Power module heat dissipation structure and semiconductor assembly with same

Abstract

The invention provides a power module heat dissipation structure and a semiconductor assembly with the same, the power module heat dissipation structure comprises a first copper-clad layer, a bottom plate is connected below the first copper-clad layer, and the bottom plate and the first copper-clad layer form a cooling flow channel; a ceramic layer is connected to the upper portion of the first copper-clad layer, and the surface of the ceramic layer makes contact with the cooling flow channel. The side, away from the first copper-clad layer, of the ceramic layer is connected with a power module, and the cooling liquid circularly flows in the cooling flow channel to take away heat transmitted to the ceramic layer by the power module. A closed cooling flow channel is formed between the ceramic layer and the bottom plate, the cooling flow channel is a streamline flow channel with a certain curvature, and rotating blades are arranged in the cooling flow channel. The cooling flow channel is in direct contact with the ceramic layer, and the circularly flowing cooling liquid continuously takes away the heat of the ceramic layer, so that the heat dissipation efficiency is improved. The rotating blades and the streamline flow channels are combined, the flow speed and direction of cooling liquid can be adjusted, and turbulent flow is reduced. And a radiator is not needed, so that the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device packaging, and in particular to a power module heat dissipation structure and a semiconductor component having the same. Background Art

[0002] There are two main packaging structures for power modules at present: the first is a single-sided heat dissipation structure, such as Figure 1 As shown, ED3 and HPD modules adopt this heat dissipation structure, which includes chip + solder + DBC + solder + substrate structure. The second type is a double-sided heat dissipation structure, such as DSC module, Figure 2 As shown, from top to bottom is substrate + solder + DBC + solder + Spacer + solder + chip + solder + DBC + solder + substrate.

[0003] The first solution has a disadvantage in that it has limited heat dissipation capacity. With the popularity of SiC chips and the increase in the power of Si-based modules, the heat dissipation efficiency of the first solution is low and it cannot dissipate heat in a timely manner. The second solution has a higher packaging density and a higher production cost.

[0004] Therefore, a power module heat dissipation structure with high heat dissipation efficiency and low production cost is needed. Summary of the Invention

[0005] In order to overcome the problems existing in the related art, an object of the present invention is to provide a power module heat dissipation structure and a semiconductor component having the same, wherein the power module heat dissipation structure has high heat dissipation efficiency and low production cost.

[0006] A power module heat dissipation structure includes a first copper clad layer, a base plate is connected below the first copper clad layer, and the base plate and the first copper clad layer form a cooling channel; a ceramic layer is connected above the first copper clad layer, and the surface of the ceramic layer is in contact with the cooling channel; the power module is connected to the side of the ceramic layer away from the first copper clad layer, and coolant circulates in the cooling channel to remove heat transferred from the power module to the ceramic layer; the cooling channel is a streamlined channel with a certain curvature, and rotating blades are provided in the cooling channel, and the rotating blades are used to reduce turbulence generated when the coolant flows through the cooling channel.

[0007] In a preferred technical solution of the present invention, a liquid inlet channel and a liquid outlet channel are respectively provided on both sides of the bottom plate, the liquid inlet channel is connected to the channel inlet, and the liquid outlet channel is connected to the channel outlet.

[0008] In a preferred technical solution of the present invention, the cooling channel is composed of a plurality of pipes connected end to end, and the shape of the cooling channel is S-shaped or right-angled.

[0009] In a preferred technical solution of the present invention, the cooling liquid flows in from the liquid inlet channel and flows out from the liquid outlet channel.

[0010] In a preferred technical solution of the present invention, a second copper clad layer is further connected to a side of the ceramic layer away from the first copper clad layer, and the second copper clad layer is connected to the power module.

[0011] In a preferred technical solution of the present invention, the power module includes a chip, and the chip is connected to the second copper cladding layer.

[0012] In a preferred technical solution of the present invention, a bonding wire is connected to a side of the chip away from the second copper cladding layer.

[0013] In a preferred technical solution of the present invention, a soldering layer is provided between the chip and the second copper cladding layer.

[0014] In a preferred technical solution of the present invention, the first end of the bonding wire is connected to the chip, and the second end of the bonding wire is connected to the second copper cladding layer.

[0015] In a preferred technical solution of the present invention, a transition zone is provided in the cooling channel, and the width of the transition zone is greater than the width of the non-transition zone; the transition zone has a certain curvature, and a plurality of rotating blades are provided in the transition zone.

[0016] The present invention also provides a semiconductor component, comprising the power module heat dissipation structure described in any one of the above items, and also comprising a cover plate, wherein the two sides of the cover plate are connected to the outer shell, and the cover plate is connected to the terminal; the cover plate and the outer shell enclose a sealed space, and the power module heat dissipation structure is arranged in the sealed space.

[0017] The beneficial effects of the present invention are:

[0018] The present invention provides a power module heat dissipation structure, comprising a first copper-clad layer, a base plate connected below the first copper-clad layer, the base plate and the first copper-clad layer forming a cooling channel; a ceramic layer connected above the first copper-clad layer, the surface of the ceramic layer in contact with the cooling channel; a power module connected to the side of the ceramic layer away from the first copper-clad layer, and coolant circulating in the cooling channel to remove heat transferred from the power module to the ceramic layer. The connection between the first copper-clad layer and the base plate forms a sealed cooling channel between the ceramic layer and the base plate. The cooling channel is in direct contact with the ceramic layer, allowing the coolant to circulate within the cooling channel and remove heat transferred from the power module to the ceramic layer, thereby dissipating heat from the power module. Localized areas of the ceramic layer of the power module have a high heat output, and the cooling channel is in direct contact with the ceramic layer. The circulating coolant continuously removes heat from the ceramic layer, resulting in high heat dissipation efficiency. The streamlined channel conforms to the characteristics of fluid mechanics and can reduce resistance to coolant flow. The combination of rotating blades and streamlined flow channels can regulate the flow rate and direction of the coolant in the cooling channel, reducing turbulence caused by the coolant flow and lowering energy consumption caused by turbulence. This invention eliminates the need for an additional radiator and instead utilizes the existing base plate and first copper cladding layer to form the cooling channel, thus reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of the heat dissipation structure of the power module of the present invention;

[0020] Figure 2 It is a structural schematic diagram of the bottom plate of the present invention;

[0021] Figure 3 It is a schematic structural diagram of the first copper clad layer of the present invention;

[0022] Figure 4 It is a schematic diagram of a single-sided heat dissipation structure of a power module in the prior art;

[0023] Figure 5 It is a schematic diagram of a double-sided heat dissipation structure of a power module in the prior art;

[0024] Figure 6 is a schematic diagram of the transition zone and non-transition zone of the cooling channel of the present invention;

[0025] Figure 7 It is a schematic diagram of the non-transition area of ​​the present invention in which a flow guide and a heat dissipation gasket are provided.

[0026] Figure numerals: 1. first copper clad layer; 2. base plate; 3. cooling channel; 4. ceramic layer; 5. power module; 6. liquid inlet channel; 7. liquid outlet channel; 8. channel inlet; 9. channel outlet; 10. pipeline; 11. second copper clad layer; 12. chip; 13. bonding wire; 14. welding layer; 15. cover plate; 16. outer shell; 17. terminal; 18. transition zone; 19. non-transition zone; 20. rotating blade; 21. guide member; 22. heat dissipation gasket. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present invention more thorough and complete and to fully convey the scope of the present invention to those skilled in the art.

[0028] Example 1

[0029] like Figure 1-Figure 3 As shown, this embodiment provides a power module heat dissipation structure, including a first copper clad layer 1, a base plate 2 is connected below the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 is connected above the first copper clad layer 1, and the surface of the ceramic layer 4 is in contact with the cooling channel 3; the side of the ceramic layer 4 away from the first copper clad layer 1 is connected to a power module 5, and the coolant circulates in the cooling channel 3 to take away the heat transferred from the power module 5 to the ceramic layer 4; the cooling channel 3 is a streamlined channel with a certain curvature, and a rotating blade 20 is provided in the cooling channel 3, and the rotating blade 20 is used to reduce the turbulence generated when the coolant flows through the cooling channel 3.

[0030] The ceramic layer 4 is a plane having a square structure. A first copper clad layer 1 is formed by directly cladding the lower surface of the ceramic layer 4 with copper. The first copper clad layer 1 is fixed to the lower surface of the ceramic layer 4. The base plate 2 is a copper base plate or an AlSiC base plate. The upper surface of the base plate 2 is nickel-plated to form a nickel layer. The nickel layer can enhance the solderability and corrosion resistance of the base plate 2.

[0031] A first copper clad layer 1 is formed by cladding copper on the lower surface of the ceramic layer 4. The first copper clad layer 1 is welded and sealed to the base plate 2 to form a cooling channel 3 that is in direct contact with the ceramic layer 4. The coolant in the cooling channel 3 is in direct contact with the ceramic layer 4, which can efficiently exchange heat, thereby achieving efficient heat dissipation and reducing the thermal resistance of the power module 5.

[0032] Base plate 2 is welded to first copper clad layer 1, which is located between base plate 2 and ceramic layer 4, further connecting the two layers. Base plate 2 supports the power heat dissipation structure and is also part of cooling channel 3. The welded portion between base plate 2 and first copper clad layer 1 not only connects base plate 2 and ceramic layer 4 but also seals cooling channel 3. Connecting base plate 2 to ceramic layer 4 allows for a compact package of base plate 2 and ceramic layer 4, minimizing space requirements.

[0033] The power module 5 transfers heat to the ceramic layer 4. Because the coolant flows within the cooling channel 3, it comes into direct contact with the ceramic layer 4. As the coolant flows through the ceramic layer 4, the heat from the ceramic layer 4 is further transferred to the coolant, allowing the coolant to remove the heat from the ceramic layer 4, reducing the heat in the ceramic layer 4. Due to the continuous circulation of the coolant, the power module 5 continuously generates heat and transfers it to the ceramic layer 4. The coolant continuously circulating in the cooling channel 3 continuously removes heat from the ceramic layer 4, achieving the purpose of dissipating heat from the power module 5.

[0034] The cooling channel 3 has a certain curvature, that is, a portion of the cooling channel 3 is curved. The cooling channel 3 is designed as a streamlined channel so that the cooling channel 3 conforms to the characteristics of fluid mechanics to reduce the resistance encountered by the coolant when flowing through the cooling channel 3, thereby reducing energy loss.

[0035] A plurality of rotating blades 20 are arranged in the cooling channel 3. The rotation of the rotating blades 20 can change the flow rate and direction of the coolant in the cooling channel 3, and adjust the flow rate of the coolant to a preset range to prevent the flow rate of the coolant from being too fast or too slow, thereby reducing the turbulence generated when the coolant flows through the cooling channel 3, making the distribution of the coolant more uniform and the flow of the coolant more stable.

[0036] This embodiment provides a power module heat dissipation structure, comprising a first copper clad layer 1, with a base plate 2 connected below the first copper clad layer 1. The base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 connected above the first copper clad layer 1, the surface of the ceramic layer 4 in contact with the cooling channel 3; a power module 5 connected to the side of the ceramic layer 4 away from the first copper clad layer 1, and coolant circulates in the cooling channel 3 to remove heat transferred from the power module 5 to the ceramic layer 4. The connection between the first copper clad layer 1 and the base plate 2 forms a sealed cooling channel 3 between the ceramic layer 4 and the base plate 2. The cooling channel 3 is in direct contact with the ceramic layer 4, so that the coolant, as it circulates in the cooling channel 3, removes heat transferred from the power module 5 to the ceramic layer 4, thereby dissipating heat from the power module 5. A local area of ​​the ceramic layer 4 of the power module 5 has a high heat generation rate. The cooling channel 3 is in direct contact with the ceramic layer 4, and the circulating coolant continuously removes heat from the ceramic layer 4. Therefore, the present invention has a high heat dissipation efficiency. Streamlined channels conform to the properties of fluid mechanics and can reduce resistance to coolant flow. The combination of rotating blades 20 and streamlined channels can regulate the flow rate and direction of the coolant in cooling channel 3, reducing turbulence and energy consumption caused by the turbulence. This invention eliminates the need for an additional heat sink and instead utilizes the existing base plate 2 and first copper cladding layer 1 to form cooling channel 3, thereby reducing costs.

[0037] Example 2

[0038] like Figure 1-Figure 3 As shown, this embodiment provides a power module heat dissipation structure, including a first copper clad layer 1, a base plate 2 is connected below the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 is connected above the first copper clad layer 1, and the surface of the ceramic layer 4 is in contact with the cooling channel 3; the side of the ceramic layer 4 away from the first copper clad layer 1 is connected to a power module 5, and the coolant circulates in the cooling channel 3 to take away the heat transferred from the power module 5 to the ceramic layer 4; the cooling channel 3 is a streamlined channel with a certain curvature, and a rotating blade 20 is provided in the cooling channel 3, and the rotating blade 20 is used to reduce the turbulence generated when the coolant flows through the cooling channel 3.

[0039] The cooling channel 3 is composed of a plurality of pipes 10 connected end to end, and the shape of the cooling channel 3 is S-shaped or right-angled.

[0040] Providing an S-shaped or right-angled cooling channel 3 can extend the cooling channel 3, making it longer. Coolant flowing through the S-shaped or right-angled cooling channel 3 ensures full contact between the coolant and the ceramic layer 4, thereby improving the heat dissipation efficiency of the ceramic layer 4. Furthermore, the S-shaped or right-angled cooling channel 3 can accommodate more coolant, increasing the contact area between the cooling channel 3 and the ceramic layer 4, thereby increasing the heat dissipation of the ceramic layer 4.

[0041] There is an opening at the connection between two adjacent pipes 10, the opening on the surface of the base plate 2 is aligned with the opening on the surface of the first copper clad layer 1, the pipe 10 on the surface of the base plate 2 is aligned with the pipe 10 on the surface of the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 enclose to form a cooling channel 3 for the coolant to flow through.

[0042] Preferably, the pipe 10 of the cooling channel 3 is in an "X" shape, which facilitates sealing the cooling channel 3 after welding the base plate 2 and the first copper cladding layer 1. By etching the ceramic layer 4 and forging the base plate 2, the number of cooling channels 3 can be multiplied at low cost, forming a capillary heat pipe effect. For the coolant, the smaller the cross-sectional area of ​​the cooling channel 3, the larger the specific surface area of ​​the coolant during operation, and the higher the heat dissipation efficiency.

[0043] like Figure 6 As shown, a transition zone 18 is provided in the cooling channel 3 , and the width of the transition zone 18 is greater than the width of the non-transition zone 19 ; the transition zone 18 has a certain curvature, and a plurality of rotating blades 20 are provided in the transition zone 18 .

[0044] Each pipe 10 is narrower at both ends and wider in the middle. A transition zone 18 is located in the middle of each pipe 10, flanked by non-transition zones 19. The transition zone 18 is connected to the non-transition zones 19 by two outwardly flaring edges, imparting a certain curvature to the transition zone 18. This conforms to the characteristics of fluid mechanics, reducing resistance to the coolant.

[0045] One or more rotating blades 20 are provided within the transition zone 18. If multiple rotating blades 20 are provided, the number of rotating blades 20 is preferably an even number. Turbulence is an unstable state of fluid motion that causes energy loss and pressure fluctuations within the pipeline 10. The provision of multiple rotating blades 20 can change the flow rate and direction of the coolant within the cooling channel 3, thereby regulating the coolant velocity and reducing turbulence.

[0046] The rotating motion of the rotating blades 20 can stratify the coolant and reduce the generation and propagation of turbulence, thereby making the distribution of the coolant more uniform and the flow of the coolant more stable.

[0047] The cooling channel 3 described in this embodiment is composed of a plurality of pipes 10 connected end to end, and the shape of the cooling channel 3 is S-shaped or right-angled. By designing the shape of the cooling channel 3 to be S-shaped or right-angled, the length of the cooling channel 3 can be further extended, so that more coolant can circulate in the cooling channel 3 to take away more heat from the ceramic layer 4. At the same time, through the etching process of the ceramic layer 4 and the forging process of the base plate 2, the first copper clad layer 1 and the base plate 2 are welded to form double the number of cooling channels 3. On this basis, the width and height of the cross section of the cooling channel 3 or the cross-sectional shape size are further reduced to a certain extent to reach the capillary level, which can achieve a higher heat exchange efficiency between the coolant and the ceramic layer 4, further improving the heat dissipation efficiency.

[0048] Example 3

[0049] like Figure 1-Figure 3 As shown, this embodiment provides a power module heat dissipation structure, including a first copper clad layer 1, a base plate 2 is connected below the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 is connected above the first copper clad layer 1, and the surface of the ceramic layer 4 is in contact with the cooling channel 3; the side of the ceramic layer 4 away from the first copper clad layer 1 is connected to a power module 5, and the coolant circulates in the cooling channel 3 to take away the heat transferred from the power module 5 to the ceramic layer 4; the cooling channel 3 is a streamlined channel with a certain curvature, and a rotating blade 20 is provided in the cooling channel 3, and the rotating blade 20 is used to reduce the turbulence generated when the coolant flows through the cooling channel 3.

[0050] A liquid inlet channel 6 and a liquid outlet channel 7 are respectively provided on both sides of the bottom plate 2 . The liquid inlet channel 6 is connected to a channel inlet 8 , and the liquid outlet channel 7 is connected to a channel outlet 9 .

[0051] The coolant flows in from the liquid inlet channel 6 and flows out from the liquid outlet channel 7 .

[0052] The four corners of the bottom plate 2 are respectively provided with through holes, and the four through holes are used to install nuts, so that the power module heat dissipation structure of the present invention can be further fixed to the external structure by installing nuts.

[0053] A liquid inlet channel 6 and a liquid outlet channel 7 are provided on either side of the base plate 2. The inlet 8 of the liquid inlet channel 6 and the outlet 9 of the liquid outlet channel 7 are connected and lie in the same plane. The cooling channel 3 is S-shaped or right-angled, with the angle of the cooling channel 3 preferably being 90°. The liquid inlet channel 6 and the liquid outlet channel 7 extend a certain distance to either side of the base plate 2. If the cooling channel 3 is S-shaped, the corners of the cooling channel 3 have a smooth transition; if the cooling channel 3 is right-angled, the corners of the cooling channel 3 have a linear transition.

[0054] The coolant can be conventional coolant such as water, or other cooling liquids such as thermal oil and fluorinated liquid. The coolant must have the following properties: antifreeze performance, heat exchange performance, anti-scaling performance, anti-corrosion performance, explosion-proof performance, etc. The coolant can also use environmentally friendly refrigerants as insulating circulating fluids, such as the refrigerant medium used in the air conditioning industry. The thermal conductivity and heat capacity of the coolant must meet the requirements.

[0055] The coolant flows into the cooling channel 3 from the channel inlet 8, flows through a plurality of pipes 10 connected end to end, and finally flows out through the channel outlet 9. Through the continuous circulation of the coolant, the coolant continuously removes the heat of the ceramic layer 4, thereby achieving the purpose of heat dissipation of the ceramic layer 4.

[0056] The positions of the liquid inlet channel 6 and the liquid outlet channel 7 can be interchanged, and the positions of the channel inlet 8 and the channel outlet 9 can also be interchanged. The flow direction of the coolant can be flexibly adjusted as needed to achieve a better heat dissipation effect. An external circulation device is also provided outside the cooling channel 3. The external circulation device, such as a water pump, provides circulation power for the coolant. The external circulation device is also provided with a storage portion for storing the coolant. The external circulation device can also be provided with a fan to cool the coolant flowing out of the channel outlet 9.

[0057] In this embodiment, a liquid inlet channel 6 and a liquid outlet channel 7 are respectively provided on both sides of the base plate 2. The liquid inlet channel 6 is connected to the channel inlet 8, and the liquid outlet channel 7 is connected to the channel outlet 9. The coolant flows in from the liquid inlet channel 6 and flows out from the liquid outlet channel 7. The positions of the liquid inlet channel 6 and the liquid outlet channel 7 can be interchanged, and the positions of the channel inlet 8 and the channel outlet 9 can also be interchanged. The flow direction of the coolant can be flexibly adjusted as needed to achieve a better heat dissipation effect. An external circulation device is also provided on the outside of the cooling channel 3. The external circulation device, such as a water pump, provides circulation power for the coolant. The external circulation device is also provided with a storage part for storing the coolant. The external circulation device can also be provided with a fan to cool the coolant flowing out of the channel outlet 9. During the circulation process, the coolant takes away the heat of the ceramic layer 4, thereby achieving efficient heat dissipation of the power module 5.

[0058] Example 4

[0059] like Figure 1-Figure 3As shown, this embodiment provides a power module heat dissipation structure, including a first copper clad layer 1, a base plate 2 is connected below the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 is connected above the first copper clad layer 1, and the surface of the ceramic layer 4 is in contact with the cooling channel 3; the side of the ceramic layer 4 away from the first copper clad layer 1 is connected to a power module 5, and the coolant circulates in the cooling channel 3 to take away the heat transferred from the power module 5 to the ceramic layer 4; the cooling channel 3 is a streamlined channel with a certain curvature, and a rotating blade 20 is provided in the cooling channel 3, and the rotating blade 20 is used to reduce the turbulence generated when the coolant flows through the cooling channel 3.

[0060] A second copper clad layer 11 is further connected to a side of the ceramic layer 4 away from the first copper clad layer 1 , and the second copper clad layer 11 is connected to the power module 5 .

[0061] Heat is transferred from the power module 5 to the second copper clad layer 11, then from the second copper clad layer 11 to the ceramic layer 4, and then from the ceramic layer 4 to the first copper clad layer 1. The first copper clad layer 1 is internally provided with cooling channels 3, and the coolant in the cooling channels 3 is in direct contact with the ceramic layer 4. As the coolant circulates in the cooling channels 3, it exchanges heat with the ceramic layer 4, removing heat from the ceramic layer 4 and achieving efficient heat dissipation.

[0062] The first copper clad layer 1 is smaller than the base plate 2. The base plate 2 is joined to multiple first copper clad layers 1. The pipes 10 on the side of the base plate 2 facing the first copper clad layers 1 correspond to the pipes 10 on the side of the first copper clad layers 1 facing the base plate 2. This embodiment uses the base plate 2 and two first copper clad layers 1 interlocked to form the cooling channel 3 as an example.

[0063] The first copper clad layer 1 and the second copper clad layer 11 are both DBC copper clad layers, i.e., copper clad layers made using a direct copper clad process. DBC copper clad layers have excellent thermal conductivity and effectively transfer heat from the power module 5 to the coolant through the first and second copper clad layers 1, 11, reducing the operating temperature of the power module 5 and thereby ensuring the stability and lifespan of the power module 5. The ceramic layer 4 connects the first and second copper clad layers 1, 11 to form a DBC board. Due to the excellent insulation and voltage resistance of the ceramic layer 4, the DBC board effectively isolates the power module 5 from the cooling channel 3, improving the insulation performance of the heat dissipation structure.

[0064] The first copper clad layer 1 and the second copper clad layer 11 can also be AMB copper clad layers or DPC copper clad layers. The AMB copper clad layer has a very strong bonding strength with the ceramic layer 4, which can better combine them together. The AMB copper clad layer has a higher thermal conductivity and has a lower thermal resistance than the traditional DBC copper clad layer, which helps improve heat dissipation efficiency. The DPC copper clad layer has excellent thermal conductivity and can effectively conduct the heat generated by the power module 5. It has a low thermal expansion coefficient in high temperature environments, can maintain good stability, and reduce the risk of mismatch and cracking caused by thermal stress.

[0065] In this embodiment, the ceramic layer 4 is further connected to a second copper clad layer 11 on a side away from the first copper clad layer 1. The second copper clad layer 11 is connected to the power module 5. The heat of the power module 5 is transferred to the second copper clad layer 11, and then from the second copper clad layer 11 to the ceramic layer 4. The ceramic layer 4 is connected to the cooling channel 3 and directly contacts the coolant. When the coolant circulates in the cooling channel 3, the coolant and the ceramic layer 4 perform efficient heat exchange and remove the heat from the ceramic layer 4 during the circulation process, reducing the temperature of the ceramic layer 4, thereby achieving heat dissipation of the power module 5. Because both the second copper clad layer 11 and the ceramic layer 4 have efficient heat transfer performance, heat is transferred from the power module 5 to the second copper clad layer 11 and then to the ceramic layer 4. The above-mentioned heat transfer channel is short and the heat transfer structure is simple, which can promptly transfer the heat generated by the power module 5 to the coolant, thereby achieving efficient heat dissipation of the power module 5.

[0066] Example 5

[0067] like Figure 1-Figure 3 As shown, this embodiment provides a power module heat dissipation structure, including a first copper clad layer 1, a base plate 2 is connected below the first copper clad layer 1, and the base plate 2 and the first copper clad layer 1 form a cooling channel 3; a ceramic layer 4 is connected above the first copper clad layer 1, and the surface of the ceramic layer 4 is in contact with the cooling channel 3; the side of the ceramic layer 4 away from the first copper clad layer 1 is connected to a power module 5, and the coolant circulates in the cooling channel 3 to take away the heat transferred from the power module 5 to the ceramic layer 4; the cooling channel 3 is a streamlined channel with a certain curvature, and a rotating blade 20 is provided in the cooling channel 3, and the rotating blade 20 is used to reduce the turbulence generated when the coolant flows through the cooling channel 3.

[0068] A second copper clad layer 11 is further connected to a side of the ceramic layer 4 away from the first copper clad layer 1 , and the second copper clad layer 11 is connected to the power module 5 .

[0069] The power module 5 includes a chip 12 , and the chip 12 is connected to the second copper cladding layer 11 .

[0070] A bonding wire 13 is connected to a side of the chip 12 away from the second copper cladding layer 11 .

[0071] A soldering layer 14 is provided between the chip 12 and the second copper cladding layer 11 .

[0072] A first end of the bonding wire 13 is connected to the chip 12 , and a second end of the bonding wire 13 is connected to the second copper cladding layer 11 .

[0073] This embodiment also provides a semiconductor component, including the power module heat dissipation structure described in any one of Embodiments 1 to 4, and also including a cover plate 15, wherein the cover plate 15 is connected to a shell 16 on both sides, and the cover plate 15 is connected to a terminal 17; the cover plate 15 and the shell 16 enclose a sealed space, and the power module heat dissipation structure is arranged in the sealed space.

[0074] Chip 12 is connected to second copper clad layer 11 via solder layer 14. Chip 12 transfers heat to second copper clad layer 11 through solder layer 14, and second copper clad layer 11 then transfers the heat to ceramic layer 4. The local area of ​​ceramic layer 4 corresponding to chip 12 generates a large amount of heat. For this area, a larger circulation channel volume can be designed to increase the coolant flow rate, thereby improving local cooling capacity. Preferably, heat transfer simulation software is used to simulate the heat transfer process based on the power and heat transfer layer of chip 12 during operation. The parameters of the different heat transfer layers, such as thickness, are adjusted based on the simulation results to achieve precise design of heat dissipation capacity, prevent over-design, and improve the energy-saving capability of the power module's heat dissipation structure.

[0075] Bonding wires 13 are used to connect chip 12 to second copper clad layer 11, which is then connected to an external circuit. This electrically interconnects chip 12 and the external circuit, allowing electrical signals to be transmitted between them. Bonding wires 13 ensure that chip 12 can withstand the physical pressure generated after packaging and, to a certain extent, dissipate the heat generated during operation. Bonding wires 13 have a conductive wire inside and an insulating material outside. This insulating material wraps around the conductive wire, allowing bonding wires 13 to conduct electricity while maintaining surface insulation.

[0076] The ceramic layer 4 is in direct contact with the coolant, and the coolant circulates in the cooling channel 3 to achieve heat exchange between the coolant and the ceramic layer 4, thereby achieving the purpose of dissipating heat from the chip 12.

[0077] The semiconductor assembly includes a cover plate 15, which provides additional mechanical support for chip 12 and enhances the stability and durability of the entire power module's heat dissipation structure. Cover plate 15 and housing 16 form a sealed space, providing a physical barrier within chip 12, protecting it from the external environment and preventing dust and water vapor from entering the sealed space and damaging it.

[0078] A transition zone 18 is provided in the cooling channel. The width of the transition zone 18 is greater than the width of the non-transition zone 19 . The transition zone 18 has a certain curvature. A plurality of rotating blades 20 are provided in the transition zone 18 .

[0079] The transition region 18 of the cooling channel 3 has a streamlined feature, while the non-transition region 19 of the cooling channel 3 does not have a streamlined feature.

[0080] The curvature can reflect the degree of curvature of a curve. The curvature is equal to the inverse of the radius of curvature of a circle. That is, the larger the radius of curvature of a circle, the flatter the curve and the smaller the curvature. The smaller the radius of curvature of a circle, the more curved the curve and the greater the curvature. The width of the non-transition region 19 of the cooling channel 3 is less than 1 mm, where mm in the present invention represents millimeters.

[0081] When the width of the non-transition zone 19 of the cooling channel 3 is less than 1 mm, the width of the transition zone 18 of the cooling channel 3 is greater than 0 mm and less than or equal to 1 mm. The curvature radius of the transition zone 18 of the cooling channel 3 is greater than 0 mm and less than or equal to 0.5 mm. The curvature of the transition zone 18 of the cooling channel 3 is greater than or equal to 2 mm. -1 , the upper limit of the curvature range of the transition zone 18 of the cooling channel 3 is set to 5mm -1 , limiting the curvature of the transition zone 18 of the cooling channel 3 to greater than or equal to 2 mm -1 , and less than or equal to 5mm -1 Within the range, the curvature of the transition zone 18 is ensured to be greater than the curvature of the non-transition zone 19, and the transition zone 18 expands outward so as to facilitate the arrangement of multiple rotating blades 20 in the transition zone 18, so that the rotating blades 20 can rotate in the transition zone 18.

[0082] In this embodiment, the width of the non-transition zone 19 of the cooling channel 3 is 0.6 mm, and the width of the transition zone 18 of the cooling channel 3 is 0.8 mm. The curvature radius of the transition zone 18 of the cooling channel 3 is 0.4 mm, and the curvature of the transition zone 18 is 2.5 mm. -1 .

[0083] Preferably, a plurality of flow guides 21 are provided in the non-transition area 19, and a plurality of heat dissipation pads 22 are provided on the sidewalls of the non-transition area 19. Figure 7As shown, the guide member 21 is in the shape of a triangle, and the width of the guide member 21 gradually decreases along the flow direction of the coolant. In addition to being a triangle, the guide member 21 can also be in the shape of a water drop or a trapezoid. The ratio of the width reduction of the guide member 21 is related to the angle of the guide member 21, and the angle of the guide member 21 is 15-75 degrees. As an example, if the shape of the guide member 21 is an equilateral triangle, the three angles of the guide member 21 are all 60 degrees, and the flow direction of the coolant is perpendicular to the bottom side of the guide member 21, then the ratio of the height direction to the width direction of the guide member 21 is The height direction of the flow guide 21 is parallel to the flow direction of the coolant, and the width direction of the flow guide 21 is perpendicular to the flow direction of the coolant.

[0084] Multiple heat dissipation gaskets 22 are spaced apart on the side wall of the non-transition zone 19. The thermal conductivity of the heat dissipation gaskets 22 is greater than the thermal conductivity of the side wall of the non-transition zone 19. The heat dissipation gaskets 22 are used to cool the coolant in the non-transition zone 19 to reduce the Reynolds coefficient of the coolant.

[0085] The guide member 21 is designed in a triangular shape, and the coolant in the non-transition zone 19 flows along the inclined surface of the guide member 21. The width of the guide member 21 gradually decreases along the direction of the coolant flow. This can guide the flow of the coolant while reducing the resistance to the coolant flow, thereby increasing the coolant flow rate in the non-transition zone 19.

[0086] The viscosity of a fluid has a significant impact on its flow stability. When the viscosity is high, the flow is relatively stable and laminar. When the viscosity is low, turbulence tends to occur. Turbulence increases the resistance to fluid flow, leading to increased energy consumption. The formula for calculating the Reynolds coefficient of a fluid is:

[0087]

[0088] Where Re is the Reynolds coefficient of the fluid, ρ is the density of the fluid, v is the flow velocity of the fluid, d is the pipe diameter, and u is the viscosity coefficient of the fluid.

[0089] Multiple heat sinks 22 are used to dissipate heat from the coolant. Because the viscosity of a liquid is negatively correlated with its temperature, this increases the viscosity of the coolant while lowering its temperature. The negative correlation between the viscosity and the Reynolds coefficient reduces the Reynolds coefficient of the coolant as it flows through the non-transition zone 19. This reduces the Reynolds coefficient of the coolant to a relatively low value, ensuring laminar flow within the non-transition zone 19 and high heat dissipation efficiency.

[0090] In combination with the guide member 21 and the heat dissipation gasket 22, the flow mode and flow speed of the coolant can be taken into account, thereby reducing the energy consumption caused by resistance when the coolant flows while maintaining a high heat dissipation efficiency of the coolant.

[0091] The ceramic layer 4 of this embodiment is further connected to a second copper clad layer 11 on a side away from the first copper clad layer 1, and the second copper clad layer 11 is connected to the power module 5. The power module 5 includes a chip 12, and the chip 12 is connected to the second copper clad layer 11. The chip 12 is connected to a bonding wire 13 on a side away from the second copper clad layer 11. A welding layer 14 is provided between the chip 12 and the second copper clad layer 11. The first end of the bonding wire 13 is connected to the chip 12, and the second end of the bonding wire 13 is connected to the second copper clad layer 11. This embodiment also provides a semiconductor component, including the above-mentioned power module heat dissipation structure, and also including a cover plate 15, the two sides of the cover plate 15 are connected to a shell 16, and the cover plate 15 is connected to a terminal 17; the cover plate 15 and the shell 16 enclose a sealed space, and the power module heat dissipation structure is provided in the sealed space. The cover plate 15 and the housing 16 of the semiconductor component enclose a sealed space, which can physically isolate the power module heat dissipation structure from the outside world, thereby protecting the chip 12 from external physical interference, thereby better protecting the chip 12 and extending the service life of the chip 12.

[0092] Unless otherwise specifically stated, the relative arrangement, numerical expression and numerical value of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that: similar reference numerals and letters represent similar items in the accompanying drawings below, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the accompanying drawings subsequently.

[0093] It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in a figure is inverted, a device described as "above" or "above" another device or structure would then be positioned "below" or "beneath" the other device or structure. Thus, the exemplary term "above" can encompass both the orientations of "above" and "below." The device may also be oriented in other different ways (rotated 90 degrees or at other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0094] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0095] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A power module heat dissipation structure, characterized in that: It includes a first copper-clad layer, a bottom plate is connected to the bottom of the first copper-clad layer, and the bottom plate and the first copper-clad layer form a cooling channel; a ceramic layer is connected to the top of the first copper-clad layer, and the surface of the ceramic layer is in contact with the cooling channel; a power module is connected to the side of the ceramic layer away from the first copper-clad layer, and coolant circulates in the cooling channel to take away the heat transferred from the power module to the ceramic layer; the cooling channel is a streamlined channel with a certain curvature, and rotating blades are arranged in the cooling channel, and the rotating blades are used to reduce turbulence generated when the coolant flows through the cooling channel.

2. The power module heat dissipation structure according to claim 1, characterized in that: A liquid inlet channel and a liquid outlet channel are respectively arranged on both sides of the bottom plate. The liquid inlet channel is communicated with the channel inlet, and the liquid outlet channel is communicated with the channel outlet.

3. The power module heat dissipation structure according to claim 1, characterized in that: The cooling channel is composed of a plurality of pipes connected end to end, and the shape of the cooling channel is S-shaped or right-angled.

4. The power module heat dissipation structure according to claim 2, characterized in that: The cooling liquid flows in from the liquid inlet channel and flows out from the liquid outlet channel.

5. The power module heat dissipation structure according to claim 1, characterized in that: A second copper clad layer is further connected to a side of the ceramic layer away from the first copper clad layer, and the second copper clad layer is connected to the power module.

6. The power module heat dissipation structure according to claim 5, characterized in that: The power module includes a chip, and the chip is connected to the second copper cladding layer.

7. The power module heat dissipation structure according to claim 6, characterized in that: A bonding wire is connected to a side of the chip away from the second copper cladding layer.

8. The power module heat dissipation structure according to claim 6, characterized in that: A soldering layer is arranged between the chip and the second copper cladding layer.

9. The power module heat dissipation structure according to claim 7, characterized in that: The first end of the bonding wire is connected to the chip, and the second end of the bonding wire is connected to the second copper cladding layer.

10. The power module heat dissipation structure according to claim 1, characterized in that: A transition zone is arranged in the cooling channel, and the width of the transition zone is greater than the width of the non-transition zone; the transition zone has a certain curvature, and a plurality of the rotating blades are arranged in the transition zone.

11. A semiconductor component, characterized in that: It includes the power module heat dissipation structure according to any one of claims 1 to 10, and also includes a cover plate, wherein the cover plate is connected to the outer shell on both sides, and the cover plate is connected to the terminal; the cover plate and the outer shell enclose a sealed space, and the power module heat dissipation structure is arranged in the sealed space.

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