Modular vapor delivery system for semiconductor processing tools

Abstract

A modular vapor delivery system includes a flow control component module including a first inlet port and a second inlet port, a liquid flow controller coupled to an outlet port of the flow control component module, and a vaporizer module coupled to the liquid flow controller. And the vaporizer module is coupled to the outlet port of the liquid flow controller.

Description

Technical Field

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 373,982, filed on August 30, 2022, entitled “MODULAR VAPOR DELIVERY SYSTEM FOR SEMICONDUCTOR PROCESS TOOLS,” the entire contents of which are incorporated herein by reference. Background Art

[0002] Processing tools are used to perform processes such as film deposition and etching on semiconductor wafer substrates. These processing tools may include vacuum chambers in which chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes may be performed. Precision deposition processes (such as ALD) precisely deliver precursor gases and vapors (collectively referred to as process gases) to a vacuum chamber via a gas distribution nozzle within the vacuum chamber. These processes use process gases containing an inert carrier gas and one or more vaporized precursor substances. The process gas may be formed by vaporizing one or more liquid precursors and then mixing the vapor with a carrier gas. In many processes, multiple precursor species may be delivered to a processing chamber at a specific concentration ratio. Conventionally, for example, various precursor vapors are processed in separate flow paths within a vapor delivery device before the precursor vapors enter a processing chamber where the various gases may be mixed and distributed via a gas distribution nozzle.

[0003] Precursor vapors are typically produced by heating liquid or solid precursor materials. The vaporization temperature can be above 100°C. In general, care must be taken to avoid cold spots along the gas flow paths within the block and between the block and the showerhead. Once formed, the precursor vapor can flow along multiple flow paths that are heated to maintain the precursor in a gaseous state. The process gas flow can pass through a system of flow components such as filters, mixing chambers, and flow control valves. These flow components are also typically heated to potential condensation points of the precursor vapor. For greater efficiency and reduced costs, a single flow path carrying multiple precursor species may be required. Thus, a simple and configurable modular vapor delivery system may be required to provide processing for two or more process precursor vapors and perform all the functions of a more complex conventional vapor delivery system. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The materials described herein are shown in the accompanying drawings by way of example and not limitation. For simplicity and clarity of description, the elements shown in the drawings are not necessarily drawn to scale and exact position. For example, for clarity, the size of some elements is more exaggerated than the size of other elements. In addition, for clarity of discussion, various physical features can be presented in their simplified "ideal" form and geometric features, but it should not be understood that the actual situation can only be close to the ideal type shown. For example, smooth surfaces and square intersections can be drawn without considering the limited roughness, rounded corners and non-ideal corner intersections of the structure formed by nanofabrication technology. In addition, where deemed appropriate, the figure marks are repeated in the drawings to indicate corresponding or similar elements.

[0005] Figure 1 In accordance with at least one implementation of the present disclosure, a block diagram of a modular vapor delivery system including a flow control component module and a vaporizer module is depicted.

[0006] Figure 2 According to at least one implementation of the present disclosure, Figure 1 A block diagram of a modular vapor delivery system comprising a chemical ampoule internally coupled to a flow control component module.

[0007] Figure 3 According to at least one implementation of the present disclosure, Figure 1 Block diagram of a modular vapor delivery system supplied by an external chemical storage and delivery unit.

[0008] Figure 4 In accordance with at least one implementation of the present disclosure, a block diagram of a system including a modular vapor delivery system is depicted.

[0009] Figure 5

[0013] In accordance with at least one implementation of the present disclosure, a process flow diagram illustrating an exemplary method for operating a modular vapor delivery system is depicted. DETAILED DESCRIPTION

[0010] Disclosed herein is a modular vapor delivery system comprising a heated conduit for transporting a plurality of precursor vapors to a processing chamber of a semiconductor processing tool. The modular vapor delivery system may comprise a flow control component module coupled to a vaporizer module. The vaporizer module may be operable to vaporize a liquid stream containing a mixture of one or more precursor substances. In at least one embodiment, mixing of a plurality of single component precursor streams may occur within the flow control component module. In at least one embodiment, the precursor mixture is supplied by an external chemical storage and delivery unit that is physically isolated from the modular vapor delivery system. In at least one embodiment, a chemical ampoule is configured to contain a precursor liquid containing one or more components. The chemical ampoule may be a module on the modular vapor delivery system.

[0011] The modules of the modular vapor delivery system can be mounted on a board or platform. In at least one embodiment, the cabinet housing can accommodate the modular vapor delivery system. The liquid delivery line from the chemical storage and distribution unit can be arranged in a discharge conduit coupled to the housing that accommodates the modular vapor delivery system. The precursor mixture can be transferred to the flow control component module as a liquid flow from the chemical storage and delivery unit (e.g., outside the modular vapor delivery system) or from a chemical ampoule (e.g., under pressure). The liquid flow can be transferred from the flow control component module to the vaporizer module. The liquid flow can be vaporized in the vaporizer module so that the resulting vapor contains the same proportions of various precursor substances as when they are in the liquid state.

[0012] In at least one implementation, the vaporizer module is the final stage of the modular vapor delivery system. Such a configuration can enable the vaporizer module to be directly coupled to a process chamber of a semiconductor processing tool, for example, via a heated delivery conduit, thereby preventing condensation of the precursor vapor within the heated vapor delivery line. Thus, the abundance ratio (e.g., molar ratio, mass or volume concentration ratio) of the precursor vapor can be maintained while transporting the precursor vapor to a distribution point within the process chamber, such as a gas distribution showerhead.

[0013] In at least one embodiment, a vaporizer module can be used as a self-contained device for vaporizing a multi-component liquid stream to supply sufficient heat and temperature control. In at least one embodiment, the vaporizer module is the final stage of a modular vapor delivery system. The use of a vaporizer module as the final stage can achieve a significant simplification in the design of a modular vapor delivery system. For example, the heating of vapor processing components may typically require a complex system of heating elements, such as plug-in heaters, temperature sensors, temperature controllers, and insulation of gas delivery lines. Such complex temperature control designs are essentially eliminated by the disclosed modular vapor delivery system. The vapor can be introduced into the processing chamber via a heated vapor delivery line behind the vaporizer module. Due to the simple geometry involved, the use of a heated vapor delivery line can also significantly reduce the risk of condensation of the vapor before it is delivered into the processing chamber.

[0014] In at least one implementation, the precursor vapor can be mixed with an inert carrier gas such as nitrogen or argon. The precursor can contain a small portion of a carrier gas or a precursor mixture. A multi-component precursor can, for example, contain two or more components in a specific molar ratio. The carrier gas can be a supplemental gas mixed with the precursor mixture to dilute the various precursor substances to a predetermined concentration. In at least one implementation, the carrier gas can also include a reactive gas such as hydrogen, ammonia, hydrazine, oxygen, ozone, or water vapor. Generally speaking, the precursor substances can be heated to an elevated temperature to vaporize the precursor substances into a gas phase. Elevated temperatures can also achieve surface reactions within a processing (e.g., deposition or etching) chamber.

[0015] In at least one embodiment, the modular vapor distribution system includes a chemical ampoule. The chemical ampoule may be a liquid compatible container integrated with the modular vapor distribution system. The chemical ampoule may be operable to contain one or more precursor compounds in a liquid mixture. In at least one embodiment, the chemical ampoule module may be pressurized to cause the liquid contents to flow into the liquid flow control component module. As an example, in at least one embodiment, the chemical ampoule module may include an inlet port coupled to an inert gas line with a valve. The inert gas line may carry an inert carrier gas (e.g., argon or nitrogen) to the chemical ampoule module for pressurization of the liquid contents. In at least one embodiment, the pressurized liquid contents may flow through the outlet port of the chemical ampoule and enter a valved liquid line coupled to the inlet port of the liquid flow control component module. The gas and liquid delivery lines may include inline valves to enable on-demand flow by opening and closing the flow of inert gas, liquid contents, or both.

[0016] In at least one implementation, the liquid precursor may be supplied to the modular vapor delivery system via an external chemical storage and delivery unit. In at least one implementation, the external vapor delivery system may be coupled to the modular vapor delivery system via one or more liquid delivery lines. In at least one implementation, the one or more liquid delivery lines may be arranged via a discharge conduit. The discharge conduit may be coupled to a housing housing the modular vapor delivery system for ventilation of the housing.

[0017] In at least one implementation, a remote lockout tagout (LOTO) valve is coupled in series with one or more liquid delivery pipelines. The in-line LOTO valve may be a shutoff valve to isolate the modular vapor delivery system from an external liquid chemical storage and delivery unit. For example, the LOTO valve may be employed for maintenance or emergency purposes. The LOTO valve may be located on a processing tool to allow for easy access. In at least one implementation, the LOTO valve may be housed in a housing inline with a discharge pipeline.

[0018] In at least one implementation, one or more degassing modules may be inline with one or more liquid delivery lines coupled to the chemical storage and delivery unit. In at least one implementation, the degassing module may be connected after the LOTO valve in the following order: external chemical storage and delivery unit, LOTO valve, and degassing module. The one or more degassing modules may remove bubbles of entrained gas from the liquid precursor or liquid precursor mixture entering the liquid flow control module.

[0019] In some cases, known methods and apparatus are shown in the following description in the form of block diagrams rather than in detail to avoid obscuring the present invention. Mentioning "implementation" or "an implementation" or "some implementations" in this specification refers to that the specific features, structures, functions, or characteristics described with reference to the implementation are included in at least one implementation of the present invention. Therefore, the words "in an implementation" or "in an implementation" or "some implementations" that appear in various places in this specification do not necessarily refer to the same implementation of the present invention. In addition, specific features, structures, functions, or characteristics can be combined in one or more implementations in any suitable manner. For example, when the specific features, structures, functions, or characteristics of the first implementation and the second implementation are not mutually exclusive, the first implementation and the second implementation can be combined.

[0020] "Coupled" and "connected" and their derivatives can be used to illustrate the functional or structural relationship between components. These words should not be synonymous with each other, but in a specific implementation, "connected" can be used to represent direct physical, optical, or electrical contact between two or more elements. "Coupled" here can be used to represent direct or indirect (with other intermediate elements) physical, electrical, or magnetic contact between two or more elements, and / or two or more elements co-operate or interact (for example, cause and effect). In this article, "coupling" can also generally refer to an electronic component directly attached to another. An electric field or magnetic field can couple a component to another, wherein the electric field or magnetic field is controlled by a component to affect another in some way.

[0021] As used herein, "above," "below," "between," and "over" may generally refer to the relative position of a component or material with respect to other components or materials where such physical relationship is noteworthy. Unless these terms are modified with "directly" or "directly," there may be one or more intervening components or materials. Similar distinctions exist in the context of assembly of components. When used throughout this specification and in the claims, a list of items connected by the term "at least one of" or "one or more of" may mean any combination of the listed items.

[0022] As used herein, "adjacent" may generally refer to one thing being located near (eg, next to or proximate to with one or more things in between) or adjacent to (eg, abutting) another thing.

[0023] As used herein, a "module" may generally refer to a group of independent components that can work together to perform a specific task. The components may be assembled on a common block or chassis. A housing may be used to house the module.

[0024] As used herein, "modular" may generally refer to an adjective describing a system that includes one or more modules. Modules may be interchangeable or replaceable.

[0025] In this document, "process gas" may generally refer to an inert or reactive carrier gas, such as argon, nitrogen, oxygen, or hydrogen. A substance may be considered a gas if it is in a gaseous state at room temperature. A process gas may also contain or be a vapor of a precursor substance. In a process gas, the precursor substance is generally in a gaseous state by sublimation or boiling at elevated temperatures. The vapor may condense or crystallize at a temperature below the critical temperature.

[0026] As used herein, "carrier gas" may generally refer to an inert or reactive gas that is mixed with one or more vapors to, for example, dilute the one or more vapors and carry the one or more vapors within a gas stream consisting primarily of the carrier gas.

[0027] In this document, "liquid" generally refers to a substance that is liquid at or near room temperature and above room temperature.

[0028] In this article, "vapor state" can generally refer to a substance that has been converted from a liquid state to a gaseous state. A substance can be heated to its boiling point to convert it from a liquid state to a gaseous state, or heated to its sublimation point to convert it from a solid state to a gaseous state by sublimation.

[0029] Herein, "precursor material" may generally refer to a chemical species that can undergo a surface or gas phase reaction during a deposition process to be converted into a solid film on a surface. A precursor may be a chemical reactant that is involved in a surface or gas phase reaction to produce a surface film.

[0030] Herein, "precursor liquid" may generally refer to a precursor substance that is liquid at room temperature, for example, well below its vaporization temperature.

[0031] Herein, "precursor vapor" generally refers to a precursor substance that has been heated to its vaporization temperature to convert it from a condensed, liquid, or solid state to its vapor state. For example, the precursor substance can be heated to its boiling or sublimation temperature.

[0032] As used herein, a "mass flow controller (MFC)" may generally refer to a device operable to control the mass flow rate of a liquid or gas.

[0033] As used herein, a "liquid flow controller (LFC)" may generally refer to a flow control device dedicated to controlling the flow rate of a liquid.

[0034] As used herein, a "surface mount substrate," or "substrate," may generally refer to a plate or block having subsurface flow channels for gas or liquid delivery. The substrate comprises a mounting surface to which surface mount valves, filters, pressure regulators, meters, line couplers, and the like may be bolted. The mounting surface comprises a plurality of pores aligned with inlet ports and outlet ports on a bottom flange of the surface mount component. The pores are fluidly coupled to an internal flow path. By aligning the fluid ports on the bottom of the surface mount component with the surface pores, the surface mount component may be in-line with the subsurface flow channels. The coupling may be in series so that the fluid may be forced to flow through the surface mount component.

[0035] As used herein, "surface mount components" may generally refer to modular valves, flow controllers, meters, filters, pressure regulators, and the like, which may include a bottom flange bolted to a surface mount substrate. The surface mount substrate may be configured to flow a gas or liquid through a subsurface flow channel, and a series of pores in rows or columns are fluidly coupled to the subsurface flow channel by accessing the flow path at intervals along the flow channel. The pores may be aligned with inlet ports and outlet ports on the bottom of multiple surface mount components, where liquid or gas may continuously enter the surface mount component that is fluidly coupled to the same subsurface flow channel. Multiple surface mount components may be coupled to the same subsurface flow channel by attaching to the substrate along the pores in rows or columns along the subsurface flow channel.

[0036] As used herein, "flow control components" may generally refer to surface mounted components or stand-alone flow control components such as valves, filters, and mass flow controllers that can control the flow of gases and liquids.

[0037] As used herein, a "flow control component module" may generally refer to a module in a modular system, such as a modular vapor delivery system. A flow control component module may include one or more flow control components.

[0038] As used herein, a "vaporizer module" may generally refer to a vaporizer device operable to supply heat of vaporization to a component liquid stream to cause vaporization of all components of the liquid stream.

[0039] As used herein, "coupled" may generally refer to components that are coupled in such a way that a fluid (e.g., a gas or liquid) can flow from one component to another component. The term "fluidically coupled" may also have the same meaning. For example, a conduit may be coupled (or fluidically coupled) to a container when it opens into the interior of the container, thereby enabling fluid to flow between the conduit and the container.

[0040] Herein, "reservoir" may generally refer to a container for containing a gas or a liquid.

[0041] As used herein, "chemical ampoule" may generally refer to a reservoir (ampoule) operable to contain a liquid substance.

[0042] As used herein, "vapor transport lines" may generally refer to metal, glass, or polymer tubing used to transport gases and vapors from one location to another within a system that includes a vapor supply or generation.

[0043] Herein, "carrier gas line" may generally refer to a gas delivery line that delivers a carrier gas.

[0044] As used herein, "liquid transport line" may generally refer to a metal, glass, or polymer tube used to transport liquid from one location to another within a system that includes a liquid supplier.

[0045] As used herein, "duct" generally refers to a conduit.

[0046] In this document, "exhaust duct" may generally refer to a conduit coupled to an exhaust system. The exhaust system may be a ventilation system with active air convection to generate suction within the enclosed space, thereby achieving the exhaust of unwanted vapors and gases accumulated in the enclosed space and the replenishment of air in the space.

[0047] As used herein, a "valve" may generally refer to a device that can control the flow of a fluid, such as a liquid or gas, with a gate. For example, a gate valve, butterfly valve, or ball valve can be fully opened or closed. A valve can also adjust the flow of a fluid between fully open or closed.

[0048] In this document, a "reversing valve" may generally refer to a three-way valve coupled to a vacuum exhaust device. The reversing valve may be operable to switch the flow of a gas or liquid in a pipeline to the vacuum exhaust device.

[0049] As used herein, a "lockout tagout (LOTO) valve" may generally refer to a type of shutoff valve that can be used to isolate one or more sections, modules, or portions of a liquid or gas processing device from other sections, modules, or portions of the same or different devices. This type of valve has a feature that allows it to be fixed in a given state (e.g., closed) by an external locking mechanism.

[0050] As used herein, an "inlet port" may generally refer to a port of a device, such as a vaporizer module, a valve, a mass flow controller, etc., to which a conduit is connected and to which an incoming liquid or gas flow is delivered from the conduit.

[0051] Herein, an "outlet port" may generally refer to a port of a device such as a vaporizer module, a valve, a mass flow controller, etc., to which a conduit is connected and into which liquid or gas flowing out of the outlet port is delivered.

[0052] As used herein, a "semiconductor processing tool" may generally refer to an apparatus including a vacuum chamber in which integrated electronic circuits and micro-electromechanical systems (MEMS) devices may be fabricated on semiconductor wafers. Semiconductor wafers may be processed by various deposition and etching processes that are typically performed in a high vacuum. A high vacuum may be formed within the vacuum chamber.

[0053] As used herein, a "showerhead" may generally refer to a gas distribution manifold used in a vacuum chamber of a semiconductor processing tool. A showerhead may include a plurality of apertures through which a process gas may flow and be distributed into the vacuum chamber. A process gas may be fed to the showerhead through a gas regulating component or directly from a process gas source. A showerhead may be used in a semiconductor processing tool vacuum chamber.

[0054] As used herein, a "conduit" may generally refer to a pipe or tube that transfers gases or liquids.

[0055] As used herein, a "vacuum chamber" may generally refer to a chamber that is evacuated to a high vacuum. Vacuum chambers may be used in semiconductor processing tools for the manufacture of integrated circuits and MEMS devices. Deposition, cleaning, and etching processes are most commonly performed in vacuum chambers.

[0056] As used herein, a "processing chamber" may generally refer to, for example, a vacuum chamber dedicated to the manufacture of semiconductor integrated circuits. A processing chamber may be part of a processing tool that includes a showerhead for introducing gases and vapors into the processing chamber. A processing chamber may also generally include a wafer chuck for supporting a semiconductor or insulator wafer as a substrate for chemical vapor deposition or etching processes.

[0057] Unless otherwise clearly indicated in the context of its use, "substantially equivalent", "approximately equivalent", and "approximately equivalent" generally mean that there are only accidental variations between the two objects described. In the art, such variations usually do not exceed + / -10% of the stated values.

[0058] Figure 1 A block diagram of a modular vapor delivery system 100 is depicted, which includes a flow control component module 102 and a vaporizer module 104. The modular vapor delivery system 100 can be depicted by a rectangle surrounding the flow control component module 102 and the vaporizer module 104. In at least one implementation, the flow control component module 102 and the vaporizer module 104 can be mounted on a plate or base plate plane. In at least one implementation, the flow control component module 102 and the vaporizer module 104 can be mounted on a platform within a housing (e.g., a casing).

[0059] In at least one embodiment, the modular vapor delivery system 100 can include high temperature materials that are significantly resistant to corrosive chemicals. In at least one embodiment, components of the modular vapor delivery system can include materials such as, but not limited to, stainless steel, or high temperature nickel alloys such as Hastelloy. Other suitable materials, such as metal alloys including titanium, tungsten, or tantalum, can also be included according to at least one embodiment. In at least one embodiment, the substrate can include a high temperature chemically resistant polymer such as polyetheretherketone (PEEK) or a fluoropolymer (e.g., Teflon).

[0060] In at least one implementation, the flow control component module 102 may include one or more liquid flow control components, such as, but not limited to, valves, liquid mass flow controllers, and gas mass flow controllers (not shown). In at least one implementation, the flow control component module 102 may include a surface mount substrate on which surface mountable flow control components, such as valves, and gas and / or liquid mass flow controllers, may be mounted and interconnected. In at least one implementation, the surface mount substrate may include a plurality of pores on the mounting surface. In at least one implementation, the pores may enable fluid communication between the liquid flow control components and a plurality of gas flow paths within the surface mount substrate.

[0061] In at least one embodiment, the valve and mass flow controller can be interconnected by swage fittings and metal tubes. In at least one embodiment, the flow control component module 102 can include one or more inlet ports 106, 108, 110 and 112, wherein the inlet ports 106 to 112 can be coupled to a liquid precursor source via liquid delivery lines 114, 116, 118 and 120. In at least one embodiment, any or all of the liquid delivery lines 114 to 120 may not be connected. In the depicted embodiment, the liquid delivery lines 116, 118 and 120 are represented by dotted lines to indicate that these lines can be connected as needed. In at least one embodiment, the liquid delivery line 114 can be connected to a liquid source, as described below.

[0062] In at least one implementation, a plurality of pure precursor materials may be delivered to the modular vapor delivery system and mixed within the modular vapor delivery system. In at least one implementation, any or all of the liquid delivery lines 116 to 120 may be used to introduce a plurality of pure liquid precursor species into the flow control component module 102. In at least one implementation, a mixing component on the flow control component module 102 may be used to directly mix the pure liquid precursor species.

[0063] In at least one implementation, the flow control component module 102 may include an inlet port 122 for introducing a carrier gas via a gas delivery line 124. In at least one implementation, the flow control component module 102 also includes an additional inlet port 126 for introducing a liquid precursor species or mixture. In at least one implementation, the inlet ports 106, 108, 110, 112, 122, and 126 may be crimp fittings connected to tubing.

[0064] In at least one implementation, a degassing module 127 is coupled to an inlet port 126 on a board of the modular vapor delivery system 100. In at least one implementation, the degassing module 127 can be coupled to any of the inlet ports 106, 108, 110, 112, 122, or 126. In at least one implementation, a plurality of degassing modules (not shown) can be disposed on a board of the modular vapor delivery system 100. In at least one implementation, the degassing module 127 can remove dissolved gases from a liquid precursor entering the flow control component module 102.

[0065] In at least one implementation, a liquid flow controller (LFC) 128 can be coupled to an outlet port 130 of the flow control component module 102 and to an inlet port 132 of the vaporizer module 104. In at least one implementation, a carrier gas line 134 includes a first end coupled to an outlet port 136 of the flow control component module 102 and a second end coupled to an inlet port 138 of the vaporizer module 104.

[0066] In at least one implementation, the vaporizer module 104 may be operable to mix a liquid precursor mixture entering the inlet port 132 and a carrier gas entering the inlet port 138. In at least one implementation, the liquid precursor mixture may be pre-mixed with the carrier gas entering through the inlet port 122 by the flow control component module 102 before entering the vaporizer module 104. In at least one implementation, the pre-mixed precursor mixture may still be further mixed and diluted using the carrier gas entering the vaporizer module 104 through the inlet port 138. In at least one implementation, the flow rate of the carrier gas may be adjusted to obtain a precise concentration of the precursor species in the precursor stream or multi-component precursor mixture stream.

[0067] In at least one implementation, the vaporizer module 104 includes, for example, a heating chamber (not shown) to cause rapid vaporization of a single or multi-component liquid stream entering at the inlet port 132. In at least one implementation, the vaporizer module 104 can be operable to vaporize substantially all of the liquid entering its heating chamber, while enabling the abundance ratio (e.g., molar, mass, or volume ratio) of the multi-component precursor vapor to be substantially the same as the abundance ratio of the liquid stream being vaporized. In at least one implementation, the vaporizer module 104 can be operable to mix the vapor with a carrier gas entering at the inlet port 138, thereby enabling adjustment of the concentration of the precursor species. In at least one implementation, the gas stream comprising the precursor vapor and the carrier gas can exit the vaporizer module 104 at the outlet port 140.

[0068] In at least one embodiment, a heated vapor delivery line 142 (enclosed in a dashed box) can be coupled to the outlet port 140 and to a processing chamber (not shown). In at least one embodiment, a heating jacket or heating tape can be wrapped or encapsulated on the heated vapor delivery line 142. In at least one embodiment, the heating tape or heating jacket can be electrically coupled to a temperature controller. In at least one embodiment, the feedback circuit for the temperature controller can include temperature sensors such as thermocouples and resistance temperature detectors (RTDs). In at least one embodiment, flow control components and lines in a module upstream of the vaporizer module can process liquids. Liquid processing can typically be performed at room temperature, so temperature control of the upstream module may be redundant. In at least one embodiment, confining heating and temperature control to the conduit can achieve significant cost savings and design simplification of the modular vapor delivery system.

[0069] In at least one implementation, a reversing valve 144 can be connected inline with the outlet port 140 of the vaporizer module 104 and the heated vapor delivery line 142. The reversing valve 144 can be coupled to a vacuum system including a vacuum pump (not shown). In at least one implementation, the reversing valve 144 can be used, for example, to divert the precursor vapor flow to a vacuum to mitigate pressure transients that may occur when gas flow begins. In at least one implementation, the reversing valve 144 can be closed, for example, to restore the flow of the precursor to the process chamber when the flow reaches a steady state.

[0070] Figure 2 A block diagram of a modular vapor delivery system 200 is depicted according to at least one implementation, the modular vapor delivery system 200 including a chemical ampoule 202 internally coupled to a flow control component module 102. In at least one implementation, the chemical ampoule 202 can be a container or reservoir operable to contain a liquid precursor. In at least one implementation, the chemical ampoule 202 can be operable to receive a flow of a carrier gas via an inlet port 204. In at least one implementation, the inlet port 204 can be fed by a gas delivery line 206. In at least one implementation, a valve 208 can be coupled inline with the gas delivery line 206 to regulate the flow of a carrier gas or an inert gas into the chemical ampoule 202. In at least one implementation, the carrier gas or the inert gas can pressurize the liquid contents of the chemical ampoule 202.

[0071] In at least one implementation, the chemical ampoule 202 can be mounted on the same platform used to mount other modules of the modular vapor delivery system 200. In at least one implementation, the chemical ampoule 202 can be included in a shared housing that houses the modular vapor delivery system 200. In at least one implementation, the chemical ampoule 202 is removable for maintenance or for refilling with precursor.

[0072] In at least one implementation, the chemical ampoule 202 can include an outlet port 210. A liquid delivery line 212 can be coupled to the outlet port 210 and to the inlet port 126 of the flow control component module 102. In at least one implementation, a valve 214 can be coupled inline with the liquid delivery line 212. The valve 214 can enable metering of the liquid precursor into the flow control component module 102. In at least one implementation, a degassing module 127 can be inline with the liquid delivery line 212 between the chemical ampoule 202 and the inlet port 126.

[0073] In at least one implementation, modular vapor delivery system 200 can be substantially similar to modular vapor delivery system 100. For example, the description of the precursor flow path including flow control component module 102 and vaporizer module 104 can be substantially the same as described for modular vapor delivery system 100.

[0074] Figure 3 A block diagram of a modular vapor delivery system 300 is depicted. In the depicted implementation, according to at least one implementation, precursors are supplied to the modular vapor delivery system 300 by a chemical storage and delivery unit (CSDU) 302. In at least one implementation, the CSDU 302 may be external to the modular vapor delivery system 300. In at least one implementation, the CSDU 302 includes one or more precursor reservoirs (not shown). In at least one implementation, the one or more precursor reservoirs may be substantially similar to the chemical ampoule 202. In at least one implementation, the one or more precursor reservoirs may be operable to store a single-component liquid precursor compound. In at least one implementation, the one or more precursor reservoirs may be operable to store a multi-component precursor mixture.

[0075] In at least one implementation, the CSDU 302 may include a batch premixing station (not shown) to pre-combine a plurality of liquid precursor compounds, for example, at a predetermined abundance ratio (e.g., molar, mass, or volume percentage). In at least one implementation, the CSDU 302 may include a continuous flow mixing station, for example, including an active pump and an inline mixer. In at least one implementation, the CSDU 302 may output the precursor mixture via a liquid delivery line 114. In at least one implementation, the liquid delivery line 114 may be arranged via an exhaust conduit 304 shown in a dotted outline. In at least one implementation, the exhaust conduit 304 is coupled to a cabinet housing of the modular vapor delivery system 300. In at least one implementation, the exhaust conduit 304 may also be coupled to an exhaust ventilation system to provide a negative pressure within the housing. In at least one implementation, the exhaust conduit 304 may enable the exhaust system to remove precursor vapors that may leak into the housing. Such vapors may escape into the environment and pose a toxic hazard to exposed personnel near the tool.

[0076] In at least one implementation, a lockout tagout (LOTO) valve 306 may be coupled inline with the liquid delivery line 114. In at least one implementation, the LOTO valve 306 may be a shutoff valve for isolating the modular vapor delivery system 300 from the CSDU 302. For example, the LOTO valve 306 may be used for maintenance or emergency purposes. In at least one implementation, the LOTO valve 306 may be in an easily accessible area of ​​the processing tool. In at least one implementation, when the LOTO valve 306 is inline with the liquid delivery line 114 disposed in the discharge pipeline 304, the LOTO valve 306 may be contained in a housing 307 coupled to the discharge pipeline 304. In at least one implementation, the housing 307 may be hermetically sealed and include a removable cover for accessing the LOTO valve 306.

[0077] In at least one implementation, a degassing module 308 can be coupled inline with the liquid delivery line 114. In at least one implementation, the degassing module 308 can be positioned on a board of the modular vapor delivery system 300. In at least one implementation, the degassing module 308 can enable the removal of dissolved inert gases in a liquid precursor or liquid precursor mixture entering the liquid delivery line 114.

[0078] In at least one implementation, the CSDU 302 can supply a plurality of precursor compounds as a single component stream flowing within the liquid delivery lines 116, 118, and 120 and flowing to the modular vapor delivery system 300. In at least one implementation, the liquid delivery lines 116, 118, and 120 can assist the liquid delivery line 114. As mentioned above, the liquid delivery lines 116, 118, and 120 can be directly coupled to the flow control component module 102. In at least one implementation, the liquid delivery lines 116, 118, and 120 can be arranged together via a drain conduit 310. In at least one implementation, the drain conduit 310 can be coupled to the modular vapor delivery system 300 to exhaust any possible accumulation of leaked vapors, such as within a housing housing the modular vapor delivery system 300. In at least one implementation, the drain conduit 310 can be coupled to a ventilation system.

[0079] In at least one implementation, a LOTO valve 312 can be coupled to the liquid delivery lines 116, 118, and 120. The LOTO valve 312 can be used to decouple the modular vapor delivery system 300 from the CSDU 302 through manual or automatic control. In at least one implementation, the LOTO valve 312 can be used, for example, for maintenance and emergency response to vapor leaks.

[0080] In at least one implementation, a degassing module 314 can be coupled to the liquid delivery lines 116, 118, and 120. In at least one implementation, the degassing module 314 is loaded onto the modular vapor delivery system 300. In at least one implementation, the degassing module 314 can represent a plurality of degassing modules. In at least one implementation, the degassing module 314 can be operable to degas a plurality of liquid streams simultaneously.

[0081] In at least one implementation, the liquid delivery lines 114 , 116 , 118 , and 120 may be arranged together via the drain conduit 304 , thereby omitting the drain conduit 310 , the LOTO valve 312 , and the degassing module 314 .

[0082] Figure 4 A block diagram of a system 400 including a modular vapor delivery system 300 coupled to a process chamber 402 is depicted according to at least one implementation. In at least one implementation, the modular vapor delivery system 300 can be substantially as described above. In at least one implementation, both the CSDU 302 and the chemical ampoule 202 are coupled to the flow control component module 102 to indicate the variability of the modular vapor delivery system 300 (including the modular vapor delivery systems 100 and 200). When both the CSDU 302 and the chemical ampoule 202 are used as precursor storage systems, one or both of the precursor storage systems can be operable.

[0083] In at least one implementation, the processing chamber 402 can be a high vacuum or ultra-high vacuum chamber included in a semiconductor processing tool. In at least one implementation, semiconductor integrated circuit manufacturing processes such as chemical vapor deposition, etching, or cleaning can be performed in the processing chamber 402. In at least one implementation, the processing chamber 402 includes a gas distribution showerhead (not shown) that can be coupled to the vaporizer module 104. In at least one implementation, the showerhead is operable to perform temperature control. Although the depicted implementation of the system 400 includes the modular vapor delivery system 300, the modular vapor delivery systems 100 and 200 can also be used to deliver precursor vapors to the processing chamber 402.

[0084] In at least one implementation, the process chamber 402 is coupled to the modular vapor delivery system 300 via a heated vapor delivery line 142. In at least one implementation, the heated vapor delivery line 142 can be substantially as described above. As mentioned above, the vaporizer module 104 can be the final stage of the modular vapor delivery system 300 (also, the modular vapor delivery system 100 or 200). As previously mentioned, the configuration of the vaporizer module 104 as the final stage of the modular vapor delivery system 300 can save costs and reduce the complexity of the system 400. In at least one implementation, system heating can be limited to the heated vapor delivery line 142.

[0085] In at least one implementation, the system 400 can include a carrier gas source 404 coupled to the gas delivery line 124. In at least one implementation, the carrier gas source 404 can supply an inert or reactive gas as a carrier gas, or as a pressurized gas for all stages or the modular vapor delivery system 300. In at least one implementation, the gas from the carrier gas source 404 can flow into the process chamber 402.

[0086] In at least one implementation, system 400 can include an exhaust system 406 to which exhaust conduit 304 and / or exhaust conduit 310 can be coupled.

[0087] In at least one implementation, the system 400 can include a processor 408 for automated control. In at least one implementation, the processor 408 can be electrically coupled to the flow control component module 102 and the vaporizer module 104. In at least one implementation, the processor 408 can be coupled to the CSDU 302. In at least one implementation, the processor 408 can coordinate the operation of the flow control components within the flow control component module 102 and the vaporizer module 104, for example.

[0088] Figure 5A process flow diagram 500 illustrating an exemplary method for operating a modular vapor delivery system, such as modular vapor delivery system 300 , is depicted in accordance with at least one implementation of the present disclosure.

[0089] In at least one implementation, in block 501, the modular vapor delivery system is connected to a process chamber, such as process chamber 402 of a semiconductor processing tool. In at least one implementation, the process chamber is a high vacuum or ultra-high vacuum chamber in which a semiconductor chip manufacturing process may be performed. In at least one implementation, processes such as chemical vapor deposition, deep reactive ion etching, or plasma cleaning may be performed in the process chamber. In at least one implementation, the deposition or etching process may use a mixture of precursor species or reactive species at predetermined concentrations and abundance ratios.

[0090] In at least one implementation, such a process is performed under high vacuum or ultra-high vacuum conditions. In at least one implementation, a gas distribution showerhead receives and distributes vapor (e.g., vapor of a deposition precursor) and reactive or inert gas within a processing chamber. In at least one implementation, the vapor and gas may be sent from holes in a faceplate of the showerhead. In at least one implementation, the faceplate of the showerhead may be positioned directly above a wafer substrate held in a chuck on a pedestal within the processing chamber.

[0091] In at least one implementation, a heated vapor delivery line (e.g., heated vapor delivery line 142) can be coupled to a vapor outlet port of a vaporizer module on the modular vapor delivery system (e.g., outlet port 140 of vaporizer module 104). In at least one implementation, the vaporizer module can be the final stage of the modular vapor delivery system. In at least one implementation, the preceding stages and lines relative to the vaporizer module stage within the modular vapor delivery system can be dedicated to conveying and handling liquids or carrier gases and not heated. In at least one implementation, the configuration of the modular vapor delivery system can achieve cost savings and design simplification. Therefore, heating can be limited to the heated vapor delivery line to maintain the precursor material in the vapor phase once the precursor material is vaporized by the vaporizer module.

[0092] In at least one implementation, the vaporizer module can supply sufficient heat to vaporize substantially all components of the precursor mixture. In at least one implementation, with substantially complete vaporization, the abundance ratios (e.g., molar, weight, or volume ratios) of the components of the liquid mixture can be substantially the same as in the vapor phase. In at least one implementation, the vaporizer module can enable reliable introduction of a precursor vapor mixture having a precise abundance ratio into a processing chamber.

[0093] In at least one embodiment, the heating vapor delivery line can be heated by wrapping a heating tape or by a coil of heating wire (e.g., nichrome wire). In at least one embodiment, the heating vapor delivery line can be covered with a heating blanket or heating jacket. In at least one embodiment, the heating vapor delivery line can be preheated to a set point temperature programmed into a temperature controller, for example. In at least one embodiment, a temperature sensor embedded in the heating vapor delivery line can provide a feedback signal to the temperature controller, for example. In at least one embodiment, for a precursor mixture, the set point temperature of the heating vapor delivery line can be determined by the highest boiling point or sublimation point of the mixed precursor components to ensure that all components remain in a vapor state.

[0094] In at least one embodiment, the heating vapor delivery line can be heated to a maximum vaporization temperature to mitigate cold spots and preclude condensation or crystallization of precursor components into liquid or solid states within the heating vapor delivery line prior to entering the processing chamber. In at least one embodiment, condensation or crystallization of precursor species within the heating vapor delivery line can cause random and undesirable changes in the residual vapor abundance ratio. In addition, condensation and crystallization can cause line blockage. In at least one embodiment, the lines and nozzles within the processing chamber can also be heated to prevent potential condensation or crystallization of precursor species from blocking the nozzle orifices and potential loss of abundance ratio.

[0095] In at least one implementation, at block 502, a carrier gas is introduced into the modular vapor delivery system. In at least one implementation, Figure 4 As shown in , a carrier gas source (e.g., carrier gas source 404) can be coupled to the inlet port 122 of the flow control component module 102. In at least one implementation, the carrier gas can be inert, such as argon or nitrogen, or reactive, such as oxygen, hydrogen, hydrazine, ammonia, ozone, or water vapor. In at least one implementation, the flow rate of the carrier gas in the flow control component module 102 can be set, for example, by a valve or by a mass flow controller.

[0096] In at least one implementation, in block 503, the flow rate of the carrier gas to the vaporizer module is set. In at least one implementation, the carrier gas source 404 of the system 400 can be the main supply source of the carrier gas of the system. In at least one implementation, the carrier gas can be supplied to and distributed in an external precursor supplier (e.g., CSDU 302) by the carrier gas source 404, for example. In at least one implementation, the CSDU 302 can include a separate carrier gas source to force the flow of the precursor flow, for example. In at least one implementation, the carrier gas can flow into the vaporizer module 104 from the carrier gas source 404 via the flow control component module 102, for example. In at least one implementation, the flow rate of the carrier gas leaving the flow control component module 102 at the outlet port 136 can be set, for example, by a valve or a mass flow controller. In at least one implementation, in the vaporizer module 104, the carrier gas can flow at a preset flow rate and dilute the precursor vapor formed in the precursor flow to a substantially accurate concentration ratio.

[0097] In at least one implementation, at block 504, a flow rate of the precursor liquid to the vaporizer module 104 is set. In at least one implementation, a pulsed, continuous, or semi-continuous flow of a liquid stream containing one or more precursor components may be initiated. In at least one implementation, the precursor flow may be initiated by pressurizing a chemical ampoule (e.g., chemical ampoule 202) containing a single-component or multi-component precursor liquid, or by pressurizing an encapsulating container similar to the chemical ampoule 202 on the CSDU 302. In at least one implementation, the CSDU 302 includes an active pump system for the generation of the continuous precursor flow. In at least one implementation, the liquid flow controller (LFC) 128 may primarily determine the liquid flow rate of the liquid precursor stream entering the vaporizer module 104 after passing through the flow control component module 102.

[0098] In at least one implementation, within the vaporizer module 104, the carrier gas flow and the liquid precursor flow can merge and flow into a heating chamber within the vaporizer module 104. In at least one implementation, the heating chamber can supply sufficient heat to continuously vaporize all liquid flows entering the heating chamber. In at least one implementation, the precursor vapor generated in the heating chamber can be mixed with the carrier gas flow through turbulence, thereby diluting the precursor vapor with the carrier gas. In at least one implementation, the flow rates of the liquid precursor flow and the carrier gas flow can be set separately by the LFC 128 and the mass flow controller within the flow control component module 102.

[0099] In at least one implementation, at block 505, the diluted precursor vapor in the carrier gas may be delivered to the process chamber 402 via the heated vapor delivery line 142. As mentioned above, the heated vapor delivery line 142 may be heated to a set point temperature corresponding to a maximum vaporization temperature of the precursor mixture. In at least one implementation, the set point temperature may be controlled by a temperature controller. In at least one implementation, setting the temperature of the heated vapor delivery line to the maximum vaporization temperature may, for example, mitigate condensation of precursor components in the mixture into a liquid state or crystallization into a solid state. In at least one implementation, the abundance ratio may be maintained during delivery to the process chamber and line clogging may be avoided.

[0100] In at least one implementation, vapor can be transferred from heated vapor delivery line 142 to a showerhead within process chamber 402. In at least one implementation, the gas and vapor delivery lines within process chamber 402 can be heated along with the showerhead itself to mitigate the risk of precursor condensation or crystallization within the showerhead. In at least one implementation, condensation of the precursor vapor stream can also be avoided. In at least one implementation, condensation of the precursor vapor within the showerhead can force droplets into the process chamber during the chemical vapor deposition process. In at least one implementation, the droplets can, for example, cause defects within a growing single crystal or polycrystalline film.

[0101] The following examples are provided to illustrate various implementations. Examples may be combined with other examples. Thus, various implementations may be combined with other implementations without changing the scope of the invention.

[0102] Example 1 is a modular vapor delivery system comprising: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to a first outlet port of the flow control component module; and a vaporizer module coupled to a second outlet port of the liquid flow controller.

[0103] Example 2 is the modular vapor delivery system of any example herein, particularly Example 1, wherein a reversing valve is coupled to the third outlet port of the vaporizer module.

[0104] Example 3 is the modular vapor delivery system of any example herein, particularly Example 1, wherein a first carrier gas line is coupled to the first inlet port of the flow control component module.

[0105] Example 4 is a modular vapor delivery system as described in any example herein (particularly Example 3), wherein a second carrier gas line is coupled to a fourth outlet port of the flow control component module and wherein the second carrier gas line is coupled to the vaporizer module.

[0106] Example 5 is the modular vapor delivery system of any example herein, particularly Example 4, further comprising a chemical ampoule, wherein the chemical ampoule is coupled to the second inlet port of the flow control component module.

[0107] Example 6 is the modular vapor delivery system of any example herein, particularly Example 5, wherein a first valve is coupled to the chemical ampoule and wherein the first valve is coupled to the second inlet port of the flow control component module.

[0108] Example 7 is the modular vapor delivery system of any example herein, particularly Example 6, wherein a second valve is coupled to a third inlet port of the chemical ampoule.

[0109] Example 8 is the modular vapor delivery system of any example herein, particularly Example 7, wherein a third carrier gas line is coupled to the second valve.

[0110] Example 9 is the modular vapor delivery system of any example herein, particularly Example 1, wherein a chemical storage and delivery unit is coupled to the second inlet port of the flow control component module.

[0111] Example 10 is the modular vapor delivery system of any example herein, particularly Example 9, wherein a liquid delivery line is coupled to the chemical storage and delivery unit and to the second inlet port of the flow control component module.

[0112] Example 11 is a modular vapor delivery system as described in any example herein, particularly Example 10, wherein the liquid delivery line is arranged within a discharge conduit, and wherein the discharge conduit is coupled to a housing housing the flow control component module.

[0113] Example 12 is the modular vapor delivery system of any example herein, particularly Example 11, wherein the degassing module is coupled inline to the liquid delivery line.

[0114] Example 13 is the modular vapor delivery system of any example herein, particularly Example 12, wherein a lockout tagout (LOTO) valve is coupled to the liquid delivery line.

[0115] Example 14 is the modular vapor delivery system of any example herein, particularly Example 13, wherein the LOTO valve is housed within a housing coupled to the exhaust conduit, and wherein the housing is sealed.

[0116] Example 15 is a system comprising: a processing chamber; and a modular vapor delivery system coupled to the processing chamber, wherein the modular vapor delivery system comprises: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to a first outlet port of the flow control component module; and a vaporizer module coupled to a second outlet port of the liquid flow controller.

[0117] Example 16 is the system of any example herein, particularly Example 15, wherein a reversing valve is coupled to the third outlet port of the vaporizer module and is coupled to a vacuum pump.

[0118] Example 17 is the system of any example herein, particularly Example 15, wherein the flow control component module comprises a mass flow controller coupled to the inert gas line.

[0119] Example 18 is a method comprising: providing a modular vapor delivery system, wherein the modular vapor delivery system comprises: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to the first outlet port of the flow control component module; and a vaporizer module coupled to the second outlet port of the liquid flow controller; preheating a heated vapor delivery line to a set point temperature, wherein the heated vapor delivery line is coupled to the vaporizer module and coupled to a processing chamber; flowing an inert gas to the modular vapor delivery system; setting a first flow rate of the inert gas to the vaporizer module; and setting a second flow rate of a precursor liquid to the vaporizer module.

[0120] Example 19 is the method of any example herein, particularly Example 18, wherein flowing the inert gas to the modular vapor delivery system comprises setting a mass flow controller coupled to the inert gas line and coupled to the vaporizer module.

[0121] Example 20 is a method described in any example herein (particularly Example 18), wherein setting the second flow rate of the precursor liquid to the vaporizer module includes: setting the liquid flow controller, wherein the liquid flow controller is coupled to the flow control component module and is coupled to the vaporizer module.

[0122] In addition to what is described herein, various modifications may be made to the disclosed implementations and implementations thereof without departing from the scope thereof. Therefore, the descriptions of the implementations herein should be interpreted as merely illustrative, and not as limitations on the scope of the present disclosure. The scope of the present invention should be measured solely with reference to the following claims.

Claims

1. A modular vapor delivery system comprising: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to the first outlet port of the flow control component module; and A vaporizer module is coupled to the second outlet port of the liquid flow controller.

2. The modular vapor delivery system of claim 1, wherein: A reversing valve is coupled to the third outlet port of the vaporizer module.

3. The modular vapor delivery system of claim 1, wherein: A first carrier gas line is coupled to the first inlet port of the flow control component module.

4. The modular vapor delivery system of claim 3, wherein a second carrier gas line is coupled to a fourth outlet port of the flow control component module and wherein the second carrier gas line is coupled to the vaporizer module.

5. The modular vapor delivery system of claim 4, further comprising a chemical ampoule, wherein the chemical ampoule is coupled to the second inlet port of the flow control component module.

6. The modular vapor delivery system of claim 5, wherein a first valve is coupled to the chemical ampoule and wherein the first valve is coupled to the second inlet port of the flow control component module.

7. The modular vapor delivery system of claim 6, wherein a second valve is coupled to a third inlet port of the chemical ampoule.

8. The modular vapor delivery system of claim 7, wherein a third carrier gas line is coupled to the second valve.

9. The modular vapor delivery system of claim 1, wherein: A chemical storage and delivery unit is coupled to the second inlet port of the flow control component module.

10. The modular vapor delivery system of claim 9, wherein: A liquid delivery line is coupled to the chemical storage and delivery unit and to the second inlet port of the flow control component module.

11. The modular vapor delivery system of claim 10, wherein the liquid delivery line is disposed within a discharge conduit, and wherein the discharge conduit is coupled to a housing housing the flow control component module.

12. The modular vapor delivery system of claim 11, wherein a degassing module is coupled inline to the liquid delivery line.

13. The modular vapor delivery system of claim 12, wherein a lockout tagout (LOTO) valve is coupled to the liquid delivery line.

14. The modular vapor delivery system of claim 13, wherein the LOTO valve is contained within a housing coupled to the exhaust conduit, and wherein the housing is sealed.

15. A system comprising: processing chamber; and a modular vapor delivery system coupled to the process chamber, wherein the modular vapor delivery system comprises: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to the first outlet port of the flow control component module; and A vaporizer module is coupled to the second outlet port of the liquid flow controller.

16. The system of claim 15, wherein a reversing valve is coupled to the third outlet port of the vaporizer module and to a vacuum pump.

17. The system of claim 15, wherein the flow control component module comprises a mass flow controller coupled to an inert gas line.

18. A method comprising: A modular vapor delivery system is provided, wherein the modular vapor delivery system comprises: a flow control component module comprising a first inlet port and a second inlet port; a liquid flow controller coupled to the first outlet port of the flow control component module; and a vaporizer module coupled to the second outlet port of the liquid flow controller; preheating a heated vapor delivery line to a set point temperature, wherein the heated vapor delivery line is coupled to the vaporizer module and to a process chamber; flowing an inert gas to the modular vapor delivery system; setting a first flow rate of the inert gas to the vaporizer module; and A second flow rate of precursor liquid to the vaporizer module is set.

19. The method of claim 18, wherein flowing the inert gas to the modular vapor delivery system comprises: A mass flow controller coupled to an inert gas line and to the vaporizer module is set.

20. The method of claim 18, wherein setting the second flow rate of the precursor liquid to the vaporizer module comprises: The liquid flow controller is provided, wherein the liquid flow controller is coupled to the flow control component module and to the vaporizer module.

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