Water-cooled power module and control method for heat dissipation of water-cooled power module

Abstract

The embodiment of the present application provides a water-cooled power module and a control method for heat dissipation of the water-cooled power module, wherein the water-cooled power module comprises: a mainboard; a plurality of functional units which are spaced apart on the mainboard, and the functional units have different working temperatures when working; and a water cooling system comprising a plurality of branches, wherein each branch comprises a water flow adjusting assembly, and each branch is correspondingly arranged on one side of the functional unit away from the mainboard. By arranging the branch of the water cooling system on each functional unit, the water flow of each branch can be independently controlled by the water flow adjusting assembly, and when the temperatures of the plurality of functional units are different, heat dissipation adjustment can be performed through water flow control, so that the normal work of the high-temperature component is achieved. The problem that the water-cooled power module in the related art cannot balance and adjust the heat dissipation of the plurality of components is solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, to a water-cooled power supply module and a control method for heat dissipation of the water-cooled power supply module. Background Technology

[0002] In existing technologies, the cooling system of a power module only provides water cooling for a limited number of components, and the flow rate is fixed and cannot be adjusted. When water cooling is applied to a specific component, once an equilibrium is reached, that component operates at a lower temperature and achieves good performance, while the temperatures of other components rise, and cooling by fans alone is insufficient. Summary of the Invention

[0003] This application provides a water-cooled power supply module and a method for controlling the heat dissipation of the water-cooled power supply module, so as to at least solve the problem in the related art that the water-cooled power supply module cannot balance and adjust the heat dissipation of multiple components therein.

[0004] According to one embodiment of this application, a water-cooled power supply module is provided, including: a motherboard; multiple functional units located at intervals on the motherboard, the functional units having different operating temperatures during operation; and a water-cooling system including multiple branches, each branch including a water flow regulating component, the branches being located one-to-one with each functional unit on the side opposite to the motherboard.

[0005] In an exemplary embodiment, the branch further includes a heat dissipation assembly, which includes a main heat dissipation section, a water inlet section, a water outlet section, and a plurality of temperature sensors, wherein: the water inlet section is located on one side of the main heat dissipation section; the water outlet section is located on the side of the main heat dissipation section opposite to the water inlet section; the temperature sensors are electrically connected to the motherboard, and the temperature sensors are located at the water inlet section and the water outlet section respectively; the main heat dissipation section includes a water flow path, which communicates with the water outlet section and the water inlet section, and the water flow path has a single-channel structure, which includes a plurality of first portions and a plurality of second portions, wherein the first portions extend along the water inlet direction of the water inlet section, and adjacent first portions are spaced apart by being connected to the second portions, so that... The water flow path is continuous, or the water flow path has a multi-channel structure, the multi-channel including a first part, a second part and multiple third parts. The first part connects the water inlet and the water outlet. The extension direction of the first part near the water inlet is consistent with the water inlet direction of the water inlet, and the extension direction of the first part near the water outlet is perpendicular to the water outlet direction of the water outlet. The second part connects the water inlet and the water outlet. The extension direction of the second part near the water inlet is perpendicular to the water inlet direction of the water inlet, and the extension direction of the second part near the water outlet is consistent with the water outlet direction of the water outlet. The third parts are distributed at intervals by connecting to the first part and the second part respectively.

[0006] In one exemplary embodiment, the branch further includes a one-way valve connected to the water outlet.

[0007] In one exemplary embodiment, the water-cooled power module further includes a main water inlet channel, a main water outlet channel, and multiple interfaces, wherein: the main water inlet channel is connected to the water inlet section and the interfaces respectively, and the main water outlet channel is connected to the water outlet section and the interfaces respectively.

[0008] In one exemplary embodiment, the water-cooled power module further includes a housing, a latch, a handle, and a connector, wherein: the latch and the handle are located on one side of the housing, the connector is located on the side of the housing opposite to the latch, and the motherboard is located inside the housing.

[0009] In one exemplary embodiment, the water-cooled power module further includes an air-cooling component located inside the housing and on the motherboard near the handle, wherein the airflow direction of the air-cooling component is the side of the handle pointing towards the connector.

[0010] According to another embodiment of this application, a method for controlling heat dissipation of a water-cooled power module is provided. This method involves obtaining the first temperature of multiple functional units of the water-cooled power module during operation; determining the temperature margin of each functional unit based on the first temperature and a preset temperature; and controlling the opening angle of the water flow adjustment component of the water-cooling system in the water-cooled power module corresponding to the multiple functional units according to the order of their temperature margins, thereby adjusting the heat dissipation degree of the multiple functional units. The larger the temperature margin of a functional unit, the larger or smaller the corresponding opening angle.

[0011] In an exemplary embodiment, obtaining the first temperature of the plurality of functional units of the water-cooled power module during operation includes: obtaining the second temperature of the inlet portion and the third temperature of the outlet portion of the plurality of branches in the water-cooling system located on the plurality of functional units, and determining the first temperature based on the second temperature and the third temperature.

[0012] In an exemplary embodiment, the control method further includes: when the temperature margins of multiple functional units are all greater than zero, determining whether the difference between the maximum temperature margin and the minimum temperature margin of the functional units satisfies a preset margin; if the determination indicates yes, determining whether a first water flow regulating component of multiple branches in the water cooling system having the minimum temperature margin is fully open; if the first water flow regulating component is determined to be fully open, determining the reduced opening angle of a second water flow regulating component of the branch having the maximum temperature margin based on a preset temperature and the maximum temperature margin, and adjusting the second water flow regulating component based on the angle; if the first water flow regulating component is determined not to be fully open, controlling the first water flow regulating component to be fully open.

[0013] In an exemplary embodiment, when the temperature margins of multiple functional units are not all greater than zero, it is determined whether the difference between the maximum and minimum temperature margins of the functional units meets a preset margin; if the determination indicates yes, it is determined whether the first water flow regulating component of the multiple branches in the water cooling system having the minimum temperature margin is fully open; if it is determined that the first water flow regulating component is fully open, based on the preset temperature and at least one temperature margin greater than zero, the angle of reducing the opening of the third water flow regulating component of the branch having at least one temperature margin greater than zero is determined, and the third water flow regulating component is adjusted according to the angle; if it is determined that the first water flow regulating component is not fully open, the first water flow regulating component is controlled to be fully open.

[0014] This application addresses the issue of water cooling in a water-cooled power module. The water cooling system comprises multiple branches, each dissipating heat from a specific functional module. Each branch also includes a water flow regulation component. This allows the water cooling system to adjust the water flow according to the specific operating conditions of each functional module, ensuring a consistent operating temperature across all functional units and guaranteeing the overall performance of the water-cooled power module. By establishing branches of the water cooling system on each functional unit, each branch can independently control the water flow through the regulation component. When temperature differences arise among multiple functional units, heat dissipation can be regulated through water flow control, ensuring the normal operation of high-temperature components. This solves the problem in related technologies where water-cooled power modules cannot balance the heat dissipation of multiple components. Attached Figure Description

[0015] Figure 1 This is a top-view perspective structural diagram of a water-cooled power supply module according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of the branch structure of the water cooling system of another water-cooled power module according to an embodiment of this application;

[0017] Figure 3 This is a three-dimensional structural schematic diagram of a water-cooled power supply module according to an embodiment of this application;

[0018] Figure 4 This is a flowchart illustrating a method for controlling heat dissipation of a water-cooled power module according to an embodiment of this application.

[0019] Figure 5 This is a flowchart illustrating another water-cooled power module heat dissipation control method according to an embodiment of this application.

[0020] The reference numerals in the above figures include:

[0021] 10. Mainboard; 21. Water cooling system; 22. Functional unit; 23. Water flow regulation component; 30. Heat dissipation component; 31. Main heat dissipation unit; 32. Water inlet; 33. Water outlet; 34. Temperature sensor; 35. Quick connector; 36. Fixing nut; 40. Water flow path; 41. First part; 42. Second part; 43. Third part; 50. Check valve; 60. Main water inlet channel; 70. Main water outlet channel; 80. Interface; 90. Housing; 100. Buckle; 110. Handle; 120. Connector; 130. Air cooling component. Detailed Implementation

[0022] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0024] This embodiment provides a water-cooled power supply module. Figure 1 This is a top-view perspective structural diagram of the water-cooled power supply module according to an embodiment of this application, as shown below. Figure 1 As shown, it includes: a motherboard 10; a water cooling system 21, including multiple branches, each branch including a water flow regulating component, the branches being located one-to-one with the functional unit 22 on the side opposite to the motherboard 10; multiple functional units 22, spaced apart on the motherboard 10, the functional units 22 having different operating temperatures during operation.

[0025] The water-cooled power module incorporates a water-cooling system with multiple branches, each dissipating heat from a specific functional module. Each branch also features a water flow regulation component, allowing the system to adjust water flow according to the specific operating conditions of each module. This ensures that the operating temperatures of all functional units within the water-cooled power module are essentially uniform, guaranteeing overall performance. By establishing branches of the water-cooling system on each functional unit, each branch can independently control water flow through the regulation component. When temperature differences arise among multiple functional units, heat dissipation can be regulated through water flow control, ensuring the normal operation of high-temperature components. This solves the problem in related technologies where water-cooled power modules cannot balance the heat dissipation of multiple components.

[0026] In the above embodiments, such as Figure 1 As shown, the above-mentioned functional unit 22 is in Figure 1 In the top view, it will be covered by the water cooling system located on it. The temperature of each functional unit 22 is different during operation, and the area occupied by each functional unit 22 is also different. Therefore, it is necessary to design the water cooling system 21 located on the functional unit 22 in a targeted manner to avoid wasting resources.

[0027] In one alternative, such as Figure 1 and Figure 2As shown, the aforementioned branch also includes a heat dissipation assembly 30, which includes a main heat dissipation section 31, a water inlet section 32, a water outlet section 33, and multiple temperature sensors 34. Specifically: the water inlet section 32 is located on one side of the main heat dissipation section 31; the water outlet section 33 is located on the side of the main heat dissipation section 31 opposite to the water inlet section 32; the temperature sensors 34 are electrically connected to the main board 10 and are located at the water inlet section 32 and the water outlet section 33, respectively; the main heat dissipation section 31 includes a water flow path 40, which communicates with the water outlet section 33 and the water inlet section 32. The water flow path 40 has a single-channel structure, comprising multiple first portions 41 and multiple second portions 42. The first portions 41 extend along the water inlet direction of the water inlet section 32, and adjacent first portions 41 are spaced apart by being connected to the second portions 42, so that the aforementioned... The water flow path 40 is continuous, or the structure of the water flow path 40 is a multi-channel structure, which includes a first part 41, a second part 42 and a plurality of third parts 43. The first part 41 connects the water inlet 32 ​​and the water outlet 33. The extension direction of the first part 41 near the water inlet 32 ​​is consistent with the water inlet direction of the water inlet 32, and the extension direction of the first part 41 near the water outlet 33 is perpendicular to the water outlet direction of the water outlet 33. The second part 42 connects the water inlet 32 ​​and the water outlet 33. The extension direction of the second part 42 near the water inlet 32 ​​is perpendicular to the water inlet direction of the water inlet 32, and the extension direction of the second part 42 near the water outlet 33 is consistent with the water outlet direction of the water outlet 33. The third parts 43 are distributed at intervals by connecting to the first part 41 and the second part 42 respectively.

[0028] In the above embodiments, such as Figure 1 and Figure 2 As shown, the heat dissipation assembly 30 also includes a quick connector 35 and a fixing nut 36. The quick connector 35 allows for quick connection to the inlet and outlet pipes of the water-cooled power module while ensuring good interface sealing. The temperature sensor 34 is connected to the motherboard 10 via a cable, drawing power from the motherboard 10 and transmitting data with it. Flexible hoses can be used as quick connectors at the inlet 32 ​​and outlet 33 to facilitate fine-tuning of the relative position of the main heat dissipation unit 31 when fixing it. The fixing nut 36 secures the main heat dissipation unit 31 to the functional unit 22, ensuring good contact between them. Thermal grease is applied to the contact surface between the main heat dissipation unit 31 and the functional unit 22 to accelerate heat transfer. The main heat dissipation unit 31 contains a tortuous water flow path 40 to increase the contact area between the cooling water and the main heat dissipation unit 31, improving heat dissipation efficiency.

[0029] The external dimensions of the main heat dissipation section 31 are determined by the size of the corresponding functional unit 22. The water flow path 40 can be designed and optimized according to the heat generation of the functional unit 22. The water flow path 40 can include single-channel and multi-channel (Z-shaped pipe) types. For example, for two functional units 22 with the same heat dissipation contact area, the functional unit 22 with greater heat generation should adopt the multi-channel design on the right. The multi-channel type has a shorter water flow path, lower pipe flow resistance, faster cooling water flow speed, and a larger contact area with the main heat dissipation section 31, which can remove more heat.

[0030] The single-channel type includes a first part 41 and a second part 42, which are interconnected to form a shape such as... Figure 2 The left-hand diagram illustrates the morphology; the multi-channel type includes a first part 41, a second part 42, and a third part 43, which are interconnected to form a shape as shown in the diagram. Figure 2 The shape shown in the diagram on the right.

[0031] In one alternative, such as Figure 1 As shown, the above-mentioned branch also includes a one-way valve 50, which is connected to the above-mentioned water outlet 33.

[0032] In the above embodiments, such as Figure 1 As shown, the one-way valve 50 can prevent water from flowing back, which would prevent the branch's heat dissipation system from dissipating heat properly and disrupt the overall heat dissipation of the water-cooled power module.

[0033] In one alternative, such as Figure 1 As shown, the water-cooled power module also includes a main water inlet channel 60, a main water outlet channel 70, and multiple interfaces 80, wherein: the main water inlet channel 60 is connected to the water inlet section 32 and the interfaces 80 respectively, and the main water outlet channel 70 is connected to the water outlet section 33 and the interfaces 80 respectively.

[0034] In the above embodiments, such as Figure 1As shown, the aforementioned water-cooled power module allows for easy front maintenance and supports hot-swapping of the power connector 120 and heat dissipation components. Both the main inlet channel 60 and the main outlet channel 70 are connected to interfaces 80, which can be quick-connect male connectors. These male connectors mate with the female connectors on the power supply frame to achieve quick connection and disassembly with external piping. The main outlet channel 70 has multiple openings for connecting to the water flow regulating component 23. The water flow regulating component 23 can be an electronic ball valve, connected to the inlet section 32 via threads and equipped with sealing gaskets to prevent leakage. The water flow regulating component 23 is connected to the motherboard 10 via a cable, drawing power from and transmitting data with the motherboard 10. The water flow regulating component 23 is controlled by the motherboard 10 (MCU). The water flow regulating component 23 can control the cross-sectional area and flow rate by adjusting the valve opening angle. The other end of the water flow regulating component 23 is a quick-connect male connector, which mates with the quick-connect female connector of the inlet section 32 of the main heat dissipation section 31 to achieve quick connection and disassembly while ensuring good packaging sealing. The main water outlet channel 70 has multiple openings, which are connected to the one-way valve 50 via threads, and sealing gaskets are added to prevent leakage. The other end of the one-way valve 50 is a quick-connect male connector, which mates with the quick-connect female connector of the water outlet 33 of the main heat dissipation section 31 to achieve quick assembly and disassembly, while ensuring good packaging sealing.

[0035] When the water-cooled power module is operating in the liquid cooling system, it is essential to ensure that there is no gas in the loop. Therefore, the liquid cooling pipes of the water-cooled power module should be filled with coolant before connecting it to the system for direct use, enabling blind insertion. When the water-cooled power module is stored separately, the main inlet channel 60, the main outlet channel 70, and the heat dissipation components are all filled with coolant, and the interface 80 is kept closed to ensure that the internal coolant is isolated from the outside environment.

[0036] In one alternative, such as Figure 3 As shown, the water-cooled power module also includes a housing 90, a latch 100, a handle 110, and a connector 120, wherein: the latch 100 and the handle 110 are located on one side of the housing 90, the connector 120 is located on the side of the housing 90 opposite to the latch 100, and the motherboard is located inside the housing 90.

[0037] In the above embodiments, such as Figure 3As shown, the interface 80 of the water-cooled power module can mate with a quick-connect female connector fixed on the power supply frame, and the power supply connector 120 can mate with a power supply connector inside the power supply frame. When the power supply is inserted into the power supply frame, the protrusion of the latch 100 protruding from the power supply housing 90 mates with the slot on the power supply frame to prevent the power supply from coming out. To remove the power supply, simply move the latch 100 to retract the protrusion of the housing 90 back into the housing 90, and pull the handle 110 to remove the power supply. The power supply adopts a rear-in, rear-out power supply method, that is, the power supply from the water-cooled power supply module, the output power from the water-cooled power supply module, and the logic or control signals of the water-cooled power supply module are all located in the power supply connector 120 at the rear of the power supply, and are connected to the power supply frame through the power supply connector 120.

[0038] In one alternative, such as Figure 1 As shown, the water-cooled power module also includes an air-cooling component 130, which is located inside the housing and on the side of the motherboard 10 near the handle. The air supply direction of the air-cooling component 130 is the side of the handle pointing towards the connector.

[0039] In the above embodiments, such as Figure 1 As shown, in addition to the water-cooling system, the water-cooled power module is also equipped with an air-cooling component 130. The air outlet direction of the air-cooling component 130 is from the power handle end to the power connector end. Figure 1 (From left to right in the image), the air-cooled component 130 dissipates some of the heat that has diffused into the air from the water-cooled power module.

[0040] According to another embodiment of this application, a method for controlling heat dissipation of a water-cooled power supply module is provided, such as... Figure 4 As shown, the method includes:

[0041] Step S201: Obtain the first temperature of multiple functional units of the water-cooled power module during operation. The first temperature can be the current operating temperature of the functional unit, obtained directly from the temperature sensor. Since the operating temperature may be very high, reducing the lifespan of the temperature sensor, the first temperature can also be set as the temperature of the heat dissipated by the water cooling system, obtained from the difference between the temperature sensors at the inlet and outlet. The heat dissipation temperature can also indirectly indicate the operating temperature. When the heat dissipation temperature is too high, it indicates that the operating temperature is too high and more heat dissipation is needed to maintain a normal operating temperature. The logic is consistent whether the first temperature is interpreted as heat dissipation temperature or operating temperature in the following text. For example, the first temperatures of the first, second, and third functional units are Ta1, Tb1, and Tc1, respectively.

[0042] Step S202: Determine the temperature margin of each of the above-mentioned functional units based on the first temperature and the preset temperature of each functional unit. The preset temperature of the functional unit can be set by the program, such as the preset temperatures of the first functional unit, the second functional unit, and the third functional unit being Ta2, Tb2, and Tc2, respectively. The obtained temperature margin is the value of the preset temperature minus the first temperature, such as the temperature margins of the first functional unit, the second functional unit, and the third functional unit being Ta3, Tb3, and Tc3, respectively.

[0043] Step S203: Based on the temperature margins of the aforementioned functional units, the opening angle of the water flow adjustment component in the water-cooled power supply module corresponding to each functional unit is controlled to adjust the heat dissipation of the aforementioned functional units. The larger the temperature margin of a functional unit, the larger or smaller the corresponding opening angle. A larger temperature margin indicates a lower operating temperature of the current functional unit and less need for heat dissipation; conversely, a smaller temperature margin indicates a higher operating temperature of the current functional unit and a greater need for heat dissipation.

[0044] This application first obtains the heat dissipation temperature of multiple functional units in a water-cooled power module during operation, designated as a first temperature. The optimal operating temperature of each functional unit is then set as a preset temperature. Based on the preset temperature and the obtained first temperature, the temperature margin of each functional unit is calculated. These temperature margins are then sorted by magnitude. Based on the sorting result, the current heat dissipation status of each functional unit is determined, and the water flow regulation component is used to control the water flow in each branch, thereby reducing the temperature differences between the functional units in the water-cooled power module. This solves the problem in related technologies where water-cooled power modules cannot balance the heat dissipation of multiple components.

[0045] In one alternative, obtaining the first temperature of the multiple functional units of the water-cooled power module during operation includes: obtaining the second temperature of the inlet and the third temperature of the outlet of the multiple branches of the water-cooling system located on the multiple functional units, and determining the first temperature based on the second temperature and the third temperature.

[0046] In the above embodiment, a second temperature at the water inlet and a third temperature at the water outlet of each functional module are obtained by a temperature sensor, and a first temperature is obtained based on the difference between the second and third temperatures. The first temperature represents the heat dissipation temperature of the current branch to the functional module. The higher the first temperature, the higher the heat generation of the current functional unit, and the smaller the obtained temperature margin.

[0047] In one alternative, such as Figure 5As shown, the control method further includes: when the temperature margins of multiple functional units are all greater than zero, determining whether the difference between the maximum and minimum temperature margins of the functional units meets a preset margin; if the determination indicates yes, determining whether the first water flow regulating component of the multiple branches in the water cooling system with the minimum temperature margin is fully open; if the first water flow regulating component is fully open, determining the reduced opening angle of the second water flow regulating component of the branch with the maximum temperature margin according to the preset temperature and the maximum temperature margin, and adjusting the second water flow regulating component according to the angle; if the first water flow regulating component is not fully open, controlling the first water flow regulating component to be fully open.

[0048] In one alternative, such as Figure 5 As shown, when the temperature margins of multiple functional units are not all greater than zero, it is determined whether the difference between the maximum and minimum temperature margins of the aforementioned functional units meets a preset margin; if the determination indicates yes, it is determined whether the first water flow regulating component of the multiple branches in the aforementioned water cooling system with the aforementioned minimum temperature margin is fully open; if it is determined that the aforementioned first water flow regulating component is fully open, based on the preset temperature and at least one temperature margin greater than zero, the reduced opening angle of the third water flow regulating component of the aforementioned branch with at least one temperature margin greater than zero is determined, and the aforementioned third water flow regulating component is adjusted according to the aforementioned angle; if it is determined that the aforementioned first water flow regulating component is not fully open, the aforementioned first water flow regulating component is controlled to be fully open.

[0049] In the above embodiments, such as Figure 5 As shown, firstly, the first temperatures Ta1, Tb1, and Tc1 of multiple functional units are obtained. The first temperature is calculated from the difference between the second and third temperatures of the functional units. Based on the first temperature and the preset temperature, multiple temperature margins Ta2, Tb2, and Tc2 are determined. The temperature margins are sorted, and a first judgment step is performed: it is judged whether the minimum value of the sorted temperature margin is greater than 0. If the first judgment result indicates yes, it means that the first temperature of all functional units is relatively lower than the preset temperature, that is, the heat dissipation of the functional units can basically meet the requirements, and the difference between the operating temperature of each functional unit and the preset temperature is relatively small. Then, a second judgment step is performed: it is judged whether the difference between any two values ​​of the multiple temperature margins is greater than 5°. If the second judgment result indicates no, it means that the difference between the first temperature of all functional units and the preset temperature is not large, that is, the operating temperature of the functional units is relatively stable, and no adjustment of the water cooling system is required. At this time, the process returns to the step of obtaining multiple first temperatures and the judgment is performed again.

[0050] If the second judgment result indicates yes, it means that the temperature margins of multiple functional modules differ significantly, that is, the operating temperature of the functional module with the smallest temperature margin is too high; proceed to the third judgment step: determine whether the water flow regulating component with the smallest temperature margin is fully open. If the third judgment result indicates no, fully open the water flow regulating component to allow the water cooling system to better dissipate heat from the functional unit, and after a preset time period, return to the second judgment step to re-judge.

[0051] If the third judgment result indicates yes, it means that the heat dissipation treatment of the functional unit with the highest heat dissipation temperature (highest operating temperature) has been increased, and the heat dissipation treatment of the functional unit with the lowest heat dissipation temperature (lowest operating temperature) needs to be reduced so that more water cooling can be directed to the functional unit with the highest operating temperature; calculate the closing angle of the water flow regulating component with the maximum temperature margin, and adjust the opening angle of the water flow regulating component with the maximum temperature margin according to the obtained closing angle, and after a preset time period, return to the second judgment step to make a new judgment.

[0052] If the first judgment result indicates no, it means that the heat dissipation temperature of the functional unit with the smallest temperature margin is higher than the preset temperature, that is, the operating temperature of the functional unit is very high; proceed to the fourth judgment step: determine whether the water flow regulating component with the smallest temperature margin is fully open. If the fourth judgment result indicates no, the water flow regulating component is fully opened so that the water cooling system can better dissipate heat from the functional unit, and after a preset time period, return to the first judgment step to re-judge.

[0053] If the fourth judgment result indicates yes, it means that the heat dissipation treatment of the functional unit with the highest heat dissipation temperature (highest operating temperature) has been increased, and the heat dissipation treatment of the functional unit with the lowest heat dissipation temperature (lowest operating temperature) needs to be reduced so that more water cooling can be directed to the functional unit with the highest operating temperature; calculate the closing angle of the water flow adjustment component except for the minimum temperature margin, and adjust the opening angle of the water flow adjustment component except for the minimum temperature margin according to the obtained closing angle, and return to the first judgment step to re-judge after a preset time period.

[0054] The above describes the situation where, if the first judgment result indicates "no," there is one temperature margin less than 0. If multiple temperature margins are less than 0, the water flow regulating components with temperature margins less than 0 should be fully opened to increase water cooling heat dissipation, while the opening angle of the water flow regulating components with temperature margins greater than 0 should be reduced. For example, if Ta2>0>Tb2>Tc2, the opening angle of the water flow regulating component of the first functional unit should be reduced, while the water flow regulating components of the second and third functional units should be fully opened. This situation represents the extreme state with three functional units, and is prepared to stop operation at any time to prevent damage to the water cooling power module.

[0055] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for controlling heat dissipation of a water-cooled power supply module, characterized in that, include: Obtain the first temperature of multiple functional units of the water-cooled power supply module during operation; Based on the first temperature and the preset temperature of each functional unit, determine the temperature margin of each functional unit; Based on the temperature margin of the multiple functional units, the opening angle of the water flow adjustment component of the water cooling system in the water cooling power module corresponding to the multiple functional units is controlled to adjust the heat dissipation of the multiple functional units. The larger the temperature margin of the functional unit, the larger or smaller the corresponding opening angle. When the temperature margin of multiple functional units is greater than zero, it is determined whether the difference between the maximum and minimum temperature margin of the functional units meets a preset margin; if the determination indicates yes, it is determined whether the first water flow regulating component of multiple branches in the water cooling system with the minimum temperature margin is fully open; if it is determined that the first water flow regulating component is fully open, the reduced opening angle of the second water flow regulating component of the branch with the maximum temperature margin is determined according to the preset temperature and the maximum temperature margin, and the second water flow regulating component is adjusted according to the angle; if it is determined that the first water flow regulating component is not fully open, the first water flow regulating component is controlled to be fully open. If the temperature margins of multiple functional units are not all greater than zero, determine whether the difference between the maximum and minimum temperature margins of the functional units meets a preset margin; if the determination indicates yes, determine whether the first water flow regulating component of the multiple branches in the water cooling system with the minimum temperature margin is fully open; if the first water flow regulating component is fully open, determine the reduced opening angle of the third water flow regulating component of the branch with the at least one temperature margin greater than zero based on the preset temperature and at least one temperature margin greater than zero, and adjust the third water flow regulating component according to the angle; if the first water flow regulating component is not fully open, control the first water flow regulating component to be fully open.

2. The control method according to claim 1, characterized in that, The method of obtaining the first temperature of multiple functional units of the water-cooled power supply module during operation includes: The second temperature of the inlet and the third temperature of the outlet of the multiple branches of the water cooling system located on the multiple functional units are obtained, and the first temperature is determined based on the second temperature and the third temperature.

3. A water-cooled power supply module, characterized in that, The cooling of the water-cooled power supply module is controlled using the cooling control method described in any one of claims 1 to 2, wherein the water-cooled power supply module comprises: Motherboard; Multiple functional units are located on the motherboard at intervals, and the functional units have different operating temperatures when they are working; The water cooling system includes multiple branches, each branch including a water flow regulating component, and each branch is located on the side of the functional unit opposite to the motherboard.

4. The water-cooled power supply module according to claim 3, characterized in that, The branch circuit also includes a heat dissipation assembly, which comprises a main heat dissipation section, a water inlet section, a water outlet section, and multiple temperature sensors, wherein: The water inlet is located on one side of the main heat dissipation section; The water outlet is located on the side of the main heat dissipation section opposite to the water inlet section; The temperature sensor is electrically connected to the motherboard, and the temperature sensor is located at the water inlet and the water outlet respectively; The main heat dissipation unit includes a water flow path, which communicates with the water outlet and the water inlet. The water flow path is a single channel, comprising multiple first portions and multiple second portions. The first portions extend along the water inlet direction of the water inlet, and adjacent first portions are spaced apart by being connected to the second portions, so that the water flow path is continuous. The water flow path has a multi-channel structure, comprising a first part, a second part, and multiple third parts. The first part connects the inlet and the outlet. The extension direction of the first part near the inlet is consistent with the water inlet direction, and the extension direction of the first part near the outlet is perpendicular to the water outlet direction. The second part connects the inlet and the outlet. The extension direction of the second part near the inlet is perpendicular to the water inlet direction, and the extension direction of the second part near the outlet is consistent with the water outlet direction. The third parts are distributed at intervals by connecting to the first and second parts respectively.

5. The water-cooled power supply module according to claim 4, characterized in that, The branch also includes a one-way valve, which is connected to the water outlet.

6. The water-cooled power supply module according to claim 4, characterized in that, The water-cooled power module also includes a main water inlet channel, a main water outlet channel, and multiple interfaces, wherein: The main water inlet channel is connected to the water inlet section and the interface, respectively, and the main water outlet channel is connected to the water outlet section and the interface, respectively.

7. The water-cooled power supply module according to claim 3, characterized in that, The water-cooled power module also includes a housing, clips, a handle, and a connector, wherein: The latch and the handle are located on one side of the housing, the connector is located on the side of the housing opposite to the latch, and the motherboard is located inside the housing.

8. The water-cooled power supply module according to claim 7, characterized in that, The water-cooled power module also includes an air-cooling component, which is located inside the housing and on the motherboard near the handle. The airflow direction of the air-cooling component is the side of the handle pointing towards the connector.

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