Silicon wafer management method and silicon wafer transfer control system

Abstract

The application provides a wafer management method and a wafer transmission control system, and relates to the technical field of semiconductors. The method comprises the following steps: acquiring transmission control parameters of a wafer library manager, wherein the transmission control parameters comprise wafer taking control parameters, scanning control parameters and wafer placing control parameters; determining a wafer taking library from a plurality of preset wafer libraries according to the wafer taking control parameters; controlling a wafer taking manipulator to scan the wafer taking library, determining a target wafer in the wafer taking library, and controlling the wafer taking manipulator to carry the target wafer to a wafer workbench for exposure; after the exposure is completed, determining a wafer placing library from the plurality of preset wafer libraries according to the wafer placing control parameters, and controlling a wafer placing manipulator to carry the exposed target wafer from the wafer workbench to the wafer placing library. The method of the application can automatically control the wafer taking manipulator and the wafer placing manipulator to complete the exposure operation of the wafer, thereby avoiding the complicated operation of a user.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a silicon wafer management method and a silicon wafer transport control system. Background Technology

[0002] A silicon wafer library is a device used in a lithography machine to store silicon wafers. During the exposure process, a robotic arm moves unexposed silicon wafers from the silicon wafer library and returns them to the silicon wafer library after exposure is completed or if an exposure error occurs.

[0003] Existing exposure operations require real-time user intervention. For example, if there are abnormalities such as stacked or tilted wafers in the current slot during wafer picking and placement, the user needs to be notified to handle the abnormality. Alternatively, the user needs to reset the wafer picking and placement parameters of the wafer library every time the silicon wafer library is changed, which is cumbersome and inconvenient for the user. Summary of the Invention

[0004] This application addresses the shortcomings of the prior art by providing a silicon wafer management method and a silicon wafer transport control system to solve the problems existing in the prior art.

[0005] The technical solution adopted in the embodiments of this application is as follows:

[0006] In a first aspect, embodiments of this application provide a silicon wafer management method, including:

[0007] Obtain the transmission control parameters of the chip library manager, wherein the transmission control parameters include: chip retrieval control parameters, scan control parameters, and chip placement control parameters;

[0008] Based on the wafer retrieval control parameters, a wafer retrieval library is determined from multiple preset silicon wafer libraries;

[0009] The robotic arm is controlled to scan the wafer collection library, identify the target silicon wafer in the library, and then transport the target silicon wafer to the wafer worktable for exposure.

[0010] After exposure is completed, the wafer loading control parameters are used to determine the wafer loading library from the plurality of preset silicon wafer libraries, and the wafer loading robot is controlled to transport the exposed target silicon wafer from the silicon wafer worktable to the wafer loading library.

[0011] Secondly, embodiments of this application provide a silicon wafer transport control system, including: a transport control device and a device front-end module; the device front-end module is provided with: a wafer picking robot, a wafer placing robot, and multiple preset silicon wafer libraries;

[0012] The film-picking robot and the film-placing robot are respectively connected to the transmission control device;

[0013] The transmission control device is used to execute the silicon wafer management method described in the above embodiments.

[0014] Thirdly, embodiments of this application provide a silicon wafer management device, including:

[0015] The acquisition module is used to acquire the transmission control parameters of the chip library manager, wherein the transmission control parameters include: chip picking control parameters, scanning control parameters, and chip placement control parameters;

[0016] The determining module is used to determine the wafer selection library from multiple preset silicon wafer libraries based on the wafer selection control parameters;

[0017] The control module is used to control the wafer picking robot to scan the wafer picking library according to the scanning control parameters, determine the target silicon wafer in the wafer picking library, and control the wafer picking robot to transport the target silicon wafer to the silicon wafer worktable for exposure.

[0018] The transfer module is used to determine the wafer placement library from the plurality of preset silicon wafer libraries according to the wafer placement control parameters after exposure, and to control the wafer placement robot to transfer the exposed target silicon wafer from the silicon wafer worktable to the wafer placement library.

[0019] Fourthly, embodiments of this application provide a transmission control device, including: a processor, a storage medium, and a bus. The storage medium stores program instructions executable by the processor. When the transmission control device is running, the processor communicates with the storage medium via the bus, and the processor executes the program instructions to implement the data processing method described in the above embodiments.

[0020] Fifthly, embodiments of this application provide a readable storage medium storing program instructions, which, when executed by a processor, implement the data processing method described in the above embodiments.

[0021] The beneficial effects of this application are as follows: This application provides a silicon wafer management method and a silicon wafer transfer control system. This method can automatically control the wafer picking robot and the wafer placing robot to complete the silicon wafer exposure operation based on the transfer control parameters of the wafer library manager. It has a high degree of intelligence, avoids tedious operation by users, and does not require real-time user intervention, thus improving the user experience. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the silicon wafer transport control system provided in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of the device front-end module provided in the embodiments of this application;

[0025] Figure 3 One of the schematic flowcharts of the silicon wafer management method provided in the embodiments of this application;

[0026] Figure 4 A second schematic flowchart illustrating the silicon wafer management method provided in this application embodiment;

[0027] Figure 5 The third schematic flowchart of the silicon wafer management method provided in the embodiments of this application;

[0028] Figure 6 This is a schematic diagram of the silicon wafer management device provided in this application;

[0029] Figure 7 A schematic diagram of the transmission control device provided in this application. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] In the description of this application, it should be noted that if the terms "upper", "lower", etc. appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0034] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can be a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0036] This application provides a silicon wafer management method, which can be generated by a transmission control device in a silicon wafer transmission control system. The transmission control device may be, for example, a terminal-oriented computer device.

[0037] First, combine Figure 1 and Figure 2 The silicon wafer transport control system of this application will be described, such as... Figure 1 As shown, the silicon wafer transmission control system includes transmission control equipment and equipment front-end modules, such as... Figure 2 As shown, the front-end module of the equipment includes a wafer pick-up robot, a wafer placement robot, and multiple preset silicon wafer libraries. The wafer pick-up robot and the wafer placement robot are connected to a transfer control device. Based on this connection, the transfer control device can control the wafer pick-up robot and the wafer placement robot to perform corresponding actions, thereby performing exposure operations on the silicon wafers in the multiple preset silicon wafer libraries. Each preset silicon wafer library can be equipped with multiple slots. For example, the silicon wafer library for placing 4 / 6-inch silicon wafers has 25 layers (25 slots), and the silicon wafer library for placing 8-inch silicon wafers has 13 layers (13 slots).

[0038] Specifically, the exposure process includes: a robotic arm retrieves an unexposed silicon wafer from the wafer library and places it in the pre-alignment position. After pre-alignment, the robotic arm places the pre-aligned wafer onto the wafer stage from the upper position. The wafer is then exposed on the wafer stage. After exposure, a robotic arm returns the exposed wafer to the wafer library from the lower position. The purpose of pre-alignment is to precisely place the wafer on the exposure stage so that the circuit pattern on the photomask can be accurately exposed at the designated location on the wafer, thereby improving the success rate of wafer exposure.

[0039] The silicon wafer management method provided in this application is illustrated below with reference to the accompanying drawings and several examples.

[0040] Figure 3 This is one of the flowcharts illustrating the silicon wafer management method provided in the embodiments of this application, such as... Figure 3 As shown, the method includes:

[0041] S101. Obtain the transfer control parameters of the disk library manager.

[0042] The transmission control device is divided into a control layer and an access layer. Before executing the method of this application, the user can set the transmission control parameters in the chip library manager of the access layer. When executing the method of this application, the control layer can obtain the transmission control parameters from the chip library manager.

[0043] The transfer control parameters include wafer picking control parameters, scanning control parameters, and wafer placement control parameters. The wafer picking control parameters indicate the method of picking unexposed silicon wafers from multiple silicon wafer libraries, the scanning control parameters indicate the scanning method of the silicon wafers, and the wafer placement control parameters indicate the method of transporting the exposed silicon wafers back to multiple silicon wafer libraries.

[0044] S102. Based on the wafer retrieval control parameters, determine the wafer retrieval library from multiple preset silicon wafer libraries.

[0045] Based on the wafer retrieval control parameter Select, the wafer retrieval library can be determined from multiple preset wafer libraries. In other words, the wafer retrieval robot will retrieve the unexposed wafer from which it will pick up the wafer.

[0046] S103. According to the scanning control parameters, control the wafer picker to scan the wafer picker library, determine the target silicon wafer in the wafer picker library, and control the wafer picker to transport the target silicon wafer to the silicon wafer worktable for exposure.

[0047] The wafer pick-up robot is equipped with a scanning device that scans the silicon wafers. After the wafer pick-up library is determined, the robot scans the library according to the scanning control parameter ScanOption. The scanning function identifies the target silicon wafer among multiple wafers in the library. Then, the robot transports the target silicon wafer to the wafer stage for exposure. It should be noted that before transporting the target silicon wafer to the wafer stage for exposure, the target silicon wafer is first placed in a pre-alignment position for pre-alignment to improve the success rate of silicon wafer exposure.

[0048] S104. After exposure is completed, the wafer loading library is determined from multiple preset silicon wafer libraries according to the wafer loading control parameters, and the wafer loading robot is controlled to transport the exposed target silicon wafer from the silicon wafer worktable to the wafer loading library.

[0049] After exposure, the control layer determines the wafer placement library from multiple preset silicon wafer libraries based on the wafer placement control parameters, and controls the wafer placement robot to transfer the exposed target silicon wafer from the silicon wafer worktable to the wafer placement library, thus completing one exposure operation for the target silicon wafer. By repeating the above process, silicon wafers in multiple silicon wafer libraries can be exposed.

[0050] In this embodiment, the user only needs to set the transmission control parameters in the film library manager before the exposure job begins, and then simply needs to change the film library in time during the job to efficiently complete the exposure task.

[0051] In summary, the embodiments of this application provide a silicon wafer management method. This method can automatically control the wafer picking robot and the wafer placing robot to complete the exposure operation of silicon wafers based on the transmission control parameters of the wafer library manager. It has a high degree of intelligence, avoids tedious operations by users, and does not require real-time user intervention, thus improving the user experience.

[0052] In one embodiment, the wafer retrieval control parameter Select may include the wafer library location identifier parameter Left or Right. The step S102, which determines the wafer retrieval library from multiple preset wafer libraries based on the wafer retrieval control parameter, may include: determining the wafer library at the target location indicated by the wafer library location identifier parameter as the wafer retrieval library from multiple preset wafer libraries based on the wafer library location identifier parameter.

[0053] For example, if there are two silicon wafer libraries, the Select options are Left and Right. Users can select different Select options on the wafer library manager interface. Left means to use one of the two silicon wafer libraries as the pick library, and Right means to use the other silicon wafer library as the pick library. Specifically, Left and Right can represent the silicon wafer libraries on the left and right, or the silicon wafer libraries above and below, respectively, as long as they represent two silicon wafer libraries in different positions. The specific meaning of Left and Right is not limited here.

[0054] In one embodiment, the scanning control parameter is the delayed scanning parameter LazyScan. S103, controlling the wafer picking robot to scan the wafer picking library and determine the target silicon wafer in the wafer picking library, may include: controlling the wafer picking robot to automatically scan the wafer picking library according to the delayed scanning parameter and determining the target silicon wafer in the wafer picking library.

[0055] In this method, the silicon wafer library is not automatically scanned each time it rotates to the working position. Before performing an exposure job, if the silicon wafer library has not been scanned, it will be automatically scanned once. The working position refers to the normal position of the silicon wafer library. When replacing a silicon wafer in the silicon wafer library, the silicon wafer library needs to be rotated out of the working position, replaced, and then rotated back to the working position.

[0056] In another embodiment, the scan control parameter can be the passive scan parameter NoScan. S103, controlling the wafer picker robot to scan the wafer library and determine the target silicon wafer in the library, can include: controlling the wafer picker robot to scan the wafer library based on a scan control operation manually input by the user to determine the target silicon wafer in the library. In this method, the scanning of the silicon wafer library is entirely performed by the user, who controls the scanning before the exposure operation.

[0057] The scanning control parameter can also be the real-time scanning parameter EagerScan. Based on the real-time scanning parameter, the robotic arm is controlled to scan the target silicon wafer library that has rotated to the working position from among multiple preset silicon wafer libraries. That is, as long as a target silicon wafer library exists in the multiple preset silicon wafer libraries and has rotated to the working position, that target silicon wafer library will be automatically scanned. With the real-time scanning parameter EagerScan method, there is no need to scan after the wafer library is determined; scanning begins as soon as it rotates to the working position.

[0058] In one embodiment, the wafer placement control parameters may include a wafer library mode parameter ControlMode. The step S104, determining the wafer placement library from multiple preset wafer libraries based on the wafer placement control parameters, may include:

[0059] If the wafer library mode parameter ControlMode is set to Single, then the wafer placement library and the wafer retrieval library are the same wafer library. That is, in Single mode, only one wafer library is used. The wafer retrieval robot takes out unexposed wafers from this wafer library, and the wafer placement robot needs to put the exposed wafers back into the wafer library (including wafers with normal exposure and abnormal exposure).

[0060] Alternatively, if the ControlMode parameter is set to Double (multi-silicon library mode), at least two silicon libraries are used. In this case, the wafer placement control parameters also include the Stream parameter, such as... Figure 4 As shown, the process for determining the film library specifically includes:

[0061] S201. Determine the wafer placement library from multiple preset wafer libraries based on the silicon wafer flow parameters.

[0062] S202. If the silicon wafer stream parameters are local silicon wafer stream parameters, then the wafer loading library and wafer unloading library are determined to be the same silicon wafer library.

[0063] If the wafer stream parameter Stream is the local wafer stream parameter Local, then the wafer placement library and wafer retrieval library are determined to be the same wafer library. That is, all wafers after the exposure operation return to their original location (the location includes the wafer library and the slot).

[0064] S202. If the silicon wafer flow parameters are other silicon wafer flow parameters, then determine the first wafer placement library and the second wafer placement library from multiple preset silicon wafer libraries, which are not the wafer pick library. The first wafer placement library and the second wafer placement library are used to place silicon wafers with different exposure states, respectively.

[0065] If the wafer stream parameter Stream is set to Other, then a first wafer placement library and a second wafer placement library, other than the wafer pick library, are determined from multiple preset wafer libraries. The first and second wafer placement libraries are used to place wafers in different exposure states. These different exposure states may include, for example, normal exposure and abnormal exposure. When the wafer stream parameter Stream is set to Other, normally exposed wafers are placed in the first wafer placement library, and abnormally exposed wafers are placed in the second wafer placement library.

[0066] In one embodiment, the transmission control parameters may further include the processing batch parameter CarrierMode, such as Figure 5 As shown, S103, controlling the wafer-picking robot to scan the wafer-picking library and determine the target silicon wafer in the library may include:

[0067] S301. Control the robotic arm to scan the film retrieval library.

[0068] Based on the scanning control parameters, the robotic arm is controlled to scan the film retrieval library.

[0069] S302. Based on the processing batch parameters and the scanning results of the wafer retrieval library, determine the target silicon wafer from the silicon wafers of the target batch corresponding to the processing batch parameters in the wafer retrieval library.

[0070] The batch processing parameters can include New and Old. New indicates that a silicon wafer library can contain silicon wafers from different batches, while Old indicates that the silicon wafers in a silicon wafer library belong to the same batch. After the control robot arm scans the wafer library, the target silicon wafer is determined from the silicon wafers of the target batch corresponding to the batch processing parameters in the wafer library based on the batch processing parameters and the scanning results of the wafer library.

[0071] In one embodiment, the method of this application further includes: if the wafer library mode parameter is a double wafer library mode and the wafer stream parameter is a local wafer stream parameter, then after all the wafers in multiple preset wafer libraries have been exposed, outputting a first wafer library replacement instruction message to prompt the user that all wafers in the wafer libraries need to be replaced.

[0072] Alternatively, if the wafer library mode parameter is Double and the wafer stream parameter is Other, then after either the first or second wafer library is full, a replacement instruction message for the second wafer library will be output, prompting the user to replace the wafers in the full wafer library.

[0073] Alternatively, if the wafer library mode parameter is set to "Continue" and the wafer stream parameter is set to "Local", then after exposure of any of the multiple preset wafer libraries, a third wafer library replacement instruction will be output. Here, "Continue" is the third wafer library mode parameter besides "Single" and "Other," used to indicate that multiple wafer libraries are used in rotation. For example, with two wafer libraries, the two libraries will be used alternately.

[0074] Among the various parameters provided in this application, the ControlMode parameter can only be specified as Double and Continue when the user uses two or more silicon libraries, and the Stream parameter can only be specified as Other when the user uses two or more silicon libraries. The other parameters are not limited and can be freely combined.

[0075] Taking the wafer retrieval control parameter Select as Left, the wafer stream parameter Stream as Local, the batch processing parameter CarrierMode as New, the scan control parameter ScanOption as EagerScan, the wafer library mode parameter ControlMode as Continue, and using two wafer libraries as an example, assuming that both wafer libraries are available new wafer libraries before the exposure job starts, the exposure job flow executed according to the above parameter combination is as follows:

[0076] 1. The wafer retrieval robot picks up a wafer from slot 0 of the left wafer library. After pre-alignment, exposure and other processes, it is put back into the wafer library. Since the Stream option is set to Local, the exposed silicon wafer will be put back into slot 0 of the left wafer library.

[0077] 2. Repeat the exposure process until all the silicon wafers in the left-hand wafer library are exposed.

[0078] Taking a 4-inch wafer library as an example, after all 25 exposed silicon wafers have been returned to the left wafer library, the ControlMode parameter is checked. If the entire batch exposure is not complete, in Continue mode, wafers will be retrieved from the right wafer library, while simultaneously notifying the user to replace the left wafer library. While the user is replacing the left wafer library, the robotic arm can normally retrieve and place wafers from the right wafer library. If the left wafer library is replaced after the right exposure is completed, the operation can continue, thus improving efficiency.

[0079] 3. After the user replaces the left-side chip library and it rotates back to the working position, the scanning device on the chip-picking robot will automatically scan the new chip library since ScanOption is set to EagerScan, without requiring manual scanning by the user. At this time, the robot may be busy, for example, the preloading station may not have finished preloading. In this case, record the chip library that needs to be scanned, and continue the scanning operation when the robot becomes available.

[0080] In summary, this application provides a silicon wafer management method with the following advantages:

[0081] 1. Different parameters can be freely combined, achieving a balance between operational efficiency and manual control. For example, when using more than two film libraries, users can choose the Double, Local, and EagerScan options, which offer a higher degree of automation; or they can choose the Single, Local, and NoScan options, allowing operators to manually scan and change film libraries.

[0082] 2. High scalability: Whether adding more silicon wafer libraries to the lithography machine or collaborating with coating and developing equipment after silicon wafer exposure, expanding new requirements will not affect the existing control strategy. For example, when using more than two silicon wafer libraries, other CST numbers such as Left1...Leftn can be added to the existing Select parameters without affecting the operation logic of Left and Right, thus achieving openness for expansion.

[0083] The apparatus, device, and storage medium for implementing the silicon wafer management method provided in any of the above embodiments of this application will be explained below. The specific implementation process and the resulting technical effects are the same as those in the corresponding method embodiments. For the sake of brevity, the parts not mentioned in the following embodiments can be referred to the corresponding content in the method embodiments.

[0084] Figure 6 A schematic diagram of the silicon wafer management device provided in this application is shown below. Figure 7 As shown, this application provides a silicon wafer management device, including:

[0085] The acquisition module 10 is used to acquire the transmission control parameters of the chip library manager, including chip picking control parameters, scanning control parameters, and chip placement control parameters.

[0086] The determination module 20 is used to determine the wafer library from multiple preset silicon wafer libraries based on the wafer retrieval control parameters.

[0087] The control module 30 is used to control the wafer picker to scan the wafer picker library according to the scanning control parameters, determine the target silicon wafer in the wafer picker library, and control the wafer picker to transport the target silicon wafer to the silicon wafer worktable for exposure.

[0088] The conveying module 40 is used to determine the wafer loading library from multiple preset silicon wafer libraries according to the wafer loading control parameters after exposure, and to control the wafer loading robot to move the exposed target silicon wafer from the silicon wafer worktable to the wafer loading library.

[0089] The above-described device is used to execute the method provided in the foregoing embodiments, and its implementation principle and technical effect are similar, so they will not be described again here.

[0090] These modules can be one or more integrated circuits configured to implement the above methods, such as one or more Application Specific Integrated Circuits (ASICs), one or more microprocessors, or one or more Field Programmable Gate Arrays (FPGAs). Alternatively, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together as a system-on-a-chip (SOC).

[0091] Optionally, such as Figure 7 As shown, this application provides an implementation of a transmission control device. The transmission control device may include a processor 100, a storage medium 200, and a bus 300. The storage medium stores program instructions that can be executed by the processor. When the transmission control device is running, the processor communicates with the storage medium through the bus, and the processor executes the program instructions to implement the silicon wafer management method of the above embodiment.

[0092] Optionally, this application also provides a readable storage medium storing program instructions, which are executed by a processor to implement the silicon wafer management method of the above embodiments.

[0093] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0094] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0095] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in a combination of hardware and software functional units.

[0096] The integrated units implemented as software functional units described above can be stored in a computer-readable storage medium. These software functional units, stored in a storage medium, include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute some steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0097] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A silicon wafer management method, characterized in that, include: Obtain the transmission control parameters of the chip library manager, wherein the transmission control parameters include: chip retrieval control parameters, scan control parameters, and chip placement control parameters; Based on the wafer retrieval control parameters, a wafer retrieval library is determined from multiple preset silicon wafer libraries; According to the scanning control parameters, the robotic arm is controlled to scan the wafer pick-up library to determine the target silicon wafer in the wafer pick-up library, and the robotic arm is controlled to transport the target silicon wafer to the wafer worktable for exposure. After exposure is completed, the wafer loading control parameters are used to determine the wafer loading library from the plurality of preset silicon wafer libraries, and the wafer loading robot is controlled to transport the exposed target silicon wafer from the silicon wafer worktable to the wafer loading library.

2. The method according to claim 1, characterized in that, The wafer retrieval control parameters include: silicon wafer library location identification parameters; The step of determining the wafer retrieval library from multiple preset silicon wafer libraries based on the wafer retrieval control parameters includes: Based on the silicon wafer library location identifier parameter, the silicon wafer library at the target location indicated by the silicon wafer library location identifier parameter is determined from the plurality of preset silicon wafer libraries as the wafer retrieval library.

3. The method according to claim 1, characterized in that, The scanning control parameters are delayed scanning parameters. The control of the wafer-picking robot to scan the wafer-picking library and determine the target silicon wafer in the library includes: Based on the delayed scanning parameters, the robotic arm is controlled to automatically scan the wafer retrieval library to determine the target silicon wafer in the library.

4. The method according to claim 1, characterized in that, The scanning control parameters are passive scanning parameters. The control of the wafer-picking robot to scan the wafer-picking library and determine the target silicon wafer in the library includes: Based on the input scanning control operation, the robotic arm is controlled to scan the wafer retrieval library to determine the target silicon wafer in the wafer retrieval library.

5. The method according to claim 1, characterized in that, The method further includes: If the scanning control parameters are real-time scanning parameters, the robotic arm is controlled to scan the target silicon wafer library rotated to the working position in the plurality of preset silicon wafer libraries according to the real-time scanning parameters.

6. The method according to claim 1, characterized in that, The wafer placement control parameters include: wafer library mode parameters. The step of determining the wafer placement library from the plurality of preset silicon wafer libraries based on the wafer placement control parameters includes: If the wafer library mode parameter is a single wafer library mode, then the wafer placement library and the wafer retrieval library are determined to be the same wafer library; or, If the wafer library mode parameter is a multi-wafer library mode, the wafer placement control parameter further includes: silicon wafer stream parameter. Then, the wafer placement library is determined from the multiple preset silicon wafer libraries according to the silicon wafer stream parameter.

7. The method according to claim 6, characterized in that, The step of determining the wafer placement library from the plurality of preset silicon wafer libraries based on the silicon wafer flow parameters includes: If the silicon wafer stream parameters are local silicon wafer stream parameters, then the wafer placement library and the wafer retrieval library are determined to be the same silicon wafer library; If the silicon wafer flow parameters are other silicon wafer flow parameters, then a first wafer placement library and a second wafer placement library other than the wafer pick-up library are determined from the plurality of preset silicon wafer libraries. The first wafer placement library and the second wafer placement library are respectively used to place silicon wafers in different exposure states.

8. The method according to claim 1, characterized in that, The transmission control parameters further include: batch processing parameters; the control of the wafer-picking robot to scan the wafer-picking library and determine the target silicon wafer in the wafer-picking library includes: Control the robotic arm to scan the film library; Based on the processing batch parameters and the scanning results of the wafer retrieval library, the target silicon wafer is determined from the silicon wafers of the target batch corresponding to the processing batch parameters in the wafer retrieval library.

9. The method according to claim 7, characterized in that, The method further includes: If the wafer library mode parameter is a multi-wafer library mode, and the wafer stream parameter is a local wafer stream parameter, then after all wafers in the multiple preset wafer libraries have been exposed, a first wafer library replacement instruction is output; or... If the wafer library mode parameter is a multi-wafer library mode, and the wafer stream parameter is another wafer stream parameter, then after either the first wafer library or the second wafer library is full, a second wafer library replacement instruction message is output; or, If the wafer library mode parameter is the alternating wafer library mode, and the wafer stream parameter is the local wafer stream parameter, then after the exposure of any wafer library in the plurality of preset wafer libraries is completed, the third wafer library replacement instruction information is output.

10. A silicon wafer transfer control system, characterized in that, include: Transmission control equipment, equipment front-end module; The front-end module of the equipment is equipped with: a wafer picking robot, a wafer placing robot, and multiple preset silicon wafer libraries; The film-picking robot and the film-placing robot are respectively connected to the transmission control device; The transmission control device is used to perform the silicon wafer management method according to any one of claims 1-9.

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