An additive manufacturing apparatus and method with waste heat recovery system
By introducing a waste heat recovery system into additive manufacturing equipment and using a thermoelectric conversion module to convert thermal energy into electrical energy, the heat dissipation problem of additive manufacturing equipment in a space environment is solved, energy consumption is reduced, and the flexibility and adaptability of the thermal control system are improved.
Patent Information
- Application Number
- CN202411788595.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2044-12-06
AI Technical Summary
The heat dissipation problem of existing additive manufacturing equipment in space environment has not been effectively solved, especially the low utilization rate of waste heat, which leads to high energy consumption of equipment. In addition, traditional thermal control systems are difficult to flexibly control the heat exchange amount and have poor adaptability.
A waste heat recovery system is introduced to exchange heat with the thermoelectric conversion module through the finned heat sink. The thermoelectric conversion module converts thermal energy into electrical energy, which is stored in the storage module. The adaptive PID control is combined to improve the thermal management efficiency.
It realizes the utilization of waste heat in the additive manufacturing process, reduces equipment energy consumption, improves energy utilization, and enhances the flexibility and adaptability of the thermal control system.
Smart Images

Figure CN119703383B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the field of additive manufacturing technology, and more particularly, relates to an additive manufacturing device and method with a waste heat recovery system. BACKGROUND
[0002] In the use scenario of space manufacturing, the power of the electrical equipment is generally provided by the solar sail absorbing solar energy. The larger the electrical load is, the larger the solar sail area will be. The electrical device releases a large amount of heat during operation. Due to the microgravity and hot vacuum environment in space, natural convection cannot be formed, and only a small amount of heat is released externally through thermal radiation. Most of the heat will accumulate inside the equipment, causing the failure of instruments and equipment. The heat dissipation of the electrical equipment in space environment is generally achieved by the skin facing away from the sun and the radiation heat sink. The heat is dissipated to the universe in the form of radiation heat dissipation. The radiation heat dissipation area directly affects the heat dissipation power. The increase of the thermal load means that the heat control system needs a larger radiation heat dissipation area. The increase of the area of the solar sail and the radiation heat sink will directly lead to the increase of the manufacturing cost of the space facilities such as satellites, spacecraft, space stations and space base stations, and also increase the mass and further increase the launch cost.
[0003] To solve the above problems, in the field of nanosatellites, there is currently a fluid circuit control device suitable for the thermal control system of nanosatellites. The fluid circuit control device combines micro-channel heat exchanger technology and thermoelectric conversion technology to form forced convection heat exchange in the fluid circuit of the nanosatellite thermal control system. The fluid circuit control device installs a micro-channel heat exchanger on the existing on-board equipment of the nanosatellite, and then connects a duct to each end of the micro-channel heat exchanger to form a forced convection fluid circuit. The fluid circuit can reuse the heat generated by the on-board equipment during operation, saving the energy of the nanosatellite and providing conditions for long-term service of the nanosatellite. The fluid circuit adopts a passive heat control mode of main loop self-driving and bypass auxiliary control. The self-driving design converts the waste heat of the nanosatellite into electrical energy to drive the fluid circuit to dissipate heat, realizing closed-loop control of the thermal control system and reducing the power consumption of the nanosatellite. The bypass auxiliary control design controls the heat radiated by the nanosatellite to the universe, and can control the temperature inside the nanosatellite.
[0004] In the field of additive manufacturing technology, the application of additive manufacturing equipment in space environment also faces the problem of heat dissipation. The existing additive manufacturing equipment only considers improving the mechanical properties of the deposited part and adapting to microgravity in the use scenario of space microgravity and thermal vacuum, without providing a solution to the waste heat problem of the additive manufacturing process from an economic perspective. The above fluid circuit control device suitable for nanosatellite thermal control system proposes a method of utilizing waste heat, but it is only applicable to the field of nanosatellite, and an adaptive solution is still needed to solve the problem of heat dissipation of additive manufacturing equipment. The multiple heat exchangers in the fluid circuit of the above device are connected in series, which makes it difficult to flexibly control the heat exchange amount of each heat exchanger. At the same time, the device does not leave an interface for the cooling medium circuit and the power circuit, and does not consider the replaceability of the payload and the expandability of the device. SUMMARY
[0005] In view of the above defects or improvement needs of the prior art, the present application provides an additive manufacturing device with a waste heat recovery system and a method thereof. The additive manufacturing module has an atmosphere protection function, and a fan is used to drive the protective atmosphere to cool the deposited layer. The air flow passes through the fin heat sink and the thermoelectric conversion module for heat exchange. The thermoelectric conversion module exchanges heat with the substrate of the additive manufacturing module, and the deposited layer is cooled through the substrate. The low-temperature cooling medium flowing out of the thermal control module exchanges heat with the thermoelectric conversion module, and the electric energy generated by the thermoelectric conversion module is collected by the power storage module, thereby realizing the utilization of waste heat in the additive manufacturing process, reducing the energy consumption of the equipment, and effectively reducing the waste heat generated by the equipment.
[0006] To achieve the above-mentioned purpose, according to one aspect of the present application, an additive manufacturing device with a waste heat recovery system is provided, comprising:
[0007] An additive manufacturing module, the additive manufacturing module comprising an atmosphere protection unit and a driving unit for driving the protective atmosphere in the atmosphere protection unit to form convection;
[0008] A first thermoelectric conversion module for exchanging heat with the heat carried by the protective atmosphere and exchanged with the deposited layer;
[0009] A second thermoelectric conversion module for exchanging heat with the substrate in the additive manufacturing module;
[0010] A thermal control module in communication with the first and second thermoelectric conversion modules through a cooling medium pipeline for exchanging heat with the first and second thermoelectric conversion modules through a cooling medium;
[0011] A power storage module for converting the heat energy collected by the first and second thermoelectric conversion modules into electric energy and providing electric energy for the additive manufacturing module.
[0012] As a further preferred, the additive manufacturing module comprises a finned heat sink, and the protective atmosphere exchanges heat with the first thermoelectric conversion module through the finned heat sink.
[0013] The heat control module comprises a liquid-cooled heat exchange copper plate, and a first disc-shaped flow channel for cooling medium to flow is arranged in the liquid-cooled heat exchange copper plate. The cooling medium exchanges heat with the liquid-cooled heat exchange copper plate when flowing through the disc-shaped flow channel.
[0014] As a further preferred, the protective atmosphere comprises any one or a mixture of more than one of helium, neon, argon, and xenon.
[0015] The finned heat sink is made of any one of copper, aluminum, and iron, and has a heat absorption power of 300-700 W.
[0016] As a further preferred, the first thermoelectric conversion module comprises a first semiconductor thermoelectric generation sheet and a first heat exchange copper plate. The high-temperature end of the first semiconductor thermoelectric generation sheet is arranged on the liquid-cooled heat exchange copper plate, and the low-temperature end is arranged on the first heat exchange copper plate. The first heat exchange copper plate is fixedly connected to the finned heat sink.
[0017] As a further preferred, the second thermoelectric conversion module comprises a second semiconductor thermoelectric generation sheet and a second heat exchange copper plate. The low-temperature end of the second semiconductor thermoelectric generation sheet is arranged on the liquid-cooled heat exchange copper plate, and the high-temperature end is arranged on the second heat exchange copper plate. The second heat exchange copper plate is fixedly connected to the substrate.
[0018] As a further preferred, a heat-conductive silicone grease is coated between the second heat exchange copper plate and the substrate.
[0019] As a further preferred, the heat control module comprises a circulating pump, a first cooling medium pipeline, and a third cooling medium pipeline. The circulating pump is in communication with the liquid-cooled heat exchange copper plate. The first cooling medium pipeline is used to connect the circulating pump and the first thermoelectric conversion module, so that the cooling medium forms a first circulation loop. The third cooling medium pipeline is used to connect the circulating pump and the second thermoelectric conversion module, so that the cooling medium forms a second circulation loop.
[0020] As a further preferred, a first electrically-driven flow regulating valve is arranged on the first cooling medium pipeline, and a second electrically-driven flow regulating valve is arranged on the third cooling medium pipeline.
[0021] As a further preferred, the power storage module comprises a storage battery, which is connected to the first thermoelectric conversion module, the second thermoelectric conversion module, and the additive manufacturing module through a cable assembly, respectively.
[0022] According to another aspect of the present application, there is also provided an additive manufacturing method with a waste heat recovery system, comprising the following steps:
[0023] Step one, the additive manufacturing module prints according to the set printing parameters, and the driving unit drives the atmosphere protection unit to form a convection to exchange heat with the finned heat sink;
[0024] Step two, the thermal control module identifies the temperature of the finned heat sink, and controls the flow and flow rate of the cooling medium according to the temperature, so that the first thermoelectric conversion module exchanges heat with the finned heat sink, and the second thermoelectric conversion module exchanges heat with the substrate in the additive manufacturing module;
[0025] Step three, the power storage module is used to convert the heat energy collected by the first and second thermoelectric conversion modules into electrical energy, and provide electrical energy for the additive manufacturing module.
[0026] Overall, compared with the prior art, the above technical solutions conceived by the present application mainly have the following technical advantages:
[0027] 1. The additive manufacturing module of the present application has atmosphere protection, and the fan drives the atmosphere protection to cool the deposited layer, and the airflow exchanges heat with the thermoelectric conversion module through the finned heat sink. The thermoelectric conversion module exchanges heat with the substrate of the additive manufacturing module, and the deposited layer is cooled through the substrate. The thermal control module flows out low-temperature cooling medium to exchange heat with the thermoelectric conversion module, and the electrical energy generated by the thermoelectric conversion module is collected by the power storage module, thereby realizing waste heat utilization in the additive manufacturing process, reducing the energy consumption of the equipment, and effectively reducing the waste heat generated by the equipment.
[0028] 2. The present application introduces a thermoelectric conversion module to generate electricity using the heat generated during the additive process, reduce the waste heat generated by the device, and improve the energy utilization rate of the device. The first thermoelectric conversion module, the second thermoelectric conversion module and the thermal control module are connected in parallel, and an electrically operated flow regulating valve is used to control the flow of cooling medium through the first and second thermoelectric conversion modules, respectively, to freely regulate and control the heat exchange capacity of the air cooling and substrate cooling of the additive manufacturing device.
[0029] 3. The liquid cooling heat exchange copper plate of the thermal control module is connected to the system by a quick connector, and can be connected to the temperature control system of a satellite, spacecraft, space station, space base and other space facilities for heat conduction heat exchange, or the liquid cooling copper plate can be removed, and the pipeline of the thermal control module can be connected to the pipeline of the temperature control system of the space facility through the quick connector, so that the cooling medium of the temperature control system of the space facility can be directly introduced, and the additive manufacturing equipment can be quickly connected to the temperature control system of the space facility.
[0030] 4. The power storage module of the device is connected to the system through a cable quick connector, which facilitates the replacement of subsequent modules or the rapid integration of the additive manufacturing device into the power system of a satellite, spacecraft, space station, space base station, or other space facility.
[0031] 5. The present application innovatively improves the traditional PID control formula by introducing an adaptive and predictive mechanism to improve the efficiency and response speed of the thermal management system of the additive manufacturing device. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is a structural schematic diagram of an additive manufacturing device with a waste heat recovery system according to an embodiment of the present application.
[0033] In all the drawings, the same reference signs represent the same technical features, specifically: 1 - additive manufacturing module, 2 - first thermoelectric conversion module, 3 - second thermoelectric conversion module, 4 - power storage module, 5 - thermal control module, 6 - liquid cooling heat exchange copper plate, 7 - circulating pump, 8 - first electrically operated flow regulating valve, 9 - second electrically operated flow regulating valve, 10 - heat collected by the finned radiator, 11 - first cooling medium pipeline, 12 - second cooling medium pipeline, 13 - third cooling medium pipeline, 14 - second cooling medium pipeline, 15 - first cable, 16 - second cable, 17 - third cable, 18 - heat collected by the base plate of the additive manufacturing module 1. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solutions and advantages of the present application clearer and more apparent, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.
[0035] As shown in Figure 1 , the additive manufacturing device with a waste heat recovery system according to an embodiment of the present application comprises: an additive manufacturing module 1, which comprises an atmosphere protection unit and a driving unit for driving the formation of a protective atmosphere convection in the atmosphere protection unit; a first thermoelectric conversion module 2 for exchanging heat with the heat carried by the protective atmosphere and exchanged with the deposited layer; a second thermoelectric conversion module 3 for exchanging heat with the base plate in the additive manufacturing module 1; a thermal control module 5 in communication with the first thermoelectric conversion module 2 and the second thermoelectric conversion module 3 through a cooling medium pipeline, for exchanging heat with the first thermoelectric conversion module 2 and the second thermoelectric conversion module 3 through a cooling medium; and a power storage module 4 for converting the heat energy collected by the first thermoelectric conversion module 2 and the second thermoelectric conversion module 3 into electrical energy and providing electrical energy for the additive manufacturing module 1.
[0036] Based on the above embodiment, the additive manufacturing module 1 includes a finned heat sink, and the protective atmosphere exchanges heat with the first thermoelectric conversion module 2 through the finned heat sink; the thermal control module 5 includes a liquid-cooled heat exchange copper plate 6, and the liquid-cooled heat exchange copper plate 6 is provided with a first disc-shaped flow channel for the flow of a cooling medium, and the cooling medium exchanges heat with the liquid-cooled heat exchange copper plate 6 when flowing through the disc-shaped flow channel. The first thermoelectric conversion module 2 includes a first semiconductor thermoelectric generator sheet and a first heat exchange copper plate, the high-temperature end of the first semiconductor thermoelectric generator sheet is attached to the liquid-cooled heat exchange copper plate 6, and the low-temperature end of the first semiconductor thermoelectric generator sheet is attached to the first heat exchange copper plate, and the first heat exchange copper plate is fixedly connected to the finned heat sink. The second thermoelectric conversion module 3 includes a second semiconductor thermoelectric generator sheet and a second heat exchange copper plate, the low-temperature end of the second semiconductor thermoelectric generator sheet is attached to the liquid-cooled heat exchange copper plate 6, and the high-temperature end of the second semiconductor thermoelectric generator sheet is attached to the second heat exchange copper plate, and the second heat exchange copper plate is fixedly connected to the substrate. The thermal control module 5 includes a circulating pump 7, a first cooling medium pipeline 11 and a third cooling medium pipeline 13, the circulating pump 7 is communicated with the liquid-cooled heat exchange copper plate 6, the first cooling medium pipeline 11 is used to communicate the circulating pump 7 and the first thermoelectric conversion module 2, so that the cooling medium forms a first circulation loop; the third cooling medium pipeline 13 is used to communicate the circulating pump 7 and the second thermoelectric conversion module 3, so that the cooling medium forms a second circulation loop. The first cooling medium pipeline 11 is provided with a first electrically-driven flow regulating valve 8, and the third cooling medium pipeline 13 is provided with a second electrically-driven flow regulating valve 9.
[0037] More specifically, the finned heat sink is used to collect the heat of the protective atmosphere, and the heat 10 collected by the finned heat sink is transmitted to the liquid-cooled heat exchange copper plate 6 through the first heat exchange copper plate and the first semiconductor thermoelectric generator sheet, that is, the high-temperature end of the first semiconductor thermoelectric generator sheet is attached to the liquid-cooled heat exchange copper plate 6, and the low-temperature end of the first semiconductor thermoelectric generator sheet is attached to the first heat exchange copper plate. The second thermoelectric conversion module 3 is connected with the power storage module 4 through the first cable 15. The heat 18 collected by the substrate of the additive manufacturing module 1 is transmitted to the second thermoelectric conversion module 3, and the second thermoelectric conversion module 3 is connected with the power storage module 4 through the second cable 16, and the power storage module 4 is connected with the additive manufacturing module 1 through the third cable 17. In addition, the first thermoelectric conversion module 2 is connected with the liquid-cooled heat exchange copper plate 6 through the second cooling medium pipeline 12, and the liquid-cooled heat exchange copper plate 6 is connected with the first thermoelectric conversion module 2 through the first cooling medium pipeline 11, so as to form a circulation loop of the cooling liquid. Correspondingly, the second thermoelectric conversion module 3 is connected with the liquid-cooled heat exchange copper plate 6 through the fourth cooling medium pipeline 14, and the liquid-cooled heat exchange copper plate 6 is connected with the second thermoelectric conversion module 3 through the third cooling medium pipeline 13, so as to form a circulation loop of the cooling liquid.
[0038] Based on any of the above embodiments or a combination of multiple embodiments, the protective atmosphere includes any one or a mixture of helium, neon, argon, xenon; the finned heat sink is made of any one of copper, aluminum and iron, and has a heat absorption power of 300-700W.
[0039] In addition, based on any of the above embodiments or a combination of multiple embodiments, in this embodiment, the additive manufacturing module 1 further includes a ratchet member for additive manufacturing, which is provided with micro-convex fins that can adsorb liquid metal for additive manufacturing on the body by capillary adsorption force in a zero-gravity environment. The ratchet member also includes a ratchet rod, and a plurality of micro-convex fins are arranged in an array along the circumference of the ratchet rod to form a ring-shaped micro-convex fin structure. The micro-convex fins are provided with ratchet wires, and the angle between the ratchet wires and the central axis of the ratchet rod is a non-right angle. The angle between the ratchet wires and the central axis of the ratchet rod is an acute angle. The diameter of the ratchet wire is not greater than the single-layer metal droplet cladding thickness, so as to achieve good capillary adsorption effect. In this way, it can be applied to the field of laser wire feeding additive manufacturing in a zero-gravity space environment, and the capillary adsorption force between solid and liquid can be used to more effectively complete the adsorption forming of liquid material. The use of micro-convex fins on the ratchet wire can multiply the capillary adsorption force compared to a smooth rod. This is extremely effective for the laser wire feeding additive process in a zero-gravity space environment. Overall, it plays a role of replacing gravity and exceeds the effect of gravity.
[0040] Based on any of the above embodiments or a combination of multiple embodiments, the second heat exchange copper plate and the substrate are also coated with a heat-conducting silicone grease.
[0041] In addition, the present embodiment also provides an additive manufacturing method with a waste heat recovery system, comprising the following steps:
[0042] Step one, the additive manufacturing module 1 prints according to the set printing parameters, and the driving unit drives the formation of convection of the protective atmosphere in the atmosphere protection unit to exchange heat with the finned heat sink;
[0043] Step two, the thermal control module 5 identifies the temperature of the finned heat sink, and controls the flow and flow rate of the cooling medium according to the temperature, so that the first thermoelectric conversion module 2 exchanges heat with the finned heat sink, and the second thermoelectric conversion module 3 exchanges heat with the substrate in the additive manufacturing module 1;
[0044] Step three, the power storage module 4 is used to convert the heat energy collected by the first thermoelectric conversion module 2 and the second thermoelectric conversion module 3 into electrical energy, and provide electrical energy for the additive manufacturing module 1.
[0045] More specifically, to effectively adjust the flow of cooling medium according to the temperature of the substrate and the heat dissipation fins, and improve the thermal management efficiency of the additive manufacturing device, in this embodiment, temperature sensors need to be installed on the substrate and the heat dissipation fins to monitor their temperatures in real time. Let the substrate temperature be Tb and the heat dissipation fin temperature be Tf. Set temperature thresholds for the device, and when Tb or Tf exceeds the threshold, the flow of cooling medium needs to be adjusted. Let the substrate temperature threshold be Tbmax and the heat dissipation fin temperature threshold be Tfmax. Use an electric flow regulating valve to control the flow of cooling medium. The flow Q can be adjusted according to the temperature difference, and the formula can be expressed as:
[0046]
[0047] where Q0 is the base flow and k is the flow adjustment coefficient, which can be adjusted according to the actual system characteristics.
[0048] The speed of the circulating pump can be adjusted according to the flow Q to ensure that the cooling medium can circulate effectively. The speed of the pump N can be expressed as:
[0049] N = N0 + mQ
[0050] Considering the heat exchange efficiency, the following formula can be used to calculate:
[0051]
[0052] where Cp is the specific heat capacity of the cooling medium, Tin and Tout are the inlet and outlet temperatures of the cooling medium, and P is the power of the heat exchanger.
[0053] In a preferred embodiment, the thermal control module 5 also integrates a PID controller, and the parameters K p , K i , K d of the PID controller are set. These parameters need to be adjusted through experiments or optimization algorithms to achieve the best control effect. Calculate the difference between the actual temperature of the substrate and the heat dissipation fins and the set temperature, i.e. the error e(t). Calculate the control output according to the PID formula, which is used to adjust the opening of the electric flow regulating valve, thereby controlling the flow of cooling medium. Further, in this step, an adaptive PID control model is constructed, which introduces an adaptive mechanism based on traditional PID control to adjust the PID parameters according to the real-time performance of the system. The adaptive PID control formula can be expressed as:
[0054]
[0055] In combination with a prediction algorithm such as model predictive control (MPC), the future error is predicted and the control output is adjusted in advance to reduce system delay. The predictive PID control formula can be expressed as:
[0056]
[0057] A fuzzy logic system is introduced to dynamically adjust the PID parameters based on the fuzzy sets of error and error rate of change. The fuzzy PID control formula can be represented as:
[0058]
[0059] where f is the fuzzy logic function.
[0060] Machine learning algorithms such as neural networks or support vector machines are used to learn from the system's historical data and predict the optimal PID parameters. The machine learning optimized PID control formula can be represented as:
[0061]
[0062] Global optimization algorithms such as genetic algorithms or particle swarm optimization are used to find the optimal PID parameter combination. The optimization objective function can be represented as:
[0063]
[0064] where J is the performance index that needs to be minimized.
[0065] For multiple-input multiple-output (MIMO) systems, a multivariable PID controller is designed to coordinate the control strategy between different input and output. The multivariable PID control formula can be represented as:
[0066]
[0067] where u(t) and e(t) are vectors representing multiple control variables and errors.
[0068] In this embodiment, the PID control strategy can better adapt to the complexity and dynamics of the additive manufacturing device thermal management system, improve the control performance, and meet the requirements of patent creativity.
[0069] Embodiment 3
[0070] The additive manufacturing device with a waste heat recovery system provided in this embodiment comprises an additive manufacturing module 1, a thermoelectric conversion module 2, a thermoelectric conversion module 3, a power storage module 4, and a thermal control module 5. The substrate is fixed during the printing process of the additive manufacturing module 1, and the print head moves with the motion mechanism.
[0071] Further, the additive manufacturing module 1 has an atmosphere protection function. The fan-driven protective atmosphere forms a forced convection to cool the deposited layer, and the airflow exchanges heat with the thermoelectric conversion module 2 through the fin heat sink.
[0072] Further, the thermoelectric conversion module 2 is characterized in that it is composed of multiple groups of semiconductor thermoelectric generation sheets, which are fixed by a liquid-cooled heat exchange copper plate with positioning grooves and a heat exchange copper plate with positioning grooves. The liquid-cooled heat exchange copper plate has a disc-shaped flow channel inside, with cooling medium inlet and outlet pipelines on both sides. The cooling medium passes through the flow channel and exchanges heat with the liquid-cooled heat exchange copper plate. The high-temperature end of the power generation sheet is attached to the heat exchange copper plate, and the low-temperature end is attached to the liquid-cooled heat exchange copper plate. The heat exchange copper plate is attached to the finned heat sink bottom plate of the additive manufacturing module 1 and is connected by bolts.
[0073] Further, the thermoelectric conversion module 3 is characterized in that it is composed of multiple groups of semiconductor thermoelectric generation sheets, which are fixed by a liquid-cooled heat exchange copper plate with positioning grooves and a heat exchange copper plate with positioning grooves. The high-temperature end of the power generation sheet is attached to the heat exchange copper plate, and the low-temperature end is attached to the liquid-cooled heat exchange copper plate. The heat exchange copper plate is attached to the substrate of the additive manufacturing module 1, and both are uniformly coated with thermal conductive silicone grease and connected by bolts.
[0074] Further, the power storage module 4 is characterized in that it is composed of a circuit system, a battery, and an electric control component. The power storage module 4 is connected to the additive manufacturing equipment by a cable quick connector, making it easy to replace the module or quickly integrate the equipment into the power system of the space facility. It provides power to the additive manufacturing module 1, and the electrical energy generated by the thermoelectric conversion module 2 and the thermoelectric conversion module 3 is stored in the power storage module 4.
[0075] Further, the thermal control module 5 is characterized in that it is composed of a pipeline system, a circulating pump, and a liquid-cooled heat exchange copper plate. The liquid-cooled heat exchange copper plate is connected to the module by a pipeline quick connector. The cooling medium is driven by the pump to circulate, flows out of the liquid-cooled heat exchange copper plate, and is controlled by electric flow regulating valves to control the flow of the cooling medium to the thermoelectric conversion module 2 and the thermoelectric conversion module 3. The cooling medium finally flows back to the liquid-cooled heat exchange copper plate, which is attached to the heat collection module of the space facility temperature control system, and the heat is introduced into the temperature control system. Or remove the liquid-cooled heat exchange copper plate and use the pipeline quick connector to connect the thermal control module 5 pipeline to the space facility temperature control system cooling medium circulation pipeline. With the help of the cooling medium, heat exchange between the two is achieved.
[0076] Example 4
[0077] As shown in Figure 1 the embodiment of the present application provides an additive manufacturing device with a waste heat recovery system, which is composed of an additive manufacturing module 1, a thermoelectric conversion module 2, a thermoelectric conversion module 3, a power storage module 4, and a thermal control module 5. In the additive manufacturing module 1, the substrate is fixed during the printing process, and the print head moves with the motion mechanism. The types of motion mechanisms that can be selected include but are not limited to three-axis motion mechanisms, six-axis robots, or combinations of six-axis robots and two-axis positioners.
[0078] Specifically, A is the outlet and B is the inlet, wherein: 1 is the additive manufacturing module, 2 is the thermoelectric conversion module, 3 is the thermoelectric conversion module, 4 is the power storage module, 5 is the thermal control module, 6 is the liquid cooling heat exchange copper plate, 7 is the circulating pump, 8 is the electric flow regulating valve, 9 is the electric flow regulating valve, 10 is the heat collected by the finned radiator, the heat is in contact with the surface of the heat exchange copper plate of the thermoelectric conversion module 2 through the bottom plate of the finned radiator, and is conducted to the thermoelectric conversion module 2, 11 is the cooling medium pipeline, the low-temperature cooling medium flows into the thermoelectric conversion module 2 through the pipeline 11 by the thermal control module 5, 12 is the cooling medium pipeline, the high-temperature cooling medium flows into the thermal control module 5 through the pipeline 12 by the thermoelectric conversion module 2, 13 is the cooling medium pipeline, the low-temperature cooling medium flows into the thermoelectric conversion module 3 through the pipeline 13 by the thermal control module 5, 14 is the cooling medium pipeline, the high-temperature cooling medium flows into the thermal control module 5 through the pipeline 14 by the thermoelectric conversion module 3, 15 is the cable, the electric energy generated by the thermoelectric conversion module 2 is stored in the power storage module 4 through the cable 15, 16 is the cable, the electric energy generated by the thermoelectric conversion module 3 is stored in the power storage module 4 through the cable 16, 17 is the cable, the power storage module 4 supplies power to the additive manufacturing module 1 through the cable 17, 18 is the heat collected by the base plate of the additive manufacturing module 1, the heat is in contact with the surface of the heat exchange copper plate of the thermoelectric conversion module 3 through the base plate, and is conducted to the thermoelectric conversion module 3.
[0079] Further, the additive manufacturing module 1 has an atmosphere protection, a fan driven protection atmosphere forms forced convection to cool the deposition layer, and the airflow exchanges heat with the thermoelectric conversion module 2 through the finned radiator. The protection atmosphere uses inert gases including but not limited to helium, neon, argon, xenon and the like, and mixed gases thereof. The material of the finned radiator is copper, aluminum and iron and the like, and the absorption power is 300-700 W.
[0080] The thermoelectric conversion module is characterized in that: it is composed of multiple groups of semiconductor thermoelectric generation sheets, which are fixed by one piece of liquid cooling heat exchange copper plate with positioning groove and one piece of heat exchange copper plate with positioning groove, the high-temperature end of the generation sheet is attached to the heat exchange copper plate, and the low-temperature end is attached to the liquid cooling heat exchange copper plate. The liquid cooling heat exchange copper plate has a disc-shaped flow channel inside, and cooling medium inlet and outlet pipelines are left on both sides, and the cooling medium exchanges heat with the liquid cooling heat exchange copper plate in the flow channel. The heat exchange copper plate is attached to the base plate of the additive manufacturing module 1, and the two are uniformly coated with thermal conductive silicone grease and connected by bolts. The thermoelectric generation sheet selects Seeback's high-temperature-resistant thermoelectric generation sheet, the output voltage is 0-5.2 V, and the size is 62*62 mm. The absorption power of the liquid cooling heat exchange copper plate is 300-700 W, and the cooling medium is deionized water.
[0081] Further, the power storage module 4 is characterized by being composed of circuit system, battery and electric control components. The power storage module 4 is connected to the additive manufacturing equipment by cable quick connector, which facilitates the replacement of the module or the removal of the battery to integrate the additive manufacturing equipment into the power system of the space facility. It provides power to the additive manufacturing module 1, and the power generated by the thermoelectric conversion module 2 and the thermoelectric conversion module 3 is stored in the power storage module 4. The cable quick connector can be selected as an aviation plug.
[0082] Further, the thermal control module 5 is characterized by being composed of pipeline system, circulating pump and liquid cooling heat exchange copper plate. The liquid cooling heat exchange copper plate is connected to the module by pipeline quick connector. The cooling medium is driven by the pump to circulate, flows out of the liquid cooling heat exchange copper plate, and is guided to the cooling medium of the thermoelectric conversion module 2 and the thermoelectric conversion module 3, whose flow is controlled by electric flow regulating valve respectively. The cooling medium finally flows back to the liquid cooling heat exchange copper plate, which is attached to the heat collection module of the temperature control system of the space facility to guide the heat into the temperature control system. Or the liquid cooling heat exchange copper plate is removed, the pipeline of the thermal control module 5 is connected to the cooling medium circulation pipeline of the temperature control system of the space facility by pipeline quick connector, and the heat exchange between them is realized by the cooling medium. The pipeline in the pipeline system can be selected as copper pipe, aluminum pipe, etc., and the inner diameter of the pipeline is 6-8mm. The circulating pump can be selected as gear pump, centrifugal pump, etc., and the flow is 0.1-0.8L / min. The flow of the electric flow regulating valve is 0.1-0.8L / min.
[0083] Those skilled in the art will readily understand that the above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An additive manufacturing device with a waste heat recovery system, characterized in that: include: An additive manufacturing module (1), comprising an atmosphere protection unit and a driving unit for driving the protective atmosphere in the atmosphere protection unit to form convection; a first heat-to-electricity conversion module (2) for performing heat exchange with the heat carried by the protective atmosphere and exchanged with the deposited layer; a second heat-to-electricity conversion module (3) for performing heat exchange with the substrate in the additive manufacturing module (1); a thermal control module (5), which is in communication with the first heat-to-electricity conversion module (2) and the second heat-to-electricity conversion module (3) via a cooling medium pipeline and is used for performing heat exchange with the first heat-to-electricity conversion module (2) and the second heat-to-electricity conversion module (3) via the cooling medium; an electricity storage module (4) for converting the heat energy collected by the first heat-to-electricity conversion module (2) and the second heat-to-electricity conversion module (3) into electrical energy, and providing electrical energy for the additive manufacturing module (1); The additive manufacturing module (1) comprises a finned heat sink, and the protective atmosphere exchanges heat with the first heat-to-electricity conversion module (2) through the finned heat sink; The thermal control module (5) includes a liquid-cooled heat exchange copper plate (6), wherein a first disc-shaped flow channel for a cooling medium to flow is provided in the liquid-cooled heat exchange copper plate (6), and when the cooling medium flows through the disc-shaped flow channel, heat is exchanged with the liquid-cooled heat exchange copper plate (6).
2. The additive manufacturing device with a waste heat recovery system according to claim 1, characterized in that: The protective atmosphere includes any one or more mixtures of helium, neon, argon, and xenon; The finned heat sink is made of any one of copper, aluminum and iron, and its heat absorption power is 300-700W.
3. The additive manufacturing device with a waste heat recovery system according to claim 1, characterized in that: The first heat-to-electricity conversion module (2) comprises a first semiconductor thermoelectric power generation sheet and a first heat exchange copper plate, wherein the low-temperature end of the first semiconductor thermoelectric power generation sheet is attached to the liquid-cooled heat exchange copper plate (6), and the high-temperature end thereof is attached to the first heat exchange copper plate, and the first heat exchange copper plate is attached and fixedly connected to the finned heat sink.
4. The additive manufacturing device with a waste heat recovery system according to claim 1, characterized in that: The second heat-to-electricity conversion module (3) comprises a second semiconductor thermoelectric power generation sheet and a second heat exchange copper plate, wherein the low-temperature end of the second semiconductor thermoelectric power generation sheet is attached to the liquid-cooled heat exchange copper plate (6), and the high-temperature end thereof is attached to the second heat exchange copper plate, and the second heat exchange copper plate is attached and fixedly connected to the substrate.
5. The additive manufacturing device with a waste heat recovery system according to claim 4, characterized in that: Thermal conductive silicone grease is also coated between the second heat exchange copper plate and the base plate.
6. The additive manufacturing device with a waste heat recovery system according to claim 1, characterized in that: The thermal control module (5) comprises a circulation pump (7), a first cooling medium pipeline (11) and a third cooling medium pipeline (13); the circulation pump (7) is connected to the liquid-cooled heat exchange copper plate (6); the first cooling medium pipeline (11) is used to connect the circulation pump (7) and the first heat-to-electricity conversion module (2) so that the cooling medium forms a first circulation loop; the third cooling medium pipeline (13) is used to connect the circulation pump (7) and the second heat-to-electricity conversion module (3) so that the cooling medium forms a second circulation loop.
7. The additive manufacturing device with a waste heat recovery system according to claim 6, characterized in that: A first electric flow regulating valve (8) is provided on the first cooling medium pipeline (11), and a second electric flow regulating valve (9) is provided on the third cooling medium pipeline (13).
8. The additive manufacturing device with a waste heat recovery system according to any one of claims 1 to 7, characterized in that: The power storage module (4) comprises a storage battery, which is respectively connected to the first heat-to-electricity conversion module (2), the second heat-to-electricity conversion module (3), and the additive manufacturing module (1) via a cable assembly.
9. An additive manufacturing method with a waste heat recovery system, implemented using an additive manufacturing device with a waste heat recovery system according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1: the additive manufacturing module (1) performs printing according to the set printing parameters, and the driving unit drives the protective atmosphere in the atmosphere protection unit to form convection to perform heat exchange with the fin heat sink; Step 2: The thermal control module (5) identifies the temperature of the finned heat sink and controls the flow rate and flow velocity of the cooling medium according to the temperature of the finned heat sink, so that the first heat-to-electricity conversion module (2) and the finned heat sink are heat-exchanged, and at the same time, the second heat-to-electricity conversion module (3) and the substrate in the additive manufacturing module (1) are heat-exchanged; In step three, the power storage module (4) is used to convert the heat energy collected by the first heat-to-electricity conversion module (2) and the second heat-to-electricity conversion module (3) into electrical energy, and provide electrical energy for the additive manufacturing module (1).
Citation Information
Patent Citations
Waste heat power generation and combined heat and power generation device and system utilizing cooling air of I-shaped furnace
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