Integrated thin-wall die casting die offset correction system, method, equipment and medium

Abstract

The invention discloses an integrated thin-wall die casting mold offset correction system, method and equipment and a medium, and relates to the technical field of machining and manufacturing. The mold comprises a first mold body and a second mold body, the first mold body is provided with at least one guide column, the second mold body is provided with at least one guide sleeve, and the guide sleeve is internally provided with a guide channel for the guide column to move, the system comprises a controller, an adjusting mechanism and a distance measuring mechanism, the adjusting mechanism is mechanically connected with the first mold body, and the distance measuring mechanism is arranged in the guide column. A probe of the distance measuring mechanism is not higher than the outer surface of the guide pillar, and the detection direction is perpendicular to the extension direction of the guide pillar; the distance measuring mechanism can measure the gap value between the guide column and the guide sleeve, the controller can compare the gap value with a preset threshold range, if the gap value exceeds the preset threshold range, the mold offset is calculated according to the gap value, and a correction instruction is sent to the adjusting mechanism so that the gap value can be within the preset threshold range. Therefore, the gap value between the guide pillar and the guide sleeve can be accurately measured, and the mold offset can be automatically corrected.

Description

Technical Field

[0001] The present application relates to the field of processing and manufacturing technology, and in particular to an integrated thin-wall die casting mold offset correction system, method, equipment and medium. Background Art

[0002] With the continuous development of the manufacturing industry, one-piece large-scale thin-walled aluminum-magnesium alloy die-casting molds have gradually been put into use. The cross-sectional area of ​​the die-casting is greater than 1.2 square meters, and the wall thickness is 2 mm to 7 mm. One-piece large-scale thin-walled aluminum-magnesium alloy die-casting molds refer to a new type of mold formed by assembling multiple interrelated parts that need to be assembled in the initial design of the die-casting as a whole. Through the one-piece large-scale thin-walled aluminum-magnesium alloy die-casting mold, multiple parts can be die-cast into one die-casting, that is, there is no need to die-cast the parts separately and assemble them into multiple parts.

[0003] However, the one-piece large thin-walled aluminum-magnesium alloy die-casting mold often sinks due to its own excessive weight and vibration during movement, that is, the movable mold and the fixed mold are offset, affecting the die-casting quality of the die-casting. When the movable mold and the fixed mold are offset, the staff must first use feeler gauges of different thicknesses to measure the gap between the guide pin and the guide sleeve and estimate the mold offset, and then add iron sheets to minimize the mold offset. The operation is cumbersome and the accuracy is not high. Summary of the invention

[0004] In view of the above-mentioned defects or deficiencies in the related art, it is desired to provide an integrated thin-wall die casting mold offset correction system, method, equipment and medium, which can accurately measure the gap between the guide pin and the guide sleeve, and automatically and efficiently correct the mold offset.

[0005] In a first aspect, the present application provides an integrated thin-wall die casting mold offset correction system, the mold comprising a first mold and a second mold, the first mold is provided with at least one guide post, the second mold is provided with at least one guide sleeve, the guide sleeve has a guide channel for the guide post to move, the mold offset correction system comprises a controller and an adjustment mechanism and a distance measuring mechanism communicatively connected to the controller, the adjustment mechanism is mechanically connected to the first mold, the distance measuring mechanism is arranged in the guide post, the probe of the distance measuring mechanism is not higher than the outer surface of the guide post, and the detection direction is perpendicular to the extension direction of the guide post; The distance measuring mechanism is configured to measure the gap value between the guide pin and the guide sleeve; the controller is configured to compare the gap value with a preset threshold range, and if the gap value exceeds the preset threshold range, calculate the mold offset according to the gap value, and send a correction instruction to the adjustment mechanism to adjust the position of the first mold so that the gap value is within the preset threshold range.

[0006] Optionally, in some embodiments of the present application, the probe of the ranging mechanism includes a first probe and a second probe, the first probe is configured to measure the upper gap value from the guide post to the guide sleeve, and the second probe is configured to measure the lower gap value from the guide post to the guide sleeve.

[0007] Optionally, in some embodiments of the present application, at least two countersunk holes are provided on the guide column, and the two countersunk holes are symmetrically distributed on both sides of the extension direction, and the first probe is arranged in one of the two countersunk holes and the second probe is arranged in the other one.

[0008] Optionally, in some embodiments of the present application, the mold offset correction system further includes an external display screen communicatively connected to the distance measuring mechanism, and the external display screen is configured to display the gap value in real time.

[0009] Optionally, the distance measuring mechanism in some embodiments of the present application includes an ultrasonic distance measuring device and a laser distance measuring device.

[0010] In a second aspect, the present application provides a method for correcting an offset of an integrated thin-wall die casting mold, the method for correcting an offset of the mold being used in a controller of a mold offset correction system described in any one of the first aspects, the method for correcting an offset of the mold comprising: Obtaining a gap value between the guide pin and the guide sleeve, wherein the gap value is measured by a distance measuring mechanism of the mold offset correction system; The gap value is compared with a preset threshold range. If the gap value exceeds the preset threshold range, the mold offset is calculated based on the gap value, and a correction instruction is sent to the adjustment mechanism of the mold offset correction system to adjust the position of the first mold so that the gap value is within the preset threshold range.

[0011] Optionally, in some embodiments of the present application, the gap value includes an upper gap value from the guide pin to the guide sleeve and a lower gap value from the guide pin to the guide sleeve, and the mold offset is the lower gap value minus the upper gap value; When the first mold is a fixed mold and the second mold is a movable mold, if the mold offset is a negative value, it is determined that the first mold sinks, and if the mold offset is a positive value, it is determined that the second mold sinks; Alternatively, when the first mold is a movable mold and the second mold is a fixed mold, if the mold offset is a negative value, it is determined that the first mold has sunk, and if the mold offset is a positive value, it is determined that the second mold has sunk.

[0012] Optionally, in some embodiments of the present application, before calculating the mold offset according to the gap value, the method also includes, when more than two guide pins and more than two guide sleeves are located on the same side of the mold, respectively calculating a first average value corresponding to each upper gap value and a second average value corresponding to each lower gap value; if both the first average value and the second average value exceed the preset threshold range, then selecting an upper gap value and a lower gap value corresponding to a guide pin and a guide sleeve from the same side of the mold, and calculating the mold offset.

[0013] In a third aspect, the present application provides a terminal device, comprising a processor and a memory, wherein the memory stores at least one instruction, at least one program, a code set or an instruction set, and the instruction, the program, the code set or the instruction set is loaded and executed by the processor to implement the steps of the mold offset correction method described in any one of the second aspects.

[0014] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the steps of the mold offset correction method described in any one of the second aspects.

[0015] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages: The embodiments of the present application provide an integrated thin-wall die casting mold offset correction system, method, equipment and medium, which accurately measures the gap value between the guide pin and the guide sleeve through a distance measuring mechanism, so that the controller can directly compare the gap value with the size of a preset threshold range, and when the gap value exceeds the preset threshold range, after calculating the mold offset according to the gap value, automatically send a correction instruction to the adjustment mechanism to adjust the position of the first mold so that the gap value is within the preset threshold range, thereby efficiently correcting the mold offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic structural diagram of an integrated thin-wall die casting mold offset correction system provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of another integrated thin-wall die casting mold offset correction system provided in an embodiment of the present application; Figure 3A schematic diagram of a process flow of a method for correcting an offset of an integrated thin-wall die casting mold provided in an embodiment of the present application; Figure 4 A schematic diagram of a cross-section of a mold after a movable mold and a fixed mold are molded together according to an embodiment of the present application; Figure 5 A structural block diagram of a terminal device provided in an embodiment of the present application.

[0018] Reference numerals: 1-mold offset correction system, 11-controller, 12-adjustment mechanism, 13-distance measuring mechanism, a1-guide post, a2-guide sleeve, a3-countersink, b1-detection direction, b2-extension direction of guide post, 2-terminal device, 21-processor, 22-memory. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Figures 1 to 5 The integrated thin-wall die casting mold offset correction system, method, equipment and medium provided in the embodiments of the present application are described in detail.

[0022] Please refer to Figure 1, which is a structural schematic diagram of an integrated thin-wall die casting mold offset correction system provided in an embodiment of the present application. The mold includes a first mold and a second mold, the first mold is provided with at least one guide post a1, and the second mold is provided with at least one guide sleeve a2, the guide sleeve a2 has a guide channel for the guide post a1 to move, wherein the guide post a1 can be installed on the side wall or base of the first mold, and the guide sleeve a2 can be installed on the side wall or base of the second mold. The mold offset correction system 1 includes a controller 11 and an adjustment mechanism 12 and a distance measuring mechanism 13 that are communicatively connected to the controller 11, the adjustment mechanism 12 is mechanically connected to the first mold, the distance measuring mechanism 13 is arranged in the guide post a1, the probe of the distance measuring mechanism 13 is not higher than the outer surface of the guide post a1, and the detection direction b1 is perpendicular to the extension direction b2 of the guide post a1. The advantage of such a setting is that the probe of the distance measuring mechanism 13 is not damaged, and the gap value measured by the distance measuring mechanism 13 is the minimum value, which is more accurate.

[0023] In actual use, during the movement of the movable mold or after the movable mold and the fixed mold are molded together, the distance measuring mechanism 13 can measure the gap value between the guide pin a1 and the guide sleeve a2. The distance measuring mechanism 13 includes but is not limited to ultrasonic distance measuring instruments and laser distance measuring instruments, etc., wherein the movable mold refers to the movable side mold of the die casting mold, and the fixed mold refers to the fixed side mold of the die casting mold. The controller 11 can compare the gap value with the preset threshold range. If the gap value exceeds the preset threshold range, the mold offset is calculated according to the gap value, and a correction instruction is sent to the adjustment mechanism 12 to adjust the position of the first mold so that the gap value is within the preset threshold range. For example, the controller 11 is a general control device for coordinating and directing various mechanisms, including but not limited to microprocessors and chips, etc. For another example, the preset threshold range is [0mm, 50mm]. It can be understood that the preset threshold range is set according to the needs of the user.

[0024] For example, the probe of the distance measuring mechanism 13 in the embodiment of the present application may include a first probe and a second probe, wherein the first probe can measure the upper gap value L1 from the guide post a1 to the guide sleeve a2, and the second probe can measure the lower gap value L2 from the guide post a1 to the guide sleeve a2, thereby simultaneously obtaining the upper and lower gap values ​​of the guide post a1 and the guide sleeve a2. For example, the first probe and the second probe may belong to different distance measuring instruments, that is, the first probe belongs to the first distance measuring instrument, and the second probe belongs to the second distance measuring instrument. For another example, the first probe and the second probe may also belong to the same distance measuring instrument. The advantage of such a setting is that it occupies a small space of the guide post and is convenient for integrated control.

[0025] Furthermore, if Figure 2As shown, in the embodiment of the present application, at least two countersunk holes a3 may be provided on the guide post a1, and the two countersunk holes a3 are symmetrically distributed on both sides of the extension direction b2, that is, the two countersunk holes a3 are not through, and one of the two countersunk holes a3 is provided with a first probe and the other is provided with a second probe, which is convenient for installation. For example, the countersunk hole a3 may be located at the midline position of the guide post a1 (corresponding to Figure 2 As shown), or it may be located on both sides of the midline position. For example, the midline position of the guide column a1 and both sides of the midline position may be provided with countersunk holes a3 to install the distance measuring probe, thereby being able to more accurately determine the gap changes between each position of the guide column a1 and the guide sleeve a2.

[0026] Furthermore, in the embodiment of the present application, the mold offset correction system 1 may also include an external display screen that is communicatively connected to the distance measuring mechanism 13. The advantage of such a setting is that the gap value between the guide column a1 and the guide sleeve a2 during the movement of the movable mold can be displayed in real time through the external display screen, which is convenient for staff to monitor.

[0027] The integrated thin-wall die-casting mold offset correction system provided in the embodiment of the present application uses a distance measuring mechanism to accurately measure the gap value between the guide pin and the guide sleeve, so that the controller can directly compare the gap value with the size of the preset threshold range, and when the gap value exceeds the preset threshold range, after calculating the mold offset according to the gap value, automatically send a correction instruction to the adjustment mechanism to adjust the position of the first mold so that the gap value is within the preset threshold range, thereby efficiently correcting the mold offset.

[0028] Based on the above embodiments, the present application provides a method for correcting the offset of an integrated thin-wall die casting mold. Figure 3 , which is a schematic flow chart of a one-piece thin-wall die casting mold offset correction method provided in an embodiment of the present application. The mold offset correction method can be used for Figure 1 to Figure 2 Corresponding to the controller 11 of the mold offset correction system 1 in the embodiment, the mold offset correction method specifically includes the following steps: S101, obtaining a clearance value between a guide pin and a guide sleeve, wherein the clearance value is measured by a distance measuring mechanism of a mold offset correction system.

[0029] S102, comparing the gap value with a preset threshold range. If the gap value exceeds the preset threshold range, calculating the mold offset according to the gap value, and sending a correction instruction to the adjustment mechanism of the mold offset correction system to adjust the position of the first mold so that the gap value is within the preset threshold range.

[0030] For example, taking the left and right molds as an example, the guide pin a1 moves horizontally in the guide sleeve a2. The embodiment of the present application can use the distance measuring mechanism 13 to simultaneously measure the upper clearance value L1 from the guide pin a1 to the guide sleeve a2 and the lower clearance value L2 from the guide pin a1 to the guide sleeve a2. Since a certain clearance fluctuation is allowed between the movable mold and the fixed mold during the mold closing process, and the fluctuation amount of the upper and lower clearance values ​​between a guide pin a1 and a guide sleeve a2 should be consistent, for example, if the upper clearance value decreases by 5mm, the lower clearance value should increase by 5mm. Therefore, the embodiment of the present application can set the same preset threshold range for the fluctuation amount of the upper and lower clearance values, so as to facilitate the determination of whether the upper and lower clearance values ​​between the guide pin a1 and the guide sleeve a2 are abnormal. For example, the preset threshold range can be [0mm, 50mm].

[0031] In the process of the controller 11 monitoring the upper and lower gap values ​​between the guide pin a1 and the guide sleeve a2 in real time, since the fluctuation of the upper and lower gap values ​​should be consistent, the controller 11 can monitor in real time whether one of the upper and lower gap values ​​between the guide pin a1 and the guide sleeve a2 exceeds the preset threshold range, and can also simultaneously monitor whether both of the upper and lower gap values ​​between the guide pin a1 and the guide sleeve a2 exceed the preset threshold range. If the gap value exceeds the preset threshold range, the controller 11 can calculate the mold offset according to the gap value, and adjust the movable mold through the movable mold adjustment mechanism to reduce or eliminate the mold offset, so that the gap value returns to the preset threshold range. It should be noted that in actual use, the adjustment of the movable mold is more convenient than the adjustment of the fixed mold, so the movable mold is generally adjusted. Of course, the fixed mold can also be adjusted according to the situation, and there is no limitation on this.

[0032] Specifically, in the process of adjusting the movable mold by the movable mold adjustment mechanism, the controller 11 can obtain the gap value between the guide column a1 and the guide sleeve a2 measured by the distance measuring mechanism 13 for multiple times. If the gap value is within the preset threshold range, the controller 11 ends the adjustment of the movable mold. Optionally, the controller 11 can also issue a prompt to the staff when the gap value exceeds the preset threshold range, indicating the movable mold height value that needs to be adjusted, so that the movable mold can be adjusted by the staff. When the staff adjusts the movable mold, first stop the machine of the mold, then loosen the locking column of the die-casting machine, and finally correct the movable mold height value through a jack-like device on the movable mold base. Similarly, in the process of adjusting the movable mold by the staff, the controller 11 can obtain the gap value between the guide column a1 and the guide sleeve a2 measured by the distance measuring mechanism 13 for multiple times, and display it on the external display screen, so that the staff can confirm whether the gap value has returned to the preset threshold range based on the real-time gap value displayed on the external display screen. If the gap value is within the preset threshold range, the adjustment of the movable mold is ended.

[0033] Furthermore, when calculating the mold offset according to the gap value, the embodiment of the present application can use the calculation result of the lower gap value L2 minus the upper gap value L1 as the mold offset. According to the installation position of the guide pin a1 and the installation position of the guide sleeve a2, the positive or negative value of the mold offset can indicate the sinking of the mold. When the first mold is a fixed mold and the second mold is a movable mold, if the mold offset is a negative value, it is determined that the first mold has sunk, and if the mold offset is a positive value, it is determined that the second mold has sunk; or, when the first mold is a movable mold and the second mold is a fixed mold, if the mold offset is a negative value, it is determined that the first mold has sunk, and if the mold offset is a positive value, it is determined that the second mold has sunk. Of course, other embodiments of the present application can also use the calculation result of the upper gap value L1 minus the lower gap value L2 as the mold offset. According to the installation position of the guide pin a1 and the installation position of the guide sleeve a2, when the first mold is a fixed mold and the second mold is a movable mold, if the mold offset is a negative value, it is determined that the second mold has sunk, and if the mold offset is a positive value, it is determined that the first mold has sunk; or, when the first mold is a movable mold and the second mold is a fixed mold, if the mold offset is a negative value, it is determined that the second mold has sunk, and if the mold offset is a positive value, it is determined that the first mold has sunk.

[0034] Furthermore, before calculating the mold offset according to the gap value, when more than two guide pins a1 and more than two guide sleeves a2 are located on the same side of the mold, the first average value corresponding to each upper gap value L1 and the second average value corresponding to each lower gap value L2 are calculated respectively. If both the first average value and the second average value exceed the preset threshold range, an upper gap value L1 and a lower gap value L2 corresponding to a guide pin a1 and a guide sleeve a2 are selected from the same side of the mold, and the mold offset is calculated, for example, the calculation result of subtracting the upper gap value L1 from the lower gap value L2 is used as the mold offset. It should be noted that when a mold has multiple guide pins a1 and guide sleeves a2, the first side portion may refer to multiple guide pins a1 and multiple guide sleeves a2 on the left side of the mold, or multiple guide pins a1 and multiple guide sleeves a2 on the upper side of the mold, and the second side portion may refer to multiple guide pins a1 and multiple guide sleeves a2 on the right side of the mold, or multiple guide pins a1 and multiple guide sleeves a2 on the lower side of the mold. When the controller 11 monitors the offset between the guide pin a1 and the guide sleeve a2, it can calculate the average value of the gap values ​​between the multiple guide pins a1 and the multiple guide sleeves a2 on the same side as described above to make a judgment. In addition, if the offset of the first side is different from the offset of the second side, the corresponding positions of the mold can be adjusted respectively.

[0035] For example Figure 4 As shown, it is a schematic diagram of a cross-section of a mold after the movable mold and the fixed mold are combined according to an embodiment of the present application, wherein the black area represents the cross-section area of ​​the guide pin, the gray area represents the cross-section area of ​​the guide sleeve, and each of the four corners of the mold has a guide pin a1 and a guide sleeve a2. At this time, Figure 4 The first side portion is the left side (solid line frame in the figure), and the second side portion is the right side (dashed line frame in the figure). The controller 11 monitors the first average value corresponding to the upper gap value between the two guide pins a1 and the guide sleeve a2 on the left side, that is, the average value of L3 and L4, and the second average value corresponding to the lower gap value between the two guide pins a1 and the guide sleeve a2 on the left side, that is, the average value of L5 and L6. The right side is the same monitoring principle. It can be understood that Figure 4 This is only an example to simply illustrate the monitoring of the gap value when there are multiple guide pins a1 and multiple guide sleeves a2. In actual situations, the cross-sectional areas of the guide pins a1 and the guide sleeves a2 do not occupy too large an area. The controller 11 of the embodiment of the present application can only monitor the change in the average gap value of the first side or the second side, or can simultaneously monitor the change in the average gap value of the first side and the second side, so as to determine whether the mold is offset from multiple angles.

[0036] It should be noted that, for the description of the same steps and the same contents in this embodiment as those in other embodiments, reference can be made to the description in other embodiments and will not be repeated here.

[0037] The one-piece thin-wall die-casting mold offset correction method provided in the embodiment of the present application uses a distance measuring mechanism to accurately measure the gap value between the guide pin and the guide sleeve, so that the controller can directly compare the gap value with the size of the preset threshold range, and when the gap value exceeds the preset threshold range, after calculating the mold offset according to the gap value, automatically send a correction instruction to the adjustment mechanism to adjust the position of the first mold so that the gap value is within the preset threshold range, thereby efficiently correcting the mold offset.

[0038] Based on the above embodiments, the present application provides a terminal device. Figure 5 The terminal device 2 may include a processor 21 and a memory 22. The memory 22 stores at least one instruction, at least one program, code set or instruction set, which is loaded and executed by the processor 21 to implement Figure 3 to Figure 4 The steps of the mold offset correction method in the corresponding embodiment.

[0039] As another aspect, an embodiment of the present application provides a computer-readable storage medium for storing program code, wherein the program code is used to implement Figure 3 to Figure 4 The steps of the mold offset correction method in the corresponding embodiment.

[0040] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and modules described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0041] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or modules, which can be electrical, mechanical or other forms. The modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of this embodiment.

[0042] In addition, each functional module in each embodiment of the present application may be integrated into a processing unit, or each module may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of a software functional unit. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium.

[0043] Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the whole or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the mold offset correction method of each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., various media that can store program codes.

[0044] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. An integrated thin-wall die casting mold offset correction system, characterized in that: The mold comprises a first mold and a second mold, the first mold is provided with at least one guide column (a1), the second mold is provided with at least one guide sleeve (a2), the guide sleeve (a2) has a guide channel inside for the guide column (a1) to move, the mold offset correction system (1) comprises a controller (11), an adjustment mechanism (12) and a distance measuring mechanism (13) which are communicatively connected to the controller (11), the adjustment mechanism (12) is mechanically connected to the first mold, the distance measuring mechanism (13) is arranged in the guide column (a1), a probe of the distance measuring mechanism (13) is not higher than the outer surface of the guide column (a1), and the detection direction (b1) is perpendicular to the extension direction (b2) of the guide column (a1); The distance measuring mechanism (13) is configured to measure the gap value between the guide column (a1) and the guide sleeve (a2); the controller (11) is configured to compare the gap value with a preset threshold range, and if the gap value exceeds the preset threshold range, calculate the mold offset according to the gap value, and send a correction instruction to the adjustment mechanism (12) to adjust the position of the first mold so that the gap value is within the preset threshold range.

2. The mold offset correction system according to claim 1, characterized in that: The probe of the distance measuring mechanism (13) comprises a first probe and a second probe, wherein the first probe is configured to measure an upper gap value from the guide column (a1) to the guide sleeve (a2), and the second probe is configured to measure a lower gap value from the guide column (a1) to the guide sleeve (a2).

3. The mold offset correction system according to claim 2, characterized in that: The guide column (a1) is provided with at least two countersunk holes (a3), the two countersunk holes (a3) ​​are symmetrically distributed on both sides of the extension direction (b2), one of the two countersunk holes (a3) ​​is provided with the first probe and the other is provided with the second probe.

4. The mold offset correction system according to any one of claims 1 to 3, characterized in that: The mold offset correction system (1) also includes an external display screen that is communicatively connected to the distance measuring mechanism (13), and the external display screen is configured to display the gap value in real time.

5. The mold offset correction system according to claim 4, characterized in that: The distance measuring mechanism (13) comprises an ultrasonic distance measuring device and a laser distance measuring device.

6. A method for correcting the offset of an integrated thin-wall die casting mold, characterized in that: The mold offset correction method is used for a controller of a mold offset correction system according to any one of claims 1 to 5, and the mold offset correction method comprises: Obtaining a gap value between the guide pin and the guide sleeve, wherein the gap value is measured by a distance measuring mechanism of the mold offset correction system; The gap value is compared with a preset threshold range. If the gap value exceeds the preset threshold range, the mold offset is calculated based on the gap value, and a correction instruction is sent to the adjustment mechanism of the mold offset correction system to adjust the position of the first mold so that the gap value is within the preset threshold range.

7. The mold offset correction method according to claim 6, characterized in that: The gap value includes an upper gap value from the guide pin to the guide sleeve and a lower gap value from the guide pin to the guide sleeve, and the mold offset is the lower gap value minus the upper gap value; When the first mold is a fixed mold and the second mold is a movable mold, if the mold offset is a negative value, it is determined that the first mold sinks, and if the mold offset is a positive value, it is determined that the second mold sinks; Alternatively, when the first mold is a movable mold and the second mold is a fixed mold, if the mold offset is a negative value, it is determined that the first mold has sunk, and if the mold offset is a positive value, it is determined that the second mold has sunk.

8. The mold offset correction method according to claim 7, characterized in that: Before calculating the mold offset according to the gap value, the method further includes: When more than two guide pins and more than two guide sleeves are located on the same side of the mold, the first average value corresponding to each upper gap value and the second average value corresponding to each lower gap value are calculated respectively. If both the first average value and the second average value exceed the preset threshold range, the upper gap value and the lower gap value corresponding to a guide pin and a guide sleeve are selected from the same side of the mold, and the mold offset is calculated.

9. A terminal device, characterized in that: The terminal device includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, code set or instruction set, and the instruction, the program, the code set or the instruction set is loaded and executed by the processor to implement the steps of the mold offset correction method described in any one of claims 6 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the steps of the mold offset correction method according to any one of claims 6 to 8.

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