High-integration low-cost communication transceiver

Abstract

A high-integration low-cost communication transceiving device comprises a baseband module and a radio frequency module, the baseband module is used for signal processing and communication with external equipment, the radio frequency module is used for signal transceiving, the baseband module is connected with the radio frequency module through a connector, the baseband module comprises a plurality of layers of printed boards, and the printed boards are connected with the radio frequency module through a connector. The plurality of layers of printed boards are connected through flexible boards, and the plurality of layers of printed boards are used for establishing a communication channel with external equipment, providing a power supply for the baseband module of the communication transceiving device, modulating, demodulating, coding and decoding signals and transmitting signals with the radio frequency module. Through the arrangement of the baseband module and the radio frequency module, the integration level of the communication transceiving device is improved, the overall size is reduced, the FLASH chip is used in the baseband module, the operation convenience of program and parameter modification and updating of the communication transceiving device is simplified, the practicability of the communication transceiving device is integrally improved, and the application range of the communication transceiving device is integrally expanded.

Description

Technical Field

[0001] The present invention belongs to the technical field of wireless communication, and in particular relates to a highly integrated and low-cost communication transceiver. Background Art

[0002] A communication transceiver is an electronic device that responds within a specified delay time when receiving a radio inquiry signal and then generates a reply signal. It has the function of receiving and sending signals. Such devices are widely used in aerospace, wireless communications, measurement and testing and other fields. A communication transceiver usually includes a baseband module, a radio frequency module and an antenna module. The main function of the baseband module is to perform frequency conversion, modulation and demodulation, encoding and decoding on the received radio frequency signal. The function of the radio frequency module is to up-convert and down-convert the signal. The function of the antenna is to receive and send signals.

[0003] With the development of science and technology, higher requirements are put forward for communication transceivers, requiring low product cost, meeting the use requirements of different scenarios, and being easy to carry. To facilitate carrying, the volume should be small, and high integration is required. However, traditional design methods cannot meet the above requirements. The designed communication transceivers have problems such as low integration, large volume, high cost, and inconvenience in carrying, which cannot meet existing needs.

[0004] For example, the patent document with publication number CN112333676B specifically discloses a wireless data transceiver module and a communication method, which relate to the field of communication technology and solve the problem that the original data of fitness equipment cannot be instantly transferred to the terminal through wireless communication. The wireless data transceiver module includes a serial communication interface, a wireless communication unit, a processor and a memory; the serial communication interface is used to connect to the first port of the first device through a cable; the wireless data transceiver module cannot obtain information that can be used to identify the model and / or brand of the first device from the first port of the first device through the serial communication interface; the wireless communication unit is used to connect to the terminal wirelessly; the memory is used to store information that can be used to identify the model and / or brand of the first device; when the wireless communication unit is wirelessly connected to the terminal, the processor is used to read the model and / or brand of the first device from the memory, and send the model and / or brand of the first device to the terminal through the wireless communication unit; the processor is also used to obtain data from the first device from the first port of the first device through the serial communication interface, and send data from the first device to the terminal through the wireless communication unit. The function realization of the wireless data transceiver module is composed of various functional modules assembled, with low integration and large volume. In addition, due to the complex structure, each functional module is relatively independent, the production cost is high, and the application range is narrow.

[0005] In summary, the prior art does not solve the technical problems that the communication transceiver has low integration, large size, high cost and needs to meet multiple application fields. Therefore, it is necessary to design a communication transceiver with high integration, small size, low cost and can meet multiple application fields. Summary of the invention

[0006] To solve the above technical problems, the present application provides a highly integrated and low-cost communication transceiver device, including a baseband module and a radio frequency module, wherein the baseband module is used for signal processing and establishing communication with external equipment, and the radio frequency module is used for signal transmission and reception, and the baseband module and the radio frequency module are connected through a connector, and the baseband module includes a multi-layer printed board, and the multi-layer printed boards are connected through a flexible board, and the multi-layer printed board is used to establish a communication channel with external equipment, provide power for the baseband module of the communication transceiver device, modulate and demodulate signals, encode and decode signals, and transmit signals with the radio frequency module.

[0007] Furthermore, the function of establishing a communication channel between the multilayer printed circuit board and the external device is realized through a serial communication chip and a JTAG interface.

[0008] Furthermore, the function of the multilayer printed circuit board to provide power to the baseband module of the communication transceiver device is realized through a power module circuit board.

[0009] Furthermore, the functions of the multilayer printed circuit board for modulating, demodulating and encoding signals are realized through a signal processing module circuit board.

[0010] Furthermore, the signal processing module circuit board realizes the functions of modulating, demodulating and encoding signals through an FPGA chip, a FLASH chip and a crystal oscillator chip.

[0011] Furthermore, the FLASH chip is used to store programs and important parameters, which is convenient for reading, writing and updating.

[0012] Furthermore, the function of transmitting signals between the multilayer printed circuit board and the radio frequency module is realized through an AD signal acquisition module circuit board.

[0013] Furthermore, the multilayer printed circuit board includes a first layer of printed circuit boards, a second layer of printed circuit boards, a third layer of printed circuit boards and a fourth layer of printed circuit boards, the first layer of printed circuit boards realizes establishing a communication channel with external equipment, the second layer of printed circuit boards realizes providing power for a baseband module of a communication transceiver device, the third layer of printed circuit boards realizes modulation, demodulation and encoding of signals, and the fourth layer of printed circuit boards realizes signal transmission with the radio frequency module.

[0014] Furthermore, the radio frequency module includes a microwave transceiver module and a heat dissipation module, the heat dissipation module is arranged at the bottom of the radio frequency module, and the microwave transceiver module is arranged above the heat dissipation module.

[0015] Furthermore, the microwave transceiver module is provided with an antenna for receiving the signal transmitted by the signal source, and the microwave transceiver module performs signal transmission with the AD signal acquisition module circuit board.

[0016] The beneficial effects of the present invention are as follows: by setting the communication transceiver device as a baseband module and a radio frequency module, the functions of establishing a communication channel with an external device, providing power for the baseband module of the communication transceiver device, modulating and demodulating signals, encoding and decoding signals, and transmitting signals with the radio frequency module are integrated on a multi-layer printed circuit board to form a baseband module, and an AD signal acquisition module circuit board, a signal processing module circuit board, a power module circuit board and a serial communication chip are used to implement the above functions, which greatly reduces the size of the communication transceiver device, improves the integration of the communication transceiver device, can meet the requirements of multi-scenario applications, and has a simple integrated structure and low production cost. By using a FLASH chip in the baseband module, the operational convenience of modifying and updating the program and parameters of the communication transceiver device is simplified, and the practicality and scope of application of the communication transceiver device are improved as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a highly integrated and low-cost communication transceiver device provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0018] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0019] The embodiment of the present invention provides a highly integrated and low-cost communication transceiver, including a baseband module and a radio frequency module. The baseband module is used for signal processing and establishing communication with external equipment, and the radio frequency module is used for signal transmission and reception. The baseband module and the radio frequency module are connected through a connector. The baseband module includes a multi-layer printed board, and the multi-layer printed boards are connected through a flexible board. The multi-layer printed board is used to establish a communication channel with external equipment, provide power for the baseband module of the communication transceiver, modulate and demodulate signals, encode and decode signals, and transmit signals with the radio frequency module. The use of a flexible board connection greatly compresses the volume of the communication transceiver, and the external equipment, such as a host computer.

[0020] In this embodiment, the function of establishing a communication channel between the multilayer printed circuit board and the external device is realized through a serial communication chip and a JTAG interface. The serial communication chip is used to establish a communication channel with the external device, and the JTAG interface is used to debug and burn programs with the external device.

[0021] In this embodiment, the function of the multilayer printed circuit board to provide power for the baseband module of the communication transceiver device is realized by a power module circuit board. The power module circuit board takes an external power signal as input and outputs multiple power signals.

[0022] In this embodiment, the functions of the multilayer printed circuit board for modulating, demodulating and encoding signals are realized through a signal processing module circuit board.

[0023] In this embodiment, the functions of the signal processing module circuit board to modulate, demodulate and encode signals are realized through an FPGA chip, a FLASH chip and a crystal oscillator chip.

[0024] In this embodiment, the FLASH chip is used to store programs and important parameters for easy reading, writing and updating.

[0025] The FLASH chip can store programs and key parameters inside. After the product is powered on, the corresponding parameters can be extracted from the FLASH and written into the program.

[0026] The advantage of using FLASH chip is that if the key parameters in FLASH are modified, there is no need to re-update the program, only the parameters in the FLASH chip need to be changed. As we all know, the FPGA program update requires code changes, re-layout and wiring, and a lot of time is needed to generate a bit or bin file that can be burned into the FPGA chip. However, if the key parameters are written into the FLASH chip, if only the parameters need to be changed, the parameters of the FLASH can be changed directly, and then the power is turned off and then turned on again, and the new parameters written in the FLASH chip can be re-extracted into the software for operation.

[0027] In this embodiment, the function of transmitting signals between the multilayer printed circuit board and the radio frequency module is realized through an AD signal acquisition module circuit board.

[0028] The AD signal acquisition module circuit board transmits the received signal after frequency reduction by the RF module to the signal processing module circuit board; the AD signal acquisition module circuit board transmits the received signal sent by the signal processing module circuit board to the RF module.

[0029] In this embodiment, the multilayer printed circuit board includes a first layer of printed circuit boards, a second layer of printed circuit boards, a third layer of printed circuit boards and a fourth layer of printed circuit boards. The first layer of printed circuit boards is used to establish a communication channel with an external device, the second layer of printed circuit boards is used to provide power for a baseband module of a communication transceiver device, the third layer of printed circuit boards is used to modulate, demodulate and encode signals, and the fourth layer of printed circuit boards is used to transmit signals with the radio frequency module, thereby achieving high integration and small size.

[0030] In this embodiment, the RF module includes a microwave transceiver module and a heat dissipation module. The heat dissipation module is arranged at the bottom of the RF module, and the microwave transceiver module is arranged above the heat dissipation module. Because the communication transceiver device has a high degree of integration and a small volume, the generated heat is difficult to dissipate. Therefore, the heat dissipation module, such as a fan, is arranged to dissipate the heat of the communication transceiver device to prevent excessive temperature from affecting product performance.

[0031] In this embodiment, the microwave transceiver module is provided with an antenna for receiving the signal transmitted by the signal source, and the microwave transceiver module performs signal transmission with the AD signal acquisition module circuit board.

[0032] The above disclosure is only a specific embodiment of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A highly integrated and low-cost communication transceiver device, characterized in that: It includes a baseband module and a radio frequency module. The baseband module is used for signal processing and establishing communication with external equipment, and the radio frequency module is used for signal transmission and reception. The baseband module and the radio frequency module are connected through a connector. The baseband module includes a multi-layer printed board, and the multi-layer printed boards are connected through a flexible board. The multi-layer printed board is used to establish a communication channel with external equipment, provide power for the baseband module of the communication transceiver device, modulate and demodulate signals, encode and decode signals, and transmit signals with the radio frequency module.

2. The highly integrated and low-cost communication transceiver device according to claim 1, characterized in that: The function of establishing a communication channel between the multilayer printed board and external equipment is realized through a serial communication chip and a JTAG interface.

3. The highly integrated and low-cost communication transceiver device according to claim 1, characterized in that: The function of the multilayer printed board to provide power to the baseband module of the communication transceiver device is realized through the power module circuit board.

4. The highly integrated and low-cost communication transceiver device according to claim 1, characterized in that: The functions of the multilayer printed board for modulating, demodulating and encoding signals are realized through a signal processing module circuit board.

5. The highly integrated and low-cost communication transceiver device as claimed in claim 4, characterized in that: The signal processing module circuit board performs the functions of modulating, demodulating and encoding signals through an FPGA chip, a FLASH chip and a crystal oscillator chip.

6. The highly integrated and low-cost communication transceiver device according to claim 5, characterized in that: The FLASH chip is used to store programs and important parameters, which is easy to read, write and update.

7. The highly integrated and low-cost communication transceiver device according to claim 6, characterized in that: The function of transmitting signals between the multilayer printed circuit board and the radio frequency module is realized through the AD signal acquisition module circuit board.

8. The highly integrated and low-cost communication transceiver device according to claim 1, characterized in that: The multilayer printed circuit board includes a first layer of printed circuit boards, a second layer of printed circuit boards, a third layer of printed circuit boards and a fourth layer of printed circuit boards. The first layer of printed circuit boards is used to establish a communication channel with external equipment, the second layer of printed circuit boards is used to provide power for a baseband module of a communication transceiver device, the third layer of printed circuit boards is used to modulate, demodulate and encode signals, and the fourth layer of printed circuit boards is used to transmit signals with the radio frequency module.

9. The highly integrated and low-cost communication transceiver device according to claim 1, characterized in that: The radio frequency module includes a microwave transceiver module and a heat dissipation module. The heat dissipation module is arranged at the bottom of the radio frequency module, and the microwave transceiver module is arranged above the heat dissipation module.

10. The highly integrated and low-cost communication transceiver device according to claim 9, characterized in that: The microwave transceiver module is provided with an antenna for receiving the signal transmitted by the signal source, and the microwave transceiver module transmits signals with the AD signal acquisition module circuit board.

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