to the micro device to be transferred on the micro device substrate MDS held by the second substrate stage 602. Figure 7 In the example of FIG. 6 , the laser head 603 is configured to be movable in the direction X1 (or the direction X2 ) and the direction Y1 (or the direction Y2 ).

[0069] After the target substrate TS is held by the first substrate stage 601 and the plurality of micro device substrates MDS are held by the second substrate stage 602, the micro device transfer sequence may start. The main controller 103 may control the first substrate stage 601, the second substrate stage 602, and the laser head 603 according to preset processing parameters. Recently, a mass transfer apparatus used as a laser irradiation system LS is required to shorten the manufacturing process time. As one of the measures, for example, it is considered to transfer the micro devices to the target substrate TS at predetermined intervals while driving the first substrate stage 601.

[0070] The following will exemplify a case where a micro device is transferred to a target substrate TS while driving the first substrate stage 601 in a predetermined direction in a micro device transfer sequence. The first controller 135 may control the driver 109 so as to drive the first substrate stage 601 in a predetermined direction. The second controller 136 may monitor the position of the first substrate stage 601 based on the output from the measuring instrument 116. The second controller 136 operates at a higher frequency than the first controller 135 controlling the first substrate stage 601. Therefore, the second controller 136 may monitor the position of the first substrate stage 601 at a higher time resolution (finer time interval) than the time resolution of the first controller 135 controlling the first substrate stage 601.

[0071] The second controller 136 may be configured to transmit an irradiation command to the laser head 603 when the first substrate stage 601 reaches a preset position. The laser head 603 may be configured to irradiate the micro device substrate MDS with a laser beam in response to the irradiation command and transfer the micro devices to be transferred to the target substrate TS.

[0072] Employing the second controller 136 operating at a second frequency higher than the first frequency controlling the first substrate stage 601 facilitates accurately transferring the micro device to a predetermined position even while driving the first substrate stage 601. Even in a transfer sequence in which the first substrate stage 601 may move irregularly, the second controller 136 operates independently of the first controller 135, and the micro device can be accurately transferred to a predetermined position.

[0073] As another embodiment, an article manufacturing method for manufacturing an article using the processing device according to the above embodiment will be described. The article manufacturing method may include a first processing step of performing a predetermined process as a first process on a substrate using the processing device, and a second processing step of performing a second process on the substrate that has undergone the first processing step.

[0074] When the processing device is configured as an exposure device, the predetermined processing may be an exposure processing. In this case, the article manufacturing method may include an exposure step of exposing the substrate by the exposure device used as the processing device, and a development step of developing the substrate that has undergone the exposure step. The article manufacturing method may also include a processing step of processing the substrate that has undergone the development step to obtain the article. The processing step may include, for example, an oxidation step, an ion implantation step, or an etching step.

[0075] When the processing device is configured as a laser irradiation system (mass transfer device), the predetermined process may be a transfer process. In this case, the article manufacturing method may include a transfer step of transferring the second substrate to the first substrate by the laser irradiation system used as the processing device, and a processing step of processing the second substrate to process the structure transferred to the first substrate by the transfer step to obtain the article.

[0076] Other embodiments

[0077] The (one or more) embodiments of the present invention may also be implemented by a computer of a system or device that reads out and executes computer executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be more completely referred to as a "non-transitory computer-readable storage medium") to perform the functions of one or more of the above (one or more) embodiments and / or includes one or more circuits (e.g., application-specific integrated circuits (ASICs)) for performing the functions of one or more of the above (one or more) embodiments, and by a method executed by a computer of a system or device, for example, by reading out and executing computer executable instructions from a storage medium to perform the functions of one or more of the above (one or more) embodiments and / or controlling one or more circuits to perform the functions of one or more of the above (one or more) embodiments. The computer may include one or more processors (e.g., a central processing unit (CPU), a microprocessing unit (MPU)), and may include a network of separate computers or separate processors to read out and execute computer executable instructions. Computer executable instructions may be provided to the computer, for example, from a network or a storage medium. The storage medium may include, for example, a hard disk, a random access memory (RAM), a read-only memory (ROM), a storage device of a distributed computing system, an optical disk (such as a compact disk (CD), a digital versatile disk (DVD), or a Blu-ray disk (BD)) TM ), flash memory devices, memory cards, etc.

[0078] Other embodiments

[0079] The embodiments of the present invention may also be implemented by providing software (program) for performing the functions of the above-described embodiments to a system or device via a network or various storage media, and a computer or a central processing unit (CPU) or a microprocessing unit (MPU) of the system or device reads and executes the program.

[0080] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A processing device, the processing device performing a predetermined process on a substrate, the processing device comprising: a driver configured to drive a stage holding the substrate; a first controller configured to operate at a first frequency and control the driver; a second controller configured to operate at a second frequency higher than the first frequency and to generate commands based on the position of the stage; as well as A device is configured to execute one of the predetermined process and a preparatory process for the predetermined process in response to the command.

2. The apparatus according to claim 1, further comprising a measuring instrument configured to measure the position of the stage, Wherein the second controller sends the command to the device based on the output from the measuring instrument.

3. The apparatus of claim 2, wherein the measuring instrument comprises one of an interferometer and an encoder. 4 . The apparatus of claim 2 , wherein the first controller receives the output from the measuring instrument at the first frequency and generates a command value to the driver at the first frequency.

5. The apparatus according to any one of claims 1 to 4, wherein the device comprises a controller configured to control an optical device for performing the preparation process.

6. The apparatus of claim 5, wherein the optical device comprises a controller configured to control an observer for detecting a position of a mark of the substrate. 7 . The apparatus of claim 6 , wherein the second frequency is determined based on the command to enable imaging of the mark by the observer. 8 . The apparatus of claim 6 , further comprising a main controller configured to control the first controller to position the substrate based on an output from the device.

9. The apparatus of claim 6, further comprising a main controller configured to control the first controller based on an output from the device to align a master having a pattern to be printed on the substrate with the substrate.

10. The apparatus according to claim 9, wherein the predetermined process includes a process of printing the pattern onto the substrate.

11. The apparatus according to claim 9, wherein the processing device is constituted as an exposure device configured to print the pattern on the substrate by projecting the pattern of the master onto the substrate.

12. The apparatus according to any one of claims 1 to 4, wherein the predetermined process includes a process of transferring a second substrate to a first substrate serving as the substrate, and The apparatus includes a laser head configured to transfer the second substrate to the first substrate in response to the command.

13. A method for manufacturing an article, comprising: exposing the substrate by the processing apparatus defined in claim 11; developing the exposed substrate; as well as The substrate that has undergone development is processed to obtain an article.

14. A method for manufacturing an article, comprising: transferring the second substrate to the first substrate by the processing device defined in claim 12; as well as The structure of the second substrate transferred to the first substrate by transfer is processed to obtain an article.

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