Adjusting mechanism of wafer air floating rotary table and wafer processing equipment
By using mechanical parts instead of motor drive in the wafer air-floating rotary table, the height adjustment is achieved manually, which solves the problems of high cost and complex installation in the prior art, and achieves accurate and economical height adjustment.
Patent Information
- Application Number
- CN202411928607.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-03-25
AI Technical Summary
In the prior art, the height adjustment frequency of the wafer air float turntable is low, resulting in high equipment costs, and motor drive requires increasing the motor driver and cable layout, which increases the installation difficulty and software development and debugging difficulty.
Mechanical parts are used instead of motor drive, and the height adjustment of the air-floating turntable is achieved through the combination of reducer, adjustment shaft, connecting rod and operating components.
It reduces equipment costs, simplifies structural installation, reduces the difficulty of software development and debugging, and realizes quantitative and precise adjustments at the micron level.
Smart Images
Figure CN119694969A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor processing, and in particular to an adjustment mechanism of a wafer air floating turntable and wafer processing equipment. Background Art
[0002] When the wafer is thinning, it is fixed on the ceramic suction cup by vacuum adsorption. The ceramic suction cup is fixed on the air-floating turntable with controllable rotation speed. The air-floating turntable is equipped with three support points, one of which is a support point with a fixed height, and the other two are floating support points that can be adjusted up and down. By fine-tuning the height of the two floating support points, the angle between the wafer and the grinding wheel axis can be indirectly adjusted. Because the adjustment amount is small, at the micron level, it is necessary to ensure that micro adjustments and high accuracy can be made.
[0003] At present, the adjustment mechanism in the existing technology often drives the connecting rod to rotate through a motor. The connecting rod nut is fixed under the support surface of the air-floating turntable. The rotation of the connecting rod can drive the air-floating turntable to move up and down slightly. By operating the upper computer to send a certain number of pulses to the motor, the number of circles of the connecting rod rotation can be accurately controlled, thereby accurately controlling the height of the air-floating turntable.
[0004] However, the height adjustment frequency of the air-floating turntable is low. If a stepper motor is used as the drive, the equipment will use a large number of stepper motors and the cost will be high. The electrical part of the equipment needs to add a motor driver and leave space for cable routing in the equipment, which increases the difficulty of installation. The software part of the equipment needs to develop an electric adjustment function, which increases the difficulty and cost of software development and debugging. Summary of the invention
[0005] The object of the present invention is to provide an adjustment mechanism for a wafer air floating turntable and a wafer processing device, which adopts mechanical parts instead of motor drive, thereby reducing equipment costs while meeting usage requirements.
[0006] To achieve this object, the present invention adopts the following technical solutions:
[0007] A wafer flotation turntable adjustment mechanism comprises: a reducer fixedly connected to an external structure; an adjustment shaft connected to the input end of the reducer; a connecting rod, one end of which is connected to the output end of the reducer, and the other end is used to connect to the flotation turntable; an operating component, which is arranged on the adjusting shaft and can rotate together with the adjusting shaft; wherein manual operation of the operating component can drive the adjusting shaft to rotate, so as to drive the connecting rod to move relative to the flotation turntable.
[0008] Preferably, it further includes a shell, which is fixedly connected to the reducer and located at the input end of the reducer, the adjusting shaft is installed on the shell, and one end extends out of the shell, and the operating component is installed on the end of the adjusting shaft extending out of the shell.
[0009] Preferably, a limit assembly is provided in the housing to limit the displacement of the adjustment shaft in the axial and radial directions.
[0010] Preferably, the limit assembly includes: a radial limit bearing, which is fixedly arranged in the housing and sleeved on the adjusting shaft, and can limit the radial displacement of the adjusting shaft; and an axial limit member, which is arranged on the adjusting shaft and can limit the axial displacement of the adjusting shaft.
[0011] Preferably, at least two radial limit bearings are provided, which are spaced apart along the axial direction of the adjusting shaft; the axial limit member includes a limit ring, which is provided on the adjusting shaft and abuts against the radial limit bearing to limit the displacement of the adjusting shaft along its axial direction, and limit the displacement of the radial limit bearing relative to the adjusting shaft along its axial direction.
[0012] Preferably, the operating assembly includes: an operating block, which is arranged in an elongated strip shape and has a through hole in the middle that can be sleeved on the adjusting shaft, and one end of the operating block is provided with a gap opened along its length direction to the through hole; a locking piece, which is arranged on the side of the operating block and is located at the end of the operating block where the gap is provided, and can lock the operating block to the adjusting shaft.
[0013] Preferably, the device further comprises: a locking member, which is arranged on the operating assembly and can lock the operating assembly to the housing.
[0014] Preferably, a plurality of graduation marks are arranged on the end surface of the shell away from the reducer, and the plurality of graduation marks are evenly distributed along the circumference of the shell.
[0015] Preferably, it further comprises an anti-dropping member, which is arranged on the adjusting shaft to prevent the operating block from falling and to position the operating block.
[0016] Another object of the present invention is to provide a wafer processing device, which does not need to develop an automatic adjustment function of the air-floating turntable in the device software, thereby reducing the difficulty of development and debugging. To achieve this object, the present invention adopts the following technical solutions:
[0017] A wafer processing device comprises a suction cup and an air-floating turntable for carrying the suction cup, wherein the suction cup is fixedly connected to the air-floating turntable, at least three supporting points are arranged on the air-floating turntable, and at least two of the supporting points use the adjustment mechanism of the wafer air-floating turntable.
[0018] Beneficial effects of the present invention:
[0019] The adjustment mechanism of the wafer air-floating turntable provided by the present invention includes a reducer, an adjustment shaft, a connecting rod and an operating assembly, wherein the reducer is fixedly connected to the external structure; the adjustment shaft is connected to the input end of the reducer; one end of the connecting rod is connected to the output end of the reducer, and the other end is connected to the air-floating turntable; the operating assembly is arranged on the adjustment shaft and can rotate together with the adjustment shaft; wherein the manual operation of the operating assembly can drive the adjustment shaft to rotate, so as to drive the connecting rod to move, thereby realizing the adjustment of the air-floating turntable. Since the height adjustment frequency of the air-floating turntable is relatively low, compared with the use of motor drive, the present invention uses mechanical parts instead of motor drive, which reduces the equipment cost while meeting the use requirements. In addition, the structure is easy to install, does not require the installation of electrical components and the laying of cables, has a small number of parts, and has a low overall cost.
[0020] The wafer processing equipment provided by the present invention comprises a suction cup and an air-floating turntable for carrying the suction cup, the suction cup is fixedly connected to the air-floating turntable, at least three supporting points are arranged on the air-floating turntable, at least two supporting points use the adjustment mechanism of the wafer air-floating turntable, so that the automatic adjustment function of the air-floating turntable does not need to be developed in the equipment software of the present invention, thereby reducing the difficulty of development and debugging. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Schematic diagram of the three-dimensional structure of the adjustment mechanism of the wafer air floating turntable in the embodiment of the present invention;
[0022] Figure 2 It is a partial cross-sectional schematic diagram of the adjustment mechanism of the wafer air floating turntable in the embodiment of the present invention.
[0023] In the figure:
[0024] 1. Reducer; 2. Adjusting shaft; 3. Connecting rod; 41. Operating block; 42. Locking piece; 5. Housing; 61. Radial limit bearing; 62. Axial limit piece; 7. Locking piece; 8. Anti-slip piece. DETAILED DESCRIPTION
[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0026] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0028] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0029] The present invention discloses a wafer processing equipment, which can be a wafer thinning equipment, and the equipment includes a suction cup and an air-floating turntable. The suction cup can be a ceramic suction cup for carrying a wafer, and the middle of the suction cup is porous ceramic. The wafer is adsorbed and fixed on the ceramic suction cup by vacuum, and the suction cup is fixedly connected to the air-floating turntable. The air-floating turntable is used to carry the suction cup and drive the wafer to rotate during the thinning grinding (using a grinding wheel to grind the surface of the wafer to reduce the thickness of the wafer). At least three support points are arranged on the air-floating turntable in the wafer processing equipment of the present invention, and at least two of the support points use an adjustment mechanism of a wafer air-floating turntable. In some embodiments, the air-floating turntable support points are set to three, and at least two of them use the adjustment mechanism of the wafer air-floating turntable as support.
[0030] Because there is a quantitative relationship between the grinding surface shape and total thickness deviation of the wafer and the angle between the grinding wheel axis and the wafer axis, by fine-tuning the angle between the grinding wheel axis and the wafer axis, the total thickness deviation of the wafer can be adjusted to within the required range while obtaining the required surface shape after grinding; and because the height adjustment frequency of the air-floating turntable is low, the cost of using motor drive in the prior art is high, so the present invention uses mechanical parts instead of motor drive, which reduces the equipment cost while meeting the use requirements. Through the adjustment mechanism of the wafer air-floating turntable, the angle of the air-floating turntable can be manually adjusted, so that the wafer axis and the grinding wheel axis can be adjusted to a suitable angle slightly and accurately before the wafer grinding process.
[0031] Specifically, the adjustment mechanism of the wafer air-floating turntable disclosed in the present invention includes a reducer 1, an adjustment shaft 2, a connecting rod 3 and an operating assembly, wherein the reducer 1 is fixedly connected to the external structure, the adjustment shaft 2 is connected to the input end of the reducer 1, one end of the connecting rod 3 is connected to the output end of the reducer 1, and the other end is connected to the air-floating turntable; the operating assembly is arranged on the adjustment shaft 2 and can rotate together with the adjustment shaft 2. Among them, the adjustment shaft 2 can be driven to rotate by manually operating the operating assembly to drive the connecting rod 3 to move relative to the air-floating turntable. It can be understood that the adjustment mechanism of the wafer air-floating turntable of the present invention rotates the adjustment shaft 2 by manually operating the operating assembly, drives the connecting rod 3 to rotate or lift relative to the air-floating turntable, and thus adjusts the angle of the air-floating turntable, so as to achieve fine-tuning of the wafer axis, thereby accurately adjusting the wafer axis and the grinding wheel axis to a suitable angle, and obtaining the required wafer grinding surface shape and higher precision. Moreover, compared with the use of motor drive adjustment in the prior art, the present invention uses mechanical parts instead of motor drive, which reduces equipment costs while meeting usage requirements. The structure is easy to install, does not require the installation of electrical components and the laying of cables, has a small number of parts, and has a low overall cost.
[0032] In some embodiments, the adjustment mechanism of the wafer air flotation turntable disclosed in the present invention further includes a shell 5, which is fixedly connected to the reducer 1 and is located at the input end of the reducer 1, and the reducer 1 is fixedly connected to the external structure through the shell 5. The adjustment shaft 2 is installed in the shell 5, and one end extends out of the shell 5, the operating component is installed at the end of the adjustment shaft 2 extending out of the shell 5, and the other end of the adjustment shaft 2 is connected to the input end of the reducer 1. It can be understood that by setting the shell 5, not only the installation structure foundation of the adjustment mechanism of the wafer air flotation turntable is provided, but also the structure set inside the shell 5 can be protected to extend the service life.
[0033] In some embodiments, a limiting assembly is provided in the housing 5, which can limit the displacement of the adjusting shaft 2 along its axial and radial directions. Specifically, the limiting assembly includes a radial limiting bearing 61 and an axial limiting member 62. The radial limiting bearing 61 is fixedly provided in the housing 5 and sleeved on the adjusting shaft 2. While realizing the rotational connection of the adjusting shaft 2 in the housing 5, the rotational friction and wear of the adjusting shaft 2 are reduced, making the rotation smoother, reducing the mechanical load friction coefficient of the adjusting shaft 2 during the rotation process, thereby reducing the rotational resistance, facilitating operation, and limiting the displacement of the adjusting shaft 2 along its radial direction; the axial limiting member 62 is provided on the adjusting shaft 2 and can limit the displacement of the adjusting shaft 2 along its axial direction. It can be understood that by providing a limiting assembly, the structural position of the adjusting shaft 2 can be ensured to be stable, making the adjustment more handy, thereby facilitating the adjustment and controlling the adjustment accuracy.
[0034] In some embodiments, a plurality of indexing marks are also provided on the end surface of the housing 5 away from the reducer 1, and the plurality of indexing marks are evenly distributed along the circumference of the housing 5, and the number of indexing marks is set according to the reduction ratio and adjustment stroke requirements of the reducer 1. For example, the indexing marks are set as indexing holes, and 20 indexing holes evenly distributed around the circumference are set below the housing 5 according to the calculation result of the reduction ratio, and quantitative and accurate adjustment can be achieved according to the number of holes that the operating component rotates during adjustment.
[0035] In some specific embodiments, at least two radial limit bearings 61 are provided, which are arranged at intervals along the axial direction of the adjusting shaft 2. The axial limit member 62 includes a limit retaining ring, the inner diameter of which is smaller than the diameter of the adjusting shaft 2, and the outer diameter of which is larger than the diameter of the adjusting shaft 2; a groove is provided on the circumference of the adjusting shaft 2, and the limit retaining ring is provided in the groove. The limit retaining ring cooperates with the housing 5 to limit the axial displacement of the adjusting shaft 2. Optionally, at least two limit retaining rings can also be provided at intervals along the axial direction of the adjusting shaft 2. When two limit retaining rings are provided, all radial limit bearings 61 are provided between the two limit retaining rings, and the limit retaining ring cooperates with the end face of the radial limit bearing 61 to limit the axial displacement of the adjusting shaft 2. Since the radial limit bearing 61 is close to the adjusting shaft 2, a retaining ring with a smaller outer diameter can be used to cooperate with the radial limit bearing 61 to limit the axial displacement of the adjusting shaft 2 while reducing friction resistance. It can be understood that the limit ring and the inner wall structure of the housing 5 cooperate to fix the position of the radial limit bearing 61 in the housing 5. For example, one end of the radial limit bearing 61 abuts against the limit ring, and the other end abuts against the limit protrusion of the housing 5. At the same time, the interlocking effect after the limit ring and the radial limit bearing 61 are installed limits the displacement of the adjustment shaft 2 along its own axial direction. In other embodiments, the limit ring on the adjustment shaft 2 can also be set at only one end, and the other end is replaced by a shaft shoulder set on the adjustment shaft 2.
[0036] In some embodiments, the operating assembly includes an operating block 41 and a locking member 42. The operating block 41 is arranged in a long strip shape, a through hole is arranged in the middle of the operating block 41, and it can be sleeved on the adjusting shaft 2. One end of the operating block 41 is provided with a gap extending to the through hole along its length direction; the locking member 42 is arranged on the side of the operating block 41 and located at the end of the operating block 41 where the gap is arranged, and the operating block 41 can be locked to the adjusting shaft 2. It can be understood that the locking member 42 clamps the operating block 41 on the adjusting shaft 2 by compressing the gap. The locking member 42 can be a locking screw, which is passed through the end of the operating block 41 where the gap is arranged. Of course, the locking member 42 can also be other types of locking clamps, which are not specifically limited here.
[0037] In some embodiments, the adjustment mechanism of the wafer air-floating turntable of the present invention further includes: a locking member 7, which is arranged on the operating assembly and can lock the operating assembly to the housing 5. It is understood that by setting the locking member 7, the operating assembly and the adjustment shaft 2 can be prevented from rotating due to accidental touch or collision, resulting in a change in the angle of the air-floating turntable. It is understood that the locking member 7 can be set as a screw, and when locked, the screw extends into the indexing hole, thereby preventing the operating block 41 from continuing to rotate.
[0038] In some embodiments, the adjustment mechanism of the wafer air flotation turntable of the present invention further includes an anti-slip member 8, which is arranged on the adjustment shaft 2 to prevent the operating assembly from being displaced along the axial direction of the adjustment shaft 2. Specifically, the anti-slip member 8 can prevent the operating block 41 of the operating assembly from falling and locate the position of the operating block 41. In some specific embodiments, the anti-slip member 8 can be configured as a locking nut, which is threadedly connected to the adjustment shaft 2 and abuts against the operating block 41. It can be understood that the provision of the anti-slip member 8 can further increase the structural stability of the operating assembly, and prevent the failure of the locking member 42 during processing, causing the operating block 41 to loosen and fall out, thereby damaging the wafer and the equipment.
[0039] The use and principle of the adjustment mechanism of the wafer air floating turntable of the present invention are roughly as follows:
[0040] The axial position of the adjusting shaft 2 is fixed by a shaft retaining ring, and the radial limit bearing 61 can be set as a deep groove ball bearing, which can ensure that the adjusting shaft 2 rotates around its axis. The reducer 1 is set as a harmonic reducer 1, and the upper end of the adjusting shaft 2 is connected to the input end of the harmonic reducer 1. The output end of the harmonic reducer 1 is connected to the connecting rod 3 through a coupling. The axial position of the connecting rod 3 is fixed and can rotate around its axis. When the adjusting shaft 2 rotates, it can drive the connecting rod 3 to rotate, so that the height of the corresponding air-floating turntable support point changes, thereby adjusting the angle between the wafer and the grinding wheel axis. In addition, in an alternative embodiment, the connecting rod 3 can also be set to be driven to rise and fall by the output end of the reducer 1, and the air-floating turntable is driven to move by the lifting of the connecting rod 3 itself. At the same time, the connection relationship between the connecting rod 3 and the air-floating turntable can also be adaptively adjusted, thereby realizing the adjustment of the angle of the air-floating turntable.
[0041] Specifically, when adjusting the angle between the wafer and the grinding wheel axis, first record the position of the indexing hole where the locking member 7 is located (it can be understood that the side of the shell 5 corresponding to each indexing hole can be marked with a serial number to facilitate identification of the position), then loosen the locking member 7 to completely separate the locking member 7 from the shell 5, and push the operating block 41 to rotate by hand. The operating block 41 is fixed to the adjustment shaft 2 through a clamping member and rotates together with the adjustment shaft 2, thereby achieving quantitative and precise adjustment according to the number of indexing holes rotated during adjustment. For example, 20 indexing holes are set below the shell 5 according to the calculation result of the reduction ratio, and are evenly distributed along the circumference. For each rotation of a indexing hole position, the connecting rod 3 at the adjustment position moves, thereby driving the air-floating turntable to rise (or fall) 1μm. The number of holes to be rotated is determined according to the distance to be adjusted. After rotating in place, the locking member 7 is locked in the corresponding indexing hole on the shell 5, and the operating block 41 is fixed to limit the rotation of the adjustment shaft 2 and maintain the stability of the angle between the wafer and the grinding wheel axis when the subsequent equipment is running.
[0042] The adjustment mechanism of the wafer air-floating turntable provided by the present invention can drive the adjustment shaft to rotate through the manual operation component to drive the connecting rod to move relative to the air-floating turntable. Since the height adjustment frequency of the air-floating turntable is relatively low, compared with the use of motor drive, the present invention uses mechanical parts instead of motor drive, which reduces the cost of equipment while meeting the use requirements. In addition, the present invention ensures the accuracy of rotation through the structural design of the parts, meets the use requirements of the equipment, and realizes quantitative and precise adjustment at the micron level through a purely mechanical structure.
[0043] The wafer processing equipment provided by the present invention does not need to develop an automatic adjustment function of the air-floating turntable in the equipment software, thereby reducing the difficulty of development and debugging. In addition, there is no need to consider electrical wiring during structural assembly, which simplifies the difficulty of development and debugging of the electrical and software parts of the equipment and reduces the cost of the equipment.
[0044] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.
Claims
1. An adjustment mechanism for a wafer air floating turntable, characterized in that: include: A reducer (1) is fixedly connected to the external structure; An adjusting shaft (2) connected to an input end of the reducer (1); A connecting rod (3), one end of which is connected to the output end of the reducer (1), and the other end of which is used to be connected to the air-floating turntable; An operating assembly, arranged on the adjusting shaft (2) and capable of rotating together with the adjusting shaft (2); Wherein, manually operating the operating assembly can drive the adjusting shaft (2) to rotate, thereby driving the connecting rod (3) to move relative to the air-floating turntable.
2. The adjustment mechanism of the wafer air floating turntable according to claim 1, characterized in that: It also comprises a shell (5), the shell (5) being fixedly connected to the reducer (1) and being located at the input end of the reducer (1), the adjusting shaft (2) being mounted on the shell (5) and having one end extending out of the shell (5), and the operating assembly being mounted on the end of the adjusting shaft (2) extending out of the shell (5).
3. The adjustment mechanism of the wafer air floating turntable according to claim 2, characterized in that: A limit assembly is arranged inside the housing (5) and is capable of limiting the displacement of the adjustment shaft (2) along its axial and radial directions.
4. The adjustment mechanism of the wafer air floating turntable according to claim 3, characterized in that: The limiting component comprises: A radial limit bearing (61) is fixedly arranged in the housing (5) and sleeved on the adjusting shaft (2), and is capable of limiting the radial displacement of the adjusting shaft (2); An axial limiting member (62) is arranged on the adjusting shaft (2) and is capable of limiting the axial displacement of the adjusting shaft (2).
5. The adjustment mechanism of the wafer air floating turntable according to claim 4, characterized in that: At least two radial limit bearings (61) are provided, and are spaced apart along the axial direction of the adjustment shaft (2); The axial limiting member (62) comprises a limiting retaining ring, which is arranged on the adjusting shaft (2) and abuts against the radial limiting bearing (61) to limit the displacement of the adjusting shaft (2) along its axial direction, and to limit the displacement of the radial limiting bearing (61) relative to the adjusting shaft (2) along its axial direction.
6. The adjustment mechanism of the wafer air floating turntable according to claim 1, characterized in that: The operating components include: The operating block (41) is arranged in a long strip shape, with a through hole in the middle so as to be sleeved on the adjusting shaft (2), and a gap extending from the through hole to one end of the operating block (41) along its length direction; A locking member (42) is arranged on the side of the operating block (41) and is located at one end of the operating block (41) where the gap is provided, and is capable of locking the operating block (41) onto the adjusting shaft (2).
7. The adjustment mechanism of the wafer air floating turntable according to claim 2, characterized in that: Also includes: A locking member (7) is arranged on the operating assembly and is capable of locking the operating assembly to the housing (5).
8. The adjustment mechanism of the wafer air floating turntable according to claim 2, characterized in that: A plurality of graduation marks are arranged on the end surface of the housing (5) away from the reducer (1), and the plurality of graduation marks are evenly distributed along the circumference of the housing (5).
9. The adjustment mechanism of the wafer air floating turntable according to claim 6, characterized in that: It also includes an anti-dropping piece (8) which is arranged on the adjusting shaft (2) to prevent the operating block (41) from falling and to position the operating block (41).
10. A wafer processing device, comprising a suction cup and an air-floating turntable for carrying the suction cup, wherein the suction cup is fixedly connected to the air-floating turntable, characterized in that: At least three supporting points are arranged on the air-floating turntable, and at least two of the supporting points use the adjustment mechanism of the wafer air-floating turntable as described in any one of claims 1-9.