Laser processing method based on workpiece reverse modeling

Abstract

The invention discloses a laser processing method based on workpiece reverse modeling, which belongs to the field of laser processing, and comprises the following steps of: scanning a workpiece by using a laser scanner and performing reverse modeling to obtain a three-dimensional model of the workpiece; establishing a three-dimensional coordinate system by taking the three-dimensional model as a reference; based on the three-dimensional coordinate system, a primitive matrix is attached to the surface of the three-dimensional model, a preprocessing model is obtained, the primitive matrix comprises a plurality of oscillators which are distributed in order, and the oscillators are plane figures; wherein the step of attaching the element matrix to the surface of the three-dimensional model comprises the substeps of sequentially setting an attaching point position and an attaching direction of each oscillator on the surface of the three-dimensional model based on an arrangement rule of the plurality of oscillators, or searching the attaching point position and the attaching direction of each oscillator on the surface of the three-dimensional model based on a preset coordinate of each oscillator in the plurality of oscillators; according to the attaching point position and the attaching direction of each oscillator, the plurality of oscillators are sequentially attached, so that the machining precision of laser machining during remachining of the workpiece can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser processing method based on workpiece reverse modeling. Background Art

[0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beams and materials to perform cutting, welding, surface treatment, drilling and micro-processing on materials. Usually, in the fields of mechanical industry and electronic industry, it is necessary to reprocess the surface of the already formed workpiece to obtain structures such as holes and grooves. Due to the advantages of high precision and high efficiency, laser processing technology is often used to reprocess the already formed workpiece.

[0003] Usually, when laser processing technology is used to reprocess a formed workpiece, the reprocessing is performed based on a theoretical model of the workpiece that has been calculated in advance before the workpiece is formed. However, due to the error between the actual product after the workpiece is formed and the theoretical model before forming, the structure formed by reprocessing based on the theoretical model of the workpiece is prone to deviation, thereby reducing the processing accuracy of laser processing when the workpiece is reprocessed. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a laser processing method based on workpiece reverse modeling. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] In a first aspect, the present invention provides a laser processing method based on workpiece reverse modeling, comprising:

[0006] Use a laser scanner to scan the workpiece and reverse model it to obtain a three-dimensional model of the workpiece;

[0007] Establish a three-dimensional coordinate system with the three-dimensional model as reference;

[0008] Based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processed model, wherein the primitive matrix includes a number of orderly distributed arrays, and the arrays are plane graphics;

[0009] Based on the pre-processing model, the workpiece is laser processed;

[0010] Among them, the primitive matrix mapped on the surface of the three-dimensional model includes:

[0011] Based on the arrangement rules of several arrays, the attachment point and attachment direction of each array are sequentially set on the surface of the three-dimensional model, and several arrays are sequentially attached according to the attachment point and attachment direction of each array;

[0012] Alternatively, based on the preset coordinates of each array in the plurality of arrays, the attachment point and attachment direction of each array are searched on the surface of the three-dimensional model, and the plurality of arrays are attached in sequence according to the attachment point and attachment direction of each array.

[0013] In one embodiment of the present invention, the workpiece is a curved workpiece, and based on the arrangement rules of a plurality of arrays, the attachment direction of each array is sequentially set on the surface of the three-dimensional model, specifically including:

[0014] Based on the arrangement rules of several arrays and according to the curvature of the surface of the curved workpiece, the rotation angle and normal direction of each array are set in sequence on the surface of the three-dimensional model.

[0015] In one embodiment of the present invention, the workpiece is a quasi-rotational workpiece, which has a generatrix and a rotation axis. Based on the arrangement rules of a plurality of arrays, the attachment points of each array are sequentially set on the surface of the three-dimensional model, specifically including:

[0016] Dividing the surface of the three-dimensional model into a plurality of ring zones at equal intervals along the generatrix direction of the three-dimensional model, wherein the size of each ring zone along the rotation axis direction of the three-dimensional model is equal;

[0017] A cross section is set on any one of the plurality of annuli, wherein the cross section is perpendicular to the rotation axis of the three-dimensional model;

[0018] obtaining a ring profile between the cross section and the surface of the three-dimensional model;

[0019] Based on the arrangement rules of several arrays, the attachment point of each array is set in sequence on the circular contour with the busbar as the starting attachment point.

[0020] In one embodiment of the present invention, a plurality of array attachment points are sequentially arranged on the annular contour, specifically including:

[0021] The first attachment points are set in sequence on the annular contour according to the first preset spacing. When the spacing between the last first attachment point and the first first attachment point is less than the first preset spacing, the last first attachment point is cancelled. When the spacing between the last first attachment point and the first first attachment point is not enough to attach an array, the last first attachment point is cancelled.

[0022] In one embodiment of the present invention, a cross section is provided on any one of the plurality of annuli, specifically comprising:

[0023] On an Nth ring belt among the plurality of ring belts, second attachment points are sequentially set along a generatrix direction of the three-dimensional model at a second preset interval, where N is an integer greater than zero;

[0024] According to the number of the second attachment points and the length of the busbar on the Nth ring belt, a plurality of third attachment points are sequentially set on the Nth ring belt along the busbar direction of the three-dimensional model, and the plurality of third attachment points are evenly spaced.

[0025] A plurality of cross sections are respectively arranged at a plurality of third attachment points, and each cross section is perpendicular to the rotation axis of the three-dimensional model.

[0026] In one embodiment of the present invention, the arrays are arranged in a regular pattern of equal center and equal spacing or equal edge and equal spacing.

[0027] In one embodiment of the present invention, a plurality of arrays are sequentially attached according to the attachment point and attachment direction of each array, specifically including:

[0028] Determine the type and size of the Mth array corresponding to the Mth attachment point, where M is an integer greater than zero;

[0029] Adjust the rotation angle and normal direction of the Mth array, and attach the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model;

[0030] When the rotation angle of the Mth array is adjusted, the position of the M+1th attachment point is adjusted according to the preset contour distance between the Mth array and the M+1th array.

[0031] In one embodiment of the present invention, the three-dimensional model is composed of a plurality of triangular facets, the matrix has a center point and a plurality of feature points, and the plurality of feature points are sequentially connected to form the matrix, wherein when the matrix is ​​a polygonal structure, the feature points are vertices of the polygonal structure, and when the matrix is ​​a circular structure, the feature points are points evenly spaced on the circumference of the circular structure;

[0032] Attaching the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model, specifically including:

[0033] According to the distance between each feature point and the center point in the Mth array, search for points with a distance equal to the distance on the triangular facets around the Mth array in sequence;

[0034] Connect the multiple searched points in sequence to form the Mth array.

[0035] In one embodiment of the present invention, before the step of sequentially searching for points with a distance equal to the distance on the triangular facets around the Mth array according to the distance between each feature point and the center point in the Mth array, the method further includes:

[0036] Cover the Mth array to the Mth attachment point;

[0037] Get the first triangle patch that overlaps with the Mth array;

[0038] Cut the first triangular face to obtain a second triangular face;

[0039] Among the vertices of the first triangular facet and / or the second triangular facet, search for the position of the vertex whose distance from the center point of the Mth array is equal to the pitch.

[0040] In one embodiment of the present invention, cutting the first triangular face to obtain the second triangular face specifically includes:

[0041] The line between any two adjacent feature points in the array is used as the first cutting line.

[0042] Calculate the number of intersections between the first cutting line and the vertices of the first triangle;

[0043] When the number of intersection points is 0, the first triangular face is cut into a triangular region and a quadrilateral region by a first cutting line, a second cutting line is set, and the quadrilateral region is cut into two triangular regions by the second cutting line;

[0044] When there is one intersection point, the first triangular face is cut into two triangular areas by the first cutting line;

[0045] When there are two intersection points, the first cutting line is tangent to the first triangle, and no cutting operation is performed.

[0046] Compared with the prior art, the present invention has the following beneficial effects:

[0047] In the above scheme of the present application, first, a laser scanner is used to scan the workpiece and reverse modeling is performed to obtain a three-dimensional model of the workpiece, and then a three-dimensional coordinate system is established with the three-dimensional model as a reference. Then, based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processing model. The primitive matrix includes a number of orderly distributed arrays, and the array is a plane figure. Finally, based on the pre-processing model, the workpiece is laser processed. Using this method, a three-dimensional model of the formed workpiece is obtained through reverse modeling, and the position of the array is determined according to the three-dimensional model, wherein the position of the array is the processing position for reprocessing. The formed workpiece is reprocessed according to the position of the array, which can reduce the processing error of laser processing and improve the processing accuracy of laser processing when the workpiece is reprocessed.

[0048] Secondly, in an optional manner, the step of attaching the matrix of primitives on the surface of the three-dimensional model includes sequentially setting the attachment point and attachment direction of each array on the surface of the three-dimensional model based on the arrangement rule of the plurality of arrays, and sequentially attaching the plurality of arrays according to the attachment point and attachment direction of each array. In this way, when the preset coordinates of the array are unknown or there is an error in the preset coordinates of the array, this method can be used to segment the surface of the three-dimensional model by sequentially setting a plurality of arrays on the surface of the three-dimensional model, and then specific arrays for reprocessing can be searched and determined from the plurality of arrays, so that when the preset coordinates of the array are unknown, this method can be used to search and determine, or when there is an error in the preset coordinates of the array, this method can be used to improve the position accuracy of the array, thereby improving the accuracy of laser processing.

[0049] In addition, in another optional manner, based on the preset coordinates of each of the plurality of arrays, the attachment point and attachment direction of each array are searched on the surface of the three-dimensional model, and the plurality of arrays are attached in sequence according to the attachment point and attachment direction of each array. In this way, when the preset coordinates of the array are known and accurate, this method can be used to quickly determine the position of the array, thereby improving the efficiency of laser processing.

[0050] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of a laser processing method based on workpiece reverse modeling provided by an embodiment of the present invention;

[0052] Figure 2 is a schematic diagram of the steps of determining the attachment points of the array provided by an embodiment of the present invention;

[0053] Figure 3 is a schematic diagram of a three-dimensional model, a cross section, a profile, and attachment points in an embodiment of the present invention;

[0054] Figure 4 is a schematic diagram of the steps of setting multiple cross sections on a busbar in an embodiment of the present invention;

[0055] Figure 5 is a schematic diagram of the steps of attaching the array in an embodiment of the present invention;

[0056] Figure 6 is a schematic diagram of specific points and center points of a polygonal array and a circular array in an embodiment of the present invention;

[0057] Figure 7 is a schematic diagram of the steps of cutting triangular facets in an embodiment of the present invention;

[0058] Figure 8is a schematic diagram of a triangular facet and a cutting line in an embodiment of the present invention;

[0059] Fig. 9 is a schematic diagram of a three-dimensional model of a workpiece in an embodiment of the present invention;

[0060] Fig.10 is a schematic diagram of a primitive matrix in an embodiment of the present invention Figure 1 ;

[0061] Fig.11 is a schematic diagram of a primitive matrix in an embodiment of the present invention Figure 2 . DETAILED DESCRIPTION

[0062] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0063] Embodiment 1:

[0064] See also Figure 1 , Fig. 9 , Fig.10 and Fig.11 The embodiment of the present invention provides a laser processing method based on workpiece reverse modeling, comprising:

[0065] S1: Use a laser scanner to scan the workpiece and reverse model it to obtain a three-dimensional model of the workpiece;

[0066] S2: Establish a three-dimensional coordinate system based on the three-dimensional model;

[0067] S3: Based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processed model, where the primitive matrix includes a number of orderly distributed arrays, and the arrays are plane figures;

[0068] S4: Based on the pre-processing model, the workpiece is laser processed;

[0069] Among them, the primitive matrix mapped on the surface of the three-dimensional model includes:

[0070] Based on the arrangement rules of several arrays, the attachment point and attachment direction of each array are sequentially set on the surface of the three-dimensional model, and several arrays are sequentially attached according to the attachment point and attachment direction of each array;

[0071] In some embodiments of the present application, a workpiece is scanned by a laser scanner, and a three-dimensional model of the workpiece can be obtained by reverse modeling. The three-dimensional model is composed of a plurality of triangular facets, which are a basic geometric element used in computer graphics to describe the surface of a three-dimensional object. The triangular facets are composed of three vertices and three edges. A complex geometric shape can be constructed by combining a large number of adjacent triangular facets to describe the surface of a three-dimensional object.

[0072] In some embodiments of the present application, the array is a graphic element, and its shape can be circular, rectangular, parallelogram, etc., which is not limited in the embodiments of the present application.

[0073] In some embodiments of the present application, by attaching a primitive matrix to the surface of a three-dimensional model, an original file that can support three-dimensional curved surface laser processing can be obtained.

[0074] In some embodiments of the present application, the workpiece may be a planar workpiece, that is, the primitive matrix may be attached to a plane; the workpiece may also be a curved workpiece, that is, the primitive matrix may be attached to a curved surface.

[0075] In the above scheme of the present application, first, a laser scanner is used to scan the workpiece and reverse modeling is performed to obtain a three-dimensional model of the workpiece, and then a three-dimensional coordinate system is established with the three-dimensional model as a reference. Then, based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processing model. The primitive matrix includes a number of orderly distributed arrays, and the array is a plane figure. Finally, based on the pre-processing model, the workpiece is laser processed. Using this method, a three-dimensional model of the formed workpiece is obtained through reverse modeling, and the position of the array is determined according to the three-dimensional model, wherein the position of the array is the processing position for reprocessing. The formed workpiece is reprocessed according to the position of the array, which can reduce the processing error of laser processing and improve the processing accuracy of laser processing when the workpiece is reprocessed.

[0076] Secondly, in an optional manner, the step of attaching the matrix of primitives on the surface of the three-dimensional model includes sequentially setting the attachment point and attachment direction of each array on the surface of the three-dimensional model based on the arrangement rule of the plurality of arrays, and sequentially attaching the plurality of arrays according to the attachment point and attachment direction of each array. In this way, when the preset coordinates of the array are unknown or there is an error in the preset coordinates of the array, this method can be used to segment the surface of the three-dimensional model by sequentially setting a plurality of arrays on the surface of the three-dimensional model, and then specific arrays for reprocessing can be searched and determined from the plurality of arrays, so that when the preset coordinates of the array are unknown, this method can be used to search and determine, or when there is an error in the preset coordinates of the array, this method can be used to improve the position accuracy of the array, thereby improving the accuracy of laser processing.

[0077] In some embodiments of the present application, the workpiece is a curved workpiece, and based on the arrangement rules of a plurality of arrays, the attachment direction of each array is sequentially set on the surface of the three-dimensional model, specifically including:

[0078] Based on the arrangement rules of several arrays and according to the curvature of the surface of the curved workpiece, the rotation angle and normal direction of each array are set in sequence on the surface of the three-dimensional model.

[0079] It is understandable that when the workpiece is a curved workpiece, since the curvature of the curved surface will affect the attachment accuracy of the array, when attaching the element matrix on the workpiece surface, it is necessary to first determine the normal direction of the array according to the curvature of the curved surface, and then attach the array, so as to improve the attachment accuracy of the array. In addition, when the shape of the array is not circular, it is necessary to first determine the rotation angle of the array according to the curvature of the curved surface, and then attach the array, so as to further improve the attachment accuracy of the array, and further improve the processing accuracy of the workpiece during reprocessing.

[0080] In some embodiments of the present application, Figure 2 and Figure 3 As shown, the workpiece is a quasi-rotational workpiece, which has a generatrix and a rotation axis. Based on the arrangement rules of several arrays, the attachment points of each array are sequentially set on the surface of the three-dimensional model, specifically including:

[0081] S101: dividing the surface of the three-dimensional model into a plurality of ring zones at equal intervals along the generatrix direction of the three-dimensional model, wherein the size of each ring zone along the rotation axis direction of the three-dimensional model is equal;

[0082] S102: setting a cross section on any one of the plurality of annular belts, wherein the cross section is perpendicular to the rotation axis of the three-dimensional model;

[0083] S103: Acquire a ring profile between the cross section and the surface of the three-dimensional model;

[0084] S104: Based on the arrangement rules of the plurality of arrays, the attachment point of each array is sequentially set on the annular contour with the busbar as the starting attachment point.

[0085] It can be understood that the three-dimensional model of the quasi-rotational workpiece is a three-dimensional quasi-rotational model. Using the above method, the attachment points of the array can be determined according to the generatrix and rotation axis of the three-dimensional quasi-rotational model, thereby improving the accuracy of array attachment.

[0086] In some embodiments of the present application, the quasi-rotational workpiece may be a conical workpiece, a cylindrical workpiece, or the like.

[0087] In some embodiments of the present application, when the workpiece is a complex torsion workpiece, the three-dimensional model of the complex torsion workpiece can be cut first to obtain the three-dimensional model of the quasi-rotational part in the complex torsion workpiece, and then the attachment points of the array of the quasi-rotational part can be determined according to the above method.

[0088] In some embodiments of the present application, a plurality of array attachment points are sequentially arranged on the annular contour, specifically including:

[0089] The first attachment points are set in sequence on the annular contour according to the first preset spacing. When the spacing between the last first attachment point and the first first attachment point is less than the first preset spacing, the last first attachment point is cancelled. When the spacing between the last first attachment point and the first first attachment point is not enough to attach an array, the last first attachment point is cancelled.

[0090] It can be understood that arranging the attachment points of the array at equal intervals on an annular contour can further improve the accuracy of the array attachment, thereby further improving the processing accuracy of the workpiece during reprocessing.

[0091] In some embodiments of the present application, Figure 3 and Figure 4 As shown, a cross section is set on any one of the multiple annular belts, specifically including:

[0092] S201: On an Nth ring belt among the multiple ring belts, second attachment points are sequentially set along a generatrix direction of the three-dimensional model at a second preset interval, where N is an integer greater than zero;

[0093] S202: according to the number of the second attachment points and the length of the busbar on the Nth ring belt, a plurality of third attachment points are sequentially set on the Nth ring belt along the busbar direction of the three-dimensional model, and the plurality of third attachment points are evenly spaced;

[0094] S203: setting a plurality of cross sections at the plurality of third attachment points respectively, each cross section being perpendicular to the rotation axis of the three-dimensional model.

[0095] It can be understood that, on any ring belt, the attachment points in the busbar direction are initially positioned according to the second preset spacing, and then the attachment points are set on the busbar of the ring belt in an equally divided manner, so that the distribution of several arrays on the surface of the three-dimensional model is more uniform and orderly, thereby improving the processing accuracy of the workpiece during reprocessing.

[0096] In some embodiments of the present application, the arrays are arranged in an equi-center and equi-spaced pattern or in an equi-edge and equi-spaced pattern.

[0097] It can be understood that when the arrangement rule of several arrays is the center equal spacing arrangement, the center points of any two adjacent arrays in the several arrays are equal; when the arrangement rule of several arrays is the edge equal spacing arrangement, the edge lines of any two adjacent arrays in the several arrays are equal. Using this method, the attachment points of several arrays can be quickly determined on the surface of the three-dimensional model, and the distribution of the arrays is more uniform and orderly, which is convenient for realizing the automatic filling and attachment of the arrays.

[0098] In some embodiments of the present application, Figure 5As shown, according to the attachment point and attachment direction of each array, several arrays are attached in sequence, including:

[0099] S301: Determine the type and size of the Mth array corresponding to the Mth attachment point, where M is an integer greater than zero;

[0100] S302: adjusting the rotation angle and normal direction of the Mth array, and attaching the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model;

[0101] S303: When the rotation angle of the Mth array is adjusted, the position of the M+1th attachment point is adjusted according to the preset contour distance between the Mth array and the M+1th array.

[0102] It is understandable that, since the normal direction and rotation angle of the array are affected by the curvature of the surface when attaching the array on a curved surface, before attaching the array, it is necessary to first adjust the rotation angle and normal direction of the array according to the curvature of the surface, and then adjust the attachment point of the next attached array according to the rotation angle and normal direction of the array to ensure that the contour spacing between two adjacent arrays is equal to the preset value.

[0103] In some embodiments of the present application, Figure 6 As shown, the three-dimensional model is composed of multiple triangular facets, and the array has a center point and multiple feature points. The multiple feature points are connected in sequence to form the array. When the array is a polygonal structure, the feature points are the vertices of the polygonal structure. When the array is a circular structure, the feature points are points evenly spaced on the circumference of the circular structure.

[0104] Attaching the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model, specifically including:

[0105] According to the distance between each feature point and the center point in the Mth array, search for points with a distance equal to the distance on the triangular facets around the Mth array in sequence;

[0106] Connect the multiple searched points in sequence to form the Mth array.

[0107] It is understandable that, by adopting the above method, after the attachment is completed, the coordinates of the array can be determined according to the triangular facets around the array, so that reprocessing can be performed according to the coordinates of the array, thereby improving the processing accuracy of the workpiece during reprocessing.

[0108] In some embodiments of the present application, Figure 6 As shown, the feature points are points on the edge line of the array graphics, the center point is the center point of the array graphics, and the distance between each feature point and the center point is the distance l1.

[0109] In some embodiments of the present application, the plurality of arrays may be arrays of the same shape and size, or arrays of different shapes and sizes. The shape of the array may be the same as the shape of the hole or groove processed during reprocessing.

[0110] In some embodiments of the present application, Figure 7 and Figure 8 As shown, according to the spacing between each feature point and the center point in the Mth array, before the step of sequentially searching for points with a distance equal to the spacing on the triangular facets around the Mth array, the method further includes:

[0111] S401: Cover the Mth array to the Mth attachment point;

[0112] S402: Acquire the first triangular facet that overlaps with the Mth array;

[0113] S403: cutting the first triangular face to obtain a second triangular face;

[0114] S404: Searching for a vertex position whose distance from the center point of the Mth array is equal to the spacing among the vertices of the first triangular facet and / or the second triangular facet.

[0115] It can be understood that by cutting the triangular facets, a three-dimensional model composed of multiple triangular facets of different sizes can be obtained. Since the more triangular facets there are, the higher the accuracy of the three-dimensional model, the method of determining the specific coordinates of the array by cutting the triangular facets can further improve the processing efficiency during reprocessing of the workpiece.

[0116] In some embodiments of the present application, Figure 8 As shown, the first triangular face is cut to obtain a second triangular face, which specifically includes:

[0117] The line between any two adjacent feature points in the array is used as the first cutting line.

[0118] Calculate the number of intersections between the first cutting line and the vertices of the first triangle;

[0119] When the number of intersection points is 0, the first triangular face is cut into a triangular region and a quadrilateral region by a first cutting line, a second cutting line is set, and the quadrilateral region is cut into two triangular regions by the second cutting line;

[0120] When there is one intersection point, the first triangular face is cut into two triangular areas by the first cutting line;

[0121] When there are two intersection points, the first cutting line is tangent to the first triangle, and no cutting operation is performed.

[0122] It is understandable that by classifying according to the number of intersections between the first cutting line and the vertices of the first triangular facet, different cutting methods are used for cutting when the number of intersections is 0, 1, and 2, respectively, so as to determine the specific coordinates of the array and the triangular facets in different coverage states.

[0123] In some embodiments of the present application, if the shape of the array has an arc, the array will be converted into a regular polygon for calculation, and ultimately the primitives will be converted into polygonal structures covering the triangles, and the edges of the primitives will form multiple small triangles on the edges of the covered triangles through short lines. During clipping and division, the minimum triangle depends on the minimum triangle in the collected workpiece model, or the minimum triangle required for processing accuracy.

[0124] In some embodiments of the present application, during laser processing, the array can be used as a processing target and processing can be performed at the location of the array; the array can also be used as a non-processing target and processing can be performed in an area outside the array.

[0125] Embodiment 2:

[0126] The present invention provides a laser processing method based on workpiece reverse modeling, comprising:

[0127] S1: Use a laser scanner to scan the workpiece and reverse model it to obtain a three-dimensional model of the workpiece;

[0128] S2: Establish a three-dimensional coordinate system based on the three-dimensional model;

[0129] S3: Based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processed model, where the primitive matrix includes a number of orderly distributed arrays, and the arrays are plane figures;

[0130] S4: laser processing of the workpiece based on the pre-processing model;

[0131] Among them, the primitive matrix mapped on the surface of the three-dimensional model includes:

[0132] Based on the preset coordinates of each of the plurality of arrays, the attachment point and attachment direction of each array are searched on the surface of the three-dimensional model, and the plurality of arrays are attached in sequence according to the attachment point and attachment direction of each array.

[0133] The beneficial effects of the second embodiment of the present invention and its various implementations can refer to the beneficial effects analysis of the first embodiment and its various implementations. In addition, in the second embodiment of the present application, when the preset coordinates of the array are known and accurate, the above method can be used to quickly determine the position of the array, thereby improving the efficiency of laser processing.

[0134] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0135] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0136] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0137] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A laser processing method based on workpiece reverse modeling, characterized in that: include: Scanning the workpiece with a laser scanner and reverse modeling to obtain a three-dimensional model of the workpiece; Establishing a three-dimensional coordinate system with reference to the three-dimensional model; Based on the three-dimensional coordinate system, a primitive matrix is ​​mapped on the surface of the three-dimensional model to obtain a pre-processed model, wherein the primitive matrix includes a plurality of orderly distributed arrays, and the array is a plane figure; Based on the pre-processing model, laser processing is performed on the workpiece; Wherein, the surface mapping primitive matrix of the three-dimensional model includes: Based on the arrangement rules of the plurality of arrays, the attachment points and attachment directions of each array are sequentially set on the surface of the three-dimensional model, and the plurality of arrays are sequentially attached according to the attachment points and attachment directions of each array; Alternatively, based on the preset coordinates of each of the plurality of arrays, the attachment point and attachment direction of each array are searched on the surface of the three-dimensional model, and the plurality of arrays are attached in sequence according to the attachment point and attachment direction of each array.

2. The laser processing method based on workpiece reverse modeling according to claim 1 is characterized in that: The workpiece is a curved workpiece, and the method of sequentially setting the attachment direction of each array on the surface of the three-dimensional model based on the arrangement rule of the plurality of arrays specifically includes: Based on the arrangement rules of the plurality of arrays, and according to the curvature of the surface of the curved workpiece, the rotation angle and the normal direction of each array are sequentially set on the surface of the three-dimensional model.

3. The laser processing method based on workpiece reverse modeling according to claim 2 is characterized in that: The workpiece is a quasi-rotational workpiece, and the quasi-rotational workpiece has a generatrix and a rotation axis. The arrangement rules of the plurality of arrays are based on sequentially setting the attachment points of each array on the surface of the three-dimensional model, specifically including: Dividing the surface of the three-dimensional model into a plurality of annular zones at equal intervals along the generatrix direction of the three-dimensional model, wherein the size of each annular zone along the rotation axis direction of the three-dimensional model is equal; Setting a cross section on any one of the plurality of annular belts, wherein the cross section is perpendicular to the axis of rotation of the three-dimensional model; obtaining an annular contour between the cross section and a surface of the three-dimensional model; Based on the arrangement rules of the plurality of arrays, the attachment point of each array is sequentially set on the annular contour with the busbar as the starting attachment point.

4. The laser processing method based on workpiece reverse modeling according to claim 3 is characterized in that: The method of sequentially setting a plurality of attachment points of the array on the annular contour specifically includes: The first attachment points are sequentially arranged on the annular contour according to a first preset spacing. When the spacing between the last first attachment point and the first first attachment point is smaller than the first preset spacing, the last first attachment point is cancelled. When the spacing between the last first attachment point and the first first attachment point is not sufficient for attaching an array, the last first attachment point is cancelled.

5. The laser processing method based on workpiece reverse modeling according to claim 3 is characterized in that: The step of setting a cross section on any one of the plurality of annular belts specifically includes: On an Nth ring belt among the plurality of ring belts, second attachment points are sequentially arranged along a generatrix direction of the three-dimensional model at a second preset interval, wherein N is an integer greater than zero; According to the number of the second attachment points and the length of the busbar on the Nth ring belt, a plurality of third attachment points are sequentially arranged on the Nth ring belt along the busbar direction of the three-dimensional model, and the plurality of third attachment points are evenly spaced; A plurality of cross sections are respectively arranged at the plurality of third attachment points, and each of the cross sections is perpendicular to the rotation axis of the three-dimensional model.

6. The laser processing method based on workpiece reverse modeling according to claim 3 is characterized in that: The arrays are arranged in a regular pattern of equal center spacing or equal edge spacing.

7. The laser processing method based on workpiece reverse modeling according to claim 2, characterized in that: The method of sequentially attaching a plurality of arrays according to the attachment point and attachment direction of each array specifically includes: Determine the type and size of the Mth array corresponding to the Mth attachment point, where M is an integer greater than zero; Adjusting the rotation angle and normal direction of the Mth array, and attaching the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model; When the rotation angle of the Mth array is adjusted, the position of the M+1th attachment point is adjusted according to the preset contour distance between the Mth array and the M+1th array.

8. The laser processing method based on workpiece reverse modeling according to claim 7 is characterized in that: The three-dimensional model is composed of a plurality of triangular facets, the array has a center point and a plurality of feature points, and the plurality of feature points are sequentially connected to form the array, wherein when the array is a polygonal structure, the feature points are vertices of the polygonal structure, and when the array is a circular structure, the feature points are points distributed at equal intervals on the circumference of the circular structure; The step of attaching the adjusted Mth array to the Mth attachment point on the surface of the three-dimensional model specifically includes: According to the distance between each feature point and the center point in the M-th array, sequentially search for points whose distance is equal to the distance on the triangular facets around the M-th array; The multiple searched points are connected in sequence to form the Mth array.

9. The laser processing method based on workpiece reverse modeling according to claim 8, characterized in that: Before the step of sequentially searching for points with a distance equal to the distance between each feature point and the center point in the Mth array on the triangular facets around the Mth array, the method further includes: Covering the M-th array onto the M-th attachment point; Acquire the first triangular facet that overlaps with the M-th array; Cutting the first triangular face to obtain a second triangular face; Among the vertices of the first triangular facet and / or the second triangular facet, search for a vertex whose distance from the center point of the Mth array is equal to the spacing.

10. The laser processing method based on workpiece reverse modeling according to claim 9, characterized in that: The step of cutting the first triangular face to obtain the second triangular face specifically includes: The line between any two adjacent feature points in the array is used as the first cutting line. Calculating the number of intersections between the first cutting line and the vertices of the first triangular face; When the number of intersection points is 0, the first triangular face is cut into a triangular region and a quadrilateral region by the first cutting line, a second cutting line is set, and the quadrilateral region is cut into two triangular regions by the second cutting line; When there is one intersection point, the first triangular face is cut into two triangular areas by the first cutting line; When there are two intersection points, the first cutting line is tangent to the first triangular facet, and no cutting operation is performed.

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