Combined interchangeable device for realizing rapid and uniform temperature distribution

Abstract

The invention provides a combined interchangeable device for realizing rapid and uniform temperature distribution, and belongs to the field of heat dissipation of electronic equipment. The invention aims to solve the problem of high cost caused by poor interchangeability and low yield of the vapor chamber in the prior art. The device comprises a heat source bearing assembly, a core soaking assembly and a heat dissipation assembly. The heat source bearing assembly and the heat dissipation assembly are connected through a bolt, a cavity is formed between the heat source bearing assembly and the heat dissipation assembly to place the core soaking assembly, and the whole device is I-shaped. According to the vapor chamber, the heat source contact point plates can be separated from the lower bearing plate, the positions and the number of the heat source contact point plates can be flexibly set according to different heat sources, and the problem that the interchangeability of the vapor chamber is poor is solved; a phase-change heat exchange device which is high in machining difficulty and low in yield is separated from other devices which are high in cost and not prone to failure, and the problem of high cost is solved. And meanwhile, the core soaking part is designed into a single soaking device or a free combination form, so that the soaking device is suitable for being used in various environments, and the practicability is higher.

Description

Technical Field

[0001] The invention relates to electronic temperature equalization technology, in particular to a combined interchangeable device for realizing rapid temperature equalization, belonging to the field of electronic equipment heat dissipation. Background Art

[0002] At present, the common devices for achieving rapid temperature uniformity are mostly single forms such as heat pipes, microfluidics, vacuum chamber heat spreaders, flat heat pipes, graphene heat spreaders, and heat sinks with hydrophobic coatings inside. Vacuum chamber heat spreaders are most widely used in the field of electronic component heat spreaders. Common heat spreader structures are mainly divided into upper plates, lower plates, airtight chambers, capillary structures, and support structures. The upper and lower plates are covered to form an airtight chamber. The airtight chamber contains a capillary structure for providing fluid reflux and a support structure for supporting the upper and lower plates. The lower plate is connected to the heat source, and the heat is diffused to the upper plate through the internal structure of the heat spreader. The lower plate is provided with a number of protrusions connected to the heat source, and the upper plate is provided with heat dissipation fins for rapid heat dissipation. The upper and lower plates are respectively processed by one-piece molding. After processing, the upper and lower covers are welded to form a shell by brazing, resistance welding, laser welding, etc., and then the interior is evacuated. In a vacuum environment, the working fluid is injected into the heat spreader through the reserved injection port, and then the injection port is sealed.

[0003] The existing devices for achieving rapid and uniform temperature distribution are of a single form, and when the environmental conditions are harsh, a single device is prone to failure. In addition, the existing temperature equalizer manufacturing technology mainly has the following problems: the manufacturing process of the temperature equalizer is complicated. After multiple processes such as stamping, welding, vacuuming, and liquid injection, it is easy to have problems such as loose welding and poor sealing, resulting in a low yield rate. When defects cannot be repaired, the cost of scrapping the entire temperature equalizer is high. The heat source contact point plate designed in the lower plate of the temperature equalizer is formed at one time during processing. When the distribution of the heat source points changes, some heat sources cannot effectively contact the heat source contact points in the lower plate, and the heat cannot be dissipated in time, resulting in poor heat equalization effect. The heat dissipation fins in the upper plate of the temperature equalizer are formed at one time with the upper plate during processing. The heat dissipation fin processing time is long and the cost is high. When the welding quality of the temperature equalizer is unqualified or fails after long-term use, the heat dissipation fins are scrapped together with the upper plate, resulting in a waste of resources. Summary of the invention

[0004] A brief overview of the present invention is provided below in order to provide a basic understanding of certain aspects of the present invention. It should be understood that this overview is not an exhaustive overview of the present invention. It is not intended to identify key or important parts of the present invention, nor is it intended to limit the scope of the present invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to a more detailed description discussed later.

[0005] In view of this, in order to solve the high cost problem caused by poor interchangeability and low yield of temperature equalizing plates in the prior art, the present invention provides a combined interchangeable device for achieving rapid temperature uniformity.

[0006] The technical solution of the present invention is a combined and interchangeable device for realizing rapid temperature uniformity, comprising a heat source receiving component, a core heat-sparing component, and a heat dissipation component;

[0007] The heat source receiving assembly is connected to the heat dissipation assembly by bolts, and a cavity is formed in the middle to place the core heat-saturating assembly, and the device is in an I-shape as a whole;

[0008] The heat source receiving assembly comprises a heat source contact point plate and a lower receiving plate, and a slideway for inserting the heat source contact point plate is provided on the front side of the lower receiving plate;

[0009] The heat dissipation assembly comprises an upper receiving plate and fins, and a slideway for inserting the fins is arranged on the rear side of the upper receiving plate.

[0010] Furthermore, a first limiting raised plane is provided on the rear side of the lower supporting plate, a second limiting raised plane is provided on the front side of the upper supporting plate, and the core heat spreader assembly is installed between the first limiting raised plane and the second limiting raised plane.

[0011] Furthermore, the front end of the heat source contact point plate is fitted with the electronic component structure surface, the rear end is a plane, and two grooves are arranged on the side. The heat source contact point plate is I-shaped as a whole, and the slide is a T-shaped slide opened longitudinally. The I-shaped heat source contact point plate is slidably installed in the T-shaped slide.

[0012] Furthermore, the core heat-saturating component includes a lower structure and an upper structure. The upper cavity portion of the lower structure is sintered and then brazed, resistively welded or laser welded with the upper structure to form an integral body with a cavity structure.

[0013] Furthermore, the core heat-saturating component is clearance-matched with the first limiting protrusion plane and the second limiting protrusion plane.

[0014] Furthermore, the fin is T-shaped.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention separates the heat source contact point plate from the lower receiving plate, and flexibly sets the position and number of the heat source contact point plates according to different heat sources, thereby solving the problem of poor interchangeability of the temperature balancing plate;

[0017] 2. The present invention separates the phase change heat exchange device with high processing difficulty and low yield from other high-cost and non-failure devices, thus solving the high cost problem caused by low yield and effectively reducing costs;

[0018] 3. The present invention designs the core heat equalizing part into a single or freely combined form of a heat equalizing device, which is suitable for use in a variety of environments and is more practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of a combined and interchangeable device for achieving rapid temperature uniformity;

[0021] Figure 2 A top view of the device.

[0022] In the figure: 1-heat source receiving assembly, 1A-heat source contact point plate, 1B-lower receiving plate, 2-core heat dissipation assembly, 3-heat dissipation assembly, 3A-upper receiving plate, 3B-fins. DETAILED DESCRIPTION

[0023] In order to make the technical solutions and advantages of the embodiments of the present invention more clearly understood, the exemplary embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than an exhaustive list of all the embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0024] Example 1, reference Figure 1-2 The present embodiment is described as a combined and interchangeable device for realizing rapid temperature uniformity, comprising a heat source receiving component 1, a core heat-saturating component 2, and a heat dissipation component 3;

[0025] The heat source receiving component 1 is connected to the heat dissipation component 3 by bolts, and a cavity is formed in the middle to place the core heat-saturating component 2, and the device is in an I-shape as a whole;

[0026] The heat source receiving assembly 1 comprises a heat source contact point plate 1A and a lower receiving plate 1B, and a slideway for inserting the heat source contact point plate 1A is provided on the front side of the lower receiving plate 1B;

[0027] The heat dissipation assembly 3 comprises an upper receiving plate 3A and fins 3B. A slideway for inserting the fins 3B is provided on the rear side of the upper receiving plate 3A.

[0028] Furthermore, a first limiting raised plane is provided on the rear side of the lower receiving plate 1B, a second limiting raised plane is provided on the front side of the upper receiving plate 3A, and the core heat spreader assembly 2 is installed between the first limiting raised plane and the second limiting raised plane.

[0029] Furthermore, the front end of the heat source contact point plate 1A is a surface that fits the electronic component structure, the rear end is a plane, and two grooves are arranged on the side. The heat source contact point plate 1A is in an I-shape as a whole, and the slide is a T-shaped slide opened longitudinally. The I-shaped heat source contact point plate 1A is slidably installed in the T-shaped slide.

[0030] Furthermore, the core heat-saturating component 2 includes a lower structure and an upper structure. The upper cavity portion of the lower structure is sintered and then brazed, resistively welded or laser welded with the upper structure to form an integral body with a cavity structure.

[0031] Furthermore, the core heat-saturating component 2 is clearance-matched with the first limiting protrusion plane and the second limiting protrusion plane.

[0032] Furthermore, the fin 3B is T-shaped.

[0033] The working principle of the present invention is as follows: the electronic component is in contact with the heat source receiving component 1, and the heat is transferred to the core heat-saturating component 2 by heat conduction, and the temperature is quickly evenly distributed in the core heat-saturating component 2, and the heat is dissipated to the external environment by the heat dissipation component 3, and finally the temperature is quickly evenly distributed and the heat is dissipated. The fluid in the vacuum chamber composed of the lower structure and the upper structure of the core heat-saturating device 2 absorbs heat and vaporizes on the upper surface of the lower structure, diffuses to the lower surface of the upper structure, and then liquefies when it is cooled and releases heat. The liquefied liquid returns to the upper surface of the lower structure by gravity or capillary action, and the heat transfer between the lower structure and the upper structure is realized through continuous circulation.

[0034] Through the present invention, the heat source contact point plate can be separated from the lower receiving plate, and the position and number of the heat source contact point plates can be flexibly set according to different heat sources, thereby solving the problem of poor interchangeability of the temperature equalizing plate.

[0035] Through the present invention, the phase change heat exchange device with great processing difficulty and low yield rate is separated from other high-cost and non-failure-prone devices, thereby solving the high cost problem caused by the low yield rate; at the same time, the core heat equalization part is designed to be a single heat equalization device or a freely combined form, which is suitable for use in a variety of environments and is more practical.

[0036] Although the present invention has been described according to a limited number of embodiments, it will be apparent to those skilled in the art, with the benefit of the above description, that other embodiments may be envisioned within the scope of the invention thus described. In addition, it should be noted that the language used in this specification is selected primarily for readability and teaching purposes, rather than for explaining or defining the subject matter of the present invention. Therefore, many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the appended claims. The disclosure of the present invention is illustrative, not restrictive, with respect to the scope of the present invention, which is defined by the appended claims.

Claims

1. A combined and interchangeable device for achieving rapid temperature uniformity, characterized in that: It comprises a heat source receiving component (1), a core heat-saturating component (2), and a heat dissipation component (3); The heat source receiving component (1) is connected to the heat dissipation component (3) by bolts, and a cavity is formed in the middle to place the core heat-saturating component (2), and the device as a whole is in an I-shape; The heat source receiving assembly (1) comprises a heat source contact point plate (1A) and a lower receiving plate (1B), and a slideway for inserting the heat source contact point plate (1A) is provided on the front side of the lower receiving plate (1B); The heat dissipation assembly (3) comprises an upper receiving plate (3A) and fins (3B), and a slideway for inserting the fins (3B) is provided on the rear side of the upper receiving plate (3A).

2. A combined interchangeable device for achieving rapid temperature uniformity according to claim 1, characterized in that: The rear side of the lower receiving plate (1B) is provided with a first limiting raised plane, the front side of the upper receiving plate (3A) is provided with a second limiting raised plane, and the core heat-saturating component (2) is installed between the first limiting raised plane and the second limiting raised plane.

3. A combined and interchangeable device for achieving rapid temperature uniformity according to claim 1, characterized in that: The front end of the heat source contact point plate (1A) is a surface that fits the electronic component structure, the rear end is a plane, and two grooves are arranged on the side. The heat source contact point plate (1A) is in an I-shape as a whole, and the slideway is a T-shaped slideway opened longitudinally. The I-shaped heat source contact point plate (1A) is slidably installed in the T-shaped slideway.

4. A combined and interchangeable device for achieving rapid temperature uniformity according to claim 1, characterized in that: The core heat-saturating component (2) comprises a lower structure and an upper structure, and the upper cavity portion of the lower structure is subjected to a sintering process and then brazed, resistively welded or laser welded with the upper structure to form an integral body having a cavity structure.

5. A combined and interchangeable device for achieving rapid temperature uniformity according to claim 2, characterized in that: The core heat-saturating component (2) is clearance-matched with the first limiting raised plane and the second limiting raised plane.

6. A combined and interchangeable device for achieving rapid temperature uniformity according to claim 1, characterized in that: The fin (3B) is T-shaped.

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