Conduction system and method simultaneously used for edge polishing and double polishing wafer cleaning
By designing a conduction system for side throwing and double throwing wafer cleaning, integrating the double throwing and side throwing cleaning loading methods, the problem of double throwing and side throwing cleaning in the existing technology requires two equipment, and the effect of cost reduction and process compatibility is achieved.
Patent Information
- Application Number
- CN202411791519.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-03-25
AI Technical Summary
In the prior art, the double-spray cleaning process and the side-spray cleaning process require two equipment respectively, resulting in high production costs.
A conduction system is designed for both side-drawn and double-drawn wafer cleaning. By integrating the loading methods of double-drawn cleaning and side-drawn cleaning, the wet and dry-drawn cleaning of double-drawn cleaning are realized, and the combination is made into a cleaning equipment.
It reduces the production costs of the enterprise, reduces the footprint, and facilitates unified management, achieving efficient compatibility of the double throw and side throw cleaning processes.
Smart Images
Figure CN119694933A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of wafer cleaning technology, and in particular to a conduction system and method for cleaning both side-polished and double-polished wafers. Background Art
[0002] With the development of semiconductor technology, semiconductor silicon wafers are gradually developing towards 300mm large silicon wafers and thin slices. The grinding and polishing of large silicon wafers occupies an extremely important position. In the process of repeated grinding and polishing of large silicon wafers, it is necessary to clean the large silicon wafers after grinding and polishing. At present, mainstream companies usually use double polishing cleaning and side polishing cleaning in the grinding and cleaning process of large silicon wafers. The main purpose is to use special chemical liquid to clean various particles and pollutants on the surface of dirty wafers after polishing. The cleaning process of large silicon wafers will be directly related to the quality of subsequent silicon wafer grinding and polishing, and play a decisive role in the production quality of large silicon wafer raw materials.
[0003] Currently, double-polishing cleaning and edge-polishing cleaning are two cleaning methods: double-polishing cleaning refers to the use of special chemical liquid to clean large silicon wafers that have been double-sided ground and polished. Since the large silicon wafers are double-sided polished, the large silicon wafers need to be placed in a special CST and immersed in water for transportation, which is a wet-in-dry-out process; edge-polishing cleaning refers to the use of special chemical liquid to clean large silicon wafers that have been edge-ground and polished. Since the large silicon wafers are edge-polished, the large silicon wafers are placed in a FOUP for transportation, which is a dry-in-dry-out process.
[0004] At present, the double-polish cleaning process and the side-polish cleaning process are wet-in and dry-in respectively. The carriers for carrying wafers are a water tank with CST and a FOUP respectively. Due to the difference between the two loading methods, the current market mainstream is to implement the two cleaning methods through two devices. Therefore, enterprises must purchase two devices, and the production cost of the enterprise is extremely high. However, for these two cleaning processes, the difference is only in the loading method, and the rest of the subsequent processes are the same. Summary of the invention
[0005] Based on the above records, the present invention provides a conduction system and method for cleaning both side polishing and double polishing wafers, which only solves the technical problem of high cost of using separate equipment for double polishing cleaning process and side polishing cleaning process in the prior art.
[0006] A conduction system for cleaning both side-throwing and double-throwing wafers, comprising a side-throwing wafer transfer subsystem, a double-throwing wafer transfer subsystem, a wafer push-out subsystem and a tank cleaning subsystem;
[0007] The wafer push-out subsystem includes a double-throw push-out device and a side-throw loading push-out device;
[0008] The tank cleaning subsystem includes a second robot and a wafer cleaning tank;
[0009] In the double-throw wafer cleaning process, the double-throw wafer transfer subsystem is used to transfer the first container box containing the double-throw wafers to the double-throw push-out device, the double-throw push-out device is used to push out the double-throw wafers in the first container box, and the second manipulator is used to clamp the double-throw wafers pushed out by the double-throw push-out device and transfer them to the cleaning tank area;
[0010] In the edge polishing wafer cleaning process, the edge polishing wafer transfer subsystem is used to take out the edge polishing wafer from the second container box and position it to the first designated position, the edge polishing loading and pushing device is used to load the edge polishing wafer from the first designated position and return to the first standby position, and the second manipulator is used to clamp the edge polishing wafer from the edge polishing loading and pushing device at the first standby position and transfer it to the cleaning tank area.
[0011] Furthermore, the double-polished wafer transfer subsystem is arranged in the first area, the side-polished wafer transfer subsystem and the wafer push-out subsystem are arranged in the second area, and the tank cleaning subsystem is arranged in the third area.
[0012] Further, the double-throw wafer transfer subsystem includes a first double-throw loading device, a second double-throw loading device and a first robot;
[0013] The first double-throw loading device is used to load the liquid tank with the first container box from the outside and transfer it to the second double-throw loading device, and the double-throw wafers in the first container box are immersed in the liquid of the liquid tank;
[0014] The first robot is used to take out the first container box with double-throw wafers from the liquid tank on the second double-throw loading device and transfer it to the double-throw ejecting device.
[0015] Further, the double-throw wafer transfer subsystem also includes a third double-throw loading device and a sliding device;
[0016] A second double-throw loading device is mounted on the slide;
[0017] The first robot is also used to retrieve the empty first container box from the double-throw ejection device and transfer it to the liquid tank on the second double-throw loading device in the second standby position;
[0018] The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;
[0019] The second double-throw loading device transfers the liquid tank with the empty first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the liquid tank with the first container box.
[0020] Further, the side-throwing wafer transfer subsystem includes a side-throwing door opening device, a side-throwing transmission device, and a side-throwing positioning device;
[0021] The edge-casting door opening device is used for carrying a second container box containing edge-casting wafers and opening the second container box;
[0022] The edge-polishing transmission device is used for forking out the edge-polishing wafer from the opened second container box and transferring it to the edge-polishing positioning device;
[0023] The edge polishing positioning device is used to position and adjust the edge polishing wafer to a first designated position;
[0024] The side-cast loading and pushing device moves from the first standby position to below the first designated position, loads the side-cast wafer from the first designated position, and then moves back to the first standby position.
[0025] Further, the second region is between the first region and the third region;
[0026] When the second double-throw loading device is in the second standby position and the side-throw loading and pushing device is in the first standby position, the first double-throw loading device, the second double-throw loading device, the double-throw pushing device, and the side-throw loading and pushing device form a row in sequence;
[0027] The side-throwing wafer transfer subsystem and the side-throwing loading and pushing device form a row.
[0028] A conduction method for cleaning both side-polished and double-polished wafers, using the aforementioned conduction system for cleaning both side-polished and double-polished wafers, including a conduction step for a double-polished wafer cleaning process and a conduction step for a side-polished wafer cleaning process;
[0029] The transfer steps of the double-throw wafer cleaning process include:
[0030] Step A1, the double-throw wafer transfer subsystem transfers the first container box containing the double-throw wafers to the double-throw ejection device;
[0031] Step A2, the double-throw wafer ejecting device ejects the double-throw wafer in the first container box;
[0032] Step A3, the second robot grips the double-polished wafer pushed out by the double-polished push-out device and transfers it to the cleaning tank area;
[0033] The transfer steps of the edge polishing wafer cleaning process include:
[0034] Step B1, the edge-polished wafer transfer subsystem takes out the edge-polished wafer from the second container box and positions it to the first designated position;
[0035] Step B2, the side-cast wafer loading and pushing device loads the side-cast wafer from the first designated position and returns to the first standby position;
[0036] Step B3, the second robot grips the edge-polished wafer from the polishing loading and pushing device at the first standby position and transfers it to the cleaning tank area.
[0037] Further, the double-throw wafer transfer subsystem includes a first double-throw loading device, a second double-throw loading device and a first robot, and step A1 includes:
[0038] Step A11, the first double-throw loading device loads the liquid tank with the first container box from the outside and transfers it to the second double-throw loading device, and the double-throw wafers in the first container box are immersed in the liquid in the liquid tank;
[0039] Step A12, the first robot takes out the first container box with the double-throw wafers from the liquid tank on the second double-throw loading device and transfers it to the double-throw ejecting device.
[0040] Further, the double-throw wafer transfer subsystem further includes a third double-throw loading device and a sliding device, and the second double-throw loading device is mounted on the sliding device;
[0041] In the transfer step of the double-throw wafer cleaning process, after step A3, the following steps are also included:
[0042] Step A4, the first robot retrieves the empty first container box from the double-throw ejection device and transfers it to the second double-throw loading device in the second standby position;
[0043] Step A5, the sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;
[0044] Step A6: the second double-throw loading device transfers the empty first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the empty first container box.
[0045] Further, the side-throwing wafer transfer subsystem includes a side-throwing door opening device, a side-throwing transmission device, and a side-throwing positioning device;
[0046] In the transfer step of the edge polishing wafer cleaning process, step B1 includes:
[0047] Step B11, the edge-casting door device carries the second container box containing the edge-casting wafers and opens the second container box;
[0048] Step B12, the edge-polishing transmission device forks out the edge-polished wafer from the opened second container box and transfers it to the edge-polishing positioning device;
[0049] Step B13, the edge polishing positioning device positions and adjusts the edge polishing wafer to a first designated position;
[0050] Step B14, the edge-cast loading and pushing device moves from the first standby position to below the first designated position, loads the edge-cast wafer from the first designated position, and then moves back to the first standby position.
[0051] The beneficial technical effect of the present invention is that the present invention integrates the loading methods of the two cleaning processes of double-throw cleaning and side-throw cleaning, and through a new layout design, realizes the sharing of wet feed for double-throw cleaning and dry feed for side-throw cleaning. After being compatible with the two loading methods, the original two cleaning equipment will be merged into one cleaning equipment, greatly reducing the production cost of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS
[0052] Figure 1 A schematic diagram of a commonly used CST and water tank for carrying double-throw wafers in the prior art;
[0053] Figure 2 It is a schematic diagram of a commonly used FOUP for carrying edge-polished wafers in the prior art;
[0054] Figure 3 A schematic diagram of a preferred arrangement of a conduction system for cleaning both side-polishing and double-polishing wafers according to the present invention;
[0055] Figure 4-11 A schematic diagram of a double-throw wafer loading process of a conduction system and method for cleaning both side-throw and double-throw wafers according to the present invention;
[0056] Figure 12-18 A schematic diagram of a process of loading side-polished wafers by a conduction system and method for cleaning side-polished and double-polished wafers according to the present invention;
[0057] Figure 19-23 A flow chart of the steps of a conduction method for cleaning both side-polished and double-polished wafers according to the present invention;
[0058] in:
[0059] 1-first container box; 2-liquid tank; 3-first double-throw loading device; 4-second double-throw loading device; 5-first manipulator; 6-sliding device; 7-third double-throw loading device; 8-double-throw ejecting device; 9-side-throw loading and pushing device; 10-second manipulator; 11-wafer cleaning tank; 12-second container box; 13-side-throw door opening device; 14-side-throw transmission device; 15-side-throw positioning device;
[0060] A-first area; B-second area; C-third area. DETAILED DESCRIPTION
[0061] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0062] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.
[0063] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.
[0064] See also Figure 3 , the present invention provides a conduction system for cleaning both side-polished and double-polished wafers, including a side-polished wafer transfer subsystem, a double-polished wafer transfer subsystem, a wafer push-out subsystem and a tank cleaning subsystem;
[0065] The wafer ejection subsystem comprises a double-throw ejection device (8) and a side-throw loading and pushing device (9);
[0066] The tank cleaning subsystem comprises a second robot (10) and a wafer cleaning tank (11);
[0067] In a double-throw wafer cleaning process, the double-throw wafer transfer subsystem is used to transfer a first container box (1) containing double-throw wafers to a double-throw wafer ejection device (8), the double-throw wafer ejection device (8) is used to eject the double-throw wafers in the first container box (1), and the second robot (10) is used to clamp the double-throw wafers ejected by the double-throw wafer ejection device and transfer them to a cleaning tank (11);
[0068] In the edge-polished wafer cleaning process, the edge-polished wafer transfer subsystem is used to take out the edge-polished wafer from the second container box (12) and position it to a first designated position, the edge-polished wafer loading and pushing device (9) is used to load the edge-polished wafer from the first designated position and return it to the first standby position, and the second manipulator (10) is used to clamp the edge-polished wafer from the edge-polished wafer loading and pushing device (9) at the first standby position and transfer it to the cleaning tank (11) area.
[0069] The present invention integrates the loading methods of double-throw cleaning and side-throw cleaning. Through a new layout design, wet loading of double-throw cleaning and dry loading of side-throw cleaning are realized. After being compatible with the two loading methods, the original two cleaning equipments will be merged into one cleaning equipment, greatly reducing the production cost of the enterprise.
[0070] Specifically, the first container box (1) is an existing CST. CST (cassette) is a fully open wafer-carrying box. The CST is placed in a liquid tank (2) so that the double-polished wafers are always immersed in liquid such as water, thereby achieving wet feeding of the double-polished wafers.
[0071] Specifically, the second container box (12) is a FOUP, which is a front-opening wafer transfer box, Front Opening Unified Pod, which also belongs to the prior art and will not be described in detail here.
[0072] Specifically, after receiving the first container box (1), the double-throw ejection device (8) will eject the double-throw wafer in the first container box (1) upwards, so that the second robot (10) can take out the double-throw wafer. The double-throw ejection device (8) is, for example, a common CST OUT in the prior art, which is a wafer ejection device.
[0073] Specifically, the side-cast loading and pushing device (9) is, for example, a Load Pusher commonly used in the prior art. The side-cast loading and pushing device (9) locates the side-cast wafer from the side-cast wafer transfer subsystem to the first designated position to load the side-cast wafer, and then returns the side-cast wafer to the standby position, i.e., the first standby position, to wait for the second robot to clamp the wafer.
[0074] The second manipulator (10), i.e., the robot, moves from its standby position to the double-throw ejection device (8) to grip the wafer when it is to grip the double-throw wafer. The second manipulator (10) then transfers the wafer to the cleaning tank area and then returns to the standby position.
[0075] When the second robot (10) is to grip the edge-polished wafer, it moves from its standby position to the area near the edge-polished loading and pushing device (9) at the first standby position to grip the wafer. Then the second robot (10) transfers the edge-polished wafer to the cleaning tank (11) area and then returns to its standby position.
[0076] Furthermore, the double-polished wafer transfer subsystem is arranged in the first area (A), the side-polished wafer transfer subsystem and the wafer ejection subsystem are arranged in the second area (B), and the tank cleaning subsystem is arranged in the third area (C).
[0077] Specifically, the second region (B) is between the first region (A) and the third region (C).
[0078] Furthermore, the double-throw wafer transfer subsystem includes a first double-throw loading device (3), a second double-throw loading device (4) and a first robot (5);
[0079] The first double-throw loading device (3) is used to load the liquid tank (2) with the first container box (1) from the outside and transfer it to the second double-throw loading device (4), and the double-throw wafers in the first container box (1) are immersed in the liquid in the liquid tank (2);
[0080] The first robot (5) is used to take out the first container box (1) with double-throw wafers from the liquid tank (2) on the second double-throw loading device (4) and transfer it to the double-throw ejecting device (8).
[0081] Specifically, the first double-throw loading device (3) and the second double-throw loading device (4) are commonly used loadports in the prior art, and are used to load and unload wafer storage devices, that is, to pick up and place wafers. The first double-throw loading device (3) can load goods from an external AGV trolley, that is, load the liquid tank (2) with the first container box (1), and then transfer it to the second double-throw loading device (4) through a roller line.
[0082] The first robot (5) is a robot. The first robot (5) takes out the first container box (1) with the double-throw wafer from the liquid tank (2) on the second double-throw loading device (4), and then transfers it to the double-throw ejection device (8). The wafer is lifted up by the double-throw ejection device (8) so that the second robot can pick it up. After transferring the wafer to the double-throw ejection device (8), the first robot (5) returns to its standby position. The standby position of the first robot (5) is in the first area, near the second double-throw loading device (4).
[0083] Furthermore, the double-throw wafer transfer subsystem also includes a third double-throw loading device (7) and a sliding device (6);
[0084] The second double-throw loading device (4) is mounted on the sliding device (6);
[0085] The first robot (5) is also used to retrieve the empty first container box (1) from the double-throw ejection device (8) and transfer it to the second double-throw loading device (4) in the second standby position;
[0086] The sliding device (6) moves the second double-throw loading device (4) linearly from the second standby position to the second designated position;
[0087] The second double-throw loading device (4) transfers the empty first container box (1) to the third double-throw loading device (7) after the second designated position, and the third double-throw loading device (7) ships the empty first container box (1).
[0088] Specifically, the third double-throw loading device (7) is a load port commonly used in the prior art, and is used for loading and unloading a wafer storage mechanism, that is, for taking and placing wafers. After the wafers in the double-throw ejection device (8) are clamped by the second robot (10), an empty first container box (1) is left, and the first robot (5) moves from its standby position to the double-throw ejection device (8) again, takes out the empty first container box (1), and transfers the empty first container box (1) to the liquid tank (2) on the second double-throw loading device (4).
[0089] The slide device (6) is an existing SLIDE mechanism, and the slide mechanism performs linear motion, moves the second double-throw loading device (4) linearly to the second designated position, and then transfers the empty first container box (1) to the third double-throw loading device (7) through the roller line, and the third double-throw loading device (7) transfers the empty first container box (1) to the AGV trolley through the roller line to the next process. Furthermore, the side-throw wafer transfer subsystem includes a side-throw door opening device (13), a side-throw transmission device (14), and a side-throw positioning device (15);
[0090] The edge-polished wafer opening device (13) is used for carrying the second container box (12) containing the edge-polished wafers and opening the second container box (12);
[0091] The edge-polishing transmission device (14) is used for forking out edge-polishing wafers from the opened second container box (12) and transferring them to the edge-polishing positioning device (15);
[0092] The edge polishing positioning device (15) is used to position and adjust the edge polishing wafer to a first designated position;
[0093] The edge-cast loading and pushing device (9) moves from a first standby position to below a first designated position, loads the edge-cast wafer from the first designated position, and then moves back to the first standby position.
[0094] The edge-cast door opening device (13) can be, for example, a commonly used FIMS device. A second container box (12) such as a FOUP containing edge-cast wafers is placed on the carrying platform, and then the door of the FOUP is opened to facilitate the clamping of the wafers, for example, by using vacuum suction to open the front door of the FOUP.
[0095] The side-by-side transfer device (14) is, for example, a WTU device in the prior art. The forking unit of the WTU device rotates to the side-by-side door opening device (13), and the forking unit goes deep into the FOUP to fork the side-by-side wafer, and then rotates again so that the forking unit faces the side-by-side positioning device (15).
[0096] The side-throwing positioning device (15) is, for example, a POS mechanism in the prior art, which can adjust the posture of the wafer so that it remains horizontal or vertical during the transmission process, and can accurately position the wafer and send it to a designated position, such as the first designated position.
[0097] The side-polished loading and pushing device (9) is, for example, a Load Pusher commonly used in the prior art. It moves from the first standby position to the bottom of the side-polished positioning device (15), and rises to receive the side-polished wafer on the side-polished positioning device (15), and then returns to the first standby position. After that, the second manipulator moves from the standby position to the side-polished loading and pushing device (9), clamps the wafer, and moves the wafer to the wafer cleaning tank area. The dry feeding of the side-polished wafer is realized. In the present invention, the wet feeding of the double-polished wafer and the dry feeding of the side-polished wafer share the cleaning tank and the second manipulator, which reduces the use of one cleaning device and manipulator, and greatly reduces the production cost. Moreover, the wet feeding and the dry feeding are integrated together, which reduces the floor space and facilitates unified management.
[0098] Further, the second region (B) is between the first region (A) and the third region (C);
[0099] When the second double-throw loading device (4) is in the second standby position and the side-throw loading and pushing device (9) is in the first standby position, the first double-throw loading device (3), the second double-throw loading device (4), the double-throw pushing device (8), and the side-throw loading and pushing device (9) sequentially form a row;
[0100] The side-throwing wafer transfer subsystem and the side-throwing loading and pushing device form a row.
[0101] Arranging them in a row improves the compactness of each transfer mechanism and reduces the floor space. In addition, the double-thrown wafer box is transferred along the row direction, and the side-thrown wafer is transferred along the column direction. The transfer process path is shortened and the transfer efficiency is improved.
[0102] Specifically, when the second double-throw loading device (4) is in the second standby position and the side-throw loading and pushing device (9) is in the first standby position, the first double-throw loading device (3), the second double-throw loading device (4), the double-throw pushing device (8), the side-throw loading and pushing device (9) and the cleaning tank (11) are sequentially arranged in a row, that is, arranged in a line.
[0103] The side-wafer transfer subsystem and the side-wafer loading and pushing device form a row, that is, the side-wafer door opening device (13), the side-wafer transmission device (14), the side-wafer positioning device (15) and the side-wafer loading and pushing device (9) are arranged in a row.
[0104] Furthermore, when the third double-throw loading device (7) and the first double-throw loading device (3) are arranged in a row.
[0105] See also Fig.19 and Fig. 20 The present invention also provides a conduction method for cleaning both side-polishing and double-polishing wafers, using the aforementioned conduction system for cleaning both side-polishing and double-polishing wafers, including a transfer step for a double-polishing wafer cleaning process and a transfer step for a side-polishing wafer cleaning process;
[0106] The transfer steps of the double-throw wafer cleaning process include:
[0107] Step A1, the double-throw wafer transfer subsystem transfers the first container box containing the double-throw wafers to the double-throw ejection device;
[0108] Step A2, the double-throw wafer ejecting device ejects the double-throw wafer in the first container box;
[0109] Step A3, the second robot grips the double-polished wafer pushed out by the double-polished push-out device and transfers it to the cleaning tank area;
[0110] The transfer steps of the edge polishing wafer cleaning process include:
[0111] Step B1, the edge-polished wafer transfer subsystem takes out the edge-polished wafer from the second container box and positions it to the first designated position;
[0112] Step B2, the side-cast wafer loading and pushing device loads the side-cast wafer from the first designated position and returns to the first standby position;
[0113] Step B3, the second robot grips the edge-polished wafer from the polishing loading and pushing device at the first standby position and transfers it to the cleaning tank area.
[0114] The present invention integrates the loading methods of double-throw cleaning and side-throw cleaning. Through a new layout design, wet loading of double-throw cleaning and dry loading of side-throw cleaning are realized. After being compatible with the two loading methods, the original two cleaning equipments will be merged into one cleaning equipment, greatly reducing the production cost of the enterprise.
[0115] See also Fig.21 Further, the double-throw wafer transfer subsystem includes a first double-throw loading device, a second double-throw loading device and a first robot, and step A1 includes:
[0116] Step A11, the first double-throw loading device loads the liquid tank with the first container box from the outside and transfers it to the second double-throw loading device, and the double-throw wafers in the first container box are immersed in the liquid in the liquid tank;
[0117] Step A12, the first robot takes out the first container box with the double-throw wafers from the liquid tank on the second double-throw loading device and transfers it to the double-throw ejecting device.
[0118] See also Fig. 22 ,Further, the double-throw wafer transfer subsystem also includes a third double-throw loading device and a sliding device, and the second double-throw loading device is mounted on the sliding device;
[0119] In the transfer step of the double-throw wafer cleaning process, after step A3, the following steps are also included:
[0120] Step A4, the first robot retrieves the empty first container box from the double-throw ejection device and transfers it to the second double-throw loading device in the second standby position;
[0121] Step A5, the sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;
[0122] Step A6: the second double-throw loading device transfers the empty first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the empty first container box.
[0123] See also Fig.23 ,Furthermore, the side throwing wafer transfer subsystem includes a side throwing door opening device, a side throwing transmission device, and a side throwing positioning device;
[0124] In the transfer step of the edge polishing wafer cleaning process, step B1 includes:
[0125] Step B11, the edge-casting door device carries the second container box containing the edge-casting wafers and opens the second container box;
[0126] Step B12, the edge-polishing transmission device forks out the edge-polished wafer from the opened second container box and transfers it to the edge-polishing positioning device;
[0127] Step 13, the edge polishing positioning device positions and adjusts the edge polishing wafer to a first designated position;
[0128] Step B14, the edge-cast loading and pushing device moves from the first standby position to below the first designated position, loads the edge-cast wafer from the first designated position, and then moves back to the first standby position.
[0129] See also Figure 4-11 The specific process of the wet-in process of the double-polished wafer cleaning process is as follows:
[0130] See also Figure 4 The liquid tank loaded with the first container box with double-throw wafers is transferred by the AGV car to the first double-throw loading device position for loading and waiting.
[0131] See also Figure 5 , the first container box loaded with double-polished wafers is integrally transferred from the liquid tank to the second double-polished loading device.
[0132] See also Figure 6 The first robot grips the first container box with the double-polished wafers in the liquid tank from the second double-polished loading device.
[0133] See also Figure 7 The first robot grips the first container box with double-throw wafers and transfers it to the double-throw ejection device, and the second robot is in the standby position.
[0134] See also Figure 8 The first robot returns to the second double-throw loading device, and the second robot moves to the double-throw ejection device to clamp the double-throw wafer ejected by the double-throw ejection device, and moves the double-throw wafer to the cleaning tank area.
[0135] See also Fig. 9 The first manipulator moves to the double-throw ejection device to clamp the empty first container box, and moves the empty first container box to the liquid tank of the second double-throw loading device.
[0136] See also Fig.10 , the sliding device moves linearly to move the second double-throw loading device to the specified position.
[0137] See also Fig.11 , the liquid tank loaded with the empty first container box is moved from the second double-throw loading device to the third double-throw loading device, and the goods are shipped from the third double-throw loading device.
[0138] See also Figure 12-18 The specific process of the wet-in process of the edge-polished wafer cleaning process is as follows:
[0139] See also Fig.12 , the side-throwing transmission device is in the standby position.
[0140] See also Fig.13 The fork unit on the edge-casting transmission device rotates to the edge-casting door opening device station, and reaches into the opened second container box to fork the edge-casting wafer.
[0141] See also Fig.14 The side-polished transmission device rotates again so that the fork unit faces the side-polished positioning device, and extends the side-polished wafer into the wafer clamping teeth in the side-polished positioning device, and the side-polished wafer is clamped by the wafer clamping teeth of the side-polished positioning device.
[0142] See also Fig.15 , the side-by-side polishing transmission device returns to the standby position, and the side-by-side polishing positioning device moves the side-by-side polishing wafer and adjusts the posture of the side-by-side polishing wafer so that the side-by-side polishing wafer is at the first designated position.
[0143] See also Fig.16 The side-cast loading and pushing device moves from the first standby position to under the side-cast positioning device and rises to load the side-cast wafer into its own device.
[0144] See also Fig.17 The side-cast loading and pushing device brings the side-cast wafer back to the first standby position.
[0145] See also Fig.18 The second robot moves from its standby position to the side-polished loading and pushing device to clamp the side-polished wafer, and then transfers it to the cleaning tank area.
[0146] In the present invention, the wet feeding of double-polished wafers and the dry feeding of edge-polished wafers share a cleaning tank and a second robot, which reduces the use of one cleaning device and a robot, greatly reducing production costs. Moreover, the wet feeding and the dry feeding are integrated together, which reduces the floor space and facilitates unified management.
[0147] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.
Claims
1. A conduction system for cleaning both side-polishing and double-polishing wafers, characterized in that: It includes side-polished wafer transfer subsystem, double-polished wafer transfer subsystem, wafer push-out subsystem and tank cleaning subsystem; The wafer ejection subsystem includes a double-throw ejection device and a side-throw loading and pushing device; The tank cleaning subsystem includes a second manipulator and a cleaning tank; In the double-throw wafer cleaning process, the double-throw wafer transfer subsystem is used to transfer the first container box containing the double-throw wafers to the double-throw push-out device, the double-throw push-out device is used to push out the double-throw wafers in the first container box, and the second robot is used to clamp the double-throw wafers pushed out by the double-throw push-out device and transfer them to the cleaning tank area; In the edge-polished wafer cleaning process, the edge-polished wafer transfer subsystem is used to take out the edge-polished wafer from the second container box and position it to the first designated position, the edge-polished wafer loading and pushing device is used to load the edge-polished wafer from the first designated position and return to the first standby position, and the second robot is used to clamp the edge-polished wafer from the edge-polished wafer loading and pushing device at the first standby position and transfer it to the cleaning tank area.
2. A conduction system for cleaning both side-polishing and double-polishing wafers as claimed in claim 1, characterized in that: The double-throw wafer transfer subsystem includes a first double-throw loading device, a second double-throw loading device and a first robot; The first double-throw loading device is used to load the liquid tank with the first container box from the outside and transfer it to the second double-throw loading device, and the double-throw wafers in the first container box are immersed in the liquid of the liquid tank; The first robot is used to take out the first container box with double-throw wafers from the liquid tank on the second double-throw loading device and transfer it to the double-throw ejecting device.
3. A conduction system for cleaning both side-polishing and double-polishing wafers as claimed in claim 2, characterized in that: The double-throw wafer transfer subsystem also includes a third double-throw loading device and a sliding device; The second double-throw loading device is mounted on the sliding device; The first robot is also used to retrieve the empty first container box from the double-throw ejection device and transfer it to the liquid tank on the second double-throw loading device in the second standby position; The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position; The second double-throw loading device transfers the liquid tank with the first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the liquid tank with the first container box.
4. A conduction system for cleaning both side-polishing and double-polishing wafers as claimed in claim 1, characterized in that: The side-throwing wafer transfer subsystem includes a side-throwing door opening device, a side-throwing transmission device, and a side-throwing positioning device; The edge-casting door opening device is used to carry a second container box containing edge-cast wafers and open the second container box; The edge-polishing transmission device is used to fork out the edge-polishing wafer from the opened second container box and transfer it to the edge-polishing positioning device; The edge polishing positioning device is used to position and adjust the edge polishing wafer to the first designated position; The edge-cast wafer loading and pushing device moves from the first standby position to below the first designated position, loads the edge-cast wafer from the first designated position, and then moves back to the first standby position.
5. A conduction system for cleaning both side-polishing and double-polishing wafers as claimed in claim 2, characterized in that: The double-polished wafer transfer subsystem is arranged in the first area, the side-polished wafer transfer subsystem and the wafer push-out subsystem are arranged in the second area, and the tank cleaning subsystem is arranged in the third area; The second area is between the first area and the third area; When the second double-throw loading device is in the second standby position, and the side-throw loading and pushing device is in the first standby position, the first double-throw loading device, the second double-throw loading device, the double-throw pushing device, and the side-throw loading and pushing device form a row in sequence; The side-cast wafer transfer subsystem and the side-cast wafer loading and pushing device form a row.
6. A conduction method for cleaning both side-polishing and double-polishing wafers, characterized in that: Using a transfer system for cleaning both side-polished and double-polished wafers as described in any one of claims 1 to 5, comprising a transfer step for a double-polished wafer cleaning process and a transfer step for a side-polished wafer cleaning process; The transfer steps of the double-throw wafer cleaning process include: Step A1, the double-throw wafer transfer subsystem transfers the first container box containing the double-throw wafers to the double-throw ejection device; Step A2, a double-throw wafer ejecting device ejects the double-throw wafers in the first container box; Step A3, the second robot grips the double-polished wafer pushed out by the double-polished pushing device and transfers it to the cleaning tank area; The transfer steps of the edge polishing wafer cleaning process include: Step B1, the edge-polished wafer transfer subsystem takes out the edge-polished wafer from the second container box and positions it to the first designated position; Step B2, the edge-cast wafer loading and pushing device loads the edge-cast wafer from the first designated position and returns to the first standby position; Step B3, the second robot grips the edge-polished wafer from the polishing loading and pushing device at the first standby position and transfers it to the cleaning tank area.
7. A conduction method for cleaning wafers by both side polishing and double polishing as claimed in claim 6, characterized in that: The double-throw wafer transfer subsystem includes a first double-throw loading device, a second double-throw loading device and a first robot, and the step A1 includes: Step A11, the first double-throw loading device loads the liquid tank with the first container box from the outside and transfers it to the second double-throw loading device, and the double-throw wafers in the first container box are immersed in the liquid in the liquid tank; Step A12: the first robot takes out the first container box with the double-throw wafers from the liquid tank on the second double-throw loading device and transfers it to the double-throw ejecting device.
8. A conduction method for cleaning wafers by both side polishing and double polishing as claimed in claim 7, characterized in that: The double-throw wafer transfer subsystem further comprises a third double-throw loading device and a sliding device, wherein the second double-throw loading device is mounted on the sliding device; In the transfer step of the double-polished wafer cleaning process, the step A3 further includes: Step A4, the first robot retrieves the empty first container box from the double-throw ejection device and transfers it to the liquid tank on the second double-throw loading device in the second standby position; Step A5, the sliding device moves the second double-throw loading device linearly from the second standby position to a second designated position; Step A6: the second double-throw loading device transfers the liquid tank with the empty first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the liquid tank with the first container box.
9. A conduction method for cleaning wafers by both side polishing and double polishing as claimed in claim 6, characterized in that: The side-throwing wafer transfer subsystem includes a side-throwing door opening device, a side-throwing transmission device, and a side-throwing positioning device; In the transfer step of the edge polishing wafer cleaning process, the step B1 includes: Step B11, the edge-polished wafer opening device carries a second container box containing edge-polished wafers and opens the second container box; Step B12, the edge-polished transfer device forks out the edge-polished wafer from the opened second container box and transfers it to the edge-polished positioning device; Step B13, the edge polishing positioning device positions and adjusts the edge polishing wafer to the first designated position; Step B14, the edge-cast wafer loading and pushing device moves from the first standby position to below the first designated position, loads the edge-cast wafer from the first designated position, and then moves back to the first standby position.
Citation Information
Cited By
Conveying system and method for cleaning of both edge-polished and double-side-polished wafers
WO2026118424A1