Cooling module and cooling system

Abstract

The invention discloses a cooling module and a cooling system, and relates to the technical field of cold plate type liquid cooling, and the cooling module comprises a second cold plate module and at least two first cold plate modules which are connected in parallel. The first cold plate module comprises a first cold plate structure and a cold head embedded in the first cold plate structure, the first cold plate structure is provided with a liquid inlet flow channel and a liquid outlet flow channel, and a cooling medium enters the cold head from the liquid inlet flow channel and flows out of the cold head from the liquid outlet flow channel so as to cool the first heating assemblies on the main plates on the two sides of the first cold plate structure; the second cold plate module is connected with the first cold plate modules in parallel, the second cold plate module comprises a second cold plate structure, the second cold plate structure is provided with a cooling channel, and the cooling channel is used for allowing a cooling medium to flow so as to cool second heating assemblies on the main plates on the two sides of the second cold plate structure. According to the cooling module, the stable and reliable heat dissipation requirements of the GPU modules can be met while the deployment density of the GPU modules in the server case is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of cold plate type liquid cooling, and in particular to a cooling module and a cooling system. Background Art

[0002] At present, cold plate liquid cooling occupies a dominant position in the data center liquid cooling market due to its advantages such as better heat dissipation performance and good compatibility.

[0003] In the existing system, for GPU (Graphics Processing Unit) servers, it is necessary to meet the growing computing needs within the limited height space of the server cabinet. It is common to place 8 GPU modules in a 2U space. In order to solve the heat dissipation temperature, the whole plate structure of the GPU cold plate radiator is currently mainly used for liquid cooling. The whole plate structure includes a whole plate bracket, a GPU water cooling module composed of multiple independent water cooling plate components, a switch water cooling plate component, a water inlet pipe, a water outlet pipe, a water distribution pipe, a water cooling circulation pipeline and a water collector. The whole plate bracket is arranged above the GPU water cooling module, one side of the whole plate bracket is movably connected to the water collector, the water cooling circulation pipeline connects multiple independent water cooling plate components in series and the inner cavities are connected, one end of the water cooling circulation pipeline is connected to the inner cavity of the switch water cooling plate component, and the other end is connected to the water collector. The multiple water outlets of the water distribution pipe are connected to the switch water cooling plate component, and the inlet of the water distribution pipe is connected to the water inlet pipe. However, the above cold plate structure splits the entire GPU cold plate into multiple independent single GPU cold plate radiators. The GPU cold plate and pipelines occupy too much space in the height direction of the chassis, limiting the improvement of the power density of the entire cabinet. At the same time, there are many hoses and pipelines connected to the cold plate in the entire cold plate assembly, and the risk of leakage is high. Once leakage occurs, it will cause damage to the server. Summary of the invention

[0004] The object of the present invention is to provide a cooling module and a cooling system, which can significantly improve the deployment density of GPU modules in a server chassis while meeting the stable and reliable heat dissipation requirements of GPU modules.

[0005] To achieve the above object, the present invention provides a cooling module, which is used to be clamped between two mainboards to cool the two mainboards, comprising:

[0006] At least two first cold plate modules connected in parallel, the first cold plate module comprising a first cold plate structure and a cold head embedded in the first cold plate structure, the first cold plate structure being provided with a liquid inlet flow channel and a liquid outlet flow channel, the cooling medium entering the cold head through the liquid inlet flow channel and flowing out of the cold head through the liquid outlet flow channel, so as to cool the first heat generating components on the main boards on both sides of the first cold plate structure;

[0007] The second cold plate module is connected in parallel with each first cold plate module. The second cold plate module includes a second cold plate structure. The second cold plate structure is provided with a cooling channel. The cooling channel is used for cooling medium to flow so as to cool the second heat generating components on the main boards on both sides of the second cold plate structure.

[0008] In some aspects, the cold head includes an upper shell and a lower shell, the upper shell and the lower shell are separated by a partition, the upper shell is provided with an upper cold cavity, the upper cold cavity is used to pass cooling medium to cool the first heat-generating component of the upper mainboard of the cold head, and the lower shell is provided with a lower cold cavity, the lower cold cavity is used to pass cooling medium to cool the first heat-generating component of the lower mainboard of the cold head.

[0009] In other aspects, the cold head is provided with a first through hole and a second through hole, the first through hole and the second through hole are both provided between the upper shell and the lower shell, the partition is located between the first through hole and the second through hole, the liquid inlet channel is connected with the first through hole, the first through hole is connected with the upper cold cavity and the lower cold cavity, the liquid outlet channel is connected with the second through hole, and the second through hole is connected with the upper cold cavity and the lower cold cavity.

[0010] In other aspects, the first cold plate module also includes a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is provided with a liquid inlet channel, the liquid outlet pipe is provided with a liquid outlet channel, the liquid inlet pipe and the liquid outlet pipe are both embedded in the first cold plate structure, one end of the liquid inlet pipe close to the cold head is embedded in the first through hole, and the end of the liquid outlet pipe close to the cold head is embedded in the second through hole.

[0011] In other aspects, the upper shell protrudes from the upper surface of the first cold plate structure, so that the upper shell abuts against the central heating device of the first heating component on the upper main board, and the upper surface of the first cold plate structure abuts against the peripheral heating device of the first heating component on the upper main board;

[0012] The lower shell protrudes from the lower surface of the first cold plate structure, so that the lower shell abuts against the central heating device of the first heating component on the lower mainboard, and the lower surface of the first cold plate structure abuts against the peripheral heating device of the first heating component on the lower mainboard.

[0013] In other aspects, the number of cold heads on the first cold plate structure is at least two, and each cold head is arranged in series on the first cold plate structure;

[0014] Both the upper shell and the lower shell are provided with heat dissipation fins.

[0015] In other aspects, the cooling module further comprises:

[0016] A flow divider, the flow divider is provided with a first liquid inlet, a second liquid outlet and at least two first liquid outlets, the first liquid inlet is used to introduce cooling medium into the flow divider, the first liquid outlet is communicated with the corresponding liquid inlet channel, and the second liquid outlet is communicated with one end of the cooling channel;

[0017] The collector and the diverter are arranged on the same side of the second cold plate module and each first cold plate module. The collector is provided with a third liquid outlet, a third liquid inlet and at least two second liquid inlets. The third liquid outlet is used for the cooling medium to flow out of the collector. The second liquid inlet is connected to the corresponding liquid outlet channel, and the third liquid inlet is connected to the other end of the cooling channel.

[0018] In other aspects, the cooling channel includes:

[0019] a first channel, wherein one end of the first channel close to the flow divider is connected to the second liquid outlet;

[0020] Two second channels, both of which are connected to an end of the first channel away from the diverter, and the two second channels are respectively arranged on both sides of the first channel;

[0021] Two third channels, the two third channels are respectively connected to ends of the two second channels away from the first channels;

[0022] The fourth channel, one end of the fourth channel away from the diverter is connected to the two third channels, and one end of the fourth channel close to the diverter is connected to the third liquid inlet.

[0023] In other aspects, the second cold plate structure includes an upper cold plate body and a lower cold plate body, and the upper cold plate body and the lower cold plate body are combined to form a T-shaped cold plate structure;

[0024] The second cold plate module further includes a first cooling pipe, two second cooling pipes, two third cooling pipes and a fourth cooling pipe, the first cooling pipe is provided with a first channel, the second cooling pipe is provided with a second channel, the third cooling pipe is provided with a third channel, and the fourth cooling pipe is provided with a fourth channel;

[0025] The first cooling pipe and the two second cooling pipes are embedded in the upper cold plate body, and the fourth cooling pipe and the two third cooling pipes are embedded in the lower cold plate body;

[0026] The first cooling tube and the fourth cooling tube both extend in a first direction, and the fourth cooling tube is located directly below the first cooling tube. The two second cooling tubes and the two third cooling tubes both extend in a second direction perpendicular to the first direction, and the third cooling tube is located directly below the corresponding second cooling tube. The third cooling tube is connected to the corresponding second cooling tube through a connecting tube.

[0027] Among them, the cooling medium distributed by the second liquid outlet of the diverter flows to the two second cooling tubes through the first cooling tube, and flows to the two third cooling tubes through the two second cooling tubes, and then flows into the collector from the third liquid inlet after converging to the fourth cooling tube through the two third cooling tubes, so as to cool the second heat-generating components on both sides of the second cold plate structure.

[0028] The present invention also provides a cooling system, comprising any one of the above cooling modules.

[0029] Relative to the above-mentioned background technology, the cooling module provided in the embodiment of the present invention is used to be clamped between two main boards to cool the two main boards, and the cooling module includes a second cold plate module and at least two first cold plate modules connected in parallel. Among them, the first cold plate module includes a first cold plate structure and a cold head embedded in the first cold plate structure, the first cold plate structure is provided with a liquid inlet channel and a liquid outlet channel, the cooling medium enters the cold head from the liquid inlet channel, and flows out of the cold head from the liquid outlet channel to cool the first heat-generating components on the main boards on both sides of the first cold plate structure; the second cold plate module is connected in parallel with each first cold plate module, the second cold plate module includes a second cold plate structure, the second cold plate structure is provided with a cooling channel, and the cooling channel is used for the cooling medium to flow, so as to cool the second heat-generating components on the main boards on both sides of the second cold plate structure.

[0030] It can be seen that the cooling module provided by the embodiment of the present invention can be used to cool two mainboards placed opposite to each other in an upper and lower direction. Specifically, the two mainboards placed opposite to each other clamp the cooling module in the middle, and the cooling module can cool and dissipate heat for the mainboards on both sides at the same time. When working, the first cold plate module is used to cool the first heat generating components of the mainboards on both sides of the upper and lower sides. The cooling medium enters the cold head from the liquid inlet channel and flows out of the cold head from the liquid outlet channel. In this way, the cooling medium flows through the liquid inlet channel, the cold head and the liquid outlet channel successively to cool the first heat generating components on both sides of the first cold plate structure. Considering that at least two groups of first heat generating components are provided on the mainboard, at least two first cold plate modules connected in parallel with each other are provided to complete the cooling of all the first heat generating components on the mainboards on both sides of the upper and lower sides; the second cold plate module is used to cool the second heat generating components of the mainboards on both sides of the upper and lower sides. The cooling medium flows along the cooling channel to cool the second heat generating components of the mainboards on both sides of the upper and lower sides.

[0031] The cooling module configured in this way has the following beneficial effects: the cooling module provided by the embodiment of the present invention can achieve the maximum GPU deployment density within the limited height space of the server chassis and provide effective heat dissipation for it. For example, for the configuration of placing two mainboards and a total of 16 GPU modules within the height space of a 1.5U chassis, the cooling module is clamped between the two mainboards, and each first cold plate module is used to cool the first heat-generating components (GPU modules) corresponding to the upper and lower mainboards, and the second cold plate module is used to cool the second heat-generating components (switch modules, optical modules, network modules, etc.) of the upper and lower mainboards. In other words, the above-mentioned cooling module can greatly improve the deployment density of GPU modules in the server chassis while meeting the stable and reliable heat dissipation requirements of GPU modules, switch modules, optical modules, network modules, etc., which not only greatly improves the deployment density of GPU modules in the server chassis, but also effectively reduces the risk of system leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0033] Figure 1 This is a schematic diagram of the overall structure of the cooling module in an embodiment of the present invention;

[0034] Figure 2 for Figure 1 A schematic structural diagram of a first cold plate module in the cooling module shown;

[0035] Figure 3 for Figure 2 A schematic structural diagram of a cold head in the first cold plate module is shown;

[0036] Figure 4 for Figure 3 Another angle structural schematic diagram of the cold head shown;

[0037] Figure 5 Schematic diagram of the flow direction of the cooling medium in the cooling module in an embodiment of the present invention;

[0038] Figure 6 A schematic diagram of the flow path structure of the cooling module in an embodiment of the present invention;

[0039] Figure 7 It is a schematic diagram of the assembly of the cooling module and the upper and lower mainboards in an embodiment of the present invention;

[0040] Figure 8 for Figure 7 Schematic diagram of the structure of the main board.

[0041] in:

[0042] 10-Cooling module;

[0043] 11-first cold plate module;

[0044] 111-first cold plate structure;

[0045] 112-cold head, 1121-upper shell, 1122-lower shell, 1123-partition, 1124-first through hole, 11241-first groove, 1125-second through hole, 11251-second groove, 1126-heat dissipation fin;

[0046] 113-liquid inlet pipe, 1131-liquid inlet channel;

[0047] 114-liquid outlet pipe, 1141-liquid outlet channel;

[0048] 12- second cold plate module;

[0049] 121-second cold plate structure, 1211-upper cold plate body, 1212-lower cold plate body;

[0050] 122-cooling channel, 1221-first cooling pipe, 12211-first channel, 1222-second cooling pipe, 12221-second channel, 1223-third cooling pipe, 12231-third channel, 1224-fourth cooling pipe, 12241-fourth channel;

[0051] 13-shunt;

[0052] 14-current collector;

[0053] 20- Mainboard;

[0054] 21-first heating component, 211-central heating device, 212-peripheral heating device;

[0055] 22 - second heating component, 221 - middle heating device, 222 - edge heating device. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0058] It should be noted that the directional words such as "upper end, lower end, left side, right side" described below are all defined based on the drawings in the specification.

[0059] See also Figure 1 and Figure 7 The cooling module 10 provided in the embodiment of the present invention is used to be clamped between two mainboards 20 to cool the two mainboards 20. The cooling module 10 includes a second cold plate module 12 and at least two first cold plate modules 11 connected in parallel.

[0060] The first cold plate module 11 includes a first cold plate structure 111 and a cold head 112 embedded in the first cold plate structure 111. The first cold plate structure 111 is provided with a liquid inlet channel 1131 and a liquid outlet channel 1141. The cooling medium enters the cold head 112 from the liquid inlet channel 1131 and flows out of the cold head 112 from the liquid outlet channel 1141 to cool the first heat-generating components 21 on the main boards 20 on both sides of the first cold plate structure 111.

[0061] It should be noted that the first heating component 21 on the mainboard 20 mainly includes a central heating device 211 and a peripheral heating device 212. The so-called peripheral heating component refers to a heating device arranged on the periphery of the central heating device 211. For example, the first heating component 21 is a GPU module. The heating device of the GPU module includes two major parts, one is the central main heating device, and the other is a peripheral low-power device.

[0062] Among them, the cold head 112 on the first cold plate structure 111 provides heat dissipation for the central main heat-generating device of the GPU module. The low-power devices of the GPU module will conduct the heat to the cover plate of the GPU module, and then to the first cold plate structure 111, and finally be taken away by the cooling medium flowing in the first cold plate structure 111.

[0063] The second cold plate module 12 is connected in parallel with each first cold plate module 11 , and the second cold plate module 12 includes a second cold plate structure 121 , and the second cold plate structure 121 is provided with a cooling channel 122 , and the cooling channel 122 is used for the flow of cooling medium to cool the second heat generating components 22 on the main boards 20 on both sides of the second cold plate structure 121 .

[0064] It should be noted that the second heating component 22 on the mainboard 20 mainly includes a middle heating device 221 and an edge heating device 222. The so-called middle heating device 221 refers to a heating device arranged in the middle of the mainboard 20, such as a switching module, and the edge heating device 222 refers to a heating device arranged at the edge of the mainboard 20, such as an optical module and a network module.

[0065] The path of the cooling channel 122 is used to extend along the layout position of the second heat-generating component 22 on the mainboard 20. When the cooling medium flows along the cooling channel 122 on the second cold plate structure 121, the heat generated by the switching module, optical module and network module on the mainboard 20 is taken away.

[0066] It can be seen that the cooling module 10 provided in the embodiment of the present invention can be used to cool two mainboards 20 placed opposite each other up and down. Specifically, the two mainboards 20 placed opposite each other clamp the cooling module 10 in the middle, and the cooling module 10 can cool and dissipate heat for the mainboards 20 on both sides at the same time.

[0067] During operation, the first cold plate module 11 is used to cool the first heat generating components 21 of the upper and lower main boards 20. The cooling medium enters the cold head 112 from the liquid inlet channel 1131 and flows out of the cold head 112 from the liquid outlet channel 1141. In this way, the cooling medium flows through the liquid inlet channel 1131, the cold head 112 and the liquid outlet channel 1141 successively to cool the first heat generating components 21 on both sides of the first cold plate structure 111. Considering that at least two groups of first heat generating components 21 are provided on the main board 20, at least two first cold plate modules 11 connected in parallel are provided to complete the cooling of all the first heat generating components 21 on the upper and lower main boards 20. The second cold plate module 12 is used to cool the second heat generating components 22 of the upper and lower main boards 20. The cooling medium flows along the cooling channel 122 to cool the second heat generating components 22 of the upper and lower main boards 20.

[0068] The cooling module 10 provided in the embodiment of the present invention can achieve the maximum GPU deployment density within the limited height space of the server chassis and provide effective heat dissipation for it. For example, for the setting of placing two mainboards 20 with a total of 16 GPU modules in the 1.5U chassis height space, the cooling module 10 is clamped between the two mainboards 20, and each first cold plate module 11 is used to cool the first heat-generating component 21 (GPU module) corresponding to the upper and lower mainboards 20, and the second cold plate module 12 is used to cool the second heat-generating component 22 (switch module, optical module and network module, etc.) of the upper and lower mainboards 20. In other words, the above-mentioned cooling module 10 can greatly improve the deployment density of GPU modules in the server chassis while meeting the stable and reliable heat dissipation requirements of GPU modules, switch modules, optical modules and network modules, which not only greatly improves the deployment density of GPU modules in the server chassis, but also effectively reduces the risk of system leakage.

[0069] Please also read Figure 2 , Figure 3 and Figure 4 The cold head 112 includes an upper shell 1121 and a lower shell 1122, and the upper shell 1121 and the lower shell 1122 are separated by a partition 1123. The upper shell 1121 is used to abut against the first heating component 21 of the upper mainboard 20. The upper shell 1121 is provided with an upper cold cavity, which is a liquid-cooling flow channel. The upper cold cavity is used to pass a cooling medium to cool the first heating component 21 of the mainboard 20 on the upper side of the cold head 112. The lower shell 1122 is provided with a lower cold cavity, which is a liquid-cooling flow channel. The lower cold cavity is used to pass a cooling medium to cool the first heating component 21 of the mainboard 20 on the lower side of the cold head 112.

[0070] It can be seen that the cold head 112 is respectively against the first heating component 21 of the upper mainboard 20 and the first heating component 21 of the lower mainboard 20 through the upper shell 1121 and the lower shell 1122. When the cooling medium flows through the upper cold cavity and the lower cold cavity, the cooling medium of the upper cold cavity can take away the heat generated by the first heating component 21 of the upper mainboard 20, and the cooling medium of the lower cold cavity can take away the heat generated by the first heating component 21 of the lower mainboard 20, thereby completing the cooling work of the first heating component 21 on the upper and lower mainboards 20.

[0071] In order to facilitate the cooling medium to flow into the upper cold cavity and the lower cold cavity, and to flow out of the upper cold cavity and the lower cold cavity, the cold head 112 is provided with a first through hole 1124 and a second through hole 1125, the first through hole 1124 and the second through hole 1125 are both provided between the upper shell 1121 and the lower shell 1122, the partition 1123 is located between the first through hole 1124 and the second through hole 1125, the liquid inlet channel 1131 is connected to the first through hole 1124, and the first through hole 1124 is provided with two first grooves 1124. 41, the first through hole 1124 is communicated with the upper cold cavity through the first groove 11241 on the upper side, the first through hole 1124 is communicated with the lower cold cavity through the first groove 11241 on the lower side, the liquid outlet channel 1141 is communicated with the second through hole 1125, two second grooves 11251 are provided in the second through hole 1125, the second through hole 1125 is communicated with the upper cold cavity through the second groove 11251 on the upper side, and the second through hole 1125 is communicated with the lower cold cavity through the second groove 11251 on the lower side.

[0072] With such arrangement, the cooling medium in the liquid inlet channel 1131 is divided into the upper cold cavity and the lower cold cavity by the two first grooves 11241 in the first through hole 1124, so as to complete the cooling work of the first heating component 21 on the upper and lower main boards 20 respectively. Afterwards, the cooling medium in the upper cold cavity and the lower cold cavity is converged into the liquid outlet channel 1141 by the two second grooves 11251 of the second through hole 1125, so as to flow out of the upper cold cavity and the lower cold cavity.

[0073] In some embodiments, the first cold plate module 11 also includes a liquid inlet pipe 113 and a liquid outlet pipe 114. The liquid inlet pipe 113 is provided with a liquid inlet channel 1131, and the liquid outlet pipe 114 is provided with a liquid outlet channel 1141. The liquid inlet pipe 113 and the liquid outlet pipe 114 are both embedded in the first cold plate structure 111, and one end of the liquid inlet pipe 113 close to the cold head 112 is embedded in the first through hole 1124, and the end of the liquid outlet pipe 114 close to the cold head 112 is embedded in the second through hole 1125.

[0074] Specifically, the first through hole 1124 can be provided at the left end of the cold head 112, and the second through hole 1125 can be provided at the right end of the cold head 112. The first through hole 1124 and the second through hole 1125 both pass through the cold head 112. The structures of the first through hole 1124 and the second through hole 1125 are respectively adapted to the structures of the liquid inlet pipe 113 and the liquid outlet pipe 114; one end of the liquid inlet pipe 113 close to the cold head 112 is sealed and assembled in the first through hole 1124 to ensure that the liquid inlet pipe 113 is sealed and assembled in the first through hole 1124. The cooling medium in the liquid pipe 113 is divided into the upper cold cavity and the lower cold cavity through the two first grooves 11241 to complete the cooling work of the first heating component 21 on the upper and lower main boards 20 respectively. The end of the liquid outlet pipe 114 close to the cold head 112 is embedded in the second through hole 1125. The cooling medium in the upper cold cavity and the lower cold cavity converges to the liquid outlet channel 1141 through the two second grooves 11251, thereby flowing out of the upper cold cavity and the lower cold cavity.

[0075] To facilitate heat dissipation of the first heat-generating component 21 on the upper and lower main boards 20, the upper shell 1121 protrudes from the upper surface of the first cold plate structure 111, so that the upper shell 1121 abuts against the central heat-generating device 211 of the first heat-generating component 21 on the upper main board 20, and the upper surface of the first cold plate structure 111 abuts against the peripheral heat-generating device 212 of the first heat-generating component 21 on the upper main board 20; the lower shell 1122 protrudes from the lower surface of the first cold plate structure 111, so that the lower shell 1122 abuts against the central heat-generating device 211 of the first heat-generating component 21 on the lower main board 20, and the lower surface of the first cold plate structure 111 abuts against the peripheral heat-generating device 212 of the first heat-generating component 21 on the lower main board 20.

[0076] Please also read Figure 8 The components required for heat dissipation of the GPU module include two major parts. One is the central main heat generating device located in the middle recess, and the other is the low-power devices such as VR located around the central main heat generating device. These low-power devices will conduct heat to the cover of the GPU module.

[0077] Therefore, the upper shell 1121 is set to protrude from the upper surface of the first cold plate structure 111, so that the upper shell 1121 can be abutted against the central heating device 211 of the first heating component 21 on the upper main board 20, and the upper surface of the first cold plate structure 111 can be abutted against the peripheral heating device 212 of the first heating component 21 on the upper main board 20; the lower shell 1122 is set to protrude from the lower surface of the first cold plate structure 111, so that the lower shell 1122 can be abutted against the central heating device 211 of the first heating component 21 on the lower main board 20, and the lower surface of the first cold plate structure 111 can be abutted against the peripheral heating device 212 of the first heating component 21 on the lower main board 20.

[0078] In this way, the upper shell 1121 and the lower shell 1122 of the cold head 112 are respectively abutted against the central heating device 211 of the first heating component 21 on the upper mainboard 20 and the central heating device 211 of the first heating component 21 on the lower mainboard 20, thereby providing heat dissipation for the central heating device 211 of the first heating component 21 on both sides of the mainboards 20 at the same time, and the peripheral heating devices 212 of the first heating components 21 on both sides of the mainboards 20 will conduct the heat to the cover plate of the GPU module, and then to the first cold plate structure 111, and finally be taken away by the cooling medium flowing in the first cold plate structure 111.

[0079] Of course, according to actual needs, the first cold plate structure 111 can be an aluminum substrate, and the liquid inlet pipe 113 and the liquid outlet pipe 114 are both copper tubes, which are embedded in the aluminum substrate. When cooling medium flows in the copper tube, the heat of low-power devices such as VR is conducted to the aluminum substrate, and then the heat is taken away by the cooling medium in the copper tube.

[0080] In some embodiments, the number of the cold heads 112 on the first cold plate structure 111 is at least two, and each cold head 112 is arranged in series on the first cold plate structure 111 .

[0081] Please also read Figure 5 , Figure 6 and Figure 8 , 8 GPU modules are set on a single motherboard 20, and the 8 GPU modules are divided into 4 columns (one column includes 2 GPU modules) and are arranged on the motherboard 20. Therefore, the number of first cold plate modules 11 is set to 4, and the 4 first cold plate modules 11 are arranged in parallel. The first cold plate modules 11 can dissipate heat for the corresponding single-column GPU modules on the upper and lower motherboards 20, and two cold heads 112 connected in series are arranged on the first cold plate structure 111 of the single first cold plate module 11, and the two cold heads 112 provide heat dissipation for the single-column GPU modules respectively.

[0082] Specifically, a liquid inlet pipe 113 and a liquid outlet pipe 114 are provided at one end of the first cold head 112 to enable the flow of cooling medium in the first cold head 112 , and the second cold head 112 is connected to the first cold head 112 via the liquid inlet pipe 113 and the liquid outlet pipe 114 to enable the flow of cooling medium in the second cold head 112 .

[0083] In this way, a part of the cooling medium in the liquid inlet pipe 113 corresponding to the first cold head 112 is divided into the upper cold cavity and the lower cold cavity of the first cold head 112, and the other part flows out of the first through hole 1124 of the first cold head 112 through the liquid inlet pipe 113 corresponding to the second cold head 112, and flows into the second cold head 112. The structure of the second cold head 112 is the same as that of the first cold head 112. The cooling medium enters the upper cold cavity and the lower cold cavity of the second cold head 112 through the first through hole 1124 on the left, and flows out of the second cold head 112 through the second through hole 1125 on the right. The cooling medium in the two cold heads 112 flows out of the cold head 112 through the second through hole 1125 on the right and converges into the copper tube to flow out of the first cold plate structure 111.

[0084] To increase the heat dissipation effect, fins may be designed on the cold head 112 to increase the heat dissipation area. For example, heat dissipation fins 1126 are provided on the end surfaces of the upper shell 1121 and the lower shell 1122.

[0085] On the basis of the above, the cooling module 10 also includes a manifold, which includes a diverter 13 and a collector 14. The diverter 13 and the collector 14 can be set as an integrated structure, wherein the second cold plate module 12 and at least two first cold plate modules 11 are all arranged in parallel on the diverter 13 and the collector 14.

[0086] Specifically, the diverter 13 is provided with a first liquid inlet, a second liquid outlet and at least two first liquid outlets (the number of the first liquid outlets is the same as the number of the first cold plate modules 11), the first liquid inlet is used to introduce the cooling medium into the diverter 13, the first liquid outlet is connected to the corresponding liquid inlet channel 1131 of the first cold plate module 11, and the second liquid outlet is connected to one end of the cooling channel 122 of the second cold plate module 12; the collector 14 and the diverter 13 are provided between the second cold plate module 12 and each first cold plate module On the same side of the block 11 (for example, the diverter 13 is fixedly connected to the upper end surface of the collector 14), the collector 14 is provided with a third liquid outlet, a third liquid inlet and at least two second liquid inlets (the number of the second liquid inlets is the same as the number of the first cold plate module 11), the third liquid outlet is used for supplying the cooling medium to flow out of the collector 14, the second liquid inlet is connected to the corresponding liquid outlet channel 1141 of the first cold plate module 11, and the third liquid inlet is connected to the other end of the cooling channel 122 of the second cold plate module 12.

[0087] In this way, a part of the cooling medium distributed by the diverter 13 can flow into the corresponding first cold plate module 11 from the corresponding first liquid outlet, and the cooling medium after heat dissipation can flow into the collector 14 from the corresponding second liquid inlet. Another part of the cooling medium distributed by the diverter 13 can flow into the second cold plate module 12 from the second liquid outlet, and the cooling medium after heat dissipation can flow into the collector 14 from the corresponding third liquid inlet.

[0088] In some embodiments, the cooling channel 122 includes a first channel 12211, two second channels 12221, two third channels 12231 and a fourth channel 12241. Among them, the end of the first channel 12211 close to the diverter 13 is connected to the second liquid outlet, the two second channels 12221 are both connected to the end of the first channel 12211 away from the diverter 13, and the two second channels 12221 are respectively arranged on both sides of the first channel 12211, the two third channels 12231 are respectively connected to the ends of the two second channels 12221 away from the first channel 12211, the end of the fourth channel 12241 away from the diverter 13 is connected to the two third channels 12231, and the end of the fourth channel 12241 close to the diverter 13 is connected to the third liquid inlet.

[0089] Considering that the second heat generating component 22 on the mainboard 20 is distributed in a T-shape as a whole, the second cold plate structure 121 includes an upper cold plate body 1211 and a lower cold plate body 1212, which are combined to form a T-shaped cold plate structure.

[0090] Further, the second cold plate module 12 further includes a first cooling tube 1221, two second cooling tubes 1222, two third cooling tubes 1223 and a fourth cooling tube 1224, the first cooling tube 1221 is provided with a first channel 12211, the second cooling tube 1222 is provided with a second channel 12221, the third cooling tube 1223 is provided with a third channel 12231, the fourth cooling tube 1224 is provided with a fourth channel 12241, the first cooling tube 1221 and the two second cooling tubes 1222 are embedded in the upper cold plate body 1211, and the fourth cooling tube 1224 and the two third cooling tubes 1223 are embedded in the lower cold plate body 1212. Of course, the first cooling tube 1221, the second cooling tube 1222, the third cooling tube 1223 and the fourth cooling tube 1224 are all copper tubes embedded in the second cold plate structure 121.

[0091] Furthermore, the first cooling tube 1221 and the fourth cooling tube 1224 both extend in the first direction, and the fourth cooling tube 1224 is located directly below the first cooling tube 1221, the two second cooling tubes 1222 and the two third cooling tubes 1223 both extend in a second direction perpendicular to the first direction, the third cooling tube 1223 is located directly below the corresponding second cooling tube 1222, and the third cooling tube 1223 and the corresponding second cooling tube 1222 are connected via a connecting tube.

[0092] It should be noted that the first direction may be as follows: Figure 1 The X-axis direction shown, the second direction can be as follows Figure 1 The Y-axis direction is shown.

[0093] In this way, the cooling medium distributed by the second liquid outlet of the diverter 13 flows to the two second cooling tubes 1222 through the first cooling tube 1221, and flows to the two third cooling tubes 1223 through the two second cooling tubes 1222, and then flows into the fourth cooling tube 1224 through the two third cooling tubes 1223, and then flows into the collector 14 from the third liquid inlet, so as to cool the second heating components 22 on both sides of the second cold plate structure 121.

[0094] It can be understood that when the cooling medium flows in the first cooling tube 1221, it can take away the heat generated by the switching module on the upper mainboard 20. After flowing out of the first cooling tube 1221, the cooling medium is divided into two and enters the second cooling tubes 1222 on both sides respectively. When the cooling medium flows in the two second cooling tubes 1222, it can take away the heat generated by modules such as the optical module and the network module on the upper mainboard 20. Afterwards, the cooling medium flows into the two third cooling tubes 1223. When the cooling medium flows in the two third cooling tubes 1223, it can take away the heat generated by modules such as the optical module and the network module on the lower mainboard 20. Finally, the cooling medium in the two third cooling tubes 1223 converges to the fourth cooling tube 1224. When the cooling medium flows in the fourth cooling tube 1224, it can take away the heat generated by the switching module on the lower mainboard 20.

[0095] That is to say, the cooling medium enters the copper tube of the upper cold plate body 1211 through the diverter 13, flows through the switching module in the middle position of the upper main board 20, provides heat dissipation for the switching module, and then is divided into two to dissipate heat for the optical module and the network module at the tail of the upper main board 20, and then flows into the lower cold plate body 1212. The upper cold plate body 1211 and the lower cold plate body 1212 are connected by copper tubes. The lower cold plate body 1212 first dissipates heat for the optical module and the network module of the lower main board 20, and then converges in the middle to dissipate heat for the switching module of the lower main board 20 and then flows into the collector 14.

[0096] In some embodiments, connecting pipelines can also be set between each first cold plate module 11 and the diverter 13, and between the second cold plate module 12 and the diverter 13, and solenoid valves for controlling the flow of cooling medium can be set on the connecting pipelines. Furthermore, the cooling module 10 also includes a control module and a temperature detection module, wherein the temperature detection module is used to detect the real-time temperature of the heat-generating components on the mainboard 20, and the control module is communicatively connected with the temperature detection module and each solenoid valve. The control module is used to control the opening of the corresponding solenoid valve according to the temperature data detected by the temperature detection module, so as to accurately control the flow of cooling medium allocated by the diverter 13 to the first cold plate module 11 and the second cold plate module 12.

[0097] In this way, the control module of the cooling module 10 is connected to the temperature detection module and each solenoid valve through communication, so that the control module can accurately control the opening of the corresponding control valve according to the temperature of the heat-generating component on the main board 20, thereby ensuring that the cooling medium flow in the first cold plate module 11 and the second cold plate module 12 is diverted as needed.

[0098] Compared with the traditional method that cannot adjust the cooling medium flow according to the temperature change of the device, the cooling module 10 provided by the present invention can finely control the cooling medium flow in the first cold plate module 11 and the second cold plate module 12 according to the temperature of each heating device on the mainboard 20, thereby ensuring that high-heat-generating devices can be effectively cooled and low-heat-generating devices can be guaranteed to work normally, so that the heat dissipation of each heating device on the mainboard 20 is uniform, and the effect of saving cooling medium flow and reducing power consumption is achieved.

[0099] The cooling module 10 has the following beneficial effects:

[0100] First, the cooling module 10 provided by the present invention is clamped between two mainboards 20 to form a sandwich structure cooling solution. For the setting of placing two mainboards 20 and a total of 16 GPU modules in a 1.5U chassis height space, the cooling module 10 is clamped between the two mainboards 20, and each first cold plate module 11 is used to cool the first heat generating components 21 (GPU modules) corresponding to the mainboards 20 on the upper and lower sides, and the second cold plate module 12 is used to cool the second heat generating components 22 (switching modules, optical modules and network modules, etc.) of the mainboards 20 on the upper and lower sides, which can effectively improve the internal space utilization of the chassis, increase the deployment density of the entire cabinet of the GPU server, and ensure the heat dissipation effect;

[0101] Secondly, the cooling module 10 provided by the present invention abandons the original hose connection between cold plates or between cold plates and manifolds, thereby improving reliability, effectively reducing the risk of system leakage, and ensuring stable and reliable operation of the cooling module 10.

[0102] A cooling system provided by the present invention includes the cooling module described in the above specific embodiment; other parts of the cooling system can refer to related technologies and will not be elaborated in this article.

[0103] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0104] The cooling module and cooling system provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the scheme of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A cooling module, used to be clamped between two mainboards to cool the two mainboards, characterized in that: include: At least two first cold plate modules connected in parallel, the first cold plate module comprising a first cold plate structure and a cold head embedded in the first cold plate structure, the first cold plate structure being provided with a liquid inlet channel and a liquid outlet channel, the cooling medium entering the cold head through the liquid inlet channel and flowing out of the cold head through the liquid outlet channel, so as to cool the first heat generating components on the main boards at both sides of the first cold plate structure; The second cold plate module is connected in parallel with each of the first cold plate modules. The second cold plate module includes a second cold plate structure. The second cold plate structure is provided with a cooling channel. The cooling channel is used for cooling medium to flow so as to cool the second heat generating components on the main boards on both sides of the second cold plate structure.

2. The cooling module according to claim 1, characterized in that: The cold head includes an upper shell and a lower shell, the upper shell and the lower shell are separated by a partition, the upper shell is provided with an upper cold cavity, the upper cold cavity is used to pass cooling medium to cool the first heat generating component of the upper mainboard of the cold head, and the lower shell is provided with a lower cold cavity, the lower cold cavity is used to pass cooling medium to cool the first heat generating component of the lower mainboard of the cold head.

3. The cooling module according to claim 2, characterized in that: The cold head is provided with a first through hole and a second through hole, the first through hole and the second through hole are both provided between the upper shell and the lower shell, the partition is located between the first through hole and the second through hole, the liquid inlet channel is communicated with the first through hole, the first through hole is communicated with the upper cold cavity and the lower cold cavity, the liquid outlet channel is communicated with the second through hole, and the second through hole is communicated with the upper cold cavity and the lower cold cavity.

4. The cooling module according to claim 3, characterized in that: The first cold plate module also includes a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is provided with the liquid inlet channel, the liquid outlet pipe is provided with the liquid outlet channel, the liquid inlet pipe and the liquid outlet pipe are both embedded in the first cold plate structure, one end of the liquid inlet pipe close to the cold head is embedded in the first through hole, and one end of the liquid outlet pipe close to the cold head is embedded in the second through hole.

5. The cooling module according to claim 2, characterized in that: The upper shell protrudes from the upper surface of the first cold plate structure, so that the upper shell abuts against the central heating device of the first heating component on the upper main board, and the upper surface of the first cold plate structure abuts against the peripheral heating device of the first heating component on the upper main board; The lower shell protrudes from the lower surface of the first cold plate structure, so that the lower shell abuts against the central heating device of the first heating component on the lower mainboard, and the lower surface of the first cold plate structure abuts against the peripheral heating device of the first heating component on the lower mainboard.

6. The cooling module according to claim 4, characterized in that: The number of the cold heads on the first cold plate structure is at least two, and each of the cold heads is arranged in series on the first cold plate structure; The upper shell and the lower shell are both provided with heat dissipation fins.

7. The cooling module according to any one of claims 1 to 6, characterized in that: The cooling module also includes: A flow divider, the flow divider is provided with a first liquid inlet, a second liquid outlet and at least two first liquid outlets, the first liquid inlet is used to introduce cooling medium into the flow divider, the first liquid outlet is communicated with the corresponding liquid inlet channel, and the second liquid outlet is communicated with one end of the cooling channel; A collector and the diverter are arranged on the same side of the second cold plate module and each of the first cold plate modules, and the collector is provided with a third liquid outlet, a third liquid inlet and at least two second liquid inlets, the third liquid outlet is used for the cooling medium to flow out of the collector, the second liquid inlet is connected to the corresponding liquid outlet channel, and the third liquid inlet is connected to the other end of the cooling channel.

8. The cooling module according to claim 7, characterized in that: The cooling channel comprises: a first channel, wherein one end of the first channel close to the diverter is connected to the second liquid outlet; Two second channels, both of which are connected to an end of the first channel away from the diverter, and the two second channels are respectively arranged on both sides of the first channel; Two third channels, the two third channels are respectively connected to ends of the two second channels away from the first channels; A fourth channel, wherein one end of the fourth channel away from the diverter is communicated with the two third channels, and one end of the fourth channel close to the diverter is communicated with the third liquid inlet.

9. The cooling module according to claim 8, characterized in that: The second cold plate structure comprises an upper cold plate body and a lower cold plate body, wherein the upper cold plate body and the lower cold plate body are combined to form a T-shaped cold plate structure; The second cold plate module further includes a first cooling tube, two second cooling tubes, two third cooling tubes and a fourth cooling tube, the first cooling tube is provided with the first channel, the second cooling tube is provided with the second channel, the third cooling tube is provided with the third channel, and the fourth cooling tube is provided with the fourth channel; The first cooling tube and the two second cooling tubes are embedded in the upper cold plate body, and the fourth cooling tube and the two third cooling tubes are embedded in the lower cold plate body; The first cooling tube and the fourth cooling tube both extend in a first direction, and the fourth cooling tube is located directly below the first cooling tube. The two second cooling tubes and the two third cooling tubes both extend in a second direction perpendicular to the first direction, and the third cooling tube is located directly below the corresponding second cooling tube. The third cooling tube is connected to the corresponding second cooling tube through a connecting tube. Among them, the cooling medium distributed by the second liquid outlet of the diverter flows to the two second cooling tubes respectively through the first cooling tube, and flows to the two third cooling tubes respectively through the two second cooling tubes, and then flows into the collector from the third liquid inlet after converging to the fourth cooling tube through the two third cooling tubes, so as to cool the second heat-generating components on both sides of the second cold plate structure.

10. A cooling system, characterized in that: Comprising a cooling module as described in any one of claims 1-9.

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