Electronic device

Abstract

An electronic device includes a housing member, a support member, and a component. The housing member has a bottom portion in which the acoustic component is disposed, and an opening facing the bottom portion. The support member covers the opening of the housing member and forms an acoustic space in the housing member for accommodating the acoustic component. The member is disposed on the support member and at least partially overlaps the acoustic space in a plan view. The support member has a facing surface facing the acoustic space, and the height of the facing surface from the bottom of the housing member increases from a side overlapping the component in plan view toward a side opposite the side.

Description

Technical Field

[0001] The present disclosure relates to electronic devices. Background Art

[0002] An electronic device having an audio function includes, for example, an audio component such as a speaker. The audio component is generally housed in an audio space, which is a closed space formed by components constituting the electronic device.

[0003] Patent Document 1 discloses a technique for utilizing a cavity formed inside a hinge member of an electronic device as an acoustic space for accommodating an acoustic component.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application No. 2007-527131 Summary of the invention

[0007] Technical issues to be solved by the invention

[0008] The above-mentioned technologies still have room for improvement in promoting miniaturization of electronic devices and suppressing degradation of acoustic characteristics.

[0009] Therefore, the present disclosure proposes an electronic device that can promote miniaturization of electronic devices and suppress degradation of acoustic characteristics.

[0010] Technical solutions for solving technical problems

[0011] The electronic device disclosed in the present invention comprises a shell member, a supporting member and a component. The shell member has a bottom for arranging the audio component and an opening opposite to the bottom. The supporting member covers the opening of the shell member and forms an audio space for accommodating the audio component in the shell member. The component is arranged on the supporting member and at least partially overlaps with the audio space when viewed from above. The supporting member has an opposing surface opposite to the audio space, and the height of the opposing surface from the bottom of the shell member increases from a side overlapping with the component when viewed from above to a side opposite to the side. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view schematically showing the appearance structure of the front side of the electronic device according to the embodiment.

[0013] Figure 2 It is a perspective view schematically showing the appearance structure of the back side of the electronic device according to the embodiment.

[0014] Figure 3 To schematically illustrate the Figure 1 A diagram of a cross section taken along line III-III is shown.

[0015] Figure 4 It is a top view showing the supporting member of the embodiment.

[0016] Figure 5 This is a perspective view of the support member according to the embodiment as viewed from the acoustic space side.

[0017] Figure 6 To schematically illustrate the Figure 2 A diagram of a cross section taken along line VI-VI is shown.

[0018] Figure 7 It is a perspective view showing the structure of the cover member according to the embodiment.

[0019] Figure 8 It is a perspective view showing the structure of the cover member according to the embodiment.

[0020] Fig. 9 It is a plan view showing the positional relationship between the cover member and the circuit board according to the embodiment.

[0021] Fig.10 It is a diagram showing a connection state between a cover member and a circuit board according to an embodiment.

[0022] Fig.11 To schematically illustrate the Figure 1 A diagram of a cross section taken along line XI-XI is shown.

[0023] 1: electronic device; 6: housing member; 7: supporting member; 7a: opposing surface; 7a1, 7a2: edges; 7b: pedestal portion; 7c: recess; 8: antenna; 9: speaker; 10: buffer member; 61: bottom; 63: opening; S: sound space. DETAILED DESCRIPTION

[0024] The following describes the embodiments of the present disclosure in detail with reference to the accompanying drawings. In addition, in each of the following embodiments, the same reference numerals are given to the same parts to omit repeated descriptions.

[0025] In addition, the present disclosure will be described in the order of the items shown below.

[0026] 1. Implementation Method

[0027] 1-1. Appearance structure of electronic equipment

[0028] 1-2. Structure around the sound hole

[0029] 1-3. Structure around the cover member

[0030] 1-4. Display module peripheral structure

[0031] 2. Effect

[0032] (1. Implementation Method)

[0033] [1-1. Appearance structure of electronic equipment]

[0034] Figure 1 It is a perspective view schematically showing the appearance structure of the front side of the electronic device 1 according to the embodiment. Figure 2 The figure is a perspective view schematically showing the appearance structure of the back side of the electronic device 1 according to the embodiment. The electronic device 1 according to the embodiment is, for example, a portable phone such as a smart phone. In addition, the electronic device 1 according to the embodiment is not limited to a portable phone, but may also be a controller of a portable music device, a tablet terminal, a notebook computer, a VR (virtual reality) terminal, a game console, etc.

[0035] like Figure 1 and Figure 2 As shown, the electronic device 1 includes a housing 2 . The housing 2 is composed of a display panel 21 , a side frame 22 , and a back cover 23 .

[0036] The display panel 21 covers the display module 3 provided inside the electronic device 1, and displays various images by allowing the image displayed on the display module 3 to be transmitted through the display area in the center. That is, the display panel 21 and the display module 3 together form the display unit of the electronic device 1. In addition, a sound hole 4 is provided at the upper end of the display panel 21. The sound hole 4 is connected to the speaker 9 (see FIG. 1 ) provided inside the electronic device 1. Figure 3 ) is connected to the through hole to output the sound emitted by the speaker 9 to the outside.

[0037] The side frame 22 is formed in a rectangular frame shape, for example, and its front opening is covered by the display panel 21, and its back opening is covered by the back cover 23, thereby forming a storage space inside together with the display panel 21 and the back cover 23. Various components including, for example, the display module 3, the speaker 9, and the camera 11 are stored in the storage space inside the side frame 22.

[0038] The back cover 23 is combined with the side frame 22 to define the shape of the back side of the electronic device 1. The back cover 23 is provided with a cover member 5 for protecting the camera 11 provided inside the electronic device 1.

[0039] [1-2. Structure around the sound hole]

[0040] Next, refer to Figure 3~Figure 5 The structure around the sound hole 4 according to the embodiment will be described. Figure 3 To schematically illustrate the Figure 1 The cross section of line III-III is shown in FIG. Figure 3 As shown, the electronic device 1 includes a housing member 6 , a support member 7 , and an antenna 8 .

[0041] The shell member 6 is a roughly rectangular box body, having a bottom 61, a side wall 62 rising from the bottom 61, and an opening 63 opposite to the bottom 61. The side wall 62 is integrally fixed to the inner surface of the side frame 22, so that the shell member 6 is stored in the storage space inside the side frame 22. The speaker 9 is arranged at the bottom 61. A through hole 61a is formed at a position below the speaker 9 of the bottom 61. The through hole 61a is connected to the sound hole 4 via a space enclosed by the adhesive member 6a, and the adhesive member 6a bonds the shell member 6 and the display panel 21. The sound generated by the speaker 9 is output from the sound hole 4 to the outside via the through hole 61a and the space. The speaker 9 is an example of an audio component.

[0042] The support member 7 is a plate-like member for supporting various antennas including the antenna 8 , and covers the opening 63 of the housing member 6 to seal the housing member 6 , thereby forming an acoustic space S for accommodating the speaker 9 in the housing member 6 .

[0043] The antenna 8 is, for example, an NFC (Near Field Communication) antenna, and is disposed on the support member 7. The thickness of the antenna 8 is greater than the thickness of other antennas disposed on the support member 7. In addition, at least a portion of the antenna 8 is located at a position overlapping with the sound space S when viewed from above. That is, the antenna 8 and the sound space S have an overlapping portion when viewed from above. As a result, the space utilization rate for configuring the antenna 8 and the housing member 6 in the thickness direction of the electronic device 1 can be increased, and the miniaturization of the electronic device 1 can be promoted.

[0044] Here, the structure of the support member 7 will be described in more detail. Figure 4 It is a top view showing the support member 7 of the embodiment. Figure 5 It is a perspective view of the support member 7 according to the embodiment as viewed from the acoustic space S side.

[0045] like Figure 3~Figure 5 As shown, the supporting member 7 has an opposing surface 7a that is opposite to the acoustic space S. The opposing surface 7a is roughly rectangular when viewed from above, and has four sides including a side 7a1 that overlaps with the antenna 8 when viewed from above and a side 7a2 on the side opposite to the side 7a1. The height of the opposing surface 7a from the bottom 61 of the shell member 6 increases from the side 7a1 that overlaps with the antenna 8 when viewed from above toward the side 7a2 on the side opposite to the side 7a1. For example, in an embodiment, the opposing surface 7a is a stepped surface in which the height of the surface connected to the side 7a2 from the bottom 61 of the shell member 6 is higher than the height of the surface connected to the side 7a1 from the bottom 61 of the shell member 6.

[0046] That is, in the embodiment, the opposing surface 7a has a shape in which the height of the side 7a2 not overlapping with the antenna 8 from the bottom 61 of the shell member 6 in a plan view is higher than the height of the side 7a1 overlapping with the antenna 8 from the bottom 61 of the shell member 6 in a plan view.

[0047] Assuming that the opposing surface 7a is formed to have a constant height from the bottom 61 of the housing member 6, the opposing surface 7a and the bottom 61 of the housing member 6 will be close to each other by an amount corresponding to the thickness of the antenna 8, so the volume of the sound space S is reduced and the sound characteristics of the speaker 9 are deteriorated. In contrast, in the embodiment, the height of the opposing surface 7a from the bottom 61 of the housing member 6 is increased from the side 7a1 overlapping with the antenna 8 when viewed from above toward the side 7a2 on the side opposite to the side 7a1. As a result, the volume of the sound space S is increased compared to the case where the height of the opposing surface 7a from the bottom 61 of the housing member 6 is constant. Therefore, even in the case where the antenna 8 and the sound space S are located at a position where they overlap when viewed from above, it is possible to promote miniaturization of the electronic device 1 and improve the sound characteristics.

[0048] In addition, the facing surface 7a may be in a shape other than a stepped surface as long as the height of the side 7a2 from the bottom 61 of the housing member 6 becomes higher than the height of the side 7a1 from the bottom 61 of the housing member 6. For example, the facing surface 7a may be a conical surface or a curved surface. Even in the case where the facing surface 7a is a conical surface or a curved surface, the miniaturization of the electronic device 1 can be promoted and the acoustic characteristics can be improved.

[0049] In addition, if Figure 3 and Figure 5 As shown, a rectangular frame-shaped pedestal 7b is formed around the opposing surface 7a. A rectangular frame-shaped buffer member 10 is inserted between the pedestal 7b and the end surface on the side of the opening 63 of the shell member 6. The buffer member 10 is composed of an elastic body such as a resin, and is deformed by the pressure between the end surface of the shell member 6 surrounding the opening 63 and the pedestal 7b, so that the shell member 6 and the supporting member 7 are sealed. That is, the pedestal 7b abuts against the end surface on the side of the opening 63 of the shell member 6 via the buffer member 10. Moreover, the abutting surface where the end surface on the side of the opening 63 of the shell member 6 abuts against the pedestal 7b is inclined in accordance with the height change of the opposing surface 7a. Thus, the airtightness of the sound space S is ensured by the buffer member 10, so that the sound transmitted from the speaker 9 to the sound space S will not leak to the outside of the sound space S, and the sound characteristics of the speaker 9 can be further improved.

[0050] In addition, if Figure 3As shown, the support member 7 has a recessed portion 7c in a region partially overlapping the sound space S when viewed from above on the surface on the side opposite to the facing surface 7a. The antenna 8 is disposed in the recessed portion 7c. Thus, the antenna 8 can be brought closer to the sound space S along the thickness direction of the electronic device 1 by an amount corresponding to the depth of the recessed portion 7c, and the miniaturization of the electronic device 1 can be further promoted.

[0051] [1-3. Structure around the cover member]

[0052] Next, refer to Figure 6~Figure 10 The structure around the cover member 5 according to the embodiment will be described. Figure 6 To schematically illustrate the Figure 2 The cross section of the VI-VI line is shown in FIG. Figure 6 As shown, the cover member 5 is arranged in the through hole 23a formed in the back cover 23 of the frame body 2, and is adhered to the inner wall surface of the back cover 23 via a double-sided tape 23b. In addition, a plurality of ( Figure 6 In the example, there are 3) cameras 11.

[0053] Here, the structure of the cover member 5 will be described in more detail. Figure 7 and Figure 8 2 is a perspective view showing the structure of the cover member 5 according to the embodiment. Figure 7 The structure of the cover member 5 on the side not facing the camera 11 is shown. Figure 8 The structure of the cover member 5 on the side facing the camera 11 is shown.

[0054] like Figure 6~Figure 8 As shown, the cover member 5 includes a main body portion 51 made of metal and covered with an insulating film, and a panel portion 52 made of a transparent material.

[0055] The main body 51 has a plurality of openings 51a at positions corresponding to the plurality of cameras 11. A portion of the corresponding camera 11 is located at each opening 51a. In addition, a flange 51b protruding outward is formed at the lower end of the main body 51, and a double-sided tape 23b is provided on the flange 51b. The double-sided tape 23b adheres the main body 51 to the inner wall surface of the back cover 23.

[0056] The main body 51 has a plurality of (two in this case) protrusions 51c on the flange 51b. The end surface of the protrusion 51c is provided with a metal exposed region 51d without an insulating film. The metal exposed region 51d is formed by laser etching the end surface of the protrusion 51c.

[0057] The main body 51 has a protective sheet 51 e on the flange 51 b. The protective sheet 51 e is made of an insulating material and protects the insulating coating of the main body 51 .

[0058] The panel portion 52 is located on the main body portion 51 so as to cover the plurality of openings 51a. The panel portion 52 is bonded to the main body portion 51 by a double-sided tape 53 having through holes formed at positions corresponding to the plurality of openings 51a.

[0059] However, in the electronic device 1, since the camera 11 is arranged close to the cover member 5, when static electricity is generated outside the electronic device 1, the static electricity may be transmitted from the main body 51 to the camera 11 due to insulation breakdown of the main body 51. When the static electricity is transmitted to the camera 11, the camera 11 may malfunction.

[0060] Therefore, in the embodiment, the cover member 5 is electrically connected to the circuit board provided inside the housing 2 .

[0061] use Fig. 9 and Fig.10 The electrical connection between the cover member 5 and the circuit board provided inside the housing 2 will be described. Fig. 9 It is a plan view showing the positional relationship between the cover member 5 and the circuit board according to the embodiment. Fig.10 It is a figure which shows the connection state of the cover member 5 and the circuit board in embodiment.

[0062] like Fig. 9 As shown, a circuit board 12 on which various electronic components are mounted is arranged inside the housing 2. The circuit board 12 is arranged so as to surround the plurality of cameras 11. The circuit board 12 has a region (hereinafter referred to as an "overlap region") that overlaps with the flange 51b of the cover member 5 when viewed from above, and in the overlapping region, a plurality of contact springs 12a are arranged corresponding to the positions of the plurality of protrusions 51c of the cover member 5. The plurality of contact springs 12a are connected to the ground potential.

[0063] Moreover, if Fig.10 As shown in FIG. 1 , the metal exposed area 51d provided on the end surface of the protrusion 51c of the cover member 5 abuts against the contact spring 12a of the circuit board 12, thereby electrically connecting the cover member 5 to the circuit board 12. As a result, since the cover member 5 is maintained at the same ground potential as the contact spring 12a, static electricity generated outside the electronic device 1 disappears in the cover member 5 and is not transmitted to the camera 11. Therefore, the possibility of a malfunction of the camera 11 due to static electricity can be reduced.

[0064] In addition, if Fig. 9As shown in FIG. 1 , the protective sheet 51e of the cover member 5 is located at a position overlapping with the overlapping region of the circuit substrate 12. Thus, even when the components arranged in the overlapping region of the circuit substrate 12 and the cover member 5 come into contact with each other due to collision such as falling, damage to the insulating film of the cover member 5 (main body 51) is avoided. Therefore, the insulation of the cover member 5 is maintained, and the performance degradation of the electronic components (such as the antenna, etc.) near the cover member 5 can be suppressed.

[0065] [1-4. Display module peripheral structure]

[0066] Next, refer to Fig.11 The structure around the display module 3 according to the embodiment will be described. Fig.11 To schematically illustrate the Figure 1 The cross section of the line XI-XI is shown in FIG. Fig.11 As shown, the display panel 21, the side frame 22 and the back cover 23 (see Figure 1 and Figure 2 ,exist Fig.11 (not shown) A storage space for various components is formed inside the side frame 22.

[0067] In addition, the storage space surrounded by the display panel 21, the side frame 22 and the back cover 23 is divided into a space on the display panel 21 side and a space on the back cover 23 side by a partition wall 22a provided on the side frame 22. The space on the display panel 21 side and the space on the back cover 23 side are connected via a through hole formed in the partition wall 22a. The display module 3 is stored in the space on the display panel 21 side.

[0068] The flexible substrate 13 having flexibility is electrically connected to the display module 3 and is led out to the space on the back cover 23 side through the through hole of the partition wall 22a. That is, the flexible substrate 13 has a planar portion 13a connected to the display module 3. In addition, the flexible substrate 13 has a folded portion 13b extending from the planar portion 13a, inserted into the through hole of the partition wall 22a, and folded back. In addition, the flexible substrate 13 has a planar portion 13c extending from the folded portion 13b and led out to the space on the back cover 23 side. A connector 13d is provided at the end of the planar portion 13c.

[0069] In addition, the other flexible substrate 14 is inserted in the space between the planar portion 13a and the planar portion 13c of the flexible substrate 13 that are opposed to each other. On the other flexible substrate 14, a connector 14b is provided corresponding to the position of the connector 13d of the flexible substrate 13, and the connector 13d of the flexible substrate 13 is connected to the connector 14b. In addition, on the other flexible substrate 14, a signal connector 14a is provided adjacent to the folded portion 13b of the flexible substrate 13, and a plug 15a of a signal cable 15 that transmits a predetermined signal is connected to the signal connector 14a.

[0070] As described above, in the embodiment, the signal connector 14a is provided adjacent to the folded portion 13b on the other flexible substrate 14 inserted into the space between the planar portion 13a and the planar portion 13c of the flexible substrate 13. Thus, the space utilization rate for arranging the signal connector 14a in the thickness direction of the electronic device 1 can be increased, and the miniaturization of the electronic device 1 can be promoted.

[0071] (2. Effect)

[0072] As described above, the electronic device (e.g., electronic device 1) of the embodiment includes a housing member (e.g., housing member 6), a supporting member (e.g., supporting member 7), and a component (e.g., antenna 8). The housing member has a bottom (e.g., bottom 61) on which an audio component (e.g., speaker 9) is arranged, and an opening (e.g., opening 63) opposite to the bottom. The supporting member covers the opening of the housing member and forms an audio space (e.g., audio space S) in the housing member for accommodating the audio component. The component is arranged on the supporting member and at least partially overlaps with the audio space when viewed from above. The supporting member has an opposing surface (e.g., opposing surface 7a) opposite to the audio space, and the height of the opposing surface from the bottom of the housing member increases from one side (e.g., side 7a1) overlapping with the component when viewed from above toward one side (e.g., side 7a2) opposite to the one side. Thus, according to the electronic device of the embodiment, it is possible to promote the miniaturization of the electronic device and suppress the degradation of the acoustic characteristics.

[0073] In addition, the facing surface may be a stepped surface, a tapered surface, or a curved surface. Thus, according to the electronic device of the embodiment, it is possible to promote miniaturization of the electronic device and suppress degradation of acoustic characteristics.

[0074] In addition, the support member may have a seat portion (e.g., seat portion 7b) formed around the opposing surface and abutting against the end surface of the opening side of the housing member via a buffer member (e.g., buffer member 10). The abutting surface where the end surface of the opening side of the housing member abuts against the seat portion may be a conical surface inclined in accordance with the height change of the opposing surface. Thus, according to the electronic device of the embodiment, the acoustic characteristics of the acoustic component can be further improved.

[0075] In addition, the buffer member may be an elastic body that is deformed by being pressed. Thus, according to the electronic device of the embodiment, the housing member and the support member can be sealed appropriately.

[0076] In addition, the support member may have a recess (eg, recess 7c) in a region partially overlapping the acoustic space when viewed from above on the surface opposite to the facing surface. The component may be arranged in the recess. Thus, according to the electronic device of the embodiment, the electronic device can be further miniaturized.

[0077] The embodiments of the present disclosure are described above, but the technical scope of the present disclosure is not limited to the above embodiments as they are, and various changes can be made within the scope of the present disclosure. In addition, the components of different embodiments and modified examples can be appropriately combined.

[0078] In addition, the effects described in this specification are merely illustrative and not limiting, and other effects may also be present.

[0079] In addition, the present technology can also adopt the following structure. (1)

[0081] An electronic device comprising:

[0082] A housing member having a bottom portion for arranging the audio component and an opening opposite to the bottom portion;

[0083] a supporting member that covers the opening of the housing member and forms an acoustic space in the housing member for accommodating the acoustic component; and

[0084] A component is arranged on the supporting member and at least partially overlaps with the acoustic space when viewed from above,

[0085] The supporting member has an opposing surface facing the acoustic space, and the height of the opposing surface from the bottom of the casing member increases from a side overlapping with the component in a plan view toward a side opposite to the side. (2)

[0087] The electronic device according to (1), wherein:

[0088] The opposing surface is a step surface, a conical surface or a curved surface. (3)

[0090] The electronic device according to (1) or (2), wherein:

[0091] The support member has a seat portion formed around the facing surface and in contact with the end surface of the opening side of the case member via a buffer member.

[0092] The contact surface between the end surface of the opening side of the case member and the seat portion is a tapered surface inclined in accordance with the change in height of the facing surface. (4)

[0094] The electronic device according to (3), wherein:

[0095] The buffer member is an elastic body that is deformed by being pressed. (5)

[0097] The electronic device according to any one of (1) to (4), wherein:

[0098] The support member has a recessed portion in a region partially overlapping the acoustic space when viewed from above on a surface on the side opposite to the facing surface.

[0099] The component is disposed in the recessed portion.

Claims

1. An electronic device comprising: A housing member having a bottom portion for arranging the audio component and an opening opposite to the bottom portion; a supporting member covering the opening of the housing member and forming an acoustic space for accommodating the acoustic component in the housing member; as well as A component is arranged on the supporting member and at least partially overlaps with the acoustic space when viewed from above, The supporting member has an opposing surface facing the acoustic space, and the height of the opposing surface from the bottom of the casing member increases from a side overlapping with the component in a plan view toward a side opposite to the side.

2. The electronic device according to claim 1, wherein: The opposing surface is a step surface, a conical surface or a curved surface.

3. The electronic device according to claim 1, wherein: The support member has a seat portion formed around the facing surface and in contact with the end surface of the opening side of the case member via a buffer member. The contact surface between the end surface of the opening side of the case member and the seat portion is a tapered surface inclined in accordance with the change in height of the facing surface.

4. The electronic device according to claim 3, wherein: The buffer member is an elastic body that is deformed by being pressed.

5. The electronic device according to claim 1, wherein: The support member has a recessed portion in a region partially overlapping the acoustic space when viewed from above on a surface on the side opposite to the facing surface. The component is disposed in the recessed portion.

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