Glue coating thickness determination method, laser processing method, device, storage medium, apparatus, and system

Abstract

The application discloses a gluing thickness determination method, a laser processing method, a device, a storage medium, equipment and a system. A plurality of processing images of a target material processed by laser under different gluing thicknesses are obtained; pixel features and heat affected zones of a cutting line in each processing image are identified. The cutting line is a linear mark formed by laser processing; the heat affected zone is a zone representing the influence of heat generated by laser processing on the periphery of the cutting line. A target image is determined from the plurality of processing images based on heat affected control conditions and grayscale screening conditions. Finally, based on the correspondence between the processing image and the gluing thickness, the gluing thickness corresponding to the target image is determined as a target gluing thickness matched with the target material. By comparing the processing images of the target material processed by laser under different gluing thicknesses, the gluing thickness ensuring and improving the material processing yield is automatically determined, so that the intelligent level of material gluing and material processing is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material processing, in particular to a glue coating thickness determination method, a laser processing method, a device, a storage medium, equipment and a system. BACKGROUND

[0002] In the semiconductor manufacturing and material processing scenarios, it is often necessary to process the material after coating glue. For example, in the wafer laser processing scenario, the wafer surface needs to be coated with glue before the wafer is processed by laser. Material coating is one of the key processes, and the glue coating thickness also has an important influence on the laser processing process. If the glue coating is too thick, the glue will absorb more heat, so that the metal on the wafer surface cannot be removed when the wafer is processed by laser, so that the expected processing effect cannot be achieved. If the glue coating is too thin, the glue has insufficient heat absorption capacity, and the excess heat quickly spreads to the wafer, which may cause damage to the wafer. Therefore, the glue coating thickness has an important influence on the material processing yield.

[0003] In the prior art, the glue coating thickness is generally controlled according to the glue discharge time. However, as the glue is used, the amount of glue in the glue discharge pipe has been greatly reduced, resulting in a slow flow rate. At this time, the glue coating thickness cannot be accurately controlled only according to the glue discharge time, so the processing yield cannot be guaranteed. In order to avoid the influence of the change of the glue discharge flow rate when the glue is almost used up on the accuracy of controlling the glue coating thickness, the factory generally replaces the new glue in advance before the glue is used up. The remaining amount of the discarded glue cannot be truly utilized, resulting in waste of glue. SUMMARY

[0004] Based on the above problems, the present application provides a glue coating thickness determination method, a laser processing method, a device, a storage medium, equipment and a system, which aims to effectively control the glue coating thickness to improve the yield of material processing and improve the utilization rate of glue.

[0005] The embodiments of the present application disclose the following technical solutions:

[0006] The first aspect of the present application provides a glue coating thickness determination method. The method comprises:

[0007] Obtaining a plurality of processing images of a target material processed by laser respectively with a plurality of different glue coating thicknesses; wherein one processing image corresponds to one glue coating thickness;

[0008] Identifying the pixel features and heat affected areas of the cutting line in each processing image; the cutting line is a linear mark formed by laser processing; the heat affected area is an area representing the influence of the heat of laser processing on the periphery of the cutting line;

[0009] Determining a target image from the plurality of processing images based on heat affected control conditions and grayscale screening conditions;

[0010] Based on the correspondence between the processing image and the glueing thickness, the glueing thickness corresponding to the target image is determined as a target glueing thickness matched with the target material.

[0011] In a possible implementation, the target image is determined from the plurality of processing images based on the heat-affected control condition and the grayscale screening condition, including:

[0012] An image satisfying the heat-affected control condition is determined from the plurality of processing images;

[0013] If there are multiple images satisfying the heat-affected control condition, one image satisfying the grayscale screening condition is determined therefrom as the target image;

[0014] If there is only one image satisfying the heat-affected control condition, the image is taken as the target image.

[0015] In a possible implementation, the heat-affected control condition is that the distance between the heat-affected area and the side edge of the cutting path is greater than or equal to a preset safety distance; and the cutting path is a strip-shaped area on the target material for separating a plurality of target features.

[0016] If there are multiple images satisfying the heat-affected control condition, one image satisfying the grayscale screening condition is determined therefrom as the target image, including:

[0017] If there are multiple images satisfying the heat-affected control condition, one image with the minimum grayscale value index is determined therefrom as the target image.

[0018] In a possible implementation, the method further includes:

[0019] In response to an editing operation of the offset on the laser processing parameter editing interface, a plurality of different sets of offset of the target material are obtained; wherein one set of offset corresponds to one laser processing.

[0020] Before each laser processing of the target material, the target material is controlled to be offset based on a set of offset corresponding to the laser processing to obtain the plurality of processing images, wherein one set of offset corresponds to one processing image.

[0021] In a possible implementation, the method further includes:

[0022] Before each laser processing of the target material, the target material is placed to a glueing position;

[0023] A laser range finder is cleared, and the target material is started to be glued;

[0024] When the laser range finder detects that the glue coating thickness of the target material reaches the edited glue coating thickness in the laser processing parameter editing interface, the glue coating is stopped, and the glued target material is displaced from the glue coating position.

[0025] In a possible implementation, the target material is controlled to be offset based on a set of offset amounts corresponding to the i-th laser processing, including:

[0026] The target material after the i-th glue coating is transported to a processing platform;

[0027] The processing platform is sequentially moved under a coarse adjustment camera and under a fine adjustment camera to identify a center position of a cutting line of the i-1-th laser processing and align the center position with a center of a field of view of the fine adjustment camera;

[0028] The processing platform is controlled to be offset according to a set of offset amounts corresponding to the i-th laser processing; wherein i is an integer greater than 1.

[0029] In a possible implementation, the processing platform is sequentially moved under a coarse adjustment camera and under a fine adjustment camera to identify a center position of a cutting line of the i-1-th laser processing and align the center position with a center of a field of view of the fine adjustment camera, including:

[0030] After the processing platform is moved to an imaging position corresponding to the coarse adjustment camera, a cutting line of the i-1-th laser processing is identified based on imaging of the target material by the coarse adjustment camera, and an offset angle of the cutting line of the i-1-th laser processing relative to a reference direction is determined;

[0031] The processing platform is controlled to be reversely rotated by the offset angle, so that the cutting line of the i-1-th laser processing is parallel to the reference direction;

[0032] A center position of the cutting line of the i-1-th laser processing is identified based on re-imaging of the target material by the coarse adjustment camera;

[0033] The processing platform is controlled to be moved so that the center position reaches a center of a field of view of the coarse adjustment camera;

[0034] According to a relative position of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera, the processing platform is controlled to be moved so that the center position reaches the center of the field of view of the fine adjustment camera.

[0035] In a possible implementation, a pixel feature hot affected area of the cutting line in each processing image is identified, including:

[0036] An area of the cutting line in each processing image is identified;

[0037] obtaining pixel features of the cutting line based on gray scales of pixels in a region of the cutting line;

[0038] identifying a first heat-affected width and a second heat-affected width of heat-affected regions on two sides of the cutting line perpendicular to a length direction of the cutting line;

[0039] The method further comprises:

[0040] determining a width of the cutting line based on a number of pixels in the region of the cutting line perpendicular to the length direction of the cutting line;

[0041] calculating a sum of the width of the cutting line and the first heat-affected width and the second heat-affected width;

[0042] If a difference between the width of the cutting path and the sum of the widths is less than 2 times the preset safety distance, it is determined that the processing image does not satisfy the heat-affected control condition.

[0043] The second aspect of the present application provides a laser processing method, which comprises:

[0044] If the material to be processed is a target material, and the width of the cutting path of the material to be processed is consistent with the width of the cutting path of the target material, then based on a mapping relationship, the material to be processed is coated with a target glue thickness.

[0045] The mapping relationship is a mapping relationship between the width of the cutting path of the target material and the target glue thickness.

[0046] The target glue thickness is a target glue thickness matched with the target material, which is determined by the glue thickness determination method introduced in any implementation manner of the first aspect.

[0047] After the material to be processed is coated, laser processing is performed.

[0048] The third aspect of the present application provides a glue thickness determination device, which comprises:

[0049] An image acquisition module is configured to acquire a plurality of processing images after a target material is processed by laser processing with a plurality of different glue thicknesses; wherein one processing image corresponds to one glue thickness.

[0050] An identification module is configured to identify pixel features and heat-affected regions of a cutting line in each processing image; the cutting line is a linear mark formed by laser processing; and the heat-affected region is a region representing an influence of heat generated by laser processing on the periphery of the cutting line.

[0051] An image determination module is used to determine a target image from the multiple processed images based on thermal effect control conditions and grayscale screening conditions;

[0052] The adhesive thickness determination module is used to determine the adhesive thickness corresponding to the target image as the target adhesive thickness that matches the target material based on the correspondence between the processing image and the adhesive thickness.

[0053] The fourth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the adhesive thickness determination method as described in any implementation of the first aspect.

[0054] The fifth aspect of this application provides an electronic device for determining the thickness of an adhesive coating, the electronic device comprising: a processor and a memory;

[0055] The memory stores computer programs;

[0056] The processor is configured to read and run the computer program stored therein, wherein the program executes the adhesive thickness determination method as described in any implementation of the first aspect.

[0057] The sixth aspect of this application provides a laser processing system, which includes the electronic device for determining the coating thickness described in the fifth aspect, and further includes a laser processing head, a laser rangefinder, and an image acquisition device; the laser processing head, the laser rangefinder, and the image acquisition device are all connected to a processor in the electronic device; the image acquisition device includes at least a coarse-tuning camera and a fine-tuning camera;

[0058] The laser rangefinder is used to measure the thickness of the adhesive coating on the material and generate an adhesive coating thickness measurement signal, and then sends the adhesive coating thickness measurement signal to the processor.

[0059] The processor is further configured to send a laser processing command to the laser processing head when the adhesive coating thickness measurement signal indicates that the adhesive coating thickness has reached the set adhesive coating thickness;

[0060] The laser processing head is used to perform laser processing on the material that has been coated with adhesive to a set coating thickness according to the laser processing command, and to feed back the signal that the laser processing is completed to the processor.

[0061] The processor is also configured to send an image acquisition command to the image acquisition device based on the signal indicating that the laser processing is complete.

[0062] The image acquisition device is used to acquire a processing image of the material according to the image acquisition command, and return the processing image to the processor.

[0063] Compared with the prior art, the present application has the following beneficial effects:

[0064] In the technical scheme of the present application, first, a plurality of processing images of a target material after laser processing at different glue coating thicknesses are obtained, one processing image corresponding to one glue coating thickness. The processing images corresponding to different glue coating thicknesses are obtained, so that the suitable glue coating thickness for laser processing of the target material can be compared from the image level. Next, based on the obtained processing images, the pixel features and heat affected zones in each processing image are identified. The cutting line reflects the actual processing trace, and the gray scale of the cutting line reflects the utilization rate of laser heating energy and whether the glue coating thickness is appropriate. The heat affected zone is a zone representing the influence of heat generated by laser processing on the periphery of the cutting line, reflecting the absorption degree of glue to heat and the influence of heat generated by laser processing on the material. Based on the above-identified information, one target image that meets the heat affected control condition and the gray scale screening condition is screened out from the plurality of processing images. Based on the correspondence between the processing image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as the target glue coating thickness matched with the target material. The use of the heat affected control condition can avoid the target glue coating thickness determined finally being too thin and reduce the negative influence of heat on the material itself. The gray scale of the cutting line reflects the utilization rate of laser heating energy and whether the glue coating thickness is appropriate. The use of the gray scale screening condition can make the determined target glue coating thickness match the target material and make the processing under the determined target glue coating thickness realize high utilization of laser heating energy. The present scheme automatically determines the glue coating thickness that guarantees and improves the material processing yield by comparing the processing images of the target material after laser processing at different glue coating thicknesses, so that the intelligent level of material coating and material processing is improved. The present scheme does not rely on glue coating time to control glue coating, so it is not necessary to replace new glue in advance due to control of glue coating thickness, thereby improving the utilization rate of glue. BRIEF DESCRIPTION OF DRAWINGS

[0065] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0066] Figure 1 A flowchart of a glue coating thickness determination method provided by an embodiment of the present application;

[0067] Figure 2 A heat affected zone schematic diagram provided by an embodiment of the present application;

[0068] Figure 3 A schematic diagram of the relative position of the heat-affected zone and the cutting path provided for an embodiment of the present application;

[0069] Figure 4 A schematic diagram of a laser processing parameter editing interface provided for an embodiment of the present application;

[0070] Figure 5 A processing scene schematic diagram provided for an embodiment of the present application;

[0071] Figure 6 A flowchart of a laser processing method provided for an embodiment of the present application;

[0072] Figure 7 A structural schematic diagram of a glue coating thickness determination device provided for an embodiment of the present application;

[0073] Figure 8 A structural schematic diagram of a laser processing system provided for an embodiment of the present application. DETAILED DESCRIPTION

[0074] The appropriateness of the glue coating thickness determines the yield of material processing. If the glue coating is too thin, the heat of laser processing will spread to other positions of the material, which may cause unnecessary damage to the material. If the glue coating is too thick, the desired processing effect may not be achieved. When laser processing is performed, the method of controlling the glue coating thickness by controlling the glue discharge time is prone to control failure due to the non-uniformity of the glue discharge flow rate. How to effectively control the glue coating thickness and improve the material processing yield is a technical problem to be solved.

[0075] In view of the above problems, the inventors propose a glue coating thickness determination method, a laser processing method, a device, a storage medium, an equipment and a laser processing system. The present scheme automatically determines the glue coating thickness that ensures and improves the material processing yield by comparing the processing images of the target material after laser processing under different glue coating thicknesses, so that the intelligent level of material glue coating and material processing is improved. The present scheme does not rely on glue discharge time to control glue coating, so it is not necessary to replace new glue in advance due to the control of glue coating thickness, and accordingly, the utilization rate of glue is also improved.

[0076] In order for those skilled in the art to better understand the present scheme, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0077] Reference is made to Figure 1Fig. 1 is a flowchart of a method for determining a glue thickness according to an embodiment of the present application. As shown in Fig. 1, the method for determining a glue thickness comprises the following steps. Figure 1

[0078] S101, obtaining a plurality of processing images of a target material processed by laser under a plurality of different glue thicknesses.

[0079] The target material described in the present application can be any product that needs to be processed by laser. For the sake of clear description, the target material herein refers to the product. The specific type of the target material is not limited in the present application. In an example, the target material can be a wafer that needs to be processed by laser.

[0080] Laser cutting is a cutting process using laser technology. It has been widely used in many fields such as semiconductor manufacturing, metal material processing, automobile manufacturing, fitness equipment production, shipbuilding industry and engineering machinery due to its high precision, high efficiency and non-contact processing characteristics.

[0081] In the scenario of laser cutting of a wafer, the purpose of laser cutting is to remove the metal on the surface of the material. In this process, the energy density of the laser beam is high enough to quickly bring the metal on the surface of the material to the melting point or boiling point.

[0082] In order to determine a suitable matching glue thickness of the target material, in this step, a plurality of processing images of the target material processed by laser under a plurality of different glue thicknesses are first obtained. Specifically, one processing image can be collected under each glue thickness. In this way, the plurality of processing images correspond to the plurality of different glue thicknesses one by one. When analyzing the processing images later, a suitable glue thickness can be determined by determining a processing image with good processing effect.

[0083] For example, the target material is processed after being coated with glue of 5 μm thickness, and a first processing image is obtained. The target material is processed after being coated with glue of 10 μm thickness, and a second processing image is obtained. The target material is processed after being coated with glue of 15 μm thickness, and a third processing image is obtained. In this way, three processing images corresponding to different glue thicknesses are obtained.

[0084] ​In one embodiment, each further coating can be to accumulate thickness on the basis of the previous coating. For example, 5 μm is coated in the first coating, and only 5 μm needs to be further coated to reach 10 μm thickness in the second coating; similarly, only 5 μm needs to be further coated to reach 15 μm thickness in the third coating. Each processing is not repeated at the same position. In one example, the first laser processing, the second laser processing and the third laser processing form three parallel cutting lines. The cutting line mentioned here is a linear mark formed by laser processing.

[0085] S102, identify the pixel features of the cutting line and the heat affected zone in each processing image.

[0086] In the embodiments of the present application, each processing image contains at least the cutting line formed after the processing. In this step, the features of the cutting line formed after the processing in each processing image need to be identified. Specifically, when identifying the features of the cutting line, the gray scale features of the cutting line can be identified. The gray scale features are explicit features that are convenient to capture for images.

[0087] In addition, in the embodiments of the present application, the heat affected zone formed after the processing in each processing image also needs to be identified. In the embodiments of the present application, the heat affected zone is a zone representing the influence of the heat of laser processing on the periphery of the cutting line. Figure 2 A schematic diagram of a heat affected zone provided by the embodiments of the present application is shown. As shown in Figure 2 , the situation after laser processing of the material is shown, and the zone between the two red lines represents the cutting line, and the distance between the two red lines is the line width of the cutting line. In combination with Figure 2 , the zone between the two green lines and the adjacent red lines is the heat affected zone. That is, Figure 2 , two parts of the heat affected zone are shown, one part is between the left red line and the green line, and the other part is between the right red line and the green line.

[0088] S103, determining a target image from the plurality of processing images based on the heat affected control condition and the gray scale screening condition.

[0089] On the basis of S102, the pixel features of the cutting line and the heat affected zone in each processing image are identified. Further, the embodiments of the present application need to determine an image with the best processing effect as a target image in combination with the pixel features of the cutting line and the heat affected zone. The processing effect can be analyzed and compared through the pixel features of the cutting line and the heat affected zone.

[0090] The heat affected zone is a zone representing the influence of the heat of laser processing on the periphery of the cutting line, reflecting the absorption degree of the glue to the heat and the influence of the heat generated by laser processing on the material.

[0091] In the embodiments of the present application, the heat-affected control condition is preset. The preset heat-affected control condition is used to screen the appropriate glue coating thickness from the dimension of heat-affected, and to screen out the glue coating thickness parameters that cause large heat-affected due to too thin glue coating thickness. That is, the screening purpose of the heat-affected control condition is to make the heat-affected caused by the selected glue coating thickness within a controllable range. In an example implementation, the heat-affected control condition can be set as: the distance between the heat-affected area and the side edge of the cutting path is greater than or equal to a preset safety distance. The cutting path is a strip-shaped area on the target material for separating a plurality of target features. In an example, if the target material is a wafer, the target feature can be a die in particular.

[0092] The distance between the heat-affected area and the side edge of the cutting path being greater than or equal to the preset safety distance indicates that the control effect of heat-affected by the glue coating thickness for laser processing is good. If the distance between the heat-affected area and the side edge of the cutting path is less than the preset safety distance, the heat generated by laser processing may damage the die on the wafer surface, resulting in product damage.

[0093] To facilitate understanding of the heat-affected control condition, the following Figure 3 is described. Figure 3 A schematic diagram of the relative position of the heat-affected area and the cutting path is provided for the embodiments of the present application. In Figure 3 , the cutting path 01 and the cutting path 02 are shown. Among them, the cutting path 01 is vertically oriented in Figure 3 , the cutting path 02 is horizontally oriented in Figure 3 , and the two cross to form a cross-like effect. By gluing the target material and processing along the cutting path 02, a cutting line as shown in Figure 3 021 is formed, and the laser heat spreads in the vertical direction to form the heat-affected areas as shown in Figure 3 022 and 023.

[0094] Figure 3 In , the two orange straight lines represent the side edges of the cutting path 02 along the horizontal direction. The distance between the heat-affected area 022 and the side edge of the cutting path 02 adjacent to it is represented as d1, and the distance between the heat-affected area 023 and the side edge of the cutting path 02 adjacent to it is represented as d2. When analyzing whether a plurality of processing images meet the heat-affected control condition, it can be specifically analyzed whether the distance d1 is greater than or equal to the preset safety distance, and whether the distance d2 is greater than or equal to the preset safety distance. If d1 and d2 are both greater than or equal to the preset safety distance, it is considered that the processing image meets the heat-affected control condition.

[0095] In combination with Figure 3In an alternative implementation, identifying the pixel feature heat affected zone of the cutting line in each processing image comprises: identifying the area of the cutting line in each processing image; obtaining the pixel feature of the cutting line based on the gray scale of each pixel in the area of the cutting line; and identifying the first heat affected width and the second heat affected width of the heat affected zone on the two sides of the cutting line perpendicular to the length direction of the cutting line. Here, the first heat affected width can be regarded as the width of the heat affected zone 022, and the numerical value is equivalent to d1; and the second heat affected width can be regarded as the width of the heat affected zone 023, and the numerical value is equivalent to d2. Figure 3 Figure 3

[0096] The method further comprises:

[0097] determining the width of the cutting line based on the number of pixels in the area of the cutting line perpendicular to the length direction of the cutting line. The width of the cutting line, as shown in FIG. 2, is the distance between the two red lines. Calculating the sum of the width of the cutting line, the first heat affected width and the second heat affected width; if the difference between the width of the cutting trace (the distance between the two orange-yellow lines) and the sum is less than 2 times the preset safety distance, it is determined that the processing image does not meet the heat affected control condition. At this time, at least one heat affected zone (022 or 023) fails to meet the heat affected control condition. As an example, the preset safety distance is 10 μm. Figure 3 Figure 4 The following introduces an example implementation of step S103.

[0098] First, the images meeting the heat affected control condition are determined from the plurality of processing images. For the images not meeting the heat affected control condition, they are excluded. Then, the number of images meeting the heat affected control condition is analyzed.

[0099] (1) If there are multiple images meeting the heat affected control condition, one image meeting the gray scale screening condition is determined as the target image from among them.

[0100] In this case, the gray scale feature of the cutting line is further combined for screening for the plurality of processing images. The cutting line reflects the actual processing trace, and the gray scale of the cutting line reflects the utilization rate of the laser heating energy and whether the glue thickness is appropriate. The lower the gray scale value, the thinner the glue thickness, but the higher the utilization rate of the laser heating energy, and the cutting is relatively clean for metal impurity removal. Under the same laser power, the most appropriate glue thickness needs to be found to realize laser processing, and therefore, the gray scale screening image is relatively easy to realize.

[0101]

[0102] ​​​​In actual application, the gray scale of the cutting line can be represented by a gray scale index. For example, the gray scale index can be the average gray scale of each pixel in the range of the cutting line. In another example, the gray scale index can also be the weighted average gray scale of the remaining pixels after filtering out a part of pixels with small gray scale value among each pixel in the range of the cutting line. In summary, the gray scale index can represent the overall gray scale (or can be understood as the overall brightness) of the cutting line in the processing image.

[0103] In the embodiment of the present application, if there are multiple images satisfying the heat affected control condition, the image with the minimum gray scale index is determined as the target image.

[0104] (2) If there is only one image satisfying the heat affected control condition, the image is taken as the target image.

[0105] In this case, it can be defaulted that the only image satisfying the heat affected control condition has the most ideal heat affected control among the multiple processing images.

[0106] S104, based on the correspondence between the processing image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as the target glue coating thickness matched with the target material.

[0107] After the target image is determined, since the processing image and the glue coating thickness are one-to-one corresponding, the glue coating thickness corresponding to the target image can be further obtained. Since the selected target image shows good laser processing effect, the glue coating thickness corresponding to the target image can be regarded as the target glue coating thickness matched with the target material. For example, if the first processing image (glue coating thickness 5 μm), the second processing image (glue coating thickness 10 μm) and the third processing image (glue coating thickness 15 μm) among them, the second processing image is selected as the target image in S103, then the glue coating thickness 10 μm corresponding to the processing image can be determined as the target glue coating thickness matched with the target material.

[0108] In the technical solution of the present application, first, a plurality of processing images of the target material are obtained, which are obtained by laser processing the target material at different glue coating thicknesses respectively, and one processing image corresponds to one glue coating thickness. The processing images corresponding to different glue coating thicknesses are obtained, so that the suitable glue coating thickness for laser processing of the target material can be compared and determined from the image level. Next, based on the obtained processing images, the pixel features and heat affected zones in each processing image are identified. The cutting line reflects the actual processing trace, and the gray scale of the cutting line reflects the utilization rate of laser heating energy and whether the glue coating thickness is suitable. The heat affected zone is a zone representing the influence of the heat generated by laser processing on the periphery of the cutting line, reflecting the degree of absorption of heat by the glue and the influence of the heat generated by laser processing on the material.

[0109] Based on the above-identified information, one target image that meets the heat affected control condition and the gray scale screening condition is screened out from the plurality of processing images. Based on the correspondence between the processing image and the glue coating thickness, the glue coating thickness corresponding to the target image is determined as the target glue coating thickness matching the target material. The use of the heat affected control condition can avoid the target glue coating thickness determined finally being too thin and reduce the negative influence of heat on the material itself. The gray scale of the cutting line reflects the utilization rate of laser heating energy and whether the glue coating thickness is suitable. The use of the gray scale screening condition can make the determined target glue coating thickness match the target material and make the processing under the determined target glue coating thickness achieve high utilization of laser heating energy.

[0110] In summary, the present solution automatically determines the glue coating thickness that ensures and improves the processing yield of the material by comparing the processing images of the target material after laser processing at different glue coating thicknesses, so that the intelligent level of material coating and material processing is improved. The present solution does not rely on glue discharge time to control glue coating, so it is not necessary to replace new glue in advance due to control of glue coating thickness, thereby improving the utilization rate of glue.

[0111] Figure 4 A schematic diagram of a laser processing parameter editing interface provided by an embodiment of the present application is shown. Figure 4 In the embodiment of the present application, the staff responsible for laser processing can edit corresponding parameters (such as cutting frequency, cutting power, cutting speed, etc.) in the laser processing parameter editing interface, and then complete multiple laser processing procedures according to the set parameters. In addition, the laser processing parameter editing interface as a host computer display interface can read out the coordinates of the position (such as the cutting position, the light emitting position, etc.) of the device and display them on the interface.

[0112] As Figure 4As shown in the laser processing parameter editing interface, a plurality of sets of offsets can also be set. The Y direction is the direction perpendicular to the cutting line, the X direction is the extension direction of the cutting line, and the Z direction is the direction perpendicular to the processing platform. The target material is placed on the processing platform for laser processing. In Figure 5 7 sets of offsets are shown in the middle. The offsets in the Y direction (referred to as Y offsets) are 10 μm, 20 μm, 30 μm, …, and 70 μm, respectively. This means that when different glue coating thicknesses are used for laser processing each time, the target material on the processing platform needs to be controlled to offset in the Y direction. Thus, each laser processing does not process the same cutting path.

[0113] The processing scene includes a laser processing head, a coarse adjustment camera, a fine adjustment camera, a laser range finder, a processing platform, and an electronic device. The electronic device includes a processor, and the laser processing head, the coarse adjustment camera, the fine adjustment camera, the laser range finder, and the processing platform are directly or indirectly connected in communication with the processor. Figure 5 A processing scene schematic diagram is provided for the embodiments of the present application. In Figure 4 The relative positions of the various devices are only exemplarily shown in the plane in the middle, and the connection lines, the above-mentioned electronic device, and the laser range finder are not shown. In this scene, the positions of the laser processing head 51, the coarse adjustment camera 52, and the fine adjustment camera 53 are fixed, and the processing platform 54 can move in the XY plane. For example, the processing platform 54 can be moved to the light-emitting position of the laser processing head 51, can be moved below the coarse adjustment camera 52, and can be moved below the fine adjustment camera 53. In addition, the processing platform 54 can also carry the target material to the glue coating position to facilitate multiple glue coating of the target material.

[0114] Before laser processing of the target material each time, the target material needs to be placed at the glue coating position. The laser range finder is reset to zero, and the target material is coated. When the laser range finder detects that the glue coating thickness of the target material reaches the edited glue coating thickness in the laser processing parameter editing interface, the coating is stopped, and the coated target material is moved away from the glue coating position.

[0115] In specific implementation, the laser processing parameter editing interface can be edited once for the glue coating thickness each time laser processing is performed. Alternatively, a fixed glue coating thickness increment value can be set, and the glue coating amount is increased by the glue coating thickness increment value each time before laser processing until the thickness reaches the thickness after the increment. For example, the glue coating thickness increment value is set to 5 μm, that is, 5 μm is added each time.

[0116] In combination with Figure 5 and Figure 6 , the glue coating thickness determination method provided in the embodiments of the present application further includes, in addition to S101-S104 introduced in the above embodiments:

[0117] In response to the editing operation of the offset amount on the laser processing parameter editing interface, a plurality of different sets of offset amounts of the target material are obtained. One set of offset amounts corresponds to one laser processing.

[0118] Before each laser processing of the target material, the target material is controlled to be offset based on a set of offset amounts corresponding to the laser processing to obtain the plurality of processing images. One set of offset amounts corresponds to one processing image.

[0119] Next, taking one laser processing as an example, the flow of offset control is introduced. For example, for a set of offset amounts corresponding to the i-th (i is an integer greater than 1, for example, i = 3) laser processing, the target material is offset, which includes:

[0120] (1) The target material coated with the i-th adhesive is transported to the processing stage.

[0121] (2) The processing stage is moved under the coarse adjustment camera and then under the fine adjustment camera to identify the center position of the cutting line of the i-1-th laser processing and align the center position with the center of the field of view of the fine adjustment camera.

[0122] In step (2), the processing stage is moved under the coarse adjustment camera and then under the fine adjustment camera to identify the center position of the cutting line of the i-1-th laser processing and align the center position with the center of the field of view of the fine adjustment camera, which can specifically include:

[0123] After moving the processing stage to the imaging position corresponding to the coarse adjustment camera, the cutting line of the i-1-th laser processing is identified based on the imaging of the target material in the coarse adjustment camera, and the offset angle of the cutting line of the i-1-th laser processing relative to the reference direction is determined. The reference direction can be understood as the horizontal direction or the direction of the X axis. First, the processing stage is moved under the coarse adjustment camera to preliminarily determine the position of the cutting line and the specific offset angle. The field of view of the coarse adjustment camera is larger than that of the fine adjustment camera.

[0124] The processing stage is controlled to rotate in the opposite direction by the offset angle. The purpose of determining the offset angle and rotating in the opposite direction is to make the cutting line of the i-1-th laser processing parallel to the reference direction. When the cutting line is parallel to the reference direction, it means that the cutting line is parallel to the X axis, and generally laser processing needs to be performed along the X direction. Adjusting the cutting line to be parallel to the X axis facilitates the offset adjustment and observation calibration of each laser processing.

[0125] The center position of the i-1th cutting line is identified based on the target material in the re-imaging of the coarse adjustment camera. The center position of the cutting line can be calculated by a visual algorithm. The center position of the cutting line facilitates the searching and identifying of features and facilitates the position adjustment.

[0126] The processing platform is controlled to move so that the center position reaches the center of the field of view of the coarse adjustment camera. Each time the center position of the cutting line reaches the center of the field of view of the camera, the cutting line of the previous laser processing is conveniently found, and the offset of the current time is conveniently performed.

[0127] Next, according to the relative position of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera, the processing platform is controlled to move so that the center position reaches the center of the field of view of the fine adjustment camera. The relative position of the center of the field of view of the coarse adjustment camera and the center of the field of view of the fine adjustment camera can be determined according to the relative position of the rotation centers of the calibration of the two cameras.

[0128] (3) The processing platform is controlled to offset according to the set of offsets corresponding to the i-th laser processing.

[0129] After the processing platform is offset according to the offset of the current time, the laser processing is performed to form the i-th cutting line. Then the target material after the i-th cutting is moved back under the fine adjustment camera, and the i-th processing image can be acquired.

[0130] After the glue coating thickness determination method introduced in the above embodiments is performed, the target glue coating thickness matching the target material is determined. Then when laser processing is needed for the same kind of target material, the glue coating and processing can be performed based on the target glue coating thickness. For convenience, a corresponding relationship between the target material and the target glue coating thickness can be constructed. For example, each kind of material has a corresponding model or identification number, and the target glue coating thickness is represented by a numerical value. After the target glue coating thickness matching the target material is determined, a mapping relationship between the model or identification number of the target material and the target glue coating thickness can be constructed. The mapping relationship can be stored in the form of a mapping table for convenient inquiry.

[0131] In addition, a mapping relationship between the width of the material cutting path and the target glue coating thickness can also be established. For the same kind of material, if the width of the cutting path is consistent with the width of the cutting path of the target material for which the mapping relationship between the width of the cutting path and the target glue coating thickness has been established in the early stage, it means that the determined target glue coating thickness can be specifically followed.

[0132] Based on the glue coating thickness determination method introduced in the foregoing embodiments, the present application also provides a laser processing method. Figure 6 A flowchart of a laser processing method provided by an embodiment of the present application is shown in FIG. 1. Figure 7 As shown in FIG. 1, the laser processing method includes:

[0133] S601, determine a material to be processed and a width of a cutting path of the material to be processed.

[0134] S602, if the material to be processed is a target material and the width of the cutting path of the material to be processed is consistent with the width of the cutting path of the target material, control gluing of the material to be processed according to a target gluing thickness based on a mapping relationship.

[0135] The mapping relationship is a mapping relationship about the width of the cutting path of the target material and the target gluing thickness. For example, it is established in advance that the target gluing thickness corresponding to the cutting path width D1 of the target material is X1, and if the material to be processed is also the target material and the cutting path width thereof is also D1, it is determined based on the mapping relationship that the gluing thickness of the material to be processed should reach X1.

[0136] S603, after the gluing of the material to be processed is completed, laser processing is performed.

[0137] In the technical scheme of the present application, the mapping relationship is established in advance, and when the material needs to be processed subsequently, it can be conveniently called. The convenience and accuracy of laser processing gluing are improved, and efficient and accurate gluing control is facilitated.

[0138] Based on the foregoing method embodiments, correspondingly, the present application also provides a gluing thickness determination device. Figure 7 A structural diagram of the gluing thickness determination device is shown in FIG. 7. Figure 8 As shown in FIG. 7, the gluing thickness determination device comprises:

[0139] An image acquisition module 701 is configured to acquire a plurality of processing images of a target material processed by laser processing at different gluing thicknesses respectively; wherein one processing image corresponds to one gluing thickness;

[0140] An identification module 702 is configured to identify pixel features and heat-affected areas of a cutting line in each processing image; the cutting line is a linear mark formed by laser processing; and the heat-affected area is an area representing the influence of heat generated by laser processing on the periphery of the cutting line;

[0141] An image determination module 703 is configured to determine a target image from the plurality of processing images based on heat-affected control conditions and grayscale screening conditions;

[0142] A gluing thickness determination module 704 is configured to determine a gluing thickness corresponding to the target image as a target gluing thickness matched with the target material based on the correspondence between the processing image and the gluing thickness.

[0143] Optionally, the image determination module 703 is specifically configured to:

[0144] determining an image satisfying the heat affected zone control condition from the plurality of processed images;

[0145] If there are multiple images satisfying the heat affected zone control condition, determining an image satisfying the gray scale screening condition as the target image therefrom;

[0146] If there is only one image satisfying the heat affected zone control condition, taking the image as the target image.

[0147] Optionally, the heat affected zone control condition is that the distance between the heat affected zone and the side edge of the cutting path is greater than or equal to a preset safety distance; and the cutting path is a strip-shaped region on the target material for separating a plurality of target features.

[0148] If there are multiple images satisfying the heat affected zone control condition, the image determining module is configured to determine an image with the smallest gray value index as the target image therefrom.

[0149] Optionally, the glue application thickness determination device further comprises:

[0150] an offset amount obtaining module configured to, in response to an editing operation of an offset amount on the laser processing parameter editing interface, obtain a plurality of different sets of offset amounts of the target material; wherein one set of offset amounts corresponds to one laser processing;

[0151] an offset control module configured to, before each laser processing of the target material, control the target material to be offset based on a set of offset amounts corresponding to the laser processing to obtain the plurality of processed images, wherein one set of offset amounts corresponds to one processed image.

[0152] Optionally, the glue application thickness determination device further comprises:

[0153] a material placing module configured to, before each laser processing of the target material, place the target material to a glue application position;

[0154] a glue application control module configured to clear the laser range finder and start applying glue to the target material;

[0155] The material placing module is further configured to, when the laser range finder detects that the glue application thickness of the target material reaches the edited glue application thickness in the laser processing parameter editing interface, stop applying glue and move the glued target material away from the glue application position.

[0156] Optionally, the offset control module is specifically configured to:

[0157] carry the target material after the i-th glue application to a processing platform;

[0158] The processing platform is moved to under the coarse adjustment camera and under the fine adjustment camera in sequence to identify a center position of a cutting line of the i-1th laser processing and align the center position with a center of a field of view of the fine adjustment camera;

[0159] The processing platform is controlled to shift according to a set of offsets corresponding to the i-th laser processing; wherein i is an integer greater than 1.

[0160] Optionally, the offset control module is specifically used for:

[0161] After the processing platform is moved to an imaging position corresponding to the coarse adjustment camera, a cutting line of the i-1th laser processing is identified based on imaging of the target material under the coarse adjustment camera, and an offset angle of the cutting line of the i-1th laser processing relative to a reference direction is determined;

[0162] The processing platform is controlled to rotate reversely by the offset angle, so that the cutting line of the i-1th laser processing is parallel to the reference direction;

[0163] The center position of the cutting line of the i-1th laser processing is identified based on re-imaging of the target material under the coarse adjustment camera;

[0164] The processing platform is controlled to move so that the center position reaches a center of a field of view of the coarse adjustment camera;

[0165] According to a relative position of the center of the field of view of the coarse adjustment camera and a center of a field of view of the fine adjustment camera, the processing platform is controlled to move so that the center position reaches the center of the field of view of the fine adjustment camera.

[0166] Optionally, the identification module 702 is specifically used for:

[0167] Identifying a region of the cutting line in each processing image;

[0168] Obtaining pixel features of the cutting line based on gray scales of each pixel in the region of the cutting line;

[0169] Identifying a first heat-affected width and a second heat-affected width of heat-affected regions on two sides of the cutting line perpendicular to a length direction of the cutting line;

[0170] The glue coating thickness determination device further comprises:

[0171] A width determination module is configured to determine a width of the cutting line based on a number of pixels in the region of the cutting line perpendicular to the length direction of the cutting line;

[0172] A width calculation module is configured to calculate a sum of the width of the cutting line, the first heat-affected width and the second heat-affected width;

[0173] The judging module is configured to determine that the processing image does not satisfy the heat affected zone control condition if a difference between the width of the cutting path and the sum of the widths is less than 2 times the preset safety distance.

[0174] Based on the glue coating thickness determination method introduced in the foregoing method embodiments, the application further provides a computer readable storage medium, which stores a computer program, and when the computer program is run by a processor, the glue coating thickness determination method introduced in the foregoing method embodiments is implemented.

[0175] Based on the glue coating thickness determination method introduced in the foregoing method embodiments, the application further provides an electronic device for determining a glue coating thickness, which comprises a processor and a memory.

[0176] The memory stores a computer program.

[0177] The processor is configured to read the computer program stored in the memory and run the computer program, and the program performs the glue coating thickness determination method introduced in the foregoing method embodiments when running.

[0178] Further, the application also provides a laser processing system, Figure 8 An example structure of the system is shown. By ​ The connection relationship between the devices can be seen.

[0179] The laser processing system comprises an electronic device 81 for determining a glue coating thickness, and further comprises a laser processing head 82, a laser range finder 83 and an image acquisition device; the laser processing head 82, the laser range finder 83 and the image acquisition device are all connected with the processor in the electronic device 81; the image acquisition device at least comprises a coarse adjustment camera 84 and a fine adjustment camera 85;

[0180] The laser range finder is configured to measure the glue coating thickness on the material and generate a glue coating thickness measurement signal, and send the glue coating thickness measurement signal to the processor;

[0181] The processor is further configured to send a laser processing instruction to the laser processing head when the glue coating thickness measurement signal indicates that the glue coating thickness reaches a set glue coating thickness;

[0182] The laser processing head is configured to perform laser processing on the material whose glue coating thickness reaches the set glue coating thickness according to the laser processing instruction, and feed back a signal of laser processing completion to the processor;

[0183] The processor is further configured to send an image acquisition instruction to the image acquisition device according to the signal of laser processing completion;

[0184] The image acquisition device is configured to acquire the processing image of the material according to the image acquisition instruction, and return the processing image to the processor.

[0185] It should be noted that the various embodiments in the specification are described in a progressive manner, and the same and similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the difference from other embodiments. In particular, the device, equipment and system embodiments are described more simply because they are basically similar to the method embodiments. The relevant parts can be referred to the part of the method embodiment. The above-described device, equipment and system embodiments are only illustrative, and the units described as separate components can or can not be physically separated, and the components indicated as units can or can not be physical units, that is, they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment according to the actual needs. Those skilled in the art can understand and implement it without creative labor.

[0186] The above is only one specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method of determining a glueing thickness, characterized by, The method comprises the following steps: acquiring a plurality of processing images of a target material after laser processing at different glue coating thicknesses, wherein one processing image corresponds to one glue coating thickness; identifying pixel features of a cutting line and a heat-affected area in each processing image, wherein the cutting line is a linear mark formed by laser processing, and the heat-affected area is an area representing the influence of heat generated by laser processing on the periphery of the cutting line; determining a target image from the plurality of processing images based on a heat-affected control condition and a grayscale screening condition; determining a target glue coating thickness corresponding to the target image as a target glue coating thickness matched with the target material based on the correspondence between the processing image and the glue coating thickness.

2. The method of claim 1, wherein, The step of determining a target image from the plurality of processing images based on a heat-affected control condition and a grayscale screening condition comprises the following steps: determining images satisfying the heat-affected control condition from the plurality of processing images; if there are a plurality of images satisfying the heat-affected control condition, determining one image satisfying the grayscale screening condition from the plurality of images as a target image; if there is only one image satisfying the heat-affected control condition, determining the image as a target image.

3. The method of claim 2, wherein, The heat-affected control condition is that the distance between the heat-affected area and the side edge of a cutting path is greater than or equal to a preset safety distance, and the cutting path is a strip-shaped area on the target material for separating a plurality of target features. If there are a plurality of images satisfying the heat-affected control condition, determining one image satisfying the grayscale screening condition from the plurality of images as a target image comprises the following step: if there are a plurality of images satisfying the heat-affected control condition, determining one image with the minimum grayscale value index from the plurality of images as a target image.

4. The method of claim 1, wherein, The method further comprises the following steps: in response to an editing operation of an offset amount on a laser processing parameter editing interface, acquiring a plurality of different sets of offset amounts of the target material, wherein one set of offset amounts corresponds to one laser processing; before each laser processing of the target material, controlling the target material to be offset based on a set of offset amounts corresponding to the laser processing to obtain the plurality of processing images, wherein one set of offset amounts corresponds to one processing image.

5. The method of claim 4, wherein, The method further comprises the following steps: before each laser processing of the target material, placing the target material on a glue coating position; zeroing a laser range finder and starting to coat glue on the target material; when the laser range finder detects that the glue coating thickness of the target material reaches the edited glue coating thickness in the laser processing parameter editing interface, stopping the glue coating, and moving the target material coated with glue away from the glue coating position.

6. The method of claim 4, wherein, The step of controlling the target material to be offset based on a set of offset amounts corresponding to the i-th laser processing comprises the following steps: carrying the target material coated with glue for the i-th time to a processing platform; moving the processing platform to be under a coarse adjustment camera and a fine adjustment camera in sequence to identify the center position of the cutting line of the i-1-th laser processing and align the center position with the center of the field of view of the fine adjustment camera; controlling the processing platform to be offset according to a set of offset amounts corresponding to the i-th laser processing, wherein i is an integer greater than 1.

7. The method of claim 6, wherein, The sequentially moving the machining platform under the coarse adjustment camera and the fine adjustment camera to identify a center position of the i-1th laser processing cutting line and align the center position with a field center of the fine adjustment camera comprises: After moving the machining platform to an imaging position corresponding to the coarse adjustment camera, identifying the i-1th laser processing cutting line based on imaging of the target material by the coarse adjustment camera, and determining an offset angle of the i-1th laser processing cutting line relative to a reference direction; Controlling the machining platform to reversely rotate by the offset angle so that the i-1th laser processing cutting line is parallel to the reference direction; Identifying a center position of the i-1th laser processing cutting line based on re-imaging of the target material by the coarse adjustment camera; Controlling the machining platform to move so that the center position reaches a field center of the coarse adjustment camera; According to a relative position of the field center of the coarse adjustment camera and a field center of the fine adjustment camera, controlling the machining platform to move so that the center position reaches the field center of the fine adjustment camera.

8. The method of claim 3, wherein, The identifying a pixel feature heat affected area of the cutting line in each processing image comprises: Identifying a region of the cutting line in each processing image; Obtaining a pixel feature of the cutting line based on gray scales of pixels in the region of the cutting line; Identifying a first heat affected width and a second heat affected width of heat affected areas on two sides of the cutting line perpendicular to a length direction of the cutting line; The method further comprises: Determining a width of the cutting line based on a number of pixels in the region of the cutting line perpendicular to the length direction of the cutting line; Calculating a sum of the width of the cutting line, the first heat affected width and the second heat affected width; If a difference between the width of the cutting track and the sum is less than 2 times of the preset safety distance, determining that the processing image does not satisfy the heat affected control condition.

9. A laser processing method characterized by, Comprise: Determining a material to be processed and a width of a cutting track of the material to be processed; If the material to be processed is a target material and the width of the cutting track of the material to be processed is consistent with the width of the cutting track of the target material, controlling to glue the material to be processed according to a target glue thickness based on a mapping relationship; The mapping relationship is a mapping relationship about the width of the cutting track of the target material and the target glue thickness; The target glue thickness is a target glue thickness matched with the target material determined based on the glue thickness determination method in any one of claims 1-8; After gluing the material to be processed, performing laser processing.

10. A gluing thickness determining device, characterized by Comprise: An image acquisition module is configured to acquire a plurality of processing images of a target material processed by laser with a plurality of different glue thicknesses; wherein one processing image corresponds to one glue thickness; An identification module is configured to identify a pixel feature and a heat affected area of a cutting line in each processing image; the cutting line is a linear mark formed by laser processing; the heat affected area is an area representing an influence of heat of laser processing on a periphery of the cutting line; An image determining module is configured to determine a target image from the plurality of processing images based on the heat-affected control condition and the grayscale screening condition. A glue application thickness determining module is configured to determine a glue application thickness corresponding to the target image as a target glue application thickness matching the target material based on the correspondence between the processing image and the glue application thickness.

11. A computer readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and when the computer program is run by the processor, the glue application thickness determining method according to any one of claims 1-8 is implemented.

12. An electronic device for determining a glueing thickness, characterized in that The electronic device comprises a processor and a memory. The memory stores a computer program. The processor is configured to read the computer program stored in the memory and run the computer program, and the program is run to perform the glue application thickness determining method according to any one of claims 1-8.

13. A laser processing system characterized by comprising: The electronic device for determining the glue application thickness according to claim 12 further comprises a laser processing head, a laser range finder and an image acquisition device; the laser processing head, the laser range finder and the image acquisition device are connected with the processor in the electronic device; the image acquisition device at least comprises a coarse adjustment camera and a fine adjustment camera; The laser range finder is configured to measure the glue application thickness on the material and generate a glue application thickness measurement signal, and send the glue application thickness measurement signal to the processor; The processor is further configured to send a laser processing instruction to the laser processing head when the glue application thickness measurement signal indicates that the glue application thickness reaches a set glue application thickness; The laser processing head is configured to perform laser processing on the material with the glue application thickness reaching the set glue application thickness according to the laser processing instruction, and feed back a signal of laser processing completion to the processor; The processor is further configured to send an image acquisition instruction to the image acquisition device according to the signal of laser processing completion; The image acquisition device is configured to acquire a processing image of the material according to the image acquisition instruction, and return the processing image to the processor.

Images