Circuit board structure of aviation equipment

Abstract

The invention discloses a manufacturing process of a circuit board structure of aviation equipment, which comprises the following steps of: providing a carbon fiber reinforced ceramic substrate, after desizing process treatment, coating high-temperature ceramic slurry on the carbon fiber reinforced ceramic substrate, forming a high-temperature-resistant base material layer through vacuum drying, coating an electromagnetic shielding material on the surface of the base material layer, and forming the circuit board structure of the aviation equipment. Designing a circuit pattern, and transferring the circuit pattern to the electromagnetic shielding layer through a laser cutting or etching process to form a circuit layout; wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer; coating the surface of the circuit board with a resin material, performing curing treatment, mounting a metal connecting piece in the edge area of the circuit board, performing connection in a crimping manner, then performing a 3D printing process, and printing connecting points on the surface of the circuit board; the circuit board provided by the invention has the advantages of high temperature resistance, electromagnetic interference resistance, support and excellent protection performance.

Description

Technical Field

[0001] The present invention relates to the field of aviation technology, and in particular to a circuit board structure of aviation equipment. Background Art

[0002] Currently, the aviation equipment field has placed extremely high demands on the reliability and performance of electronic systems in high-end applications such as aircraft, satellites and drones. Aviation equipment often needs to work stably in high temperature, high pressure, strong vibration and harsh electromagnetic interference environments. Due to the limitations of materials and manufacturing processes, traditional circuit board structures are difficult to simultaneously meet the requirements of lightweight, high strength and excellent environmental adaptability. In order to achieve high reliability and long life of system integration, aviation equipment has put forward higher requirements for heat resistance, impact resistance and electromagnetic shielding for circuit board structures. Its application scenarios cover extreme climates, complex electromagnetic environments and long-term continuous working conditions.

[0003] At present, the widely used circuit board manufacturing process in the existing technology mainly relies on the traditional FR4 substrate and copper foil lamination process, and simple metal plating or conductive coating as electromagnetic shielding measures. This method can meet the basic requirements in conventional electronic products, but it has obvious defects in aviation-grade applications: on the one hand, FR4 materials are prone to thermal deformation and interlayer delamination under high temperature and severe vibration conditions, and cannot provide stable mechanical support; on the other hand, a single electromagnetic shielding solution often cannot effectively resist the extreme electromagnetic interference encountered by aviation equipment, resulting in unstable circuit signal transmission or increased risk of failure.

[0004] In view of this, it is necessary to improve the circuit board manufacturing technology in the prior art to solve the technical problem that it cannot meet the performance requirements of extreme environments in aerospace applications. Summary of the invention

[0005] The purpose of the present invention is to provide a circuit board structure for aviation equipment to solve the above technical problems.

[0006] To achieve this object, the present invention adopts the following technical solutions: A manufacturing process for a circuit board structure of aviation equipment, comprising: Step S1, providing a carbon fiber reinforced ceramic substrate, coating a high temperature ceramic slurry on the carbon fiber reinforced ceramic substrate after desizing, and forming a high temperature resistant substrate layer by vacuum drying; Step S2, coating an electromagnetic shielding material on the surface of the substrate layer to form an electromagnetic shielding layer, wherein the electromagnetic shielding material comprises a composite of a conductive polymer and a metal plating layer; Step S3, designing a circuit pattern on the electromagnetic shielding layer, and transferring the circuit pattern to the electromagnetic shielding layer by laser cutting or etching to form a circuit layout; Step S4, wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer; Step S5, coating the surface of the circuit board with a high-strength polymer resin material, and coating it evenly by a spraying process, and then performing a curing treatment to form an outer protective layer; Step S6, installing metal connectors on the edge area of ​​the circuit board and connecting them by crimping, then performing a 3D printing process to print connection points on the surface of the circuit board and connect the exposed ports to obtain a circuit board structure.

[0007] Optionally, the step S1 specifically includes: Step S11, providing a carbon fiber reinforced ceramic substrate: the pretreated carbon fiber and ceramic powder are subjected to a hot pressing process and a high-temperature sintering process to form a high-strength, high-temperature resistant carbon fiber reinforced ceramic substrate suitable for aviation equipment application, and the substrate thickness is in the range of 0.2 mm to 1.5 mm; Step S12, performing a desizing process: using an acidic solution for removing unbound substances on the surface, soaking the carbon fiber reinforced ceramic substrate at room temperature for 5-15 minutes to perform a desizing process on the substrate; Step S13, coating high temperature ceramic slurry: coating the surface of the desizing carbon fiber reinforced ceramic substrate with high temperature ceramic slurry, the coating method adopts a spin coating process, the coating speed is controlled between 2000-3000rpm, and the coating thickness is controlled between 30-50μm; the high temperature ceramic slurry includes high temperature refractory ceramic powder, a binder, a solvent and an additive; Step S14, vacuum drying: After coating is completed, enter the vacuum drying stage, and dry the substrate coated with the high-temperature ceramic slurry in a vacuum environment, and the drying temperature is set between 50-80°C.

[0008] Optionally, after step S14, the following steps are further included: Step S15, secondary coating and baking: re-coating the high temperature ceramic slurry on the dried substrate, using the same spin coating process to make the coating uniform; then performing a baking treatment, setting the temperature in the range of 700-800°C, maintaining it for 2-4 hours, and performing secondary coating on the substrate; Step S16, cooling and surface inspection: after baking, the substrate is placed in a cooling zone, the cooling rate should be controlled between 1-5°C / min, and after cooling to room temperature, the surface of the coated ceramic layer is inspected; Step S17, heat treatment strengthening: placing the substrate in a high temperature furnace at 1000-1100°C for 1-2 hours of high temperature heating, heat treating the substrate coated with the ceramic layer to obtain a high temperature resistant substrate layer.

[0009] Optionally, the step S2 specifically includes: Step S21, surface pretreatment of the substrate layer: performing surface pretreatment on the substrate layer, including plasma cleaning or ultraviolet light / ozone treatment for 5-10 minutes to remove dust and organic pollutants and generate active hydroxyl groups on the surface of the substrate; Step S22, preparing a conductive polymer solution: selecting poly(3,4-ethylenedioxythiophene):polystyrene sulfonate as the main conductive component, dissolving it in deionized water at a weight ratio of 1-5%, adding 5-10% dimethyl sulfoxide as an auxiliary agent, and using ultrasonic oscillation for 5-10 minutes to ensure that the solution is fully dispersed, thereby preparing a conductive polymer solution; Step S23, preparing a metal coating composite precursor: adding a metal precursor to a conductive polymer solution, wherein the concentration of the metal precursor is controlled within the range of 0.1-0.5M, and then adding an appropriate amount of a reducing agent to perform in-situ chemical reduction at room temperature, wherein the reaction time is controlled within 15-30 minutes, and the generated metal particles are uniformly dispersed in the polymer matrix to form a metal coating composite; Step S24, coating electromagnetic shielding material: the prepared conductive polymer / metal plating composite solution is evenly coated on the surface of the pretreated high-temperature resistant substrate layer by an electrostatic spraying process, the coating speed is controlled at 100-150 mm / s, and the coating thickness is adjusted between 5-15 μm to obtain a continuous, dense and bubble-free electromagnetic shielding layer.

[0010] Optionally, after step S24, the following steps may be further performed: Step S25, intermediate drying treatment: after coating, the workpiece is placed in a drying oven at a temperature of 60-80° C. and subjected to intermediate drying treatment in a vacuum environment for 30-60 minutes; Step S26, heat treatment and curing: after intermediate drying, the electromagnetic shielding layer is heat treated and cured, and the curing process parameters are a temperature of 120-150° C. and a curing time of 30-45 minutes; Step S27, surface quality inspection and correction: electronic scanning equipment is used to inspect the surface uniformity and density of the cured electromagnetic shielding layer, and the surface resistance is measured by a four-probe method to confirm that the conductivity of the electromagnetic shielding layer meets the predetermined standard.

[0011] Optionally, the step S3 specifically includes: Step S31, circuit pattern design and digital processing: using CAD software and circuit simulation tools, designing circuit patterns according to the requirements of aviation equipment in terms of high-frequency transmission and anti-electromagnetic interference, and converting the design data into a digital template file; Step S32, precise alignment of the pattern template and the electromagnetic shielding layer: using a digital alignment system, aligning the circuit pattern template to the surface of the electromagnetic shielding layer, using a fine-tuning platform to control the alignment error within ±2 μm, and gently preheating the electromagnetic shielding layer before alignment; Step S33, laser cutting process to achieve pattern transfer: after alignment is completed, ultraviolet laser cutting equipment with a wavelength of 355nm is used to cut the electromagnetic shielding layer under the conditions of laser power of 0.5-1.5W, pulse frequency of 20-50kHz and scanning speed of 100-200 mm / s, and the laser cutting depth is strictly controlled within the range of 5-15μm to cut the shielding layer to form a preset circuit pattern; Step S34, post-processing: ultrasonically clean the processed circuit pattern area to remove residual impurities and obtain a circuit board with a circuit pattern.

[0012] Optionally, the step S4 specifically includes: Step S41, selecting a copper-nickel alloy or a copper-silver alloy as a copper alloy film material, and performing surface treatment on the copper alloy film, specifically, pickling with an acid solution to remove surface oxides and oil stains, then washing with deionized water, and drying with nitrogen; Step S42, according to the designed circuit pattern, using a laser etching process to remove unnecessary parts of the surface of the copper alloy film to form a circuit pattern; the laser power is set to 1-3W, the scanning speed is controlled between 100-300mm / s, and the cutting depth is 10-20μm to divide the circuit path; Step S43, docking the treated copper alloy film with the pre-prepared polymer composite middle layer, aligning the edge of the circuit pattern with the edge of the polymer composite middle layer, and then laminating the copper alloy film and the polymer composite together by hot pressing, with the temperature set at 120-150°C, the pressure controlled at 0.5-1.0MPa, and the lamination time being 30-60 minutes; Step S44, during the lamination process, the copper alloy film and the polymer composite material are placed in a vacuum bag and hot-pressed and laminated under vacuum; Step S45, after lamination is completed, the product is placed in a cooling tank, the cooling rate is controlled between 2-5°C / min, and after cooling to room temperature, a curing treatment is performed. The curing temperature is set to 150°C and the curing time is 30 minutes, so that the bonding force between the pressed copper alloy film and the polymer composite material layer reaches the maximum value to form an electrical connection layer.

[0013] Optionally, the step S5 specifically includes: Step S51, selecting epoxy resin or polyimide resin as the high-strength polymer resin material, and controlling the viscosity of the resin between 300-500 cP; Step S52, before coating the resin, the circuit board surface is subjected to surface activation treatment, such as plasma treatment or ultraviolet / ozone treatment, and the treatment time is 3-5 minutes; Step S53, using a spraying process, using an automatic spraying device to evenly spray the high-strength polymer resin material on the surface of the circuit board, the spraying speed is controlled at 100-150 mm / s, the distance between the nozzle and the circuit board surface is controlled between 5-10 cm, and the thickness of the spray layer is controlled between 20-50 μm; Step S55, after the resin coating is completed, a curing treatment is performed to form an outer protective layer; the curing temperature is set to 120-160°C, and the curing time is 30-60 minutes.

[0014] Optionally, the step S6 specifically includes: Step S61, installing the metal connector on the edge area of ​​the circuit board, aligning and fixing it by a positioning device; Step S62, connecting the metal connector to the circuit board by crimping, with the crimping pressure controlled between 0.5-1.0 MPa and the crimping time being 10-15 seconds, so that the metal connector is completely pressed into the preset groove; Step S63, according to the circuit pattern and connection requirements, 3D printing design of connection points is performed on the surface of the circuit board, modeling is performed using 3D design software, and a resin material with high conductivity is selected for printing using a 3D printing device to print connection points on the surface of the circuit board; Step S64, after the 3D printing is completed, the printed connection points are post-processed, the post-processing includes cleaning to remove excess resin material and performing a curing process; Step S65, docking the connection point formed by 3D printing with the exposed port to ensure that the connection point and the port are firmly docked, and then fixing them with conductive glue, and coating a layer of insulating material around the docking position; Step S66, after the connection is completed, a final inspection of visual inspection and electrical performance test is performed.

[0015] The present invention further provides a circuit board structure of aviation equipment, which is manufactured using the manufacturing process of the circuit board structure of aviation equipment as described above, and the circuit board structure comprises: The substrate layer is composed of a carbon fiber reinforced ceramic substrate coated with a high-temperature ceramic slurry and is used as a basic support layer for the circuit board; An electromagnetic shielding layer, coated on the surface of the substrate layer, composed of a composite material of a conductive polymer and a metal plating layer, for isolating external electromagnetic interference; A circuit connection layer is formed by a copper alloy film through a laser cutting or etching process, and a circuit pattern is formed along the surface of the electromagnetic shielding layer; An outer protective layer, coated on the surface of the circuit connection layer, is made of a high-strength polymer resin material and is used for protection; Metal connectors are installed at the edge of the circuit board and connected by crimping; 3D printed connection points are formed on the surface of the circuit board using 3D printing technology and are used to connect the circuit pattern to the electrical connection points of the exposed ports.

[0016] Compared with the prior art, the present invention has the following beneficial effects: the manufacturing process starts with the preparation of a carbon fiber reinforced ceramic substrate, and after being treated by a desizing process, a high-temperature ceramic slurry is coated on its surface, and a high-temperature resistant substrate layer is formed by vacuum drying; subsequently, an electromagnetic shielding material is coated on the surface of the substrate layer to form an electromagnetic shielding layer, a circuit pattern is designed on the electromagnetic shielding layer by a laser cutting or etching process, and further wiring is performed by a copper alloy film and a lamination process is performed to stably combine the electrical connection layer with the middle layer composite material; next, a high-strength polymer resin is coated on the surface of the circuit board and cured to form an outer protective layer to ensure the wear resistance and corrosion resistance of the circuit board; finally, a metal connector is installed in the edge area of ​​the circuit board, the connection is firmly connected by crimping, and the connection points are printed on the surface of the circuit board using 3D printing technology to ensure that the electrical connection is stable and reliable; this scheme provides a circuit board with high temperature resistance, anti-electromagnetic interference, support and excellent protection performance by introducing a carbon fiber reinforced ceramic substrate, a high-temperature ceramic slurry, a composite electromagnetic shielding material, and advanced lamination and 3D printing processes, which can operate stably for a long time in the extreme environment of aviation equipment, and fully meet the special performance requirements of the circuit board in the aviation field. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 This is one of the flow charts of the manufacturing process of the circuit board structure of the aviation equipment of the first embodiment; Figure 2 This is the second flow chart of the manufacturing process of the circuit board structure of the aviation equipment of the first embodiment. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: Combination Figure 1 to Figure 2 As shown, an embodiment of the present invention provides a manufacturing process of a circuit board structure of aviation equipment, including: Step S1, providing a carbon fiber reinforced ceramic substrate, coating a high temperature ceramic slurry on the carbon fiber reinforced ceramic substrate after a desizing process, and forming a high temperature resistant substrate layer by vacuum drying.

[0024] Step S2, coating an electromagnetic shielding material on the surface of the substrate layer to form an electromagnetic shielding layer, wherein the electromagnetic shielding material comprises a composite of a conductive polymer and a metal plating layer.

[0025] Step S3, designing a circuit pattern on the electromagnetic shielding layer, and transferring the circuit pattern to the electromagnetic shielding layer by laser cutting or etching process to form a circuit layout.

[0026] Step S4, wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer.

[0027] Step S5, coating the surface of the circuit board with a high-strength polymer resin material, and coating it evenly through a spraying process, and then performing a curing treatment to form an outer protective layer.

[0028] Step S6, installing metal connectors on the edge area of ​​the circuit board and connecting them by crimping, then performing a 3D printing process to print connection points on the surface of the circuit board and connect the exposed ports to obtain a circuit board structure.

[0029] The working principle of the present invention is as follows: the manufacturing process starts with the preparation of a carbon fiber reinforced ceramic substrate, and after being treated by a desizing process, a high-temperature ceramic slurry is coated on its surface, and a high-temperature resistant substrate layer is formed by vacuum drying; subsequently, an electromagnetic shielding material is coated on the surface of the substrate layer to form an electromagnetic shielding layer, a circuit pattern is designed on the electromagnetic shielding layer by a laser cutting or etching process, and further wiring is performed by a copper alloy film and a lamination process is performed to stably combine the electrical connection layer with the middle layer composite material; next, a high-strength polymer resin is coated on the surface of the circuit board and cured to form an outer protective layer to ensure the wear resistance and corrosion resistance of the circuit board; finally, a metal connector is installed in the edge area of ​​the circuit board, the connection is firmly connected by crimping, and the connection points are printed on the surface of the circuit board using 3D printing technology to ensure that the electrical connection is stable and reliable; this scheme provides a circuit board with high temperature resistance, anti-electromagnetic interference, support and excellent protection performance by introducing a carbon fiber reinforced ceramic substrate, a high-temperature ceramic slurry, a composite electromagnetic shielding material, and advanced lamination and 3D printing processes, which can operate stably for a long time in the extreme environment of aviation equipment, and fully meet the special performance requirements of the circuit board in the aviation field.

[0030] In this embodiment, it is specifically explained that step S1 specifically includes: Step S11, providing a carbon fiber reinforced ceramic substrate: the pretreated carbon fiber and ceramic powder are subjected to a hot pressing process and a high-temperature sintering process to form a high-strength, high-temperature resistant carbon fiber reinforced ceramic substrate suitable for aviation equipment application, and the substrate thickness is in the range of 0.2 mm to 1.5 mm; A high-strength, high-temperature-resistant carbon fiber reinforced ceramic substrate suitable for aviation equipment applications is selected, and the substrate thickness is in the range of 0.2mm to 1.5mm, preferably 0.5mm to 1.0mm. The substrate is formed by a hot pressing process of pre-treated carbon fiber and ceramic powder, and is sintered at high temperature to ensure that it has excellent high temperature resistance, strength and rigidity.

[0031] Step S12, performing a desizing process: using an acidic solution for removing unbound substances on the surface, soaking at room temperature for 5-15 minutes, and performing a desizing treatment on the carbon fiber reinforced ceramic substrate; An acid solution with a concentration of 1-5% (e.g., hydrochloric acid, sulfuric acid, etc.) is usually used for soaking at room temperature for 5-15 minutes. This desizing process can remove the slurry residue and impurities on the surface of the substrate, ensure the surface is clean and improve the adhesion of the subsequent ceramic slurry.

[0032] Step S13, coating high temperature ceramic slurry: coating the surface of the desizing carbon fiber reinforced ceramic substrate with high temperature ceramic slurry, the coating method adopts a spin coating process, the coating speed is controlled between 2000-3000rpm, and the coating thickness is controlled between 30-50μm; the high temperature ceramic slurry includes high temperature refractory ceramic powder, a binder, a solvent and an additive; In the formulation of high-temperature ceramic slurry, the particle size of the ceramic powder should be controlled between 5-15μm to ensure that the coating is uniform and has good density. The coating method adopts a spin coating process, and the coating speed is controlled between 2000-3000rpm to ensure that the ceramic slurry is evenly covered on the substrate surface, and the coating thickness is controlled between 30-50μm. In order to improve the adhesion of the coating, a certain proportion of organic solvents (such as acetone) can be added to the ceramic slurry to reduce its viscosity, thereby enhancing the leveling and adhesion of the coating.

[0033] Step S14, vacuum drying: After coating is completed, enter the vacuum drying stage, and dry the substrate coated with the high-temperature ceramic slurry in a vacuum environment (pressure controlled between 0.1-0.5MPa), and the drying temperature is set between 50-80°C.

[0034] This step can effectively remove the solvent in the ceramic slurry, promote the initial solidification of the ceramic powder, and ensure that the coating does not have bubbles and cracks. The drying time is generally 3-6 hours, and the specific time is adjusted according to the substrate size and the characteristics of the ceramic slurry.

[0035] Step S15, secondary coating and baking: re-coating the high temperature ceramic slurry on the dried substrate, using the same spin coating process to make the coating uniform; then performing a baking treatment, setting the temperature in the range of 700-800°C, maintaining it for 2-4 hours, and performing secondary coating on the substrate; In order to improve the high temperature resistance and compactness of the coating, the substrate is coated twice. The ceramic slurry is re-coated on the dried substrate using the same spin coating process to ensure uniform coating. After that, a baking treatment is performed with the temperature set in the range of 700-800°C for 2-4 hours. This process allows the ceramic powder to be completely sintered, enhancing the strength and high temperature resistance of the ceramic layer, and ensuring that the substrate surface has good hardness and corrosion resistance.

[0036] Step S16, cooling and surface inspection: after baking, the substrate is placed in a cooling zone, the cooling rate should be controlled between 1-5°C / min, and after cooling to room temperature, the surface of the coated ceramic layer is inspected; Avoid thermal stress caused by too fast cooling in the cooling zone. After cooling to room temperature, conduct a surface inspection of the applied ceramic layer to check whether the coating is uniform, free of cracks and bubbles, and ensure that the adhesion of the ceramic layer meets the standards. If defects are found, they can be repaired by re-coating or light grinding.

[0037] Step S17, heat treatment strengthening: placing the substrate in a high temperature furnace at 1000-1100° C. for 1-2 hours of high temperature heating to heat treat the substrate coated with the ceramic layer to obtain a high temperature resistant substrate layer; In order to further improve the thermal shock resistance of the coating, the substrate coated with the ceramic layer is heat treated. The substrate is placed in a high-temperature furnace at 1000-1100°C and heated for a short time (1-2 hours) to make the crystal structure of the ceramic layer more stable, thereby enhancing its ability to withstand high temperatures.

[0038] In this embodiment, it is specifically described that step S2 specifically includes: Step S21, surface pretreatment of the substrate layer: Surface pretreatment of the substrate layer includes plasma cleaning or UV / ozone treatment for 5-10 minutes to remove dust and organic pollutants and generate active hydroxyl groups on the substrate surface to improve the adhesion of subsequent electromagnetic shielding materials.

[0039] Step S22, preparing a conductive polymer solution: selecting poly (3, 4-ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS) as the main conductive component, dissolving it in deionized water at a weight ratio of 1-5%, adding 5-10% dimethyl sulfoxide (DMSO) as an auxiliary agent, and using ultrasonic oscillation for 5-10 minutes to ensure that the solution is fully dispersed, thereby preparing a conductive polymer solution; Dimethyl sulfoxide (DMSO) was used as an auxiliary agent to improve the uniformity and conductivity of the solution, and ultrasonic oscillation was used for 5-10 minutes to ensure that the solution was fully dispersed.

[0040] Step S23, preparing a metal coating composite precursor: adding a metal precursor (e.g., a silver ion or copper ion solution) to a conductive polymer solution, wherein the concentration of the metal precursor is controlled within the range of 0.1-0.5 M, and then adding an appropriate amount of a reducing agent (e.g., sodium citrate or ascorbic acid) to perform in-situ chemical reduction at room temperature, wherein the reaction time is controlled within 15-30 minutes, and the generated metal particles are uniformly dispersed in the polymer matrix to form a metal coating composite; Step S24, coating electromagnetic shielding material: the prepared conductive polymer / metal coating composite solution is evenly coated on the surface of the pretreated high temperature resistant substrate layer by an electrostatic spraying process, the coating speed is controlled at 100-150 mm / s, and the coating thickness is regulated between 5-15 μm to obtain a continuous, dense and bubble-free electromagnetic shielding layer; Step S25, intermediate drying treatment: After coating, the workpiece is placed in a drying oven at a temperature of 60-80°C and subjected to intermediate drying treatment in a vacuum environment (pressure controlled at 0.1-0.3MPa) for 30-60 minutes to quickly evaporate the solvent and fix the composite material structure to avoid sagging or uneven coating.

[0041] Step S26, heat treatment and curing: After intermediate drying, the electromagnetic shielding layer is heat treated and cured, and the curing process parameters are temperature 120-150°C and curing time 30-45 minutes; in this process, the interaction between the conductive polymer and the metal particles is further promoted, the overall electromagnetic shielding performance and mechanical adhesion are improved, while the resistance is reduced and the environmental resistance is enhanced.

[0042] Step S27, surface quality inspection and correction: Use electronic scanning equipment to inspect the surface uniformity and density of the cured electromagnetic shielding layer, and use the four-probe method to measure the surface resistance to confirm that the conductivity of the electromagnetic shielding layer meets the predetermined standard. (The resistance value is less than 10 ohms per square, and the square resistance is used to evaluate the conductivity of the electromagnetic shielding layer); if local defects are found during the inspection, local re-coating and re-curing processes are used to correct them until a consistent and excellent shielding effect is achieved.

[0043] In this embodiment, it is specifically described that step S3 specifically includes: Step S31, circuit pattern design and digital processing: using CAD software and circuit simulation tools, designing circuit patterns according to the requirements of aviation equipment in terms of high-frequency transmission and anti-electromagnetic interference, and converting the design data into a digital template file; Convert design data into high-resolution (not less than 2000 dpi) digital template files and generate precise matching pattern layouts based on the actual substrate size; Step S32, precise alignment of the pattern template and the electromagnetic shielding layer: using a digital alignment system, the circuit pattern template is aligned to the surface of the electromagnetic shielding layer, the alignment error is controlled within ±2μm using a fine-tuning platform, and the electromagnetic shielding layer is gently preheated before alignment; (the mild preheating conditions are set to 40-60°C, 3-5 minutes) to enhance the stability of the pattern transfer.

[0044] Step S33, laser cutting process realizes pattern transfer: after completing alignment, ultraviolet laser cutting equipment with a wavelength of 355nm is used to cut the electromagnetic shielding layer under the conditions of laser power of 0.5-1.5W, pulse frequency of 20-50kHz and scanning speed of 100-200 mm / s. The laser cutting depth is strictly controlled within the range of 5-15μm to cut the shielding layer to form a preset circuit pattern; at the same time, the underlying high temperature resistant substrate is not damaged.

[0045] As an alternative to laser cutting, the pre-aligned circuit pattern template is first coated with a layer of photosensitive resist, and then treated in a developer for 2-4 minutes after UV exposure to reveal the outline of the circuit pattern. The workpiece is then immersed in a 1-3% concentration of diluted nitric acid or hydrochloric acid solution for etching. The etching time is controlled within 1-3 minutes, thereby achieving accurate removal of the electromagnetic shielding layer and forming a clear circuit layout; Step S34, post-processing: ultrasonically clean the processed circuit pattern area to remove residual impurities and obtain a circuit board with a circuit pattern.

[0046] Regardless of whether laser cutting or chemical etching is used, the processed circuit pattern area is ultrasonically cleaned to remove residual impurities and resist. Then, an optical microscope and laser scanner are used to detect the neatness of the pattern edge and the uniformity of the line width to ensure that the error is controlled within ±1μm. At the same time, the detection data is recorded to facilitate the optimization of subsequent process parameters.

[0047] In this embodiment, it is specifically described that step S4 specifically includes: Step S41, selecting a copper-nickel alloy or a copper-silver alloy as a copper alloy film material, and performing surface treatment on the copper alloy film, specifically, pickling with an acid solution to remove surface oxides and oil stains, then washing with deionized water, and drying with nitrogen; Select a suitable copper alloy film (such as copper-nickel alloy, copper-silver alloy), the thickness of which is generally between 15-35μm, and adjust the alloy composition according to the power and transmission requirements of the circuit. First, the copper alloy film is surface treated by pickling with an acid solution (such as sulfuric acid or sodium chloride solution) to remove surface oxides and oil stains. After treatment, it is washed with deionized water and dried with nitrogen to ensure that the surface is clean and pollution-free, providing good adhesion for subsequent wiring.

[0048] Step S42, according to the designed circuit pattern, using a laser etching process to remove unnecessary parts of the surface of the copper alloy film to form a circuit pattern; the laser power is set to 1-3W, the scanning speed is controlled between 100-300mm / s, and the cutting depth is 10-20μm to divide the circuit path; Step S43, docking the treated copper alloy film with the pre-prepared polymer composite middle layer, aligning the edge of the circuit pattern with the edge of the polymer composite middle layer, and then laminating the copper alloy film and the polymer composite together by hot pressing, with the temperature set at 120-150°C, the pressure controlled at 0.5-1.0MPa, and the lamination time being 30-60 minutes; The combination of copper alloy film and polymer composite middle layer: The treated copper alloy film is docked with the pre-prepared polymer composite middle layer (such as polyimide film or epoxy resin film), and a precision alignment device is used to ensure that the circuit pattern is accurately aligned with the middle layer material, with an error control within ±2μm. Subsequently, the copper alloy film and the polymer composite are laminated together, and the lamination is performed by hot pressing, with the temperature set at 120-150°C, the pressure controlled at 0.5-1.0MPa, and the lamination time is 30-60 minutes to ensure good adhesion and a stable structure.

[0049] Step S44, during the lamination process, the copper alloy film and the polymer composite material are placed in a vacuum bag and hot-pressed and laminated under vacuum; Vacuum environment control during lamination: During the lamination process, vacuum bag lamination technology is used to ensure the close bonding between the copper alloy film and the polymer composite material. The materials are placed in a vacuum bag and hot-pressed and laminated under vacuum, with the vacuum degree maintained between 0.08-0.1MPa. This process can effectively remove bubbles and air layers that may exist during the lamination process, and improve the compactness of the lamination and the electrical connection performance.

[0050] Step S45, after lamination is completed, the product is placed in a cooling tank, the cooling rate is controlled between 2-5°C / min, and after cooling to room temperature, a curing treatment is performed, the curing temperature is set to 150°C, and the curing time is 30 minutes, so that the bonding force between the pressed copper alloy film and the polymer composite material layer reaches the maximum value, forming an electrical connection layer; After lamination, the electrical connection layer is strictly inspected for quality, using a microscope to check the clarity of the circuit pattern and the adhesion of the copper alloy film. A resistance tester is used to test the conductivity of the electrical connection layer to ensure that there are no short circuits or open circuits in the circuit. For defects found during the inspection, a local repair process can be used to repair them through welding or conductive glue to ensure that the final product meets high standards of electrical connection quality.

[0051] In this embodiment, it is specifically described that step S5 specifically includes: Step S51, selecting epoxy resin or polyimide resin as the high-strength polymer resin material, and controlling the viscosity of the resin between 300-500 cP; Choose high-strength polymer resin materials: Choose polymer resin materials with excellent high temperature resistance, corrosion resistance and mechanical strength. Epoxy resin or polyimide resin is recommended. These resin materials can withstand high temperature, high pressure and strong mechanical impact of aviation equipment in extreme environments. The viscosity of the resin is controlled between 300-500 cP to ensure fluidity and uniformity in the coating process. At the same time, nano-scale fillers (such as silicon powder, carbon nanotubes, etc.) can be added to the resin to enhance its wear resistance and electrical insulation properties.

[0052] Step S52, before coating the resin, the circuit board surface is subjected to surface activation treatment, such as plasma treatment or ultraviolet / ozone treatment, and the treatment time is 3-5 minutes; PCB surface pretreatment: Before applying the resin, the PCB surface is pretreated to ensure good adhesion of the resin to the PCB. The pretreatment step includes cleaning the surface with a solvent (such as acetone or isopropyl alcohol) to remove surface grease and impurities. Subsequently, the PCB surface is activated by plasma treatment or UV / ozone treatment to increase its surface energy and adhesion. The treatment time is 3-5 minutes, and the resin is applied immediately after the treatment to avoid re-contamination of the surface.

[0053] Step S53, using a spraying process, using an automatic spraying device to evenly spray the high-strength polymer resin material on the surface of the circuit board, the spraying speed is controlled at 100-150 mm / s, the distance between the nozzle and the circuit board surface is controlled between 5-10 cm, and the thickness of the spray layer is controlled between 20-50 μm; Choose the appropriate resin coating method based on the complexity and surface characteristics of the circuit board. Common coating methods include dip coating and spraying. If dip coating is used, the circuit board is completely immersed in the resin solution and the dipping time is controlled to 10-20 seconds to ensure that the resin evenly covers the entire surface.

[0054] Whether using the dipping or spraying process, the coated circuit board needs to be treated evenly to ensure the flatness and bubble-free resin layer. In the dipping process, the circuit board is vibrated or centrifuged using a vibrating table or centrifuge to remove excess resin and evenly distribute the resin. For the spraying process, an automatic spraying robot is used for uniform spraying, and the circuit board is left to stand after coating to ensure that the resin is naturally leveled and avoid uneven thickness or bubbles.

[0055] Step S55, after the resin coating is completed, a curing treatment is performed to form an outer protective layer; the curing temperature is set to 120-160° C. and the curing time is 30-60 minutes; Ensure that the resin layer reaches optimal strength and stability. The specific curing time is adjusted according to the type and thickness of the resin. The process can be heated by infrared heating, hot air circulation or oven to ensure uniform curing of the resin. After curing, the resin layer has high mechanical strength and heat resistance, effectively improving the protection performance of the circuit board.

[0056] In this embodiment, it is specifically described that step S6 specifically includes: Step S61, installing the metal connector on the edge area of ​​the circuit board, aligning and fixing it by a positioning device; Selection and installation of metal connectors: Select metal connectors that are suitable for the high frequency and high strength requirements of aviation equipment. It is recommended to use highly conductive and corrosion-resistant materials such as copper alloy, aluminum alloy or stainless steel. The size of the metal connector should be customized according to the layout of the edge area of ​​the circuit board. The aperture and contact point design of the connector should ensure stable electrical contact. Install the metal connector on the edge area of ​​the circuit board, align and fix it with a precise positioning device. Use appropriate pressure during the installation process to fully press the connector into the preset groove. The installation depth of the connector must ensure good and stable contact.

[0057] Step S62, connecting the metal connector to the circuit board by crimping, with the crimping pressure controlled between 0.5-1.0 MPa and the crimping time being 10-15 seconds, so that the metal connector is completely pressed into the preset groove; To ensure stable electrical contact and avoid cold soldering or poor contact. After crimping, check the contact resistance of the connection part to ensure that the connection impedance is less than 10mΩ. If the connector is a terminal type, ensure that the connection area between the terminal and the circuit board meets the requirements and the connection is firm and durable.

[0058] Step S63, according to the circuit pattern and connection requirements, 3D printing design of connection points is performed on the surface of the circuit board, modeling is performed using 3D design software, and a resin material with high conductivity is selected for printing using a 3D printing device to print connection points on the surface of the circuit board; Design and printing of 3D printed connection points: According to the circuit pattern and connection requirements, 3D print the connection points on the surface of the circuit board, and use 3D design software for modeling to ensure that the connection points are accurately connected with metal connectors and exposed ports. Use high-precision 3D printing equipment (such as FDM or SLA technology) and select resin materials with high conductivity (such as silver nano conductive ink or conductive polymer) for printing. During the printing process, set the printing layer thickness to 50-100μm and the printing speed to 20-30mm / s to ensure that the printed connection points have good structural strength and conductivity.

[0059] Step S64, after the 3D printing is completed, the printed connection points are post-processed, the post-processing includes cleaning to remove excess resin material and performing a curing process; The curing temperature is set at 80-100°C and the curing time is 20-30 minutes. Then use a microscope to check the dimensional accuracy, surface flatness and continuity of the printed connection points to ensure that there are no breaks or defects in the printing path. Through the conductivity test, confirm that the conductivity of the printed connection points meets the electrical connection requirements.

[0060] Step S65, docking the connection point formed by 3D printing with the exposed port to ensure that the connection point and the port are firmly docked, and then fixing them with conductive glue, and coating a layer of insulating material around the docking position; Docking and fixing the connection point and the exposed port: Docking the connection point formed by 3D printing with the exposed port to ensure that the connection point and the port are firmly connected and the electrical connection is stable. After docking, use welding or conductive glue to fix to ensure the stability of the connection point. Apply a thin layer of insulating material around the docking part to avoid poor contact and short circuit. Check the electrical connectivity between the connection point and the port to ensure unimpeded signal transmission.

[0061] Step S66, after the connection is completed, a final inspection of visual inspection and electrical performance test is performed. Specifically, it includes the use of surface scanners and X-ray detectors to perform non-destructive testing on the circuit board to ensure that the quality of all connection points meets the standards. Accelerated life tests under environmental conditions such as high temperature, humidity, and vibration are performed to verify the reliability of the circuit board in harsh environments. During the test, the temperature range is set to -40°C to 85°C, the humidity is 85%, the vibration frequency is 10-500Hz, and the continuous test time is 72 hours.

[0062] Embodiment 2: The present invention further provides a circuit board structure of aviation equipment, which is manufactured using the manufacturing process of the circuit board structure of aviation equipment in Embodiment 1, and the circuit board structure includes: The substrate layer is composed of a carbon fiber reinforced ceramic substrate coated with a high-temperature ceramic slurry and is used as the basic supporting layer of the circuit board.

[0063] The electromagnetic shielding layer is coated on the surface of the substrate layer and is composed of a composite material of a conductive polymer and a metal plating layer. It is used to isolate external electromagnetic interference and ensure the electromagnetic compatibility of the circuit board.

[0064] The circuit connection layer is formed by a copper alloy film through a laser cutting or etching process, and a circuit pattern is formed along the surface of the electromagnetic shielding layer; it is used to connect various electrical functional areas.

[0065] The outer protective layer is coated on the surface of the circuit connection layer and is made of high-strength polymer resin material. It is used to protect the circuit board from damage by external factors and enhance its corrosion resistance and mechanical impact resistance.

[0066] Metal connectors are installed on the edge of the circuit board and are connected by crimping to ensure stable and reliable electrical connection with external devices.

[0067] 3D printed connection points are formed on the surface of the circuit board through 3D printing technology and are used to connect the circuit pattern with the electrical connection points of the exposed ports; ensuring the accuracy and stability of the connection points.

[0068] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing process for a circuit board structure of aviation equipment, characterized in that: include: Step S1, providing a carbon fiber reinforced ceramic substrate, coating a high temperature ceramic slurry on the carbon fiber reinforced ceramic substrate after desizing, and forming a high temperature resistant substrate layer by vacuum drying; Step S2, coating an electromagnetic shielding material on the surface of the substrate layer to form an electromagnetic shielding layer, wherein the electromagnetic shielding material comprises a composite of a conductive polymer and a metal plating layer; Step S3, designing a circuit pattern on the electromagnetic shielding layer, and transferring the circuit pattern to the electromagnetic shielding layer by laser cutting or etching to form a circuit layout; Step S4, wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer; Step S5, coating the surface of the circuit board with a high-strength polymer resin material, and coating it evenly by a spraying process, and then performing a curing treatment to form an outer protective layer; Step S6, installing metal connectors on the edge area of ​​the circuit board and connecting them by crimping, then performing a 3D printing process to print connection points on the surface of the circuit board and connect the exposed ports to obtain a circuit board structure.

2. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S1 specifically includes: Step S11, providing a carbon fiber reinforced ceramic substrate: the pretreated carbon fiber and ceramic powder are subjected to a hot pressing process and a high-temperature sintering process to form a high-strength, high-temperature resistant carbon fiber reinforced ceramic substrate suitable for aviation equipment application, and the substrate thickness is in the range of 0.2 mm to 1.5 mm; Step S12, performing a desizing process: using an acidic solution for removing unbound substances on the surface, soaking the carbon fiber reinforced ceramic substrate at room temperature for 5-15 minutes to perform a desizing process on the substrate; Step S13, coating high temperature ceramic slurry: coating the surface of the desizing carbon fiber reinforced ceramic substrate with high temperature ceramic slurry, the coating method adopts a spin coating process, the coating speed is controlled between 2000-3000rpm, and the coating thickness is controlled between 30-50μm; the high temperature ceramic slurry includes high temperature refractory ceramic powder, a binder, a solvent and an additive; Step S14, vacuum drying: After coating is completed, enter the vacuum drying stage, and dry the substrate coated with the high-temperature ceramic slurry in a vacuum environment, and the drying temperature is set between 50-80°C.

3. The manufacturing process of the circuit board structure of aviation equipment according to claim 2, characterized in that: After step S14, the following steps are also included: Step S15, secondary coating and baking: re-coating the high temperature ceramic slurry on the dried substrate, using the same spin coating process to make the coating uniform; then performing a baking treatment, setting the temperature in the range of 700-800°C, maintaining it for 2-4 hours, and performing secondary coating on the substrate; Step S16, cooling and surface inspection: after baking, the substrate is placed in a cooling zone, the cooling rate should be controlled between 1-5°C / min, and after cooling to room temperature, the surface of the coated ceramic layer is inspected; Step S17, heat treatment strengthening: placing the substrate in a high temperature furnace at 1000-1100°C for 1-2 hours of high temperature heating, heat treating the substrate coated with the ceramic layer to obtain a high temperature resistant substrate layer.

4. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S2 specifically includes: Step S21, surface pretreatment of the substrate layer: performing surface pretreatment on the substrate layer, including plasma cleaning or ultraviolet light / ozone treatment for 5-10 minutes to remove dust and organic pollutants and generate active hydroxyl groups on the surface of the substrate; Step S22, preparing a conductive polymer solution: selecting poly(3,4-ethylenedioxythiophene):polystyrene sulfonate as the main conductive component, dissolving it in deionized water at a weight ratio of 1-5%, adding 5-10% dimethyl sulfoxide as an auxiliary agent, and using ultrasonic oscillation for 5-10 minutes to ensure that the solution is fully dispersed, thereby preparing a conductive polymer solution; Step S23, preparing a metal coating composite precursor: adding a metal precursor to a conductive polymer solution, wherein the concentration of the metal precursor is controlled within the range of 0.1-0.5M, and then adding an appropriate amount of a reducing agent to perform in-situ chemical reduction at room temperature, wherein the reaction time is controlled within 15-30 minutes, and the generated metal particles are uniformly dispersed in the polymer matrix to form a metal coating composite; Step S24, coating electromagnetic shielding material: the prepared conductive polymer / metal plating composite solution is evenly coated on the surface of the pretreated high-temperature resistant substrate layer by an electrostatic spraying process, the coating speed is controlled at 100-150 mm / s, and the coating thickness is adjusted between 5-15 μm to obtain a continuous, dense and bubble-free electromagnetic shielding layer.

5. The manufacturing process of the circuit board structure of aviation equipment according to claim 4, characterized in that: After step S24, the following steps are also included: Step S25, intermediate drying treatment: after coating, the workpiece is placed in a drying oven at a temperature of 60-80° C. and subjected to intermediate drying treatment in a vacuum environment for 30-60 minutes; Step S26, heat treatment and curing: after intermediate drying, the electromagnetic shielding layer is heat treated and cured, and the curing process parameters are a temperature of 120-150° C. and a curing time of 30-45 minutes; Step S27, surface quality inspection and correction: electronic scanning equipment is used to inspect the surface uniformity and density of the cured electromagnetic shielding layer, and the surface resistance is measured by a four-probe method to confirm that the conductivity of the electromagnetic shielding layer meets the predetermined standard.

6. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S3 specifically includes: Step S31, circuit pattern design and digital processing: using CAD software and circuit simulation tools, designing circuit patterns according to the requirements of aviation equipment in terms of high-frequency transmission and anti-electromagnetic interference, and converting the design data into a digital template file; Step S32, precise alignment of the pattern template and the electromagnetic shielding layer: using a digital alignment system, aligning the circuit pattern template to the surface of the electromagnetic shielding layer, using a fine-tuning platform to control the alignment error within ±2 μm, and gently preheating the electromagnetic shielding layer before alignment; Step S33, laser cutting process to achieve pattern transfer: after alignment is completed, ultraviolet laser cutting equipment with a wavelength of 355nm is used to cut the electromagnetic shielding layer under the conditions of laser power of 0.5-1.5W, pulse frequency of 20-50kHz and scanning speed of 100-200 mm / s, and the laser cutting depth is strictly controlled within the range of 5-15μm to cut the shielding layer to form a preset circuit pattern; Step S34, post-processing: ultrasonically clean the processed circuit pattern area to remove residual impurities and obtain a circuit board with a circuit pattern.

7. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S4 specifically includes: Step S41, selecting a copper-nickel alloy or a copper-silver alloy as a copper alloy film material, and performing surface treatment on the copper alloy film, specifically, pickling with an acid solution to remove surface oxides and oil stains, then washing with deionized water, and drying with nitrogen; Step S42, according to the designed circuit pattern, using a laser etching process to remove unnecessary parts of the surface of the copper alloy film to form a circuit pattern; the laser power is set to 1-3W, the scanning speed is controlled between 100-300mm / s, and the cutting depth is 10-20μm to divide the circuit path; Step S43, docking the treated copper alloy film with the pre-prepared polymer composite middle layer, aligning the edge of the circuit pattern with the edge of the polymer composite middle layer, and then laminating the copper alloy film and the polymer composite together by hot pressing, with the temperature set at 120-150°C, the pressure controlled at 0.5-1.0MPa, and the lamination time being 30-60 minutes; Step S44, during the lamination process, the copper alloy film and the polymer composite material are placed in a vacuum bag and hot-pressed and laminated under vacuum; Step S45, after lamination is completed, the product is placed in a cooling tank, the cooling rate is controlled between 2-5°C / min, and after cooling to room temperature, a curing treatment is performed. The curing temperature is set to 150°C and the curing time is 30 minutes, so that the bonding force between the laminated copper alloy film and the polymer composite material layer reaches the maximum value to form an electrical connection layer.

8. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S5 specifically includes: Step S51, selecting epoxy resin or polyimide resin as the high-strength polymer resin material, and controlling the viscosity of the resin between 300-500 cP; Step S52, before coating the resin, the circuit board surface is subjected to surface activation treatment, such as plasma treatment or ultraviolet / ozone treatment, and the treatment time is 3-5 minutes; Step S53, using a spraying process, using an automatic spraying device to evenly spray the high-strength polymer resin material on the surface of the circuit board, the spraying speed is controlled at 100-150 mm / s, the distance between the nozzle and the circuit board surface is controlled between 5-10 cm, and the thickness of the spray layer is controlled between 20-50 μm; Step S55, after the resin coating is completed, a curing treatment is performed to form an outer protective layer; the curing temperature is set to 120-160°C, and the curing time is 30-60 minutes.

9. The manufacturing process of the circuit board structure of aviation equipment according to claim 1, characterized in that: The step S6 specifically includes: Step S61, installing the metal connector on the edge area of ​​the circuit board, aligning and fixing it by a positioning device; Step S62, connecting the metal connector to the circuit board by crimping, with the crimping pressure controlled between 0.5-1.0 MPa and the crimping time being 10-15 seconds, so that the metal connector is completely pressed into the preset groove; Step S63, according to the circuit pattern and connection requirements, 3D printing design of connection points is performed on the surface of the circuit board, modeling is performed using 3D design software, and a resin material with high conductivity is selected for printing using a 3D printing device to print connection points on the surface of the circuit board; Step S64, after the 3D printing is completed, the printed connection points are post-processed, the post-processing includes cleaning to remove excess resin material and performing a curing process; Step S65, docking the connection point formed by 3D printing with the exposed port to ensure that the connection point and the port are firmly docked, and then fixing them with conductive glue, and coating a layer of insulating material around the docking position; Step S66, after the connection is completed, a final inspection of visual inspection and electrical performance test is performed.

10. A circuit board structure for aviation equipment, characterized in that: The circuit board structure is manufactured by using the manufacturing process of the circuit board structure of aviation equipment according to any one of claims 1 to 9, wherein the circuit board structure comprises: The substrate layer is composed of a carbon fiber reinforced ceramic substrate coated with a high-temperature ceramic slurry and is used as a basic support layer for the circuit board; An electromagnetic shielding layer, coated on the surface of the substrate layer, composed of a composite material of a conductive polymer and a metal plating layer, for isolating external electromagnetic interference; A circuit connection layer is formed by a copper alloy film through a laser cutting or etching process, and a circuit pattern is formed along the surface of the electromagnetic shielding layer; An outer protective layer, coated on the surface of the circuit connection layer, is made of a high-strength polymer resin material and is used for protection; Metal connectors are installed at the edge of the circuit board and connected by crimping; 3D printed connection points are formed on the surface of the circuit board using 3D printing technology and are used to connect the circuit pattern to the electrical connection points of the exposed ports.

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