Transformer, mutual inductor or inductor and manufacturing method

Abstract

The invention discloses a transformer, a mutual inductor or an inductor and a manufacturing method. The transformer, the mutual inductor or the inductor comprises a ferrite magnetic core and at least one coil, the coil is wound on a magnetic conductive frame of the ferrite magnetic core, the ferrite magnetic core is an integral magnetic core, and the magnetic conductive frame is a closed integral frame; and the coil is an electroplating coil plated on the magnetic conductive frame. The transformer, the mutual inductor or the inductor is few in component, simple in structure and small in size.

Description

[Technical field]

[0001] The invention relates to an electromagnetic device consisting of a magnetic core and a coil, and in particular to a transformer, a mutual inductor or an inductor and a manufacturing method thereof. [Background Technology]

[0002] Transformers, mutual inductors and inductors are electromagnetic devices consisting of a magnetic core and a coil, and are widely used in power systems and electronic circuits.

[0003] The utility model with patent number 202021314158.3 discloses an electronic transformer, which is used in a dynamic loss measurement system as a reference electronic transformer. Among them, the electronic transformer includes a magnetic core structure, an inductor, a frame and a substrate. The magnetic core structure is placed on the substrate, and the frame is sleeved on the magnetic core structure. The inductor is wound on the outer surface of the frame. The magnetic core structure is partially accommodated in the frame and is accommodated in a receiving groove of the substrate. The frame is made of insulating material to isolate the inductor from the magnetic core structure. The magnetic core structure is composed of a low-loss ferrite core. The cross-section of the inductor is composed of 1000 copper wires with a diameter of 0.1 mm.

[0004] The electronic transformer of the utility model is composed of many components, has a complex structure and is large in size. [Summary of the invention]

[0005] The technical problem to be solved by the present invention is to provide a transformer, mutual inductor or inductor with a simple structure.

[0006] Another technical problem to be solved by the present invention is to provide a method for manufacturing the above-mentioned transformer, mutual inductor or inductor.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is a transformer, a mutual inductor or an inductor, comprising a ferrite core and at least one coil, the coil being wound on a magnetic conductive frame of the ferrite core, the ferrite core being an integral magnetic core, the magnetic conductive frame being a closed integral frame; the coil being an electroplated coil plated on the magnetic conductive frame.

[0008] The transformer, mutual inductor or inductor described above includes a solder resist layer, and the electroplated coil includes a spiral winding and a solder pad connected to the end of the spiral winding; the solder resist layer covers the outer surface of the coil and the magnetic conductive frame, the solder resist layer includes a solder pad window, and the solder pad of the electroplated coil is arranged in the solder pad window corresponding to the solder resist layer.

[0009] In the transformer, mutual inductor or inductor described above, the outer layer of the electroplated coil is a copper-plated layer, and the inner layer of the electroplated coil is a vacuum sputtered conductive metal layer; or the surface of the magnetic conductive frame includes a roughened surface with the same shape as the electroplated coil, the outer layer of the electroplated coil is a copper-plated layer, and the inner layer of the electroplated coil is a copper-plated layer combined with the roughened surface.

[0010] A method for manufacturing the above transformer, mutual inductor or inductor comprises the following steps:

[0011] 401) preparing a ferrite core panel, the ferrite core panel comprising M rows and N columns arranged in a matrix and interconnected, the magnetic conductive frame according to claim 1;

[0012] 402) vacuum sputtering a conductive metal layer on the outer surface of the ferrite core panel;

[0013] 403) copper plating on the outer surface of the conductive metal layer;

[0014] 404) coating the outer surface of the copper plating layer with electrophoretic paint;

[0015] 405) laser engraving away unnecessary electrophoretic paint, and for each magnetic conductive frame, retaining electrophoretic paint consistent with the shape of the electroplating coil according to claim 1;

[0016] 406) etching to remove unnecessary copper-plated layers and conductive metal layers, and for each magnetic conductive frame, retaining the copper-plated layers and conductive metal layers consistent with the shape of the electroplated coil, to obtain an electroplated coil composed of the copper-plated layers and the conductive metal layers and covered with an electrophoretic paint layer on the surface;

[0017] 407) The ferrite core panels are cut to obtain single-body transformers, mutual inductors or inductors.

[0018] In the above-described manufacturing method, the electroplated coil includes a spiral winding and a solder pad connected to the end of the spiral winding; after step 406 and before step 407, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a solder pad window, and the solder pad of the electroplated coil is located in the solder pad window corresponding to the solder resist layer.

[0019] A method for manufacturing the above transformer, mutual inductor or inductor comprises the following steps:

[0020] 601) preparing a ferrite core panel, the ferrite core panel comprising the magnetic conductive frame according to claim 1, which is arranged in M ​​rows and N columns in a matrix and connected to each other;

[0021] 602) vacuum sputtering a conductive metal layer on the outer surface of the ferrite core panel;

[0022] 603) coating the outer surface of the conductive metal layer with electrophoretic paint;

[0023] 604) laser engraving removes unnecessary electrophoretic paint, and retains the electrophoretic paint power line as the electroplating power line at the edge of the ferrite core panel; for each magnetic conductive frame, retain the electrophoretic paint with the same shape as the electroplating coil described in claim 1; for each electrophoretic paint with the same shape as the electroplating coil, retain at least one electrophoretic paint connecting wire electrically connected to the electrophoretic paint power line;

[0024] 605) etching to remove the conductive metal layer not protected by the electrophoretic paint;

[0025] 606) after removing the electrophoretic paint, copper plating is performed to form a copper plating layer and a conductive metal layer consistent with the shape of the electroplating coil for each magnetic conductive frame;

[0026] 607) Cut the ferrite core panels to obtain single-body transformers, mutual inductors or inductors.

[0027] In the above-described manufacturing method, the electroplated coil includes a spiral winding and a soldering pad connected to the end of the spiral winding; the electrophoretic paint power line is a rectangular frame line, and if the soldering pad of the electroplated coil is close to the electrophoretic paint power line, the electrophoretic paint connecting line is connected to the electrophoretic paint power line from the soldering pad position of the electroplated coil; if the soldering pad of the electroplated coil is close to the soldering pad of the electroplated coil in an adjacent magnetic conductive frame, the electrophoretic paint connecting line connects the soldering pad positions of the electroplated coils in two adjacent magnetic conductive frames; after step 606 and before step 607, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a soldering pad window, and the soldering pad of the electroplated coil is located in the soldering pad window corresponding to the solder resist layer.

[0028] A method for manufacturing the above transformer, mutual inductor or inductor comprises the following steps:

[0029] 801) preparing a ferrite core panel, the ferrite core panel comprising the magnetic conductive frame according to claim 1, which is arranged in a matrix and connected to each other by M rows and N columns;

[0030] 802) The outer surface of the ferrite core panel is selectively roughened by laser, and the roughened area includes: the electroplated power line at the edge of the ferrite core panel, and for each magnetic conductive frame, a spiral line having the same shape as the electroplated coil as described in claim 1 and a connecting line between the spiral line and the electroplated power line;

[0031] 803) depositing copper in the roughened area, for each magnetic conductive frame, including forming a copper deposited layer consistent with the shape of the electroplated coil;

[0032] 804) copper plating, for each magnetic conductive frame, including forming a copper plating layer consistent with the shape of the electroplated coil;

[0033] 805) Cut the ferrite core panels to obtain single-body transformers, mutual inductors or inductors.

[0034] In the above-described manufacturing method, the electroplating coil includes a spiral winding and a soldering pad connected to the end of the spiral winding; the electroplating power line at the edge of the ferrite core panel is a rectangular frame line. If the soldering pad of the electroplating coil is close to the electroplating power line, the connecting wire is connected to the electroplating power line from the soldering pad position of the electroplating coil; if the soldering pad of the electroplating coil is close to the soldering pad of the electroplating coil in an adjacent magnetic conductive frame, the connecting wire connects the soldering pad positions of the electroplating coils in two adjacent magnetic conductive frames.

[0035] In the above-described manufacturing method, after step 804 and before step 805, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a pad window, and the pad of the electroplated coil is located in the pad window corresponding to the solder resist layer.

[0036] The transformer, mutual inductor or inductor of the present invention has fewer components, simple structure and small size. [Drawings]

[0037] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] Figure 1 It is a front view of the ferrite core panel of Examples 1-3 of the present invention.

[0039] Figure 2 It is a schematic diagram of vacuum sputtering a conductive metal layer on the outer surface of a ferrite core panel in embodiments 1 and 2 of the present invention.

[0040] Figure 3 It is a schematic diagram of copper plating on the outer surface of the conductive metal layer according to Example 1 of the present invention.

[0041] Figure 4 It is a schematic diagram of coating the outer surface of the copper plating layer with electrophoretic paint in Example 1 of the present invention.

[0042] Figure 5 It is a schematic diagram of laser etching away unnecessary electrophoretic paint layers in Example 1 of the present invention.

[0043] Figure 6 It is a schematic diagram of etching and removing unnecessary copper plating layers and conductive metal layers in Example 1 of the present invention.

[0044] Figure 7 It is a schematic diagram of removing the electrophoretic paint layer in Example 1 of the present invention.

[0045] Figure 8 It is a schematic diagram of the solder mask covering layer in Example 1 of the present invention.

[0046] Fig. 9 It is a front view of a single transformer of Embodiments 1-3 of the present invention.

[0047] Fig.10 yes Fig. 9 AA section view in.

[0048] Fig.11 It is a schematic diagram of coating the outer surface of the conductive metal layer with electrophoretic paint according to Example 2 of the present invention.

[0049] Fig.12 It is a schematic diagram of laser etching away unnecessary electrophoretic paint layers in Example 2 of the present invention.

[0050] Fig.13 It is a schematic diagram of etching and removing the conductive metal layer that is not protected by the electrophoretic paint in Example 2 of the present invention.

[0051] Fig.14 It is a schematic diagram of copper plating after removing the electrophoretic paint layer in Example 2 of the present invention.

[0052] Fig.15 It is a schematic diagram of the solder mask covering layer in embodiment 2 of the present invention.

[0053] Fig.16 It is a schematic diagram of the outer surface of the ferrite core panel selectively roughened by laser in Example 3 of the present invention.

[0054] Fig.17 It is a schematic diagram of copper deposition on the surface of the roughened layer in Example 3 of the present invention.

[0055] Fig.18 It is a schematic diagram of copper plating on the outer surface of the copper deposition layer according to Example 3 of the present invention.

[0056] Fig.19 It is a schematic diagram of the solder mask covering layer in embodiment 3 of the present invention.

[0057] Fig. 20 It is a cross-sectional view of a single transformer according to Embodiment 3 of the present invention. [Specific implementation method]

[0058] 1. A method for manufacturing a transformer according to Embodiment 1 of the present invention (the method for manufacturing a mutual inductor or an inductor is the same, except that the number of electroplating coils may be different) Figures 1 to 10 As shown, the following steps are included:

[0059] 101) Figure 1 As shown, a ferrite core panel 10 is prepared, and the ferrite core panel 10 includes M rows and N columns of magnetically conductive frames 11 that are arranged in a matrix and connected to each other. In this embodiment, M=N=3.

[0060] 102) Figure 2As shown, a conductive metal layer 12 is vacuum sputtered on the outer surface of the ferrite core panel 10 , and the conductive metal layer 12 includes a vacuum sputtered titanium layer 123 as a base and a vacuum sputtered copper layer 122 on the outer surface of the titanium layer 123 .

[0061] 103) Figure 3 As shown, copper is plated on the outer surface of the conductive metal layer 12 to form a copper-plated layer 13 .

[0062] 104) Figure 4 As shown, electrophoretic paint is plated on the outer surface of the copper plating layer 13 to form an electrophoretic paint layer 14.

[0063] 105) Figure 5 As shown, the unnecessary electrophoretic paint layer 14 is removed by laser, and for each magnetic conductive frame 11 , the electrophoretic paint layer 14 having the same shape as the two electroplated coils 20 is retained.

[0064] 106) etching to remove unnecessary copper-plated layers and conductive metal layers. For each magnetic conductive frame 11, the copper-plated layer 13 retains copper-plated spiral wires in the same shape as the two electroplated coils 20, and the conductive metal layer 12 retains conductive metal spiral wires in the same shape as the two electroplated coils 20, so as to obtain two electroplated coils with an upper layer composed of copper-plated spiral wires and a lower layer composed of conductive metal spiral wires and an outer surface covered with an electrophoretic paint layer 14, as shown in FIG. Figure 6 shown.

[0065] 107) Remove the electrophoretic paint layer 14, and for each magnetic conductive frame 11, obtain two electroplated coils 20 consisting of a copper-plated spiral wire and a conductive metal spiral wire, such as Figure 7 The electroplating coil 20 includes a spiral winding 21 and two pads 22 connected to two ends of the spiral winding 21 .

[0066] 108) Figure 8 As shown, the solder resist layer 15 is covered, and the solder resist layer 15 covers the outer surface of the coil and the magnetic conductive frame 11. The solder resist layer 15 includes a pad window 151, and the pad 22 of the electroplated coil 20 is located in the pad window 151 corresponding to the solder resist layer 15.

[0067] 109) Cut the ferrite core panel 10 to obtain a single transformer (mutual inductor or inductor) as shown in FIG. Fig. 9 and Fig.10 shown.

[0068] like Fig. 9 and Fig.10As shown, the single transformer (mutual inductor or inductor) of embodiment 1 of the present invention includes a ferrite core and two electroplated coils 20, the electroplated coils 20 are wound on the magnetic conductive frame 11 of the ferrite core, the ferrite core is an integral magnetic core, and the magnetic conductive frame 11 is a closed integral frame. The electroplated coils 20 are plated on the magnetic conductive frame 11. The outer layer of the electroplated coil 20 is a copper plating layer 13, and the inner layer of the electroplated coil 20 is a vacuum sputtered conductive metal layer 12. The electroplated coil 20 includes a spiral winding 21 and two pads 22 connected to both ends of the spiral winding 21. The solder resist layer 15 covers the outer surface of the spiral winding 21 and the magnetic conductive frame 11, and the solder resist layer 15 includes a pad window 151 corresponding to the electroplated coil pad 22, and the pad 22 of the electroplated coil 20 is arranged in the pad window 151 corresponding to the solder resist layer 15.

[0069] 2. The manufacturing method of the transformer of Embodiment 2 of the present invention (the manufacturing method of the mutual inductor or the inductor is the same, but the number of electroplating coils may be different) Figure 1 , Figure 2 as well as Figures 11 to 15 As shown, the following steps are included:

[0070] 201) Figure 1 As shown, a ferrite core panel 10 is prepared, and the ferrite core panel 10 includes M rows and N columns of magnetically conductive frames 11 that are arranged in a matrix and connected to each other. In this embodiment, M=N=3.

[0071] 202) Figure 2 As shown, a conductive metal layer 12 is vacuum sputtered on the outer surface of the ferrite core panel 10 , and the conductive metal layer 12 includes a vacuum sputtered titanium layer 123 as a base and a vacuum sputtered copper layer 122 on the outer surface of the titanium layer 123 .

[0072] 203) Fig.11 As shown, electrophoretic paint is plated on the outer surface of the conductive metal layer 12 to form an electrophoretic paint layer 14 .

[0073] 204) Fig.12As shown, the unnecessary electrophoretic paint layer 14 is formed by laser etching, and the electrophoretic paint power line 141 as the electroplating power line is retained at the edge of the ferrite core panel 10, and the electrophoretic paint power line 141 is a rectangular frame line. For each magnetic conductive frame 11, an electrophoretic paint spiral line 143 consistent with the shape of the electroplating coil 20 is retained. For each end of the electrophoretic paint consistent with the shape of the electroplating coil 20, an electrophoretic paint connecting line 142 electrically connected to the electrophoretic paint power line 141 is retained. Because the electroplating coil 20 includes a spiral winding 21 and a soldering pad 22 connected to the end of the spiral winding 21, if the soldering pad of the electroplating coil 20 is close to the electrophoretic paint power line 141, the electrophoretic paint connecting line 142 is directly connected to the electrophoretic paint power line 141 from the soldering pad of the electroplating coil 20. If the pad of the electroplated coil 20 is close to the pad of the electroplated coil 20 in the adjacent magnetic conductive frame 11 , the electrophoretic paint connecting wire 142 directly connects the pads of the electroplated coils 20 in the two adjacent magnetic conductive frames 11 .

[0074] 205) Fig.13 As shown, etching is performed to remove the conductive metal layer 12 not protected by the electrophoretic paint, retaining the conductive metal spiral wire protected by the electrophoretic paint spiral wire 143 and consistent with the shape of the electroplating coil 20, the conductive metal power wire protected by the electrophoretic paint power wire 141, and the conductive metal connecting wire protected by the electrophoretic paint connecting wire 142.

[0075] 206) Fig.14 As shown, after the electrophoretic paint layer 14 is removed, copper is plated. For each magnetic conductive frame 11 , two copper-plated spirals having the same shape as the electroplated coil 20 are formed on the conductive metal spirals of the conductive metal layer 12 .

[0076] 207) Fig.15 As shown, the solder resist layer 15 is covered, and the solder resist layer 15 covers the outer surface of the coil and the magnetic conductive frame 11. The solder resist layer 15 includes a pad window 151, and the pad 22 of the electroplated coil 20 is located in the pad window 151 corresponding to the solder resist layer 15.

[0077] 208) The ferrite core panel 10 is cut to obtain a single transformer (mutual inductor or inductor) of this embodiment, which has the same structure as that of embodiment 1. Fig. 9 and Fig.10 shown.

[0078] 3. The manufacturing method of the transformer of the third embodiment of the present invention (the manufacturing method of the mutual inductor or the inductor is the same, but the number of electroplating coils may be different) Figure 1 , Figure 2 as well as Figures 16 to 20 As shown, the following steps are included:

[0079] 301) Figure 1As shown, a ferrite core panel 10 is prepared, and the ferrite core panel 10 includes M rows and N columns of magnetically conductive frames 11 that are arranged in a matrix and connected to each other. In this embodiment, M=N=3.

[0080] 302) Fig.16 As shown, the outer surface of the ferrite core panel 10 is selectively roughened by laser to form a roughening layer 16, and the roughened area includes: the electroplating power line 161 at the edge of the ferrite core panel 10, for each magnetic conductive frame 11, a spiral line 162 having the same shape as the electroplating coil 20, and two connecting lines 163 between each spiral line 162 and the electroplating power line 161. The electroplating power line 161 at the edge of the ferrite core panel 10 is a rectangular frame line. If the pad 22 of the electroplating coil 20 is close to the electroplating power line 161, the connecting line 163 is directly connected to the electroplating power line 161 from the pad portion of the electroplating coil 20. If the pad 22 of the electroplating coil 20 is close to the pad 22 of another electroplating coil 20 in the adjacent magnetic conductive frame 11, the connecting line 163 connects the pad portions of the electroplating coils 20 in the two adjacent magnetic conductive frames 11.

[0081] 303) Fig.17 As shown, copper is deposited (chemical copper plating) on ​​the surface of the roughened layer 16 in the roughened area to form a copper deposited layer 17 . The copper deposited layer 17 includes a copper deposited spiral line 171 having the same shape as the electroplated coil 20 .

[0082] 304) Fig.18 As shown, copper is plated on the outer surface of the copper-plated layer 17 to form a copper-plated layer 13, and the copper-plated layer 13 includes a copper-plated spiral 131 that is consistent with the shape of the electroplated coil 20. For each magnetic conductive frame 11, two electroplated coils 20 are formed, and the electroplated coil 20 includes a copper-plated spiral 131 and a copper-plated spiral 171.

[0083] 305) Fig.19 As shown, the solder resist layer 15 is covered, and the solder resist layer 15 covers the outer surface of the coil and the magnetic conductive frame 11. The solder resist layer 15 includes a pad window 151, and the pad 22 of the electroplated coil 20 is located in the pad window 151 corresponding to the solder resist layer 15.

[0084] 306) The ferrite core panel 10 is cut to obtain a single transformer (mutual inductor or inductor) of this embodiment, the shape of which is as follows: Fig. 9 As shown, its internal structure is as follows Fig. 20As shown. The single transformer (mutual inductor or inductor) of embodiment 3 of the present invention includes a ferrite core and two electroplated coils 20. The electroplated coils 20 are wound on the magnetic conductive frame 11 of the ferrite core. The ferrite core is an integral magnetic core, and the magnetic conductive frame 11 is a closed integral frame. The electroplated coils 20 are plated on the magnetic conductive frame 11. The outer layer of the electroplated coil 20 is a copper plating layer 13, and the inner layer of the electroplated coil 20 is a copper deposition layer 17. The copper deposition layer 17 is combined with the roughening layer 16 on the magnetic conductive frame 11. As shown Fig. 9 As shown, the electroplating coil 20 includes a spiral winding 21 and two pads 22 connected to both ends of the spiral winding 21. The solder resist layer 15 covers the outer surface of the spiral winding 21 and the magnetic conductive frame 11, and the solder resist layer 15 includes a pad window 151 corresponding to the electroplating coil pad 22. The pad 22 of the electroplating coil 20 is arranged in the pad window 151 corresponding to the solder resist layer 15.

[0085] The transformer (mutual inductor or inductor) manufactured by the above embodiments of the present invention has fewer components, simple structure and small size.

Claims

1. A transformer, mutual inductor or inductor, comprising a ferrite core and at least one coil, the coil being wound on a magnetically conductive frame of the ferrite core, characterized in that: The ferrite core is an integral core, the magnetic conductive frame is a closed integral frame; and the coil is an electroplated coil plated on the magnetic conductive frame.

2. The transformer, mutual inductor or inductor according to claim 1, characterized in that: It includes a solder resist layer, and the electroplated coil includes a spiral winding and a solder pad connected to the end of the spiral winding; the solder resist layer covers the outer surface of the coil and the magnetic conductive frame, the solder resist layer includes a solder pad window, and the solder pad of the electroplated coil is arranged in the solder pad window corresponding to the solder resist layer.

3. The transformer, mutual inductor or inductor according to claim 1, characterized in that: The outer layer of the electroplated coil is a copper-plated layer, and the inner layer of the electroplated coil is a vacuum-sputtered conductive metal layer; or, the surface of the magnetic conductive frame includes a roughened surface with the same shape as the electroplated coil, the outer layer of the electroplated coil is a copper-plated layer, and the inner layer of the electroplated coil is a copper-plated layer combined with the roughened surface.

4. A method for manufacturing the transformer, mutual inductor or inductor according to claim 1, characterized in that: The following steps are involved: 401) preparing a ferrite core panel, the ferrite core panel comprising M rows and N columns arranged in a matrix and interconnected, the magnetic conductive frame according to claim 1; 402) vacuum sputtering a conductive metal layer on the outer surface of the ferrite core panel; 403) copper plating on the outer surface of the conductive metal layer; 404) coating the outer surface of the copper plating layer with electrophoretic paint; 405) laser engraving away unnecessary electrophoretic paint, for each magnetic conductive frame, including retaining electrophoretic paint consistent with the shape of the electroplated coil according to claim 1; 406) etching to remove unnecessary copper-plated layers and conductive metal layers, and for each magnetic conductive frame, retaining the copper-plated layers and conductive metal layers consistent with the shape of the electroplated coil, to obtain an electroplated coil composed of the copper-plated layers and the conductive metal layers and covered with an electrophoretic paint layer on the surface; 407) The ferrite core panels are cut to obtain a single transformer, mutual inductor or inductor as described in claim 1.

5. The method according to claim 4, characterized in that: The electroplated coil includes a spiral winding and a solder pad connected to the end of the spiral winding; after step 406 and before step 407, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a solder pad window, and the solder pad of the electroplated coil is located in the solder pad window corresponding to the solder resist layer.

6. A method for manufacturing the transformer, mutual inductor or inductor according to claim 1, characterized in that: The following steps are involved: 601) preparing a ferrite core panel, the ferrite core panel comprising the magnetic conductive frame according to claim 1, which is arranged in M ​​rows and N columns in a matrix and connected to each other; 602) vacuum sputtering a conductive metal layer on the outer surface of the ferrite core panel; 603) coating the outer surface of the conductive metal layer with electrophoretic paint; 604) laser engraving removes unnecessary electrophoretic paint, and retains the electrophoretic paint power line as the electroplating power line at the edge of the ferrite core panel; for each magnetic conductive frame, retain the electrophoretic paint with the same shape as the electroplating coil described in claim 1; for each electrophoretic paint with the same shape as the electroplating coil, retain at least one electrophoretic paint connecting wire electrically connected to the electrophoretic paint power line; 605) etching to remove the conductive metal layer not protected by the electrophoretic paint; 606) after removing the electrophoretic paint, copper plating is performed to form a copper plating layer and a conductive metal layer consistent with the shape of the electroplating coil for each magnetic conductive frame; 607) The ferrite core panel is cut to obtain a single body transformer, mutual inductor or inductor as described in claim 1.

7. The manufacturing method according to claim 6, characterized in that: The electroplating coil includes a spiral winding and a soldering pad connected to the end of the spiral winding; the electrophoretic paint power line is a rectangular frame line, and if the soldering pad of the electroplating coil is close to the electrophoretic paint power line, the electrophoretic paint connecting line is connected to the electrophoretic paint power line from the soldering pad position of the electroplating coil; if the soldering pad of the electroplating coil is close to the soldering pad of the electroplating coil in an adjacent magnetic conductive frame, the electrophoretic paint connecting line connects the soldering pad positions of the electroplating coils in two adjacent magnetic conductive frames; after step 606 and before step 607, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a soldering pad window, and the soldering pad of the electroplating coil is located in the soldering pad window corresponding to the solder resist layer.

8. A method for manufacturing the transformer, mutual inductor or inductor according to claim 1, characterized in that: The following steps are involved: 801) preparing a ferrite core panel, the ferrite core panel comprising the magnetic conductive frame according to claim 1, which is arranged in a matrix and connected to each other by M rows and N columns; 802) The outer surface of the ferrite core panel is selectively roughened by laser, and the roughened area includes: the electroplated power line at the edge of the ferrite core panel, and for each magnetic conductive frame, a spiral line having the same shape as the electroplated coil as described in claim 1 and a connecting line between the spiral line and the electroplated power line; 803) depositing copper in the roughened area, for each magnetic conductive frame, including forming a copper deposited layer consistent with the shape of the electroplated coil; 804) copper plating, for each magnetic conductive frame, including forming a copper plating layer consistent with the shape of the electroplated coil; 805) The ferrite core panels are cut to obtain a single transformer, mutual inductor or inductor as described in claim 1.

9. The manufacturing method according to claim 8, characterized in that: The electroplating coil includes a spiral winding and a soldering pad connected to the end of the spiral winding; the electroplating power line at the edge of the ferrite core panel is a rectangular frame line. If the soldering pad of the electroplating coil is close to the electroplating power line, the connecting line is connected to the electroplating power line from the soldering pad position of the electroplating coil; if the soldering pad of the electroplating coil is close to the soldering pad of the electroplating coil in an adjacent magnetic conductive frame, the connecting line connects the soldering pad positions of the electroplating coils in two adjacent magnetic conductive frames.

10. The manufacturing method according to claim 9, characterized in that: After step 804 and before step 805, a solder resist layer is covered, and the solder resist layer covers the outer surface of the coil and the magnetic conductive frame; the solder resist layer includes a pad window, and the pad of the electroplated coil is located in the pad window corresponding to the solder resist layer.

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