Circuit board welding method and related device

Abstract

The embodiment of the invention discloses a circuit board welding method and a related device, which are used for improving the welding efficiency. The method provided by the embodiment of the invention comprises the following steps: acquiring an actual temperature value of a preheated circuit board; if the actual temperature value is larger than or equal to the preset target preheating temperature value, welding control is carried out to weld the circuit board, and the newly detected actual temperature value of the circuit board is obtained; obtaining a current output power value according to the actual temperature value and a preset target welding temperature value, and performing welding control based on the output power value so as to change the temperature of the circuit board; if the accumulative duration that the actual temperature value is equal to the target welding temperature value reaches the preset duration, shutdown control is carried out, so that welding on the circuit board is stopped; if the accumulated time length does not reach the preset time length, the target step is executed again until the accumulated time length reaches the preset time length, and the target step is to obtain the latest detected actual temperature value of the circuit board.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of circuit boards, and in particular to a circuit board welding method and related devices. Background Art

[0002] With the continuous development of science and technology, the welding level of circuit boards is also constantly improving. The entire circuit board welding process is generally divided into preheating, heating, reflow and cooling. Among them, reflow soldering is a welding process for circuit boards. All electronic components on the circuit board are completed in one go by heating the whole circuit board. The existing reflow soldering process uses a reflow soldering furnace to solder circuit boards. The principle is to heat the circuit board through the hot air flow in the furnace so that the circuit board reaches different temperatures. The reflow soldering furnace is divided into multiple heating zones, namely preheating zone, heating zone, reflow zone and cooling zone, corresponding to the four stages of preheating, heating, reflow and cooling. The circuit board enters each heating zone in turn through the conveyor belt to complete the welding.

[0003] However, in the existing solutions, the power control accuracy of the reflow oven is poor, the welding time is long, and the welding efficiency is low. Summary of the invention

[0004] The embodiments of the present application provide a circuit board welding method and related devices for improving welding efficiency.

[0005] A first aspect of an embodiment of the present application provides a circuit board welding method, comprising:

[0006] Get the actual temperature value of the preheated circuit board;

[0007] If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained;

[0008] Obtaining a current output power value according to the actual temperature value and a preset target welding temperature value, and performing welding control based on the output power value to change the temperature of the circuit board;

[0009] If the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time, a shutdown control is performed to stop welding the circuit board;

[0010] If the accumulated time does not reach the preset time, the process returns to the target step until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

[0011] Optionally, obtaining the current output power value according to the actual temperature value and a preset target welding temperature value includes:

[0012] Based on a linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value;

[0013] or,

[0014] Based on a successive approximation algorithm of a convex function model, the current output power value is obtained according to the actual temperature value and the target welding temperature value.

[0015] Optionally, if the actual temperature value is a temperature value obtained for the first time after the circuit board is welded, obtaining the current output power value according to the actual temperature value and the target welding temperature value based on a linear model control algorithm includes:

[0016] Determine the difference between the target welding temperature value and the actual temperature value as a deviation value;

[0017] Calculating according to the deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain a first power increment, wherein the deviation value is proportional to the power increment;

[0018] The sum of the power increment and the preset initial power value is determined as the current output power value.

[0019] Optionally, if the actual temperature value is a temperature value obtained for the second time after the circuit board is welded, obtaining the current output power value according to the actual temperature value and the target welding temperature value based on a linear model control algorithm includes:

[0020] Determine the difference between the target welding temperature value and the temperature value first obtained after welding the circuit board as a first deviation value, and determine the difference between the target welding temperature value and the actual temperature value as a second deviation value;

[0021] Calculating according to the first deviation value, the second deviation value, a preset proportional coefficient, a preset integral coefficient, and a preset differential coefficient to obtain a second power increment, wherein the second deviation value is proportional to the power increment, and the first deviation value is inversely proportional to the power increment;

[0022] The sum of the power increment and the power value output for the first time after the circuit board is welded is determined as the current output power value.

[0023] Optionally, if the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is an integer greater than or equal to 3, then based on a linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value, including:

[0024] Determine the difference between the target welding temperature value and the temperature value obtained for the n-2th time after welding the circuit board as the n-2th deviation value, determine the difference between the target welding temperature value and the temperature value obtained for the n-1th time after welding the circuit board as the n-1th deviation value, and determine the difference between the target welding temperature value and the actual temperature value as the nth deviation value;

[0025] Calculating according to the n-2th deviation value, the n-1th deviation value, the n-th deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain an n-th power increment, wherein the n-2th deviation value is proportional to the power increment, the n-th deviation value is proportional to the power increment, and the n-1th deviation value is inversely proportional to the power increment;

[0026] The sum of the power increment and the power value output for the n-1th time after welding the circuit board is determined as the current output power value.

[0027] Optionally, if the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, a successive approximation algorithm based on a convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0028] Calculating according to the target welding temperature value, the preset power lower limit value, the preset temperature lower limit value, the preset power initial value and the preset temperature initial value to obtain the current output power value, the power initial value is greater than the power lower limit value, and the temperature initial value is greater than the temperature lower limit value;

[0029] or,

[0030] If the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then a successive approximation algorithm based on a convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0031] The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, a preset power lower limit value and a preset temperature lower limit value, wherein the power value output for the n-1th time after welding the circuit board is directly proportional to the output power value, and the temperature value obtained for the n-1th time after welding the circuit board is inversely proportional to the output power value.

[0032] Optionally, if the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, a successive approximation algorithm based on a convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0033] Calculating according to the target welding temperature value, the preset upper power limit value, the preset upper temperature limit value, the preset initial power value and the preset initial temperature value to obtain the current output power value, the initial power value is less than the upper power limit value, and the initial temperature value is less than the upper temperature limit value;

[0034] or,

[0035] If the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then the successive approximation algorithm based on the convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0036] The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, the preset power upper limit value and the preset temperature upper limit value, and the power value output for the n-1th time after welding the circuit board is proportional to the output power value.

[0037] A second aspect of an embodiment of the present application provides a circuit board welding device, comprising:

[0038] An acquisition unit, used for acquiring an actual temperature value of the preheated circuit board;

[0039] A processing unit, configured to perform welding control to weld the circuit board when the actual temperature value is greater than or equal to a preset target preheating temperature value, and to obtain a latest detected actual temperature value of the circuit board;

[0040] a calculation unit, configured to obtain a current output power value according to the actual temperature value and a preset target welding temperature value, and perform welding control based on the output power value to change the temperature of the circuit board;

[0041] The processing unit is used to perform shutdown control to stop welding the circuit board when the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time;

[0042] The processing unit is used to return to execute the target step when the accumulated time does not reach the preset time until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

[0043] A third aspect of an embodiment of the present application provides a circuit board welding device, comprising:

[0044] CPU, memory and input / output interface;

[0045] The memory is a short-term storage memory or a persistent storage memory;

[0046] The central processing unit is configured to communicate with the memory and execute instructions in the memory to perform the aforementioned method.

[0047] A fourth aspect of an embodiment of the present application provides a computer-readable storage medium, comprising instructions, which, when executed on a computer, enable the computer to execute the aforementioned method.

[0048] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0049] First, the actual temperature value of the preheated circuit board is obtained. Then, if the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained. Then, the current output power value is obtained according to the actual temperature value and the preset target welding temperature value, and welding control is performed based on the output power value to change the temperature of the circuit board. If the cumulative time when the actual temperature value is equal to the target welding temperature value reaches the preset time, shutdown control is performed to stop welding the circuit board. Finally, if the cumulative time does not reach the preset time, the target step is returned to execute until the cumulative time reaches the preset time. After preheating the circuit board, the actual temperature value is obtained in real time, and the power value is adjusted using the actual temperature value and the target welding temperature value. The power control accuracy is high, the welding time is short, and the welding efficiency is high, which brings a better experience to the welding personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 This is a schematic diagram of the preheating, heating, reflux and cooling processes involved in this application;

[0051] Figure 2 A schematic diagram of an embodiment of a circuit board welding method disclosed in the present application;

[0052] Figure 3 A schematic diagram of the overall system disclosed in this application;

[0053] Figure 4A schematic diagram of another embodiment of a circuit board welding method disclosed in the present application;

[0054] Figure 5 A schematic diagram of an embodiment of the overall system of the present application;

[0055] Figure 6 A schematic diagram of an embodiment of a circuit board welding device disclosed in the present application;

[0056] Figure 7 This is a schematic diagram of another embodiment of a circuit board welding device disclosed in the present application. DETAILED DESCRIPTION

[0057] The present application is further described in detail below in conjunction with the accompanying drawings.

[0058] The embodiments of the present application provide a circuit board welding method and related devices for improving welding efficiency.

[0059] The process of PCB soldering is generally divided into four parts: preheating, heating, reflow and cooling. Figure 1 , the circuit board will be preheated at the beginning, and then the temperature will be increased to reach the target welding temperature after the preheating is completed, and then reflow will be performed at the target welding temperature, and finally cooled. However, in the existing scheme, the accuracy of power control is poor, resulting in a long welding time and low welding efficiency. In order to solve the above problems, the present application provides a circuit board welding method and related devices, which can use the actual temperature value and the target welding temperature value to adjust the power value, with high power control accuracy, short welding time, high welding efficiency, and a better experience for welders. Among them, the circuit board can be a printed circuit board (PCB, printed circuitboard) or a flexible circuit board (FPC, flexible printed circuit), which is not limited here.

[0060] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0061] The terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0062] A circuit board welding method of the present application is described below. Figure 2 , an embodiment of a circuit board welding method of the present application includes:

[0063] 201. Obtaining an actual temperature value of the preheated circuit board;

[0064] Get the actual temperature value of the preheated circuit board. Specifically, the circuit board will be preheated first, and the actual temperature value of the circuit board at this time is obtained through the sensor. Subsequently, it is necessary to decide whether to enter the welding stage based on the actual temperature value of the circuit board.

[0065] 202. If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained;

[0066] If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained. Among them, the target preheating temperature value is a temperature value indicating that the preheating has reached a certain degree, which can be set according to actual needs and is not limited here. Specifically, the actual temperature value will be compared with the target preheating temperature value. If the actual temperature value is less than the target preheating temperature value, it means that the preheating has not been completed and preheating needs to continue. If the actual temperature value is greater than or equal to the target preheating temperature value, it means that the preheating has been completed and welding can be performed. Then welding control is performed to make the relevant welding devices work, weld the circuit board, and obtain the latest detected actual temperature value during welding based on the sensor.

[0067] 203. Obtaining a current output power value according to the actual temperature value and a preset target welding temperature value, and performing welding control based on the output power value to change the temperature of the circuit board;

[0068] The current output power value is obtained according to the actual temperature value and the preset target welding temperature value, and welding control is performed based on the output power value to change the temperature of the circuit board. Among them, the target welding temperature value is the required temperature when the circuit board is welded, which can be set according to the actual situation and is not limited here. Specifically, based on the preset algorithm, the current output power value corresponding to the actual temperature value is calculated according to the actual temperature value and the target welding temperature value, and welding control is performed based on the output power value, so that the relevant welding devices work and the temperature of the circuit board is changed.

[0069] 204. If the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time, a shutdown control is performed to stop welding the circuit board;

[0070] If the cumulative time when the actual temperature value is equal to the target welding temperature value reaches the preset time, shutdown control is performed to stop welding the circuit board. The preset time is the necessary welding time to complete the welding of the circuit board. Specifically, the actual temperature value obtained is compared with the target welding temperature value in real time. If the actual temperature value is equal to the target welding temperature value, timing is performed, the cumulative time is updated, and it is determined whether the cumulative time reaches the preset time. If it reaches it, shutdown control is performed to stop the relevant welding device from welding the circuit board. In addition, the target temperature range can also be used instead of the target welding temperature value, that is, if the cumulative time when the actual temperature value is in the target temperature range reaches the preset time, this step is also performed.

[0071] 205. If the accumulated time does not reach the preset time, return to execute the target step until the accumulated time reaches the preset time. The target step is to obtain the latest detected actual temperature value of the circuit board.

[0072] If the accumulated time does not reach the preset time, the target step is returned to be executed until the accumulated time reaches the preset time. The target step is to obtain the actual temperature value of the circuit board detected most recently. Specifically, if the accumulated time when the actual temperature value is equal to the target welding temperature value does not reach the preset time, it means that welding is not completed and welding needs to be continued. The target step (i.e., step 202) is returned to be executed for a new round of adjustment.

[0073] In the embodiment of the present application, the actual temperature value of the preheated circuit board is first obtained, and then if the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the actual temperature value of the circuit board detected most recently is obtained, and then the current output power value is obtained according to the actual temperature value and the preset target welding temperature value, and welding control is performed based on the output power value to change the temperature of the circuit board, and then if the cumulative time when the actual temperature value is equal to the target welding temperature value reaches the preset time, then shutdown control is performed to stop welding the circuit board, and finally if the cumulative time does not reach the preset time, the target execution step is returned until the cumulative time reaches the preset time. After preheating the circuit board, the actual temperature value is obtained in real time, and the power value is adjusted using the actual temperature value and the target welding temperature value. The power control accuracy is high, the welding time is short, and the welding efficiency is high, which brings a better experience to the welding personnel.

[0074] See also Figure 3 The overall system involved in this application includes a welding system and a preheating system. The welding system includes a power regulator, a power output module, a laser heating module and a temperature feedback module. The preheating system includes a preheating module. Among them, the power regulator is used to calculate the current output power value according to the real-time temperature value and the target welding temperature value. The power output module is used to drive the laser heating module to work. The laser heating module is used to convert electrical energy into light energy to perform laser welding on the circuit board. Preferably, a Vcsel array laser is used, wherein the Vcsel array laser is a vertical cavity surface emitting laser that emits a laser beam in a planar form. Unlike traditional lasers, the laser emission direction of Vcsel is perpendicular to the substrate surface, and a circular spot can be obtained. It is usually composed of multiple laser units to form a two-dimensional array. The temperature feedback module is used to obtain the temperature of the target area of ​​the heated object, which is generally a planar array infrared temperature measuring device or an infrared sensor, etc., which is not limited here. The preheating module is used for preheating, preferably, it is a heating plate, which can achieve preheating and prevent the circuit board from deformation, without preparing a circuit board with a high thermogravimetric analysis value, wherein the thermogravimetric analysis technology (TG, thermogravimetric analysis) is a technology that studies the thermal stability and composition of a material by measuring the change of its mass over time in a controlled temperature environment.

[0075] Specifically, the circuit board can be placed on the preheating module and preheated with the preheating module first. After preheating to a certain temperature, the temperature feedback module feeds back the temperature information to the power regulator, and the power regulator calculates the current output power value, controls the power output module to drive the laser heating module to perform laser welding on the circuit board until the welding completion conditions are met. This can prevent the circuit board from deforming and shorten the welding time.

[0076] See also Figure 4 Another embodiment of a circuit board welding method of the present application involves Figure 3 The overall system, the power conditioner applied to the overall system, the method comprising:

[0077] 401. Obtaining an actual temperature value of the preheated circuit board;

[0078] Get the actual temperature value of the preheated circuit board. Specifically, the preheating module will be turned on first to preheat the circuit board placed on the preheating module, and the temperature feedback module will be turned on at the same time. The temperature feedback module will obtain the actual temperature value of the circuit board at this time and send it to the power regulator. The power regulator will then decide whether to enter the welding stage based on the actual temperature value of the circuit board.

[0079] 402. If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained;

[0080] If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the actual temperature value of the circuit board detected most recently is obtained. Among them, the target preheating temperature value is a temperature value indicating that the preheating has reached a certain degree, which can be set according to actual needs and is not limited here. Specifically, the actual temperature value will be compared with the target preheating temperature value. If the actual temperature value is less than the target preheating temperature value, it means that the preheating has not been completed and preheating needs to continue. If the actual temperature value is greater than or equal to the target preheating temperature value, it means that the preheating has been completed and welding can be performed. Then, a control signal is output to the power output module, and the power output module drives the laser heating module to work, laser welding the circuit board, and the actual temperature value detected most recently during welding is obtained based on the temperature feedback module.

[0081] 403. Obtain a current output power value according to the actual temperature value and a preset target welding temperature value, and perform welding control based on the output power value to change the temperature of the circuit board;

[0082] The current output power value is obtained according to the actual temperature value and the preset target welding temperature value, and welding control is performed based on the output power value to change the temperature of the circuit board. Among them, the target welding temperature value is the required temperature when the circuit board is welded, which can be set according to the actual situation and is not limited here. Specifically, the current output power value can be obtained based on the actual temperature value and the target welding temperature value based on the linear model control algorithm, or, the current output power value can be obtained based on the actual temperature value and the target welding temperature value based on the successive approximation algorithm of the convex function model. There are other ways, which are not limited here.

[0083] For the linear model control algorithm, it can be an incremental PID algorithm or other algorithms, which are not limited here and are described below with three implementation methods.

[0084] In one implementation, if the actual temperature value is the first temperature value obtained after the circuit board is welded, the difference between the target welding temperature value and the actual temperature value is first determined as the deviation value, and then the first power increment is calculated based on the deviation value, the preset proportional coefficient, the preset integral coefficient and the preset differential coefficient, wherein the deviation value is proportional to the power increment, and finally the sum of the power increment and the preset initial power value is determined as the current output power value. Specifically, it is expressed by the following formula:

[0085] ΔP(n)=Kp*e(n)+Ki*e(n)+Kd*e(n);

[0086] P(1)=ΔP(n)+P(0);

[0087] Where n is 1, ΔP(n) is the first power increment, Kp is the proportional coefficient, Ki is the integral coefficient, Kd is the differential coefficient, e(n) is the deviation value, P(1) is the first output power value, and P(0) is the initial power value.

[0088] In another embodiment, if the actual temperature value is the temperature value obtained for the second time after the circuit board is welded, the difference between the target welding temperature value and the temperature value obtained for the first time after the circuit board is welded is first determined as the first deviation value, and the difference between the target welding temperature value and the actual temperature value is determined as the second deviation value, and then the second power increment is calculated according to the first deviation value, the second deviation value, the preset proportional coefficient, the preset integral coefficient and the preset differential coefficient, wherein the second deviation value is proportional to the power increment, and the first deviation value is inversely proportional to the power increment, and finally the sum of the power increment and the power value output for the first time after the circuit board is welded is determined as the current output power value. Specifically, it is expressed by the following formula:

[0089] ΔP(n)=Kp*(e(n)-e(n-1))+Ki*e(n)+Kd*(e(n)-2*e(n-1));

[0090] P(2) = ΔP(n) + P(1);

[0091] Wherein, n is 2, ΔP(n) is the second power increment, Kp is the proportional coefficient, Ki is the integral coefficient, Kd is the differential coefficient, e(n) is the second deviation value, e(n-1) is the first deviation value, P(1) is the first output power value, and P(2) is the second output power value.

[0092] In another embodiment, if the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is an integer greater than or equal to 3, the difference between the target welding temperature value and the temperature value obtained for the n-2th time after the circuit board is welded is first determined as the n-2th deviation value, the difference between the target welding temperature value and the temperature value obtained for the n-1th time after the circuit board is welded is determined as the n-1th deviation value, and the difference between the target welding temperature value and the actual temperature value is determined as the nth deviation value, and then the n-2th deviation value, the n-1th deviation value, the n-1th deviation value, the preset proportional coefficient, the preset integral coefficient and the preset differential coefficient are calculated to obtain the nth power increment, wherein the n-2th deviation value is proportional to the power increment, the nth deviation value is proportional to the power increment, and the n-1th deviation value is inversely proportional to the power increment, and finally the sum of the power increment and the power value output for the n-1th time after the circuit board is welded is determined as the current output power value. Specifically, it is expressed by the following formula:

[0093] ΔP(n)=Kp*(e(n)-e(n-1))+Ki*e(n)+Kd*(e(n)-2*e(n-1)+e(n-2));

[0094] P(n)=ΔP(n)+P(n-1);

[0095] Wherein, n is a positive integer greater than or equal to 3, ΔP(n) is the nth power increment, Kp is the proportional coefficient, Ki is the integral coefficient, Kd is the differential coefficient, e(n) is the nth deviation value, e(n-1) is the n-1th deviation value, e(n-2) is the n-2th deviation value, P(n) is the nth output power value, and P(n-1) is the n-1th output power value.

[0096] The successive approximation algorithm for the convex function model may be a tangent function model or other models, which are not limited here and are described below with four implementation methods.

[0097] In one embodiment, if the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, the current output power value is calculated based on the target welding temperature value, the preset power lower limit value, the preset temperature lower limit value, the preset power initial value and the preset temperature initial value, wherein the power initial value is greater than the power lower limit value, and the temperature initial value is greater than the temperature lower limit value. The temperature lower limit value is the minimum temperature of the specified circuit board, the power lower limit value is the minimum power of the specified circuit board, and the temperature initial value and the power initial value can be set according to the actual situation. Specifically, it is expressed by the following formula:

[0098]

[0099] Wherein, n is 1, Pn is the first output power value, Tt is the target welding temperature value, Tmin is the lower limit of temperature, P0 is the initial power value, T0 is the initial temperature value, and Pmin is the lower limit of power.

[0100] In another embodiment, if the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is a positive integer greater than or equal to 2, then the current output power value is calculated based on the power value output for the n-1th time after the circuit board is welded, the temperature value obtained for the n-1th time after the circuit board is welded, the target welding temperature value, the preset power lower limit value, and the preset temperature lower limit value, wherein the power value output for the n-1th time after the circuit board is welded is proportional to the output power value, and the temperature value obtained for the n-1th time after the circuit board is welded is inversely proportional to the output power value. Specifically, it is expressed by the following formula:

[0101]

[0102] Where n is a positive integer greater than or equal to 2, P n is the nth output power value, Tt is the target welding temperature value, Tmin is the lower limit of temperature, P n-1 is the output power value of the n-1th time, T n-1 is the temperature value obtained for the n-1th time, and Pmin is the power lower limit.

[0103] In another embodiment, if the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, the current output power value is calculated based on the target welding temperature value, the preset power upper limit value, the preset temperature upper limit value, the preset power initial value and the preset temperature initial value, wherein the power initial value is less than the power upper limit value, the temperature initial value is less than the temperature upper limit value, the temperature upper limit value is the maximum temperature of the specified circuit board, and the power upper limit value is the maximum power of the specified circuit board. Specifically, it is expressed by the following formula:

[0104]

[0105] Where n is 1, P n is the first output power value, Tt is the target welding temperature value, Tmax is the upper limit of temperature, P0 is the initial power value, T0 is the initial temperature value, and Pmax is the upper limit of power.

[0106] In another embodiment, if the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is a positive integer greater than or equal to 2, then the current output power value is calculated based on the power value output for the n-1th time after the circuit board is welded, the temperature value obtained for the n-1th time after the circuit board is welded, the target welding temperature value, the preset power upper limit value, and the preset temperature upper limit value, wherein the power value output for the n-1th time after the circuit board is welded is proportional to the output power value. Specifically, it is expressed by the following formula:

[0107]

[0108] Where n is a positive integer greater than or equal to 2, P n is the nth output power value, Tt is the target welding temperature value, Tmax is the upper temperature limit, P n-1 is the output power value of the n-1th time, T n-1 is the temperature value obtained for the n-1th time, and Pmax is the upper power limit.

[0109] 404. If the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time, a shutdown control is performed to stop welding the circuit board;

[0110] If the cumulative time when the actual temperature value is equal to the target welding temperature value reaches the preset time, shutdown control is performed to stop welding the circuit board. The preset time is the necessary welding time for the circuit board to be welded. Specifically, the actual temperature value obtained from the temperature feedback module is compared with the target welding temperature value in real time. If the actual temperature value is equal to the target welding temperature value, timing is performed, the cumulative time is updated, and it is determined whether the cumulative time reaches the preset time. If it reaches it, shutdown control is performed, that is, a signal is sent to control the power output module so that the power output module drives the laser heating module to stop welding the circuit board. In addition, the target temperature range can also be used instead of the target welding temperature value, that is, if the cumulative time when the actual temperature value is in the target temperature range reaches the preset time, shutdown control can also be performed.

[0111] 405. Send out a welding completion prompt;

[0112] After the work is stopped, a welding completion prompt is issued. Specifically, the relevant information may be displayed on a display screen, or a prompt tone may be issued, etc., which is not limited here.

[0113] 406. If the accumulated time does not reach the preset time, return to execute the target step until the accumulated time reaches the preset time. The target step is to obtain the latest detected actual temperature value of the circuit board.

[0114] If the cumulative duration does not reach the preset duration, the target step is returned to be executed until the cumulative duration reaches the preset duration, and the target step is to obtain the actual temperature value of the circuit board detected most recently. Specifically, if the cumulative duration that the actual temperature value is equal to the target welding temperature value does not reach the preset duration, it means that welding is not completed and welding needs to be continued, and the target step (i.e., step 402) is returned to be executed to perform a new round of adjustment. In addition, the target welding temperature value can also be replaced by the target temperature range, that is, if the cumulative duration that the actual temperature value is in the target temperature range does not reach the preset duration, a new round of adjustment can also be performed.

[0115] The present embodiment is now described by taking an example. Figure 5 , the power regulator in the total system is the industrial computer 5, the power output module is the driving power supply 6, the laser heating module is the array laser 1, the temperature feedback module is the infrared thermal imager 3, the circuit board 2, and the preheating module is the heating plate 4. The total system is started, and the heating plate 4 first preheats the circuit board 2, heating the circuit board 2 from room temperature to 200°C. The infrared thermal imager 3 detects the actual temperature value of the circuit board 2 and feeds it back to the industrial computer 5. After the industrial computer 5 detects the actual temperature value, when the actual temperature value is greater than the target preheating temperature value, the driving power supply 6 is controlled to work to drive the array laser 1 to perform laser welding on the circuit board 2. The temperature of the circuit board 2 rises, and the infrared thermal imager 3 feeds back the latest detected temperature value to the industrial computer 5. When the cumulative time when the actual temperature value is maintained at the target welding temperature value reaches the preset time, the driving power supply 6 is controlled to stop working, and the array laser 1 stops laser welding.

[0116] In this embodiment, the actual temperature value of the preheated circuit board is first obtained, and then if the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the actual temperature value of the circuit board detected most recently is obtained, and then the current output power value is obtained according to the actual temperature value and the preset target welding temperature value, and welding control is performed based on the output power value to change the temperature of the circuit board, and then if the cumulative time when the actual temperature value is equal to the target welding temperature value reaches the preset time, then shutdown control is performed to stop welding the circuit board and a prompt is given, and finally if the cumulative time does not reach the preset time, the target step is returned to be executed until the cumulative time reaches the preset time. After preheating the circuit board, the actual temperature value is obtained in real time, and the power value is adjusted using the actual temperature value and the target welding temperature value. The power control accuracy is high, the welding time is short, and the welding efficiency is high, which brings a better experience to the welding personnel.

[0117] A circuit board welding method in an embodiment of the present application is described above, and a circuit board welding device in an embodiment of the present application is described below. Figure 6 , a circuit board welding device in an embodiment of the present application includes:

[0118] An acquisition unit 601 is used to acquire an actual temperature value of the preheated circuit board;

[0119] The processing unit 602 is used to perform welding control to weld the circuit board when the actual temperature value is greater than or equal to a preset target preheating temperature value, and obtain the latest detected actual temperature value of the circuit board;

[0120] A calculation unit 603, configured to obtain a current output power value according to the actual temperature value and a preset target welding temperature value, and perform welding control based on the output power value to change the temperature of the circuit board;

[0121] The processing unit 602 is configured to perform a shutdown control to stop welding the circuit board when the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time;

[0122] The processing unit 602 is used to return to execute the target step when the accumulated time does not reach the preset time until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

[0123] In the embodiment of the present application, the acquisition unit 601 first acquires the actual temperature value of the preheated circuit board, and then if the actual temperature value is greater than or equal to the preset target preheating temperature value, the processing unit 602 performs welding control to weld the circuit board, and obtains the latest detected actual temperature value of the circuit board, and then the calculation unit 603 obtains the current output power value according to the actual temperature value and the preset target welding temperature value, and performs welding control based on the output power value to change the temperature of the circuit board, and then if the actual temperature value is equal to the target welding temperature value The cumulative duration reaches the preset duration, then the shutdown control is performed to stop welding the circuit board, and finally if the cumulative duration does not reach the preset duration, it returns to the target execution step until the cumulative duration reaches the preset duration. After preheating the circuit board first, the actual temperature value is obtained in real time, and the power value is adjusted using the actual temperature value and the target welding temperature value. The power control accuracy is high, the welding time is short, and the welding efficiency is high, which brings a better experience to the welding personnel.

[0124] A circuit board welding device according to an embodiment of the present application is described in detail below. Another embodiment of a circuit board welding device according to an embodiment of the present application includes:

[0125] An acquisition unit, used for acquiring an actual temperature value of the preheated circuit board;

[0126] A processing unit, configured to perform welding control to weld the circuit board when the actual temperature value is greater than or equal to a preset target preheating temperature value, and to obtain a latest detected actual temperature value of the circuit board;

[0127] a calculation unit, configured to obtain a current output power value according to the actual temperature value and a preset target welding temperature value, and perform welding control based on the output power value to change the temperature of the circuit board;

[0128] The processing unit is used to perform shutdown control to stop welding the circuit board when the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time;

[0129] The processing unit is used to return to execute the target step when the accumulated time does not reach the preset time until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

[0130] Computing unit, specifically used for:

[0131] Based on a linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value;

[0132] or,

[0133] Based on a successive approximation algorithm of a convex function model, the current output power value is obtained according to the actual temperature value and the target welding temperature value.

[0134] If the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, the calculation unit is specifically used to:

[0135] Determine the difference between the target welding temperature value and the actual temperature value as a deviation value;

[0136] Calculating according to the deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain a first power increment, wherein the deviation value is proportional to the power increment;

[0137] The sum of the power increment and the preset initial power value is determined as the current output power value.

[0138] If the actual temperature value is a temperature value obtained for the second time after the circuit board is welded, the calculation unit is specifically used to:

[0139] Determine the difference between the target welding temperature value and the temperature value first obtained after welding the circuit board as a first deviation value, and determine the difference between the target welding temperature value and the actual temperature value as a second deviation value;

[0140] Calculating according to the first deviation value, the second deviation value, a preset proportional coefficient, a preset integral coefficient, and a preset differential coefficient to obtain a second power increment, wherein the second deviation value is proportional to the power increment, and the first deviation value is inversely proportional to the power increment;

[0141] The sum of the power increment and the power value output for the first time after the circuit board is welded is determined as the current output power value.

[0142] If the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is an integer greater than or equal to 3, the calculation unit is specifically configured to:

[0143] Determine the difference between the target welding temperature value and the temperature value obtained for the n-2th time after welding the circuit board as the n-2th deviation value, determine the difference between the target welding temperature value and the temperature value obtained for the n-1th time after welding the circuit board as the n-1th deviation value, and determine the difference between the target welding temperature value and the actual temperature value as the nth deviation value;

[0144] Calculating according to the n-2th deviation value, the n-1th deviation value, the n-th deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain an n-th power increment, wherein the n-2th deviation value is proportional to the power increment, the n-th deviation value is proportional to the power increment, and the n-1th deviation value is inversely proportional to the power increment;

[0145] The sum of the power increment and the power value output for the n-1th time after welding the circuit board is determined as the current output power value.

[0146] If the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, the calculation unit is specifically used to:

[0147] Calculating according to the target welding temperature value, the preset power lower limit value, the preset temperature lower limit value, the preset power initial value and the preset temperature initial value to obtain the current output power value, the power initial value is greater than the power lower limit value, and the temperature initial value is greater than the temperature lower limit value;

[0148] or,

[0149] If the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then a successive approximation algorithm based on a convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0150] The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, a preset power lower limit value and a preset temperature lower limit value, wherein the power value output for the n-1th time after welding the circuit board is directly proportional to the output power value, and the temperature value obtained for the n-1th time after welding the circuit board is inversely proportional to the output power value.

[0151] If the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, the calculation unit is specifically used to:

[0152] Calculating according to the target welding temperature value, the preset upper power limit value, the preset upper temperature limit value, the preset initial power value and the preset initial temperature value to obtain the current output power value, the initial power value is less than the upper power limit value, and the initial temperature value is less than the upper temperature limit value;

[0153] or,

[0154] If the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then the successive approximation algorithm based on the convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including:

[0155] The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, the preset power upper limit value and the preset temperature upper limit value, and the power value output for the n-1th time after welding the circuit board is proportional to the output power value.

[0156] The functions and processes performed by each unit in the circuit board welding device of this embodiment are similar to those of the aforementioned Figure 2 and Figure 4 The functions and processes performed by the circuit board welding device are similar and will not be repeated here.

[0157] Figure 7It is a schematic diagram of the structure of a circuit board welding device provided in an embodiment of the present application. The circuit board welding device 700 may include one or more central processing units (CPU) 701 and a memory 705. The memory 705 stores one or more application programs or data.

[0158] The memory 705 may be a volatile storage or a persistent storage. The program stored in the memory 705 may include one or more modules, each of which may include a series of instruction operations in the circuit board welding device 700. Furthermore, the central processor 701 may be configured to communicate with the memory 705 and execute a series of instruction operations in the memory 705 on the circuit board welding device 700.

[0159] The circuit board welding device 700 may also include one or more power supplies 702, one or more wired or wireless network interfaces 703, one or more input and output interfaces 704, and / or one or more operating systems, such as Windows ServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, etc.

[0160] The CPU 701 can execute the aforementioned Figure 2 and Figure 4 The operations performed by the circuit board welding device in the illustrated embodiment will not be described in detail herein.

[0161] An embodiment of the present application also provides a computer-readable storage medium, including instructions, which, when executed on a computer, enable the computer to execute the method in the aforementioned embodiment.

[0162] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0163] It should be noted that, although the steps in the flowcharts involved in the embodiments are drawn in sequence according to the instructions of the arrows, unless otherwise clearly stated in this document, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0164] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0165] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0166] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0167] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, read-only memory), random access memory (RAM, random access memory), disk or optical disk and other media that can store program code.

Claims

1. A circuit board welding method, characterized in that: include: Get the actual temperature value of the preheated circuit board; If the actual temperature value is greater than or equal to the preset target preheating temperature value, welding control is performed to weld the circuit board, and the latest detected actual temperature value of the circuit board is obtained; Obtaining a current output power value according to the actual temperature value and a preset target welding temperature value, and performing welding control based on the output power value to change the temperature of the circuit board; If the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time, a shutdown control is performed to stop welding the circuit board; If the accumulated time does not reach the preset time, the process returns to the target step until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

2. The circuit board welding method according to claim 1, characterized in that: The obtaining of the current output power value according to the actual temperature value and the preset target welding temperature value comprises: Based on a linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value; or, Based on a successive approximation algorithm of a convex function model, the current output power value is obtained according to the actual temperature value and the target welding temperature value.

3. The circuit board welding method according to claim 2, characterized in that: If the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, then based on the linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value, including: Determine the difference between the target welding temperature value and the actual temperature value as a deviation value; Calculating according to the deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain a first power increment, wherein the deviation value is proportional to the power increment; The sum of the power increment and the preset initial power value is determined as the current output power value.

4. The circuit board welding method according to claim 2, characterized in that: If the actual temperature value is the temperature value obtained for the second time after the circuit board is welded, then based on the linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value, including: Determine the difference between the target welding temperature value and the temperature value first obtained after welding the circuit board as a first deviation value, and determine the difference between the target welding temperature value and the actual temperature value as a second deviation value; Calculating according to the first deviation value, the second deviation value, a preset proportional coefficient, a preset integral coefficient, and a preset differential coefficient to obtain a second power increment, wherein the second deviation value is proportional to the power increment, and the first deviation value is inversely proportional to the power increment; The sum of the power increment and the power value output for the first time after the circuit board is welded is determined as the current output power value.

5. The circuit board welding method according to claim 2, characterized in that: If the actual temperature value is the temperature value obtained for the nth time after the circuit board is welded, where n is an integer greater than or equal to 3, then based on the linear model control algorithm, the current output power value is obtained according to the actual temperature value and the target welding temperature value, including: Determine the difference between the target welding temperature value and the temperature value obtained for the n-2th time after welding the circuit board as the n-2th deviation value, determine the difference between the target welding temperature value and the temperature value obtained for the n-1th time after welding the circuit board as the n-1th deviation value, and determine the difference between the target welding temperature value and the actual temperature value as the nth deviation value; Calculating according to the n-2th deviation value, the n-1th deviation value, the n-th deviation value, a preset proportional coefficient, a preset integral coefficient and a preset differential coefficient to obtain an n-th power increment, wherein the n-2th deviation value is proportional to the power increment, the n-th deviation value is proportional to the power increment, and the n-1th deviation value is inversely proportional to the power increment; The sum of the power increment and the power value output for the n-1th time after welding the circuit board is determined as the current output power value.

6. The circuit board welding method according to claim 2, characterized in that: If the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, then the successive approximation algorithm based on the convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including: Calculating according to the target welding temperature value, the preset power lower limit value, the preset temperature lower limit value, the preset power initial value and the preset temperature initial value to obtain the current output power value, the power initial value is greater than the power lower limit value, and the temperature initial value is greater than the temperature lower limit value; or, If the actual temperature value is less than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then a successive approximation algorithm based on a convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including: The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, a preset power lower limit value and a preset temperature lower limit value, wherein the power value output for the n-1th time after welding the circuit board is directly proportional to the output power value, and the temperature value obtained for the n-1th time after welding the circuit board is inversely proportional to the output power value.

7. The circuit board welding method according to claim 2, characterized in that: If the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the first time after the circuit board is welded, then the successive approximation algorithm based on the convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including: Calculating according to the target welding temperature value, the preset upper power limit value, the preset upper temperature limit value, the preset initial power value and the preset initial temperature value to obtain the current output power value, the initial power value is less than the upper power limit value, and the initial temperature value is less than the upper temperature limit value; or, If the actual temperature value is greater than the target welding temperature value, and the actual temperature value is the temperature value obtained for the nth time after welding the circuit board, where n is a positive integer greater than or equal to 2, then the successive approximation algorithm based on the convex function model is used to obtain the current output power value according to the actual temperature value and the target welding temperature value, including: The current output power value is obtained by calculation based on the power value output for the n-1th time after welding the circuit board, the temperature value obtained for the n-1th time after welding the circuit board, the target welding temperature value, the preset power upper limit value and the preset temperature upper limit value, and the power value output for the n-1th time after welding the circuit board is proportional to the output power value.

8. A circuit board welding device, characterized in that: include: An acquisition unit, used for acquiring an actual temperature value of the preheated circuit board; A processing unit, configured to perform welding control to weld the circuit board when the actual temperature value is greater than or equal to a preset target preheating temperature value, and to obtain a latest detected actual temperature value of the circuit board; a calculation unit, configured to obtain a current output power value according to the actual temperature value and a preset target welding temperature value, and perform welding control based on the output power value to change the temperature of the circuit board; The processing unit is used to perform shutdown control to stop welding the circuit board when the accumulated time during which the actual temperature value is equal to the target welding temperature value reaches a preset time; The processing unit is used to return to execute the target step when the accumulated time does not reach the preset time until the accumulated time reaches the preset time, and the target step is to obtain the latest detected actual temperature value of the circuit board.

9. A circuit board welding device, characterized in that: include: CPU, memory and input / output interface; The memory is a short-term storage memory or a persistent storage memory; The central processing unit is configured to communicate with the memory and execute instructions in the memory to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The method comprises instructions, which, when executed on a computer, cause the computer to execute the method according to any one of claims 1 to 7.

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