Broadband SIP three-dimensional interconnection transmission structure

Abstract

The invention discloses a broadband SIP three-dimensional interconnection transmission structure which comprises an upper plate transmission structure, a lower plate transmission structure and a ball array. The upper plate transmission structure comprises a coplanar waveguide, a coplanar waveguide-to-quasi-coaxial matching disc, a first quasi-coaxial matching disc and a quasi-coaxial-to-ball array matching disc; the lower plate transmission structure comprises a ball array-to-quasi-coaxial matching disc, a second quasi-coaxial matching disc, a quasi-coaxial-to-strip line matching disc and a strip line; the ball array comprises a radio-frequency ball in the center and grounding balls arranged around the radio-frequency ball in an array mode, the first and second quasi-coaxial units comprise radio-frequency inner cores and grounding holes arranged around the radio-frequency inner cores, and the radio-frequency inner cores and the radio-frequency ball are installed in an aligned welding mode; each of the ball array to quasi-coaxial matching disc and the quasi-coaxial to ball array matching disc comprises a central bonding pad, a second anti-bonding pad and a transmission ground, the upper and lower plate transmission structure is welded with a radio frequency ball of the ball array through the central bonding pad, and the transmission grounds are welded through a grounding surface of the ball array. The broadband radio frequency transmission characteristic can be realized, and the integration level of the electronic equipment is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of radio frequency microwaves, and in particular relates to a broadband SIP three-dimensional interconnection transmission structure. Background Art

[0002] The current electronic equipment is becoming more and more integrated. The traditional brick-type two-dimensional modules are large and can no longer meet the development needs. Microwave modules need to be developed towards the goal of light miniaturization, high integration, and wide bandwidth. With the continuous advancement of current science and technology, advanced packaging and interconnection technologies have been widely used. Modules have developed from traditional two-dimensional architectures to three-dimensional architectures. Multiple chips and devices are integrated together through advanced packaging technology to form a microsystem with independent functions.

[0003] The development of microsystems requires interconnection technology that matches it. Traditional RF cables, connectors, and buttons are large in size and have low interconnection density. They cannot guarantee the requirements of lightweight miniaturization, high integration, and wide bandwidth of modules. There is an urgent need to address the high-density interconnection requirements brought about by high integration under wide-band applications. Summary of the invention

[0004] The purpose of the present invention is to provide a broadband SIP three-dimensional interconnection transmission structure, which can realize broadband radio frequency transmission characteristics and improve the integration of electronic equipment.

[0005] One aspect of the present invention provides a broadband SIP three-dimensional interconnection transmission structure, comprising an upper plate transmission structure, a lower plate transmission structure and a ball array, wherein the upper plate transmission structure and the lower plate transmission structure are connected via the ball array;

[0006] The upper plate transmission structure includes coplanar waveguide, coplanar waveguide to quasi-coaxial matching plate, first type coaxial, quasi-coaxial to ball array matching plate, and the lower plate transmission structure includes ball array to quasi-coaxial matching plate, second type coaxial, quasi-coaxial to stripline matching plate, and stripline;

[0007] The ball array includes a radio frequency ball located at the center of the array and a ground ball arranged in a rectangular array around the radio frequency ball. The first type coaxial and the second type coaxial include a radio frequency inner core and ground holes evenly arranged around the radio frequency inner core. The radio frequency inner core and the radio frequency ball are welded and installed in position.

[0008] The upper plate transmission structure and the lower plate transmission structure include a plurality of metal layers, each metal layer is provided with a first anti-pad, and the first anti-pad, the RF inner core and the grounding hole form a RF signal path;

[0009] The ball array to quasi-coaxial matching plate and the quasi-coaxial to ball array matching plate both include a center pad, a second anti-pad and a transmission ground. The upper plate transmission structure and the lower plate transmission structure are welded to the RF ball of the ball array via the center pad, and the transmission grounds are welded via the ground ball of the ball array.

[0010] Preferably, the RF inner core includes a first type of coaxial RF inner core and a second type of coaxial RF inner core, and the grounding holes include a first grounding hole and a second grounding hole surrounding the first type of coaxial RF inner core and a third grounding hole and a fourth grounding hole surrounding the second type of coaxial RF inner core.

[0011] Preferably, the upper plate transmission structure is an 8-layer plate composed of 8 metal layers, and the lower plate transmission structure is a 4-layer plate composed of 4 metal layers.

[0012] Preferably, the first type of coaxial RF core is a metallized through hole from the first metal layer to the eighth metal layer, the first grounding hole is a metallized through hole from the first metal layer to the eighth metal layer, and the second grounding hole is a metallized blind hole from the second metal layer to the eighth metal layer;

[0013] The RF inner core of the second type of coaxial cable is a metallized through hole from the first metal layer to the fourth metal layer, the third grounding hole is a metallized through hole from the first metal layer to the fourth metal layer, and the fourth grounding hole is a metallized blind hole from the first metal layer to the second metal layer.

[0014] Preferably, the broadband SIP three-dimensional interconnection transmission structure further includes radio frequency ground holes and radio frequency holes, which are arranged around the coplanar waveguide and the strip line to ensure that the signal is transmitted in a relatively closed area.

[0015] Preferably, the upper plate transmission structure and the lower plate transmission structure are both made of a high-frequency circuit board CLTE-XT.

[0016] Preferably, the ball diameter of the ground ball is 0.5 mm, the ball spacing is 0.8 mm, and the central cross-sectional impedance of the ball array is 50 ohms.

[0017] Preferably, the signal transmission direction of the coplanar waveguide and the signal transmission direction of the strip line are set to 180°.

[0018] Preferably, the structural impedance of the first type coaxial cable and the second type coaxial cable is set to 50 ohms.

[0019] The broadband SIP three-dimensional interconnection transmission structure according to the above aspect of the present invention can realize broadband radio frequency transmission characteristics and improve the integration of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0021] Figure 1 is a schematic diagram of a broadband SIP three-dimensional interconnection transmission structure according to an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of an upper plate transmission structure according to an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of a lower plate transmission structure according to an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a ball array according to an embodiment of the present invention;

[0025] Figure 5 is a schematic cross-sectional view of the first and second types of coaxials according to an embodiment of the present invention;

[0026] Figure 6 is a schematic diagram of a quasi-coaxial to ball array matching disk and a ball array to quasi-coaxial matching disk according to an embodiment of the present invention;

[0027] Figure 7 is a standing wave curve diagram of an embodiment of the present invention;

[0028] Figure 8 is a loss curve diagram of an embodiment of the present invention;

[0029] Fig. 9 It is a schematic diagram of SiP interconnect assembly application according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] An embodiment of the present invention provides a broadband SIP three-dimensional interconnection transmission structure, such as Figure 1-3As shown, the broadband SIP three-dimensional interconnection transmission structure of the embodiment of the present invention includes an upper plate transmission structure 1, a lower plate transmission structure 2 and a ball array 3, wherein the upper plate transmission structure 1 includes a coplanar waveguide 4, a coplanar waveguide to quasi-coaxial matching disk 5, a first type of coaxial 7, and a quasi-coaxial to ball array matching disk 6; the lower plate transmission structure 2 includes a ball array to quasi-coaxial matching disk 16, a second type of coaxial 25, a quasi-coaxial to stripline matching disk 8, and a stripline 9. The upper plate transmission structure 1 and the lower plate transmission structure 2 are connected through the ball array 3. Radio frequency ground holes 25 and radio frequency holes 26 are arranged around the coplanar waveguide 4 and the stripline 9 to ensure that the signal is transmitted in a relatively closed area. The upper plate transmission structure 1 and the lower plate transmission structure 2 are both made of a high-frequency circuit board CLTE-XT.

[0032] The upper plate transmission structure 1 and the lower plate transmission structure 2 both include multiple metal layers, and the number of metal layers is not fixed and can be freely set according to actual needs in actual use. In this embodiment, the upper plate transmission structure 1 is an 8-layer plate composed of 8 metal layers 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, 1-7, and 1-8, and the lower plate transmission structure 2 is a 4-layer plate composed of 4 metal layers 2-1, 2-2, 2-3, and 2-4.

[0033] like Figure 4 As shown, the ball array 3 is composed of a radio frequency ball 23 at the center of the array and a ground ball 24 arranged in a rectangular array around it. The ball diameter of the ground ball 24 is 0.5 mm, and the ball spacing is 0.8 mm. The central cross-sectional impedance of the ball array 3 is 50 ohms. The ball array 3 realizes the connectivity of the radio frequency signal and plays a supporting role for the upper plate transmission structure 1.

[0034] like Figure 5 As shown, both the first type coaxial 7 and the second type coaxial 25 are composed of an RF inner core 17 and grounding holes 18 uniformly arranged around the RF inner core 17 at a certain distance, and each layer is provided with a first anti-welding pad 19, which together constitute an RF signal path. The structural impedance of the first type coaxial 7 and the second type coaxial 25 is set to 50 ohms, which ensures the consistency of the impedance before and after the number of upper and lower board layers changes, and realizes the free setting of the number of layers of the broadband transmission structure. During the installation process, the RF inner core 17 in the first type coaxial 7 and the second type coaxial 25 and the RF ball 23 of the ball array 3 are accurately aligned and welded and installed.

[0035] The RF inner core 17 includes the RF inner core 15 of the first type coaxial 7 and the RF inner core 16 of the second type coaxial 25, and the grounding hole 18 includes the first grounding hole 11 and the second grounding hole 12 surrounding the RF inner core 15 of the first type coaxial 7 and the third grounding hole 14 and the fourth grounding hole 13 surrounding the RF inner core 16 of the second type coaxial 25.

[0036] The RF inner core 15 of the first type coaxial cable 7 is a metallized through hole from the first metal layer 1-1 to the eighth metal layer 1-8, the first grounding hole 11 is a metallized through hole from the first metal layer 1-1 to the eighth metal layer 1-8, and the second grounding hole 12 is a metallized blind hole from the second metal layer 1-2 to the eighth metal layer 1-8. The RF inner core 16 of the second type coaxial cable 25 is a metallized through hole from the first metal layer 2-1 to the fourth metal layer 2-4, the third grounding hole 14 is a metallized through hole from the first metal layer 2-1 to the fourth metal layer 2-4, and the fourth grounding hole 13 is a metallized blind hole from the first metal layer 2-1 to the second metal layer 2-2.

[0037] like Figure 6 As shown, the ball array to quasi-coaxial matching plate 4 and the quasi-coaxial to ball array matching plate both include a center pad 20, a second anti-pad 21 and a transmission ground 22. The upper plate transmission structure 1 and the lower plate transmission structure 2 are welded to the RF ball 23 of the ball array 3 via the center pad 20, and the transmission grounds 22 are welded to each other via the grounding ball 24 of the ball array 3, thereby ensuring a good connection and signal transmission effect between the upper plate transmission structure 1 and the lower plate transmission structure 2.

[0038] The upper plate transmission structure 1 and the lower plate transmission structure 2 can be adjusted at any angle in the RF signal transmission direction. In the embodiment of the present invention, the signal transmission direction of the coplanar waveguide 4 and the signal transmission direction of the strip line 9 are set to 180°.

[0039] The entire transmission structure forms a good grounding and signal shielding effect through the radio frequency ground hole 25, the quasi-coaxial ground hole 18, and the ground ball 24, thereby ensuring high-quality signal transmission.

[0040] Figure 7 and Figure 8 The standing wave and differential loss of the broadband SIP three-dimensional interconnection transmission structure of the embodiment of the present invention are respectively reflected. It can be seen that the standing wave in the DC-52GHz range is no higher than 1.28, and the differential loss is better than 0.195, which proves that the transmission structure of the embodiment of the present invention has good broadband RF transmission characteristics, and the transmission structure is small in size and can meet the requirements of high integration of electronic equipment.

[0041] Fig. 9 The application of the transmission structure of the embodiment of the present invention in SIP interconnection assembly is shown. The upper board transmission structure 1 is placed in module A and module B respectively, and the lower board transmission structure 2 is placed in the motherboard. Module A and module B are connected to the motherboard through a ball array. The radio frequency signal is transmitted to the ball array through the upper board transmission structure in module A, and then transmitted to the strip line through the ball array, and then transmitted to the ball array at module B after being transmitted through the strip line in the motherboard, and then transmitted to the upper board transmission structure inside module B, so as to realize the signal interconnection and assembly of the SIP module on the motherboard.

[0042] According to the broadband SIP three-dimensional interconnection transmission structure of the above embodiment of the present invention, the signal within the board is converted from horizontal transmission to coaxial vertical transmission, and the electrical connection and physical support are achieved between the boards through the ball array, completing the transition of the radio frequency signal from horizontal transmission to vertical transmission and then to horizontal transmission. The broadband three-dimensional signal transmission interconnection can be flexibly realized, and can be widely used in multi-layer SIP internal interconnection. At the same time, it can also be used for the port lead-out structure when the SIP is assembled on the motherboard and the interconnection assembly structure between SIPs.

[0043] The broadband SIP three-dimensional interconnection transmission structure of the embodiment of the present invention has good matching effect, can achieve good radio frequency transmission, meets the requirements of current electronic equipment for broadband performance, and effectively solves the problem of not being able to cover broadband in the past. At the same time, it has a small size, which is conducive to improving the integration of electronic equipment.

[0044] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A broadband SIP three-dimensional interconnection transmission structure, characterized in that: It includes an upper plate transmission structure, a lower plate transmission structure and a ball array, wherein the upper plate transmission structure and the lower plate transmission structure are connected via the ball array; The upper plate transmission structure includes coplanar waveguide, coplanar waveguide to quasi-coaxial matching plate, first type coaxial, quasi-coaxial to ball array matching plate, and the lower plate transmission structure includes ball array to quasi-coaxial matching plate, second type coaxial, quasi-coaxial to stripline matching plate, and stripline; The ball array includes a radio frequency ball located at the center of the array and a ground ball arranged in a rectangular array around the radio frequency ball. The first type coaxial and the second type coaxial include a radio frequency inner core and ground holes evenly arranged around the radio frequency inner core. The radio frequency inner core and the radio frequency ball are welded and installed in position. The upper plate transmission structure and the lower plate transmission structure include a plurality of metal layers, each metal layer is provided with a first anti-pad, and the first anti-pad, the RF inner core and the grounding hole form a RF signal path; The ball array to quasi-coaxial matching plate and the quasi-coaxial to ball array matching plate both include a center pad, a second anti-pad and a transmission ground. The upper plate transmission structure and the lower plate transmission structure are welded to the RF ball of the ball array via the center pad, and the transmission grounds are welded via the ground ball of the ball array.

2. The broadband SIP three-dimensional interconnection transmission structure according to claim 1 is characterized in that: The RF inner core includes a first type of coaxial RF inner core and a second type of coaxial RF inner core, and the grounding holes include a first grounding hole and a second grounding hole surrounding the first type of coaxial RF inner core and a third grounding hole and a fourth grounding hole surrounding the second type of coaxial RF inner core.

3. The broadband SIP three-dimensional interconnection transmission structure according to claim 2 is characterized in that: The upper plate transmission structure is an 8-layer plate composed of 8 metal layers, and the lower plate transmission structure is a 4-layer plate composed of 4 metal layers.

4. The broadband SIP three-dimensional interconnection transmission structure according to claim 3 is characterized in that: The RF inner core of the first type of coaxial cable is a metallized through hole from the first metal layer to the eighth metal layer, the first grounding hole is a metallized through hole from the first metal layer to the eighth metal layer, and the second grounding hole is a metallized blind hole from the second metal layer to the eighth metal layer; The RF inner core of the second type of coaxial cable is a metallized through hole from the first metal layer to the fourth metal layer, the third grounding hole is a metallized through hole from the first metal layer to the fourth metal layer, and the fourth grounding hole is a metallized blind hole from the first metal layer to the second metal layer.

5. The broadband SIP three-dimensional interconnection transmission structure according to any one of claims 1 to 4, characterized in that: It also includes radio frequency ground holes and radio frequency holes, which are arranged around the coplanar waveguide and the strip line to ensure that the signal is transmitted in a relatively closed area.

6. The broadband SIP three-dimensional interconnection transmission structure according to any one of claims 1 to 4, characterized in that: The upper plate transmission structure and the lower plate transmission structure are both made of a high-frequency circuit board CLTE-XT.

7. The broadband SIP three-dimensional interconnection transmission structure according to any one of claims 1 to 4, characterized in that: The ball diameter of the ground ball is 0.5 mm, the ball spacing is 0.8 mm, and the central cross-sectional impedance of the ball array is 50 ohms.

8. The broadband SIP three-dimensional interconnection transmission structure according to any one of claims 1 to 4, characterized in that: The signal transmission direction of the coplanar waveguide and the signal transmission direction of the strip line are set to 180°.

9. The broadband SIP three-dimensional interconnection transmission structure according to any one of claims 1 to 4, characterized in that: The structural impedance of the first type coaxial and the second type coaxial is set to 50 ohms.

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