Gluing thickness determination method and device, laser processing method and device, storage medium, equipment and system

Abstract

The invention discloses a gluing thickness determination method, a laser processing method and device, a storage medium, equipment and a system. Acquiring a plurality of processing images of the target material subjected to laser processing with a plurality of different gluing thicknesses; pixel features and heat affected regions of the cut lines in each processed image are identified. The cutting line is a linear trace formed by laser processing; the heat affected area is an area for representing the influence of laser processing heat on the periphery of the cutting line. A target image is determined from among a plurality of processed images based on a thermal influence control condition and a gray scale screening condition. And finally, based on the correspondence between the processing image and the gluing thickness, determining the gluing thickness corresponding to the target image as a target gluing thickness matched with the target material. By comparing the processing images of the target material after laser processing under different gluing thicknesses, the gluing thickness for guaranteeing and improving the material processing yield is automatically determined, so that the intelligent level of material gluing and material processing is improved.

Description

Technical Field

[0001] The present application relates to the field of material processing technology, and in particular to a method for determining glue coating thickness, a laser processing method, device, storage medium, equipment and system. Background Art

[0002] In semiconductor manufacturing and material processing scenarios, it is often necessary to coat materials with glue before processing. For example, in the wafer laser processing scenario, the wafer surface needs to be coated with glue before the wafer is processed by laser. Material coating is one of the key processes, and the thickness of the glue coating also has an important impact on the laser processing technology. If the glue is too thick, the glue will absorb more heat, resulting in the inability to remove the metal on the surface of the wafer during laser processing of the wafer, thus failing to achieve the expected processing effect. If the glue is too thin, the glue's ability to absorb heat is insufficient, and the excess heat quickly transfers to the wafer, which is likely to cause damage to the wafer. This shows the impact of the glue coating thickness on the material processing yield.

[0003] In the existing technology, the glue coating thickness is generally controlled according to the glue discharge time. However, as the glue is used, the amount of glue in the glue discharge tube has been greatly reduced, resulting in a slowdown in the flow rate. At this time, the glue coating thickness cannot be accurately controlled based on the glue discharge time alone, so there is still a problem that the processing yield cannot be guaranteed. In order to avoid the change in the glue discharge flow rate when the glue is almost exhausted, which affects the accuracy of controlling the glue coating thickness, the factory generally replaces the new glue in advance before the glue is exhausted. The discarded glue surplus cannot be truly utilized, resulting in a waste of glue. Summary of the invention

[0004] Based on the above problems, the present application provides a method for determining the thickness of the glue coating, a laser processing method, an apparatus, a storage medium, an equipment and a system, the purpose of which is to effectively control the thickness of the glue coating to improve the yield of material processing and improve the utilization rate of glue.

[0005] The embodiments of the present application disclose the following technical solutions:

[0006] The first aspect of the present application provides a method for determining the thickness of a coating. The method comprises:

[0007] Acquire multiple processed images of the target material after laser processing with multiple different coating thicknesses; wherein one processed image corresponds to one coating thickness;

[0008] Identify the pixel features and heat-affected area of ​​the cutting line in each processed image; the cutting line is a linear trace formed by laser processing; the heat-affected area is an area representing the effect of the heat of laser processing on the periphery of the cutting line;

[0009] Determining a target image from the plurality of processed images based on a heat impact control condition and a grayscale screening condition;

[0010] Based on the correspondence between the processed image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as a target glue coating thickness matching the target material.

[0011] In a possible implementation, determining a target image from the plurality of processed images based on the heat impact control condition and the grayscale screening condition includes:

[0012] Determining an image satisfying the heat impact control condition from the plurality of processed images;

[0013] If there are multiple images that meet the heat influence control condition, then determine an image that meets the grayscale screening condition as the target image;

[0014] If there is only one image that meets the heat influence control condition, then this image is used as the target image.

[0015] In a possible implementation, the heat impact control condition is that the distance between the heat impact area and the side edge of the cutting path is greater than or equal to a preset safety distance; the cutting path is a strip area on the target material used to separate multiple target features;

[0016] If there are multiple images that meet the heat influence control condition, then determining an image that meets the grayscale screening condition as a target image, including:

[0017] If there are multiple images that meet the heat influence control condition, an image with the smallest gray value index is determined as the target image.

[0018] In a possible implementation, the method further includes:

[0019] In response to an editing operation of the offset on a laser processing parameter editing interface, a plurality of different sets of offsets of the target material are obtained; wherein a set of offsets corresponds to one laser processing;

[0020] Before laser processing is performed on the target material each time, the target material is controlled to be offset based on a set of offsets corresponding to the laser processing to obtain the multiple processed images, wherein a set of offsets corresponds to one processed image.

[0021] In a possible implementation, the method further includes:

[0022] Before laser processing the target material each time, placing the target material at a glue coating position;

[0023] Reset the laser rangefinder to zero and start applying glue to the target material;

[0024] When the laser rangefinder detects that the coating thickness of the target material reaches the coating thickness edited in the laser processing parameter editing interface, the coating is stopped and the coated target material is moved out of the coating position.

[0025] In a possible implementation, controlling the target material to shift based on a set of shift amounts corresponding to the i-th laser processing includes:

[0026] Transporting the target material after the i-th coating to a processing platform;

[0027] Move the processing stage to under the coarse adjustment camera and the fine adjustment camera in sequence to identify the center position of the cutting line of the (i-1)th laser processing and align the center position with the center of the field of view of the fine adjustment camera;

[0028] The processing stage is controlled to shift according to a set of offsets corresponding to the i-th laser processing; wherein i is an integer greater than 1.

[0029] In a possible implementation, the step of sequentially moving the processing stage under a coarse adjustment camera and a fine adjustment camera to identify the center position of a cutting line processed by the (i-1)th laser process and aligning the center position with the center of the field of view of the fine adjustment camera includes:

[0030] After moving the processing stage to an imaging position corresponding to the coarse-adjustment camera, a cutting line of the i-1th laser processing is identified based on the imaging of the target material by the coarse-adjustment camera, and an offset angle of the cutting line of the i-1th laser processing relative to a reference direction is determined;

[0031] Controlling the processing stage to rotate in the opposite direction by the offset angle so that the cutting line of the (i-1)th laser processing is parallel to the reference direction;

[0032] Identifying the center position of the cutting line of the (i-1)th laser processing based on the re-imaging of the target material by the coarse adjustment camera;

[0033] Controlling the processing stage to move so that the center position reaches the center of the field of view of the coarse adjustment camera;

[0034] According to the relative positions of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera, the processing stage is controlled to move so that the center position reaches the center of the field of view of the fine adjustment camera.

[0035] In a possible implementation, identifying the pixel feature heat-affected area of ​​the cutting line in each processed image includes:

[0036] Identify the area of ​​the cutting line in each processed image;

[0037] Based on the grayscale of each pixel in the area of ​​the cutting line, obtaining the pixel feature of the cutting line;

[0038] Identify a first heat-affected width and a second heat-affected width of the heat-affected zone on both sides of the cutting line perpendicular to its own length direction;

[0039] The method further comprises:

[0040] Determine the width of the cutting line based on the number of pixels in the area of ​​the cutting line that is perpendicular to its own length direction;

[0041] Calculating the sum of the width of the cutting line, the first heat-affected width, and the second heat-affected width;

[0042] If the difference between the width of the cutting road and the sum of the widths is less than twice the preset safety distance, it is determined that the processed image does not meet the heat impact control condition.

[0043] A second aspect of the present application provides a laser processing method, the method comprising: determining a material to be processed and a width of a cutting path of the material to be processed;

[0044] If the material to be processed is a target material, and the width of the cutting path of the material to be processed matches the width of the cutting path of the target material, controlling the coating of glue on the material to be processed according to the target coating thickness based on the mapping relationship;

[0045] Wherein, the mapping relationship is a mapping relationship between the width of the cutting path of the target material and the target glue coating thickness;

[0046] The target glue coating thickness is a target glue coating thickness that matches the target material and is determined based on the glue coating thickness determination method introduced in any implementation of the first aspect;

[0047] After the material to be processed is coated with glue, laser processing is performed.

[0048] The third aspect of the present application provides a device for determining the thickness of a coating, the device comprising:

[0049] An image acquisition module is used to acquire a plurality of processed images of the target material after laser processing with a plurality of different coating thicknesses; wherein one processed image corresponds to one coating thickness;

[0050] An identification module, used to identify pixel features and heat-affected areas of cutting lines in each processed image; the cutting lines are linear traces formed by laser processing; the heat-affected areas are areas representing the effects of heat from laser processing on the periphery of the cutting lines;

[0051] An image determination module, used for determining a target image from the plurality of processed images based on a heat impact control condition and a grayscale screening condition;

[0052] The glue coating thickness determination module is used to determine the glue coating thickness corresponding to the target image as a target glue coating thickness matching the target material based on the correspondence between the processed image and the glue coating thickness.

[0053] A fourth aspect of the present application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method for determining the glue thickness as described in any implementation of the first aspect is implemented.

[0054] A fifth aspect of the present application provides an electronic device for determining glue coating thickness, the electronic device comprising: a processor and a memory;

[0055] The memory stores a computer program;

[0056] The processor is used to read the computer program stored therein and run the computer program, and when the program is run, the method for determining the glue thickness as described in any implementation of the first aspect is executed.

[0057] In a sixth aspect, the present application provides a laser processing system, which includes the electronic device for determining the coating thickness described in the fifth aspect, and also includes a laser processing head, a laser rangefinder and an image acquisition device; the laser processing head, the laser rangefinder and the image acquisition device are all connected to a processor in the electronic device; the image acquisition device includes at least a coarse adjustment camera and a fine adjustment camera;

[0058] The laser rangefinder is used to measure the glue coating thickness on the material and generate a glue coating thickness measurement signal, and send the glue coating thickness measurement signal to the processor;

[0059] The processor is further configured to send a laser processing instruction to the laser processing head when the glue coating thickness measurement signal indicates that the glue coating thickness reaches a set glue coating thickness;

[0060] The laser processing head is used to perform laser processing on the material coated with glue to a set glue coating thickness according to the laser processing instruction, and feed back a signal of completion of the laser processing to the processor;

[0061] The processor is further used to send an image acquisition instruction to the image acquisition device according to the signal that the laser processing is completed;

[0062] The image acquisition device is used to acquire a processed image of the material according to the image acquisition instruction and return the processed image to the processor.

[0063] Compared with the prior art, this application has the following beneficial effects:

[0064] In the technical solution of the present application, first, after the target material is laser processed with a plurality of different glue coating thicknesses, a plurality of processed images of the target material are obtained, and one processed image corresponds to a glue coating thickness. Processed images corresponding to a plurality of different glue coating thicknesses are obtained, so as to facilitate the comparison of the suitable glue coating thickness for the target material when the laser processing is performed from the image level. Next, on the basis of the acquired processed images, the pixel features and heat-affected areas cut in each processed image are identified. The cutting line reflects the actual processing trace, and the grayscale of the cutting line reflects the utilization rate of the laser heating energy efficiency and the suitability of the glue coating thickness. The heat-affected area is an area that characterizes the influence of the heat of the laser processing on the periphery of the cutting line, reflecting the degree of heat absorption of the glue and the influence of the heat generated by the laser processing on the material. Based on the above-mentioned information identified, a target image that meets the heat influence control condition and the grayscale screening condition is screened out from the plurality of processed images. Based on the correspondence between the processed image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as the target glue coating thickness matching the target material. The use of heat impact control conditions can prevent the final target glue coating thickness from being too thin, reducing the negative impact of heat on the material itself. The grayscale of the cutting line reflects the utilization rate of the laser heating energy efficiency and whether the glue coating thickness is appropriate. The use of grayscale screening conditions can match the determined target glue coating thickness with the target material, enable processing at the determined target glue coating thickness, and achieve high utilization of laser heating energy efficiency. This solution automatically determines the glue coating thickness that guarantees and improves the material processing yield by comparing the processing images of the target material after laser processing at different glue coating thicknesses, thereby improving the intelligent level of material gluing and material processing. This solution does not rely on the glue discharge time to control the glue coating, so there is no need to replace new glue in advance due to controlling the glue coating thickness, which improves the utilization rate of the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0066] Figure 1 A flow chart of a method for determining glue coating thickness provided in an embodiment of the present application;

[0067] Figure 2 A schematic diagram of a heat-affected zone provided in an embodiment of the present application;

[0068] Figure 3 A schematic diagram of the relative positions of a heat-affected zone and a cutting path provided in an embodiment of the present application;

[0069] Figure 4 A schematic diagram of a laser processing parameter editing interface provided in an embodiment of the present application;

[0070] Figure 5 A schematic diagram of a processing scenario provided in an embodiment of the present application;

[0071] Figure 6 A flow chart of a laser processing method provided in an embodiment of the present application;

[0072] Figure 7 A schematic diagram of the structure of a device for determining the thickness of a coating provided in an embodiment of the present application;

[0073] Figure 8 A schematic diagram of the structure of a laser processing system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0074] The appropriateness of the glue coating thickness determines the yield of material processing. If the glue coating is too thin, the heat of laser processing will diffuse to other parts of the material, which may cause unnecessary damage to the material. If the glue coating is too thick, the expected processing effect may not be achieved. During the current laser processing, the method of controlling the glue coating thickness by controlling the glue discharge time is prone to improper control due to uneven glue discharge flow rate. How to effectively control the glue coating thickness and improve the material processing yield is a technical problem that needs to be solved urgently.

[0075] In view of the above problems, the inventors have proposed a method for determining the coating thickness, a laser processing method, a device, a storage medium, a device and a laser processing system after research. This solution automatically determines the coating thickness that guarantees and improves the material processing yield by comparing the processing images of the target material after laser processing under different coating thicknesses, thereby improving the intelligent level of material coating and material processing. This solution does not rely on the glue discharge time to control the coating, so there is no need to replace new glue in advance to control the coating thickness, and accordingly, the utilization rate of the glue is also improved.

[0076] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0077] See also Figure 1, which is a flow chart of a method for determining the coating thickness provided in an embodiment of the present application. Figure 1 As shown, the method for determining the glue coating thickness includes:

[0078] S101, obtaining a plurality of processed images of a target material after being laser processed with a plurality of different adhesive coating thicknesses.

[0079] The target material described in this application can be any product that needs to be processed by laser. For the sake of clarity, the target material is used to refer to the product. The specific type of the target material is not limited in this application. In an example, the target material can be a wafer that needs to be laser cut.

[0080] Laser cutting is a cutting process that uses laser technology. It has been widely used in many fields such as semiconductor manufacturing, metal material processing, automobile manufacturing, fitness equipment production, shipbuilding and engineering machinery due to its high precision, high efficiency and non-contact processing characteristics.

[0081] In the scenario of laser surface cutting of wafers, the purpose of laser surface cutting is to remove part of the metal covering the surface of the material. In this process, the energy density of the laser beam is high enough to quickly make the metal on the surface of the material reach the melting point or boiling point.

[0082] In order to determine the appropriate matching glue coating thickness of the target material, in this step, the present application first needs to obtain multiple processed images of the target material after laser processing with a variety of different glue coating thicknesses. Specifically, a processing image can be collected for each glue coating thickness. In this way, the multiple processed images obtained correspond to a variety of different glue coating thicknesses. When the processed images are subsequently analyzed, it is only necessary to determine the processed image with a better processing effect to determine a suitable glue coating thickness.

[0083] For example, the target material is processed after coating with 5 μm thickness to obtain the first processed image; the target material is processed after coating with 10 μm thickness to obtain the second processed image; and the target material is processed after coating with 15 μm thickness to obtain the third processed image. In this way, three processed images corresponding to different coating thicknesses are obtained.

[0084] In one embodiment, each further application of glue can be a cumulative thickness based on the previous application of glue. For example, after applying 5μm of glue for the first time, in order to achieve a thickness of 10μm, only 5μm needs to be applied for the second time; similarly, in order to achieve a thickness of 15μm for the third time, only 5μm needs to be further applied. Each processing is not repeated at the same position. In one example, the first laser processing, the second laser processing and the third laser processing form three parallel cutting lines. The cutting lines mentioned here are linear traces formed by laser processing.

[0085] S102: Identify pixel features and heat-affected areas of cutting lines in each processed image.

[0086] In the embodiment of the present application, each processed image contains at least a tangent line formed after the current processing. In this step, it is necessary to identify the features of the cutting line formed by the current processing in each processed image. Specifically, when identifying the features of the cutting line, it can be specifically to identify the grayscale features of the cutting line. The grayscale feature is a dominant feature that is relatively easy to capture for an image.

[0087] In addition, in the embodiment of the present application, it is also necessary to identify the heat-affected area formed after the current processing in each processing image. In the embodiment of the present application, the heat-affected area is an area that represents the effect of the heat of the laser processing on the periphery of the cutting line. Figure 2 A schematic diagram of a heat affected area provided in an embodiment of the present application. Figure 2 The figure shows the situation after laser processing of the material. The area between the two red lines represents the cutting line, and the distance between the two red lines is the line width of the cutting line. Figure 2 As shown in the figure, the area between the two green lines and the adjacent red line is the heat affected area. Figure 2 A total of two parts of the heat affected zone are shown, one between the red and green lines on the left, and the other between the red and green lines on the right.

[0088] S103: Determine a target image from the plurality of processed images based on the heat impact control condition and the grayscale screening condition.

[0089] Based on S102, the pixel features of the cutting lines and the heat-affected areas in each processed image are identified. Furthermore, the embodiment of the present application needs to determine an image with the best processing effect as the target image by combining the pixel features of the cutting lines and the heat-affected areas. The processing effect can be analyzed and compared by comparing the pixel features of the cutting lines and the heat-affected areas.

[0090] The heat-affected zone is a region where the heat from the laser processing affects the periphery of the cutting line, reflecting the degree of heat absorption by the glue and the effect of the heat generated by the laser processing on the material.

[0091] In the embodiment of the present application, the heat effect control condition is pre-set. The original intention of setting the heat effect control condition is to screen the appropriate glue coating thickness from the dimension of heat effect, and to screen out the glue coating thickness parameters that cause greater heat effect due to too thin glue coating thickness. That is, the purpose of screening the heat effect control condition is to make the heat effect caused by the selected glue coating thickness within a controllable range. In an example implementation, the heat effect control condition can be set as follows: the distance between the heat affected area and the side edge of the cutting path is greater than or equal to a preset safety distance. The cutting path is a strip area on the target material used to separate multiple target features. In one example, if the target material is a wafer, the target feature may specifically be a grain.

[0092] If the distance between the heat-affected zone and the side edge of the cutting path is greater than or equal to the preset safety distance, it means that the thickness of the glue coating has a better control effect on the heat effect during laser processing. If the distance between the heat-affected zone and the side edge of the cutting path is less than the preset safety distance, the heat generated by the laser processing may damage the grains on the surface of the wafer, resulting in damage to the product.

[0093] To facilitate understanding of the heat impact control conditions, the following Figure 3 Provide explanation. Figure 3 A schematic diagram of the relative position of a heat-affected zone and a cutting path provided in an embodiment of the present application. Figure 3 The figure shows cutting lane 01 and cutting lane 02. Figure 3 The middle is vertical, and cutting path 02 is Figure 3 The middle is horizontal, and the two intersect to form a cross-like effect. By applying glue to the target material and processing along the cutting path 02, a Figure 3 The cutting line shown at 021 in the figure, and the laser heat diffuses in the vertical direction to form a Figure 3 The heat affected zone shown at 022 and 023.

[0094] Figure 3 In the figure, the two orange straight lines represent the side edges of the cutting path 02 along the horizontal direction. The distance between the heat-affected area 022 and the side edge adjacent to the cutting path 02 is represented as d1, and the distance between the heat-affected area 023 and the side edge adjacent to the cutting path 02 is represented as d2. When analyzing whether multiple processed images meet the heat impact control condition, it can be specifically analyzed whether the distance d1 is greater than or equal to the preset safety distance, and whether the distance d2 is greater than or equal to the preset safety distance. If both d1 and d2 are greater than or equal to the preset safety distance, it is considered that the processed image meets the heat impact control condition.

[0095] Combination Figure 3In an optional implementation, identifying the heat affected area of ​​the pixel features of the cutting line in each processed image includes: identifying the area of ​​the cutting line in each processed image; obtaining the pixel features of the cutting line based on the grayscale of each pixel in the area of ​​the cutting line; identifying the first heat affected width and the second heat affected width of the heat affected area on both sides of the cutting line perpendicular to its own length direction. Here, the first heat affected width can be regarded as Figure 3 The width of the middle heat affected zone 022 is equal to d1; the second heat affected width can be regarded as Figure 3 The width of the medium heat affected zone 023 is equal to d2.

[0096] The method further comprises:

[0097] The width of the cutting line is determined based on the number of pixels in the area of ​​the cutting line that are perpendicular to its own length direction. The width of the cutting line, such as Figure 3 is the distance between the two red lines. Calculate the sum of the width of the cutting line, the first heat-affected width, and the second heat-affected width; if the width of the cutting line ( Figure 3 If the difference between the distance between the two orange-yellow lines and the sum of the widths is less than twice the preset safety distance, it is determined that the processed image does not meet the heat impact control condition. At this time, at least one heat-affected area (022 or 023) fails to meet the heat impact control condition. As an example, the preset safety distance is 10 μm.

[0098] An example implementation of step S103 is described below.

[0099] First, images satisfying the heat influence control condition are determined from the plurality of processed images, and images not satisfying the heat influence control condition are screened out. Next, the number of images satisfying the heat influence control condition is analyzed.

[0100] (1) If there are multiple images that satisfy the heat influence control condition, an image that satisfies the grayscale screening condition is determined as the target image.

[0101] In this case, the grayscale features of the cutting lines are further combined for screening for multiple processing images. The cutting lines reflect the actual processing traces, and the grayscale of the cutting lines reflects the utilization rate of the laser heating energy efficiency and the suitability of the glue coating thickness. The lower the grayscale value, the thinner the glue coating thickness, but the higher the utilization rate of the laser heating energy efficiency, and the surface cutting is cleaner for removing metal impurities. Under the same laser power, it is necessary to find the most suitable glue coating thickness to achieve laser processing. For this reason, it is relatively easy to screen images by grayscale.

[0102] In practical applications, the grayscale of the cutting line can be represented by a grayscale value index. For example, the grayscale value index can be the grayscale mean of each pixel within the range where the cutting line is located. In another example, the grayscale value index can also be the grayscale weighted average of the remaining pixels in the range where the cutting line is located after filtering out a portion of pixels with a relatively small grayscale value. In short, the grayscale value index can represent the overall grayscale (or can be understood as the overall brightness) of the cutting line in the processed image.

[0103] In the embodiment of the present application, if there are multiple images that meet the heat impact control conditions, an image with the smallest gray value index is determined as the target image.

[0104] (2) If there is only one image that satisfies the heat influence control condition, then this image is used as the target image.

[0105] In this case, it can be assumed that there is only one image that meets the heat effect control conditions and its glue coating thickness is the most ideal for heat effect control among multiple processed images.

[0106] S104: Based on the correspondence between the processed image and the glue coating thickness, determine the glue coating thickness corresponding to the target image as a target glue coating thickness matching the target material.

[0107] After the target image is determined, since the processed image and the glue coating thickness are one-to-one corresponding, the glue coating thickness corresponding to the target image can be further known. Since the selected target image shows a good laser processing effect, its corresponding glue coating thickness can be regarded as the target glue coating thickness matching the target material. For example, if among the first processed image (glue coating thickness 5μm), the second processed image (glue coating thickness 10μm) and the third processed image (glue coating thickness 15μm), the second processed image is selected as the target image in S103, then the glue coating thickness 10μm corresponding to the processed image can be determined as the target glue coating thickness matching the target material.

[0108] In the technical solution of the present application, first, a plurality of processed images of the target material are obtained, and the plurality of processed images are obtained by laser processing the target material with a plurality of different glue coating thicknesses, and one processed image corresponds to one glue coating thickness. Processed images corresponding to a plurality of different glue coating thicknesses are obtained, so as to facilitate the comparison of the suitable glue coating thickness for the target material when laser processing is performed from the image level. Next, on the basis of the acquired processed images, the cut pixel features and heat-affected areas in each processed image are identified. The cutting line reflects the actual processing traces, and the grayscale of the cutting line reflects the utilization rate of the laser heating energy efficiency and the suitability of the glue coating thickness. The heat-affected area is an area that characterizes the influence of the heat of the laser processing on the periphery of the cutting line, reflecting the degree of heat absorption by the glue and the influence of the heat generated by the laser processing on the material.

[0109] Based on the above identified information, a target image that meets the heat effect control condition and the grayscale screening condition is screened out from multiple processed images. Based on the correspondence between the processed image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as the target glue coating thickness that matches the target material. The use of heat effect control conditions can avoid the final target glue coating thickness being too thin and reduce the negative impact of heat on the material itself. The grayscale of the cutting line reflects the utilization rate of the laser heating energy efficiency and the suitability of the glue coating thickness. The use of grayscale screening conditions can match the determined target glue coating thickness with the target material, enable processing at the determined target glue coating thickness, and achieve high utilization of laser heating energy efficiency.

[0110] In general, this solution automatically determines the glue coating thickness that guarantees and improves the material processing yield by comparing the processing images of the target material after laser processing at different glue coating thicknesses, thereby improving the intelligent level of material coating and material processing. This solution does not rely on the glue discharge time to control the glue coating, so there is no need to replace new glue in advance to control the glue coating thickness, which improves the utilization rate of glue.

[0111] Figure 4 A schematic diagram of a laser processing parameter editing interface provided in an embodiment of the present application. Figure 4 In the embodiment of the present application, the staff responsible for participating in the laser processing can edit the corresponding parameters (such as cutting frequency, cutting power, cutting speed, etc.) in the laser processing parameter editing interface, and then complete multiple laser processing processes according to the set parameters. In addition, the laser processing parameter editing interface serves as a host computer display interface, which can read the coordinates of the position of the equipment (such as cutting position, light output position, etc.) and display them on the interface.

[0112] like Figure 4As shown in the figure, multiple groups of offsets can be set on the laser processing parameter editing interface. The Y direction is perpendicular to the cutting line, the X direction is the extension direction of the cutting line, and the Z direction is perpendicular to the processing platform. The target material is placed on the processing platform for laser processing. Figure 4 The figure shows 7 groups of offsets, and the offsets in the Y direction (abbreviated as: Y offset) are 10μm, 20μm, 30μm, and 70μm, respectively. This means that each time a different glue coating thickness is used for laser processing, the target material on the processing stage needs to be controlled to offset in the Y direction. Therefore, each laser processing will not process the same cutting path.

[0113] The processing scene includes: a laser processing head, a coarse adjustment camera, a fine adjustment camera, a laser rangefinder, a processing stage and electronic equipment. The electronic equipment includes a processor, and the laser processing head, the coarse adjustment camera, the fine adjustment camera, the laser rangefinder and the processing stage are directly or indirectly connected to the processor. Figure 5 A schematic diagram of a processing scenario provided in an embodiment of the present application. Figure 5 The relative positions of the various components are only shown in the plane, and the connecting wires, the above-mentioned electronic devices and the laser rangefinder are not shown. In this scene, the positions of the laser processing head 51, the coarse adjustment camera 52 and the fine adjustment camera 53 are fixed, and the processing stage 54 can move in the XY plane. For example, the processing stage 54 can be moved to the light output position of the laser processing head 51, can be moved below the coarse adjustment camera 52, and can be moved below the fine adjustment camera 53. In addition, the processing stage 54 can also transport the target material to the gluing position to facilitate multiple gluing of the target material.

[0114] Before laser processing the target material each time, the target material needs to be placed in the glue coating position. The laser rangefinder is cleared and glue coating of the target material begins. When the laser rangefinder detects that the glue coating thickness of the target material reaches the glue coating thickness edited in the laser processing parameter editing interface, glue coating is stopped and the glued target material is moved out of the glue coating position.

[0115] In specific implementation, the laser processing parameter editing interface can be used to edit the glue coating thickness once for each laser processing. It can also be used to set a fixed glue coating thickness increment value, and increase the glue coating amount according to the glue coating thickness increment value before each laser processing until the thickness reaches the thickness after the increment. For example, setting the glue coating thickness increment value to 5μm means that the glue coating thickness is increased by 5μm each time.

[0116] Combination Figure 4 and Figure 5 In addition to S101 to S104 described in the above embodiment, the method for determining the coating thickness provided in the embodiment of the present application further includes:

[0117] In response to the editing operation of the offset on the laser processing parameter editing interface, a plurality of different groups of offsets of the target material are obtained, wherein one group of offsets corresponds to one laser processing.

[0118] Before laser processing the target material each time, the target material is controlled to be offset based on a set of offsets corresponding to the laser processing to obtain the multiple processed images, wherein a set of offsets corresponds to one processed image.

[0119] The following describes the process of offset control by taking a laser processing as an example. For example, a set of offsets corresponding to the i-th laser processing (i is an integer greater than 1, such as i=3) controls the target material to be offset, including:

[0120] (1) The target material after the i-th coating is transported to a processing platform.

[0121] (2) The processing stage is moved successively to under the coarse adjustment camera and the fine adjustment camera to identify the center position of the cutting line of the (i-1)th laser processing and align the center position with the center of the field of view of the fine adjustment camera.

[0122] Among them, step (2) moves the processing stage to under the coarse adjustment camera and the fine adjustment camera in sequence to identify the center position of the cutting line of the (i-1)th laser processing and align the center position with the center of the field of view of the fine adjustment camera, which may specifically include:

[0123] After moving the processing stage to the imaging position corresponding to the coarse adjustment camera, the cutting line of the i-1th laser processing is identified based on the imaging of the target material on the coarse adjustment camera, and the offset angle of the cutting line of the i-1th laser processing relative to the reference direction is determined. The reference direction can be understood as the horizontal direction, or as the direction of the X-axis. First, move the processing stage under the coarse adjustment camera to preliminarily determine the position of the cutting line and the specific offset angle. The field of view of the coarse adjustment camera is larger than that of the fine adjustment camera.

[0124] The processing stage is controlled to rotate in the opposite direction of the offset angle. The purpose of determining the offset angle and rotating in the opposite direction is to make the cutting line of the i-1th laser processing parallel to the reference direction. When the cutting line is parallel to the reference direction, it means that the cutting line is parallel to the X-axis, and general processing requires laser processing along the X-direction. Adjusting the cutting line to be parallel to the X-axis facilitates offset adjustment and observation calibration for each laser processing.

[0125] Based on the re-imaging of the target material by the coarse adjustment camera, the center position of the cutting line of the i-1th laser processing is identified. The center position of the cutting line can be calculated by a visual algorithm. The center position of the cutting line facilitates the search and identification of features and facilitates position adjustment.

[0126] The processing stage is controlled to move so that the center position reaches the center of the field of view of the coarse adjustment camera. Each time the center position of the cutting line is controlled to reach the center of the camera field of view, it is convenient to find the cutting line of the previous laser processing and to facilitate the offset this time.

[0127] Next, according to the relative position of the field of view center of the coarse adjustment camera and the field of view center of the fine adjustment camera, the processing stage is controlled to move so that the center position reaches the field of view center of the fine adjustment camera. The relative position of the field of view center of the coarse adjustment camera and the field of view center of the fine adjustment camera can be determined according to the relative position of the rotation centers calibrated by the two cameras.

[0128] (3) Controlling the processing stage to shift according to a set of offsets corresponding to the i-th laser processing.

[0129] After the processing stage is offset according to the offset amount of the current time, laser processing is performed to form the i-th cutting line. Then the target material after the i-th cutting is moved back under the fine-tuning camera, and the i-th processing image can be collected.

[0130] After executing the method for determining the glue coating thickness described in the above embodiment, the target glue coating thickness that matches the target material has been determined. Then, when the same target material needs to be laser processed, the glue coating and processing can be performed based on the target glue coating thickness. For convenience, a corresponding relationship between the target material and the target glue coating thickness can be established. For example, each material has a corresponding model or identification number, and the target glue coating thickness is represented by a numerical value. After determining the target glue coating thickness that matches the target material, a mapping relationship between the model or identification number of the target material and the target glue coating thickness can be established. This mapping relationship can be stored in the form of a mapping table for easy query.

[0131] In addition, a mapping relationship between the width of the material cutting path and the target glue coating thickness can also be established. For the same material, if its cutting path width is consistent with the cutting path width of the target material with which the mapping relationship was established earlier, it means that the determined target glue coating thickness can be used.

[0132] Based on the method for determining the glue coating thickness introduced in the above-mentioned embodiment, the present application also provides a laser processing method accordingly. Figure 6 A flow chart of a laser processing method provided in an embodiment of the present application. Figure 6 As shown, the laser processing method includes:

[0133] S601, determining a material to be processed and a width of a cutting path of the material to be processed.

[0134] S602: If the material to be processed is a target material, and the width of the cutting path of the material to be processed matches the width of the cutting path of the target material, control the coating of glue on the material to be processed according to the target coating thickness based on the mapping relationship.

[0135] The mapping relationship is a mapping relationship between the width of the cutting path of the target material and the target glue coating thickness. For example, the target glue coating thickness corresponding to the cutting path width D1 of the target material is pre-established as X1. If the material to be processed is also the target material and its cutting path width is also D1, then based on the mapping relationship, it is determined that the glue coating thickness of the material to be processed should reach X1.

[0136] S603, after the material to be processed is coated with glue, laser processing is performed.

[0137] In the technical solution of this application, a mapping relationship is established in the early stage, and it can be conveniently called when the material needs to be processed later. The convenience and accuracy of laser processing glue coating are improved, and efficient and accurate glue coating control is realized.

[0138] Based on the aforementioned method embodiments, the present application also provides a device for determining glue coating thickness. Figure 7 The schematic diagram of the structure of the device for determining the glue coating thickness is shown in FIG. Figure 7 As shown, the device for determining the glue coating thickness comprises:

[0139] The image acquisition module 701 is used to acquire a plurality of processed images of the target material after laser processing with a plurality of different coating thicknesses; wherein one processed image corresponds to one coating thickness;

[0140] The identification module 702 is used to identify the pixel features and heat-affected area of ​​the cutting line in each processing image; the cutting line is a linear trace formed by laser processing; the heat-affected area is an area representing the effect of the heat of the laser processing on the periphery of the cutting line;

[0141] An image determination module 703, configured to determine a target image from the plurality of processed images based on a heat impact control condition and a grayscale screening condition;

[0142] The glue coating thickness determination module 704 is used to determine the glue coating thickness corresponding to the target image as a target glue coating thickness matching the target material based on the correspondence between the processed image and the glue coating thickness.

[0143] Optionally, the image determination module 703 is specifically configured to:

[0144] Determining an image satisfying the heat impact control condition from the plurality of processed images;

[0145] If there are multiple images that meet the heat influence control condition, then determine an image that meets the grayscale screening condition as the target image;

[0146] If there is only one image that meets the heat influence control condition, then this image is used as the target image.

[0147] Optionally, the heat impact control condition is that the distance between the heat impact area and the side edge of the cutting path is greater than or equal to a preset safety distance; the cutting path is a strip area on the target material used to separate multiple target features;

[0148] If there are multiple images that meet the heat impact control condition, the image determination module is used to determine an image with the smallest gray value index as the target image.

[0149] Optionally, the device for determining the coating thickness further comprises:

[0150] An offset acquisition module, used for acquiring a plurality of different offsets of the target material in response to an editing operation of the offset on a laser processing parameter editing interface; wherein a set of offsets corresponds to one laser processing;

[0151] The offset control module is used to control the offset of the target material based on a set of offsets corresponding to the laser processing each time before the target material is laser processed, so as to obtain the multiple processed images, wherein a set of offsets corresponds to one processed image.

[0152] Optionally, the device for determining the coating thickness further comprises:

[0153] A material placement module, used for placing the target material at a glue coating position before laser processing the target material each time;

[0154] A glue coating control module, used for clearing the laser rangefinder and starting to coat the target material with glue;

[0155] The material placement module is also used to stop gluing and move the glued target material out of the glue coating position when the laser rangefinder detects that the glue coating thickness of the target material reaches the glue coating thickness edited in the laser processing parameter editing interface.

[0156] Optionally, the offset control module is specifically used for:

[0157] Transporting the target material after the i-th coating to a processing platform;

[0158] Move the processing stage to under the coarse adjustment camera and the fine adjustment camera in sequence to identify the center position of the cutting line of the (i-1)th laser processing and align the center position with the center of the field of view of the fine adjustment camera;

[0159] The processing stage is controlled to shift according to a set of offsets corresponding to the i-th laser processing; wherein i is an integer greater than 1.

[0160] Optionally, the offset control module is specifically configured to:

[0161] After moving the processing stage to an imaging position corresponding to the coarse-adjustment camera, a cutting line of the i-1th laser processing is identified based on the imaging of the target material by the coarse-adjustment camera, and an offset angle of the cutting line of the i-1th laser processing relative to a reference direction is determined;

[0162] Controlling the processing stage to rotate in the opposite direction by the offset angle so that the cutting line of the (i-1)th laser processing is parallel to the reference direction;

[0163] Identifying the center position of the cutting line of the (i-1)th laser processing based on the re-imaging of the target material by the coarse adjustment camera;

[0164] Controlling the processing stage to move so that the center position reaches the center of the field of view of the coarse adjustment camera;

[0165] According to the relative positions of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera, the processing stage is controlled to move so that the center position reaches the center of the field of view of the fine adjustment camera.

[0166] Optionally, the identification module 702 is specifically configured to:

[0167] Identify the area of ​​the cutting line in each processed image;

[0168] Based on the grayscale of each pixel in the area of ​​the cutting line, obtaining the pixel feature of the cutting line;

[0169] Identify a first heat-affected width and a second heat-affected width of the heat-affected zone on both sides of the cutting line perpendicular to its own length direction;

[0170] The glue coating thickness determining device also includes:

[0171] A width determination module, used to determine the width of the cutting line based on the number of pixels in the area of ​​the cutting line that is perpendicular to its own length direction;

[0172] A width calculation module, used for calculating the sum of the width of the cutting line, the first heat-affected width and the second heat-affected width;

[0173] A judgment module is used to determine that the processed image does not meet the heat impact control condition if the difference between the width of the cutting road and the sum of the widths is less than twice the preset safety distance.

[0174] Based on the method for determining the glue thickness described in the aforementioned method embodiment, the present application further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method for determining the glue thickness described in the aforementioned method embodiment is implemented.

[0175] Based on the method for determining the glue coating thickness described in the foregoing method embodiment, the present application further provides an electronic device for determining the glue coating thickness, the electronic device comprising: a processor and a memory;

[0176] The memory stores a computer program;

[0177] The processor is used to read the computer program stored therein and run the computer program, and when the program is run, the method for determining the glue thickness as described in the above method embodiment is executed.

[0178] Furthermore, the present application also provides a laser processing system, Figure 8 An example structure of this system is shown. Figure 8 You can see the connection relationship between each device.

[0179] The laser processing system includes an electronic device 81 for determining the thickness of the glue coating, and also includes a laser processing head 82, a laser rangefinder 83 and an image acquisition device; the laser processing head 82, the laser rangefinder 83 and the image acquisition device are all connected to the processor in the electronic device 81; the image acquisition device includes at least a coarse adjustment camera 84 and a fine adjustment camera 85;

[0180] The laser rangefinder is used to measure the glue coating thickness on the material and generate a glue coating thickness measurement signal, and send the glue coating thickness measurement signal to the processor;

[0181] The processor is further configured to send a laser processing instruction to the laser processing head when the glue coating thickness measurement signal indicates that the glue coating thickness reaches a set glue coating thickness;

[0182] The laser processing head is used to perform laser processing on the material coated with glue to a set glue coating thickness according to the laser processing instruction, and feed back a signal of completion of the laser processing to the processor;

[0183] The processor is further used to send an image acquisition instruction to the image acquisition device according to the signal that the laser processing is completed;

[0184] The image acquisition device is used to acquire a processed image of the material according to the image acquisition instruction and return the processed image to the processor.

[0185] It should be noted that each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device, equipment and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. The device, equipment and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components indicated as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0186] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for determining the thickness of a coating, characterized in that: include: Acquire multiple processed images of the target material after laser processing with multiple different coating thicknesses; wherein one processed image corresponds to one coating thickness; Identify the pixel features and heat-affected zone of the cutting line in each processed image; the cutting line is a linear trace formed by laser processing; the heat-affected zone is a zone representing the effect of the heat of laser processing on the periphery of the cutting line; Determining a target image from the plurality of processed images based on a heat impact control condition and a grayscale screening condition; Based on the correspondence between the processed image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as a target glue coating thickness matching the target material.

2. The method according to claim 1, characterized in that The step of determining a target image from the plurality of processed images based on the heat impact control condition and the grayscale screening condition comprises: Determining an image satisfying the heat impact control condition from the plurality of processed images; If there are multiple images that meet the heat influence control condition, then determine an image that meets the grayscale screening condition as the target image; If there is only one image that meets the heat influence control condition, then this image is used as the target image.

3. The method according to claim 2, characterized in that The heat impact control condition is that the distance between the heat impact area and the side edge of the cutting path is greater than or equal to a preset safety distance; the cutting path is a strip area on the target material used to separate multiple target features; If there are multiple images that meet the heat influence control condition, then determining an image that meets the grayscale screening condition as a target image, including: If there are multiple images that meet the heat influence control condition, an image with the smallest gray value index is determined as the target image.

4. The method according to claim 1, characterized in that: Also includes: In response to an editing operation of the offset on a laser processing parameter editing interface, a plurality of different sets of offsets of the target material are obtained; wherein a set of offsets corresponds to one laser processing; Before laser processing is performed on the target material each time, the target material is controlled to be offset based on a set of offsets corresponding to the laser processing to obtain the multiple processed images, wherein a set of offsets corresponds to one processed image.

5. The method according to claim 4, characterized in that Also includes: Before laser processing the target material each time, placing the target material at a glue coating position; Reset the laser rangefinder to zero and start applying glue to the target material; When the laser rangefinder detects that the coating thickness of the target material reaches the coating thickness edited in the laser processing parameter editing interface, the coating is stopped and the coated target material is moved out of the coating position.

6. The method according to claim 4, characterized in that Controlling the target material to shift based on a set of shift amounts corresponding to the i-th laser processing includes: Transporting the target material after the i-th coating to a processing platform; Move the processing stage to under the coarse adjustment camera and the fine adjustment camera in sequence to identify the center position of the cutting line of the (i-1)th laser processing and align the center position with the center of the field of view of the fine adjustment camera; The processing stage is controlled to shift according to a set of offsets corresponding to the i-th laser processing; wherein i is an integer greater than 1.

7. The method according to claim 6, characterized in that The step of sequentially moving the processing stage to under the coarse adjustment camera and the fine adjustment camera to identify the center position of the cutting line of the (i-1)th laser processing and aligning the center position with the center of the field of view of the fine adjustment camera comprises: After moving the processing stage to an imaging position corresponding to the coarse-adjustment camera, a cutting line of the i-1th laser processing is identified based on the imaging of the target material by the coarse-adjustment camera, and an offset angle of the cutting line of the i-1th laser processing relative to a reference direction is determined; Controlling the processing stage to rotate in the opposite direction by the offset angle so that the cutting line of the (i-1)th laser processing is parallel to the reference direction; Identifying the center position of the cutting line of the (i-1)th laser processing based on the re-imaging of the target material by the coarse adjustment camera; Controlling the processing stage to move so that the center position reaches the center of the field of view of the coarse adjustment camera; According to the relative positions of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera, the processing stage is controlled to move so that the center position reaches the center of the field of view of the fine adjustment camera.

8. The method according to claim 3, characterized in that Identify the pixel features of the cutting line in each processed image. Heat-affected area, including: Identify the area of ​​the cutting line in each processed image; Based on the grayscale of each pixel in the area of ​​the cutting line, obtaining the pixel feature of the cutting line; Identify a first heat-affected width and a second heat-affected width of the heat-affected zone on both sides of the cutting line perpendicular to its own length direction; The method further comprises: Determine the width of the cutting line based on the number of pixels in the area of ​​the cutting line that is perpendicular to its own length direction; Calculating the sum of the width of the cutting line, the first heat-affected width, and the second heat-affected width; If the difference between the width of the cutting road and the sum of the widths is less than twice the preset safety distance, it is determined that the processed image does not meet the heat impact control condition.

9. A laser processing method, characterized in that: include: Determining the material to be processed and the width of the cutting path of the material to be processed; If the material to be processed is a target material, and the width of the cutting path of the material to be processed matches the width of the cutting path of the target material, controlling the coating of glue on the material to be processed according to the target coating thickness based on the mapping relationship; Wherein, the mapping relationship is a mapping relationship between the width of the cutting path of the target material and the target glue coating thickness; The target glue coating thickness is a target glue coating thickness matched with the target material determined based on the glue coating thickness determination method according to any one of claims 1 to 8; After the material to be processed is coated with glue, laser processing is performed.

10. A device for determining the thickness of a coating, characterized in that: include: An image acquisition module is used to acquire a plurality of processed images of the target material after laser processing with a plurality of different coating thicknesses; wherein one processed image corresponds to one coating thickness; An identification module, used to identify pixel features and heat-affected areas of cutting lines in each processed image; the cutting lines are linear traces formed by laser processing; the heat-affected areas are areas representing the effects of heat from laser processing on the periphery of the cutting lines; An image determination module, used for determining a target image from the plurality of processed images based on a heat impact control condition and a grayscale screening condition; The glue coating thickness determination module is used to determine the glue coating thickness corresponding to the target image as a target glue coating thickness matching the target material based on the correspondence between the processed image and the glue coating thickness.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for determining the glue thickness according to any one of claims 1 to 8 is implemented.

12. An electronic device for determining the thickness of glue coating, characterized in that: The electronic device comprises: a processor and a memory; The memory stores a computer program; The processor is used to read the computer program stored therein and run the computer program, and when the program is run, the method for determining the glue thickness according to any one of claims 1 to 8 is executed.

13. A laser processing system, characterized in that: The electronic device for determining the coating thickness according to claim 12 further comprises a laser processing head, a laser rangefinder and an image acquisition device; the laser processing head, the laser rangefinder and the image acquisition device are all connected to a processor in the electronic device; the image acquisition device comprises at least a coarse adjustment camera and a fine adjustment camera; The laser rangefinder is used to measure the glue coating thickness on the material and generate a glue coating thickness measurement signal, and send the glue coating thickness measurement signal to the processor; The processor is further configured to send a laser processing instruction to the laser processing head when the glue coating thickness measurement signal indicates that the glue coating thickness reaches a set glue coating thickness; The laser processing head is used to perform laser processing on the material coated with glue to a set glue coating thickness according to the laser processing instruction, and feed back a signal of completion of the laser processing to the processor; The processor is further used to send an image acquisition instruction to the image acquisition device according to the signal that the laser processing is completed; The image acquisition device is used to acquire a processed image of the material according to the image acquisition instruction and return the processed image to the processor.

Images