Wafer film pouring equipment

Abstract

The invention relates to the field of wafer processing, in particular to wafer film pouring equipment. Comprising a machine body, a feeding device arranged on the machine body, a first clamping device arranged at the discharging end of the feeding device, a film pasting device arranged on the machine body, a grabbing device arranged on the machine body, a peptizing device arranged on the machine body, a turnover device arranged on the machine body and a film tearing device arranged on the machine body. The first clamping device is arranged at the feeding end of the film tearing device, the second clamping device is arranged at the discharging end of the film tearing device, the discharging device is arranged on the machine body, the feeding device, the first clamping device and the film pasting device are located on the same center line, and a first aligning device located between the feeding device and the first clamping device is arranged on the machine body; the film tearing device, the second clamping device and the discharging device are located on the same center line, and a second aligning device is arranged between the second clamping device and the discharging device. The device has the advantages that the wafer can be conveniently subjected to film reversing processing, the steel ring is prevented from falling off, and the film reversing efficiency of the wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a wafer film inversion device. Background Art

[0002] Wafer film inversion is one of the steps in the wafer semiconductor manufacturing process. The specific operation is to remove the original protective film on the wafer and then cover one side of the wafer with a new adhesive film. The existing product wafer includes a wafer body and a steel ring on the periphery of the wafer. The original protective film of the wafer adheres the wafer body and the steel ring together. In order to avoid directly tearing off the protective film and causing the steel ring to fall off, the present application provides the wafer film inversion equipment. Summary of the invention

[0003] In order to facilitate the film inversion processing of the wafer, prevent the steel ring from falling, and improve the efficiency of the wafer film inversion, the present application provides a wafer film inversion equipment.

[0004] The present application provides a wafer film inversion device, which adopts the following technical solution:

[0005] A wafer film inversion device comprises a machine body, a feeding device arranged on the machine body, a clamping device 1 arranged at the discharge end of the feeding device, a film sticking device arranged on the machine body, a grasping device arranged on the machine body, a debonding device arranged on the machine body, a flipping device arranged on the machine body, a film tearing device arranged on the machine body, a clamping device 2 arranged at the discharge end of the film tearing device and a discharge device arranged on the machine body, the feeding device, the clamping device 1 and the film sticking device are located on the same center line, the machine body is provided with an alignment device 1 located between the feeding device and the clamping device 1, the film tearing ... The second holding device and the discharge device are located on the same center line, and an alignment device is provided between the second holding device and the discharge device; the feeding device is used to load wafers, the first clamping device clamps the wafer in the feeding device and places it on a first alignment device for position adjustment, the film pasting device receives the wafer with adjusted position and performs the film pasting operation, the grasping device grasps the wafer after film pasting and places the wafer on the debonding device, the debonding device debonds the protective film on the bottom of the wafer, the flipping device flips the debonded wafer, and the film tearing device tears off the protective film on the wafer.

[0006] By adopting the above technical scheme, the feeding device loads the wafer with the protective film attached, the clamping device 1 clamps the wafer to the alignment device 1, and the alignment device 1 adjusts the position of the wafer. After the wafer position is adjusted, the clamping device 1 transfers the wafer to the film attaching device, the film attaching device receives the material and attaches the adhesive film on the top surface of the wafer, and the protective film is located on the bottom surface of the wafer. After the wafer is attached with the adhesive film, the gripping device places the wafer to the debonding device, and the debonding device debonds the protective film on the bottom layer of the wafer, so that the subsequent film tearing device can tear the film. After the debonding device completes debonding, the gripping device picks up the wafer and the flipping device clamps the wafer. At this time, the gripping device releases the wafer, and the flipping device flips the wafer. The protective film after debonding is set upward. At this time, the gripping device places the wafer on the film tearing device for film tearing. Before entering the film tearing device, the alignment device 2 adjusts the position of the wafer. After the film tearing is completed, the wafer with the protective film torn off is clamped by the clamping device 2 and transmitted to the unloading device for unloading. This application effectively improves the efficiency of wafer film tearing and reduces the possibility of the steel ring falling when the wafer film is tearing.

[0007] Preferably, the feeding device includes a feeding rack arranged on the machine body, a feeding seat arranged on the feeding rack and used for loading wafers, and a moving part arranged on the feeding rack and used for driving the feeding seat to move up and down, the feeding seat includes a base plate arranged on the feeding rack and a positioning plate arranged on the base plate and used for positioning both sides of the wafer, the positioning plate is provided with a plurality of positioning grooves along the height direction, and the positioning grooves extend along the moving direction of the wafer.

[0008] Preferably, the alignment device includes a mounting frame arranged at the discharge end of the feeding device, a feeding plate arranged on the mounting frame, an adjustment plate arranged on the feeding plate and used for positioning both sides of the wafer, and an adjustment component arranged on the mounting frame and used for driving the adjustment plate to move; the clamping device includes a fixed seat arranged on the machine body, a clamping claw arranged on the fixed seat and located at the discharge end of the alignment device, and a linear motor arranged on the fixed seat and used for driving the clamping claw to move along the wafer movement path; the clamping claw includes an extension rod arranged on the linear motor, a clamping seat arranged at the end of the extension rod away from the linear motor, a clamping plate arranged on the clamping seat, a clamping plate cooperated with the clamping plate, and a driving member used to drive the clamping plate to clamp and position, and the clamping plate is provided with a positioning block for positioning the wafer.

[0009] Preferably, the film pasting device includes a material receiving assembly arranged on the machine body and used for receiving materials, a fixing frame arranged on the machine body and a film pasting assembly arranged on the fixing frame and located on the material receiving assembly, the material receiving assembly includes a material receiving cylinder and a material receiving seat arranged at the piston end of the material receiving cylinder, the machine body is provided with a slide rail extending along the moving direction of the material receiving cylinder piston, and the bottom surface of the material receiving seat is provided with a slider located on the slide rail; the material receiving seat includes a base, a material receiving table arranged on the base, a material receiving plate arranged on the material receiving table and a lifting member arranged on the base and used to drive the material receiving plate to move up and down, and a spring is sleeved on the lifting member.

[0010] Preferably, the film laminating assembly includes a film placing roller arranged on a fixed frame and used for placing the film, a plurality of guide rollers arranged on the fixed frame, a material receiving roller arranged on the fixed frame and a film cutting member arranged on the fixed frame, the machine body is provided with a support platform located on both sides of the material receiving seat, the support platform is provided with a plurality of guide rods for connecting to another support platform, a sliding block 1 is sleeved on the guide rod, a film pressing roller is arranged on the sliding block 1, a sliding block 2 is arranged at the end of the guide rod away from the sliding block 1, a traction roller is arranged on the sliding block 2, a driving member 2 for driving the traction roller to move is provided on the support platform, and a driving member 3 for driving the film pressing roller to move is provided on the support platform.

[0011] Preferably, the grasping device includes a grasping assembly for grasping wafers, a linear motor 2 arranged on the machine body and used to drive the grasping assembly to move horizontally, and a linear motor 3 arranged on the linear motor 2 and used to drive the grasping assembly to move up and down, the grasping assembly includes a clamping seat 2 arranged on the linear motor 3 and a plurality of suction nozzles arranged on the clamping seat 2, the clamping seat 2 includes a positioning portion arranged on the linear motor 3 and an extension portion uniformly arranged along the circumference of the positioning portion, and the extension portion is provided with an adjustment groove for installing the suction nozzle along the length direction.

[0012] Preferably, the debonding device includes an LED debonding part and a driving part four arranged on the body and used to drive the LED debonding part to move toward the grabbing component. The body is provided with a slide rail two along the driving direction of the driving part four, and the LED debonding part is provided with a slider two located on the slide rail two.

[0013] Preferably, the flipping device includes a mounting platform arranged on the machine body and located at both ends of the wafer, a flipping motor arranged on the mounting platform, a second clamp arranged at the output end of the flipping motor, and a driving cylinder arranged on the machine body and used to drive the two mounting platforms to move closer to or away from each other.

[0014] Preferably, the film tearing device includes a support frame, a material roller arranged on the support frame, a plurality of guide rollers arranged on the support frame, a movable roller group arranged on the support frame, a driving component arranged on the support frame and used to drive the movable roller group to move, a receiving component for receiving the material, and a winding roller arranged on the support frame.

[0015] Preferably, the movable roller group includes a connecting frame, a plurality of rotating rollers arranged on the connecting frame, a movable cylinder arranged on the connecting frame, a connecting frame arranged at the piston end of the movable cylinder, a pressing roller and a pulling and adjusting roller arranged in the connecting frame, and the connecting frame is provided with elastic parts located at both ends of the pulling and adjusting roller, and the elastic parts include a connecting rod arranged on the connecting frame, a positioning block two which is sleeved on the connecting rod and used to position the pulling and adjusting roller, and a spring two which is arranged in the positioning block two and sleeved on the connecting rod.

[0016] To sum up, the structural space utilization rate of the equipment of the present application is high, and the equipment volume is smaller than that of the equipment with the same processing output; for the wafer with a steel ring, the equipment of the present application first sticks the adhesive film on the wafer through the film sticking device, and then the debonding device debonds the protective film on the bottom of the wafer, and then the flipping device flips the wafer, and then the film tearing device tears off the protective film. There is no repeated operation in the whole equipment, the processing steps are simple and efficient, and the efficiency of wafer film flipping is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a wafer film inversion device of the present application;

[0018] Figure 2 It is a structural schematic diagram of a feeding device in a wafer film inversion device of the present application;

[0019] Figure 3 It is a structural schematic diagram of a clamping device 1 and an alignment device 1 in a wafer film inversion device of the present application;

[0020] Figure 4 This is a schematic structural diagram of an alignment device 1 in a wafer film inversion device of the present application;

[0021] Figure 5 This is a schematic diagram of the structure of a film laminating device in a wafer film inversion device of the present application. Figure 1 ;

[0022] Figure 6 This is a schematic diagram of the structure of a film laminating device in a wafer film inversion device of the present application. Figure 2 ;

[0023] Figure 7 It is a schematic diagram of the arrangement structure of a dissolving device, a turning device, a grabbing device, a film tearing device, a second clamping device, a second alignment device and a discharging device in a wafer film inversion device of the present application;

[0024] Figure 8 It is a structural schematic diagram of a gripping device in a wafer film inversion device of the present application;

[0025] Fig. 9 This is a schematic diagram of the structure of a clamping device 2 in a wafer film inversion device of the present application;

[0026] Fig.10 This is a schematic diagram of the structure of a film tearing device in a wafer film inversion device of the present application. Figure 1 ;

[0027] Fig.11 This is a schematic diagram of the structure of a film tearing device in a wafer film inversion device of the present application. Figure 2 ;

[0028] Fig.12 It is a cross-sectional view of a film tearing device in a wafer film inversion device of the present application.

[0029] Description of reference numerals: 1, machine body; 2, feeding device; 21, feeding rack; 22, feeding seat; 221, bottom plate; 222, positioning plate; 23, moving part; 3, clamping device 1; 31, fixing seat 1; 32, clamping claw 1; 321, extension rod 1; 322, clamping seat 1; 323, clamping plate 1; 3231, positioning block 1; 324, clamping plate 2; 325, driving part 1; 33, linear motor 1; 4, film sticking device; 41, material receiving assembly; 411, material receiving cylinder; 412, material receiving seat; 4121 , base; 4122, receiving platform; 4123, receiving plate; 4124, lifting member; 42, fixing frame; 43, film sticking assembly; 431, film placing roller; 432, guiding roller; 433, material collecting roller; 434, film cutting member; 5, grabbing device; 51, grabbing assembly; 511, clamping seat 2; 5111, positioning part; 5112, extension part; 512, nozzle; 52, linear motor 2; 53, linear motor 3; 6, degumming device; 61, LED degumming member; 62, driving member 4; 7, flipping device ;71, mounting table;72, flip motor;73, clamping claw 2;74, driving cylinder;8, film tearing device;81, support frame;82, material roller;83, guide roller;84, moving roller group;841, connecting frame;842, rotating roller;843, moving cylinder;844, connecting frame;845, pressing roller;846, pulling and adjusting roller;85, driving assembly;86, receiving assembly;87, winding roller;9, clamping device 2;10, discharging device;11, alignment device 1;111, mounting frame 1;1 12. Feed plate one; 113. Adjustment plate one; 114. Adjustment component one; 12. Alignment device two; 13. Positioning slot; 14. Slide rail one; 15. Slider one; 16. Spring one; 17. Support table; 18. Guide rod; 19. Slide block one; 20. Film pressing roller; 24. Slide block two; 25. Traction roller; 26. Drive member two; 27. Drive member three; 28. Adjustment slot; 29. ​​Slide rail two; 30. Slider two; 34. Elastic member; 341. Connecting rod; 342. Positioning block two; 343. Spring two. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-Figure 12 This application is described in further detail.

[0031] The present application embodiment discloses a wafer film inversion device. Figure 1, including a body 1, a feeding device 2 installed on the body 1, an alignment device 11, a clamping device 3, a film pasting device 4, a gripping device 5, a dissolving device 6, a flipping device 7, a film tearing device 8, a clamping device 9, an alignment device 12 and a discharging device 10. In the embodiment of the present application, the above components are arranged in sequence and in a U-shaped arrangement. The feeding device 2 is used to load wafers with a protective film pasted on the bottom, and the clamping device 3 is used to clamp the wafers in the feeding device 2. Before the clamping device 3 clamps the wafer to the film pasting device 4, the alignment device 11 adjusts the position of the wafer to ensure the uniformity of the position of the wafer on the film pasting device 4. In order to further improve the stability of the wafer position movement, the feeding device 2, the alignment device 11, the clamping device 3 and the film pasting device 4 are all on the same center line. The clamping device 1 3 places the wafer with adjusted position on the film sticking device 4 for film sticking. After the film sticking is completed, the grasping device 5 places the wafer on the debonding device 6. The debonding device 6 debonds the protective film on the bottom of the wafer. Then the wafer after debonding is grasped by the flipping device 7, which performs a flipping operation to flip the debonded protective film upward. The grasping device 5 grabs the wafer to the alignment device 2 12. The alignment device 2 12, the discharge device 10, the clamping device 2 9 and the film tearing device 8 are all on the same center line. The alignment device 2 12 adjusts the position of the wafer, and then the film tearing device 8 receives the material and tears off the protective film on the wafer. After the film tearing operation is completed, the clamping device 2 9 places the wafer on the discharge device 10.

[0032] Reference Figure 1 and Figure 2 The feeding device 2 includes a feeding rack 21 fixedly mounted on the machine body 1, a moving part 23 mounted on the feeding rack 21, and a feeding seat 22 mounted on the moving part 23. The moving part 23 is used to drive the feeding seat 22 to move up and down. The feeding seat 22 is used to load a number of wafers with protective films attached. The protective film of the present application adheres the wafer body and the external steel ring together to improve the stability of the wafer. The feeding seat 22 includes a bottom plate 221 fixedly mounted on the driving end of the moving part 23 and a positioning plate 222 mounted on the bottom plate 221 and located on both sides of the wafer moving path. The two positioning plates 222 are used to position both sides of the wafer. The positioning plate 222 is provided with a number of positioning grooves 13 for positioning the side edges of the wafer in the height direction. The positioning grooves 13 are open toward one end of the film pasting device 4 to facilitate wafer discharge. In order to facilitate wafer loading, the positioning groove 13 on one of the positioning plates 222 is sealed at one end away from the film sticking device 4, and both ends of the positioning groove 13 on the other positioning plate 222 are open, so that the wafer can be pushed into the positioning groove 13. In the embodiment of the present application, a plurality of positioning grooves 13 are evenly opened along the height direction of the positioning plate 222. In the embodiment of the present application, the moving part 23 is mainly a linear drive structure, such as a linear motor, a motor lead screw, a cylinder or other drive structures.

[0033] Reference Figure 2 and Figure 3 When the equipment is started, the clamping device 3 clamps the wafer on the feed seat 22 to prevent it from being adjusted on the alignment device 11. The alignment device 11 includes a mounting frame 111 fixedly mounted on the discharge end of the feed seat 22, a feed plate 112 mounted on the mounting frame 111, an adjustment plate 113 mounted on the feed plate 112 and located on both sides of the wafer conveying path, and an adjustment component 114 mounted on the mounting frame 111 and used to drive the adjustment plates 113 on both sides to move closer to or away from each other.

[0034] Reference Figure 3 and Figure 4 , the adjustment component 114 includes a conveyor belt located between two adjustment plates 113, a conveyor wheel connected to the conveyor belt and located at both ends of the conveyor belt, and a motor for driving the conveyor wheel to rotate, wherein the bottom surface of one adjustment plate 113 is installed with a connection block 1 located on one side of the length direction of the conveyor belt, and the bottom surface of the other adjustment plate 113 is installed with a connection block 2 located on the other side of the length direction of the conveyor belt. When the conveyor belt moves, the two adjustment plates 113 are driven to approach or move away from the center line of the mounting frame 111 at the same time. In order to improve the stability of the movement of the adjustment plate, the mounting frame is fixedly installed with a slide rail 3 along the length direction of the conveyor belt, and the bottom surface of the adjustment plate is fixedly installed with a slider 3 located on the slide rail 3. The adjustment component 114 of the present application can also be a double-headed cylinder or two sets of screw rods arranged relatively to each other, which mainly drives the two adjustment plates 113 to move closer or farther in translation, adjusts the center line of the wafer to the center line of the alignment device 111, and improves the position accuracy of the subsequent wafer on the film bonding device 4.

[0035] Reference Figure 1 and Figure 3After the wafer position is adjusted, the clamping device 3 clamps the wafer to the film attaching device 4. The clamping device 3 includes a fixed seat 31 fixedly mounted on the machine body 1, a linear motor 33 fixedly mounted on the fixed seat 31, and a clamping claw 32 fixedly mounted on the output end of the linear motor 33. The fixed seat 31 extends along the length direction of the wafer conveying path, and the linear motor 33 extends along the length direction of the fixed seat 31, so as to drive the clamping claw 32 to move from the feeding device 2 to the film attaching device 4. The clamping claw 32 includes an extension rod 321 mounted on a linear motor 33, a clamping seat 322 fixedly mounted on one end of the extension rod 321 away from the linear motor 33, a clamping plate 323 fixedly mounted on the clamping seat 322, a driving member 325 fixedly mounted on the clamping seat 322, and a clamping plate 324 fixedly mounted on the driving end of the driving member 325 and cooperating with the clamping plate 323. The driving member 325 uses a cylinder in the embodiment of the present application, and the cylinder drives the clamping plate 324 to move up and down, and cooperates with the clamping plate 323 to clamp the wafer. A positioning block 3231 for positioning the side of the wafer is fixedly mounted on the clamping plate 323. Two groups of positioning blocks 3231 are arranged in the embodiment of the present application, and the two groups of positioning blocks 3231 are symmetrically arranged on both sides of the clamping plate 323.

[0036] Reference Figure 3 and Figure 5, the clamping jaw 32 clamps the wafer to the film pasting device 4 for film pasting operation, and the film pasting device 4 includes a fixing frame 42 fixedly mounted on the machine body 1, a receiving assembly 41 mounted on the machine body 1 and located below the clamping jaw 32, and a film pasting assembly 43 mounted on the fixing frame 42 and used to film the wafer on the receiving assembly 41. The receiving assembly 41 includes a receiving cylinder 411 fixedly mounted on the machine body 1 and a receiving seat 412 fixedly mounted on the piston end of the receiving cylinder 411. The piston movement direction of the receiving cylinder 411 is consistent with the wafer conveying direction. The receiving cylinder 411 moves the receiving seat 412 to the right below the clamping jaw 32, and the receiving seat 412 receives the wafer. The material receiving seat 412 includes a base 4121 connected to the cylinder piston end, a material receiving platform 4122 fixedly installed on the base 4121, a lifting member 4124 fixedly installed on the base 4121 and a material receiving plate 4123 fixedly installed on the driving end of the lifting member 4124. The top surface of the material receiving platform 4122 is provided with a through groove for the material receiving plate 4123 to move up and down. The lifting member 4124 is sleeved with a spring 16. When the lifting member 4124 drives the material receiving plate 4123 to move up or down, the spring 16 improves the stability of the movement of the material receiving plate 4123. In order to improve the stability of the movement of the receiving seat 412, a slide rail 14 is fixedly installed on the body 1, and the slide rail 14 extends along the moving direction of the piston of the receiving cylinder 411. A slider 15 located on the slide rail 14 is fixedly installed on the base 4121. The present application provides two sets of slide rails 14 and sliders 15. When the receiving cylinder 411 drives the receiving seat 412 to move below the clamping jaw 32, the lifting member 4124 drives the receiving plate 4123 to move up to receive the material. After the wafer receiving plate 4123 receives the material, the clamping jaw 32 is released to place the wafer on the receiving plate 4123. After the receiving plate 4123 receives the wafer, the lifting member 4124 moves down to drive the wafer to move to the processing area of ​​the film assembly 43. The lifting member 4124 is preferably a linear drive structure such as a cylinder, a telescopic rod, or a screw.

[0037] Reference Figure 5 and Figure 6The film sticking assembly 43 includes a film putting roller 431 mounted on the fixed frame 42, a plurality of guide rollers 432 mounted on the fixed frame 42, a material receiving roller 433 mounted on the fixed frame 42, and a film cutting member 434 mounted on the fixed frame 42. The film putting roller 431 is wound with a sticking film, and the guide roller 432 is used to guide the sticking film to the top of the wafer. The machine body 1 is fixedly mounted with support tables 17 located on both sides of the receiving seat 412, and a plurality of guide rods 18 are arranged between the two support tables 17. In the embodiment of the present application, two guide rods 18 are arranged and located on the other parallel sides of the receiving seat 412. One end of the guide rod 18 is fixed to one end of a support table 17, and the other end of the guide rod 18 is fixed to one end of another support table 17. In the embodiment of the present application, the two guide rods 18 are sleeved with a sliding block 19, a film pressing roller 20 is installed between the two sliding blocks 19, and a driving member 3 27 is installed on the support platform 17 for driving the sliding block 19 to move, thereby driving the film pressing roller 20 to rotate and move; the two guide rods 18 are sleeved with a sliding block 24, a traction roller 25 is installed between the two sliding blocks 24, and a driving member 26 is installed on the support platform 17, and the driving member 26 is used to drive the sliding block 24 to move, thereby driving the traction roller 25 to rotate and move. In the embodiment of the present application, the driving member 3 27 and the driving member 2 26 are conveyor belts or cylinders, the traction roller 25 is located at one end of the guide rod 18, and the film pressing roller 20 is located at the other end of the guide rod 18. The adhesive film passes under the film pressing roller 20, and the driving member 3 27 drives the film pressing roller 20 to move toward the traction roller 25 and press the adhesive film on the wafer, and then the film pressing roller 20 presses the film again when it is reset to ensure the integrity of the adhesive film.

[0038] Reference Figure 5 and Figure 6After the film pressing roller 20 is reset, the film cutting component 434 cuts off the excess film material on the wafer. The film cutting component 434 includes a cylinder fixedly mounted on the fixed frame 42, a connecting seat arranged at the piston end of the cylinder, an extension rod 2 arranged on the connecting seat, a motor arranged on the extension rod 2 and located between the film pressing roller 20 and the traction roller 25, a connecting block arranged at the output end of the motor, and a film cutting knife arranged on the connecting block. A rotating shaft is arranged on the connecting seat, and one end of the extension rod 2 is rotatably connected to the connecting seat through the rotating shaft. A positioning block located between the connecting seat and the motor is arranged on the fixed frame 42, and a rotating shaft is arranged on the fixed cutting block, and the extension rod 2 is rotatably connected to the positioning block through the rotating shaft. When the cylinder drives one end of the extension rod 2 to move upward, the rotating shaft on the positioning block is the rotation fulcrum of the extension rod 2, driving the other end of the extension rod 2 to move downward. When the cylinder drives one end of the extension rod 2 to move downward, the other end of the extension rod 2 moves upward, so as to control the film cutting knife to cut off the excess abrasive on the wafer. The motor drives the connection block to rotate, and the connection block drives the film cutter to rotate and cut the film. The connection block is provided with a plug-in rod for adjusting the film cutting radius of the film cutter. The plug-in rod is fixed to the connection block by bolts. The staff controls the film cutting radius of the film cutter by adjusting the plug-in length of the plug-in rod. After the wafer film cutting is completed, the driving part 26 drives the traction roller 25 to move toward the film pressing roller 20, and the excess film material is peeled off the material receiving seat 412, and the material receiving roller 433 rewinds the excess film material.

[0039] Reference Figure 1 and Figure 7 After the wafer film is attached, the receiving assembly 41 moves the wafer to the operating range of the grabbing device 5. The grabbing device 5 grabs the wafer on the receiving assembly 41 and places the wafer to the disintegration device 6 for disintegration. The grabbing device 5 includes a linear motor 2 52 fixedly mounted on the fixing frame 42 at one end, a linear motor 3 53 mounted on the linear motor 2 52, and a grabbing assembly 51 mounted on the linear motor 3 53. The other end of the linear motor 2 52 is fixedly mounted on the film tearing device 8. The linear motor 2 52 drives the linear motor 3 53 to move horizontally, and the linear motor 3 53 drives the grabbing assembly 51 to move up and down.

[0040] Reference Figure 7 and Figure 8The gripping assembly 51 includes a clamping seat 2 511 mounted on a linear motor 3 53 and a plurality of suction nozzles 512 mounted on the clamping seat 2 511. The suction nozzles 512 are used to adsorb the wafers, so as to facilitate the grasping of the wafers for movement. In order to improve the adsorption stability of the gripping assembly 51 on the wafers, the clamping seat 2 511 includes a positioning portion 5111 mounted on the linear motor 3 53 and a plurality of extension portions 5112 uniformly distributed along the circumference of the positioning portion 5111. The extension portion 5112 is provided with an adjustment slot 28 for installing the suction nozzles 512 along the length direction, so that the staff can adjust the position or number of the suction nozzles 512 to improve the gripping stability of the gripping assembly 51. The linear motor 52 drives the clamping seat 2 511 to move above the material receiving seat 412, and the linear motor 53 drives the clamping seat 2 511 to move downward. After the suction nozzle 512 contacts and adsorbs the wafer, the linear motor 53 drives the clamping seat 2 511 to move upward, and the linear motor 52 drives the clamping seat 2 511 to move above the degumming device 6, and then the linear motor 53 drives the clamping seat 2 511 to move downward, and the wafer is placed on the degumming device 6 for degumming.

[0041] Reference Figure 7 and Fig. 9 The debonding device 6 includes an LED debonding component 61 and a driving component 4 62 installed on the machine body 1 and used to drive the LED debonding component 61 to move toward the grab assembly 51. The driving component 4 62 is a motor and ball screw drive structure in the embodiment of the present application, and a linear drive structure such as a cylinder or a linear motor can also be used. In order to improve the movement stability of the LED debonding component 61, the machine body 1 is fixedly installed with a slide rail 29 along the driving direction of the driving component 4 62, and a slider 2 30 located on the slide rail 29 is fixedly installed on the LED debonding component 61. The LED debonding component 61 is installed inside the machine body 1, and an opening is opened on the machine body 1 below the clamping seat 2 511. When the LED debonding component 61 moves to the opening, the linear motor 3 53 drives the clamping seat 2 511 to move downward to place the wafer on the LED debonding component 61, and then the driving component 4 62 drives the LED debonding component 61 to enter a light-proof place for debonding. The LED debonding component 61 quickly solidifies the glue through ultraviolet rays, thereby quickly debonding. After the debonding is completed, the debonding protective film needs to be torn off. In order to facilitate the film tearing device 8 to tear off the protective film, the wafer needs to be turned over, and the debonding protective film is turned over and transferred upward to the film tearing device 8 for film tearing processing.

[0042] Reference Figure 7 and Fig. 9The flipping device 7 includes a driving cylinder 74 fixedly mounted on the body 1 and used to position the two ends of the wafer, a mounting platform 71 arranged at the piston end of the driving cylinder 74, a flipping motor 72 fixedly mounted on the mounting platform 71, and a clamp 2 73 fixedly mounted at the output end of the flipping motor 72. The clamp 2 73 includes a cylinder fixedly mounted at the output end of the flipping motor 72, a clamping block 1 arranged at the piston end of the cylinder, and a clamping block 2 arranged on the cylinder and cooperating with the clamp 1. In the embodiment of the present application, the mounting platform 71 avoids the adsorption position of the suction nozzle 512, and the two mounting platforms 71 are arranged relative to each other to position the two ends of the wafer, thereby improving the clamping stability of the wafer by the clamp 2 73. The driving cylinder 74 is used to drive the two clamps 2 73 to move closer or farther away from each other, so that the clamp 2 73 can clamp the wafer or avoid the wafer. The gripping assembly 51 absorbs the wafer after debonding and places it within the clamping range of the second clamping jaw 73. The driving cylinder 74 drives the second clamping jaw 73 to approach the wafer, and then the second clamping jaw 73 clamps the wafer. The flipping motor 72 drives the second clamping jaw 73 to rotate, driving the wafer to flip, and flip the protective film after debonding upward. After the flipping is completed, the gripping assembly 51 absorbs the flipped wafer and moves it to the film tearing device 8 for film tearing operation.

[0043] Reference Fig.10 and Fig.11 Before the wafer enters the film tearing device 8, the alignment device 2 12 adjusts the position of the wafer to ensure the uniformity of the wafer placement position. The alignment device 2 12 has the same structure as the alignment device 1 11, which is convenient for the production and installation of the equipment. The alignment device 2 12 includes a mounting frame 2 fixedly mounted on the feed end of the discharging device 10, a feed plate 2 mounted on the mounting frame, an adjustment plate 2 mounted on the feed plate 2 and used to position the two sides of the wafer, and an adjustment component 2 mounted on the mounting frame 2, and the adjustment component 2 is used to drive the two adjustment plates 2 to move synchronously and oppositely. The adjustment component 2 of the present application is consistent in structure with the adjustment component 1 14. After the two adjustment plates 2 align the center line of the wafer with the alignment device 2 12 or the center line of the film tearing device 8, the film tearing device 8 receives the material and performs a film tearing operation on the wafer.

[0044] Reference Fig.10 and Fig.11The film tearing device 8 includes a support frame 81 fixedly mounted on the machine body 1, a material roller 82 mounted on the support frame 81, a plurality of guide rollers 83 mounted on the support frame 81, a moving roller group 84 mounted on the support frame 81, a driving component 85 mounted on the support frame 81 and used to drive the moving roller group 84 to move, a receiving component 86 mounted on the machine body 1 and used to receive the wafer, and a winding roller 87 mounted on the support frame 81 and used to wind up the waste film. The material roller 82 is wrapped with tape, the guide roller 83 is used to move the tape toward the wafer on the receiving component 86, the moving roller group 84 is used to adhere the tape to the wafer, the driving component 85 is used to drive the moving roller group 84 to press the adhesive tape and pull the tape at the same time to tear off the protective film on the wafer, and then the material is rewound by the winding roller 87.

[0045] Reference Fig.11 and Fig.12 The driving assembly 85 includes a motor mounted on the support frame 81, a ball screw fixedly mounted on the output end of the motor, and a control block mounted on the ball screw nut. The moving roller group 84 includes a connecting frame 841 fixedly mounted on the control block, a rotating roller 842 mounted on the connecting frame 841 at one end close to the guide roller 83, a moving cylinder 843 fixedly mounted on the connecting frame 841, a connecting frame 844 fixedly mounted on the piston end of the moving cylinder 843, a pressing roller 845 mounted on one end of the connecting frame 844 close to the rotating roller 842, and a pulling and adjusting roller 846 mounted on one end of the connecting frame 844 away from the rotating roller 842. The connecting frame 844 is provided with an elastic member 34 located at both ends of the pulling and adjusting roller 846. The elastic member 34 includes a connecting rod 341 with one end fixedly installed on the connecting frame 844, a positioning block 342 sleeved on the connecting rod 341 and used to position the pulling and adjusting roller 846, and a spring 343 arranged in the positioning block 342 and sleeved on the connecting rod 341. One end of the spring 343 is fixed to the connecting frame 844, and the other end of the spring 343 is fixed to the positioning block 342. A groove for the extension and retraction of the connecting rod 341 is provided in the positioning block 342, so that the pulling and adjusting roller 846 can be elastically moved up and down through the elastic member 34.

[0046] Reference Fig.11 and Fig.12In the embodiment of the present application, a material roller 82 is provided, a guide roller 83a is provided below the material roller 82, and a guide roller 83b is provided above the guide roller 83a; in the embodiment of the present application, three rotating rollers 842 (a, b, c) are provided, and the three rotating rollers 842 (a, b, c) are arranged in sequence from top to bottom along the height direction; the pressing roller 845 is located at the end of the connecting frame 841 away from the rotating roller 842, and the pulling adjustment roller 846 is located at the side of the pressing roller 845 away from the rotating roller 842. Three rotating rollers 842 (a, b, c) are located above the guide roller 83b, and a rotating roller 842d is also installed on the connecting frame 844. The rotating roller 842d is located between the rotating roller 842a and the guide roller 83b, and the rotating roller 842d is located above the rotating roller 842a; two mutually cooperating guide rollers 83 (c, d) are also installed on the support frame 81; a winding roller 87 is provided, and the winding roller 87 is located above the guide roller 83c and the guide roller 83d. The adhesive tape is wound on the material roller 82, and the guide roller 83a guides the adhesive tape to the guide roller 83b. The guide roller 83b guides the adhesive tape to between the rotating roller 842b and the rotating roller 842c, and then moves from between the rotating roller 842b and the rotating roller 842c to the pressing roller 845, and then goes back from the pressing roller 845 to between the rotating roller 842a and the rotating roller 842b. The adhesive tape then moves from the rotating roller 842d to between the guide roller 83c and the guide roller 83d, and then is taken up by the winding roller 87. The driving component 85 first moves the pressing roller 845 to the end of the receiving component 86 away from the material roller 82, and then the pressing roller 845 presses the adhesive tape on the protective film of the wafer after the adhesive is dissolved, and then the driving component 85 drives the pressing roller 845 to move toward the material roller 82 and press the adhesive tape on the wafer, and at this time the adhesive tape is adhered to the protective film on the wafer. Then the driving assembly 85 drives the connecting frame 841 to move as a whole, and the pulling adjustment roller 846 cooperates with the pressing roller 845 to tear the tape, and at the same time the elastic member 34 adapts to the pulling force of the tape to avoid excessive force and cause the tape to be damaged. Finally, the winding roller 87 starts to wind up the tape with the protective film attached.

[0047] Reference Figure 1 and Fig.10In the embodiment of the present application, the receiving assembly 86 has the same structure as the receiving assembly 41, which is convenient for conveying wafers. For wafers with film peeling completed, the receiving assembly 86 lifts the wafer to the clamping height of the clamping device 2 9, and the clamping device 2 9 clamps and pushes the wafer to the discharge device 10. The structure of the clamping device 2 9 in the present application is consistent with the structure of the clamping device 1 3. The clamping device 2 9 includes a fixed seat 2 fixedly mounted on the body 1, a linear motor 4 fixedly mounted on the fixed seat 2, and a clamping claw 3 fixedly mounted on the output end of the linear motor 4. The fixed seat 2 extends along the length direction of the wafer conveying path, and the linear motor 4 extends along the length direction of the fixed seat 2, so as to drive the clamping claw 3 to move from the film peeling device 8 to the discharge device 10. The clamping jaw 3 includes an extension rod 3 mounted on the linear motor 4, a clamping seat 3 fixedly mounted on the end of the extension rod 3 away from the linear motor 4, a clamping plate 3 fixedly mounted on the clamping seat 3, a driving member 5 fixedly mounted on the clamping seat 3, and a clamping plate 4 fixedly mounted on the driving end of the driving member 5 and cooperating with the clamping plate 3. The driving member 5 uses a cylinder in the embodiment of the present application, and the clamping plate 4 is driven up and down by the cylinder to clamp the wafer in cooperation with the clamping plate 3. A positioning block 2 342 for positioning the side of the wafer is fixedly mounted on the clamping plate 3. The positioning block 2 342 is arranged in two groups in the embodiment of the present application. The two groups of positioning blocks 2 342 are symmetrically arranged on both sides of the clamping plate 3, so that the clamping jaw 3 can clamp and push the wafer into the discharge device 10.

[0048] Reference Figure 1 and Fig.10 In the embodiment of the present application, the discharge device 10 has the same structure as the feed device 2. The wafer enters the feed seat 22 of the discharge device 10, and the feed seat 22 is driven up and down by the moving member 23 to facilitate wafer feeding. The wafer film inversion equipment of the present application effectively prevents the steel ring from falling during the wafer film inversion process, improves the wafer film inversion efficiency, and at the same time improves the wafer film tearing efficiency.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer film inversion device, characterized in that: The invention comprises a machine body (1), a feeding device (2) arranged on the machine body (1), a clamping device (3) arranged at the discharge end of the feeding device (2), a film sticking device (4) arranged on the machine body (1), a grasping device (5) arranged on the machine body (1), a degumming device (6) arranged on the machine body (1), a turning device (7) arranged on the machine body (1), a film tearing device (8) arranged on the machine body (1), a clamping device (9) arranged at the discharge end of the film tearing device (8), and a discharge device (10) arranged on the machine body (1), wherein the feeding device (2), the clamping device (3) and the film sticking device (4) are located on the same center line, and the machine body (1) is provided with an alignment device (11) located between the feeding device (2) and the clamping device (3). ), the film tearing device (8), the clamping device 2 (9) and the discharge device (10) are located on the same center line, and an alignment device 2 (12) is provided between the clamping device 2 (9) and the discharge device (10); the feeding device (2) is used to load wafers, the clamping device 1 (3) clamps the wafer in the feeding device (2) and places it at the alignment device 1 (11) for position adjustment, the film pasting device (4) receives the wafer with adjusted position and then performs the film pasting operation, the grasping device (5) grasps the wafer after film pasting and places the wafer on the debonding device (6), the debonding device (6) debonds the protective film on the bottom of the wafer, the flipping device (7) flips the wafer after debonding, and the film tearing device (8) tears off the protective film on the wafer.

2. The wafer film inversion device according to claim 1, characterized in that: The feeding device (2) comprises a feeding rack (21) arranged on the machine body (1), a feeding seat (22) arranged on the feeding rack (21) and used for loading wafers, and a moving member (23) arranged on the feeding rack (21) and used for driving the feeding seat (22) to move up and down, the feeding seat (22) comprising a bottom plate (221) arranged on the feeding rack (21) and a positioning plate (222) arranged on the bottom plate (221) and used for positioning both sides of the wafer, the positioning plate (222) being provided with a plurality of positioning grooves (13) along a height direction, and the positioning grooves (13) extending along a wafer moving direction.

3. The wafer film inversion device according to claim 1, characterized in that: The alignment device (11) comprises a mounting frame (111) arranged at the discharge end of the feed device (2), a feed plate (112) arranged on the mounting frame (111), an adjustment plate (113) arranged on the feed plate (112) and used for positioning the two sides of the wafer, and an adjustment component (114) arranged on the mounting frame (111) and used for driving the adjustment plate (113) to move; the clamping device (3) comprises a fixing seat (31) arranged on the machine body (1), a clamping claw (32) arranged on the fixing seat (31) and located at the discharge end of the alignment device (11), and a fixing member (114) arranged on the fixing seat (31) and located at the discharge end of the alignment device (11). A linear motor (33) is mounted on a wafer substrate and is used to drive a clamping jaw (32) to move along a wafer moving path; the clamping jaw (32) comprises an extension rod (321) arranged on the linear motor (33), a clamping seat (322) arranged at one end of the extension rod (321) away from the linear motor (33), a clamping plate (323) arranged on the clamping seat (322), a clamping plate (324) matched with the clamping plate (323) and a driving member (325) used to drive the clamping plate (324) to clamp and position, and a positioning block (3231) for positioning the wafer is provided on the clamping plate (323).

4. The wafer film inversion device according to claim 1, characterized in that: The film pasting device (4) comprises a material receiving assembly (41) arranged on the machine body (1) and used for receiving materials, a fixing frame (42) arranged on the machine body (1), and a film pasting assembly (43) arranged on the fixing frame (42) and located on the material receiving assembly (41); the material receiving assembly (41) comprises a material receiving cylinder (411) and a material receiving seat (412) arranged at the piston end of the material receiving cylinder (411); the machine body (1) is provided with a slide rail (14) extending along the moving direction of the piston of the material receiving cylinder (411); The bottom surface of the material receiving seat (412) is provided with a sliding block (15) located on a slide rail (14); the material receiving seat (412) comprises a base (4121), a material receiving platform (4122) arranged on the base (4121), a material receiving plate (4123) arranged on the material receiving platform (4122), and a lifting member (4124) arranged on the base (4121) and used for driving the material receiving plate (4123) to move up and down, and a spring (16) is sleeved on the lifting member (4124).

5. The wafer film inversion device according to claim 4, characterized in that: The film laminating assembly (43) comprises a film placing roller (431) arranged on a fixing frame (42) and used for placing a film, a plurality of guide rollers (432) arranged on the fixing frame (42), a material receiving roller (433) arranged on the fixing frame (42), and a film cutting member (434) arranged on the fixing frame (42); the machine body (1) is provided with a support platform (17) located on both sides of the material receiving seat (412); the support platform (17) is provided with a plurality of guide rods (18) for connecting to another support platform (17). ), a sliding block 1 (19) is sleeved on the guide rod (18), a film pressing roller (20) is arranged on the sliding block 1 (19), a sliding block 2 (24) is arranged at one end of the guide rod (18) away from the sliding block 1 (19), a traction roller (25) is arranged on the sliding block 2 (24), a driving member 2 (26) for driving the traction roller (25) to move is arranged on the support platform (17), and a driving member 3 (27) for driving the film pressing roller (20) to move is arranged on the support platform (17).

6. The wafer film inversion device according to claim 1, characterized in that: The gripping device (5) comprises a gripping assembly (51) for gripping wafers, a second linear motor (52) arranged on a machine body (1) and used to drive the gripping assembly (51) to move horizontally, and a third linear motor (53) arranged on the second linear motor (52) and used to drive the gripping assembly (51) to move up and down. The gripping assembly (51) comprises a second clamping seat (511) arranged on the third linear motor (53) and a plurality of suction nozzles (512) arranged on the second clamping seat (511). The second clamping seat (511) comprises a positioning portion (5111) arranged on the third linear motor (53) and an extension portion (5112) uniformly arranged along the circumference of the positioning portion (5111). The extension portion (5112) is provided with an adjustment groove (28) for mounting the suction nozzle (512) along the length direction.

7. The wafer film inversion device according to claim 6, characterized in that: The degumming device (6) comprises an LED degumming component (61) and a driving component four (62) arranged on the machine body (1) and used to drive the LED degumming component (61) to move toward the grasping component (51), the machine body (1) is provided with a slide rail two (29) along the driving direction of the driving component four (62), and the LED degumming component (61) is provided with a slider two (30) located on the slide rail two (29).

8. The wafer film inversion device according to claim 1, characterized in that: The flipping device (7) comprises a mounting platform (71) arranged on the machine body (1) and located at both ends of the wafer, a flipping motor (72) arranged on the mounting platform (71), a second clamping claw (73) arranged at the output end of the flipping motor (72), and a driving cylinder (74) arranged on the machine body (1) and used to drive the two mounting platforms (71) to move closer to or farther away from each other.

9. The wafer film inversion device according to claim 1, characterized in that: The film tearing device (8) comprises a support frame (81), a material roller (82) arranged on the support frame (81), a plurality of guide rollers (83) arranged on the support frame (81), a moving roller group (84) arranged on the support frame (81), a driving component (85) arranged on the support frame (81) and used for driving the moving roller group (84) to move, a receiving component (86) used for receiving the material, and a winding roller (87) arranged on the support frame (81).

10. The wafer film inversion device according to claim 9, characterized in that: The movable roller group (84) comprises a connecting frame (841), a plurality of rotating rollers (842) arranged on the connecting frame (841), a movable cylinder (843) arranged on the connecting frame (841), a connecting frame (844) arranged at the piston end of the movable cylinder (843), a pressing roller (845) and a pulling and adjusting roller (846) arranged in the connecting frame (844); the connecting frame (844) is provided with an elastic member (34) located at both ends of the pulling and adjusting roller (846); the elastic member (34) comprises a connecting rod (341) arranged on the connecting frame (844), a second positioning block (342) sleeved on the connecting rod (341) and used for positioning the pulling and adjusting roller (846), and a second spring (343) arranged in the second positioning block (342) and sleeved on the connecting rod (341).

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