Operation control method, device and system based on circuit board etching tin stripping equipment

Abstract

The invention relates to an operation control method, device and system based on circuit board etching tin stripping equipment. The method comprises the following steps: acquiring a processing flow of a target circuit board; wherein the treatment process reflects the indicated tin stripping device; controlling the etching processing device and the indicated tin stripping device to process the target circuit board; receiving image detection data about the target circuit board output by the detection device; determining that the image detection data represents a first area of the target circuit board which is not subjected to complete tin stripping; according to the first relative position of the first area and the target circuit board, a specific tin stripping device is controlled to carry out set tin stripping treatment on the target circuit board; wherein the at least two tin stripping devices comprise specific tin stripping devices.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the technical field of circuit board processing, and more specifically, to an operation control method, device and system based on circuit board etching and tin stripping equipment. Background Art

[0002] With the development of automation and intelligent technology, for the etching and detinning process of circuit boards, the circuit boards can be etched by using the corresponding etching processing device first, and then the detinning device can be used to detin the circuit boards. At present, due to the complex wiring of some circuit boards, a single detinning process of the detinning device will still have residual tin, which requires these circuit boards to be reallocated to the detinning device for detinning, affecting the efficiency of batch processing of circuit boards. Summary of the invention

[0003] One purpose of the embodiments of the present disclosure is to provide a new technical solution for the operation control of circuit board etching and desoldering equipment.

[0004] According to a first aspect of the present disclosure, an operation control method based on a circuit board etching and tin stripping device is provided. The circuit board etching and tin stripping system includes an etching processing device, at least two tin stripping devices, a detection device and a control device. The etching processing device, the at least two tin stripping devices, and the detection device are respectively connected to the control device for communication. The control device is the execution subject of the method. The method includes: Obtaining a processing flow of a target circuit board; wherein the processing flow reflects the indicated desoldering device; Controlling the etching processing device and the indicated tin stripping device to process the target circuit board; receiving image detection data about the target circuit board output by the detection device; Determining that the image detection data represents a first area of ​​the target circuit board where the solder is not completely stripped; According to a first relative position between the first area and the target circuit board, a specific tin stripping device is controlled to perform a set tin stripping process on the target circuit board; wherein the at least two tin stripping devices include a specific tin stripping device.

[0005] Optionally, the specific desoldering device includes a desoldering operation table, a desoldering knife brush and a driving component, the desoldering operation table is provided with a desoldering area for placing a circuit board, the desoldering knife brush is provided on the driving component, and the driving component is used to switch the desoldering knife brush to an indicated desoldering partition and drive the desoldering knife brush to desolder in the indicated desoldering partition; wherein the indicated desoldering partition is part of the desoldering area; according to the first relative position of the first area and the target circuit board, controlling the specific desoldering device to perform a set desoldering process on the target circuit board includes: Determine a second relative position between the first area and the desoldering area according to a preset mapping relationship and a first relative position between the first area and the target circuit board; wherein the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; Determine a first detinning zone of the first region in the detinning area according to the second relative position; Obtaining a moving trajectory of the driving component according to the position nodes respectively corresponding to the first desoldering zones; The movement trajectory is sent to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in the set order according to the movement trajectory, and controls the tin stripping knife brush to remove the tin at the corresponding position node.

[0006] Optionally, determining that the image detection data represents a first area of ​​the target circuit board where the solder is not completely stripped includes: Determine a second area in the image detection data that matches a set color; determining the shortest separation distance between each of the second areas; The second areas whose shortest interval distance is within the set distance are combined into the first area.

[0007] Optionally, the driving component includes a horizontal moving component and a vertical moving component, the horizontal moving component is used to drive the detinning brush to move to the indicated detinning partition, and the detinning brush is arranged on the telescopic part of the vertical moving component; The sending of the movement trajectory to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in the set sequence according to the movement trajectory, and controls the tin stripping knife to remove tin at the corresponding position node, including: The moving trajectory and the pre-stored thickness information about the target circuit board are sent to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position node in the set order, and the specific desoldering device controls the movement of the telescopic part of the vertical moving component according to the thickness information, and controls the desoldering knife to remove the tin at the corresponding position node.

[0008] Optionally, the detinning brush moves back and forth along a first direction to achieve detinning; and obtaining the moving trajectory of the driving component according to the position nodes respectively corresponding to the first detinning partitions includes: Determine adjacent first position nodes in the second direction according to the position nodes respectively corresponding to the first desoldering zones; The moving track of the driving component is determined according to the first position node and the set direction; wherein the set direction is related to the first direction.

[0009] Optionally, before sending the movement trajectory to the specific solder stripping device, the method further includes: Determine a second position node whose number of adjacent position nodes in the movement trajectory is less than or equal to one and a third position node whose number is greater than one; Determine a first desoldering time for the desoldering knife brush to perform desoldering on the second position node and a second desoldering time for the desoldering knife brush to perform desoldering on the third position node; The sending of the movement trajectory to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in the set sequence according to the movement trajectory, and controls the tin stripping knife to remove tin at the corresponding position node, including: The moving trajectory, the first detinning time and the second detinning time are sent to the specific detinning device, so that the specific detinning device controls the horizontal moving component to move to the corresponding position node in the set order, and the specific detinning device controls the detinning knife brush to remove the tin according to the first detinning time and the second detinning time at the corresponding position node.

[0010] According to a second aspect of the present disclosure, there is also provided an operation control device based on a circuit board etching and tin stripping device, the device comprising: An acquisition module is used to acquire a processing flow of a target circuit board; wherein the processing flow reflects the indicated tin stripping device; A control module, used for controlling the etching processing device and the indicated tin stripping device to process the target circuit board; A receiving module, used for receiving the image detection data about the target circuit board output by the detection device; A determination module, configured to determine that the image detection data indicates a first area of ​​the target circuit board where the solder is not completely stripped; A control module is used to control a specific tin stripping device to perform a set tin stripping process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein the at least two tin stripping devices include a specific tin stripping device.

[0011] According to a third aspect of the present disclosure, an electronic device is also provided, including a memory and a processor, wherein the memory is used to store a computer program; and the processor is used to execute the computer program to implement the method according to the first aspect of the present disclosure.

[0012] According to a fourth aspect of the present disclosure, a computer-readable storage medium is further provided, on which a computer program is stored. When the computer program is executed by a processor, the method according to the first aspect of the present disclosure is implemented.

[0013] According to a fifth aspect of the present disclosure, a computer program product is further provided, comprising a computer program, wherein when the computer program is executed by a processor, the method according to the first aspect of the present disclosure is implemented.

[0014] One beneficial effect of the embodiments of the present disclosure is that the operation control method based on the circuit board etching and detinning equipment provided by the present invention can control the target circuit board to be sent to the etching processing device and the indicated detinning device for processing according to the processing flow. When the detection device determines that the target circuit board has a first area where the tin is not completely detinned, the specific detinning device is controlled to detin the target circuit board there, effectively reducing the occurrence of residual tin in a single detinning of the target circuit board, thereby improving the efficiency of batch processing of circuit boards.

[0015] Other features and advantages of the embodiments of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments of the present disclosure.

[0017] Figure 1 It is a schematic diagram of the composition structure of an operation control system based on a circuit board etching and tin stripping device to which an operation control method based on a circuit board etching and tin stripping device according to an embodiment can be applied; Figure 2 is a schematic structural diagram of a specific tin stripping device according to an embodiment; Figure 3 is a schematic structural diagram of a specific tin stripping device according to another embodiment; Figure 4 It is a flow chart of an operation control method based on a circuit board etching and tin stripping device according to an embodiment; Figure 5 It is a block diagram of a running control device based on a circuit board etching and tin stripping device according to an embodiment; Figure 6 is a schematic diagram of the hardware structure of an electronic device according to an embodiment. DETAILED DESCRIPTION

[0018] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0019] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0020] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0021] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0022] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0023] <System Embodiment> Figure 1 The schematic diagram of the structure of the operation control system based on the circuit board etching and tin stripping equipment can be applied to the operation control method based on the circuit board etching and tin stripping equipment according to one embodiment. Figure 1 As shown, the operation control system based on the circuit board etching and tin stripping equipment includes an etching processing device 1, at least two tin stripping devices 2, a detection device 3 and a control device 4.

[0024] The above etching processing device 1 is a device for etching on the surface of a circuit board. The etching processing device 1 can etch on the surface of the circuit board by wet etching.

[0025] The above at least two tin stripping devices 2 can be divided into a mechanical tin stripping device 2 and a chemical tin stripping device 2, and at least one of the at least two tin stripping devices 2 is a mechanical tin stripping device 2, and at least one is a chemical tin stripping device 2, and the etching treatment device 1 and the at least two tin stripping devices 2 can be connected through a first conveying platform 6, and at least two tin stripping devices 2 can be connected to the output end of the operation control system based on the circuit board etching tin stripping equipment through a second conveying platform. The circuit board can be placed on the carrier 5, and the carrier 5 can pass through the etching treatment device 1 and move to the first conveying platform 6. The first conveying platform 6 is provided with a first baffle 61 and a second baffle 62 that can be raised and lowered. When the first baffle 61 descends and the second baffle 62 rises, the carrier 5 can move along the first baffle 61 to the tin stripping device 2A, and when the second baffle 62 descends and the first baffle 61 rises, the carrier 5 can move along the second baffle 62 to the tin stripping device 2B, and then the carrier 5 can send the circuit board out through the second conveying platform after completing the tin stripping process.

[0026] The above detection device 3 is, for example, a camera or a laser radar, etc., which is not limited here. A second conveying platform 7 is arranged between the second conveying platform and the tin stripping device 2A, and a third baffle 71 that can be raised and lowered is arranged above the second conveying platform 7. When the third baffle 71 is lowered, the carrier 5 can move along the third baffle 71 through the third conveying platform 8 to the tin stripping device 2A. When the third baffle 71 is raised, the carrier 5 can output the circuit board.

[0027] The above control device 4 is, for example, a controller, which can be respectively communicated with the etching processing device 1, at least two tin stripping devices 2 and the detection device 3, so that the control device 4 can control the etching processing device 1, at least two tin stripping devices 2 and the detection device 3.

[0028] In some embodiments, Figure 2 As shown, the specific tin stripping device can be a mechanical tin stripping device, that is, a tin stripping device 2A. The specific tin stripping device can include a tin stripping operating table 21, a tin stripping knife brush 22 and a driving component 23. The tin stripping operating table 21 is provided with a tin stripping area for placing circuit boards. The tin stripping knife brush 22 is provided on the driving component 23. The driving component 23 is used to switch the tin stripping knife brush 22 to the indicated tin stripping partition and drive the tin stripping knife brush 22 to strip tin in the indicated tin stripping partition; wherein, the indicated tin stripping partition is part of the tin stripping area.

[0029] In the present application, the detinning area includes detinning partitions (1, 1) to detinning partitions (11, 10). When the circuit board placed on the carrier 5 is moved into a specific detinning device, the circuit board can correspond to all or part of the detinning partitions in the detinning area to suit circuit boards of different specifications.

[0030] In some embodiments, Figure 3As shown, the driving component 23 includes a horizontal moving component 231 and a vertical moving component 232. The horizontal moving component 231 is used to drive the desoldering brush 22 to move to the indicated desoldering partition, and the desoldering brush 22 is arranged on the telescopic part of the vertical moving component 232.

[0031] In the present application, the horizontal moving component 231 may include a first drive motor 2311, a first transmission structure, a second drive motor 2311, and a second transmission structure. When the first drive motor 2311 is working, the first transmission structure can drive the tin removal brush 22 to move along the X direction. When the second drive motor 2311 is working, the second transmission structure can drive the tin removal brush 22 to move along the Y direction. The first transmission structure and the second transmission structure are, for example, a screw transmission structure or a synchronous belt transmission structure, which is not limited here.

[0032] In the present application, the vertical moving part 232 can be a telescopic rod with an electrically controlled telescopic length, which is arranged on the second transmission structure so that the detinning brush 22 can be moved to any detinning partition, and when the vertical moving part 232 is extended, the detinning brush 22 can contact the surface of the circuit board and detin the circuit board.

[0033] In some embodiments, the desoldering brush 22 reciprocates along a first direction to achieve desoldering.

[0034] In the present application, when the first direction is the X direction, the second direction may be the Y direction, and when the first direction is the Y direction, the second direction may be the X direction.

[0035] Applied in the embodiment of the present disclosure, the memory of the control device 4 is used to store a computer program, and the computer program is used to control the processor of the control device 4 to operate according to the operation control method based on the circuit board etching and tin stripping equipment of any embodiment. The technician can design a computer program according to the scheme of the embodiment of the present disclosure. How the computer program controls the processor to operate is well known in the art, so it will not be described in detail here.

[0036] <Method Example> Figure 4 The following is a flow chart of an operation control method based on a circuit board etching and tin stripping device according to an embodiment. Figure 1 Middle control device 4.

[0037] like Figure 4 As shown, the operation control method based on the circuit board etching and tin stripping equipment of this embodiment may include the following steps S410 to S450: Step S410, obtaining a processing flow of a target circuit board; wherein the processing flow reflects an indicated solder stripping device.

[0038] In the present application, the processing flow is, for example, an etching processing device 1-a tin stripping device 2B, wherein the tin stripping device indicated is the tin stripping device 2B.

[0039] Step S420, controlling the etching processing device and the instructed solder stripping device to process the target circuit board.

[0040] In some examples, such as Figure 1 As shown, the processing flow is etching processing device 1-tin stripping device 2B, the control device 4 can control the carrier 5 to move to the etching processing device 1 and perform etching processing. After the etching processing is completed, the control device 4 controls the second baffle to descend and the first baffle to rise, and then controls the carrier 5 to move to the tin stripping device 2B and perform tin stripping processing.

[0041] Step S430, receiving image detection data on the target circuit board output by the detection device.

[0042] In this application, if Figure 1 As shown, when the carrier 5 moves to the second conveying platform, the detection device 3 can check the image detection data about the target circuit board directly below, and feed back the image detection data to the control device.

[0043] Step S440: determining that the image detection data indicates a first area of ​​the target circuit board where the solder is not completely stripped.

[0044] Step S450, controlling a specific tin stripping device to perform a set tin stripping process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein the at least two tin stripping devices include a specific tin stripping device.

[0045] In the present application, the detinning process is set to be a reciprocating motion of the detinning brush on the first area for a set time period, and the set number of times is, for example, 5s, 10s or 20s, etc., which is not limited here.

[0046] In some embodiments, step S450 may include the following steps S510 to S540: Step S510, determining a second relative position between the first area and the desoldering area according to a preset mapping relationship and a first relative position between the first area and the target circuit board; wherein the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area.

[0047] In this application, if Figure 1 As shown, the carrier 5 can be moved into the desoldering device 2A, and the camera configured on the carrier is aligned with the QR code set at the center point set by the desoldering device 2A to achieve the vertical overlap of the center of the target circuit board and the center point set by the desoldering device 2A, which enables different points on the circuit board to correspond to different desoldering partitions on the desoldering area.

[0048] Step S520: determining a first desoldering zone of the first region in the desoldering area according to the second relative position.

[0049] Step S520, obtaining the moving trajectory of the driving component according to the position nodes corresponding to the first desoldering partitions.

[0050] Step S530, sending a movement trajectory to a specific tin stripping device, so that the specific tin stripping device controls the driving components to move to the corresponding position nodes in a set order according to the movement trajectory, and controls the tin stripping knife to brush the tin at the corresponding position node.

[0051] In some examples, Figure 2 For example, the first detinning partition of the first area in the detinning zone may include: detinning partition [1, 1], detinning partition [1, 2], detinning partition [1, 3], detinning partition [2, 3], and detinning partition [5, 3]. Then, the moving trajectory of the driving component is to continuously detin the detinning partition [1, 1]-detinning partition [1, 2]-detinning partition [1, 3]-detinning partition [2, 3], and then, detinning the detinning partition [5, 3].

[0052] In other words, when the position nodes are continuous, the vertical moving parts of the specific desoldering device do not need to work, and the desoldering knife brush continuously removes the tin to further enhance the desoldering effect of the specific desoldering device.

[0053] In some embodiments, step S440 may include the following steps S610 to S630: Step S610, determining a second region in the image detection data that matches a set color.

[0054] In the present application, the color is set to be silver, for example.

[0055] Step S620: determine the shortest spacing distance between the second areas.

[0056] In this application, if Figure 2 As shown, any two detinning partitions can be represented by one cell. For example, the distance between detinning partition [1, 1] and detinning partition [1, 2] is 0 cells, the distance between detinning partition [1, 1] and detinning partition [1, 3] is 1 cell, and the distance between detinning partition [1, 1] and detinning partition [2, 2] is 0 cells.

[0057] Step S630: combine the second areas whose shortest interval distance is within the set distance into the first area.

[0058] In this application, the distance is set to 0 cells.

[0059] In other words, by combining the second area within the set distance into the first area, when the position nodes are continuous, the vertical moving part of the specific desoldering device does not need to work, and the desoldering knife brush continuously removes the tin to further enhance the desoldering effect of the specific desoldering device.

[0060] In some embodiments, step S530 may include the following step S5301: Step S5301, sending a moving trajectory and pre-stored thickness information about the target circuit board to a specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position node in a set order, and the specific desoldering device controls the movement of the telescopic part of the vertical moving component according to the thickness information, and controls the desoldering knife to brush off the tin at the corresponding position node.

[0061] In the present application, the control device pre-stores the thickness information of the target circuit board to control the telescopic distance of the telescopic part of the vertical moving component according to the thickness information, so as to reduce the abnormal wear of the target circuit board by the desoldering brush, and improve the desoldering efficiency of the circuit board by the specific desoldering device.

[0062] In some embodiments, step S520 may include the following steps S5201 and S5202: Step S5201, determining adjacent first position nodes in the second direction according to the position nodes respectively corresponding to the first desoldering partitions.

[0063] In some examples, the first direction is the Y direction, and the position nodes corresponding to the first detinning partitions include detinning partition [1, 1], detinning partition [1, 2], and detinning partition [2, 1]. The second direction is the X direction, then the adjacent first position nodes in the second direction are detinning partition [1, 1] and detinning partition [1, 2].

[0064] Step S5202, determining a moving trajectory of the driving component according to the first position node and the set direction; wherein the set direction is related to the first direction.

[0065] In the present application, when the first direction is the Y direction, the set direction is the Y direction.

[0066] In some examples, the first direction is the Y direction, the position nodes corresponding to the first desoldering partitions include desoldering partition [1, 1], desoldering partition [1, 2], and desoldering partition [2, 1], and the second direction is the X direction, then the moving track is desoldering partition [1, 2]-desoldering partition [1, 1]-desoldering partition [2, 1]. In other words, since the desoldering brush reciprocates along the first direction, the desoldering effect of the specific desoldering device on the target circuit board can be further improved by continuously desoldering the adjacent desoldering partitions in the second direction.

[0067] In some embodiments, before step S530, the method further includes the following steps S710 and S720: Step S710, determining a second position node whose number of adjacent position nodes in the movement trajectory is less than or equal to one and a third position node whose number is greater than one.

[0068] In some examples, the position nodes of the moving trajectory are detinning partition [1, 1], detinning partition [1, 2], and detinning partition [1, 3]. Then, the second position node is detinning partition [1, 1] and detinning partition [1, 3], and the third position node is detinning partition [1, 2].

[0069] Step S720, determining a first desoldering time of the desoldering knife brush for the second position node and a second desoldering time of the desoldering knife brush for the third position node.

[0070] In some examples, the control device can pre-set a first detinning time for the second position node and pre-set a second detinning time for the third position node, and the first detinning time is longer than the second detinning time, for example, the first detinning time is 8s, the second detinning time is 5s, etc.

[0071] Based on this, step S530 may include the following step S5302: Step S5302, sending the moving trajectory, the first detinning time and the second detinning time to the specific detinning device, so that the specific detinning device controls the horizontal moving part to move to the corresponding position node in the set order, and the specific detinning device controls the detinning knife brush to remove the tin according to the first detinning time and the second detinning time at the corresponding position node.

[0072] In some examples, when the second position node is desoldering partition [1, 1] and desoldering partition [1, 3], and the third position node is desoldering partition [1, 2], the desoldering brush moves to desoldering partition [1, 1] or desoldering partition [1, 3] for 8 seconds, and moves to desoldering partition [1, 2] for 5 seconds.

[0073] In other words, by desoldering the second position node for a longer period of time, the desoldering effect of the specific desoldering device on the target circuit board can be further improved.

[0074] <Equipment Example 1> Figure 5 1 is a principle block diagram of an operation control device based on a circuit board etching and desoldering device according to an embodiment. Figure 5 As shown, the operation control device 500 based on the circuit board etching and tin stripping equipment may include: The acquisition module 510 is used to acquire the processing flow of the target circuit board; wherein the processing flow reflects the indicated tin stripping device; A control module 520 is used to control the etching processing device and the instructed tin stripping device to process the target circuit board; The receiving module 530 is used to receive the image detection data about the target circuit board output by the detection device; A determination module 540 is used to determine that the image detection data indicates a first area of ​​the target circuit board where the solder is not completely stripped; The control module 550 is used to control a specific tin stripping device to perform a set tin stripping process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein at least two tin stripping devices include a specific tin stripping device.

[0075] Optionally, the control module 550 is also used to determine the second relative position of the first area and the detinning area based on a preset mapping relationship and the first relative position of the first area and the target circuit board; wherein the mapping relationship reflects that different points on the circuit board correspond to different points on the detinning area; according to the second relative position, determine the first detinning partition of the first area in the detinning area; obtain the movement trajectory of the driving component according to the position nodes corresponding to the first detinning partition; send the movement trajectory to a specific detinning device, so that the specific detinning device controls the driving component to move to the corresponding position node in the set order according to the movement trajectory, and controls the detinning knife brush to remove tin at the corresponding position node.

[0076] Optionally, the determination module 540 is further used to determine the second area in the image detection data that meets the set color; determine the shortest spacing distance between each second area; and combine the second areas whose shortest spacing distance is within the set distance into the first area.

[0077] Optionally, the control module 550 is also used to send a movement trajectory and pre-stored thickness information about the target circuit board to a specific detinning device, so that the specific detinning device controls the horizontal moving component to move to a corresponding position node in a set order, and the specific detinning device controls the movement of the telescopic part of the vertical moving component according to the thickness information, and controls the detinning knife to brush off the tin at the corresponding position node.

[0078] Optionally, the control module 550 is also used to determine the adjacent first position nodes in the second direction according to the position nodes corresponding to the first desoldering partitions; determine the movement trajectory of the driving component according to the first position nodes and the set direction; wherein the set direction is related to the first direction.

[0079] Optionally, the operation control device 500 based on the circuit board etching and detinning equipment further includes a node determination module, which is used to determine a second position node in which the number of adjacent position nodes in the moving trajectory is less than or equal to one and a third position node greater than one; determine a first detinning time length for the detinning knife brush to the second position node and a second detinning time length for the third position node; The control module 550 is also used to send a moving trajectory, a first detinning time and a second detinning time to a specific detinning device, so that the specific detinning device controls the horizontal moving component to move to the corresponding position node in a set order. The specific detinning device controls the detinning knife brush to remove tin according to the first detinning time and the second detinning time at the corresponding position node.

[0080] The operation control device 500 based on the circuit board etching and tin stripping equipment can be Figure 1 The control device 4 in.

[0081] <Equipment Example 2> Figure 6 is a schematic diagram of the hardware structure of an electronic device according to another embodiment.

[0082] like Figure 6 As shown, the electronic device 600 includes a processor 610 and a memory 620, wherein the memory 620 is used to store an executable computer program, and the processor 610 is used to execute a method such as any of the above method embodiments under the control of the computer program.

[0083] The electronic device 600 may be Figure 1 The control device 4 in.

[0084] Each module of the above-mentioned operation control device 500 based on circuit board etching and tin stripping equipment can be implemented by the processor 610 in this embodiment executing the computer program stored in the memory 620, or can be implemented by other structures, which is not limited here.

[0085] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0086] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. More specific examples (a non-exhaustive list) of computer-readable storage media include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the above. The computer-readable storage medium used herein is not to be interpreted as a transient signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0087] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0088] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect through the Internet). In some embodiments, by using the state information of the computer-readable program instructions to personalize an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit may execute the computer-readable program instructions, thereby implementing various aspects of the present invention.

[0089] Various aspects of the present invention are described herein with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flowchart and / or block diagram and the combination of the boxes in the flowchart and / or block diagram can be implemented by computer-readable program instructions.

[0090] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0091] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0092] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0093] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. An operation control method based on circuit board etching and tin stripping equipment, characterized in that: The circuit board etching and tin stripping system includes an etching processing device, at least two tin stripping devices, a detection device and a control device. The etching processing device, the at least two tin stripping devices and the detection device are respectively connected to the control device for communication. The control device is the execution subject of the method. The method includes: Obtaining a processing flow of a target circuit board; wherein the processing flow reflects the indicated solder stripping device; Controlling the etching processing device and the indicated tin stripping device to process the target circuit board; receiving image detection data on the target circuit board output by the detection device; Determining that the image detection data represents a first area of ​​the target circuit board where the solder is not completely stripped; According to a first relative position between the first area and the target circuit board, a specific tin stripping device is controlled to perform a set tin stripping process on the target circuit board; wherein the at least two tin stripping devices include a specific tin stripping device.

2. The method according to claim 1, characterized in that The specific desoldering device includes a desoldering operation table, a desoldering knife brush and a driving component, wherein a desoldering area for placing a circuit board is arranged on the desoldering operation table, the desoldering knife brush is arranged on the driving component, and the driving component is used to switch the desoldering knife brush to an indicated desoldering partition and drive the desoldering knife brush to desolder in the indicated desoldering partition; wherein the indicated desoldering partition is a part of the desoldering area; and according to a first relative position between the first area and the target circuit board, controlling the specific desoldering device to perform a set desoldering process on the target circuit board includes: Determine a second relative position between the first area and the desoldering area according to a preset mapping relationship and a first relative position between the first area and the target circuit board; wherein the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; Determine a first detinning zone of the first region in the detinning area according to the second relative position; Obtaining a moving trajectory of the driving component according to the position nodes respectively corresponding to the first desoldering zones; The moving trajectory is sent to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in a set order according to the moving trajectory, and controls the tin stripping knife brush to remove the tin at the corresponding position node.

3. The method according to claim 2, characterized in that Determining that the image detection data indicates a first area of ​​the target circuit board where the solder is not completely stripped includes: Determine a second area in the image detection data that matches a set color; determining the shortest separation distance between each of the second areas; The second areas whose shortest interval distance is within the set distance are combined into the first area.

4. The method according to claim 2, characterized in that: The driving component includes a horizontal moving component and a vertical moving component, the horizontal moving component is used to drive the detinning brush to move to the indicated detinning partition, and the detinning brush is arranged on the telescopic part of the vertical moving component; The sending of the movement trajectory to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in the set sequence according to the movement trajectory, and controls the tin stripping knife to remove tin at the corresponding position node, including: The moving trajectory and the pre-stored thickness information about the target circuit board are sent to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position node in the set order, and the specific desoldering device controls the movement of the telescopic part of the vertical moving component according to the thickness information, and controls the desoldering knife to remove the tin at the corresponding position node.

5. The method according to claim 2, characterized in that: The detinning brush moves back and forth along a first direction to achieve detinning; and obtaining the moving trajectory of the driving component according to the position nodes respectively corresponding to the first detinning partitions includes: Determine adjacent first position nodes in the second direction according to the position nodes respectively corresponding to the first desoldering zones; The moving track of the driving component is determined according to the first position node and the set direction; wherein the set direction is related to the first direction.

6. The method according to claim 4, characterized in that Before sending the movement trajectory to the specific tin stripping device, the method further includes: Determine a second position node whose number of adjacent position nodes in the movement trajectory is less than or equal to one and a third position node whose number is greater than one; Determine a first desoldering time for the desoldering knife brush to perform desoldering on the second position node and a second desoldering time for the desoldering knife brush to perform desoldering on the third position node; The sending of the movement trajectory to the specific tin stripping device, so that the specific tin stripping device controls the driving component to move to the corresponding position node in the set sequence according to the movement trajectory, and controls the tin stripping knife to remove tin at the corresponding position node, including: The moving trajectory, the first detinning time and the second detinning time are sent to the specific detinning device, so that the specific detinning device controls the horizontal moving component to move to the corresponding position node in the set order, and the specific detinning device controls the detinning knife brush to remove the tin according to the first detinning time and the second detinning time at the corresponding position node.

7. An operation control device based on a circuit board etching and tin stripping device, the device comprising: An acquisition module is used to acquire a processing flow of a target circuit board; wherein the processing flow reflects the indicated tin stripping device; A control module, used for controlling the etching processing device and the indicated tin stripping device to process the target circuit board; A receiving module, used for receiving image detection data about the target circuit board output by the detection device; A determination module, configured to determine that the image detection data indicates a first area of ​​the target circuit board where the solder is not completely stripped; A control module is used to control a specific tin stripping device to perform a set tin stripping process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein at least two tin stripping devices include a specific tin stripping device.

8. A control device, characterized in that: The invention comprises a memory and a processor, wherein the memory is used to store a computer program; and the processor is used to execute the computer program to implement the method according to any one of claims 1 to 6.

9. An operation control system based on circuit board etching and tin stripping equipment, characterized in that: The system comprises an etching processing device, at least two tin stripping devices, a detection device and a control device, wherein the etching processing device, the at least two tin stripping devices and the detection device are respectively connected to the control device for communication; The control device is configured to: obtain a processing flow of a target circuit board; wherein the processing flow reflects an indicated tin stripping device; control the etching processing device and the indicated tin stripping device to process the target circuit board; obtain a processing flow of a target circuit board; wherein the processing flow reflects an indicated tin stripping device; control the etching processing device and the indicated tin stripping device to process the target circuit board; receive image detection data about the target circuit board output by the detection device; determine that the image detection data represents a first area of ​​the target circuit board that is not completely stripped; control a specific tin stripping device to perform a set tin stripping process on the target circuit board based on a first relative position of the first area and the target circuit board; wherein the at least two tin stripping devices include a specific tin stripping device.

10. The system according to claim 9, characterized in that The specific detinning device comprises a detinning operation table, a detinning brush and a driving component, wherein a detinning area for placing a circuit board is arranged on the detinning operation table, the detinning brush is arranged on the driving component, and the driving component is used to switch the detinning brush to an indicated detinning partition and drive the detinning brush to detin in the indicated detinning partition; wherein the indicated detinning partition is a part of the detinning area; The control device is also configured to determine a second relative position between the first area and the desoldering area according to a preset mapping relationship and a first relative position between the first area and the target circuit board; wherein the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; according to the second relative position, determine a first desoldering partition of the first area in the desoldering area; obtain a moving trajectory of the driving component according to position nodes corresponding to the first desoldering partitions; send the moving trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position node in a set order according to the moving trajectory, and controls the desoldering knife brush to remove tin at the corresponding position node.

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