I / O module device

Abstract

An I / O module arrangement (10) for a process control system, comprising a first substrate (12) for at least one I / O module (14), the first substrate (12) comprising a first socket (16) for a first I / O module (14) and a first set (18) of connection terminals for connecting the first I / O module (14) to a first set of wires leading to a first set of field devices of the process control system, the first substrate (12) is adapted to allow the first I / O module and any other I / O module attached to the first substrate (12) to operate as any type of I / O module for the input and output of any type of field device.

Description

Technical Field

[0001] The present invention relates to an input / output (I / O) module device for a process control system. Background Art

[0002] Industrial processes in process control systems can be controlled by controllers. In providing such control, the controllers can communicate with field devices via I / O modules.

[0003] The I / O modules may then be provided on the substrate.

[0004] US2015 / 120972 discloses an I / O module device, which includes a substrate, an optional module, a universal I / O module and a plurality of terminals, wherein the optional module enables various field devices to be connected to the same universal I / O module. The optional module performs communication protocol conversion and signal processing such as amplification and attenuation. In addition, a set of two universal I / O modules can be attached to the same substrate, thereby allowing redundant operation.

[0005] In a process control system, there may be many I / O modules and many baseboards to interface to different signal types, different voltages, different power supply concepts for field devices (source or sink), single / redundant I / O, etc.

[0006] Having many different baseplates complicates planning, ordering, installation and commissioning.

[0007] from Figure 1 An example of this situation can be understood in Figure 1 The I / O module device 10 is schematically shown. The device 10 comprises a first base plate BP1A 12, which comprises a first socket SO1 16 (shown as a dashed rectangle), to which a first I / O module IOM1A 14 is connected. It also comprises a first set CT1A 18 of connection terminals for connecting the first I / O module 14 to a field device. There is also a second base plate BP2A 20 having a second socket SO2 24 (also shown as a dashed rectangle), to which a second I / O module IOM2A 22 is connected. The second base plate 20 comprises a second set CT2A 26 of connection terminals for connecting the second I / O module 22 to a field device. In addition, there is a third base plate BP3A 28, which comprises a third socket (not shown) and a third set of connection terminals for connecting a third I / O module 30 to a field device, to which the third I / O module IOM3A 30 is connected. There is also a fourth base plate BP4A32 having a fourth socket (not shown) to which a fourth I / O module IOM4A34 is connected.

[0008] Field devices of a process control system can be connected to a multi-core cable. When connecting these field devices to an I / O module, the wires of the multi-core cable are connected to a terminal block that is usually provided in a marshaling chassis. Thereafter, the terminal block is connected to a base plate. Figure 1 In the example shown, the conductors of the first multi-core cable MCC1 40 are connected to the first set of terminal blocks TB1 36, and the conductors of the second multi-core cable MCC2 42 are connected to the second set of terminal blocks TB2 38. Here, there is one terminal block for each conductor in the corresponding multi-core cable. The first set of terminal blocks 36 connects some of the conductors of the first multi-core cable 40 to the first set 18 of the connection terminals of the first substrate 12, and connects other conductors of the first multi-core cable 40 to the second set 26 of the connection terminals of the second substrate 20, and the second set of terminal blocks 38 connects some of the conductors of the second multi-core cable 42 to the third set of the connection terminals of the third substrate 28, and connects other conductors of the second multi-core cable 42 to the fourth set of the connection terminals of the fourth substrate 32.

[0009] The connection of the wires of a multi-core cable to a terminal block is often done by someone who does not know the signals that the wires carry. In this case, the wires of the multi-core cable can usually be connected to the terminal block in the order in which they appear in the multi-core cable. When interconnecting the terminal block to the baseboard, some more considerations usually need to be made. Here, which wires go where depends on the type of signals that the wires carry and the capabilities of the I / O module. This usually requires more qualified personnel. Such as those who can Figure 1 As seen in , it is usually also necessary to cross-connect the wires.

[0010] Needless to say, connecting field devices to IO modules can be labor intensive, time consuming, and relatively complex.

[0011] Furthermore, by using several different baseboards, changes may be difficult, for example, if the digital input signal is changed from 24V to 230V, then the baseboard may have to be changed. The same applies if the loop requires higher availability and a single I / O module and baseboard must be changed to a redundant I / O module and baseboard.

[0012] There are some prior art techniques that address different types of signals.

[0013] For example, US2020 / 0334173 discloses a UI / O card that includes a universal I / O IC and is provided for digital and analog IO signals, different voltage levels, and resistance temperature detectors and thermocouples. In addition, the UI / O card is also connected to the field terminal array UFTA of the marshaling machine chassis, and the marshaling machine chassis field devices are also connected to the marshaling machine chassis.

[0014] EP 3798769 discloses an IO device having an IO module provided on an IO base and configurable for analog or digital signals and / or RTDs or thermocouples. It is also discussed that two configurable IO modules are 100% redundant with respect to each other and are operably connected to share a single common terminal block bridging a first terminal block mounting position and a second terminal block mounting position.

[0015] Another related document is US2021 / 209049, which discloses a signal processor connected to a socket of a base, wherein four I / O module electrical connectors are connected to the socket for connecting field devices.

[0016] However, there remains room for improvement with respect to providing I / O modules in process control systems. Summary of the invention

[0017] Accordingly, the present invention is directed to providing improvements in the way I / O modules are provided in process control systems.

[0018] This object is achieved by an input / output I / O module device for a process control system, the I / O module device comprising:

[0019] A first substrate for at least one I / O module, the first substrate comprising a first socket for the first I / O module and a first set of connection terminals for connecting the first I / O module to a first set of wires leading to a first group of field devices of a process control system, the first substrate being adapted to allow the first I / O module and any other I / O modules attached to the first substrate to function as any type of I / O module that operates on input and output signals of any type of field device, such as AI RTD / TC, AI mA, AO mA, AI V, AO V, and DI 24V to 230V, DO 24V to 230V, HART, 2-wire, 3-wire, 4-wire, sink and source field devices.

[0020] Thus, the I / O modules can be I / O modules from the following groups: AI RTD / TC, AI mA, AO mA, AI V, AO V, and DI 24V to 230V, DO 24V to 230V, and HART, and the field devices can be field devices from the 2-wire, 3-wire, 4-wire, sink, and source field device groups.

[0021] For universal use, the number of connection terminals in the first set may have to correspond to the maximum possible number of field device connections that can exist in different types of I / O modules. Therefore, the number of connection terminals may correspond to the maximum number of field device connections that can be made with the I / O module. The connection terminals in the first set may additionally include three or more connection terminals for each connectable field device.

[0022] The I / O module may additionally be capable of operating input and output signals having different voltage levels. The distances between the connection terminals in the first set of connection terminals may then be based on creepage and clearance distances associated with the highest possible voltage level of the possible voltage levels of the input and output signals (i.e., associated with the highest possible signal voltage level of the input and output signals). When the highest voltage is 230V, the connection terminals may be suitable for a 230V voltage level. The creepage and clearance distances may be creepage and clearance distances specified by applicable industry standards such as IEC 61010-1 and IEC 61010-2-201.

[0023] The first socket may also have connection terminals for mating with corresponding connection terminals of the first I / O module, and the connection terminals in the first set of connection terminals may be interconnected with the connection terminals of the first socket via conductors extending in the first substrate. In this case, the distance between the conductors may be based on the creepage and clearance distance associated with the highest possible voltage level of the possible voltage levels of the input and output signals, and the connection terminals of the first socket may be based on the creepage and clearance distance associated with the highest possible voltage level of the possible voltage levels of the input and output signals.

[0024] The first socket may also include one or more connection terminals to allow the first I / O module to communicate with a controller of the process control system via a fieldbus. Thus, the first socket may include one or more connection terminals for connecting the first I / O module to the controller via the fieldbus. Thus, the first substrate may also include at least a portion of a local bus interconnecting these connection terminals of the first socket with the fieldbus socket.

[0025] The I / O module arrangement may further include a second socket and a second set of connection terminals for a second I / O module.

[0026] A second set of connection terminals may be provided for connecting the second I / O module to a second set of wires leading to a second group of field devices of the process control system.

[0027] The second socket may also have connection terminals for mating with corresponding connection terminals of the second I / O module, and the connection terminals in the second set of connection terminals may be interconnected with the connection terminals of the second socket by conductors. In this case, the distances between the connection terminals in the second set of connection terminals, the distances between the conductors interconnecting the second set of connection terminals with the second socket and the connection terminals of the second socket may be based on the creepage and clearance distances associated with the highest possible voltage level of the possible voltage levels of the input signal and the output signal.

[0028] The second socket may also include one or more connection terminals to allow the second I / O module to communicate with the controller of the process control system via a fieldbus. Thus, the second socket may include one or more connection terminals for connecting the second I / O module to the controller via the fieldbus. Thus, the substrate including the second socket may also include at least a portion of the local bus interconnecting the connection terminals of the second socket with the fieldbus socket.

[0029] The fieldbus socket may be provided on one of the substrates (such as the first substrate or the second substrate). The fieldbus socket may additionally include or hold a fieldbus communication unit instead of the I / O module. The fieldbus communication unit and / or the fieldbus socket may also be considered to form a fieldbus communication interface.

[0030] A second socket and a second set of connection terminals may be provided on the first substrate.

[0031] The I / O module device may further include a second substrate. In this case, a second socket and a second set of connection terminals may be provided on the second substrate.

[0032] The I / O module arrangement may further comprise an I / O module. Thus, it may comprise a first I / O module and a second I / O module.

[0033] The first I / O module may be an I / O module of a first type, and the second I / O module may be an I / O module of a second type.

[0034] The first I / O module may operate on input signals and output signals of the first set of conductors having a first voltage level, and the second I / O module may operate on input signals and output signals of the second set of conductors having a second voltage level. The distances between the connection terminals in each set may be based on creepage and clearance distances associated with the highest possible voltage level of the possible voltage levels of the input and output signals. These creepage and clearance distances may be creepage and clearance distances specified by applicable industry standards such as IEC 61010-1 and IEC 61010-2-201.

[0035] The first I / O module may operate at more than one voltage level, such as 24 V and 230 V. Alternatively or additionally, it is possible that the second I / O module is capable of operating at more than one voltage level.

[0036] The first I / O module may additionally operate only on analog input signals and analog output signals, and the second I / O module may operate only on digital input signals and digital output signals, or vice versa. Thus, the first I / O module may be capable of operating only on analog input signals and analog output signals, and the second I / O module may be capable of operating only on digital input signals and digital output signals. Thus, the first I / O module may be a general purpose analog I / O module, and the second I / O module may be a general purpose digital I / O module, or vice versa.

[0037] In this case, the first set of connection terminals can be connected to the first group of field devices via one or more multi-core cables that carry only analog input signals and analog output signals, and the second set of connection terminals can be connected to the second group of field devices using one or more multi-core cables that carry only digital input signals and digital output signals. Therefore, the first wire set can include one or more multi-core cables that carry only analog input signals and analog output signals, and the second wire set can include one or more multi-core cables that carry only digital input signals and digital output signals. The I / O module device can also include a first wire set and a second wire set in the form of two or more multi-core cables.

[0038] The first set of connection terminals may be adapted for attachment to one or more multi-core cables carrying only analog input and output signals, and the second set of connection terminals may be adapted for attachment to one or more multi-core cables carrying only digital input and output signals.

[0039] I / O modules may perform signal conditioning of input and output signals, and optionally also perform analog-to-digital (A / D) or digital-to-analog (D / A) conversions.

[0040] At least the first I / O module can be a general purpose I / O module, such as an I / O module that handles both digital input and output signals and analog input and output signals and all possible voltage levels. Thus, the first I / O module can be a general purpose I / O module. Likewise, the second I / O module can be a general purpose I / O module.

[0041] The I / O module arrangement may further comprise a signal bridge for interconnecting one set of connection terminals associated with a socket for one I / O module with another set of connection terminals associated with another socket for another I / O module. The two I / O modules may additionally be of the same type, e.g. for providing redundancy. The interconnected sets of connection terminals may be, e.g., a first set and a second set of connection terminals.

[0042] The first substrate may also include a first fieldbus communication interface and a second fieldbus communication interface.

[0043] The first substrate may have a rectangular shape, and the first set of connection terminals may be provided along a first side of the first substrate.

[0044] The second substrate may be attached to the third side of the first substrate.

[0045] The I / O module device may further include a third substrate attachable to a fourth side of the first substrate.

[0046] When the second socket and the second set of connection terminals are provided on the second substrate, the second set of connection terminals may be provided along the first side of the second substrate.

[0047] When the second socket and the second set of connection terminals are provided on the first substrate, the second set of connection terminals may be provided along a second side of the first substrate opposite to the first side.

[0048] If the first substrate has a horizontal orientation when installed in the mounting chassis, one of the first side and the second side may be directed upward, and the other of the first side and the second side may be directed downward. On the other hand, if the first substrate has a vertical orientation when installed in the mounting chassis, one of the first side and the second side may be provided on the left side of the substrate, and the other of the first side and the second side may be provided on the right side of the substrate.

[0049] The I / O module arrangement may further comprise a third socket for a third I / O module, a third set of connection terminals, and a fourth socket for a fourth I / O module and a fourth set of connection terminals. The third set of connection terminals may be used to connect the third I / O module to a third set of wires leading to a third group of field devices of the process control system, and the fourth set of connection terminals may be used to connect the fourth I / O module to a fourth set of wires leading to a fourth group of field devices of the process control system. It is also possible to connect a signal bridge between the third and fourth sets of connection terminals and leave one of these sets unconnected to any wires.

[0050] The third and fourth sockets and the third and fourth sets of connection terminals may be provided on the first substrate, the second substrate or one or more further substrates.

[0051] The third I / O module may be of the same type, or the third I / O module may be of a third type and the fourth I / O module may be of a fourth type.

[0052] The I / O module arrangement may further include a fifth socket and a fifth set of connection terminals for a fifth I / O module and a sixth socket and a sixth set of connection terminals for a sixth I / O module.

[0053] The fifth set of connection terminals can be used to connect a fifth I / O module to a fifth set of wires leading to a fifth group of field devices of the process control system, and the sixth set of connection terminals can be used to connect a sixth I / O module to a sixth set of wires leading to a sixth group of field devices of the process control system. It is also possible to connect a signal bridge between the fifth and sixth sets of connection terminals and leave one of these sets unconnected to any wires.

[0054] The fifth and sixth sockets and the fifth and sixth sets of connection terminals may be provided on the first substrate, the third substrate or one or more further substrates.The fifth and sixth I / O modules may be of the same type or of different types. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] The present invention will now be described with reference to the accompanying drawings, in which:

[0056] Figure 1 (previously presented) schematically shows a known I / O module device comprising a plurality of baseboards and I / O modules connected to two multi-core cables via two terminal blocks,

[0057] Figure 2 Schematically showing a top view of a first embodiment of an I / O module device, the I / O module device comprising a first I / O module and a first substrate, the first substrate comprising a first terminal block, the first terminal block comprising a first set of connection terminals and a first slot for the first I / O module;

[0058] Figure 3 Schematically shows a top view of a second embodiment of an I / O module device comprising two baseboards and two I / O modules,

[0059] Figure 4 Schematically shows a top view of an I / O module device according to a second embodiment, wherein a first multi-core cable is connected to a first substrate and a second multi-core cable is connected to a second substrate,

[0060] Figure 5 Schematically shows a top view of a third embodiment of an I / O module device including four baseboards and four I / O modules,

[0061] Figure 6 Schematically shows a top view of a fourth embodiment of an I / O module device, the I / O module device comprising a first substrate having a first I / O module and a second I / O module and a second substrate having a third I / O module and a fourth I / O module,

[0062] Figure 7 A top view schematically shows a variant of the fourth embodiment of the I / O module device, and

[0063] Figure 8 A top view of a fifth embodiment of an I / O module arrangement comprising a first substrate with a plurality of I / O modules is schematically shown. DETAILED DESCRIPTION

[0064] In the following, a detailed description will be given of an embodiment of an input / output (I / O) module device including at least one substrate and possibly also at least one I / O module.

[0065] Figure 2 A top view of a first embodiment of an I / O module device 10 for a process control system is shown, the device 10 comprising a first base plate BP1A12 for at least one I / O module, wherein the first base plate 12 comprises a first socket SO116 for a first I / O module IOM114 and a first set CT1A 18 of connection terminals for connecting the first I / O module 14 to a first set of wires leading to a first set of field devices of the process control system. In the first embodiment, the I / O module device 10 comprises the first I / O module 14. However, it should be appreciated that it may alternatively comprise only the first base plate 12.

[0066] The first substrate 12 is rectangular in shape and has a first side S1A and an opposite second side S2A, a third side S3A extending between a first end of the first side S1A and a first end of the second side S2A, and a fourth side S4A extending between a second end of the first side S1A and a second end of the second side S2A.

[0067] The first substrate 12 has a first set CT1A 18 of connection terminals, which can be provided in a first terminal block. The first substrate 12 also includes a first socket 16, wherein the first I / O module 14 is suitable for being accommodated in the first socket 16. According to aspects of the present disclosure, all possible I / O modules can be accommodated in the first socket 16. The first set CT1A of connection terminals includes connection terminals, to which it is possible to connect wires of field devices of the process control system (such as a first set of wires leading to a first group of field devices). The connection terminals are interconnected within the substrate 12 with corresponding connection terminals of the socket 16, and the corresponding connection terminals are respectively provided for connecting to corresponding connection terminals of the first I / O module 14. Therefore, the connection terminals of the first I / O module 14 are electrically connected to corresponding connection terminals in the first set 18 of connection terminals when inserted into the first socket 16, and the first set of wires leading to the first group of field devices can be connected to the corresponding connection terminals.

[0068] The first substrate 12 is adapted to allow the first I / O module and any other I / O modules attached to the first substrate 12 to act as any type of I / O module that operates on input and output signals of any type of field device, which operation may generally involve signal conditioning and optionally also involve analog-to-digital (A / D) or digital-to-analog (D / A) conversion. Thus, the first substrate 12 may be a universal substrate that allows connection to all kinds of I / O modules and input and output signals, such as for analog input (AI), analog output (AO), digital input (DI), digital output (DO), high-speed addressable remote sensor (HART), resistance temperature detector (RTD), thermocouple (TC) and NAMUR signals, where NAMUR is an abbreviation for "Normenarbeitsgemeinschaft für Mess-und Regeltechnik in der chemischen Industrie". The input and output signals may additionally have different voltage levels, such as 24V, 48V, 120V and 230V. Therefore, the I / O module can be an AI RTD / TC, AI mA, AO mA, AI V, AO V, and DI 24V to 230V, DO 24V to 230V, or HART I / O module. Therefore, the I / O module can also be an I / O module from the following group: AI RTD / TC, AI mA, AOmA, AI V, AO V, and DI 24V to 230V, DO 24V to 230V, and HART. In addition, the connected field devices can be HART, 2-wire, 3-wire, 4-wire, sink, and source field devices. Therefore, the field device can be a field device from the HART, 2-wire, 3-wire, 4-wire, sink, and source field device group.

[0069] The first I / O module may be a general purpose I / O module, such as an I / O module that handles both digital input and output signals and analog input and output signals and all possible voltage levels. Thus, the first I / O module may be a general purpose I / O module. Alternatively, it may be any type of dedicated I / O module.

[0070] The connection terminals in the first set 18 may allow 1-wire, 2-wire, 3-wire and 4-wire equipment to be connected to the first I / O module 14 and to the connection of sink or source field devices. For general use, the number of connection terminals in the first set may have to correspond to the maximum possible number of field device connections that can exist in different types of I / O modules. The connection terminals in the first set may additionally include three or more connection terminals for each connectable field device.

[0071] The I / O module may additionally be capable of operating input and output signals having different voltage levels. The distance between the connection terminals in each set of connection terminals may then be based on the creepage and clearance distance associated with the highest possible voltage level of the possible voltage levels of the input and output signals. Therefore, the size of the distance between the connection terminals in the first terminal block may be set to handle the creepage and clearance distance associated with the highest possible signal voltage of the input and output signals, which may be 230V. Therefore, the connection terminals may be suitable for a 230V voltage level. As an example, the first I / O module may be an I / O module that operates input and output signals at a voltage of 24V. The creepage and clearance distance may be the creepage and clearance distance specified by applicable industrial standards such as IEC 61010-1 and IEC 61010-2-201.

[0072] Likewise, the distances between the connection terminals of the first socket 16 and the distances between the conductors in the first substrate 12 that interconnect the connection terminals with the connection terminals in the first set of connection terminals 18 may be based on the creepage and clearance distances associated with the highest possible voltage level of the possible voltage levels. However, such distances may only be required for the first I / O module 14 if it actually operates at the voltage level in question.

[0073] Therefore, the first universal substrate is designed in such a way that it can interface to all different signal types. The substrate will also have terminals that enable connection to 1-wire, 2-wire, 3-wire and 4-wire instruments.

[0074] A first set 18 of connection terminals may be provided along a first side S1A of the first substrate 12 .

[0075] The first socket 16 may also include one or more connection terminals to allow the first I / O module 14 to communicate with a controller in a process control system via a fieldbus. Thus, the first socket may include one or more connection terminals for connecting the first I / O module 14 to a controller via a fieldbus.

[0076] The first substrate 12 may include at least a portion of the local bus interconnecting the connection terminals of the first socket with the fieldbus socket. In this case, the entire local bus may be provided via the first substrate 12. Likewise, in this case, the fieldbus socket may also be provided on the first substrate. The fieldbus socket may additionally include or hold a fieldbus communication unit instead of an I / O module.

[0077] Modular I / O devices are usually built from baseboards and I / O modules. In most cases, there can be many I / O modules and many baseboards to interface to different signal types, different voltages, different power supply principles for field devices (source or sink), single / redundant I / O, so as to allow the formation of the desired I / O module device.

[0078] Having many different baseplates complicates planning, ordering, installation and commissioning. Furthermore, this does not allow for easy changes, for example, if the digital input signal is changed from 24V to 230V, then the baseplate may have to be changed. The same applies if a loop requires higher availability and a single I / O module and baseplate must be changed to a redundant I / O module and baseplate.

[0079] The above-mentioned I / O module device simplifies the planning and installation of the I / O system in the chassis using a universal base plate for all signal types. In addition, for example, if the digital input signal is changed from 24V to 230V, this allows easy changes.

[0080] In the above example, the I / O module arrangement comprises only one base plate having a first socket for a first I / O module 14 and a first set of connection terminals 18. However, it is also possible that it comprises a second socket for a second I / O module and a second set of connection terminals for connecting the second I / O module to a second set of wires leading to a second group of field devices of the process control system.

[0081] As will be seen later, the second socket and the second set of connection terminals may be provided on the first substrate. However, the I / O module device may alternatively include a second substrate. In this case, the second socket and the second set of connection terminals may be provided on the second substrate.

[0082] Thus, an I / O module device may include more than one substrate.

[0083] exist Figure 3An example of this can be seen in Figure 3 A second embodiment of an I / O module device 10 is shown. In this case, the I / O module device 10 comprises a first I / O module and a second I / O module and a first substrate and a second substrate, which substrates are identical. Therefore, the slots and the connection terminal blocks have the same implementation in both substrates.

[0084] In this case, therefore, in addition to the first substrate BP1A 12 , the second substrate BP2A 20 also exists.

[0085] The second substrate 20 is also rectangular in shape, having a first side S1A, an opposite second side S2A, a third side S3A extending between a first end of the first side S1A and a first end of the second side S2A, and a fourth side extending between a second end of the first side S1A and a second end of the second side S2A.

[0086] The second substrate 20 also has a second set CT2A 26 of connection terminals, which can be provided in a corresponding second terminal block. The second substrate 20 also includes a second socket SO2 24, in which the second I / O module 22 is suitable for being accommodated. The second set 26 of connection terminals includes connection terminals, to which it is possible to connect wires of field devices of the process control system, such as to a second set of wires leading to a second group of field devices of the process control system. The connection terminals in the second set 26 are interconnected with corresponding connection terminals of the second socket 24 within the second substrate 20, and the corresponding connection terminals are respectively provided for connecting to corresponding connection terminals of any type of I / O module (e.g., the second I / O module 22) inserted into the second socket 24. Therefore, the connection terminals of the second I / O module 22 are connected to corresponding connection terminals in the second set 26 of connection terminals when inserted into the second socket 24.

[0087] The second substrate may be attached to the third side of the first substrate. In other words, the third side of the first substrate 12 may be attached to the fourth side of the second substrate 20.

[0088] As can be seen above, both bases 12, 20 have sets 18, 26 of connection terminals for connecting field devices to first I / O modules 14 and second I / O modules 22 attached to sockets 16, 24. Figure 3 As can be seen in FIG. 1 , all these sets of connection terminals are provided on the first side S1A of the substrate 12 , 20 . Thus, the sets of connection terminals are aligned with each other along the first side S1A of the substrate 12 , 20 .

[0089] The second socket 24 also has connection terminals for mating with corresponding connection terminals of the second I / O module 22, and the connection terminals in the second set 26 of connection terminals are interconnected with the connection terminals of the second socket through conductors in the second substrate 20. Since the second substrate 20 has the same implementation as the first substrate 12, the distances between the connection terminals in the second set 26 of connection terminals, the distances between the conductors interconnecting the second set 26 of connection terminals with the second socket 24 and the corresponding connection terminals of the second socket 24 can be based on creepage and clearance distances associated with the highest possible voltage level among the possible voltage levels of the input and output signals.

[0090] The second socket 24 may also include one or more connection terminals, thereby allowing the second I / O module 22 to communicate with the controller of the process control system via the field bus. Therefore, the second socket 24 may include one or more connection terminals for connecting the second I / O module 22 to the controller via the field bus.

[0091] The second substrate 20 may also include at least a portion of a local bus interconnecting the connection terminals of the second socket with the fieldbus socket. In this case, the first portion of the local bus may be provided via the first substrate and the second portion of the local bus may be provided via the second substrate. The fieldbus socket may in turn be provided on the first substrate or on the second substrate. The fieldbus socket may additionally include or hold a fieldbus communication unit.

[0092] At least the first I / O module can be a general purpose I / O module, such as an I / O module that handles both digital input and output signals and analog input and output signals and all possible voltage levels. Thus, the first I / O module can be a general purpose I / O module. Likewise, the second I / O module can be a general purpose I / O module.

[0093] It is also possible that the first I / O module 14 is capable of operating at more than one voltage level, such as 24 V and 230 V. Alternatively or in addition, it is possible that the second I / O module 22 is capable of operating at more than one voltage level.

[0094] It is also possible that the first I / O module 14 is an I / O module of a first type and the second I / O module 22 is an I / O module of a second type.

[0095] For example, the first I / O module may only operate on analog input signals and analog output signals, and the second I / O module may only operate on digital input signals and digital output signals, or vice versa. Thus, the first I / O module may be a general-purpose analog I / O module, and the second I / O module may be a general-purpose digital I / O module. Thus, the first I / O module may only be able to operate on analog input signals and analog output signals, and the second I / O module may only be able to operate on digital input signals and digital output signals.

[0096] In other words, the first I / O module 14 may be a general-purpose analog I / O module operable to handle all types of analog input signals and analog output signals, and the second I / O module 22 may be a general-purpose digital I / O module operable to handle all types of digital input signals and digital output signals.

[0097] If the second I / O module is capable of operating on two voltages, it may be, for example, a combined DI 24V and DI 230V I / O module.

[0098] Field devices operating with analog input signals and analog output signals may be connected to the first set 18 of connection terminals via one or more multi-core cables carrying only analog input signals and analog output signals, and field devices operating with digital input signals and digital output signals may be connected to the second set 26 of connection terminals via one or more multi-core cables carrying only digital input signals and digital output signals. Thus, the first set of connection terminals may be adapted to be attached to one or more multi-core cables carrying only analog input signals and analog output signals, and the second set of connection terminals may be adapted to be attached to one or more multi-core cables carrying only digital input signals and digital output signals.

[0099] This is Figure 4 Schematically shown in the figure, a first multi-core cable MCC1 40 carrying a first set of wires leading to a first group of field devices is connected to a first set 18 of connection terminals, and a second multi-core cable MCC2 42 carrying a second set of wires leading to a second group of field devices is connected to a second set 26 of connection terminals, and wherein the first set of wires only carries analog signals, such as analog input signals and analog output signals, and the second set of wires only carries digital signals, such as digital input signals and digital output signals.

[0100] It will be appreciated that the I / O module device may also include the first set of conductors and the second set of conductors in the form of two or more multi-core cables.

[0101] The above described I / O module arrangement has a number of additional advantages.

[0102] As hinted above, there are so-called universal I / O modules. A typical universal I / O module holds multiple channels, where each channel can be configured as AI or AO or DI or DO. Since these types of I / O modules need to carry hardware electronics for AI, AO as well as DI and DO, they tend to be relatively expensive.

[0103] Furthermore, since the input and output signals in a multi-core cable are usually classified, with one multi-core cable holding analog input and analog output, and another multi-core cable holding digital input and digital output signals, a universal I / O module with AI / AO / DI / DO is not actually needed. Therefore, most existing solutions on the market are too complicated and expensive, such as a universal I / O module that implements hardware electronics for AI / AO / DI / DO.

[0104] Instead of having a universal I / O module with hardware electronics implemented for AI / AO / DI / DO, a universal DI / DO module and a universal AI / AO module are proposed, wherein the universal DI / DO module is connected to a multi-core cable carrying only digital input and digital output signals, and the universal AI / AO module is connected to a multi-core cable carrying only analog input and analog output signals. Figure 4 As can be seen in FIG. 1 , since the signal types are classified into AI / AO multicore cables and DI / DO multicore cables, no marshaling is required. This avoidance of marshaling is combined with a simpler implementation of the universal I / O modules without unnecessary signal processing. The first I / O module 14 can be, for example, a universal analog I / O module, and the second I / O module 22 can be a universal digital I / O module. Universal analog I / O modules are also cheaper than "generic" universal I / O modules. Furthermore, universal digital I / O modules are cheaper than "generic" universal I / O modules.

[0105] Alternatively, the first I / O module may operate on input and output signals having a first voltage level for a first set of conductors, and the second I / O module may operate on input and output signals having a second voltage level for a second set of conductors.

[0106] Therefore, as an alternative to the universal analog I / O module and the universal digital I / O module, the first I / O module 14 can be an I / O module that operates on 24V signals and possibly also 48V signals, and the second I / O module can be an I / O module that operates on 230V signals and perhaps also 120V signals.

[0107] This allows the two I / O modules to operate at different voltage levels.

[0108] exist Figure 5Another example where there is more than one substrate is shown in Figure 5 A third embodiment of an I / O module device is shown. In this case, the I / O module device comprises four base plates, at least two of which are identical. Furthermore, the slots and the connection terminal blocks have identical implementations in the base plates.

[0109] In addition to using the first and second sockets and the first and second sets of communication terminals on the first and second substrates, there is also a third socket for the third I / O module, a third set of connection terminals, and a fourth socket for the fourth I / O module and a fourth set of connection terminals, wherein the third set of the third socket and the connection terminals are provided on the third substrate BP3A 28, and the fourth set of the fourth socket and the connection terminals are provided on the fourth substrate BP4A 32. The third set of connection terminals can be provided for connecting the third I / O module to a third set of wires leading to a third group of field devices of the process control system, and the fourth set of connection terminals can be provided for connecting the fourth I / O module to a fourth set of wires leading to a fourth group of field devices of the process control system. However, in the present case, no wire set is connected to the fourth set of connection terminals. Alternatively, it is possible that no wire set is connected to the fourth connection terminal.

[0110] Here, the sockets may respectively include one or more connection terminals, thereby allowing the corresponding I / O module to communicate with a controller of the process control system via a fieldbus.

[0111] In this case, the second substrate 20 can be attached to the third side of the first substrate 12. Therefore, the third side of the first substrate BP1A12 can be attached to the fourth side of the second substrate BP2A20 again. In addition, the third substrate 28 can be attached to the fourth side of the first substrate 12. Therefore, the fourth side of the first substrate 12 can be attached to the third side of the third substrate 28. The fourth substrate BP4A32 in turn has a third side attached to the fourth side of the third substrate 28. As can be seen above, all substrates have a set of connection terminals for connecting field devices to I / O modules attached to the sockets of the substrates. As can be seen in FIG. Figure 5 As can be seen in FIG. 1 , all these sets of connection terminals are provided on the first side of the substrate. Therefore, in this case, the sets of connection terminals are also aligned with each other along the first side of the substrate.

[0112] A local bus may be provided via all base plates 12, 20, 28, 32 for interconnecting connection terminals of different I / O module sockets with a fieldbus socket which may be provided on one of the base plates, such as the second base plate 20. The fieldbus socket may additionally include or hold a fieldbus communication unit.

[0113] As before, the first I / O module 10M1A 14 is attached to the first substrate 12, and the second I / O module 10M2A 22 is attached to the second substrate 20. In addition, the third I / O module 10M3A 30 is attached to the third substrate 28, and the fourth I / O module 10M4A 34 is attached to the fourth substrate BP4A 32.

[0114] In this case, the first I / O module 14 can be an I / O module that operates on 24V signals and may also operate on 48V signals, and the second I / O module 10M2A 22 attached to the second substrate 20 can be an I / O module that operates on 230V signals and may also operate on 120V signals. As an alternative, one of the I / O modules can be a general-purpose analog I / O module, and the other I / O module can be a general-purpose digital I / O module. On the other hand, the third I / O module 30 and the fourth I / O module 34 can be of the same type. They can be any of the previously described types discussed with respect to the first variant of the I / O module device. They can also be general-purpose I / O modules.

[0115] Here, the purpose is to provide redundancy with respect to the third I / O module 30 and the fourth I / O module 34, and therefore they have the same type of advantages. In order to provide redundancy, there is also a signal bridge SB 44, which is used to interconnect one set of connection terminals associated with a socket for one I / O module with another set of connection terminals associated with another socket for another I / O module. The signal bridge 44 is used to bridge the terminals in the two sets of connection terminals. In this case, the signal bridge 44 is connected between the set of connection terminals of the third substrate 28 and the set of connection terminals of the fourth substrate 32, and electrically interconnects the connection terminals in the third set of connection terminals of the third substrate 28 with the corresponding connection terminals in the fourth set of connection terminals of the fourth substrate 32.

[0116] It is possible to connect all connection terminals in the third set of the third substrate 28 with corresponding connection terminals in the fourth set of the fourth substrate 32. Therefore, it is not necessary to connect the field wires to the fourth substrate 32. Alternatively, it is possible to omit the connection of the field wires to the third substrate 28.

[0117] Here, it should be appreciated that in a variant of the second embodiment, a signal bridge is connected between the first and second sets of connection terminals, in which case the first I / O module and the second I / O module can also be of the same type.

[0118] Here, it should be appreciated that the I / O module device according to the third embodiment may consist of only the base plates 12, 20, 28, 32 and the signal bridge 44. It should also be appreciated that the signal bridge may also be used in the second embodiment.

[0119] exist Figure 6 A fourth embodiment of the I / O module device can be seen in FIG. This embodiment is suitable for vertical installation. In this case, the first substrate BP1B 46 has two sockets for two I / O modules and two sets of connection terminals for field devices. Therefore, there is a first set CT1B 48 of connection terminals for the first I / O module IOM1A 14 and a second set CT2B 50 of connection terminals for the second I / O module IOM2A 22 on the first substrate 46. Similarly, the first set 48 of connection terminals is provided along the first side S1B of the first substrate 46. However, in this case, the second set CT2B of connection terminals is provided along the second side S2B of the first substrate 46, which is opposite to the first side S1B. The first substrate 46 has a vertical orientation when installed in the mounting chassis. Then, one of the first side and the second side is provided on the left side of the substrate, and the other of the first side and the second side is provided on the right side of the substrate. This simplifies the connection of the cabling.

[0120] In addition, the connection terminals and the sockets are aligned with each other between the first side S1B and the second side S2B. Therefore, they are placed along the line between the first side S1B and the second side S2B. The first field wiring FW 62A and the second field wiring FW 62B are also shown as being connected to the first set 48 and the second set 50 of connection terminals.

[0121] In this case, the third side of the first base plate 46 is attached to the fourth side of a second base plate BPB2 52 having the same implementation as the first base plate 46. The second base plate 52 likewise has two sockets for two I / O modules 54, 56 and two sets of connection terminals for field devices.

[0122] There is also a third socket for a third I / O module, a third set of connection terminals, and a fourth socket for a fourth I / O module and a fourth set of connection terminals. The third set of connection terminals can be provided for connecting the third I / O module to a third set of wires leading to a third group of field devices of the process control system, and the fourth set of connection terminals can be provided for connecting the fourth I / O module to a fourth set of wires leading to a fourth group of field devices of the process control system.

[0123] In this case, third and fourth sockets and third and fourth sets of connection terminals are provided on the second substrate 52 .

[0124] There is a third set CT3B58 of connection terminals for the third I / O module IOM3A 54 and a fourth set CT4B 60 of connection terminals for the fourth I / O module IOM4A 56. The third set 58 of connection terminals is provided along the first side of the second substrate 52, and the fourth set 60 of connection terminals is provided along the second side of the second substrate 52. In addition, the connection terminals and the sockets are aligned with each other between the first side and the second side. Therefore, they are placed along the line between the first side and the second side. Therefore, the sets 48, 58 of connection terminals at the first side S1B of the substrates 46, 52 are aligned with each other, and the sets 50, 60 of connection terminals at the second side S2B of the substrates 46, 52 are aligned with each other.

[0125] Here, moreover, the sockets may respectively include one or more connection terminals, thereby allowing the corresponding I / O module to communicate with a controller of the process control system via a fieldbus.

[0126] A local bus may be provided via base plates 46, 52 for interconnecting connection terminals of different I / O module sockets with a fieldbus socket which may be provided on one of the base plates, such as the first base plate 46. The fieldbus socket may additionally include or hold a fieldbus communication unit.

[0127] The first I / O module and the second I / O module may be Figure 5 The first I / O module and the second I / O module in the third embodiment depicted in FIG. 5 are of the same type, although other types are possible. The third I / O module 54 and the fourth I / O module 56 placed in the second substrate 52 may be of the same type or other types. As an example, they may be a universal analog I / O module and a universal digital I / O module.

[0128] As shown, the first and second sets 48, 50 of communication terminals can be connected to the first and second sets of wires 62A, 62B leading to the first and second sets of field devices. Similarly, the third and fourth connection terminals can be connected to the third and fourth sets of wires leading to the first and second sets of field devices in a similar manner. Alternatively, the signal bridge can be connected between the connection terminals on the first side of the substrate 46, 52 and / or between the connection terminals on the second side of the substrate 46, 52.

[0129] exist Figure 7 A variation of the fourth embodiment of the I / O module arrangement can be seen in FIG. , which variation is suitable for horizontal mounting.

[0130] Also in this case, the first substrate BPC1 64 has two sockets for two I / O modules and two sets of connection terminals for field devices, wherein again, a first set CT1C 66 of connection terminals is provided along a first side S1C of the first substrate 64, and a second set CT2C 68 of connection terminals is provided along a second side S2C of the first substrate 64. In this variant, the first set 66 of connection terminals and the first socket are placed along a first line between the first side and the second side, and the second set 68 of connection terminals and the second socket are placed along a second line between the first side and the second side, which is parallel to the first line. In addition, the first socket and the second socket are placed side by side. The first substrate 64 has a horizontal orientation when installed in the mounting chassis. Then, one of the first side and the second side is directed upward, and the other of the first side and the second side is directed downward. This also simplifies the connection of the cabling.

[0131] In this case, there is also a fifth socket for a fifth I / O module, a fifth set of connection terminals, and a sixth socket for a sixth I / O module and a sixth set of connection terminals, wherein the fifth set and the sixth set of connection terminals are provided on the third base board BP3C 72. The fifth set of connection terminals may be provided for connecting the fifth I / O module to a fifth set of wires leading to a fifth group of field devices of the process control system, and the sixth set of connection terminals may be provided for connecting the sixth I / O module to a sixth set of wires leading to a sixth group of field devices of the process control system.

[0132] Here, moreover, the sockets may respectively include one or more connection terminals, thereby allowing the corresponding I / O module to communicate with a controller of the process control system via a fieldbus.

[0133] In this case, the third side of the first substrate 64 is also attached to the fourth side of the second substrate BP2C 70 having the same implementation. In other words, the fourth side of the first substrate 64 can be attached to the third side of the third substrate BP3C 72 having the same implementation. Therefore, the sets of connection terminals at the first side of the substrate are aligned with each other, and the sets of connection terminals at the second side of the substrate are aligned with each other.

[0134] A local bus may be provided via all base plates 64, 70, 72 for interconnecting connection terminals of different I / O module sockets with a fieldbus socket which may be provided on one of the base plates, such as the third base plate 72. The fieldbus socket may additionally include or hold a fieldbus communication unit.

[0135] In this case, the I / O module may be any type of I / O module.

[0136] As seen above, the baseboard is able to host two I / O modules respectively and has a set of connection terminals pointing in different directions (left and right or up and down) to facilitate cable routing. This also has the advantages of reducing the manufacturing cost of the I / O module device and saving floor space in the chassis when installed. In addition, easy cable connection from different directions is allowed.

[0137] As an example, the dual substrate can host different signal types, such as mA / TC / RTD / 24V / 48V / 120V / 230V. It is also possible to utilize different dual substrates for different signal types, for example, one for mA / TC / RTD and 24V / 48V signals, and one for 120 / 230V signals.

[0138] As before, the slots and the connection terminal blocks may have the same implementation in the base plate.It is also possible that the I / O module arrangement comprises only the first base plate.

[0139] Furthermore, it is possible to connect a signal bridge between two connection terminals on a first side of the substrate 64 , 70 , 72 and / or between two connection terminals on a second side of the substrate 64 , 70 , 72 .

[0140] Figure 8 A fifth embodiment of an I / O module arrangement is shown comprising a first base plate BP1D 74. In this case, it has several slots for accommodating several different I / O modules and several corresponding sets of connection terminals, which are all placed along the first side of the base plate 74. The base plate 74 is thus common to all signal types and all I / O module types. The slots and the connection terminal blocks can have the same implementation in the base plate.

[0141] The sockets respectively include one or more connection terminals, thereby allowing the corresponding I / O module to communicate with the controller of the process control system via the fieldbus.Therefore, the sockets respectively include one or more connection terminals, thereby allowing the corresponding I / O module to communicate with the controller of the process control system via the fieldbus.

[0142] In this case, the first substrate includes a local bus that interconnects the connection terminals of the first socket, the second socket, the third socket, the fourth socket, the fifth socket and the sixth socket with at least one fieldbus socket on the first substrate 74. Each fieldbus socket may additionally include or hold a fieldbus communication unit. The fieldbus socket and / or the fieldbus communication unit placed therein may also be considered to form a fieldbus communication interface.

[0143] As an example, there are a first I / O module 14 for 24V and a second I / O module 22 for 230V, and a third I / O module 30 and a fourth I / O module 34 of the same type for redundancy purposes. In this case, the sets of connection terminals of the slots for inserting the third I / O module 30 and the fourth I / O module 34 are interconnected by a signal bridge 44. There are also a fifth I / O module IOM5A 78 and a sixth I / O module IOM6A 80, which may be a general-purpose analog I / O module and a general-purpose digital I / O module.

[0144] In this case, there is also a first fieldbus communication interface and a second fieldbus communication interface FBCI 76 for connecting the I / O module to the controller via the fieldbus, i.e., a pair of fieldbus communication interfaces. Thus, this pair of fieldbus interfaces allows the I / O module to communicate with the controller via the fieldbus. The use of two interfaces can serve the use of redundancy.

[0145] Therefore, some of the connection terminals in each socket are interconnected with the first fieldbus interface and the second fieldbus interface 76 .

[0146] Here, the first substrate 74 is also designed in such a way that it can be docked to all different signal types. The substrate 74 will also have terminals that enable connection to 1-wire, 2-wire, 3-wire, and 4-wire instruments. The signal bridge 44 is used to bridge the terminals of two terminal blocks to implement redundant I / O modules (where two I / O modules are connected to the same instrument).

[0147] The distances between the connection terminals in each set of connection terminals 26, the distances between the conductors interconnecting each set of connection terminals with the connection terminals of the corresponding sockets, and the connection terminals of these sockets can be based on the creepage and clearance distances associated with the highest possible voltage level among the possible voltage levels of the input and output signals.

[0148] Here, it should be appreciated that the first I / O module 14 and the second I / O module 22 may be general purpose analog and general purpose digital I / O modules.

[0149] Alternatively, the first I / O module 14 and the second I / O module 22 can be identical, and a signal bridge may be connected between the first and second sets of communication terminals to provide redundancy.

[0150] The collection of connection terminals can be provided in a terminal block that can be plugged in or fixed. It is also possible to have different coloring on the terminals, for example, gray for standard signals, red for 120 / 230V signals, and blue for intrinsically safe I / O.

[0151] Here, it should be recognized that the I / O module device may only include the first substrate, the first substrate and the signal bridge, the first substrate and the I / O module, or the first substrate, the signal bridge and the I / O module. Some sets of slots and communication terminals are not used, and it is also possible to have more or fewer sets of slots and connection terminals on the substrate.

Claims

1. An input / output (I / O) module device (10) for a process control system, the I / O module device comprising: A first substrate (12; 46; 64; 74) for at least one I / O module (14; 14, 22; 14, 22, 30, 34, 78, 80), the first substrate (12; 46; 64; 74) comprising a first socket (16) for the first I / O module (14) and a first set of connection terminals (18; 48; 66), the first socket (16) for the first I / O module (14), the first set of connection terminals (18; 48; 66) for connecting the first I / O module (14) to a first set of wires (62A) leading to a first set of field devices of the process control system, the first substrate (12; 46; 64; 74) being adapted to allow the first I / O module and any other I / O modules attached to the first substrate (12; 46; 64; 74) to function as any type of I / O module that operates on input and output signals of any type of field device, such as AIRTD / TC, AImA, AO mA, AIV, AO V and DI 24V to 230V, DO 24V to 230V, HART, 2-wire, 3-wire, 4-wire, sink and source field devices.

2. The I / O module arrangement (10) according to claim 1, wherein the number of connection terminals in the first set (18; 48; 66) corresponds to the maximum number of field devices that can be connected to the I / O module.

3. The I / O module arrangement (10) according to claim 1 or 2, wherein the connection terminals in the first set (18; 48; 66) include three or more connection terminals for each connectable field device.

4. The I / O module device (10) according to any one of claims 1 to 3, wherein the first socket (16) has connection terminals for mating with corresponding connection terminals of the first I / O module (14), and the connection terminals in the first set (18; 48; 66) of connection terminals are interconnected with the connection terminals of the first socket (16) through conductors extending in the first substrate (12; 46; 64; 74), and the distances between the connection terminals in the first set (18; 48; 66) of connection terminals, the distances between the conductors, and the distances between the connection terminals of the first socket (16) are based on creepage and clearance distances associated with the highest possible signal voltage levels of the input and output signals.

5. The I / O module arrangement (10) according to any one of the preceding claims, further comprising a second socket (24) and a second set of connection terminals (26; 50; 68) for a second I / O module (22).

6. An I / O module device (10) according to claim 5, wherein the first I / O module (14) operates on input and output signals of the first wire set (62A) having a first voltage level, and the second I / O module operates on input and output signals of the second wire set (62B) having a second voltage level.

7. The I / O module device (10) according to claim 5 or 6, wherein the first I / O module (14) operates only on analog input signals and analog output signals, and the second I / O module (22) operates only on digital input signals and digital output signals.

8. An I / O module device (10) according to claim 7, wherein the first set of connection terminals is connected to the first group of field devices via one or more multi-core cables that only carry analog input signals and analog output signals, and the second set of connection terminals is connected to the second group of field devices using one or more multi-core cables that only carry digital input signals and digital output signals.

9. The I / O module arrangement (10) according to any one of claims 5 to 8, wherein the first I / O module and / or the second I / O module is capable of operating at more than one voltage level.

10. The I / O module device (10) according to any one of the preceding claims, further comprising a signal bridge (44), wherein the signal bridge (44) is used to interconnect one set of connection terminals associated with a socket for one I / O module (30) and another set of connection terminals associated with another socket for another I / O module (34).

11. The I / O module device (10) according to any one of the preceding claims, wherein the first substrate (12; 46; 64; 74) has a rectangular shape and the first set (18; 48; 66) of connection terminals is provided along a first side (S1A; S1B; S1C) of the first substrate (12; 46; 64; 74).

12. The I / O module device (10) according to claim 11 when dependent on claim 5, further comprising a second substrate (20; 52; 70), and wherein the second socket (24) and the second set (26) of connection terminals are provided on the second substrate (20).

13. The I / O module device (10) of claim 11 when dependent on claim 5, wherein the second set of connection terminals is provided on the first substrate (74) along the first side.

14. An I / O module device (10) according to claim 11 when dependent on claim 5, wherein the second set (50; 68) of connection terminals is provided on the first substrate (46; 64) along a second side (S2B; S2C) of the first substrate (46; 64) opposite to the first side (S1B; S1C).

15. The I / O module device (10) of claim 14, wherein the first substrate (64) has a horizontal orientation when installed in a mounting chassis, and one of the first side and the second side is directed upward, and the other of the first side and the second side is directed downward.

16. The I / O module device (10) of claim 14, wherein the first substrate (46) has a vertical orientation when installed in a mounting chassis, and one of the first side and the second side is provided on a left side of the substrate, and the other of the first side and the second side is provided on a right side of the substrate.

Images