Electronic device

Abstract

The electronic device comprises a display layer which defines a first non-folding display area, a second non-folding display area and a folding display area; a support plate disposed under the display layer and including a folding portion capable of being folded about a folding axis, a first non-folding portion, and a second non-folding portion; the built-in battery is arranged below the supporting plate; an energy conversion layer disposed under the built-in battery and electrically connected to the built-in battery; the driving chip is configured below the energy conversion layer and is electrically connected with the built-in battery and the display layer; and the processor is configured below the driving chip and is used for driving the driving chip.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device which is improved to generate and consume electric energy within a module. Background Art

[0002] The display module includes: a display layer including pixels; a driving chip (or a driving integrated circuit) for driving the pixels, etc.

[0003] The driving chip supplies a data voltage corresponding to input image data supplied from the outside to the pixel, and the pixel emits light at a brightness corresponding to the data voltage.

[0004] As the driver chip consumes power, a portion of the display module where the driver chip is located may generate heat intensively. Summary of the invention

[0005] An object of the present invention is to provide an electronic device which is improved to generate and consume electric energy within a module.

[0006] An electronic device according to an embodiment of the present invention may include: a display layer, which is defined with a first non-folding display area, a second non-folding display area and a folding display area, wherein the second non-folding display area is separated from the first non-folding display area in a first direction, and the folding display area is arranged between the first non-folding display area and the second non-folding display area; a support plate, which is arranged under the display layer and includes a folding portion, a first non-folding portion and a second non-folding portion, wherein the folding portion can be folded with a folding axis as a reference, the folding axis extends along a second direction intersecting the first direction, the first non-folding portion extends from the folding portion along the first direction, and the second non-folding portion is separated from the first non-folding portion by the folding portion; a built-in battery, which is arranged under the support plate; an energy conversion layer, which is arranged under the built-in battery and electrically connected to the built-in battery; a driving chip, which is arranged under the energy conversion layer and electrically connected to the built-in battery and the display layer; and a processor, which is arranged under the driving chip and is used to drive the driving chip.

[0007] When viewed from a planar perspective, the internal battery may overlap at least a portion of the second unfolded portion.

[0008] When viewed from a planar perspective, the energy conversion layer may overlap at least a portion of the second unfolded portion.

[0009] When viewed from a planar perspective, the driving chip may overlap at least a portion of the second non-folded portion.

[0010] When viewed from a planar perspective, the processor may overlap at least a portion of the second unfolded portion.

[0011] The driving chip is electrically connected to the display layer through a flexible circuit board. The flexible circuit board includes a first part, a bent part extending from the first part, and a second part extending from the bent part. The first part is in contact with the display layer, the bent part is bent toward the back side of the display layer, and the driving chip can be installed in the second part.

[0012] The energy conversion layer may convert heat generated in the processor into electrical energy.

[0013] The built-in battery can store the electric energy and supply the electric energy to the driving chip.

[0014] The driving chip can receive the electric energy and provide a driving voltage to the display layer.

[0015] The energy conversion layer may include a substance that operates at room temperature.

[0016] A plurality of openings are defined in the folded portion, and the plurality of openings are spaced apart in the first direction.

[0017] The electronic device may further include a protective layer, a metal layer, a heat dissipation layer, and an insulating layer, wherein the protective layer, the metal layer, the heat dissipation layer, and the insulating layer are disposed between the support plate and the built-in battery.

[0018] The protective layer is disposed under the supporting plate, and when viewed from a plane, the protective layer may overlap with the folding portion.

[0019] The metal layer is disposed below the protective layer, and when viewed from a plane, the metal layer may not overlap with at least a portion of the folded portion.

[0020] The heat dissipation layer is disposed below the metal layer, and when viewed from a plane, the heat dissipation layer may not overlap with at least a portion of the folded portion.

[0021] The insulating layer is disposed below the heat dissipation layer and above the internal battery, and the insulating layer may not overlap with at least a portion of the folded portion when viewed from a planar perspective.

[0022] An electronic device according to an embodiment of the present invention may include: a display layer; a support plate disposed under the display layer; a built-in battery disposed under the support plate; an energy conversion layer disposed under the built-in battery and electrically connected to the built-in battery; a driver chip disposed under the energy conversion layer and electrically connected to the built-in battery and the display layer; a processor disposed under the driver chip and used to drive the driver chip; and a flexible circuit board electrically connecting the driver chip and the display layer. The flexible circuit board includes a first portion, a bent portion extending from the first portion, and a second portion extending from the bent portion, the first portion being in contact with the display layer, the bent portion being bent toward the back of the display layer, and the driver chip being mounted on the second portion.

[0023] The energy conversion layer may convert heat generated in the processor into electrical energy.

[0024] The built-in battery can store the electric energy and supply the electric energy to the driving chip.

[0025] The driving chip can receive the electric energy and provide a driving voltage to the display layer.

[0026] (Effects of the Invention)

[0027] As described above, the electronic device can generate and consume power in the display module. The generated power can be consumed in driving the display layer. Therefore, the power required for driving the electronic device can be saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A This is a perspective view showing a state where the electronic device according to one embodiment of the present invention is unfolded.

[0029] Figure 1B It is shown Figure 1A A perspective view showing a process in which an electronic device is folded inwardly.

[0030] Figure 1C It is shown Figure 1A The electronic device is shown in a top view in a state where it is folded inward.

[0031] Figure 1D It is a perspective view showing a process in which one embodiment of the present invention is folded outward.

[0032] Figure 2A This is a perspective view showing a state where the electronic device according to one embodiment of the present invention is unfolded.

[0033] Figure 2B It is shown Figure 2A A perspective view showing a process of folding an electronic device.

[0034] Figure 3 is a three-dimensional diagram of an electronic device according to an embodiment of the present invention.

[0035] Figure 4 is a block diagram of an electronic device according to an embodiment of the present invention.

[0036] Figure 5 FIG. 4 is a cross-sectional view of a display layer and a sensor layer according to an embodiment of the present invention.

[0037] Figure 6 FIG. 4 is a cross-sectional view of a display layer and a sensor layer according to an embodiment of the present invention.

[0038] Figure 7 According to one embodiment of the present invention Figure 1A A cross-sectional view of the electronic device taken along line I-I'.

[0039] Description of Reference Numerals

[0040] 1000: electronic device; DM: display module; 100: display layer; 200: sensor layer; 300: built-in battery; 400: energy conversion layer; 500: driver chip; 600: processor DETAILED DESCRIPTION

[0041] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is "on" another component, "connected" or "combined with" another component, it means that the certain component can be directly configured / connected / combined on the other component, or a third-party component can be configured between them.

[0042] The same reference numerals represent the same components. In addition, in the drawings, the thickness, ratio and size of the components are exaggerated for effective description of the technical content. "And / or" includes all of the combinations of more than one defined for the components related to each other.

[0043] The terms first, second, etc. can be used to describe a variety of constituent elements, but the constituent elements are not limited to the terms. The terms are used only for the purpose of distinguishing one constituent element from other constituent elements. For example, without departing from the scope of the present invention, the first constituent element can be referred to as the second constituent element, and similarly, the second constituent element can also be referred to as the first constituent element. Unless the context clearly indicates a different meaning, a singular expression includes a plural expression.

[0044] In addition, the terms such as “below”, “lower side”, “above”, and “upper side” are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0045] The terms "including" or "having" should be understood as intending to specify the existence of the features, numbers, steps, actions, constituent elements, parts or their combinations recorded in the specification, but are not intended to preclude the existence or additional possibilities of one or more other features, numbers, steps, actions, constituent elements, parts or their combinations.

[0046] Unless defined differently, all terms (including technical terms and scientific terms) used in this specification have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs. In addition, terms that are the same as those defined in generally used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and unless explicitly defined, should not be interpreted as overly idealized or overly formalized meanings.

[0047] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0048] Figure 1A This is a perspective view showing a state where the electronic device according to one embodiment of the present invention is unfolded.

[0049] Reference Figure 1A , the electronic device 1000 may be a device activated by an electrical signal. For example, the electronic device 1000 may be a mobile phone, a tablet PC, a car navigation system, a game console, or a wearable device, but is not limited thereto. In the specification of the present invention, the electronic device 1000 is illustrated as an example of a mobile phone.

[0050] The electronic device 1000 may include a first display surface FS defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1. The electronic device 1000 may provide an image IM to a user through the first display surface FS. The image IM may include not only dynamic images but also static images. Figure 1A , a clock window and an icon are shown as an example of the image IM. The electronic device 1000 can display the image IM on the first display surface FS parallel to each of the first direction DR1 and the second direction DR2 toward the third direction DR3. Based on the direction in which the image IM is displayed, the front (or upper surface) and the back (or lower surface) of each structure can be defined. The front and back can be opposite to each other in the third direction DR3, and the normal direction of each of the front and back can be parallel to the third direction DR3.

[0051] The first display surface FS may include a first active area F-AA and a first peripheral area F-NAA. The first active area F-AA may include an electronic module area EMA. The electronic device 1000 may display an image IM through the first active area F-AA. Moreover, various forms of external inputs may be sensed in the first active area F-AA. The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a prescribed color. The first peripheral area F-NAA may surround the first active area F-AA. Thus, the shape of the first active area F-AA may be substantially defined by the first peripheral area F-NAA. However, this is only an illustrative illustration, and the first peripheral area F-NAA may also be configured adjacent to only one side of the first active area F-AA, and may also be omitted. The electronic device 1000 of an embodiment of the present invention may include active areas of various shapes, and is not limited to a certain embodiment.

[0052] The electronic device 1000 may include a second display surface RS. The second display surface RS may be defined as a surface facing at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of the electronic device 1000. In the inwardly folded state, the second display surface RS may be visible to the user.

[0053] A variety of electronic modules may be configured in the electronic module area EMA. For example, the electronic module may include at least one of a camera, a speaker, a light sensing sensor, and a heat sensing sensor. The electronic module area EMA may sense an external subject received through the first or second display surface FS, RS, or provide a sound signal such as voice to the outside through the first or second display surface FS, RS. The electronic module may also include multiple structures and is not limited to a certain embodiment.

[0054] The electronic module area EMA may be surrounded by the first active area F-AA and the first peripheral area F-NAA. However, the present invention is not limited thereto, and the electronic module area EMA may be disposed in the first active area F-AA, and is not limited to a certain embodiment.

[0055] The electronic device 1000 can sense external input applied from the outside. The external input may include various forms of input provided from the outside of the electronic device 1000. For example, the external input includes not only contact based on a part of the body such as a hand of the user, but also external input applied close to the electronic device 1000 or adjacent to it at a specified distance (e.g., hovering). And, it may have various forms such as force, pressure, temperature, light, etc.

[0056] In addition, Figure 1AThe first direction DR1 to the third direction DR3 are shown in the following drawings. The directions indicated by the first to third directions DR1, DR2, and DR3 described in this specification are relative concepts and can be changed to other directions. In addition, the directions indicated by the first to third directions DR1, DR2, and DR3 can be described as the first to third directions, and the same reference numerals can be used.

[0057] The electronic device 1000 may include at least one folding area FA1 and non-folding areas NFA1 and NFA2 adjacent to the folding area FA1. The non-folding areas NFA1 and NFA2 may be spaced apart from each other with the folding area FA1 interposed therebetween.

[0058] Figure 1B It is shown Figure 1A A perspective view showing a process in which an electronic device is folded inwardly.

[0059] Reference Figure 1B , the electronic device 1000 may be folded with the first folding axis FX1 as a reference. The first folding axis FX1 may be an imaginary axis extending along the second direction DR2. The first folding axis FX1 may be parallel to the long side direction of the electronic device 1000. The first folding axis FX1 may extend along the second direction DR2 on the first display surface FS.

[0060] The non-folding areas NFA1 and NFA2 may be arranged adjacent to the folding area FA1 with the folding area FA1 interposed therebetween. For example, the first non-folding area NFA1 may be arranged on one side of the folding area FA1 along the first direction DR1, and the second non-folding area NFA2 may be separated from the first non-folding area NFA1 and arranged on the other side of the folding area FA1 in the opposite direction of the first direction DR1.

[0061] The electronic device 1000 may be folded based on the first folding axis FX1 to be transformed into an in-folding state in which a region overlapping the first non-folding area NFA1 and another region overlapping the second non-folding area NFA2 of the first display surface FS face each other.

[0062] Figure 1C It is shown Figure 1A The electronic device is shown in a top view in a state where it is folded inward.

[0063] Reference Figure 1C, the electronic device 1000 can be folded inward, and the second display surface RS can be viewed by the user. At this time, the second display surface RS may include: a second active area R-AA, for displaying images; and a second peripheral area R-NAA, adjacent to the second active area R-AA. The second active area R-AA may be an area that displays images and can sense various forms of external inputs. The second peripheral area R-NAA may have a prescribed color. The second peripheral area R-NAA may surround the second active area R-AA. In addition, although not shown in the figure, the second display surface RS may also include an electronic module area for configuring an electronic module including a variety of structures, and is not limited to a certain embodiment.

[0064] Figure 1D It is a perspective view showing a process in which one embodiment of the present invention is folded outward.

[0065] Reference Figure 1D The electronic device 1000 can be folded based on the first folding axis FX1, thereby being deformed into an out-folding state in which an area overlapping the first non-folding area NFA1 and another area overlapping the second non-folding area NFA2 in the second display surface RS face each other.

[0066] However, the embodiment is not limited thereto, and can be folded based on multiple folding axes and folded so that parts of the first display surface FS and the second display surface RS face each other, and the number of folding axes and the number of corresponding non-folding areas are not particularly limited.

[0067] In one embodiment of the present invention, the electronic device 1000 may be configured to have a structure in which the inner folding or outer folding actions are repeated, but the embodiment is not limited thereto. In one embodiment, the electronic device 1000 may also be configured to be able to select one of the unfolding action, the inner folding action, and the outer folding action.

[0068] Figure 2A This is a perspective view showing a state where the electronic device according to one embodiment of the present invention is unfolded. Figure 2B It is shown Figure 2A A perspective view of the process of folding the electronic device shown. Figure 2A and Figure 2B In the process of explaining Figures 1A to 1D The components already described in the drawings will be labeled with the same reference numerals and their description will be omitted.

[0069] Reference Figure 2A and Figure 2B, the electronic device 1000-1 may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA and a first peripheral area F-NAA. The second display surface RS may be defined as a surface facing at least a portion of the first display surface FS. In the inwardly folded state, the second display surface RS may be visible to the user. The second display surface RS may include an electronic module area EMA for configuring an electronic module including a variety of structures. In addition, in one embodiment, an image may also be provided through the second display surface RS.

[0070] The electronic device 1000-1 may include a folding area FA2 and non-folding areas NFA3 and NFA4. The electronic device 1000-1 may include a plurality of non-folding areas NFA3 and NFA4. The plurality of non-folding areas NFA3 and NFA4 may include a first non-folding area NFA3 and a second non-folding area NFA4 separated and arranged across the folding area FA2.

[0071] The electronic device 1000 - 1 may be folded with reference to a second folding axis FX2 extending in a direction parallel to the second direction DR2 . Figure 2A 2 shows a case where the extending direction of the second folding axis FX2 is parallel to the extending direction of the short side of the electronic device 1000 - 1 . However, the embodiment is not limited thereto.

[0072] The folding area FA2 is equivalent to a portion that can be folded based on a second folding axis FX2 parallel to the second direction DR2. The folding area FA2 has a specified curvature and a curvature radius. In one embodiment, the first non-folding area NFA3 and the second non-folding area NFA4 may face each other, and the electronic device 1000-1 may be in-folded so that the first display surface FS is not exposed to the outside.

[0073] Furthermore, unlike the figure, in one embodiment, the electronic device 1000-1 can be folded outward (outer-folding) to expose the first display surface FS to the outside. In addition, in one embodiment, the electronic device 1000-1 can make the first display surface FS visible to the user in the unfolded state, and make the second display surface RS visible to the user in the inner folded state.

[0074] Figure 3 is a three-dimensional diagram of an electronic device according to an embodiment of the present invention. Figure 3 In the process of explaining Figures 1A to 1D The components already described in the drawings will be labeled with the same reference numerals and their description will be omitted.

[0075] Reference Figure 3, the electronic device 1000-2 may include a first display surface FS. The first display surface FS may include a first active area F-AA and a first peripheral area F-NAA. For example, the electronic device 1000-2 may be a rigid electronic device.

[0076] Figure 4 is a block diagram of an electronic device according to an embodiment of the present invention.

[0077] Reference Figure 4 , the electronic device 1000 may include: an electronic module EM, a power module PSM, a display module DM and an electronic optical module ELM.

[0078] The electronic module EM may include a processor 600, a wireless communication module 620, an image input module 630, an audio input module 640, an audio output module 650, a memory 660, and an external interface module 670. The modules may be mounted on a circuit board or electrically connected via a flexible circuit board. The electronic module EM may be electrically connected to the power supply module PSM.

[0079] The processor 600 can control the overall operation of the electronic device 1000. For example, the processor 600 can activate or deactivate the display module DM in accordance with the user input. The processor 600 can control the image input module 630, the audio input module 640, and the audio output module 650 in accordance with the user input. The processor 600 may include at least one microprocessor. The processor 600 may generate heat HT (refer to Figure 7 ).

[0080] The wireless communication module 620 can use Bluetooth or WiFi lines to send / receive wireless signals with other terminals. The wireless communication module 620 can use general communication lines to send / receive voice signals. The wireless communication module 620 may include: a sending circuit 622 that modulates and sends the signal to be sent; and a receiving circuit 624 that demodulates the received signal.

[0081] The image input module 630 can process the image signal and convert it into image data that can be displayed on the display module DM. The audio input module 640 can use a microphone to receive external audio signals in a recording mode or a voice recognition mode, and convert it into electrical voice data. The audio output module 650 can convert the audio data received from the wireless communication module 620 or the audio data stored in the memory 660 and output it to the outside.

[0082] The external interface module 670 may function as an interface for connecting to an external charger, a wired / wireless data port, a card slot (eg, a memory card, a SIM / UIM card), and the like.

[0083] The power module PSM can supply the power required for the overall operation of the electronic device 1000. The power module PSM can include a common battery device. For example, the power module PSM can include a rigid lithium-ion battery.

[0084] The display module DM may include a display layer 100, a built-in battery 300, and an energy conversion layer 400. The display layer 100 may generate an image.

[0085] The built-in battery 300 may be a drive chip 500 (see Figure 7 )Components that provide electrical power.

[0086] The energy conversion layer 400 may convert heat HT generated in the processor 600 or heat (eg, body temperature) generated by a user contacting the electronic device 1000 into electric energy and transfer it to the built-in battery 300. The energy conversion layer 400 may include a thermoelectric element that converts thermal energy into electric energy.

[0087] The built-in battery 300 can be charged according to the electric energy.

[0088] The display layer 100 , the internal battery 300 , and the energy conversion layer 400 will be described in more detail later.

[0089] The electronic optical module ELM may be an electronic component that outputs or receives an optical signal. The electronic optical module ELM may send or receive an optical signal through a portion of the display module DM. In this embodiment, the electronic optical module ELM may include a camera module CAM and a sensor module SNM. The camera module CAM may include a camera. The sensor module SNM may include a sensor. For example, the sensor may include an infrared sensor.

[0090] Figure 5 FIG. 4 is a cross-sectional view of a display layer and a sensor layer according to an embodiment of the present invention.

[0091] Reference Figure 5 The display layer 100 may include: a base layer 110 , a circuit layer 120 , a light emitting element layer 130 and an encapsulation layer 140 .

[0092] The base layer 110 may be a member providing a base surface for configuring the circuit layer 120. The base layer 110 may be a glass substrate, a metal substrate or a polymer substrate. However, the embodiment is not limited thereto, and the base layer 110 may be an inorganic layer, an organic layer or a composite material layer.

[0093] The base layer 110 may have a multi-layer structure. For example, the base layer 110 may include: a first synthetic resin layer, a silicon oxide (SiO x ) layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as a base barrier layer.

[0094] Each of the first and second synthetic resin layers may include a polyimide resin. Furthermore, each of the first and second synthetic resin layers may include at least one of an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. In addition, in this specification, a "~~" type resin means a functional group including "~~".

[0095] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by coating, deposition, and the like, and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by multiple photoresist processes. Subsequently, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 may be formed.

[0096] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting substance, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0097] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles.

[0098] Display module DM (refer to Figure 4) may further include a sensor layer 200. The sensor layer 200 may be formed on the display layer 100 through a continuous process. In this case, the sensor layer 200 may be described as being directly configured on the display layer 100. The so-called "direct configuration" may mean that no third-party component is configured between the sensor layer 200 and the display layer 100. That is, no additional bonding member may be configured between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 may be bonded to the display layer 100 through a bonding member. The bonding member may include a common bonding agent or adhesive.

[0099] Figure 6 is a cross-sectional view of a display layer and a sensor layer according to an embodiment of the present invention. Figure 6 In the process of explaining Figure 5 The components that have already been described will be denoted by the same reference numerals and their description will be omitted.

[0100] Reference Figure 6 At least one inorganic layer may be formed on the upper surface of the base layer 110. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed into multiple layers. The multiple layers of inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display layer 100 is illustrated as including a buffer layer BFL.

[0101] The buffer layer BFL may improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and the silicon nitride layer may be alternately stacked.

[0102] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, the present invention is not limited thereto, and the semiconductor pattern may also include amorphous silicon, low temperature polysilicon, or oxide semiconductor.

[0103] Figure 6 Only a portion of the semiconductor pattern is shown, and semiconductor patterns may be configured in other areas. The semiconductor patterns may be arranged according to specific rules within the pixel range. The electrical properties of the semiconductor pattern may be different depending on whether it is doped or not. The semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region, or may be doped at a lower concentration than the first region.

[0104] The conductivity of the first region is greater than that of the second region, and it can substantially act as an electrode or a signal line. The second region can substantially correspond to the active (or channel) of a transistor. In other words, a portion of the semiconductor pattern can be the active of a transistor, another portion can be the source or drain of the transistor, and another portion can be a connecting electrode or a connecting signal line.

[0105] Each pixel may have an equivalent circuit including seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit of the pixel may be deformed into various shapes. Figure 6 Schematically shows a transistor 100PC and a light emitting element 100PE included in a pixel.

[0106] The transistor 100PC may include a source SC1, an active electrode A1, a drain electrode D1, and a gate electrode G1. The source SC1, the active electrode A1, and the drain electrode D1 may be formed from a semiconductor pattern. The source SC1 and the drain electrode D1 may extend from the active electrode A1 in opposite directions to each other in a cross section. Figure 6 1 shows a portion of a connection signal line SCL formed from a semiconductor pattern. Although not shown separately, the connection signal line SCL can be electrically connected to the drain D1 of the transistor 100PC on a plane.

[0107] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may be stacked together on a plurality of pixels and cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but also the insulating layer of the circuit layer 120 described later may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above-mentioned substances, but is not limited thereto.

[0108] The gate G1 is disposed on the first insulating layer 10. The gate G1 may be a part of the metal pattern. The gate G1 may overlap the active A1. The gate G1 may be used as a mask in the process of doping the semiconductor pattern.

[0109] The second insulating layer 20 may be disposed on the first insulating layer 10 and cover the gate G1. The second insulating layer 20 may be stacked together on the pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single layer or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0110] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single layer or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0111] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 penetrating the first, second and third insulating layers 10, 20 and 30.

[0112] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0113] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 penetrating the fourth insulating layer 40 and the fifth insulating layer 50.

[0114] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0115] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element 100PE. For example, the light emitting element layer 130 may include an organic light emitting substance, a quantum dot, a quantum rod, a micro LED, or a nano LED. In the following, although the light emitting element 100PE is an organic light emitting element, it is not particularly limited thereto.

[0116] The light emitting element 100PE may include: a first electrode AE, a light emitting layer EL and a second electrode CE. The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a contact hole CNT-3 penetrating the sixth insulating layer 60.

[0117] The pixel definition film 70 may be disposed on the sixth insulating layer 60 and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel definition film 70. The opening 70-OP of the pixel definition film 70 exposes at least a portion of the first electrode AE.

[0118] The first active area F-AA (see Figure 1A ) and the second active area R-AA (refer to Figure 1C) may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In the present embodiment, the light emitting region PXA is defined to correspond to a partial region of the first electrode AE ​​exposed by the opening 70-OP.

[0119] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed in a region corresponding to the opening 70-OP. That is, the light-emitting layer EL may be formed separately in each of the plurality of pixels. In the case where the light-emitting layer EL is formed separately in each of the plurality of pixels, each of the plurality of light-emitting layers EL may emit light of at least one color of blue, red, and green. However, this is not limited thereto, and the light-emitting layer EL may also be provided together by being connected together on a plurality of pixels. In this case, the light-emitting layer EL may provide blue light, or may also provide white light.

[0120] The second electrode CE may be disposed on the light emitting layer EL. The second electrode CE may have an integral shape and be commonly disposed in a plurality of pixels.

[0121] Although not shown, a hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EL. The hole control layer may be disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be formed in a plurality of pixels in common using an open mask.

[0122] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 140 are not limited thereto.

[0123] The inorganic layer can protect the light emitting element layer 130 from moisture and oxygen, and the organic layer can protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but is not limited thereto.

[0124] The sensor layer 200 may be formed on the display layer 100 through a continuous process. In this case, it may be described as the sensor layer 200 being directly disposed on the display layer 100. The so-called "directly disposed" may mean that no third-party component is disposed between the sensor layer 200 and the display layer 100. That is, no additional bonding member may be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 may be bonded to the display layer 100 through a bonding member. The bonding member may include a common bonding agent or adhesive.

[0125] The sensor layer 200 may include a base insulating layer 201 , a first conductive layer 202 , a sensing insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0126] The base insulating layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride and silicon oxide. Alternatively, the base insulating layer 201 may also be an organic layer including epoxy resin, acrylic resin or imide resin. The base insulating layer 201 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3.

[0127] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure, or a multi-layer structure stacked along the third direction DR3.

[0128] The conductive layer of the single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, a metal nanocable, graphene, etc.

[0129] The conductive layer of the multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of titanium / aluminum / titanium, for example. The conductive layer of the multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0130] At least one of the sensing insulating layer 203 and the cap insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0131] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0132] Figure 7 According to one embodiment of the present invention Figure 1A A cross-sectional view of the electronic device taken along line I-I'.

[0133] Reference Figure 1B and Figure 7 , a first non-folding display area NFA1-D, a folding display area FA1-D, and a second non-folding display area NFA2-D may be defined in the display layer 100. The folding display area FA1-D may be folded based on the aforementioned first folding axis FX1. When viewed from a plane, the first non-folding display area NFA1-D may overlap with at least a portion of the first non-folding area NFA1, the folding display area FA1-D may overlap with the folding area FA1, and the second non-folding display area NFA2-D may overlap with at least a portion of the second non-folding area NFA2.

[0134] The electronic device 1000 may include a window WM, a shock absorbing layer SAL, a sensor layer 200, a display layer 100, a flexible circuit board FPCB, a panel protection layer PPL, a barrier layer BRL, a support plate FP, a protection layer TPU, a metal layer CU, a heat dissipation layer SHL, an insulating layer ISL, a built-in battery 300, an energy conversion layer 400, a driving chip 500, a processor 600 and first to tenth adhesive layers AL1~AL10.

[0135] The window WM may include: a hard coating layer HC, a window protection layer WP, a printing layer PIT and a window layer WIN.

[0136] The window layer WIN can protect the display layer 100 from scratches from the outside. The window layer WIN can have an optically transparent property. The window layer WIN can include glass. However, it is not limited thereto, and the window layer WIN can include a synthetic resin film.

[0137] The window layer WIN may have a multi-layer structure or a single-layer structure. For example, the window layer WIN may include a plurality of synthetic resin films bonded by an adhesive, or include a glass substrate and a synthetic resin film bonded by an adhesive.

[0138] The window protection layer WP may be disposed on the window layer WIN. The window protection layer WP may include a flexible plastic material such as polyimide or polyethylene terephthalate. The hard coating layer HC may be disposed on an upper surface of the window protection layer WP.

[0139] The printed layer PIT may be disposed on the lower surface of the window protection layer WP. The printed layer PIT may have a black color, but the color of the printed layer PIT is not limited thereto. The printed layer PIT may be adjacent to the frame of the window protection layer WP.

[0140] The first adhesive layer AL1 may be disposed between the window protection layer WP and the window layer WIN. Under the action of the first adhesive layer AL1, the window protection layer WP and the window layer WIN may be attached to each other. The first adhesive layer AL1 may cover the printing layer PIT.

[0141] The shock absorbing layer SAL may be disposed on the sensor layer 200. The shock absorbing layer SAL may absorb external shock applied from above the electronic device 1000 toward the sensor layer 200, thereby protecting the sensor layer 200. The shock absorbing layer SAL may be manufactured in a stretched film shape.

[0142] The impact absorbing layer SAL may include a flexible plastic material. The flexible plastic material may be defined as a synthetic resin film. For example, the impact absorbing layer SAL may include a flexible plastic material such as polyimide (PI) or polyethylene terephthalate (PET).

[0143] The second adhesive layer AL2 may be disposed between the window layer WIN and the impact absorbing layer SAL. Under the action of the second adhesive layer AL2, the window layer WIN and the impact absorbing layer SAL may be attached to each other.

[0144] The sensor layer 200 may be disposed below the shock absorbing layer SAL. The sensor layer 200 may include a flexible material.

[0145] The third adhesive layer AL3 may be disposed between the shock absorbing layer SAL and the sensor layer 200. Under the action of the third adhesive layer AL3, the shock absorbing layer SAL and the sensor layer 200 may be attached to each other.

[0146] The display layer 100 may be disposed below the sensor layer 200. The display layer 100 may include a flexible material. The display layer 100 may extend in a direction opposite to the first direction DR1. The extended portion may be electrically connected to the flexible circuit board FPCB.

[0147] The flexible circuit board FPCB may include a first portion FPCB1, a bent portion FPCBB, and a second portion FPCB2. The bent portion FPCBB is a portion extending from the first portion FPCB1, and the second portion FPCB2 is a portion extending from the bent portion FPCBB.

[0148] The first portion FPCB1 may contact the display layer 100 , the bent portion FPCBB is bent toward the back side of the display layer 100 , and the second portion FPCB2 is connected to the driving chip 500 and is mounted with the driving chip 500 .

[0149] The panel protection layer PPL may protect the lower portion of the display layer 100. The panel protection layer PPL may include a flexible plastic material, such as polyethylene terephthalate (PET).

[0150] A fourth adhesive layer AL4 may be disposed between the display layer 100 and the panel protection layer PPL. The display layer 100 and the panel protection layer PPL may be attached to each other using the fourth adhesive layer AL4.

[0151] The barrier layer BRL may be disposed under the panel protection layer PPL. The barrier layer BRL may improve resistance to a compressive force corresponding to external pressure. Therefore, the barrier layer BRL may play a role in preventing the display layer 100 from deforming. The barrier layer BRL may include a flexible plastic material such as polyimide or polyethylene terephthalate.

[0152] The barrier layer BRL may have a color that absorbs light. For example, the barrier layer BRL may have a black color. In this case, when the display layer 100 is viewed from above the display layer 100, components disposed under the barrier layer BRL may not be visible.

[0153] A fifth adhesive layer AL5 may be disposed between the panel protection layer PPL and the barrier layer BRL. The panel protection layer PPL and the barrier layer BRL may be attached to each other using the fifth adhesive layer AL5.

[0154] A sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support plate FP. The barrier layer BRL and the support plate FP may be attached to each other using the sixth adhesive layer AL6.

[0155] The sixth adhesive layer AL6 may overlap with the first and second non-folding display areas NFA1-D and NFA2-D, and may not overlap with the folding display area FA1-D when viewed from a plane. That is, the sixth adhesive layer AL6 may not be disposed in the folding display area FA1-D.

[0156] The support plate FP may be disposed under the barrier layer BRL. The support plate FP may have higher rigidity than the display layer 100 and the sensor layer 200 and is disposed under the display layer 100 and the sensor layer 200 so as to support the display layer 100 and the sensor layer 200.

[0157] The support plate FP may have a continuous integrated shape. The support plate FP may be disposed under the display layer 100 and support the display layer 100. The support plate FP may include a metal substance and / or a non-metal substance.

[0158] When viewed from a plane, a plurality of openings OP may be defined in a portion of the support plate FP that overlaps with the folding display area FA1-D. When viewed from a plane, the plurality of openings OP may overlap with the folding display area FA1-D. The plurality of openings OP may be formed spaced apart from each other in the first direction DR1, and may be formed by penetrating the support plate FP in the third direction DR3. The plurality of openings OP may be formed by a laser process or a micro blast process.

[0159] A plurality of openings OP are defined in the portion of the support plate FP overlapping the folding display area FA1-D, which can improve the flexibility of the portion of the support plate FP overlapping the folding display area FA1-D. Therefore, the support plate FP can be easily folded around the folding display area FA1-D.

[0160] The support plate FP may include a folding portion FA-FP, a first non-folding portion NFA1-FP, and a second non-folding portion NFA2-FP. The portion of the support plate FP provided with a plurality of openings OP may be defined as the folding portion FA-FP. The folding portion FA-FP is oriented with a first folding axis FX1 (refer to FIG. 1 ) extending in a second direction DR2 intersecting the first direction DR1. Figure 1B ) is folded as the basis.

[0161] The portion of the support plate FP that is not provided with the plurality of opening portions OP may be defined as a first non-folding portion NFA1-FP or a second non-folding portion NFA2-FP. The portion of the support plate FP that extends from the folding portion FA-FP in the first direction DR1 may be referred to as the first non-folding portion NFA1-FP, and the portion of the support plate FP that is separated from the first non-folding portion NFA1-FP via the folding portion FA-FP may be referred to as the second non-folding portion NFA2-FP.

[0162] The protective layer TPU may be disposed under the support plate FP. When viewed from a plane, the protective layer TPU may overlap the folding portion FA-FP. The protective layer TPU may prevent foreign matter from entering the plurality of openings OP provided in the folding portion FA-FP. The protective layer TPU may include thermoplastic polyurethane. However, this is not limited thereto.

[0163] The seventh adhesive layer AL7 may be disposed between the support plate FP and the protective layer TPU. Under the action of the seventh adhesive layer AL7, the support plate FP and the protective layer TPU may be attached to each other.

[0164] The metal layer CU may be disposed under the protective layer TPU. The metal layer CU may prevent the folding portion FA-FP from being deformed due to heat. The metal layer CU may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The metal layer CU may be separated into two under the folding portion FA-FP. When viewed from a plane, the metal layer CU may not overlap at least a portion of the folding portion FA-FP.

[0165] The eighth adhesive layer AL8 may be disposed between the protective layer TPU and the metal layer CU. Under the action of the eighth adhesive layer AL8, the protective layer TPU and the metal layer CU may be bonded to each other.

[0166] The eighth adhesive layer AL8 may overlap with the first and second non-folding display areas NFA1-D and NFA2-D. When viewed from a plane, the eighth adhesive layer AL8 may not overlap with at least a portion of the folding display area FA1-D.

[0167] The heat dissipation layer SHL may be disposed under the metal layer CU. The heat dissipation layer SHL may include at least one of graphite, copper (Cu) and aluminum (Al) having good heat dissipation properties, but is not limited thereto. The heat dissipation layer SHL not only improves the heat dissipation properties, but also may have electromagnetic wave shielding or electromagnetic wave absorption properties. The heat dissipation layer SHL may be separated into two under the folding portion FA-FP. When viewed from a plane, the heat dissipation layer SHL may not overlap with at least a portion of the folding portion FA-FP.

[0168] The ninth adhesive layer AL9 may be disposed between the metal layer CU and the heat dissipation layer SHL. Under the effect of the ninth adhesive layer AL9, the metal layer CU and the heat dissipation layer SHL may be attached to each other.

[0169] The ninth adhesive layer AL9 may overlap with the first and second non-folding display areas NFA1-D and NFA2-D. When viewed from a plane, the ninth adhesive layer AL9 may not overlap with at least a portion of the folding display area FA1-D.

[0170] The insulating layer ISL may be disposed below the heat dissipation layer SHL and above the built-in battery 300. The insulating layer ISL may prevent an electrical short circuit between the heat dissipation layer SHL and the built-in battery 300. The insulating layer ISL may include an electrical insulating tape. The electrical insulating tape may include a synthetic resin layer with strong electrical insulation and an adhesive layer. The insulating layer ISL may be separated into two below the folding portion FA-FP. When viewed from a plane, the insulating layer ISL may not overlap with at least a portion of the folding portion FA-FP.

[0171] The tenth adhesive layer AL10 may be disposed between the heat dissipation layer SHL and the insulating layer ISL. Under the effect of the tenth adhesive layer AL10, the heat dissipation layer SHL and the insulating layer ISL may be attached to each other.

[0172] The tenth adhesive layer AL10 may overlap with the first and second non-folding display areas NFA1-D and NFA2-D. When viewed from a plane, the tenth adhesive layer AL10 may not overlap with at least a portion of the folding display area FA1-D.

[0173] The first to tenth adhesive layers AL1 ˜ AL10 may include a transparent adhesive such as a pressure sensitive adhesive (PSA: Pressure Sensitive Adhesive) or an optically clear adhesive (OCA: Optically Clear Adhesive), but the type of the adhesive is not limited thereto.

[0174] The internal battery 300 may be disposed under the insulating layer ISL. When viewed from a planar perspective, the internal battery 300 may be disposed overlapping at least a portion of the second unfolded portion NFA2-FP. Figure 7 The internal battery 300 is shown overlapping only the second unfolded portion NFA2-FP, but when viewed from a planar perspective, the internal battery 300 may also be arranged to overlap at least a portion of each of the first unfolded portion NFA1-FP and the second unfolded portion NFA2-FP.

[0175] The built-in battery 300 can store electric energy and supply the stored electric energy to the driving chip 500 .

[0176] The built-in battery 300 may be a lithium-ion battery. The thickness of the lithium-ion battery may be about 500 um or less. That is, the built-in battery 300 may be a thin battery.

[0177] Alternatively, the built-in battery 300 may be a stretchable battery. In the case of a stretchable battery, the built-in battery 300 may be composed of an organogel. In the case where the material of the built-in battery 300 includes an organogel, the adhesion of the built-in battery 300 may be improved by irradiating the organogel with an electron beam (E-Beam). Adhesion may be imparted by irradiating the built-in battery 300 with an electron beam (E-Beam), and the built-in battery 300 may be used as an adhesive to attach the lower structure of the built-in battery 300. In this case, there is no need to provide an additional adhesive layer. However, the present invention is not limited thereto.

[0178] According to the present invention, in addition to the power supply module PSM (refer to Figure 4 ) in addition to the battery device in the display module DM (refer to Figure 4 ) can be additionally equipped with a built-in battery 300. Since the built-in battery 300 can provide a voltage for driving the display layer 100, the power supply module PSM (refer to Figure 4 ) in the size and thickness of the battery device. Thus, it is possible to ensure a surplus space of the lower structure of the electronic device 1000. By ensuring the space, the thickness of the electronic device 1000 can be reduced. Therefore, a light and thin electronic device 1000 can be provided.

[0179] Furthermore, according to the present invention, the built-in battery 300 integrally built into the display module of the electronic device 1000 can supply power in an emergency, thereby being used as an auxiliary power source. Figure 4 ) is completely discharged, the display module DM (refer to Figure 4 ) to drive the electronic device 1000. Therefore, the electronic device 1000 with improved reliability can be provided.

[0180] The energy conversion layer 400 may be disposed under the internal battery 300. The internal battery 300 and the energy conversion layer 400 may be attached to each other using an adhesive layer (not shown). When viewed from a plane, the energy conversion layer 400 may overlap at least a portion of the second non-folding portion NFA2-FP. Figure 7 The energy conversion layer 400 is shown to overlap only with the second non-folding part NFA2-FP, but when observed from a plane, the energy conversion layer 400 can also be configured to overlap with at least a portion of the first non-folding part NFA1-FP and the second non-folding part NFA2-FP depending on the arrangement state of the built-in battery 300.

[0181] The energy conversion layer 400 may convert the heat HT generated in the processor 600 or the heat generated by the user contacting the electronic device 1000 into electric energy. The energy conversion layer 400 may transfer the electric energy to the built-in battery 300 .

[0182] The energy conversion layer 400 may be a thermoelectric element. The thermoelectric element may operate at room temperature. The thermoelectric element may be composed of at least one of a bismuth-telluride (Bi-Te) compound, a mixed compound including a bismuth-telluride (Bi-Te) compound, a silicon compound, and a zinc-antimony (Zn-Sb) compound.

[0183] The driver chip 500 may be disposed under the energy conversion layer 400. The energy conversion layer 400 and a portion of the second portion FPCB2 may be attached to each other using an adhesive layer (not shown). When viewed from a plane, the driver chip 500 may overlap at least a portion of the second non-folding portion NFA2-FP. Figure 7 The driving chip 500 is shown to overlap only the second non-folding part NFA2-FP, but when viewed from a plane, the driving chip 500 may also overlap at least a portion of each of the first non-folding part NFA1-FP and the second non-folding part NFA2-FP.

[0184] The driving chip 500 may receive power from the built-in battery 300. The driving chip 500 may be connected to the display layer 100 through the flexible circuit board FPCB and provide a driving voltage to the display layer 100.

[0185] The processor 600 may be disposed under the driver chip 500. The driver chip 500 and the processor 600 may be attached to each other using an adhesive layer (not shown). When viewed from a plane, the processor 600 may overlap at least a portion of the second non-folding portion NFA2-FP. Figure 7 The processor 600 is shown overlapping only the second non-folding portion NFA2-FP, but when viewed from a plane, the processor 600 may also be configured to overlap at least a portion of each of the first non-folding portion NFA1-FP and the second non-folding portion NFA2-FP.

[0186] The processor 600 may control the overall operation of the electronic device 1000. The processor 600 may generate heat HT in the process of performing the control operation.

[0187] The heat HT generated in the processor 600 may be moved to the energy conversion layer 400 through the driving chip 500 and the second part FPCB2 of the flexible circuit board FPCB. The energy conversion layer 400 may convert the heat HT into electric energy. The electric energy may be stored in the built-in battery 300. The electric energy stored in the built-in battery 300 may be transferred to the driving chip 500. The driving chip 500 may receive the electric energy and provide a driving voltage to the display layer 100.

[0188] According to the present invention, the heat HT generated when the processor 600 is driven or the heat generated when the user contacts the electronic device 1000 can be converted into electric energy and used to drive the display layer 100. That is, the display module DM (refer to Figure 4 ) to supply power by itself. Therefore, the power required to drive the electronic device 1000 can be saved. When the required power is reduced, the main battery, namely the power module PSM (refer to Figure 4 ) in the battery device. Therefore, a surplus space can be ensured in the lower structure of the electronic device 1000.

[0189] Although the above description is made with reference to the preferred embodiments of the present invention, it is understood by those skilled in the art or those of ordinary skill in the art that various modifications and changes may be made to the present invention without departing from the concept of the present invention and the technical scope of the present invention as described in the attached claims. Therefore, the technical scope of the present invention should not be limited to the contents described in the specific embodiments of the specification, but should be defined by the attached claims.

Claims

1. An electronic device, wherein: include: The display layer is defined with a first non-folding display area, a second non-folding display area, and a folding display area, wherein the second non-folding display area is separated from the first non-folding display area in a first direction, and the folding display area is arranged between the first non-folding display area and the second non-folding display area; a support plate, arranged under the display layer and comprising a folding portion, a first non-folding portion and a second non-folding portion, wherein the folding portion can be folded with a folding axis as a reference, the folding axis extends along a second direction intersecting the first direction, the first non-folding portion extends from the folding portion along the first direction, and the second non-folding portion is separated from the first non-folding portion via the folding portion; A built-in battery is arranged under the support plate; an energy conversion layer, disposed below the built-in battery and electrically connected to the built-in battery; A driving chip, disposed under the energy conversion layer and electrically connected to the built-in battery and the display layer; as well as The processor is configured under the driving chip and is used to drive the driving chip.

2. The electronic device according to claim 1, wherein: When viewed from a planar perspective, the internal battery overlaps at least a portion of the second unfolded portion.

3. The electronic device according to claim 1, wherein: When viewed from a planar perspective, the energy conversion layer overlaps at least a portion of the second unfolded portion.

4. The electronic device according to claim 1, wherein: When viewed from a planar perspective, the driving chip overlaps at least a portion of the second unfolded portion.

5. The electronic device according to claim 1, wherein: When viewed from a planar perspective, the processor overlaps at least a portion of the second unfolded portion.

6. The electronic device according to claim 1, wherein: The driving chip is electrically connected to the display layer through a flexible circuit board. The flexible circuit board includes a first portion, a bent portion extending from the first portion, and a second portion extending from the bent portion. The first portion is in contact with the display layer, The bent portion is bent toward the back side of the display layer, The driving chip is mounted on the second part.

7. The electronic device according to claim 1, wherein: The energy conversion layer converts heat generated in the processor into electrical energy.

8. The electronic device according to claim 7, wherein: The built-in battery stores the electric energy and supplies the electric energy to the driving chip.

9. The electronic device according to claim 8, wherein: The driving chip receives the electric energy and provides a driving voltage to the display layer.

10. The electronic device according to claim 1, wherein: The energy conversion layer includes a substance that operates at room temperature.

11. The electronic device according to claim 1, wherein: A plurality of openings are defined in the folded portion, The plurality of openings are spaced apart in the first direction.

12. The electronic device according to claim 1, wherein: It also includes a protective layer, a metal layer, a heat dissipation layer and an insulating layer. The protection layer, the metal layer, the heat dissipation layer, and the insulation layer are disposed between the support plate and the built-in battery.

13. The electronic device according to claim 12, wherein: The protection layer is arranged below the support plate, and when viewed from a plane, the protection layer overlaps with the folded portion.

14. The electronic device according to claim 12, wherein: The metal layer is disposed below the protective layer, and when viewed from a plane, the metal layer does not overlap with at least a portion of the folded portion.

15. The electronic device according to claim 12, wherein: The heat dissipation layer is arranged below the metal layer, and when viewed from a plane, the heat dissipation layer does not overlap with at least a portion of the folded portion.

16. The electronic device according to claim 12, wherein: The insulating layer is arranged below the heat dissipation layer and above the internal battery, and when viewed from a planar perspective, the insulating layer does not overlap at least a portion of the folded portion.

17. An electronic device, wherein: include: Display layer, A support plate is arranged below the display layer. A built-in battery is arranged under the support plate. The energy conversion layer is disposed under the built-in battery and is electrically connected to the built-in battery. A driving chip is disposed under the energy conversion layer and is electrically connected to the built-in battery and the display layer. a processor, configured under the driver chip and used to drive the driver chip, and A flexible circuit board electrically connecting the driving chip and the display layer; The flexible circuit board includes a first portion, a bent portion extending from the first portion, and a second portion extending from the bent portion. The first portion is in contact with the display layer, The bent portion is bent toward the back side of the display layer, The driving chip is mounted on the second part.

18. The electronic device according to claim 17, wherein: The energy conversion layer converts heat generated in the processor into electrical energy.

19. The electronic device according to claim 18, wherein: The built-in battery stores the electric energy and supplies the electric energy to the driving chip.

20. The electronic device according to claim 19, wherein: The driving chip receives the electric energy and provides a driving voltage to the display layer.

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