Wafer offset detection device and detection method

Abstract

The embodiment of the invention provides a wafer offset detection device and detection method. A wafer is provided with a positioning groove. The detection device comprises the components of a substrate which is used for bearing the wafer; the positioning mark is located on the substrate; the detection unit is used for transmitting a detection signal to a preset range of the substrate so as to detect whether the positioning groove and the positioning identifier are located in the preset range or not; the acquisition unit is arranged along the transmission or reflection path of the detection signal through the substrate in the preset range, and is used for acquiring the image information of the positioning groove and the positioning identifier in the preset range when the substrate in the preset range is detected by the detection unit, and the image information comprises the position information of the positioning groove and the position information of the positioning identifier; and the processing unit is connected with the acquisition unit and is used for determining the offset between the initial position of the wafer and the position of the wafer in the image information according to the image information. By adopting the detection device, the production efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a wafer offset detection device and a wafer offset detection method. Background Art

[0002] In order to improve the heat dissipation efficiency of the chip, reduce the chip packaging volume, reduce the internal stress of the chip, and improve the electrical performance, the wafer needs to be thinned. The wafer thinning process does not thin the entire plane of the wafer, but only thins the middle part of the wafer. The thinned part forms the wafer body, and the edge of the wafer is not thinned. The edge of the wafer that is not thinned forms a thinning ring. The thinned wafer is cut once by a cutting blade to remove the thinning ring, and the wafer body after the thinning ring is removed is cut twice to form multiple single chips.

[0003] However, during the wafer cutting process, there is a problem of reduced production efficiency. Therefore, how to provide a technical solution to improve production efficiency has become a technical problem that those skilled in the art need to solve urgently. Summary of the invention

[0004] The technical problem solved by the present invention is to improve production efficiency by providing a wafer deviation detection device and a detection method.

[0005] In order to solve the above problems, an embodiment of the present invention provides a wafer offset detection device, wherein the wafer has a positioning groove; the detection device comprises: a substrate for carrying the wafer; a positioning mark located on the substrate; a detection unit for emitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; a collection unit is arranged along a path along which the detection signal is transmitted or reflected by the substrate within the preset range, and is used to obtain image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information comprising: position information of the positioning groove and position information of the positioning mark; a processing unit is connected to the collection unit, and is used to determine, based on the image information, an offset between an initial position of the wafer and a position of the wafer in the image information.

[0006] Optionally, the detection unit and the collection unit are located on the same side of the substrate supporting the wafer.

[0007] Optionally, the detection unit and the collection unit are located on opposite sides of the substrate, and the collection unit is located on a side of the substrate that supports the wafer, and the detection unit is located on a side facing away from the substrate that supports the wafer.

[0008] Optionally, the detection device further includes: a fixing ring for fixing a substrate carrying a wafer, wherein an inner diameter of the fixing ring is larger than a diameter of the wafer, so that the positioning mark is arranged on the substrate between an edge of the wafer and an inner wall of the fixing ring.

[0009] Optionally, the detection unit includes: an alarm, which is used to alarm when one or more of the following conditions are met:

[0010] When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range;

[0011] When the offset is greater than or equal to a preset offset threshold.

[0012] Optionally, the detection unit includes: a transmitter that emits a detection signal to a preset range of the substrate, the angle between the detection signal and the normal of the positioning mark being greater than or equal to 15 degrees.

[0013] Optionally, the shape of the positioning mark includes: one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow.

[0014] Correspondingly, an embodiment of the present invention also provides a method for detecting wafer offset, the detection device comprising: a substrate, a positioning mark, a detection unit, a collection unit, and a processing unit; the wafer has a positioning groove; the detection method comprises: the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; the collection unit obtains image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, the image information comprising: position information of the positioning groove and position information of the positioning mark; the processing unit determines the offset between the initial position of the wafer and the position of the wafer in the image information based on the image information.

[0015] Optionally, the detection unit includes: an alarm;

[0016] The step of the detection unit transmitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range includes:

[0017] When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range, the alarm device sounds an alarm;

[0018] The step of determining, by the processing unit, an offset between an initial position of the wafer and a position of the wafer in the image information according to the image information comprises:

[0019] When the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

[0020] Optionally, the detection device further includes: a fixing ring;

[0021] Before the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range, the detection method further includes:

[0022] Formulate a preset offset threshold value between the positioning mark and the positioning groove;

[0023] placing the substrate on the fixing ring;

[0024] Placing the wafer on the substrate exposed in the fixing ring, with a distance between the positioning groove of the wafer and the inner wall of the fixing ring;

[0025] The positioning mark is arranged on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring according to the preset offset threshold and the distance, and is opposite to the positioning groove of the wafer.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0027] The detection device of the embodiment of the present invention includes: a substrate, a positioning mark, a detection unit, a collection unit, and a processing unit. The detection unit detects whether the positioning groove and the positioning mark are within the preset range, thereby reducing the probability that the wafer whose positioning groove and the positioning mark are not within the preset range will flow to the wafer cutting process, reducing the probability of poor wafer cutting, and improving production efficiency. The collection unit obtains the image information of the positioning groove and the positioning mark within the preset range, and the processing unit determines the offset between the initial position of the wafer and the position of the wafer in the image information based on the image information, thereby reducing the probability that the wafer whose position offset on the substrate is greater than or equal to the preset offset threshold will flow to the wafer cutting process, reducing the probability of poor wafer cutting, and also improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0029] Figures 1 to 3 is a schematic structural diagram of a wafer offset detection device according to an embodiment of the present invention;

[0030] Figure 4 It is a flow chart of a detection method corresponding to the wafer offset detection device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] As known from the background technology, there is a problem of reduced production efficiency during the wafer cutting process. The reasons for the reduced production efficiency are analyzed below by taking a thinned wafer as an example.

[0033] The wafer includes a wafer body and a thinning ring surrounding the wafer body.

[0034] A wafer cutting device comprises: a wafer base, a first cutting component, a second cutting component and a cutting blade.

[0035] The first cutting component is used for performing a first cutting, and the second cutting component is used for performing a second cutting.

[0036] The wafer base is used to support the wafer when cutting the wafer, and is also used to align with the cutting equipment to cut the wafer.

[0037] Before wafer cutting, the wafer is placed on the wafer base.

[0038] The wafer base is aligned with the first cutting component, and the thinning ring is cut once to remove the thinning ring.

[0039] The wafer base is aligned with the second cutting component, and the wafer body is cut twice to cut the wafer body into a plurality of individual chips.

[0040] However, during the transportation process, the wafer base carrying the wafer may be subject to actions such as collision, sliding, falling, and stacking, which may cause the wafer to shift in position on the wafer base. When the wafer base is aligned with the first cutting component and the second cutting component, the risk of the cutting blade deviating from the cutting path on the wafer is increased, thereby reducing production efficiency.

[0041] According to the above problems, before the wafer is cut once or twice, it is necessary to manually visually inspect whether the wafer is offset relative to the wafer base. This has the following problems: First, the position offset of each wafer on the wafer base is manually visually inspected, which reduces production efficiency. Second, there are cases of false detection and missed detection during manual visual inspection, resulting in wafers whose position offset on the wafer base exceeds the preset offset threshold value, flowing to the wafer cutting process, resulting in poor cutting, which also reduces production efficiency.

[0042] In view of the above technical problems, an embodiment of the present invention provides a wafer offset detection device, which can improve production efficiency during the detection process.

[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the following will be combined with the embodiments of the present invention. Figures 1 to 3 , the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] refer to Figures 1 to 3 , is a schematic structural diagram of a wafer offset detection device according to an embodiment of the present invention. Figure 2 The figure is a top view of the device for detecting wafer offset.

[0045] The wafer offset detection device of this embodiment comprises: a wafer 100 having a positioning groove 102; the detection device comprises: a substrate for carrying the wafer 100; a positioning mark 106 located on the substrate; a detection unit 200 for emitting a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are located within the preset range; a collection unit 300 is arranged along a path of transmission or reflection of the detection signal through the substrate within the preset range, and is used to obtain image information of the positioning groove 102 and the positioning mark 106 within the preset range when the substrate within the preset range is detected by the detection unit 200, and the image information comprises: position information of the positioning groove 102 and position information of the positioning mark 106; a processing unit 400 is connected to the collection unit 300, and is used to determine, based on the image information, an offset between an initial position of the wafer 100 and a position of the wafer 100 in the image information.

[0046] The preset range is used to represent an area that is pre-determined to have a positioning groove (wafer notch) and a positioning mark.

[0047] As a non-limiting example, the area with the positioning grooves can be determined according to the design layout and the wafer positioning unit (also called wafer alignment unit) of each machine.

[0048] As a non-limiting example, the positioning mark can be added to the substrate by pasting, welding, vacuum adsorption, etc. after the wafer is aligned, and the area with the positioning mark can be determined according to the device for adding the positioning mark. In the embodiment of the present invention, there is no limitation on the specific implementation method of how to add the positioning mark.

[0049] In a specific embodiment, the image information of the positioning groove 102 may also include an image (such as a picture or a video) of the positioning groove 102 , for example, a top view of the positioning groove 102 .

[0050] In a specific embodiment, the image information of the positioning mark 106 may also include an image (such as a picture or a video) of the positioning mark 106 , for example, a top view of the positioning mark 106 .

[0051] The detection device of the present invention comprises: a substrate, a positioning mark 106, a detection unit 200, a collection unit 300, and a processing unit 400. The detection unit 200 detects whether the positioning groove 102 and the positioning mark 106 are located within the preset range, thereby reducing the probability that the wafer 100 whose positioning groove 102 and the positioning mark 106 are not within the preset range flows to the wafer 100 cutting process, reducing the probability of poor cutting of the wafer 100, and improving production efficiency. The collection unit 300 obtains the image information of the positioning groove 102 and the positioning mark 106 within the preset range, and the processing unit 400 determines the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information according to the image information, thereby reducing the probability that the wafer 100 whose position offset on the substrate is greater than or equal to the preset offset threshold flows to the wafer 100 cutting process, reducing the probability of poor cutting of the wafer 100, and also improving production efficiency.

[0052] Continue to refer Figure 1 and Figure 2 , the wafer 100 has a positioning groove 102 .

[0053] In this embodiment, the positioning groove 102 has the following functions:

[0054] First, it is used to indicate the crystal orientation of the wafer 100. Different crystal orientations will affect the electrical properties of the semiconductor, and the positioning groove 102 can quickly identify the crystal orientation of the wafer 100 during the process to ensure correct processing.

[0055] Second, cutting positioning: Before the wafer 100 is cut into individual chips, the positioning groove 102 is used to position the cutting blade.

[0056] Third, quality control: When inspecting the appearance of the wafer 100 , the positioning grooves 102 can be used to check whether the wafer 100 is correctly placed, thereby reducing the probability of the wafer 100 being twisted or damaged.

[0057] It should be noted that the above only lists some functions of the positioning groove 102 and cannot be used as a limitation to the present invention.

[0058] The shape of the positioning groove 102 includes one or more of: V-shaped, U-shaped, arc-shaped, circular, square, elliptical, and triangular. In this embodiment, the shape of the positioning groove 102 is V-shaped.

[0059] Continue to refer Figure 1 and Figure 2 , the detection device comprises: a substrate (not shown).

[0060] The substrate is used to support the wafer 100 .

[0061] The types of substrates include: plastic substrates, glass substrates, and metal substrates.

[0062] A base film 104 is provided on the substrate, and the base film 104 is used to fix the wafer 100 on the substrate. During the wafer 100 cutting process, the base film 104 is used to reduce the probability of the wafer 100 moving relative to the substrate, thereby reducing the risk of the cutting knife deviating from the cutting path during the cutting process, improving the cutting yield of the wafer 100, and correspondingly improving the production efficiency.

[0063] The material of the base film 104 includes: one or more of polyester film, ultraviolet light curing film, heat curing film, polyimide tape, etc. The material of the base film 104 has ultraviolet light curing properties.

[0064] In this embodiment, the substrate is a plastic substrate, and the base film 104 is made of a polyester film. The base film 104 is bonded to the substrate by bonding, and the substrate and the base film 104 have a certain degree of transparency.

[0065] Continue to refer Figure 1 and Figure 2 The detection device includes: a positioning mark 106 and a fixing ring 108.

[0066] The positioning mark 106 is located on the substrate.

[0067] Setting the positioning mark 106 has the following beneficial effects:

[0068] First, the offset of the wafer 100 on the base film 104 is detected.

[0069] The positioning mark 106 cooperates with the positioning groove 102 to detect the offset of the wafer 100 on the base film 104, preventing the wafer 100 from flowing to the cutting process when the offset is greater than or equal to a preset offset threshold, thereby improving production efficiency.

[0070] Second, the manufacturing information of the wafer 100 is identified.

[0071] The positioning mark 106 may be provided with a pattern, such as a QR code and numbers; the QR code is used for a machine to read information of the wafer 100, such as the production date and production batch of the wafer 100; the numbers are used for human eyes to identify the information of the wafer 100.

[0072] Third, it serves as a reference mark for the cutting alignment of the wafer 100 .

[0073] The thinned wafer 100 includes: a thinned wafer 100 body and a thinning ring surrounding the thinned wafer 100 body, the positioning groove 102 is located on the thinning ring, and after the thinning ring is removed, when the thinned wafer 100 body is cut into multiple single chips, the positioning mark 106 can be used to position the cutting knife to the cutting line position on the wafer 100 body, thereby improving the cutting yield of the wafer 100.

[0074] In this embodiment, the positioning mark 106 is independently provided with the base film 104, and the positioning mark 106 is placed on the base film 104 by, for example, attaching. In other embodiments, the positioning mark 106 can be integrally formed with the base film 104, omitting the process of attaching the positioning mark 106, thereby improving production efficiency. For example, a region is selected on the base film 104 as the positioning mark 106, and the material properties of the region are different from those of other regions of the base film 104, for example, different transparency and reflectivity.

[0075] The fixing ring 108 is used to fix the substrate carrying the wafer 100 . The inner diameter of the fixing ring 108 is larger than the diameter of the wafer 100 , so that the positioning mark 106 is set on the substrate between the edge of the wafer 100 and the inner wall of the fixing ring 108 .

[0076] The shape of the positioning mark 106 includes: one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow. In this embodiment, the shape of the positioning mark 106 is a rectangle.

[0077] The material of the positioning mark 106 includes: one or more of resin, paper, and metal foil. In this embodiment, the material of the positioning mark 106 is paper.

[0078] In this embodiment, the positioning mark 106 is attached to the base film 104 on the substrate manually or by a positioning mark 106 attaching device; the positioning mark 106 is located on the base film 104 on the substrate between the edge of the wafer 100 and the inner wall of the fixing ring 108, and at this time, the position of the wafer 100 relative to the positioning mark 106 is the initial position of the wafer 100.

[0079] It should be noted that there may be three states between the positioning mark 106 and the positioning groove 102:

[0080] The first state: the positioning mark 106 is not completely opposite to the positioning groove 102 , for example, the extension line or the reverse extension line of the positioning groove 102 (such as the center line EL mentioned below) does not pass through any point on the positioning mark 106 .

[0081] The second state: the positioning mark 106 is partially opposite to the positioning groove 102 , for example, an extension line or a reverse extension line (such as the center line EL mentioned below) of the positioning groove 102 passes through one or more points on the positioning mark 106 .

[0082] The third state: the positioning mark 106 and the positioning groove 102 are completely opposite to each other, for example, the extension line or the reverse extension line of the positioning groove 102 (such as the center line EL mentioned below) passes through the center of the positioning mark.

[0083] It can be understood that when the positioning mark 106 and the positioning groove 102 are completely opposite to each other, the offset is zero, which is an ideal state.

[0084] In this embodiment, the positioning mark 106 is in the shape of a rectangle ABCD, and the positioning grooves 102 form a triangle EFG.

[0085] In this embodiment, the positioning mark 106 and the positioning groove 102 are completely opposite, that is, a distance is set between the positioning mark 106 and the positioning groove 102, and the center line EL of the positioning groove 102 and the center line MN of the positioning mark 106 are located on the same straight line, or the offset of the center line EL relative to the center line MN is less than the preset offset threshold. In other embodiments, the center line EL of the positioning groove 102 and the center line MN of the positioning mark 106 can be set to a certain angle.

[0086] The orientation of the positioning groove 102 is toward or away from the center of the wafer. In this embodiment, the orientation of the positioning groove 102 is toward the center of the wafer.

[0087] The distance between the positioning mark 106 and the positioning groove 102, that is, the distance between the point L on the side EG of the triangle EFG of the positioning groove 102 and the point M on the positioning mark 106, the value of the distance can be set according to actual needs. In other embodiments, the distance between the positioning mark 106 and the positioning groove 102 can be selected, for example, the distance between point A and point E. Those skilled in the art can make a selection according to actual needs, and the present invention is not limited thereto.

[0088] The material of the fixing ring 108 includes: metal material (such as stainless steel, aluminum, etc.) or anti-static plastic material (such as polycarbonate, electro-propylene, acrylic, etc.); in this embodiment, the material of the fixing ring 108 is metal stainless steel.

[0089] Continue to refer Figure 1 and Figure 2 The detection device comprises: a detection unit 200.

[0090] The detection unit 200 is used to transmit a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0091] The preset range of the substrate is a range that at least includes the positioning mark 106 and the positioning groove 102. In this embodiment, the shape of the preset range is set to a quadrilateral RPQS, and the positioning mark 106 and the positioning groove 102 are located within the range of the quadrilateral RPQS. In other embodiments, the shape of the preset range also includes: triangle, circle, ellipse, polygon, irregular shape, etc.

[0092] It should be noted that the preset range is larger than the range enclosed by the positioning mark 106 and the positioning groove 102. The preset range may also include the base film 104. There are differences in the reflectivity or absorption rate of the detection signal emitted by the detection unit 200 among the base film 104, the positioning mark 106 and the positioning groove 102, which facilitates the detection unit 200 to detect whether the positioning groove 102 and the positioning mark 106 are within the preset range.

[0093] The detection unit 200 is used to transmit a detection signal to a preset range of the substrate.

[0094] In this embodiment, the detection unit 200 includes a transmitter (not shown), a light scattering detector (not shown), an alarm (not shown), a graphics processor (not shown), and an image comparator (not shown).

[0095] The detection unit 200 transmits a detection signal to a preset range of the substrate through the transmitter.

[0096] The detection signal that can be emitted by the transmitter includes: optical signal, infrared, microwave, X-ray, etc. In this embodiment, a light source is provided in the transmitter, and the detection signal emitted by the transmitter through the light source is an optical signal.

[0097] It should be noted that, in order to facilitate the collection unit 300 in the detection device to collect the signal after the detection signal is reflected by the base film 104, the positioning groove 102, and the positioning mark 106 within the preset range of the substrate, the detection signal emitted by the transmitter to the preset range of the substrate has an angle greater than or equal to 15 degrees with the normal of the positioning mark 106.

[0098] In this embodiment, a light signal is emitted to a preset range of the substrate by a light source, and the light scattering detector detects the scattered light signal after the light signal is scattered by the positioning mark 106, the positioning groove 102, and the base film 104 within the preset range to determine whether the positioning groove 102 and the positioning mark 106 are within the preset range.

[0099] The alarm is used to alarm when the detection unit 200 detects that the positioning groove 102 and / or the positioning mark 106 are not within the preset range.

[0100] In this embodiment, if the positioning slot 102 is not within the preset range, the alarm will sound.

[0101] In this embodiment, if the positioning mark 106 is not within the preset range, the alarm will sound an alarm.

[0102] In this embodiment, if the positioning groove 102 and the positioning mark 106 are both outside the preset range, the alarm will sound.

[0103] The alarm device can be used to screen out the positioning grooves 102 and / or the positioning marks 106 that are not within the preset range, thereby preventing them from flowing into the wafer 100 cutting process, thereby improving the cutting yield and the production efficiency.

[0104] It should be noted that, in this embodiment, the positioning groove 102 is not within the preset range, which means that the entire graphic or part of the graphic of the positioning groove 102 is not within the preset range; the positioning mark 106 is not within the preset range, which means that the entire graphic or part of the graphic of the positioning mark 106 is not within the preset range.

[0105] In this embodiment, the principle of the detection unit 200 detecting whether the positioning groove 102 and the positioning mark 106 are within a preset range is as follows:

[0106] The image comparator stores the image within the preset range to form a stored image, and the stored image at least includes: the positioning groove 102 and the positioning mark 106 .

[0107] The light source emits a light signal to a preset range of the substrate.

[0108] The light scattering detector receives a reflection signal of the light signal after the light signal is reflected by an object within the preset range, and transmits the reflection signal to a graphics processor for processing to form a scattered object image.

[0109] The image comparator compares the scattered object image with the stored image, and the comparison result includes the following situations:

[0110] If the scattered object image includes the positioning groove 102 and the positioning mark 106 in the stored image, then the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0111] If the scattered image only includes: the positioning groove 102, or the positioning mark 106, or a part of the positioning groove 102, or a part of the positioning mark 106, the alarm will sound to prevent the wafer 100 whose positioning groove 102 and / or the positioning mark 106 is not within the preset range from flowing to the cutting process, thereby improving the cutting yield and the production efficiency.

[0112] Continue to refer Figure 1 and Figure 2 The detection device includes: a collection unit 300.

[0113] The acquisition unit 300 is arranged along the path where the detection signal is transmitted or reflected by the substrate within the preset range, and is used to obtain image information of the positioning groove 102 and the positioning mark 106 within the preset range when the substrate within the preset range is detected by the detection unit 200, and the image information includes: position information of the positioning groove 102 and position information of the positioning mark 106.

[0114] In some embodiments, the detection unit 200 and the collection unit 300 are located on the same side of the substrate-carrying wafer 100 , and the collection unit 300 is disposed along a path where the detection signal is reflected by the substrate within the preset range.

[0115] It should be noted that the same side includes: a side of the substrate carrying the wafer 100, or a side facing away from the substrate carrying the wafer 100. The substrate reflection includes: a reflection of the base film 104 on the substrate.

[0116] In other embodiments, the detection unit 200 and the collection unit 300 are located on opposite sides of the substrate, and the collection unit 300 is located on the side of the substrate carrying the wafer 100, the detection unit 200 is located on the side facing away from the substrate carrying the wafer 100, and the collection unit 300 is arranged along the path of the detection signal transmitted through the substrate within the preset range.

[0117] In other embodiments, the detection unit 200 and the collection unit 300 are located on opposite sides of the substrate, and the detection unit 200 is located on the side of the substrate carrying the wafer 100, and the collection unit 300 is located on the side facing away from the substrate carrying the wafer 100, and the collection unit 300 is arranged along the path of the detection signal transmitted through the substrate within the preset range.

[0118] In this embodiment, the detection unit 200 and the collection unit 300 are located on the same side of the substrate-carrying wafer 100, and the same side is one side of the substrate-carrying wafer 100. The collection unit 300 is arranged along the path where the detection signal is reflected by the substrate within the preset range.

[0119] The acquisition unit 300 includes a receiver (not shown), a graphic generator (not shown), a display 301, and a position detector (not shown).

[0120] The working principle of the acquisition unit 300 is as follows:

[0121] The receiver receives the detection signal emitted by the transmitter of the detection unit 200 to a preset range of the substrate, and the reflected signal after being reflected by the base film 104, the positioning groove 102, and the positioning mark 106 within the preset range.

[0122] The graphic generator clearly displays a graphic within a preset range on the display 301 according to the reflection signal, wherein the graphic at least includes the base film 104 , the positioning groove 102 , the positioning mark 106 , and the boundary of the preset range.

[0123] refer to Figure 3In order to make the drawings concise and clear, the display 301 only displays the graphics of the positioning mark 106 and the positioning groove 102, and the graphics of the positioning mark 106 and the positioning groove 102 are enlarged, but the present invention is not limited thereto.

[0124] In this embodiment, four points are used as an example to obtain the position information of the positioning mark 106, and three points are used as an example to obtain the position information of the positioning groove 102. The point A1 corresponds to the point A, the point B1 corresponds to the point B, the point C1 corresponds to the point C, the point D1 corresponds to the point D, the point E1 corresponds to the point E, the point F1 corresponds to the point F, and the point G1 corresponds to the point G. The positional relationship between the rectangle A1B1C1D1 and the triangle E1F1G1 reflects the positional relationship between the rectangle ABCD and the triangle EFG.

[0125] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and respectively tests the coordinates B1 (X2, Y2) of point B1 of the positioning mark 106, the coordinates C1 (X3, Y3) of point C1, and the coordinates D1 (X4, Y4) of point D1.

[0126] In this embodiment, the position detector takes the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as the reference point, and also tests the coordinates E1 (X5, Y5) of point E1, the coordinates F1 (X6, Y6) of point F1, and the coordinates G1 (X7, Y7) of point G1 on the positioning groove 102 respectively.

[0127] It should be noted that the number of reference points and coordinate points for obtaining the position information of the positioning mark 106 and the positioning groove 102 can be selected according to actual needs, and the present invention is not limited thereto.

[0128] Continue to refer Figure 1 and Figure 2 , the detection device comprises: a processing unit 400.

[0129] The processing unit 400 is connected to the acquisition unit 300 and is used to determine, based on the image information, an offset between an initial position of the wafer 100 and a position of the wafer 100 in the image information.

[0130] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is determined by the deviation between the position of the positioning mark 106 in the image information and the position of the positioning groove 102 in the image information.

[0131] Specifically, the initial position of the wafer 100 is determined by the position information of the positioning mark 106 in the image information, because the positioning mark 106 is attached to the base film 104 on the substrate, and the position of the positioning mark 106 on the base film 104 is not easy to change. The position information of the positioning groove 102 in the image information is used to reflect the position of the wafer 100 in the image information, because the positioning groove 102 is located on the wafer 100. When the position of the wafer 100 on the base film 104 shifts, the positioning groove 102 will also shift with the wafer 100 by a corresponding distance.

[0132] In this embodiment, the wafer 100 is located on the base film 104 of the substrate. During the processing and / or transportation of the wafer 100 , there is a probability that the wafer 100 moves on the base film 104 , thereby causing the initial position of the wafer 100 to shift.

[0133] In this embodiment, the processing unit 400 is connected to the collection unit 300 via an optical fiber to achieve rapid data transmission.

[0134] In this embodiment, the processing unit 400 includes a data processor and a memory.

[0135] The data processor is used to process the image information collected by the collection unit 300; the memory is used to store data during the data processing to prevent data loss.

[0136] refer to Figure 3 The acquisition unit 300 transmits the acquired image information, such as the coordinates of point A1, point B1, point C1, point D1, point E1, point F1, and point G1, to the data processor of the processing unit 400. The data processor calculates the midpoint coordinates M1 (X8, Y8) of the A1B1 side and the midpoint coordinates N1 (X9, Y9) of the C1D1 side of the positioning mark 106 according to the coordinates of point A1, point B1, point C1, and point D1, and then calculates the slope K1 of the straight line M1N1.

[0137] The data processor calculates the midpoint coordinates L1 (X10, Y10) of the F1G1 side of the positioning groove 102 according to the coordinates of points E1, F1 and G1, and then calculates the slope K2 of the straight line E1L1.

[0138] The data processor calculates the offset distance of the wafer 100 relative to the positioning mark 106 along the straight line M1N1 according to the midpoint coordinates M1 (X8, Y8) and L1 (X10, Y10).

[0139] The data processor calculates the offset angle of the straight line E1L1 relative to the straight line M1N1 based on the straight line M1N1.

[0140] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is the offset distance and the offset angle.

[0141] In this embodiment, the alarm device sounds an alarm when the offset is greater than or equal to a preset offset threshold value. The preset offset threshold value is the limit of the offset distance and the offset angle meeting the process manufacturing standard of the wafer 100.

[0142] In this embodiment, for the wafer 100 whose offset is greater than or equal to the preset offset threshold, the following two schemes are performed:

[0143] The first solution is to rework the wafer 100 with an offset greater than or equal to a preset offset threshold according to the process manufacturing standard and then place it back on the base film 104, thereby improving the cutting efficiency of the wafer 100 and improving the production efficiency.

[0144] The second solution is to feed back the offset, i.e., the offset distance and the offset angle, to a cutting device. The cutting device responds to a detection device for detecting the wafer offset. The cutting device automatically adjusts cutting parameters according to the offset so as to cut the wafer 100 whose offset is greater than or equal to a preset offset threshold value. There is no need to rework the wafer 100, which not only improves the cutting yield but also improves the production efficiency.

[0145] In order to solve the technical problem, accordingly, an embodiment of the present invention further provides a method for detecting wafer offset, which is applied to a device for detecting wafer offset. Figure 4 It is a flow chart of a detection method corresponding to the wafer offset detection device according to an embodiment of the present invention.

[0146] refer to Figure 4 , combined with Figure 1 , Figure 2 and Figure 3 The detection device includes: a substrate, a positioning mark 106 , a detection unit 200 , a collection unit 300 , a processing unit 400 , and a fixing ring 108 .

[0147] It should be noted that, before the detection unit 200 transmits a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are within the preset range, the detection method also includes: formulating a preset offset threshold value for the offset of the positioning mark 106 and the positioning groove 102; placing the substrate on the fixing ring 108; placing the wafer 100 on the substrate exposed in the fixing ring 108, and a distance is set between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108; the positioning mark 106 is set on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 according to the preset offset threshold value and the distance, and is opposite to the positioning groove 102 of the wafer 100.

[0148] The detection method mainly comprises the following steps:

[0149] Step S11: formulating a preset offset threshold value between the positioning mark and the positioning groove.

[0150] According to the process production requirements, a preset offset threshold value of the offset between the positioning mark 106 and the positioning groove 102 is formulated. In this embodiment, the preset offset threshold value of the offset between the positioning mark 106 and the positioning groove 102 is formulated, including: a preset offset distance and a preset offset angle. The preset offset distance and the preset offset angle refer to the description of the wafer offset detection device in the previous embodiment, and will not be repeated here.

[0151] In this embodiment, the preset offset distance is ±0.5 mm, and the preset offset angle is ±1 degree.

[0152] Step S12: placing the substrate on the fixing ring.

[0153] The method of placing the substrate on the fixing ring 108 includes: one or more of bolts, vacuum adsorption, and glue bonding. In this embodiment, the substrate is placed on the fixing ring 108 by glue bonding.

[0154] A base film 104 is bonded to the substrate, and the base film 104 is used to bond the wafer 100 .

[0155] The base film 104 for bonding the wafer 100 is exposed in the fixing ring 108 .

[0156] Step S13: placing the wafer on the substrate.

[0157] In this embodiment, the wafer 100 is placed on the substrate exposed in the fixing ring 108 , that is, the wafer 100 is attached to the base film 104 on the substrate exposed in the fixing ring 108 .

[0158] In this embodiment, the wafer 100 is attached to the base film 104 on the substrate exposed in the fixing ring 108 by aligning the center of the wafer 100 with the center of the inner ring of the fixing ring 108 through a wafer attaching device. In other embodiments, the wafer 100 is attached to the base film 104 on the substrate exposed in the fixing ring 108 by manual attaching.

[0159] A distance is set between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 to reserve space for attaching the positioning mark 106 between the positioning groove 102 and the inner wall of the fixing ring 108 later.

[0160] In this embodiment, the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 is equal. In other embodiments, the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 may not be equal. Those skilled in the art may set the distance between the edge of the wafer 100 and the inner wall of the fixing ring 108 according to actual needs.

[0161] Step S14: setting the positioning mark on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring.

[0162] The positioning mark 106 is disposed on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 according to the preset offset threshold and the distance, and is opposite to the positioning groove 102 of the wafer 100 .

[0163] In this embodiment, according to the preset offset threshold and the distance, with the positioning groove 102 as a reference, the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108 through the positioning mark 106 attaching device, and the positioning mark 106 and the positioning groove 102 are all arranged opposite to each other.

[0164] In this embodiment, information corresponding to the wafer 100 is printed on the positioning mark 106. For example, a two-dimensional code and numbers are printed on the positioning mark 106; the two-dimensional code is used for a machine to read the information of the wafer 100, such as the production date and production batch of the wafer 100; the numbers are used for the naked eye to recognize the information of the wafer 100.

[0165] In this embodiment, after the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108, the offset between the positioning mark 106 and the positioning groove 102 is detected, for example, with the help of a caliper.

[0166] Step S15: the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range.

[0167] The preset range of the substrate at least includes the range of the positioning mark 106 and the positioning groove 102. In this embodiment, the shape of the preset range is set to a quadrilateral RPQS, and the positioning mark 106 and the positioning groove 102 are located within the range of the quadrilateral RPQS.

[0168] The detection unit 200 transmits a detection signal to a preset range of the substrate to detect whether the positioning groove 102 and the positioning mark 106 are within the preset range, including: when the detection unit 200 detects that the positioning groove 102 and / or the positioning mark 106 are not within the preset range, the alarm sounds an alarm.

[0169] In this embodiment, the detection unit 200 includes a transmitter, a light scattering detector, an alarm, a graphics processor, and an image comparator. The transmitter includes: a light source.

[0170] In this embodiment, the step of the detection unit 200 detecting whether the positioning groove 102 and the positioning mark 106 are located within the preset range mainly includes:

[0171] The image comparator stores the image within the preset range to form a stored image, and the stored image at least includes: a positioning groove 102 and a positioning mark 106 .

[0172] The light source emits a light signal to a preset range of the substrate.

[0173] The light scattering detector receives a reflection signal of the light signal after the light signal is reflected by an object within the preset range, and transmits the reflection signal to a graphics processor for processing to form a scattered object image.

[0174] The image comparator compares the scattered object image with the stored image, and the comparison result includes the following situations:

[0175] If the scattered object image includes the positioning groove 102 and the positioning mark 106 in the stored image, then the positioning groove 102 and the positioning mark 106 are located within the preset range.

[0176] If the scattered image only includes: the positioning groove 102, or the positioning mark 106, or a part of the positioning groove 102, or a part of the positioning mark 106, the alarm will sound to prevent the wafer 100 whose position offset on the substrate is greater than or equal to the preset offset threshold from flowing to the cutting process, thereby improving the cutting yield and also improving the production efficiency.

[0177] Step S16: When the substrate within the preset range is detected by the detection unit, the acquisition unit obtains image information of the positioning groove and the positioning mark within the preset range, wherein the image information includes: position information of the positioning groove and position information of the positioning mark.

[0178] The acquisition unit 300 includes a receiver, a graphic generator, a display 301 and a position detector.

[0179] The step of the acquisition unit 300 acquiring the image information of the positioning groove 102 and the positioning mark 106 within the preset range mainly includes:

[0180] The receiver receives the detection signal emitted by the transmitter of the detection unit 200 to the preset range of the substrate, and the reflection signal after being reflected by the base film 104, the positioning groove 102, and the positioning mark 106 within the preset range.

[0181] The graphic generator clearly displays a graphic within a preset range on the display 301 according to the reflected signal, wherein the graphic at least includes the base film 104 , the positioning groove 102 , the positioning mark 106 , and the boundary of the preset range.

[0182] In this embodiment, the position information of the positioning mark 106 is obtained by taking 4 points as an example, and the position information of the positioning groove 102 is obtained by taking 3 points as an example. The point A1 corresponds to the point A, the point B1 corresponds to the point B, the point C1 corresponds to the point C, the point D1 corresponds to the point D, the point E1 corresponds to the point E, the point F1 corresponds to the point F, and the point G1 corresponds to the point G. The positional relationship between the rectangle A1B1C1D1 and the triangle E1F1G1 reflects the positional relationship between the rectangle ABCD and the triangle EFG, and also reflects the positional relationship between the initial position of the wafer 100 and the position of the wafer 100 in the image information.

[0183] In this embodiment, the position detector uses the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as a reference point, and respectively tests the coordinates B1 (X2, Y2) of point B1 of the positioning mark 106, the coordinates C1 (X3, Y3) of point C1, and the coordinates D1 (X4, Y4) of point D1.

[0184] In this embodiment, the position detector takes the coordinates A1 (X1, Y1) of point A1 of the positioning mark 106 on the display 301 as the reference point, and also tests the coordinates E1 (X5, Y5) of point E1, the coordinates F1 (X6, Y6) of point F1, and the coordinates G1 (X7, Y7) of point G1 on the positioning groove 102 respectively.

[0185] It should be noted that the points and the number of points for obtaining the position information of the positioning mark 106 and the positioning groove 102 can be selected according to actual needs, and the present invention is not limited thereto.

[0186] Step S17: The processing unit determines the offset between the initial position of the wafer and the position of the wafer in the image information according to the image information.

[0187] In this embodiment, the processing unit 400 includes a data processor and a memory.

[0188] The processing unit 400 determines the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information according to the image information, including: when the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

[0189] refer to Figure 3 The acquisition unit 300 transmits the acquired image information, such as the coordinates of point A1, point B1, point C1, point D1, point E1, point F1, and point G1, to the data processor of the processing unit 400. The data processor calculates the midpoint coordinates M1 (X8, Y8) of the A1B1 side and the midpoint coordinates N1 (X9, Y9) of the C1D1 side of the positioning mark 106 according to the coordinates of point A1, point B1, point C1, and point D1, and then calculates the slope K1 of the straight line M1N1.

[0190] The data processor calculates the midpoint coordinates L1 (X10, Y10) of the F1G1 side of the positioning groove 102 according to the coordinates of points E1, F1 and G1, and then calculates the slope K2 of the straight line E1L1.

[0191] The data processor calculates the offset distance of the wafer 100 relative to the positioning mark 106 along the straight line M1M1 according to the midpoint coordinates M1 (X8, Y8) and L1 (X10, Y10).

[0192] The data processor calculates the offset angle of the straight line E1L1 relative to the straight line M1N1 based on the straight line M1N1.

[0193] In this embodiment, the offset between the initial position of the wafer 100 and the position of the wafer 100 in the image information is the offset distance and the offset angle.

[0194] In this embodiment, the alarm sounds an alarm when the offset is greater than or equal to a preset offset threshold. The preset offset threshold is the offset distance and the offset angle that meet the limit standard of the process manufacturing of the wafer 100.

[0195] In this embodiment, for the wafer 100 whose offset is greater than or equal to the preset offset threshold, the following two schemes are performed:

[0196] The first solution is to rework the wafer 100 whose offset is greater than or equal to the preset offset threshold according to the manufacturing standard, and place the wafer 100 back on the base film 104, thereby improving the cutting efficiency of the wafer 100 and improving the production efficiency.

[0197] The second solution is to feed back the offset, i.e., the offset distance and the offset angle, to a cutting device. The cutting device responds to a detection device for detecting the wafer offset. The cutting device automatically adjusts cutting parameters according to the offset so as to cut the wafer 100 whose offset is greater than or equal to a preset offset threshold value. There is no need to rework the wafer 100, which not only improves the cutting yield but also improves the production efficiency.

[0198] In this embodiment, for example, the offset distance of the wafer 100 in the direction away from the positioning mark 106 is 1 mm, and the offset angle of the straight line E1L1 relative to the straight line M1N1 in the counterclockwise direction is 1 degree. The cutting equipment automatically adjusts the offset distance of the cutting knife in the direction away from the positioning mark 106 by 1 mm according to the offset, and adjusts the offset angle in the counterclockwise direction by 1 degree, so that the cutting knife coincides with the cutting path on the wafer 100, so as to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold.

[0199] It should be noted that, in step S14 of other embodiments, after the positioning mark 106 is attached to the base film 104 on the substrate exposed between the positioning groove 102 of the wafer 100 and the inner wall of the fixing ring 108, there is no need to detect the offset between the positioning mark 106 and the positioning groove 102, and steps S15, S16, and S17 are directly executed. In step S17, the offset is directly fed back to the cutting equipment, and the cutting equipment automatically adjusts the cutting parameters according to the offset to cut the wafer 100 whose offset is greater than or equal to the preset offset threshold, without the need to rework the wafer 100, thereby further improving production efficiency.

[0200] It should be pointed out that for other relevant descriptions in the detection method, reference can be made to the corresponding description in the wafer offset detection device in the aforementioned embodiment, which will not be repeated here.

[0201] It should be understood that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article indicates that the associated objects before and after are in an "or" relationship.

[0202] The "plurality" appearing in the embodiments of the present application refers to two or more.

[0203] The first, second, etc. descriptions appearing in the embodiments of the present application are only used for illustration and distinction of the description objects. There is no order, nor do they indicate any special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation on the embodiments of the present application.

[0204] It should be pointed out that the serial numbers of the steps in this embodiment do not limit the execution order of the steps.

[0205] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A wafer deviation detection device, characterized in that: The wafer has a positioning groove; The detection device comprises: A substrate, used for supporting the wafer; A positioning mark, located on the substrate; A detection unit, used for transmitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; A collection unit is provided along a path through which the detection signal is transmitted or reflected by the substrate within the preset range, and is used to obtain image information of the positioning groove and the positioning mark within the preset range when the substrate within the preset range is detected by the detection unit, wherein the image information includes: position information of the positioning groove and position information of the positioning mark; A processing unit is connected to the acquisition unit and is used to determine, based on the image information, an offset between an initial position of the wafer and a position of the wafer in the image information.

2. The detection device according to claim 1, characterized in that The detection unit and the collection unit are located on the same side of the substrate carrying the wafer.

3. The detection device according to claim 1, characterized in that: The detection unit and the collection unit are located on opposite sides of the substrate, and the collection unit is located on the side of the substrate carrying the wafer, and the detection unit is located on the side facing away from the substrate carrying the wafer.

4. The detection device according to claim 1, characterized in that: The detection device also includes: a fixing ring for fixing the substrate carrying the wafer, the inner diameter of the fixing ring is larger than the diameter of the wafer, so that the positioning mark is set on the substrate between the edge of the wafer and the inner wall of the fixing ring.

5. The detection device according to claim 1, characterized in that: The detection unit includes an alarm configured to alarm when one or more of the following conditions are met: When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range; When the offset is greater than or equal to a preset offset threshold.

6. The detection device according to claim 1, characterized in that: The detection unit includes: a transmitter, which transmits a detection signal to a preset range of the substrate, and the angle between the detection signal and the normal of the positioning mark is greater than or equal to 15 degrees.

7. The detection device according to claim 1, characterized in that: The shape of the positioning mark includes: one or more of a circle, a square, an ellipse, a triangle, a polygon, and an arrow.

8. A wafer shift detection method, applied to a wafer shift detection device, characterized in that: The detection device comprises: Substrate, positioning mark, detection unit, collection unit, processing unit; The wafer has a positioning groove; The detection method comprises: The detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range; When the substrate within the preset range is detected by the detection unit, the acquisition unit acquires image information of the positioning groove and the positioning mark within the preset range, wherein the image information includes: position information of the positioning groove and position information of the positioning mark; The processing unit determines, according to the image information, an offset between an initial position of the wafer and a position of the wafer in the image information.

9. The detection method according to claim 8, characterized in that: The detection unit includes: an alarm; The step of the detection unit transmitting a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range includes: When the detection unit detects that the positioning groove and / or the positioning mark is not within the preset range, the alarm device sounds an alarm; The step of determining, by the processing unit, an offset between an initial position of the wafer and a position of the wafer in the image information according to the image information comprises: When the offset is greater than or equal to a preset offset threshold, the alarm sounds an alarm.

10. The detection method according to claim 8, characterized in that: The detection device further includes: a fixing ring; Before the detection unit transmits a detection signal to a preset range of the substrate to detect whether the positioning groove and the positioning mark are located within the preset range, the detection method further includes: Formulate a preset offset threshold value between the positioning mark and the positioning groove; placing the substrate on the fixing ring; Placing the wafer on the substrate exposed in the fixing ring, with a distance between the positioning groove of the wafer and the inner wall of the fixing ring; The positioning mark is arranged on the substrate exposed between the wafer positioning groove and the inner wall of the fixing ring according to the preset offset threshold and the distance, and is opposite to the positioning groove of the wafer.

Images