Novel crystal oscillator gluing and packaging device and packaging method

Abstract

The invention relates to the field of machinery, and particularly discloses a novel crystal oscillator gluing and packaging device, which comprises an adsorption device for adsorbing a wafer on a vibration disc and moving the wafer to a dispensing turnover mechanism for gluing; placing on a die bonding mechanism; the die bonding placing mechanism is used for placing the tray filled with the glued wafers into the material box device; the glue dispensing turnover mechanism is used for turning over a rubber suction nozzle to a glue disc device to be coated with glue by a turnover device; the overturning motor is fixed to one side face of the overturning transverse plate. The output end of the overturning motor penetrates through the overturning transverse plate and is fixed to the reverse side of the overturning fixing disc. One end of the overturning supporting arm is fixed to the center of the front face of the overturning fixing disc, one end of the overturning adjusting arm is fixed to one end of the first connecting piece, and the other end of the first connecting piece is fixed to the outer edge of the overturning fixing disc. One end of the turnover adjusting structure is fixed to the first hole of the turnover adjusting arm, and the other end of the turnover adjusting structure penetrates through the second hole of the turnover supporting arm, extends outwards and is fixed through an adjusting nut.

Description

Technical Field

[0001] The invention belongs to the field of machinery, and in particular relates to a novel crystal oscillator gluing packaging device and packaging method. Background Art

[0002] In the electronics manufacturing industry, the assembly of electronic components is a highly precise and complex process involving a variety of technologies and processes. In particular, in the process of coating components with colloid and mounting them on substrates, the specific operating procedures and materials used by different companies vary significantly, and these differences directly affect the quality and production efficiency of the final product. For example: the impact of the curing time of glue: The curing time of glue refers to the time required from coating to complete hardening. This parameter has a direct impact on the speed of the production line. Some fast-curing glues can improve production efficiency, but may also bring control challenges; while slow-curing glues, although providing a longer operating window period, will reduce overall productivity, and different companies have different glue curing times due to different glue properties; the corresponding glue adsorption equipment has different structures, and the same equipment cannot be used to adapt to different glue adsorption. Therefore, the existing technology has defects and needs to be improved. Summary of the invention

[0003] The present invention provides a novel crystal oscillator gluing packaging device and packaging method to solve the above-mentioned problems.

[0004] To solve the above problems, the technical solution provided by the present invention is as follows: a novel crystal oscillator gluing and packaging device, provided with an adsorption device: adsorbing the wafer on the vibration plate, moving it to the glue dispensing and flipping mechanism for gluing, and placing it on the crystal bonding mechanism;

[0005] Solid crystal placement mechanism: placing the tray filled with wafers after being coated with glue into the material box device, glue dispensing flipping mechanism: the flipping device flips the rubber suction nozzle to the glue disc device to apply glue; the flipping device is provided with a flipping motor, a flipping horizontal plate, a flipping fixed disc, a flipping support arm, a flipping adjustment arm and a flipping adjustment structure; the flipping motor is fixed on one side of the flipping horizontal plate; the output end of the flipping motor passes through the flipping horizontal plate and is fixed to the back side of the flipping fixed disc; one end of the flipping support arm is fixed to the center position of the front side of the flipping fixed disc, one end of the flipping adjustment arm is fixed to one end of the first connecting plate, and the other end of the first connecting plate is fixed to the outer edge of the flipping fixed disc; one end of the flipping adjustment structure is fixed to the first hole of the flipping adjustment arm, and the other end of the flipping adjustment structure passes through the second hole of the flipping support arm and extends outward, and is fixed by an adjusting nut.

[0006] Preferably, the flip adjustment structure includes a flip adjustment column, a flip adjustment spring and a flip nut; one end of the flip adjustment column is fixed on the flip adjustment arm, the other end of the flip adjustment column passes through the first hole and the second hole and extends outward, and the flip nut is sleeved on the outer wall of the flip adjustment column; the pitch of the flip nut matches the spacing between the first hole and the second hole.

[0007] Preferably, a photoelectric sensor is also provided on the transverse plate; a sensing element is also provided between the output end of the flip motor and the flip fixed disk; the sensing element cooperates with the photoelectric sensor; the sensing element is an arc-shaped structure.

[0008] Preferably; the flipping device also includes a flipping and lifting structure that can move the flipping horizontal plate up and down; the flipping and lifting structure is provided with a flipping fixed plate, a flipping and lifting motor, a tension spring and a cam; the protrusion on the flipping fixed plate cooperates with the slide groove on the flipping horizontal plate; one end of the tension spring is fixed to the upper end of the flipping fixed plate, and the other end of the tension spring is fixed to the lower end of the flipping horizontal plate; the flipping and lifting motor is fixed to the flipping fixed plate, and a third placement hole is provided on the flipping horizontal plate; the output end of the flipping and lifting motor passes through the flipping fixed plate and extends into the third placement hole, and the cam is placed in the third placement hole, and the cam is fixed to the end of the output end of the flipping and lifting motor;.

[0009] Preferably, the rubber disc device comprises a rubber disc bracket, a rubber disc motor, a rubber disc gear set, a rubber disc connecting shaft, a rubber disc rotating shaft and a rubber disc body; the bottom of the rubber disc bracket is fixed to the upper surface of the bracket, the rubber disc motor is fixed to the rubber disc bracket, the output end of the rubber disc motor is connected to the first gear shaft of the rubber disc gear assembly, the last gear of the rubber disc gear assembly is fixed to one end of the rubber disc connecting shaft, the other end of the rubber disc connecting shaft is fixed to the inner shaft of the rubber disc rotating shaft, and the outer shaft of the rubber disc rotating shaft is fixed to the rubber disc body;

[0010] A connecting ring is sleeved on the outer wall of the rubber disc connecting shaft, the outer wall of the connecting ring is fixed to one end of the second connecting piece, and the other end of the second connecting piece is fixed to the outer wall of the placement ring.

[0011] Preferably, the adsorption device comprises an adsorption mounting frame, a side surface of which is provided with an adsorption driving component, and at least one adsorption execution component is provided on the adsorption driving component so that the scattered wafers can be picked up by the adsorption execution component.

[0012] Preferably, the adsorption execution component includes an adsorption connecting plate, an adsorption mounting plate, an adsorption slide, a suction nozzle and a CCD camera, the adsorption connecting plate is arranged at the working end of the adsorption driving component, the adsorption slide is arranged on the adsorption connecting plate, the adsorption mounting plate is slidably connected to the adsorption connecting plate through the adsorption slide, the suction nozzle is arranged on the adsorption mounting plate, and the CCD camera is arranged on the adsorption mounting frame and is located above the suction nozzle.

[0013] Preferably, the solid crystal placement mechanism includes a placement shift platform, a placement workbench and a push plate assembly, the placement workbench is arranged on the placement shift platform, the placement workbench includes a placement bracket, a top plate assembly and a placement guide assembly, the placement guide assembly includes two material guide plates relatively arranged on the top of the placement bracket, the tops of the two material guide plates form a material transfer channel along their own length direction, the top plate assembly is arranged in the placement bracket, and the support plate used to place the wafer is lifted up by the top plate assembly, and the push plate assembly is arranged on the side of the placement bracket to push the support plate along the material transfer channel.

[0014] Preferably, the pushing plate assembly includes a pushing guide plate, a pushing motor, a pushing active wheel, a pushing driven wheel, a pushing support and a pushing rod, the pushing guide plate is arranged on the side of the placing bracket, the pushing motor is arranged at one end of the pushing guide plate close to the adsorption device, the pushing active wheel is arranged at the working end of the pushing motor, the pushing driven wheel is rotatably arranged at one end of the pushing guide plate away from the adsorption device, the pushing active wheel and the pushing driven wheel are linked by a connecting belt, the pushing support is slidably connected to the pushing guide plate, the upper part of the pushing support is connected to the connecting belt, and the pushing rod is arranged on the top of the pushing support.

[0015] Compared with the prior art, the beneficial effect is that the dispensing and flipping mechanism of the present invention has a novel structure and the advantages are as follows:

[0016] First, to solve the problem that different companies have different glue properties and different glue solidification times, the distance between the rubber nozzle and the glue is adjusted by flipping the connection relationship and characteristics of the adjustment structure and the connecting piece to adapt to the different glue stocks in the glue disc;

[0017] Second: The structure of the flip device, through the characteristics of the cam and the cooperation between the protrusion and the slide slot, makes the flip horizontal plate move up and down, through the connection method of the tension spring, the flip horizontal plate can automatically return to the initial position without using external force, the structure is ingenious. Make the flip horizontal plate move downward on the flip fixed plate through the cooperation between the protrusion and the slide slot.

[0018] Another object of the present invention is to provide a novel crystal oscillator gluing packaging method.

[0019] To achieve the above purpose, the present invention adopts the following technical solution: a new crystal oscillator glue packaging method, the steps of which are as follows:

[0020] S1: The vibration plate arranges the wafers to be coated in order;

[0021] S2: The adsorption slide drives the suction nozzle to move downward, picks up the wafer, and is driven by the adsorption drive component to move toward the working position of the dispensing flip mechanism;

[0022] S3: The flip motor works, driving the flip fixed plate to rotate, so that the flip support arm and the flip adjustment arm rotate. When the rubber nozzle on the flip adjustment arm rotates to the position of the rubber plate;

[0023] S4: the flip lifting motor works, the convex part of the cam contacts the bottom of the third placement hole, and the convex part applies downward pressure to the bottom of the third placement hole, so that the flip horizontal plate moves downward;

[0024] S5: The rubber nozzle on the flip adjustment arm is moved downward to apply glue to the wafer;

[0025] S6: After the glue is applied, the horizontal plate is flipped and moved up, and the adsorption drive component drives the adsorption slide to the support plate in the solid crystal placement mechanism.

[0026] The advantages of the crystal oscillator glue packaging method and the above-mentioned crystal oscillator glue packaging device over the prior art are similar and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the adsorption device of the present invention;

[0030] Figure 3 This is a schematic diagram of the structure of the adsorption execution component of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the rubber disc device of the present invention;

[0032] Figure 5 This is a schematic diagram of the dispensing flipping mechanism of the present invention;

[0033] Figure 6 It is a schematic diagram of the structure of the turning device of the present invention;

[0034] Figure 7 This is a schematic diagram of the structure of the solid crystal placement mechanism of the present invention;

[0035] Figure 8 This is a schematic diagram of the workbench structure of the present invention;

[0036] Fig. 9 This is a schematic diagram of the structure of the push plate assembly of the present invention;

[0037] Fig.10 It is a schematic diagram of the structure of the aggregate assembly of the present invention.

[0038] According to the above diagram: vibration plate-1; adsorption device-2; glue plate device-3; glue dispensing flip mechanism-4; solid crystal placement mechanism-5; adsorption mounting frame-21 ； Adsorption drive assembly-22; adsorption execution group-23; CCD camera-231; adsorption connection plate-232; adsorption slide-233; adsorption mounting plate-234; suction nozzle-235; glue tray bracket-31; glue tray motor-32; glue tray gear set-33; glue tray connecting shaft-34; glue tray rotating shaft-35; glue tray body-36; connecting piece-37; placing ring-38; flip horizontal plate-40; flip device-41; flip lifting structure-42; flip motor-411; flip fixed plate-412; flip support arm-413; flip adjustment arm-414; first connecting piece-415; flip adjustment structure-416; induction piece-417; photoelectric sensor Sensor-418; flip lifting motor-421; bump-422; tension spring-423; third placement hole-424; placement shift platform-51; placement workbench-52; top plate assembly-521; placement bracket-522; placement guide assembly-523; guide plate-524; push plate assembly-53; push guide plate-531; push driving wheel-532; push motor-533; push driven wheel-534; push support-535; push rod-536; positioning pin-537; support plate-54; collection assembly-55; collection drive member-551; collection seat-552; material box-553; guide bar-554; blocking member-555. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the present invention are provided in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "fixed", "integrally formed", "left", "right" and similar expressions used in this specification are for illustrative purposes only. In the drawings, units with similar structures are marked with the same reference numerals.

[0041] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0042] like Figure 1-10 As shown, one embodiment of the present invention is:

[0043] A new crystal oscillator gluing and packaging device, equipped with

[0044] Adsorption device 2: adsorbs the wafer on the vibration plate 1, moves it to the glue dispensing and flipping mechanism 4 to be glued, and places it on the crystal bonding mechanism;

[0045] Solid crystal placement mechanism 5: Place the tray filled with glued wafers into the material box device.

[0046] Glue dispensing and flipping mechanism 4: the flipping device 41 flips the rubber suction nozzle to the glue disc device 3 to apply glue;

[0047] The flipping device 41 is provided with a flipping motor 411, a flipping horizontal plate 40, a flipping fixed disk 412, a flipping support arm 413, a flipping adjustment arm 414 and a flipping adjustment structure 416; the flipping motor 411 is fixed on one side of the flipping horizontal plate 40; the output end of the flipping motor 411 passes through the flipping horizontal plate 40 and is fixed to the back side of the flipping fixed disk 412; one end of the flipping support arm 413 is fixed to the center position of the front side of the flipping fixed disk 412, one end of the flipping adjustment arm 414 is fixed to one end of the first connecting piece 415, and the other end of the first connecting piece 415 is fixed to the outer edge of the flipping fixed disk 412; one end of the flipping adjustment structure 416 is fixed to the first hole of the flipping adjustment arm 414, and the other end of the flipping adjustment structure 416 passes through the second hole of the flipping support arm 413 and extends outward, and is fixed by an adjusting nut.

[0048] It should be noted that: the flip motor 411 works, driving the flip fixing plate 412 to rotate, thereby rotating the flip support arm 413 and the flip adjustment arm 414. When the rubber suction nozzle on the flip adjustment arm 414 rotates to the position of the glue disc, the glue is adsorbed and continues to flip, thereby achieving reciprocating adsorption of the glue.

[0049] Embodiment 2; the flip adjustment structure 416 includes a flip adjustment column, a flip adjustment spring and a flip nut; one end of the flip adjustment column is fixed on the flip adjustment arm 414, the other end of the flip adjustment column passes through the first hole and the second hole and extends outward, and the flip nut is sleeved on the outer wall of the flip adjustment column; the pitch of the flip nut matches the spacing between the first hole and the second hole.

[0050] It should be noted that due to the difference in the quality of glue, some glue solidifies quickly, while some glue solidifies slowly; therefore, different types of glue have different injection amounts in the glue disc, so the distance between the rubber nozzle and the glue in the glue disc is different;

[0051] Therefore, the rubber suction nozzle can adapt to glue of different heights in the glue disc through the flip adjustment structure 416; the distance between the flip adjustment arm 414 and the flip support arm 413 is the adjustment distance: when the adjustment distance needs to be increased: by rotating the flip nut, the extension part of the flip adjustment column becomes smaller, because the pressure of the flip adjustment arm 414 and the flip support arm 413 on the flip adjustment spring is reduced, so that the flip adjustment spring causes the flip adjustment arm 414 to tilt outward due to its characteristics (because one end of the flip support arm 413 and one end of the flip support arm 413 are fixed to the center of the flip fixed disc 412, and one end of the flip adjustment arm 414 is fixed to the flip fixed disc 412 through a connecting piece, and the connecting piece is a flexible material that can be bent), so that the adjustment distance becomes larger; when the adjustment distance needs to be smaller, by rotating the flip nut, the extension part of the flip adjustment column becomes larger, so that the flip adjustment arm 414 fixed with one end of the flip adjustment column tilts toward the flip support arm 413, so that the adjustment distance becomes smaller.

[0052] When the adjustment distance becomes larger, the distance between the rubber nozzle and the rubber disc becomes closer; when the adjustment distance becomes smaller, the distance between the rubber nozzle and the rubber disc becomes farther.

[0053] Embodiment 3: A photoelectric sensor 418 is also provided on the horizontal plate; a sensing element 417 is also provided between the output end of the flip motor 411 and the flip fixed disk 412; the sensing element 417 cooperates with the photoelectric sensor 418; the sensing element 417 is an arc-shaped structure. It should be noted that: in order to accurately enable the rubber suction nozzle to absorb glue, the flip motor 411 drives the sensing element 417 to rotate. When the photoelectric sensor 418 senses the arc-shaped portion of the sensing element 417, it means that the rubber suction nozzle is in the glue sucking position above the glue disk. It is only necessary to move the flip device 41 downward to achieve the action of sucking glue; when the photoelectric sensor 418 cannot sense the arc-shaped portion of the sensing element 417, it means that the rubber suction nozzle is not in the glue sucking position of the glue disk. At this time, it is not necessary to move the flip device 41 downward.

[0054] Embodiment 4; The flipping device 41 also includes a flipping and lifting structure 42 that can move the flipping horizontal plate 40 up and down; the flipping and lifting structure 42 is provided with a flipping fixed plate, a flipping and lifting motor 421, a tension spring 423 and a cam; the protrusion 422 on the flipping fixed plate cooperates with the slide groove on the flipping horizontal plate 40; one end of the tension spring 423 is fixed to the upper end of the flipping fixed plate, and the other end of the tension spring 423 is fixed to the lower end of the flipping horizontal plate 40; the flipping and lifting motor 421 is fixed to the flipping fixed plate, and a third placement hole 424 is provided on the flipping horizontal plate 40; the output end of the flipping and lifting motor 421 passes through the flipping fixed plate and extends into the third placement hole 424, the cam is placed in the third placement hole 424, and the cam is fixed to the end of the output end of the flipping and lifting motor 421;.

[0055] It should be noted that: when the flip lifting motor 421 is working, the cam rotates in the third placement hole 424. When the convex part of the cam contacts the bottom of the third placement hole 424, the convex part applies downward pressure to the bottom of the third placement hole 424, and the corresponding tension spring 423 is stretched, so that the flip horizontal plate 40 moves downward on the flip fixed plate through the cooperation of the protrusion 422 and the slide groove. When the convex part of the cam leaves the bottom of the third placement hole 424, due to the characteristics of the tension spring 423, the flip horizontal plate 40 is pulled upward on the flip fixed plate, so that the device returns to its initial state.

[0056] Embodiment 5; the rubber disc device 3 comprises a rubber disc bracket, a rubber disc motor, a rubber disc gear set, a rubber disc connecting shaft, a rubber disc rotating shaft and a rubber disc body; the bottom of the rubber disc bracket is fixed to the upper surface of the bracket, the rubber disc motor is fixed to the rubber disc bracket, the output end of the rubber disc motor is connected to the first gear shaft of the rubber disc gear assembly, the last gear of the rubber disc gear assembly is fixed to one end of the rubber disc connecting shaft, the other end of the rubber disc connecting shaft is fixed to the inner shaft of the rubber disc rotating shaft, and the outer shaft of the rubber disc rotating shaft is fixed to the rubber disc body;

[0057] A connecting ring is sleeved on the outer wall of the rubber disc connecting shaft, the outer wall of the connecting ring is fixed to one end of the second connecting piece, and the other end of the second connecting piece is fixed to the outer wall of the placement ring.

[0058] It should be noted that: when the glue disc motor works, the first gear of the glue disc gear group rotates, thereby driving the entire glue disc gear group to rotate, and finally the gear drives the glue disc connecting shaft to rotate, and the other end of the glue disc connecting shaft drives the inner shaft of the glue disc rotating shaft to rotate; the glue disc connecting shaft drives the connecting piece to rotate, stirring the glue in the glue disc, thereby reducing the solidification time, and the rubber suction nozzle moves down to the inside of the placement ring to suck glue to prevent the suction nozzle from absorbing too much glue.

[0059] Embodiment 6: The adsorption device comprises an adsorption mounting frame 21 , a side surface of which is provided with an adsorption driving component 22 , and at least one adsorption execution component 23 is provided on the adsorption driving component 22 , so that the adsorption execution component 23 can pick up the scattered wafers.

[0060] The adsorption execution component 23 includes an adsorption connection plate 232, an adsorption mounting plate 234, an adsorption slide 233, a suction nozzle 235 and a CCD camera 231. The adsorption connection plate 232 is arranged at the working end of the adsorption driving component 22, the adsorption slide 233 is arranged on the adsorption connection plate 232, the adsorption mounting plate 234 is slidably connected to the adsorption connection plate 232 through the adsorption slide 233, the suction nozzle 235 is arranged on the adsorption mounting plate 234, and the CCD camera 231 is arranged on the adsorption mounting frame 21 and is located above the suction nozzle 235.

[0061] It should be noted that: the adsorption slide 233 is a slide cylinder, the adsorption mounting plate 234 is arranged on the front side of the adsorption connecting plate 232, and the suction nozzle 235 is driven to move up and down by the adsorption slide 233. The CCD camera 231 is located above the material dividing mechanism 1. The CCD camera component 231 detects the wafer to determine whether the wafer is a defective product. If it is a defective wafer, it will be placed in a waste box; if there is no problem with the product, the suction nozzle 235 will be driven downward by the adsorption slide 233 to pick up the component.

[0062] Embodiment 6; The die bonding placement mechanism 5 includes a placement shifting platform 51, a placement workbench 52 and a push plate assembly 53. The placement workbench 52 is arranged on the placement shifting platform 51. The placement workbench 52 includes a placement bracket 522, a top plate assembly 521 and a placement guiding assembly 523. The placement guiding assembly 523 includes two guiding plates 524 oppositely arranged on the top of the placement bracket 522. The tops of the two guiding plates 524 form a material passing channel along their own length directions. The top plate assembly 521 is arranged inside the placement bracket 522, and a pallet 54 for placing a wafer is lifted by the top plate assembly 521. The push plate assembly 53 is arranged on the side of the placement bracket 522 to push the pallet 54 along the material passing channel.

[0063] The push plate assembly 53 includes a push material guiding plate 531, a push material motor 533, a push material driving wheel 532, a push material driven wheel 534, a push material support 535 and a push material rod 536. The push material guiding plate 531 is arranged on the side of the placement bracket 522. The push material motor 533 is arranged at one end of the push material guiding plate 531 close to the adsorption device. The push material driving wheel 532 is arranged at the working end of the push material motor 533. The push material driven wheel 534 is rotatably arranged at one end of the push material guiding plate 531 far from the adsorption device 2. The push material driving wheel 532 and the push material driven wheel 534 are linked by a connecting belt. The push material support 535 is slidably connected with the push material guiding plate 531. The upper part of the push material support 535 is connected with the connecting belt. The push material rod 536 is arranged on the top of the push material support 535.

[0064] It should be noted that: The placement shifting platform 51 is composed of an X-axis shifting component and a Y-axis shifting component, and drives the placement workbench 52 to move in the X and Y directions in a cylinder driving mode.

[0065] Specifically, the placement bracket 522 is a U-shaped structure with an upward opening, and the left and right sides are support plates, forming a front-back through material passing channel at the top of the placement bracket 522. The top plate assembly 521 includes a lifting cylinder and a lifting positioning plate. The lifting cylinder is installed at the bottom of the placement bracket 522. The bottom of the lifting positioning plate is connected with the working end of the lifting cylinder. The pallet 54 placed on the lifting positioning plate is lifted by the lifting cylinder, so that the upper pallet 54 is located in the material passing channel at the top of the placement bracket 522, and the push plate assembly 53 positions the pallet 54, and then the adsorption device 2 moves the glued components into the pallet 54.

[0066] The pushing plate assembly 53 includes a pushing guide plate 531, a pushing motor 533, a pushing active wheel 532, a pushing driven wheel 534, a pushing support 535 and a pushing rod 536. The pushing guide plate 531 is arranged on the side of the placing bracket 522, the pushing motor 533 is arranged at the end of the pushing guide plate 531 close to the adsorption device 2, the pushing active wheel 532 is arranged at the working end of the pushing motor 533, and the pushing driven wheel 534 is rotatably arranged at the end of the pushing guide plate 531 away from the adsorption device 2. The pushing active wheel 532 and the pushing driven wheel 534 are linked by a connecting belt, the pushing support 535 is slidably connected to the pushing guide plate 531, the upper part of the pushing support 535 is connected to the connecting belt, and the pushing rod 536 is arranged on the top of the pushing support 535.

[0067] The pushing motor 533 is a stepping motor, and the pushing guide plate 531 is arranged on the right side of the placing bracket 522. The pushing motor 533 is arranged on the rear side of the pushing guide plate 531. The pushing motor 533 drives the pushing active wheel 532 to rotate, so as to drive the pushing support 535 to move forward and backward along the pushing guide plate 531, and then the pushing rod 536 is pushed forward along the material passing channel with the support plate 54.

[0068] A positioning pin 537 is provided at one end of the pushing rod 536 away from the pushing support 535. When the pallet 54 placed on the lifting positioning plate is lifted up by the lifting cylinder, the CCD camera 231 located above the placing workbench 52 detects the pallet 54. The pushing motor 533 drives the pushing rod 536 to move. When the pallet 54 is pushed into the material transfer channel by the lifting cylinder, the positioning pin 537 of the pushing rod 536 is inserted into the positioning hole of the pallet 54 to realize the positioning of the pallet 54. A material collection assembly 55 is arranged on the side of the placement workbench 52 away from the adsorption device 2, and the material collection assembly 55 includes a material collection drive 551, a material collection seat 552, a material box 553 and a blocking member 555. The material collection seat 552 is arranged at the working end of the material collection drive 551, and the material box 553 is detachably arranged on the material collection seat 552. The material box 553 is provided with a through material opening, and a plurality of symmetrical material guide strips 554 are arranged on both sides of the material box 553 adjacent to the material opening, and the blocking member 555 is arranged on the side of the material box 553 away from the push plate assembly 53.

[0069] The material collecting driving member 551 is arranged at the front side of the placing workbench 52, and is a linear slide cylinder, which drives the material box 553 to move up and down. The front and rear ends of the material box 553 are connected, and the material collecting driving member 551 lifts the material box 553 so that the uppermost material guide strip 554 is aligned with the material transfer channel at the top of the placing bracket 522, and the pushing motor 533 drives the pushing support 535 to move forward along the pushing guide plate 531, so that the pushing rod 536 pushes the support plate 54 forward along the material transfer channel, so that the support plate 54 carrying the adhesive components is pushed into the material box 553 from the material port along the material guide strip 554, and then the material collecting driving member 551 lifts the material box 553 for a certain distance, so that the second layer of the material guide strip 554 is aligned with the material transfer channel at the top of the placing bracket 522, so as to collect the second layer of materials, and this is repeated to fill the material box 553.

[0070] The blocking member 555 includes a blocking cylinder and a blocking block arranged on the blocking cylinder. The blocking cylinder is arranged on the front side of the material collecting seat 552, and the blocking block is located at the material port on the front side of the material box 553. When the pushing motor 533 drives the pushing rod 536 to push the support plate 54 forward into the material box 553, the blocking block prevents the support plate 54 from moving forward excessively.

[0071] Embodiment 7: A novel crystal oscillator gluing packaging method, the steps are as follows:

[0072] S1: The vibration plate arranges the wafers to be coated in order;

[0073] S2: The adsorption slide (233) drives the suction nozzle (235) to move downward, picks up the wafer, and is driven by the adsorption drive component (22) to move toward the working position of the dispensing flip mechanism (3);

[0074] S3: The flip motor works, driving the flip fixed plate to rotate, so that the flip support arm and the flip adjustment arm rotate. When the rubber nozzle on the flip adjustment arm rotates to the position of the rubber plate;

[0075] S4: the flip lifting motor works, the convex part of the cam contacts the bottom of the third placement hole, and the convex part applies downward pressure to the bottom of the third placement hole, so that the flip horizontal plate moves downward;

[0076] S5: The rubber nozzle on the flip adjustment arm is moved downward to apply glue to the wafer;

[0077] S6: After the glue coating is completed, the horizontal plate is turned over and moved upward, and the adsorption drive assembly (22) drives the adsorption slide (233) onto the support plate (54) of the solid crystal placement mechanism.

[0078] It should be noted that the above-mentioned technical features are further combined with each other to form various embodiments not listed above, which are all deemed to be within the scope of the present invention; and, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A novel crystal oscillator gluing and packaging device, characterized in that; Features Adsorption device: adsorbs the wafer on the vibration plate, moves it to the glue dispensing and flipping mechanism to apply glue, and places it on the crystal bonding mechanism; Solid crystal placement mechanism: placing the tray filled with wafers after glue coating into the material box device, glue dispensing flipping mechanism: the flipping device flips the rubber suction nozzle to the glue disc device to apply glue; the glue dispensing flipping mechanism includes a flipping device and a glue disc device; the flipping device is provided with a flipping motor, a flipping horizontal plate, a flipping fixed disc, a flipping support arm, a flipping adjustment arm and a flipping adjustment structure; the flipping motor is fixed on one side of the flipping horizontal plate; the output end of the flipping motor passes through the flipping horizontal plate and is fixed to the back side of the flipping fixed disc; one end of the flipping support arm is fixed to the center position of the front side of the flipping fixed disc, one end of the flipping adjustment arm is fixed to one end of the first connecting plate, and the other end of the first connecting plate is fixed to the outer edge of the flipping fixed disc; one end of the flipping adjustment structure is fixed to the first hole of the flipping adjustment arm, and the other end of the flipping adjustment structure passes through the second hole of the flipping support arm and extends outward, and is fixed by an adjusting nut.

2. A novel crystal oscillator glue packaging device according to claim 1, characterized in that: The flip adjustment structure includes a flip adjustment column, a flip adjustment spring and a flip nut; One end of the flip adjustment column is fixed on the flip adjustment arm, and the other end of the flip adjustment column passes through the first hole and the second hole and extends outward, and the flip nut is sleeved on the outer wall of the flip adjustment column; the pitch of the flip nut matches the spacing between the first hole and the second hole.

3. A novel crystal oscillator glue packaging device according to claim 2, characterized in that: The horizontal plate is also provided with a photoelectric sensor; an induction element is also provided between the output end of the flip motor and the flip fixed plate; the induction element cooperates with the photoelectric sensor; The induction element is an arc-shaped structure.

4. A novel crystal oscillator glue packaging device according to claim 1, characterized in that: The flipping device also includes a flipping and lifting structure that can move the flipping horizontal plate up and down; the flipping and lifting structure is provided with a flipping fixed plate, a flipping and lifting motor, a tension spring and a cam; the protrusion on the flipping fixed plate cooperates with the slide groove on the flipping horizontal plate; one end of the tension spring is fixed to the upper end of the flipping fixed plate, and the other end of the tension spring is fixed to the lower end of the flipping horizontal plate; the flipping and lifting motor is fixed to the flipping fixed plate, and a third placement hole is provided on the flipping horizontal plate; the output end of the flipping and lifting motor passes through the flipping fixed plate and extends into the third placement hole, the cam is placed in the third placement hole, and the cam is fixed to the end of the output end of the flipping and lifting motor.

5. According to the novel crystal oscillator glue packaging device of claim 1, it is characterized by: The glue disc device comprises a glue disc bracket, a glue disc motor, a glue disc gear set, a glue disc connecting shaft, a glue disc rotating shaft and a glue disc body; the bottom of the glue disc bracket is fixed to the upper surface of the bracket, the glue disc motor is fixed to the glue disc bracket, the output end of the glue disc motor is connected to the first gear shaft of the glue disc gear assembly, the last gear of the glue disc gear assembly is fixed to one end of the glue disc connecting shaft, the other end of the glue disc connecting shaft is fixed to the inner shaft of the glue disc rotating shaft, and the outer shaft of the glue disc rotating shaft is fixed to the glue disc body; A connecting ring is sleeved on the outer wall of the rubber disc connecting shaft, the outer wall of the connecting ring is fixed to one end of the second connecting piece, and the other end of the second connecting piece is fixed to the outer wall of the placement ring.

6. A novel crystal oscillator glue packaging device according to claim 1, characterized in that: The adsorption device comprises an adsorption mounting frame, a side surface of which is provided with an adsorption driving component, and at least one adsorption execution component is provided on the adsorption driving component so that the scattered wafers can be picked up by the adsorption execution component.

7. A novel crystal oscillator glue packaging device according to claim 6, characterized in that: The adsorption execution component includes an adsorption connecting plate, an adsorption mounting plate, an adsorption slide, a suction nozzle and a CCD camera. The adsorption connecting plate is arranged on the working end of the adsorption driving component, the adsorption slide is arranged on the adsorption connecting plate, the adsorption mounting plate is slidably connected to the adsorption connecting plate through the adsorption slide, the suction nozzle is arranged on the adsorption mounting plate, and the CCD camera is arranged on the adsorption mounting frame and is located above the suction nozzle.

8. A novel crystal oscillator glue packaging device according to claim 1, characterized in that: The solid crystal placement mechanism includes a placement shift platform, a placement workbench and a push plate assembly. The placement workbench is arranged on the placement shift platform. The placement workbench includes a placement bracket, a top plate assembly and a placement guide assembly. The placement guide assembly includes two guide plates relatively arranged on the top of the placement bracket. The tops of the two guide plates form a material transfer channel along their own length directions. The top plate assembly is arranged in the placement bracket. The support plate used to place the wafer is lifted up by the top plate assembly. The push plate assembly is arranged on the side of the placement bracket to push the support plate along the material transfer channel.

9. A novel crystal oscillator glue packaging device according to claim 8, characterized in that: The pushing plate assembly includes a pushing guide plate, a pushing motor, a pushing active wheel, a pushing driven wheel, a pushing support and a pushing rod. The pushing guide plate is arranged on the side of the placing bracket, the pushing motor is arranged at an end of the pushing guide plate close to the adsorption device, the pushing active wheel is arranged at the working end of the pushing motor, and the pushing driven wheel is rotatably arranged at an end of the pushing guide plate away from the adsorption device. The pushing active wheel and the pushing driven wheel are linked by a connecting belt, the pushing support is slidably connected to the pushing guide plate, the upper part of the pushing support is connected to the connecting belt, and the pushing rod is arranged on the top of the pushing support.

10. A novel crystal oscillator gluing packaging method, characterized in that; According to a novel crystal oscillator glue packaging device according to any one of claims 1 to 9, the steps are as follows: S1: The vibration plate arranges the wafers to be coated in order; S2: The adsorption slide drives the suction nozzle to move downward, picks up the wafer, and is driven by the adsorption drive component to move toward the working position of the dispensing flip mechanism; S3: The flip motor works, driving the flip fixed plate to rotate, so that the flip support arm and the flip adjustment arm rotate. When the rubber nozzle on the flip adjustment arm rotates to the position of the rubber plate; S4: the flip lifting motor works, the convex part of the cam contacts the bottom of the third placement hole, and the convex part applies downward pressure to the bottom of the third placement hole, so that the flip horizontal plate moves downward; S5: The rubber nozzle on the flip adjustment arm is moved downward to apply glue to the wafer; S6: After the glue is applied, the horizontal plate is flipped and moved up, and the adsorption drive component drives the adsorption slide to the support plate in the solid crystal placement mechanism.

Images