Preheating device for chip mounter and chip mounter

Abstract

The invention relates to the related technical field of chip mounter accessories, in particular to a preheating device for a chip mounter and the chip mounter. The preheating device comprises a circulating air pump, a gas heater and a dust removal module, the circulating air pump is fixedly installed on a bottom plate, and an air inlet port of the gas heater is connected with an air outlet of the circulating air pump through a first-stage air pipe; air outlet shutter openings are formed in the front end face and the rear end face of the gas heater; a pipeline connecting opening in the dust removal module is connected with an air inlet of a circulating air pump through a secondary air pipe; the preheating device for the chip mounter is formed by combining a circulating air pump, a gas heater and a dust removal module, the dust removal module is arranged to be of a flat plate structure, a main air channel, a secondary air channel and an air inlet are formed in the dust removal module, and a dust filtering mechanism is arranged at an end opening of the air inlet; therefore, the internal gas of the chip mounter can be self-cleaned while the internal part of the chip mounter is preheated, so that the chip mounting effect of the chip mounter is effectively ensured.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip mounter accessories, and in particular to a preheating device for a chip mounter and a chip mounter. Background Art

[0002] Mounter: Also known as "mounting machine" or "surface mounting system", it is placed after the dispensing machine or screen printer in the production line. It is a device that accurately places surface mount components on the PCB pads by moving the mounting head. The existing Chinese patent document with announcement number CN219478233U discloses a preheating device for a placement machine, which includes a shell, two slide grooves are provided on the top of the shell, and sliders are movably installed on the inner sides of the two slide grooves, a connecting pipe is fixedly installed on the inner side of the slider, the top of the connecting pipe is connected to a top bin, a fan is installed on the bottom end of the connecting pipe, the top bin, and the slider are fixedly installed with a side connecting block on the opposite side, a sliding rod is movably sleeved on the inner side of the side connecting block, a middle connecting block is fixedly installed on the opposite side of the slider, a screw is threadedly connected on the inner side of the middle connecting block, and a driven gear ring is fixedly sleeved on the outer side of one end of the screw. A driving gear is meshed on the outer side of the driven gear ring, a first motor is installed on one side of the driving gear, a number of mounting holes are opened on both sides of the shell, two slide rail grooves are fixedly installed inside one end of the top bin, a slide bar is movably installed on the inner side of the two slide rail grooves, a rolling door is fixedly installed on the top of the slide bar, a steering roller is movably installed on one side of the rolling door, a winding roller sleeve is movably sleeved on the other end of the rolling door, a double-headed motor is installed on the inner side of the winding roller sleeve, a number of heating wires are installed inside the top bin, a number of card blocks are fixedly installed on the inner side of the top bin, a filter plate is movably installed on the inner side of the card blocks, and a hatch is movably installed on the top of the top bin; However, the preheating device in the above scheme cannot form a self-cleaning effect on the airflow inside the placement machine. When the equipment in the dust-free workshop is in operation, a small amount of particulate dust will still be generated due to equipment wear and other problems, thereby causing a certain impact on the normal operation of the placement machine. For this reason, the present invention proposes a preheating device for a placement machine and a placement machine to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a preheating device for a chip mounter and a chip mounter to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a preheating device for a chip mounter, comprising: A circulating air pump, wherein the circulating air pump is fixedly mounted on the bottom plate; A gas heater, wherein the air inlet port of the gas heater is connected to the air outlet of the circulating air pump through a primary air pipe, and the front and rear end surfaces of the gas heater are both provided with air outlet louvers; A dust removal module, wherein the pipeline connection port on the dust removal module is connected to the air inlet of the circulating air pump through a secondary air pipe; The dust removal module is a flat structure, and is provided with a main air duct and a secondary air duct. The main air duct is connected to the pipe connecting port, and the secondary air ducts are arranged in a row at equal intervals, and the secondary air ducts are connected to the main air ducts. An air inlet is provided on the lower side wall of the secondary air duct, and the air inlets are arranged in a row at equal intervals on a single secondary air duct.

[0005] Preferably, a dust filtering mechanism is installed at the lower port of the air inlet, the dust filtering mechanism is a spherical structure, and filter holes are evenly arranged on the spherical surface of the dust filtering mechanism, a connecting pipe is integrally formed on the spherical surface of the dust filtering mechanism, a connecting thread is arranged at the port of the connecting pipe, a threaded hole is arranged at the lower port of the air inlet, and the connecting pipe is threadedly connected in the threaded hole.

[0006] Preferably, the spherical inner cavity of the dust filtering mechanism is filled with a dust filtering sponge.

[0007] Preferably, the dust filtering mechanism is composed of a combination of a first spherical surface and a second spherical surface, and the connecting thread at the connecting pipe port is located at the connecting pipe on the first spherical surface, and force rings are integrally formed on the outer side walls of the connecting pipe located on the first spherical surface and the second spherical surface, and a force groove is opened at the port of the threaded hole, the size of the force ring matches the size of the force groove, and when the connecting pipe is actually tightened, the force ring is embedded in the force groove.

[0008] Preferably, an alignment groove is provided on the force ring on the first spherical surface, and an alignment protrusion is integrally formed on the force ring on the second spherical surface. The alignment protrusion is matched with the alignment groove, and when the first spherical surface and the second spherical surface are actually docked, the alignment protrusion is embedded in the alignment groove.

[0009] Preferably, a sealing groove is provided at the port of the first spherical surface, and a sealing ring is integrally formed at the port of the second spherical surface. The sealing ring is matched with the sealing groove, and when the first spherical surface and the second spherical surface are actually docked, the sealing ring is embedded in the sealing groove.

[0010] Preferably, no filter holes are provided at the vertical lower side of the dust filtering mechanism.

[0011] A chip placement machine, the chip placement machine has the above-mentioned preheating device for the chip placement machine, the device comprises: a support box, a table, a processing cabin, a cabin door, a loading platform, a Y-axis guide rail, a Y-axis moving module, an X-axis guide rail, an X-axis moving module, a Z-axis guide rail, a Z-axis moving module and a chip placement mechanism combination, and the loading platform is a dust removal module.

[0012] Preferably, the table top is fixedly mounted on the support box, the processing cabin is fixedly mounted on the table top, the processing cabin is hingedly mounted at the feed port of the processing cabin, the base plate is arranged on the table top, and the base plate is located in the inner cavity of the processing cabin, the Y-axis guide rail is fixedly mounted on the mounting bracket on the base plate, and a group of Y-axis guide rails are symmetrically arranged, the Y-axis moving module is arranged on the Y-axis guide rail, the two ends of the X-axis guide rail are respectively connected to the Y-axis moving modules on both sides, the X-axis moving module is arranged on the X-axis guide rail, the Z-axis guide rail is fixedly mounted on the mounting plate on the X-axis moving module, the Z-axis moving module is arranged on the Z-axis guide rail, and the patch mechanism is fixedly mounted on the Z-axis moving module.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting a preheating device for a placement machine composed of a circulating air pump, a gas heater and a dust removal module, and by setting the dust removal module into a flat structure, and opening a main air duct, a secondary air duct and an air inlet on the dust removal module, and setting a dust filter mechanism at the port of the air inlet, the inside of the placement machine can be preheated and the internal gas of the placement machine can be self-cleaned, thereby effectively ensuring the placement effect of the placement machine; 2. A dust filter sponge is filled in the spherical inner cavity of the dust filter mechanism, thereby further improving the filtering effect of the dust filter mechanism through the setting of the dust filter sponge. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 A magnified schematic diagram of the structure at D in the middle; Figure 3 It is a horizontal half-section view of the dust removal module of the present invention; Figure 4 A vertical half-section view of the dust removal module of the present invention; Figure 5 for Figure 4 A schematic diagram of the structure enlargement in the middle; Figure 6 It is a schematic diagram of the dust filtering mechanism of the present invention; Figure 7 It is a schematic diagram of the first spherical structure of the present invention; Figure 8 for Figure 7 A magnified schematic diagram of the structure at B in the middle; Fig. 9 It is a schematic diagram of the second spherical structure of the present invention; Fig.10 for Fig. 9 A magnified schematic diagram of the structure at C in the middle; Fig.11 It is a schematic diagram of the structure of the chip placement machine of the present invention.

[0015] In the figure: circulating air pump 1, gas heater 2, dust removal module 3, bottom plate 4, pipe connection port 5, main air duct 6, secondary air duct 7, air inlet 8, threaded hole 9, dust filtering mechanism 10, filter hole 11, dust filtering sponge 12, first spherical surface 13, second spherical surface 14, connecting pipe 15, connecting thread 16, stress groove 17, stress ring 18, alignment groove 19, alignment protrusion 20, sealing groove 21, sealing ring 22, supporting box 23, table 24, processing cabin 25, cabin door 26, Y-axis guide rail 27, Y-axis moving module 28, X-axis guide rail 29, X-axis moving module 30, Z-axis guide rail 31, Z-axis moving module 32, patch mechanism 33, mounting plate 34. DETAILED DESCRIPTION

[0016] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-11 The present invention provides the following three preferred embodiments: Embodiment 1, a preheating device for a placement machine, includes a circulating air pump 1, a gas heater 2 and a dust removal module 3, the circulating air pump 1 is fixedly mounted on a base plate 4, the air inlet port of the gas heater 2 is connected to the air outlet of the circulating air pump 1 through a primary air pipe, and the front and rear end surfaces of the gas heater 2 are provided with air outlet louvers, the pipe connecting port 5 on the dust removal module 3 is connected to the air inlet of the circulating air pump 1 through a secondary air pipe, the dust removal module 3 is a flat plate structure, and a main air duct 6 and a secondary air duct 7 are provided on the dust removal module 3, the main air duct 6 is connected to the pipe connecting port 5, the secondary air duct 7 is arranged in a row at equal intervals, and the secondary air duct 7 is arranged in communication with the main air duct 6, an air inlet 8 is provided on the lower side wall of the secondary air duct 7, and the air inlet 8 is arranged in a row at equal intervals on a single secondary air duct 7.

[0018] A dust filter mechanism 10 is installed at the lower port of the air inlet 8. The dust filter mechanism 10 is a spherical structure, and filter holes 11 are evenly opened on the spherical surface of the dust filter mechanism 10. A connecting pipe 15 is integrally formed on the spherical surface of the dust filter mechanism 10, and a connecting thread 16 is opened at the port of the connecting pipe 15. A threaded hole 9 is opened at the lower port of the air inlet 8, and the connecting pipe 15 is threadedly connected in the threaded hole 9. A preheating device for a chip mounter composed of a circulating air pump 1, a gas heater 2 and a dust removal module 3 is set, and the dust removal module 3 is set to a flat structure, and a main air duct 6, a secondary air duct 7 and an air inlet 8 are opened on the dust removal module 3, and a dust filter mechanism 10 is set at the port of the air inlet 8, so that the interior of the chip mounter is preheated and the internal gas of the chip mounter can be self-cleaned, thereby effectively ensuring the chip mounting effect of the chip mounter.

[0019] Embodiment 2, on the basis of embodiment 1, the spherical inner cavity of the dust filtering mechanism 10 is filled with a dust filtering sponge 12. By filling the spherical inner cavity of the dust filtering mechanism 10 with the dust filtering sponge 12, the filtering effect of the dust filtering mechanism 10 is further improved through the setting of the dust filtering sponge 12.

[0020] The dust filtering mechanism 10 is composed of a first spherical surface 13 and a second spherical surface 14, and the connecting thread 16 at the end of the connecting tube 15 is located at the connecting tube 15 on the first spherical surface 13, and a force ring 18 is integrally formed on the outer wall of the connecting tube 15 located on the first spherical surface 13 and the second spherical surface 14, and a force groove 17 is opened at the end of the threaded hole 9. The size of the force ring 18 matches the size of the force groove 17, and when the connecting tube 15 is actually tightened, the force ring 18 is embedded in the force groove 17. By configuring the dust filtering mechanism 10 to be composed of a first spherical surface 13 and a second spherical surface 14, it is convenient to clean and maintain the inside of the dust filtering mechanism 10.

[0021] An alignment groove 19 is provided on the force ring 18 on the first spherical surface 13, and an alignment protrusion 20 is integrally formed on the force ring 18 on the second spherical surface 14. The alignment protrusion 20 is matched with the alignment groove 19. When the first spherical surface 13 and the second spherical surface 14 are actually docked, the alignment protrusion 20 is embedded in the alignment groove 19 to improve the docking stability of the first spherical surface 13 and the second spherical surface 14.

[0022] A sealing groove 21 is provided at the end of the first spherical surface 13 , and a sealing ring 22 is integrally formed at the end of the second spherical surface 14 . The sealing ring 22 is matched with the sealing groove 21 . When the first spherical surface 13 and the second spherical surface 14 are actually docked, the sealing ring 22 is embedded in the sealing groove 21 to avoid a large gap between the first spherical surface 13 and the second spherical surface 14 .

[0023] No filter hole 11 is provided at the vertical lower side of the dust filtering mechanism 10 .

[0024] Embodiment 3, on the basis of embodiment 2, a chip mounter, the chip mounter has the above-mentioned preheating device for the chip mounter, the device includes: a support box 23, a table 24, a processing chamber 25, a cabin door 26, a loading platform, a Y-axis guide rail 27, a Y-axis moving module 28, an X-axis guide rail 29, an X-axis moving module 30, a Z-axis guide rail 31, a Z-axis moving module 32 and a chip mounting mechanism 33, the loading platform is a dust removal module 3, and the dust removal module 3 is used as the loading platform to reduce the use of the structure, and can effectively increase the air intake area, thereby improving the gas filtration efficiency.

[0025] The table 24 is fixedly mounted on the support box 23, the processing cabin 25 is fixedly mounted on the table 24, the processing cabin 25 is hingedly mounted at the feed port of the processing cabin 25, the bottom plate 4 is arranged on the table 24, and the bottom plate 4 is located in the inner cavity of the processing cabin 25, the Y-axis guide rail 27 is fixedly mounted on the mounting bracket on the bottom plate 4, and the Y-axis guide rail 27 is symmetrically arranged in a group, the Y-axis moving module 28 is arranged on the Y-axis guide rail 27, the two ends of the X-axis guide rail 29 are respectively connected to the Y-axis moving modules 28 on both sides, the X-axis moving module 30 is arranged on the X-axis guide rail 29, the Z-axis guide rail 31 is fixedly mounted on the mounting plate 34 on the X-axis moving module 30, the Z-axis moving module 32 is arranged on the Z-axis guide rail 31, and the patch mechanism 33 is fixedly mounted on the Z-axis moving module 32.

[0026] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. A preheating device for a chip mounter, characterized in that: include: A circulating air pump (1), wherein the circulating air pump (1) is fixedly mounted on the base plate (4); A gas heater (2), wherein the air inlet port of the gas heater (2) is connected to the air outlet of the circulating air pump (1) via a primary air pipe, and air outlet louvers are provided on the front and rear end surfaces of the gas heater (2); A dust removal module (3), wherein the pipeline connection port (5) on the dust removal module (3) is connected to the air inlet of the circulating air pump (1) via a secondary air pipe; The dust removal module (3) is a flat plate structure, and a main air duct (6) and a secondary air duct (7) are provided on the dust removal module (3), the main air duct (6) is connected to the pipeline connection port (5), the secondary air ducts (7) are arranged in a row at equal intervals, and the secondary air ducts (7) are arranged in communication with the main air duct (6), an air inlet (8) is provided on the lower side wall of the secondary air duct (7), and the air inlet (8) is arranged in a row at equal intervals on a single secondary air duct (7).

2. A preheating device for a chip mounter according to claim 1, characterized in that: A dust filter mechanism (10) is installed at the lower port of the air inlet (8); the dust filter mechanism (10) is a spherical structure, and filter holes (11) are evenly arranged on the spherical surface of the dust filter mechanism (10); a connecting pipe (15) is integrally formed on the spherical surface of the dust filter mechanism (10); a connecting thread (16) is arranged at the port of the connecting pipe (15); a threaded hole (9) is arranged at the lower port of the air inlet (8), and the connecting pipe (15) is threadedly connected to the threaded hole (9).

3. A preheating device for a chip mounter according to claim 2, characterized in that: The spherical inner cavity of the dust filtering mechanism (10) is filled with a dust filtering sponge (12).

4. A preheating device for a chip mounter according to claim 3, characterized in that: The dust filtering mechanism (10) is composed of a first spherical surface (13) and a second spherical surface (14), and the connecting thread (16) at the end of the connecting tube (15) is located at the connecting tube (15) on the first spherical surface (13), and a force ring (18) is integrally formed on the outer wall of the connecting tube (15) located on the first spherical surface (13) and the second spherical surface (14), and a force groove (17) is opened at the end of the threaded hole (9), the size of the force ring (18) matches the size of the force groove (17), and when the connecting tube (15) is actually tightened, the force ring (18) is embedded in the force groove (17).

5. A preheating device for a chip mounter according to claim 4, characterized in that: The force ring (18) on the first spherical surface (13) is provided with an alignment groove (19), and the force ring (18) on the second spherical surface (14) is integrally formed with an alignment protrusion (20), the alignment protrusion (20) and the alignment groove (19) are matched, and when the first spherical surface (13) and the second spherical surface (14) are actually connected, the alignment protrusion (20) is embedded in the alignment groove (19).

6. A preheating device for a chip mounter according to claim 5, characterized in that: A sealing groove (21) is provided at the end of the first spherical surface (13), and a sealing ring (22) is integrally formed at the end of the second spherical surface (14); the sealing ring (22) is matched with the sealing groove (21), and when the first spherical surface (13) and the second spherical surface (14) are actually butted together, the sealing ring (22) is embedded in the sealing groove (21).

7. A preheating device for a chip mounter according to claim 6, characterized in that: No filter hole (11) is provided at a vertically lower position on the dust filtering mechanism (10).

8. A chip mounter, characterized in that: The chip placement machine has a preheating device for a chip placement machine as described in any one of claims 1 to 7, the device comprising: a support box (23), a table (24), a processing chamber (25), a cabin door (26), a loading platform, a Y-axis guide rail (27), a Y-axis moving module (28), an X-axis guide rail (29), an X-axis moving module (30), a Z-axis guide rail (31), a Z-axis moving module (32) and a chip placement mechanism (33), and the loading platform is a dust removal module (3).

9. A chip mounter according to claim 8, characterized in that: The table (24) is fixedly mounted on the support box (23), the processing chamber (25) is fixedly mounted on the table (24), the processing chamber (25) is hingedly mounted at the feed port of the processing chamber (25), the bottom plate (4) is arranged on the table (24), and the bottom plate (4) is located in the inner cavity of the processing chamber (25), the Y-axis guide rail (27) is fixedly mounted on the mounting bracket on the bottom plate (4), and a group of Y-axis guide rails (27) are symmetrically arranged, and the Y-axis moves The module (28) is arranged on the Y-axis guide rail (27), the two ends of the X-axis guide rail (29) are respectively connected to the Y-axis moving modules (28) on both sides, the X-axis moving module (30) is arranged on the X-axis guide rail (29), the Z-axis guide rail (31) is fixedly mounted on the mounting plate (34) on the X-axis moving module (30), the Z-axis moving module (32) is arranged on the Z-axis guide rail (31), and the patch mechanism (33) is fixedly mounted on the Z-axis moving module (32).

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