High-temperature superconducting current lead and superconducting magnet system

Abstract

The invention belongs to the field of high-temperature superconducting current leads of superconducting magnet systems, and particularly discloses a high-temperature superconducting current lead and a superconducting magnet system. According to the application, the cover plate and the bottom plate are additionally arranged, and the high-temperature superconducting tape is fixed in the middle and is tightly attached, so that external force borne by the high-temperature superconducting tape in the processes of assembly, transportation, installation, cooling, excitation and the like can be transferred to the reinforcing structure, and therefore, stress concentration and deformation on the high-temperature superconducting tape are eliminated, and the service life of the high-temperature superconducting tape is prolonged. The thermal performance and the electrical performance of the lead can be considered, and the possibility that the lead is subjected to mechanical damage due to shear stress and stripping stress is eliminated.

Description

Technical Field

[0001] The present application belongs to the field of high-temperature superconducting current leads for superconducting magnet systems, and more specifically, to a high-temperature superconducting current lead and a superconducting magnet system. Background Art

[0002] In a superconducting magnet system, high-temperature superconducting current leads are responsible for conducting current between the primary and secondary parts of the system. Once a quench occurs in the leads, the magnet will be at great risk of quenching. Therefore, current leads with high reliability are an important part of the system.

[0003] The design of HTS current leads needs to consider three aspects: electricity, heat, and force. In terms of electricity, it is necessary to ensure that the current capacity of the leads is greater than the magnet excitation current under the background magnetic field. In terms of heat, it is necessary to ensure that the secondary heat leakage brought to the system by the leads is as small as possible. In terms of mechanics, since the HTS tape is a multi-layer structure and the HTS material inside is a brittle ceramic material, the lateral shear stress or interlayer peeling stress can easily cause irreversible damage to it, which in turn leads to a serious decrease in its current capacity or even burns it out. However, existing current lead structures all ignore mechanical design. Summary of the invention

[0004] In view of the defects of the prior art, the purpose of this application is to provide a high-temperature superconducting current lead and superconducting magnet system, aiming to take into account the thermal and electrical properties of the lead while eliminating the possibility of mechanical damage to the lead due to lateral shear stress and / or interlayer peeling stress during assembly, transportation, installation, cooling, excitation, etc.

[0005] The first aspect of the present application relates to a high-temperature superconducting current lead, which includes: a cover plate, a base plate, a connecting terminal and a high-temperature superconducting tape; the two ends of the high-temperature superconducting tape are respectively matched and connected with the connecting terminals; the cover plate and the base plate fix the high-temperature superconducting tape in the middle and form a tight fit so that it does not produce lateral displacement during the excitation process.

[0006] In some embodiments, a buffer layer is provided on the upper surface and / or the lower surface of the high temperature superconducting tape.

[0007] In some embodiments, the buffer layer is an elastic low-temperature resistant soft material.

[0008] In some embodiments, the cross-sectional shapes of the cover plate and the bottom plate are complementary and match the cross-sectional shape of the high temperature superconducting tape so as to completely fix it between the cover plate and the bottom plate.

[0009] In some embodiments, the cross-sections of the cover plate and the bottom plate are L-shaped, forming a complementary double L-shaped structure.

[0010] In some embodiments, the high-temperature superconducting current lead further includes a fixing member for reinforcing the multilayer structure consisting of the cover plate-high-temperature superconducting tape-bottom plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

[0011] In some embodiments, the fixing members are clamps, cable ties or screws, and are evenly distributed along the length direction of the lead wire.

[0012] In some embodiments, the bottom plate is provided with a groove near the high-temperature end of the lead, and a gap space is formed between the groove and the cover plate.

[0013] A second aspect of the present application relates to a superconducting magnet system, comprising a high-temperature superconducting current lead according to any one of the embodiments of the present application.

[0014] In some embodiments, the superconducting magnet system is applied to MRI, NMR, STM, PPMS, magneto-optical systems, and quantum computing systems.

[0015] In general, the above technical solutions conceived by this application have the following beneficial effects compared with the prior art: (1) The present application provides a high-temperature superconducting current lead, with a newly added cover plate and bottom plate, which fix the high-temperature superconducting tape in the middle and form a tight fit, so that the external force applied to the high-temperature superconducting tape during assembly, transportation, installation, cooling, excitation, etc. can be transferred to the reinforcement structure, thereby eliminating stress concentration and deformation on the high-temperature superconducting tape. While taking into account the thermal and electrical properties of the lead, the possibility of the lead being mechanically damaged due to lateral shear stress and / or interlayer peeling stress can be eliminated.

[0016] (2) The present application provides a superconducting magnet system, which has a mechanical performance enhancement design for the weak point of the system, the high-temperature superconducting current lead. Compared with the traditional superconducting magnet system, the operating stability is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a high-temperature superconducting current lead structure provided in an embodiment of the present application.

[0018] Figure 2 An exploded view of a meandering multilayer structure provided in an embodiment of the present application.

[0019] Figure 3 The cross-sectional structure and mechanical schematic diagram of the double L-shaped structure provided in the embodiment of the present application.

[0020] Figure 4 A schematic diagram of the clamp mechanics provided in an embodiment of the present application.

[0021] Figure 5A schematic diagram of the bottom plate groove structure provided in an embodiment of the present application.

[0022] Figure 6 A schematic diagram of the multi-segment structure of the cover plate provided in an embodiment of the present application.

[0023] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein: 1 is a cover plate, 2 is a bottom plate, 3 is a fixture, 4 is a copper terminal, 5 is a YBCO tape, 6 is a buffer layer, and 101, 102, 103 are multiple segments of the cover plate. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] The term "and / or" in this article is a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The symbol " / " in this article indicates that the associated objects are in an or relationship, for example, A / B means A or B.

[0026] The terms "first" and "second" in the specification and claims herein are used to distinguish different objects rather than to describe a specific order of the objects. For example, a first response message and a second response message are used to distinguish different response messages rather than to describe a specific order of the response messages.

[0027] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0028] In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more than two. For example, multiple processing units refer to two or more processing units, etc.; multiple elements refer to two or more elements, etc.

[0029] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0030] The present application provides a high-temperature superconducting current lead, comprising: a cover plate, a base plate, a connecting terminal and a high-temperature superconducting tape; the two ends of the high-temperature superconducting tape are respectively matched and connected with the connecting terminals; the cover plate and the base plate fix the high-temperature superconducting tape in the middle and form a tight fit so that it does not produce lateral displacement during the excitation process.

[0031] The high temperature superconducting tape includes but is not limited to: YBCO (yttrium barium copper oxide), Bi-2223 and iron-based superconductor. Optionally, the high temperature superconducting tape is provided with protective layers on both the upper and lower surfaces.

[0032] Preferably, a buffer layer is provided on the upper surface and / or the lower surface of the high temperature superconducting tape. This design can effectively eliminate the phenomenon of local compressive stress or peeling stress concentration of the high temperature superconducting tape due to the uneven surface of the cover plate and the bottom plate, and eliminate the possibility of local damage to the high temperature superconducting tape during lead assembly, transportation, installation, cooling, excitation, etc.

[0033] Preferably, the buffer layer is made of an elastic low-temperature resistant soft material, and the elastic low-temperature resistant soft material includes but is not limited to: Kapton, Teflon, Mylar, and glass fiber cloth.

[0034] Preferably, the buffer layer has a width equal to that of the high-temperature superconducting tape, and a length equal to that of the high-temperature superconducting tape between the cover plate and the bottom plate.

[0035] Optionally, the high temperature superconducting tapes sandwiched between the buffer layers are one or more connected in parallel, and the number of the high temperature superconducting tapes depends on the critical current of a single high temperature superconducting tape and the operating current of the current lead.

[0036] Preferably, the cross-sectional shapes of the cover plate and the bottom plate are complementary and match the cross-sectional shape of the high-temperature superconducting tape so as to completely fix it between the cover plate and the bottom plate.

[0037] Preferably, the cross-sections of the cover plate and the bottom plate are L-shaped, forming a complementary double L-shaped structure, which can completely cover the high-temperature superconducting tape. This design isolates the high-temperature superconducting tape from the outside world, and the double L-shaped structure can still effectively reinforce the multilayer structure when the thickness of the multilayer structure inside it changes, facilitating processing while protecting the high-temperature superconducting tape from damage in the process of assembly, transportation, installation, etc. The length and width of the L-shape can be designed according to actual needs.

[0038] Preferably, the high-temperature superconducting current lead further includes a fixing piece for reinforcing the multilayer structure consisting of the cover plate-high-temperature superconducting tape-bottom plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

[0039] The fixings are clamps, cable ties or screws, and are evenly distributed in the length direction. This design ensures that even in a strong background magnetic field, the Lorentz force on the high-temperature superconducting tape can be evenly transferred to the reinforcement structure, thereby eliminating stress concentration and deformation on the high-temperature superconducting tape, effectively avoiding damage to the tape, and significantly improving the lead strength and working ability under a strong background magnetic field.

[0040] Preferably, the fixing member is a clamp. The clamp is evenly distributed on both sides of the cover plate and the bottom plate, and a bolt structure is used to apply pressure to uniformly reinforce the multi-layer structure of the cover plate-high temperature superconducting tape-bottom plate. The clamp is pressurized by using a torque wrench to rotate the bolt structure on both sides of the clamp to apply pressure. Optionally, the clamp is made of high-strength materials, including but not limited to: stainless steel, brass and G10.

[0041] Preferably, the cover plate and the bottom plate are serpentine structures in the length direction, and the bending radius is not less than the minimum curvature radius of the high-temperature superconducting tape for normal operation. This design can effectively increase the length of the current lead within the limited low-temperature container space, thereby increasing the lead thermal resistance and reducing the lead conduction heat leakage.

[0042] Preferably, the bottom plate is provided with a groove near the high-temperature end of the lead, and a gap space is formed between the groove and the cover plate. This design can store the length of part of the high-temperature superconducting tape in it when the lead is assembled. On the one hand, it solves the installation fit problem caused by the inconsistency between the actual length of the high-temperature superconducting tape and the designed length during the lead assembly process, so that the multi-layer structure of the cover plate-high-temperature superconducting tape-bottom plate outside the groove area can form a stable and fit firm structure, and does not apply additional tensile stress or shear stress to the high-temperature superconducting tape. On the other hand, the redundant high-temperature superconducting tape in the groove can effectively eliminate the tensile stress along the length direction of the high-temperature superconducting tape caused by the inconsistent thermal shrinkage coefficients of the cover plate, bottom plate, (buffer layer), and high-temperature superconducting tape during the cooling process of the lead.

[0043] Optionally, a groove is formed on the bottom plate by increasing the bending radius of the bottom plate close to the high-temperature end of the lead wire.

[0044] Preferably, the length of the high temperature superconducting tape is longer than the length of the cover plate, and shorter than the length of the bottom plate on which the high temperature superconducting tape is placed. This design allows the high temperature superconducting tape to have a certain amount of movement and expansion space between the cover plate and the bottom plate.

[0045] Preferably, the cover plate is a segmented structure along the length direction. This design ensures that during the lead assembly process, by installing the segmented cover plate from the low-temperature end of the lead, the redundant high-temperature superconducting tape can be smoothly stored in the groove area of ​​the bottom plate while ensuring that the multi-layer structure of the cover plate-high-temperature superconducting tape-bottom plate outside the groove area forms a stable structure.

[0046] Preferably, additional platforms are extended from both ends of the bottom plate, and threaded holes are provided on the platforms for matching and connecting with the connecting terminals.

[0047] Preferably, the connection terminal is a square copper block having a screw hole for matching with the base plate and a groove for matching with the high-temperature superconducting tape. The connection terminal and the base plate are connected by a bolt structure. Optionally, the connection terminal can be made of oxygen-free copper.

[0048] Optionally, the high-temperature superconducting tape and the connection terminal are connected by welding using high-strength solder, including Sn63Pb37 and Sn60Pb40.

[0049] Optionally, the materials of the cover plate and the base plate include but are not limited to: GFRP (glass fiber reinforced plastic) or CFRP (carbon fiber reinforced composite material). These materials have the characteristics of low thermal conductivity and high strength, which can reduce heat leakage of the lead and improve the mechanical properties of the lead.

[0050] Example In this embodiment, the high temperature superconducting tape is a YBCO tape, and the connecting terminal is a copper terminal.

[0051] like Figure 1 As shown, a high-temperature superconducting current lead provided in this embodiment includes: a cover plate 1, a bottom plate 2, a clamp 3, a copper terminal 4 and a YBCO tape 5, the left end is the high-temperature end of the lead, and the right end is the low-temperature end of the lead. Among them, the material of the cover plate 1 and the bottom plate 2 is G10, which has both high strength and low thermal conductivity characteristics. The material of the clamp 3 is stainless steel, which has the characteristics of high strength. The material of the copper terminal 4 is oxygen-free copper with RRR (metal residual conductivity) greater than 50, which has a low resistivity and can reduce the Joule heat of the copper terminal at the low-temperature end of the lead. The YBCO tape 5 uses a copper tape with a surface protective copper layer thickness of 5 um, which has a certain strength and low thermal conductivity, and the surface copper layer can also form a firm copper-copper welding joint with the copper terminal.

[0052] like Figure 1 As shown, the copper terminal 4 is a square copper block, which has a groove for placing the YBCO belt 5, four positioning screw holes and an assembly screw hole. The groove is used to form a welding joint with the YBCO belt 5, the positioning hole is used to cooperate with the positioning screw holes on the platform extending from both ends of the bottom plate 2, and the assembly screw hole is used to cooperate with other conductive parts when assembling the current lead. The present application adopts the above structure, and a tight and firm welding joint can be formed between the copper terminal 4 and the YBCO belt 5, and a tight bolt structure can also be formed between the copper terminal 4 and the bottom plate 2, so that the lead becomes a compact whole, which significantly enhances the ability of the lead to resist external forces and reduces the possibility of mechanical damage to the lead during assembly, transportation, installation, cooling, excitation, etc.

[0053] like Figure 1 As shown, multiple groups of clamps 3 are evenly placed along the length direction of the lead wire, and through holes are provided on the clamps on both sides of the cover plate 1 and the bottom plate 2. A torque wrench is used to rotate the bolt structure on both sides of the clamp to apply pressure, and the internal multi-layer structure is evenly reinforced. The present application adopts the above structure, and even under a strong background magnetic field, the Lorentz force on the current lead wire can be effectively and evenly transferred to the reinforcement structure, thereby eliminating stress concentration and deformation on the YBCO tape 5, effectively avoiding damage to the tape, and significantly improving the lead wire strength and working ability under a strong background magnetic field.

[0054] like Figure 2 As shown, the cover plate 1 and the bottom plate 2 are serpentine structures in the length direction, and the minimum bending radius is not less than the minimum curvature radius of 15 mm for the normal operation of the YBCO tape 5. The present application adopts the above structure, which can effectively increase the length of the current lead in the limited low-temperature container space, thereby increasing the thermal resistance of the lead and reducing the heat leakage of the lead conduction. The high-temperature superconducting current lead also includes a buffer layer 6, which is located on the upper and lower surfaces of the YBCO tape 5 and forms a close fit. The buffer layer 6 uses Kapton film, which can produce a good buffering effect.

[0055] like Figure 2 As shown, the length of the YBCO tape 5 is slightly longer than the length of the cover plate 1, but slightly shorter than the length of the base plate 2 that can accommodate the YBCO tape 5. The present application adopts the above structure, so that in the groove area near the high-temperature end of the lead, the YBCO tape 5 can have a certain amount of movement and expansion space between the cover plate 1 and the base plate 2.

[0056] like Figure 2 As shown, the width of the buffer layer 6 is equal to the width of the YBCO tape 5, and the length is equal to the length of the YBCO tape 5 between the cover plate 1 and the bottom plate 2, and it is placed on both sides of the YBCO tape 5 and sandwiched between the cover plate 1 and the bottom plate 2. The present application adopts the above structure, and uses elastic low-temperature resistant soft material as the buffer belt between the cover plate 1 and the bottom plate 2 and the YBCO tape 5, which can effectively reduce the local compressive stress or peeling stress concentration of the YBCO tape 5 caused by the uneven surface of the cover plate 1 and the bottom plate 2, and eliminate the possibility of local damage to the YBCO tape 5 during lead assembly, transportation, installation, cooling, excitation, etc.

[0057] like Figure 3 As shown, the cross-sections of the cover plate 1 and the bottom plate 2 are L-shaped structures, and the double L-shaped structures complement each other, so that the multi-layer structure of the buffer layer 6-YBCO tape 5-buffer layer 6 can be completely fixed inside the double L-shaped structure.

[0058] like Figure 3As shown, the YBCO tape 5 may be subjected to external forces F1 in various directions during lead assembly, transportation, and installation. The double L-shaped structure formed by the cover plate 1 and the bottom plate 2 exerts reaction forces F2 and F3 equal in magnitude and opposite in direction to the external forces on the YBCO tape 5, thereby protecting the YBCO tape 5 from mechanical damage.

[0059] The present application adopts the above structure to isolate the YBCO tape 5 from the outside world, and can protect the YBCO tape 5 from mechanical damage during lead assembly, transportation, installation, etc., and the double L-shaped structure can still effectively reinforce the multi-layer structure when the thickness of the multi-layer structure inside it changes.

[0060] like Figure 4 As shown, the YBCO tape 5 may be subjected to a Lorentz force perpendicular to the length direction of the tape during the excitation process, which will lead to huge transverse shear stress and interlayer peeling stress at the fixed position of the YBCO tape 5. The clamp 3 applies a compressive stress perpendicular to the surface direction of the tape to the cover plate 1 and the bottom plate 2, and reinforces the multilayer structure composed of the cover plate-high-temperature superconducting tape-bottom plate perpendicular to the surface direction of the high-temperature superconducting tape, so that the Lorentz force on the YBCO tape 5 is evenly transferred to the reinforcement structure, thereby eliminating the stress concentration and deformation on the YBCO tape 5.

[0061] like Figure 5 As shown, the bending radius of the part of the bottom plate 2 near the high-temperature end of the lead is increased, so that a groove appears on the bottom plate 2, and a gap is formed between the bottom plate 2 and the cover plate 1. The present application adopts the above structure, so that the length of part of the YBCO tape 5 can be stored in the groove during the lead assembly. On the one hand, this design detail solves the installation fit problem caused by the inconsistency between the actual length of the YBCO tape 5 and the designed length during the lead assembly process, so that the multi-layer structure of the cover plate 1-buffer layer 6-YBCO tape 5-buffer layer 6-bottom plate 2 outside the groove area can form a stable and firm structure, and no additional tensile stress or shear stress is applied to the YBCO tape 5. On the other hand, the redundant YBCO tape 5 in the groove can effectively eliminate the tensile stress along the length direction of the YBCO tape 5 caused by the inconsistent thermal shrinkage coefficients of the cover plate 1, bottom plate 2, YBCO tape 5, and buffer layer 6 during the lead cooling process.

[0062] like Figure 6 As shown, the cover plate 1 can be divided into multiple sections along its length. The present application adopts the above structure, and the segmented cover plates 103, 102, and 101 are installed section by section from the low-temperature end of the lead during the lead assembly process, so that the redundant YBCO tape 5 can be gradually pushed to the groove area of ​​the high-temperature end of the lead, and the redundant YBCO tape can be smoothly stored in the groove area of ​​the bottom plate while ensuring the stable adhesion of the multi-layer structure of the cover plate 1-buffer layer 6-YBCO tape 5-buffer layer 6-bottom plate 2 outside the groove area.

[0063] This embodiment has been applied to a 9 T conduction-cooled NbTi superconducting magnet system, and has produced the following effects: through the serpentine lead structure, an effective lead length of 40 cm is achieved in a limited space of 20 cm height, and the heat leakage caused by a single lead is reduced to 30 mW; through multi-layer reinforcement and buffer structure and design details such as bottom plate grooves and segmented cover plates, the lead can be intermittently excited for more than 100 hours without failure under the background field of the 9 T magnet and the excitation current of more than 80 A, and the shear stress or peeling stress of more than 10 Mpa at the low temperature end of the traditional current lead YBCO tape is reduced to 0.2 Mpa, while the YBCO tape may be structurally damaged under the shear stress of 3.44 Mpa or the peeling stress of 10 Mpa. Obviously, on the basis of ensuring the thermal and electrical properties of the current lead, the present application significantly improves the lead strength and the working ability under a strong background magnetic field, and effectively eliminates the possibility of mechanical damage to the lead during assembly, transportation, installation, cooling, excitation, etc.

[0064] On the basis of the above, the present application also provides a superconducting magnet system, including the high-temperature superconducting current lead as described above.

[0065] The superconducting magnet system is applied to the fields of MRI (nuclear magnetic resonance) system, NMR (magnetic resonance spectroscopy) system, STM (scanning tunneling microscope) system, PPMS (comprehensive physical property measurement system), magneto-optical system and quantum computing system.

[0066] It should be understood that expressions such as "including" and "may include" that may be used in the present application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In the present application, terms such as "including" and / or "having" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0067] In addition, in the present application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0068] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the relative position relationship after connection remains unchanged. "Rotational connection" means that the two are connected to each other and can rotate relative to each other after connection. "Sliding connection" means that the two are connected to each other and can slide relative to each other after connection. The directional terms mentioned in the embodiments of the present application, such as "top", "bottom", "inside", "outside", "left", "right", etc., are only reference directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0069] In addition, in the embodiments of the present application, the mathematical concepts mentioned are symmetry, equality, parallelism, verticality, etc. These limitations are all for the current state of the art, rather than being absolutely strict definitions in a mathematical sense, and allow a small amount of deviation, approximation to symmetry, approximation to equality, approximation to parallelism, approximation to verticality, etc. are all possible. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0070] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A high temperature superconducting current lead, characterized in that: include: Cover plates, base plates, connection terminals and high-temperature superconducting tapes; The two ends of the high temperature superconducting tape are matched and connected to the connection terminals respectively; The cover plate and the bottom plate fix the high temperature superconducting tape in the middle and form a tight fit so that no lateral displacement occurs during the excitation process.

2. The high temperature superconducting current lead according to claim 1, characterized in that: A buffer layer is provided on the upper surface and / or the lower surface of the high temperature superconducting tape.

3. The high temperature superconducting current lead according to claim 2, characterized in that: The buffer layer is made of elastic low-temperature resistant soft material.

4. The high temperature superconducting current lead according to claim 1, characterized in that: The cross-sectional shapes of the cover plate and the bottom plate are complementary and match the cross-sectional shape of the high-temperature superconducting tape so as to completely fix it between the cover plate and the bottom plate.

5. The high temperature superconducting current lead according to claim 4, characterized in that: The cross sections of the cover plate and the bottom plate are L-shaped, forming a complementary double L-shaped structure.

6. The high temperature superconducting current lead according to claim 1, characterized in that: The high-temperature superconducting current lead also includes a fixing piece for reinforcing the multilayer structure consisting of the cover plate-high-temperature superconducting tape-bottom plate in a direction perpendicular to the surface of the high-temperature superconducting tape.

7. The high temperature superconducting current lead according to claim 6, characterized in that: The fixing parts are clamps, cable ties or screws, and are evenly distributed in the length direction of the lead wire.

8. The high temperature superconducting current lead according to claim 1, characterized in that: The bottom plate is provided with a groove near the high-temperature end of the lead wire, and a gap space is formed between the groove and the cover plate.

9. A superconducting magnet system, characterized in that: It comprises the high temperature superconducting current lead as claimed in any one of claims 1 to 8.

10. The superconducting magnet system according to claim 9, characterized in that: The superconducting magnet system is applied to MRI, NMR, STM, PPMS, magneto-optical system and quantum computing system.

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