Nozzle angle adjusting device and system for cleaning cavity

Abstract

The invention provides a nozzle angle adjusting device and system for a cleaning cavity, and relates to the technical field of semiconductor technologies. The device comprises a base and two movable adjusting arms, the two sides of the base are each provided with an adjusting arm. The base comprises a base plate, a driving unit and a transmission unit; the adjusting arm comprises a fixed part and a sliding sleeve rod, the fixed part is located at one end of the sliding sleeve rod, the other end of the sliding sleeve rod is connected with the transmission unit, and the fixed part is provided with an orthographic projection located on the base plate; a fixing groove is formed in the fixing part of the adjusting arm and is used for fixing a nozzle cross rod; the driving unit is located on the base plate and used for driving the transmission unit to drive the fixing part to move so as to adjust the position of the orthographic projection of the fixing part on the base plate, and the angle of the nozzle on the nozzle cross rod can be adjusted. According to the scheme of the invention, the cleaning efficiency and the cleaning effect of wafer cleaning can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor process technology, and in particular to a nozzle angle adjustment device and system for a cleaning chamber. Background Art

[0002] After the Chemical Mechanical Polishing (CMP) process is completed, the cleaning chamber is used to clean the polishing liquid and polishing waste on the surface of the wafer. The nozzle in the cleaning chamber will continuously flow out the cleaning liquid to the surface of the wafer to assist the cleaning brush to clean the wafer. However, the nozzle angles on the machines for different chemicals or different polishing processes are different. Therefore, how to intelligently adjust the angle of the nozzle for the cleaning chamber to improve the efficiency and effect of cleaning the wafer is a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides a nozzle angle adjustment device and system for a cleaning chamber, which can improve the cleaning efficiency and cleaning effect of cleaning wafers by adjusting the angle of the nozzle for the cleaning chamber, thereby improving the qualified rate of wafers.

[0004] According to a first aspect of an embodiment of the present application, a nozzle angle adjustment device for a cleaning chamber is provided, comprising: a base, a movable adjustment arm; the base comprises: a substrate, a driving unit and a transmission unit; the adjustment arm is located on one side of the substrate, the adjustment arm comprises a fixing portion and a sliding sleeve rod, the fixing portion is located at one end of the sliding sleeve rod, the other end of the sliding sleeve rod is connected to the transmission unit, the fixing portion has an orthographic projection located on the substrate; a fixing groove is provided in the fixing portion of the adjustment arm, the fixing groove is used to fix the nozzle cross bar; The driving unit is located on the substrate, and is used to drive the transmission unit to drive the fixing part to move so as to adjust the position of the orthographic projection of the fixing part on the substrate, so as to adjust the nozzle angle on the nozzle crossbar.

[0005] Preferably, the fixing portion is an openable and closable structure, and the fixing portion includes a first fixing portion and a second fixing portion; the fixing groove is a groove formed by the cooperation of the first surface of the first fixing portion and the second surface of the second fixing portion, and matches the rod body of the nozzle cross bar.

[0006] Preferably, the transmission unit includes a displacement adjustment component; the driving unit is connected to the displacement adjustment component, and the sliding sleeve rod is driven to move radially along the substrate through the displacement adjustment component.

[0007] Preferably, the displacement adjustment assembly includes a slide rail, a rack and a gear; the slide rail is provided on the base plate and extends in a direction radially parallel to the base plate, the rack is placed in the slide rail and moves in the slide rail; the rack is connected to the sliding sleeve rod, and the rack is meshed with the gear; the driving unit includes a motor, and the motor is connected to the gear to drive the rack and the sliding sleeve rod to move.

[0008] Preferably, the transmission unit further comprises an angle adjustment portion for adjusting the included angle between the sliding sleeve rod and the base plate, and the adjustment range of the included angle between the sliding sleeve rod and the base plate is 30°-70°.

[0009] Preferably, the driving unit further comprises: an electric motor and a motor bracket; the motor bracket is used to carry the motor, and the motor is connected to the displacement adjustment component.

[0010] Preferably, there are two adjusting arms, which are respectively arranged on two sides of the base plate, and the two adjusting arms are respectively connected to the driving unit through the transmission unit.

[0011] Preferably, the sliding sleeve comprises: an external sleeve and a telescopic tube; the telescopic tube is inserted into the hollow portion of the external sleeve and can slide along the inner wall of the external sleeve to achieve telescopic movement of the sliding sleeve.

[0012] Preferably, a distance sensor is further included, and the distance sensor is used to measure the moving distance of the displacement adjustment component on the substrate.

[0013] The present invention also provides a nozzle angle adjustment system for a cleaning chamber, the system comprising: The nozzle angle adjustment device for a cleaning chamber as described in any one of the above items, the nozzle angle adjustment device for a cleaning chamber comprises a distance sensor, the distance sensor is used to measure the moving distance of the sliding sleeve rod connected to the transmission unit on the substrate, the moving distance is used as the target length; the target nozzle cross bar is provided in the fixing groove, and the driving unit is used to control the fixing part to move to the target position; A controller is connected to the distance sensor and the driving unit, and is used to obtain the target length, and calculate the angle between the adjustment arm and the substrate according to the target length.

[0014] According to the solution of the present application, by adjusting the angle of the nozzle used in the cleaning chamber, the cleaning efficiency and cleaning effect of the wafer can be improved, thereby improving the qualified rate of the wafer.

[0015] It should be understood that the contents described in the Summary of the Invention are not intended to limit the key or important features of the embodiments of the present application, nor are they intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other features, advantages and aspects of the embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein: Figure 1 is a schematic structural diagram of a nozzle angle adjustment device for a cleaning chamber according to an embodiment of the present application; Figure 2 is a side cross-sectional view of a nozzle angle adjustment device for a cleaning chamber according to an embodiment of the present application; Figure 3 is a schematic structural diagram of a sliding sleeve rod according to an embodiment of the present application; Figure 4 It is a schematic diagram of the structure of the nozzle angle adjustment system for the cleaning chamber according to an embodiment of the present application.

[0017] Description of reference numerals: 1: Substrate; 2: Adjust the arm; 3: first fixing part; 4: second fixing part; 5: Motor; 6: Motor bracket; 7: Sliding sleeve rod; 8: Gear; 9: rack; 10: Slide rail; 11: external casing; 12: Telescopic tube; 13: Angle adjustment unit. DETAILED DESCRIPTION

[0018] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0019] In the related art, after the CMP process is completed, the cleaning chamber is used to clean the grinding liquid and grinding waste on the surface of the wafer. The cleaning chamber includes a cleaning brush, a nozzle and a chamber structure. Among them, the nozzle in the cleaning chamber will continuously flow out the cleaning liquid to the surface of the wafer to assist the cleaning brush to clean the wafer. The angle of the nozzle in the cleaning chamber will affect the cleaning efficiency and cleaning effect of the wafer. However, the nozzle angles for different chemicals or for different grinding processes are different. In order to improve the efficiency and effect of cleaning the wafer, thereby improving the qualified rate of the wafer, it is necessary to precisely adjust the angle of the nozzle for the cleaning chamber.

[0020] In the prior art, the adjustment of the cleaning chamber nozzle angle mainly relies on manual observation. Specifically, the cleaning fluid is sprayed onto the standard part through the cleaning chamber nozzle to observe the spraying position; a special tool is tied to the nozzle cross bar to imitate the position of the cleaning chamber nozzle spray, and a ruler is used to measure to complete the positioning of the cleaning chamber nozzle angle. After confirming the angle of the cleaning chamber nozzle, the nozzle cross bar is fixed with the screws on the nozzle cross bar, so that the angle of the cleaning chamber nozzle is fixed by friction.

[0021] The disadvantages of adjusting the nozzle angle for the cleaning chamber by manual observation are: 1. The method of manually observing the spraying position of the cleaning chamber nozzle by spraying the cleaning liquid onto the standard part. Due to the different splashing of water flow, only the angle of the cleaning chamber nozzle can be roughly confirmed, and the accuracy is low; 2. When using standard parts to adjust the angle of the cleaning chamber nozzle, the different angles of manual observation may cause different recorded data, resulting in inaccurate angles of the cleaning chamber nozzle; 3. After completing the angle adjustment of the cleaning chamber nozzle, when fixing the angle of the cleaning chamber nozzle, the angle may change slightly; 4. After the nozzle angle adjustment for cleaning the chamber is completed, the obtained nozzle angle cannot be simply and quickly replicated on other machines, resulting in low efficiency.

[0022] The nozzle angle in this specification refers to the position of the nozzle in space relative to the wafer, including the height Z of the nozzle relative to the wafer, the X and Y offset of the center of the fluid ejected by the nozzle on the wafer surface relative to the center of the wafer, and the angle between the fluid ejected by the nozzle and the nozzle cross bar.

[0023] In order to solve the above technical problems, the embodiment of the present application provides a device and system for adjusting the angle of a nozzle for a cleaning chamber. The device for adjusting the angle of a nozzle for a cleaning chamber comprises: a base, a movable adjusting arm; the base comprises: a substrate, a driving unit and a transmission unit; the adjusting arm is located on one side of the substrate, the adjusting arm comprises a fixed part and a sliding sleeve rod, the fixed part is located at one end of the sliding sleeve rod, the other end of the sliding sleeve rod is connected to the transmission unit, and the fixed part has an orthographic projection located on the substrate; a fixed groove is provided in the fixed part of the adjusting arm, and the fixed groove is used to fix the nozzle crossbar; the driving unit is located on the substrate, and is used to drive the transmission unit to adjust the position of the orthographic projection of the fixed part in the radial direction of the substrate, so as to realize the adjustment of the nozzle angle on the nozzle crossbar. Through any embodiment of the present application, the angle of the nozzle for the cleaning chamber can be intelligently adjusted, and the efficiency and effect of cleaning the wafer can be improved, thereby improving the qualified rate of the wafer. The present application adjusts the position of the orthographic projection of the fixed part on the substrate, thereby using spatial geometry to realize the adjustment of the nozzle angle on the nozzle crossbar, and specifically can realize the X and Y displacement of the center of the fluid ejected by the nozzle on the wafer surface relative to the center of the wafer.

[0024] According to the embodiments of the present application, it should be noted that: After the CMP process is completed, the cleaning chamber is used to clean the grinding liquid and grinding waste on the surface of the wafer. Specifically, the CMP process is one of the indispensable key processes in the semiconductor manufacturing process. Its core is to achieve global nanoscale flattening of the wafer surface to ensure high precision and high quality of integrated circuit manufacturing. The CMP process processes the wafer through specially designed polishing liquid and polishing pads. During the polishing process, the chemical components in the polishing liquid react chemically with the material on the surface of the wafer to soften it, and then the abrasive particles in the polishing pad and polishing liquid remove the softened material through mechanical action, thereby achieving flattening of the wafer surface. Therefore, after the CMP process is completed, the wafer needs to be placed in the cleaning chamber and the wafer surface needs to be cleaned to remove the grinding liquid and grinding waste remaining on the wafer surface after the CMP process is completed.

[0025] The cleaning chamber may include: a cleaning brush, a cleaning liquid, a nozzle, a wafer support table, and a chamber structure. Among them, the cleaning brush is used to physically clean the wafer surface after the CMP process is completed to remove the grinding liquid and grinding waste; the cleaning brush is usually made of soft and durable materials to ensure that the wafer surface is not damaged during the cleaning process. The cleaning liquid flows out or sprays out through the nozzle and is used in conjunction with the cleaning brush to more effectively remove pollutants on the wafer surface; the cleaning liquid can be a preparation containing specific chemical components or clean water. The nozzle is used to spray the cleaning liquid evenly onto the wafer surface to ensure that the cleaning liquid can fully cover the entire wafer surface; multiple nozzles are arranged equidistantly on a crossbar; the design of the nozzle usually needs to consider factors such as the flow rate, pressure, and spray angle of the cleaning liquid to ensure the best cleaning effect. The wafer support table is used to place the wafer. The chamber structure is a space for accommodating the cleaning brush, nozzle, cleaning liquid, wafer support table, and wafer.

[0026] like Figure 1 As shown, the base includes: a substrate 1, a driving unit and a transmission unit; in this embodiment, the transmission unit includes a displacement adjustment component, and the driving unit is connected to the displacement adjustment component. The displacement adjustment component moves along the radial direction of the substrate 1, so that the angle between the adjustment arm 2 and the substrate 1 changes, thereby changing the position of the orthographic projection of the fixed part of the adjustment arm 2 on the substrate 1. In this embodiment, the substrate 1 is used as a reference reference for the nozzle spraying surface, such as a wafer-like structure. In this embodiment, the driving unit drives the fixed part and the spray cross bar to move through the displacement adjustment component, thereby changing the nozzle angle on the spray cross bar, changing the nozzle spraying area, and monitoring whether the substrate 1 is fully covered to meet the semiconductor wafer cleaning process requirements.

[0027] The displacement adjustment assembly includes: a rack 9, a slide rail 10 and a gear 8; the rack 9 is connected to the sliding sleeve rod 7 and placed in the slide rail 10, and the rack 9 is meshed with the gear 8; the motor shaft of the motor 5 is inserted into the shaft hole of the gear 8 to drive the rack 9 to move in the slide rail 10. In this embodiment, the displacement movement of the sliding sleeve rod 7 is realized by the gear 8 and the rack 9. Here, the slide rail can extend in a direction parallel to the radial direction of the substrate, or extend in a direction overlapping with one of the diameter directions of the substrate 1. The displacement adjustment assembly is not limited to this, as long as the power of the driving unit can be converted into linear motion to realize the displacement of the sliding sleeve rod 7. The driving unit includes at least one motor 5; the motor 5 is used to drive the rack 9 of the displacement adjustment assembly to move along the radial direction of the substrate. Here, the size of the base is not specifically limited, and its size can be set according to the requirements of the semiconductor manufacturing process.

[0028] As an embodiment, a distance sensor is provided in the sliding sleeve rod 7 in this embodiment, and the distance sensor is used to measure the sliding distance of the rack 9. In this embodiment, the distance sensor is used to measure the sliding distance of the rack 9, so as to obtain the distance between the connection between the adjusting arm 2 and the rack 9 and the orthographic projection of the fixed part at the end of the adjusting arm on the substrate 1. In the right triangle formed by the adjusting arm 2 and the substrate 1, the angle between the hypotenuse and the right side can be obtained when the two right-angled sides are known. The distance from the end of the adjusting arm, that is, the fixed part of the end of the adjusting arm to the substrate is the length of one of the right-angled sides, and the distance between the connection between the adjusting arm 2 and the rack 9 and the orthographic projection of the fixed part on the substrate 1 is the length of the other right-angled side. It is also known that the adjusting arm is the hypotenuse of the right triangle. Therefore, through the characteristics of the right triangle, the length of one of the right-angled sides can be adjusted to adjust the acute angle, that is, the angle between the adjusting arm 2 and the substrate 1 can be adjusted, that is, the adjustment of the nozzle spray angle is completed.

[0029] As an example, Figure 1 As shown, the adjustment arm 2 includes a fixed portion and a sliding sleeve rod 7, and the sliding sleeve rod 7 is connected to the angle adjustment portion 13, through which the angle between the sliding sleeve rod 7 and the base plate 1 can be adjusted. Figure 2 As shown, the rack 9 is connected to the sliding sleeve rod 7 through the angle adjustment part 13 and is placed in the slide rail 10; the rack 9 is meshed with the gear 8; the motor shaft of the motor 5 is inserted into the shaft hole of the gear 8; when the motor shaft of the motor 5 rotates, it drives the gear 8 to rotate, so that the rack 9 moves in the slide rail 10. Among them, the angle adjustment part 13 includes a rotating shaft arranged on the rack 9, and the end of the sliding sleeve rod 7 is rotatably connected to the rotating shaft, and the sliding sleeve rod 7 rotates around the rotating shaft to adjust the angle between the sliding sleeve rod 7 and the base plate 1. The adjustment range of the angle between the sliding sleeve rod 7 and the base plate 1 is 30°-70°.

[0030] A fixing groove is provided in the fixing part of the above-mentioned adjustment arm 2, and the fixing groove is used to fix the nozzle cross bar. The fixing part is an openable structure, and the fixing part includes a first fixing part 3 and a second fixing part 4; the fixing groove is a groove formed by the first surface of the first fixing part 3 and the second surface of the second fixing part 4 to match the rod body of the nozzle cross bar; the second surface of the first fixing part 3 opposite to its first surface is a plane; the first surface of the second fixing part 4 opposite to its second surface is a plane. Exemplarily, the first fixing part 3 is a hexahedron, the first surface of the first fixing part 3 is a lower arc groove, and the second surface opposite to the first surface is a plane. The second fixing part 4 is a hexahedron, the first surface of the second fixing part 4 is a plane, and the second surface opposite to the first surface is an upper arc groove. Here, the size of the arc groove on the first surface of the first fixing part 3 and the second surface of the second fixing part 4 is not limited, and its size can be set according to the size of the nozzle cross bar.

[0031] An embodiment of the above-mentioned sliding sleeve rod 7 includes: an external sleeve 11 and a telescopic tube 12; the external sleeve 11 is used to place the telescopic tube 12; the telescopic tube 12 is connected to the rack 9 through the angle adjustment part 13, the telescopic tube 12 is rotatably connected to the rotating shaft on the rack 9, and the telescopic tube 12 rotates around the rotating shaft to adjust the angle of the nozzle on the nozzle cross bar.

[0032] The nozzle crossbar is a crossbar on which a plurality of nozzles are evenly distributed. The angles of the nozzles on the nozzle crossbar are fixed. The rod of the nozzle crossbar is a cylinder, and the first surface of the first fixing portion 3 of the adjustment arm 2 and the second surface of the second fixing portion 4 cooperate to form a fixing groove corresponding to the nozzle crossbar. The size of the fixing groove is compatible with the nozzle crossbar.

[0033] According to the embodiments of the present application, by adjusting the angle of the nozzle for the cleaning chamber, the cleaning efficiency and cleaning effect of the wafer can be improved, thereby improving the qualified rate of the wafer.

[0034] According to the embodiments of the present application, it should be noted that: like Figure 1 As shown, the first fixing part 3 is a hexahedron, the first surface of the first fixing part 3 is a lower arc groove, and the second surface opposite to the first surface is a plane. Bolt holes are respectively provided on both sides of the first surface of the first fixing part 3, and the first fixing part 3 and the second fixing part 4 are matched to form a fixing groove to fix the nozzle cross bar by bolt connection.

[0035] like Figure 1 As shown, the second fixing part 4 is a hexahedron, the first surface of the second fixing part 4 is a plane, and the second surface opposite to the first surface is an upper arc groove. Bolt holes are respectively provided on both sides of the first surface of the second fixing part 4, and the first fixing part 3 and the second fixing part 4 are matched to form a fixing groove to fix the nozzle cross bar by bolt connection.

[0036] like Figure 1 As shown, the lower arc groove on the first surface of the first fixing portion 3 and the upper arc groove on the second surface of the second fixing portion 4 have the same arc and depth, and the two can cooperate to form a fixing groove corresponding to the nozzle crossbar. After the first surface of the first fixing portion 3 and the second surface of the second fixing portion 4 are attached and fixed by bolts, the fixing groove formed matches the rod body of the nozzle crossbar.

[0037] like Figure 1 As shown, the first surface of the first fixing part 3 is fitted with the second surface of the second fixing part 4, and is locked by bolts, so that the nozzle crossbar can be fixed. Here, the locking method of the first fixing part 3 and the second fixing part 4 is not specifically limited, and the locking method can also be a snap connection, a magnetic connection, a pin or other locking method.

[0038] According to an embodiment of the present application, by designing the fixing groove in the fixing part to be a groove matching the rod body of the nozzle cross bar, the contact area and fit between the fixing part and the nozzle cross bar can be increased, thereby helping to improve the stability of the fixing part in fixing the nozzle cross bar.

[0039] In one embodiment, the driving unit includes at least one motor 5; the motor 5 is used to drive the displacement adjustment component to move, thereby driving the adjustment arm 2 to move.

[0040] According to the embodiments of the present application, it should be noted that: like Figure 1 As shown, the motor 5 is used to provide power for the rack 9 to move in the slide rail 10. Preferably, the motor 5 is a stepper motor. A stepper motor is an open-loop control element stepper motor that can convert an electrical pulse signal into an angular displacement or a linear displacement. Each time a pulse signal is input, the stepper motor will rotate a fixed angle (called a step angle). Therefore, by accurately controlling the number and frequency of input pulses, it is possible to accurately control the rotation of the stepper motor shaft, and then accurately control the moving distance and speed of the rack 9 in the slide rail 10. That is, in the process of adjusting the nozzle angle, when it is observed that the nozzle angle is at the target position, the fluid can be sprayed to the substrate surface through the nozzle for testing. In this embodiment, the target position refers to the area sprayed by the nozzle on the substrate to meet the semiconductor cleaning process requirements, so that all nozzles spray liquid to ensure that the entire substrate surface is covered. In this embodiment, the motor controls the rack to slide until the fixed part moves to the target position, and the operating parameters of the motor can be obtained, namely the number and frequency of pulses. In addition, the stepper motor also has a self-locking function, that is, when there is no input pulse, the motor shaft will remain in the current position and will not rotate due to external force. This characteristic enables the stepper motor to provide stable power when driving the rack 9 to move, ensuring that the rack 9 moves smoothly and accurately in the slide rail 10. Among them, the motor shaft is a component of the motor 5, and the motor shaft is inserted into the shaft hole of the gear 8 to drive the rack 9 to move in the slide rail 10.

[0041] According to the embodiments of the present application, the motor can accurately control the moving distance and speed of the rack in the slide rail, thereby improving the accuracy of the angle adjustment. The motor's operating parameters can also be obtained to facilitate the subsequent control of the operation of the motor in the nozzle angle adjustment device for other cleaning chambers, thereby ensuring rapid and accurate adjustment of the nozzle angles on all nozzle cross bars.

[0042] According to the embodiments of the present application, the position of the adjusting arm can be accurately adjusted through the rack, the slide rail and the gear of the transmission unit, thereby improving the accuracy of adjusting the angle of the nozzle on the nozzle cross bar.

[0043] In one embodiment, the substrate 1 is a wafer-like structure.

[0044] According to the embodiments of the present application, it should be noted that: Wafer-like structures refer to structures with similar features and morphology to wafer standard parts. The structure of substrate 1 imitates the structure of wafer standard parts. Specifically, substrate 1 has some key features of a wafer, such as planarity, circular profile, and a certain thickness. Here, the size of the wafer-like structure is not specifically limited, and its size can be set according to the semiconductor manufacturing process.

[0045] According to the embodiments of the present application, by imitating the shape of a wafer, the angle of the nozzle can be accurately adjusted, thereby helping to improve the accuracy of adjusting the angle of the nozzle.

[0046] In one embodiment, the sliding sleeve rod 7 includes: an external sleeve 11 and a telescopic tube 12; the telescopic tube 12 is inserted into the hollow portion of the external sleeve 11 and can slide along the inner wall of the external sleeve 11 to achieve telescopic movement; the telescopic tube 12 is used to adjust the position of the nozzle cross bar through telescopic movement.

[0047] According to the embodiments of the present application, it should be noted that: like Figure 3 As shown, the external sleeve 11 is a tubular structure, and the external sleeve 11 is used to provide an external environment for protection and support for the telescopic rod 12. The external sleeve 11 includes a hollow portion, and the telescopic tube 12 is inserted into the hollow portion of the external sleeve 11 and can slide along the inner wall of the external sleeve 11 to achieve telescopic movement; the telescopic tube 12 is used to adjust the position of the nozzle cross bar through telescopic movement. In addition, the external sleeve 11 can also have waterproof, dustproof or corrosion-resistant functions to protect the telescopic tube 12 and other components connected thereto from damage by the external environment.

[0048] like Figure 3 As shown, the hollow portion of the external sleeve 11 is used to place the telescopic tube 12, and the external sleeve 11 and the telescopic rod can be connected by plug-in.

[0049] According to the embodiment of the present application, the hollow portion of the outer sleeve is used to provide a protective and supporting external environment for the telescopic tube, so that it can maintain stable telescopic and movable when the angle needs to be adjusted. At the same time, the movement of the telescopic tube relative to the outer sleeve can adjust the position of the nozzle crossbar, thereby helping to improve the flexibility of adjusting the nozzle angle.

[0050] In one embodiment, the drive unit further includes: a motor bracket 6 ; the motor bracket 6 is used to carry the motor 5 .

[0051] According to the embodiments of the present application, it should be noted that: like Figure 1As shown, the motor bracket 6 can be respectively arranged on one side or both sides of the base. The shape and size of the motor bracket 6 can be set according to the size or shape of the motor 5, such as a fan-shaped plate, a circular plate, etc. The specific installation position of the motor bracket 6 can be designed according to actual needs, such as being installed on the right edge of the first surface of the base. Here, the shape and size of the motor bracket 6 are not specifically limited, and its shape and size can be set according to the shape and size of the motor 5. The specific installation position of the motor bracket 6 is not limited, and its specific installation position can be set according to actual needs.

[0052] As an embodiment, adjustment arms are provided on both sides of the substrate, thereby enabling adjustment of the nozzle angle on the nozzle crossbar corresponding to the different surfaces of the substrate to be cleaned. According to the embodiment of the present application, by providing motor brackets on the two surfaces of the base, the motor brackets can effectively prevent the motor from shaking or tilting during operation, thereby improving the stability of the nozzle angle adjustment device for the entire cleaning chamber. The two adjustment arms can be connected to the motor through different transmission units, that is, two motors and two sets of gear and rack structures are provided on the base.

[0053] The present application embodiment provides a nozzle angle adjustment system for a cleaning chamber, such as Figure 4 As shown, the system includes: At least one cleaning chamber nozzle angle adjustment device is used to adjust the angles of multiple nozzles on the target nozzle crossbar; one of the cleaning chamber nozzle angle adjustment devices is used as a target reference, which is called a first adjustment device in this embodiment, and can first adjust the angle of the nozzle on the nozzle crossbar. The first adjustment device includes a distance sensor for measuring the moving distance of the rack, and the distance between the connection between the adjustment arm and the rack and the orthographic projection of the above-mentioned fixed part on the substrate is calculated based on the moving distance of the rack, and the moving distance of the rack is used as the target length; the target nozzle crossbar is provided in the fixing groove of the first adjustment device, and the driving unit of the first adjustment device is used to control the fixing part to move to the target position; The controller is connected to the distance sensor and the drive unit, and is used to obtain the target length, and calculate the angle between the adjustment arm and the substrate according to the target length, that is, to obtain the nozzle angle on the spray crossbar on the fixed part. The controller of this embodiment obtains the target length as a reference, which can be used to subsequently control the nozzle angle adjustment of other nozzle crossbars to achieve systematic control. The steps in this embodiment: calculate the angle between the adjustment arm and the substrate according to the target length. This step can be implemented by the calculation unit in the controller. The calculation principle adopts the description of the embodiment of the nozzle angle adjustment device for the cleaning chamber mentioned above, using the characteristics of the right triangle.

[0054] The nozzle angle adjustment device for the cleaning chamber is the nozzle angle adjustment device for the cleaning chamber described above.

[0055] In one embodiment, after the CMP process is completed, the nozzle bar used for different chemicals or tools for different polishing processes is different. The target nozzle bar refers to any one of the nozzle bars used for different chemicals or tools for different polishing processes.

[0056] In one embodiment, the distance sensor is used to measure the linear distance that the rack moves on the substrate to obtain the target length; the distance sensor can be a laser distance sensor, an infrared distance sensor, or an ultrasonic distance sensor, etc. Here, the type of distance sensor is not specifically limited, and its type can be set according to the requirements of the semiconductor process. The target length is the distance between the intersection of the extension line of the adjustment arm and the substrate and the orthographic projection of the fixing part on the substrate on the surface of the substrate after the angle adjustment of the nozzle angle adjustment device for the cleaning chamber is completed.

[0057] According to the embodiments of the present application, the target length is obtained through the distance sensor, and the target length can be quickly copied to other machines, thereby improving the efficiency of the nozzle angle adjustment system for the cleaning chamber.

[0058] In one embodiment, the nozzle angle adjustment system for the cleaning chamber further includes: a calculation unit, which is used to calculate based on the target length to obtain the angle of the nozzle on the first nozzle cross bar.

[0059] In one embodiment, the distance sensor obtains a target length of L, and a perpendicular line is drawn between the fixed part and the substrate, that is, the orthographic projection of the fixed part on the substrate is obtained. In the right triangle formed by the perpendicular line between the fixed part and the substrate and the slide rail, the length of one right-angled side is A, which is the distance between the fixed part, that is, the nozzle crossbar, and the substrate. This distance value remains unchanged when the nozzle angle is adjusted; the length of the other right-angled side is L, which represents the distance between the connection between the adjustment arm and the rack and the orthographic projection of the fixed part on the substrate. The above target length, that is, the moving distance of the rack, causes the change of L. According to the formula of the Pythagorean theorem, the values ​​of L and A are substituted into the formula, that is, the change of L can cause the change of the hypotenuse, which is the sliding sleeve rod. The length of the sliding sleeve rod remains unchanged during the nozzle angle adjustment. When the length of the hypotenuse remains unchanged, it further causes the change of the angle between the rack and the sliding sleeve rod, that is, the change of the angle between the adjustment arm and the substrate, that is, the change of the nozzle angle is completed. Based on this, this embodiment drives the fixed part to move through the displacement adjustment component and then drives the spray crossbar to move, thereby realizing the adjustment of the nozzle angle in three-dimensional space.

[0060] According to the embodiments of the present application, through the design of the nozzle angle adjustment device, distance sensor and calculation unit for the cleaning chamber, the angle of the nozzle on the target nozzle crossbar can be quickly copied to other machines, thereby improving the efficiency and accuracy of the nozzle angle adjustment system for the cleaning chamber.

[0061] In the description of this specification, it should be understood that, unless otherwise expressly specified and limited, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0062] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0063] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0064] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0065] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0066] The above specific implementations do not constitute a limitation on the protection scope of this application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included in the protection scope of this application.

Claims

1. A nozzle angle adjustment device for a cleaning chamber, characterized in that: include: Base, removable adjustment arm; The base comprises: a base plate, a driving unit and a transmission unit; The adjusting arm is located at one side of the base plate, and the adjusting arm comprises a fixing part and a sliding sleeve rod, wherein the fixing part is located at one end of the sliding sleeve rod, and the other end of the sliding sleeve rod is connected to the transmission unit, and the fixing part has an orthographic projection located on the base plate; a fixing groove is provided in the fixing part of the adjusting arm, and the fixing groove is used to fix the nozzle cross bar; The driving unit is located on the substrate, and is used to drive the transmission unit to drive the fixing part to move so as to adjust the position of the orthographic projection of the fixing part on the substrate, so as to adjust the nozzle angle on the nozzle crossbar.

2. The device according to claim 1, characterized in that The fixing part is an openable and closable structure, and includes a first fixing part and a second fixing part; the fixing groove is a groove formed by the cooperation of the first surface of the first fixing part and the second surface of the second fixing part, and matches the rod body of the nozzle cross rod.

3. The device according to claim 1, characterized in that The transmission unit comprises a displacement adjustment component; the driving unit is connected to the displacement adjustment component, and the sliding sleeve rod is driven to move along the radial direction of the base plate through the displacement adjustment component.

4. The device according to claim 3, characterized in that The displacement adjustment assembly includes a slide rail, a rack and a gear; the slide rail is arranged on the base plate and extends in a direction parallel to the radial direction of the base plate, the rack is placed in the slide rail and moves in the slide rail; the rack is connected to the sliding sleeve rod, and the rack is meshed with the gear; the driving unit includes a motor, and the motor is connected to the gear to drive the rack and the sliding sleeve rod to move.

5. The device according to claim 1 or claim 3, characterized in that: The transmission unit further comprises an angle adjustment portion for adjusting the included angle between the sliding sleeve rod and the base plate, and the adjustment range of the included angle between the sliding sleeve rod and the base plate is 30°-70°.

6. The device according to claim 3, characterized in that The driving unit further includes: an electric motor and a motor bracket; the motor bracket is used to carry the motor, and the motor is connected to the displacement adjustment component.

7. The device according to claim 1, characterized in that There are two adjusting arms, which are respectively arranged on two sides of the base plate, and the two adjusting arms are respectively connected to the driving unit through the transmission unit.

8. The device according to claim 1, characterized in that The sliding sleeve rod comprises: an external sleeve and a telescopic tube; the telescopic tube is inserted into the hollow part of the external sleeve and can slide along the inner wall of the external sleeve to realize the telescopic movement of the sliding sleeve rod.

9. The device according to claim 3, characterized in that A distance sensor is also included, and the distance sensor is used to measure the moving distance of the displacement adjustment component on the substrate.

10. A nozzle angle adjustment system for a cleaning chamber, characterized in that: The system comprises: The nozzle angle adjustment device for a cleaning chamber according to any one of claims 1 to 8, the nozzle angle adjustment device for a cleaning chamber comprising a distance sensor, the distance sensor being used to measure the moving distance of the sliding sleeve rod on the substrate where it is connected to the transmission unit, the moving distance being used as the target length; a target nozzle cross bar is provided in the fixing groove, and the driving unit is used to control the fixing portion to move to the target position; A controller is connected to the distance sensor and the driving unit, and is used to obtain the target length, and calculate the angle between the adjustment arm and the substrate according to the target length.

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