An automated device for optimizing the termination quality of MLCC ceramic capacitors

Abstract

The present invention discloses an automated device for optimizing the end-capping quality of MLCC ceramic capacitors, which relates to the field of end-capping treatment of ceramic capacitors and includes: a device box body, inside which a conveying area and a processing area are arranged; at the bottom of the conveying area, a conveying rack is provided, and at the top of the conveying rack, a tray is provided; a processing table, arranged at the center of the inside of the processing area, on the top of the processing table, a control box is provided, and above the control box, two groups of symmetrically distributed clamping blocks are provided, and a control mechanism is arranged inside the control box; a guiding rack, arranged inside the device box body, on the guiding rack, a third electric push rod is provided, and at the bottom of the third electric push rod, a picking mechanism is provided; a cutting assembly, symmetrically arranged inside the processing area, including a guide rail and a laser cutter head. This automated device for optimizing the end-capping quality of MLCC ceramic capacitors can simultaneously perform surface modification on the ends of multiple ceramic chips to ensure their flatness and welding performance, and improve the end-capping quality of MLCC ceramic capacitors.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic capacitor end - sealing treatment, and particularly to an automated device for optimizing the end - sealing quality of MLCC ceramic capacitors. Background Art

[0002] An MLCC is composed of multiple layers of ceramic dielectric films. These films are stacked together in a misaligned manner and form a ceramic chip through a one - time high - temperature sintering. Metal layers are sealed at both ends of the chip as electrodes. MLCC products are small in size, high in precision, convenient for high - efficiency assembly by automatic chip mounters, and are applicable to many electronic devices such as communication, computers, household appliances, and instruments.

[0003] During the end - sealing process of both ends of an MLCC ceramic capacitor, due to the relatively rough surface of the end of the ceramic chip after preliminary processing, and problems such as metal impurities, dust, or scratches, during end - sealing, the insufficient flatness of the end of the ceramic chip affects the welding performance of the metal layer, resulting in defects such as voids, cracks, and offsets in the MLCC ceramic capacitor after end - sealing, reducing the end - sealing quality of the MLCC ceramic capacitor, and causing quality problems such as ceramic damage or exposed electrodes in subsequent process products. Summary of the Invention

[0004] Technical problems to be solved: The surface of the end of the ceramic chip after preliminary processing is relatively rough, affecting the welding performance of the metal layer, resulting in defects such as voids, cracks, and offsets in the MLCC ceramic capacitor after end - sealing, and reducing the end - sealing quality of the MLCC ceramic capacitor.

[0005] In view of the deficiencies of the prior art, the present invention provides an automated device for optimizing the end - sealing quality of MLCC ceramic capacitors, thereby solving the technical problems mentioned in the background art.

[0006] Technical solutions:

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0008] An automated device for optimizing the end - sealing quality of MLCC ceramic capacitors, comprising: an equipment box body, inside which a conveying area and a processing area are provided. The conveying area is located in front of the processing area, and a conveying rack is provided at the bottom of the conveying area. A tray is provided on the top of the conveying rack, and ceramic chips distributed in a rectangular array are supported on the tray. A limiting baffle is provided above the conveying rack and near the left end.

[0009] The processing table is arranged at the inner center of the processing area. A control box is arranged on the top of the processing table. Two sets of clamping blocks symmetrically distributed front and back are arranged above the control box. Each clamping block is rotatably connected to the control box. A control mechanism for driving the clamping block to rotate 180° is arranged inside the control box. The control mechanism includes a control frame, a connecting plate and an adjusting plate. The control frame is slidably arranged inside the control box. The connecting plate is fixedly connected to the clamping block. The two ends of the adjusting plate are respectively rotatably connected to the control frame and the connecting plate;

[0010] The guiding frame is arranged inside the equipment box body. A third electric push rod is slidably connected to the guiding frame. A picking mechanism is installed at the bottom of the third electric push rod, which is used to move the whole group of ceramic chips on the tray to the inside of the clamping block for fixing. The picking mechanism includes a vacuum suction plate. Two sets of suction pipes symmetrically distributed front and back are arranged at the bottom of the vacuum suction plate. Each suction pipe corresponds to the clamping block respectively. A suction cup is arranged at the bottom of the suction pipe. A movable head rotatably connected to the vacuum suction plate is arranged at the top of the suction pipe;

[0011] The cutting assembly is symmetrically arranged inside the processing area. The cutting assembly includes guide rails and laser cutter heads symmetrically arranged on the front and back sides of the control box. A sliding seat is slidably connected to the guide rail. The laser cutter head is installed on the sliding seat.

[0012] In a possible implementation manner, a partition is arranged between the conveying area and the processing area, and there is a space for the picking mechanism to move between the upper part of the partition and the inner top wall of the equipment box body. The front inner wall of the equipment box body is of a hollow structure, and a control system is arranged inside it. A display screen is installed at the front side of the equipment box body and near the top. A plurality of uniformly distributed control buttons are arranged at the bottom of the display screen. Heat dissipation holes are opened on the side walls of the equipment box body and on the left and right sides of the processing area.

[0013] In a possible implementation manner, a conveyor belt is installed at the inner side of the conveying frame and near the top. A first motor for driving the conveyor belt is installed at the left front side of the conveying frame. The tray is placed on the upper surface of the conveyor belt. A rectangular array of receiving grooves is arranged on the top of the tray. Each ceramic chip is respectively arranged inside the receiving groove. Movable feet are arranged at both ends of the limiting baffle. The movable feet are rotatably connected to the inner wall of the equipment box body. A control motor for driving the movable feet to rotate 90° is installed in the front inner wall of the equipment box body.

[0014] In a possible implementation manner, a chip removal box is installed on the inner bottom wall of the equipment box body and below the processing table. Chip inlet openings are arranged on the top of the chip removal box and on the front and back sides of the processing table. A protective cover is arranged on the top of the chip removal box and outside the chip inlet openings, and the top of the protective cover is located between the laser cutter head and the sliding seat.

[0015] In a possible implementation, a pallet is installed on the top of the control box. The clamping blocks are symmetrically arranged in an array in the front and back above the pallet. A control shaft rotatably connected to the pallet is provided at the center of the bottom of the clamping block. The end of the connecting plate is fixedly connected to the bottom of the control shaft. The control frame is slidably arranged inside the control box. Symmetrically distributed control grooves are provided at the top of the control frame. Connecting holes are arranged in an array on the inner side of the control groove. The adjusting plates are arranged in an array on the inner side of the control groove. One end of the adjusting plate is rotatably connected to the connecting hole through a rotating shaft, and the other end of the adjusting plate is rotatably connected to the connecting plate through a rotating shaft. A first electric push rod for pushing the control frame to slide is installed on the left side of the control box.

[0016] In a possible implementation, the top of the clamping block is an open structure that is symmetric left and right. Anti-slip pads are provided on both the left and right side walls of the clamping block. Spring clips are installed on the side wall of the clamping block near the bottom end.

[0017] In a possible implementation, symmetrically distributed positioning plates are provided between the front and back groups of clamping blocks above the control box. Limit frames are provided at both the left and right ends of the positioning plate. The bottom of the limit frame is integrally formed with the upper surface of the control box. A first spring is installed between the limit frame and the positioning plate. The opposite sides of the bottom of the positioning plate are bevel-shaped. A receiving groove penetrating up and down is provided near the center of the control frame. A wedge-shaped push block is provided inside the receiving groove. The wedge-shaped push block penetrates the pallet, and the top of the wedge-shaped push block contacts the bevel on the bottom of the positioning plate. A second electric push rod for pushing the wedge-shaped push block to move up and down is installed inside the control box at the bottom of the receiving groove.

[0018] In a possible implementation, the guiding frame is fixedly connected to the inner top wall of the equipment box body. A guiding block slidably connected to the guiding frame is provided at the top of the third electric push rod. A rotatable first lead screw is installed at the top end of the guiding frame. The first lead screw penetrates the guiding block and is threadedly connected to the guiding block. A second motor for driving the first lead screw to rotate is installed at the top of the guiding frame. The top of the vacuum suction plate is fixedly connected to the end of the push rod of the third electric push rod. A vacuum generator is installed at the top of the equipment box body near the left end. A connecting pipe is provided for connecting the vacuum generator and the vacuum suction plate.

[0019] In a possible implementation, the movable head is rotatably connected to the bottom of the vacuum suction plate, and a sealing ring is provided between the movable head and the vacuum suction plate. Triangular prisms are symmetrically distributed front and back on the outer wall of the movable head. A locking seat is installed at the bottom of the vacuum suction plate and near the center. High-definition cameras are symmetrically arranged left and right at the bottom of the locking seat. Symmetrically distributed front and back locking plates are slidably connected inside the locking seat. A number of triangular grooves corresponding to the triangular prisms are provided on the locking plates. Locking grooves are arranged in an array inside the locking seat. Symmetrically distributed front and back sliding shafts are slidably connected inside the locking grooves. The ends of the front and back groups of sliding shafts are respectively fixedly connected to the front and back locking plates. A second spring is provided inside the locking grooves and between the front and back sliding shafts.

[0020] In a possible implementation, a laser generator is installed on the inner top wall of the equipment box near the right end. The laser generator is connected to the two laser cutter heads through a circuit. A rotatable second lead screw is provided on the guide rail. The second lead screw passes through the sliding seat and is threadedly connected to the sliding seat. A third motor for driving the second lead screw to rotate is installed on the left side of the guide rail.

[0021] Beneficial effects:

[0022] In this solution, by providing a processing table, clamping blocks, a picking mechanism, a cutting assembly, etc., the end of the ceramic chip can be surface-modified to remove rough substances such as metal impurities and dust existing after the preliminary processing of the ceramic chip, so as to ensure the flatness and welding performance of the ceramic chip, and further improve the capping quality of the MLCC ceramic capacitor.

[0023] In this solution, by providing two groups of symmetrically distributed clamping blocks and picking mechanisms front and back, and cooperating with the two laser cutter heads, two ceramic chips on the tray can be picked up and surface-treated simultaneously. In addition, through the mutual cooperation of the control frame, the connecting plate and the adjusting plate, the turning operations of multiple ceramic chips can be carried out simultaneously, ensuring that the ceramic chips have a high surface treatment efficiency and enabling the equipment to have a high capping optimization efficiency for the MLCC ceramic capacitor.

[0024] In this solution, by providing a positioning plate and a wedge-shaped push block, when the wedge-shaped push block moves upward, the positioning plate can align the ceramic chips on the clamping blocks. Through the mutual cooperation of the locking seat, the locking plates and the triangular prisms, the movable head can be locked and fixed, ensuring that the picking mechanism has high stability when picking up the ceramic chips. Description of the drawings

[0025] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly and implement it according to the content of the description, the following takes the preferred embodiments of the present invention and combines with the drawings to describe in detail as follows.

[0026] Figure 1 is the overall structure schematic diagram of the present invention;

[0027] Figure 2 is the internal structure schematic diagram of the equipment box of the present invention;

[0028] Figure 3 is one of the structure schematic diagrams of the conveying rack of the present invention;

[0029] Figure 4 is the second structure schematic diagram of the conveying rack of the present invention;

[0030] Figure 5 is the side view of the main structure of the present invention;

[0031] Figure 6 is the structure schematic diagram of the processing area of the present invention;

[0032] Figure 7 is the structure schematic diagram of the processing table of the present invention;

[0033] Figure 8 is the structure schematic diagram of the control box of the present invention;

[0034] Figure 9 is the structure schematic diagram of the control rack of the present invention;

[0035] Figure 10 is the structure schematic diagram of the clamping block of the present invention;

[0036] Figure 11 is the schematic diagram of the alignment mechanism of the present invention;

[0037] Figure 12 is the structure schematic diagram of the guide rack of the present invention;

[0038] Figure 13 is the structure schematic diagram of the vacuum suction plate of the present invention;

[0039] Figure 14 is the structure schematic diagram of the locking seat of the present invention;

[0040] Figure 15 is the schematic diagram of the cutting assembly of the present invention.

[0041] Legend: 1. Equipment box; 11. Conveyor area; 12. Processing area; 13. Partition; 14. Display screen; 15. Control buttons; 16. Heat dissipation holes; 2. Conveyor rack; 21. Conveyor belt; 211. First motor; 22. Tray; 221. Storage groove; 23. Ceramic chip; 24. Limit baffle; 241. Movable foot; 242. Control motor; 3. Processing table; 31. Chip removal box; 32. Chip inlet; 33. Protective cover; 4. Control box; 41. Support plate; 42. Clamp block; 421. Anti-slip pad; 422. Spring clip; 43. Control rack; 431. Control groove; 432. Connecting hole; 44. First electric push rod; 45. Control shaft; 451. Connecting plate; 46. Adjusting plate; 47. Accommodation groove; 5. Positioning plate; 51. Limit frame; 52. First spring; 53. Wedge-shaped push block; 54. Second electric push rod; 6. Guide frame; 61. Third electric push rod; 611. Guide block; 62. Vacuum suction plate; 621. Vacuum generator; 622. Connecting pipe; 63. Suction pipe; 631. Suction cup; 64. Movable head; 641. Triangular prism; 65. First lead screw; 651. Second motor; 7. Locking seat; 71. High-definition camera; 72. Locking plate; 721. Triangular groove; 73. Locking groove; 74. Sliding shaft; 75. Second spring; 8. Guide rail; 81. Slide block; 82. Laser cutter head; 83. Laser generator; 84. Second lead screw; 85. Third motor. Detailed implementation

[0042] Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention can be implemented in various different forms. Therefore, the present invention is not limited to the embodiments described below. In addition, in order to describe the present invention more clearly, components not connected to the invention will be omitted from the drawings;

[0043] The technical solutions in the embodiments of the present application are to solve the problems in the above-mentioned background technology. The general idea is as follows:

[0044] Embodiment 1:

[0045] This embodiment introduces the specific structure of an automated device for optimizing the capping quality of MLCC ceramic capacitors.

[0046] As Figures 1 - 15 shown, it includes: an equipment box 1. Inside the equipment box 1, there are a conveyor area 11 and a processing area 12. The conveyor area 11 is located in front of the processing area 12. At the bottom of the conveyor area 11, there is a conveyor rack 2. On the top of the conveyor rack 2, there is a tray 22. The tray 22 supports ceramic chips 23 distributed in a rectangular array. Above the conveyor rack 2 and near the left end, there is a limit baffle 24;

[0047] The processing table 3 is arranged at the inner center of the processing area 12. A control box 4 is arranged on the top of the processing table 3. Two sets of clamping blocks 42 are symmetrically distributed front and back above the control box 4. Each clamping block 42 is rotatably connected to the control box 4. A control mechanism for driving the clamping block 42 to rotate by 180° is arranged inside the control box 4. The control mechanism includes a control frame 43, a connecting plate 451 and an adjusting plate 46. The control frame 43 is slidably arranged inside the control box 4. The connecting plate 451 is fixedly connected to the clamping block 42. The two ends of the adjusting plate 46 are respectively rotatably connected to the control frame 43 and the connecting plate 451;

[0048] The guiding frame 6 is arranged inside the equipment box body 1. A third electric push rod 61 is slidably connected to the guiding frame 6. A picking mechanism is installed at the bottom of the third electric push rod 61, which is used to move the whole group of ceramic chips 23 on the tray 22 to the inner side of the clamping block 42 for fixation. The picking mechanism includes a vacuum suction plate 62. Two sets of suction pipes 63 are symmetrically distributed front and back at the bottom of the vacuum suction plate 62. Each suction pipe 63 corresponds to the clamping block 42 respectively. A suction cup 631 is arranged at the bottom of the suction pipe 63. A movable head 64 rotatably connected to the vacuum suction plate 62 is arranged at the top of the suction pipe 63;

[0049] The cutting assembly is symmetrically arranged inside the processing area 12. The cutting assembly includes guide rails 8 and laser cutter heads 82 symmetrically arranged on the front and back sides of the control box 4. A sliding seat 81 is slidably connected to the guide rail 8. The laser cutter head 82 is installed on the sliding seat 81.

[0050] When producing MLCC ceramic capacitors, the conveying rack 2 is connected to the production line of MLCC ceramic capacitors, and the ceramic chips 23 in the tray 22 can be conveyed to the inside of the conveying area 11. The ceramic chips 23 are limited at the left end of the conveying area 11 through the limit baffle 24 to ensure that the ceramic chips 23 are aligned with the leftmost suction pipe 63, so as to facilitate the picking mechanism to move the ceramic chips 23 onto the clamping block 42;

[0051] After the limit baffle 24 blocks and limits the tray 22, the third electric push rod 61 slides along the guiding frame 6 and drives the picking mechanism to move back and forth. Through the cooperation of the vacuum suction plate 62, the suction pipes 63 and the suction cups 631, the two groups of ceramic chips 23 can be moved from the tray 22 to the clamping block 42 for fixation. Then, the cutting assembly moves along the guide rail 8, and one side of the ceramic chip 23 can be laser cut through the laser cutter head 82, so as to perform surface modification on the end of the ceramic chip 23 to remove rough substances such as metal impurities and dust on the surface of the original component, ensure its flatness and welding performance, and further improve the capping quality of the MLCC ceramic capacitor.

[0052] After the surface treatment of the end of the ceramic chip 23 close to one side of the guide rail 8, the control frame 43 is pushed to slide inside the control box 4, and is transmitted through the connecting plate 451 and the adjusting plate 46, and the clamping block 42 is pushed to rotate 180°, so as to adjust the steering of the two groups of ceramic chips 23 at the same time, which is convenient for processing the end of the ceramic chip 23 on the other side, thereby improving the flatness of both ends of the ceramic chip 23 and avoiding defects such as voids, cracks, and particle protrusions when the MLCC ceramic capacitor is sealed.

[0053] As Figure 2 shown, a partition 13 is provided between the conveying area 11 and the processing area 12, and there is a space for the picking mechanism to move between the upper part of the partition 13 and the inner top wall of the equipment box body 1. The partition 13 can avoid interfering with the movement of the picking mechanism while installing the cutting component on the front side.

[0054] The front inner wall of the equipment box body 1 is a hollow structure, and a control system is arranged inside it, which can be used for overall control of the equipment. A display screen 14 is installed on the front side of the equipment box body 1 and close to the top. At the same time, a high-definition camera 71 is also installed at the bottom of the vacuum suction plate 62. The display screen 14 can display the pictures taken by the high-definition camera 71 in real time, so as to observe the position and surface condition of the ceramic chip 23 during the processing. A number of uniformly distributed control buttons 15 are arranged at the bottom of the display screen 14, which is convenient for setting the equipment. Heat dissipation holes 16 are opened on both sides of the side wall of the equipment box body 1 and located on the left and right sides of the processing area 12, which can dissipate heat from the processing area 12.

[0055] As Figures 2 - 4 shown, a conveyor belt 21 is installed inside the conveying rack 2 and close to the top. A first motor 211 for driving the conveyor belt 21 is installed on the left front side of the conveying rack 2. The tray 22 is placed on the upper surface of the conveyor belt 21. A rectangular array of storage grooves 221 is arranged at the top of the tray 22. Each ceramic chip 23 is respectively arranged inside the storage groove 221. The conveyor belt 21 is connected to the production line of the MLCC ceramic capacitor. When the first motor 211 operates, it can drive the conveyor belt 21 to move and continuously convey the tray 22 into the equipment box body 1, so as to perform a whole-group optimization process on the ceramic chips 23 stored on the tray 22.

[0056] Both ends of the limit baffle 24 are provided with movable feet 241. The movable feet 241 are rotatably connected to the inner wall of the equipment box body 1. A control motor 242 for driving the movable feet 241 to rotate 90° is installed in the front inner wall of the equipment box body 1. When the motor 242 operates to drive the movable feet 241 to rotate, the direction of the limit baffle 24 can be controlled. When the limit baffle 24 faces to the right, it can limit and block the tray 22 on the conveyor belt 21 to ensure that the ceramic chip 23 and the straw 63 are on the same center line. When the limit baffle 24 faces upward, the tray 22 can be allowed to move to the left, facilitating the conveyor belt 21 to convey the ceramic chip 23 in the tray 22 to the next production line.

[0057] In addition, in order to improve the overall control effect of the equipment and the suction efficiency of the picking mechanism for the ceramic chip 23, a pressure sensor can be installed on the limit baffle 24. After the tray 22 contacts the limit baffle 24, the pressure sensor can feedback a signal to the control system to facilitate controlling the picking mechanism to suck the ceramic chip 23 on the tray 22.

[0058] As Figures 5 - 7 shown, a chip removal box 31 is installed on the inner bottom wall of the equipment box body 1 and below the processing table 3. Chip inlet openings 32 are provided on the top of the chip removal box 31 and on the front and rear sides of the processing table 3. The chips generated during the processing of the ceramic chip 23 can fall into the interior of the chip removal box 31 through the chip inlet openings 32 to facilitate the collection and treatment of waste chips. A protective cover 33 is provided on the top of the chip removal box 31 and outside the chip inlet openings 32, and the top end of the protective cover 33 is located between the laser cutter head 82 and the slide base 81. The protective cover 33 can block and guide the chips generated during processing, avoiding the outward sputtering of chips while facilitating the chips to fall into the chip removal box 31 for collection.

[0059] As Figures 8 - 10 shown, a support plate 41 is installed on the top of the control box 4. Clamping blocks 42 are symmetrically arranged in an array in the front and rear above the support plate 41. A control shaft 45 rotatably connected to the support plate 41 is provided at the center of the bottom of the clamping block 42. The end of the connecting plate 451 is fixedly connected to the bottom of the control shaft 45. A control frame 43 is slidably arranged inside the control box 4. Control grooves 431 symmetrically distributed in the front and rear are provided on the top of the control frame 43. Connecting holes 432 distributed in an array are provided inside the control grooves 431. Adjusting plates 46 are arranged in an array inside the control grooves 431. One end of the adjusting plate 46 is rotatably connected to the connecting hole 432 through a rotating shaft, and the other end of the adjusting plate 46 is rotatably connected to the connecting plate 451 through a rotating shaft. A first electric push rod 44 for pushing the control frame 43 to slide is installed on the left side of the control box 4.

[0060] It should be noted that in order to facilitate the connecting plate 451 to drive the clamping block 42 to rotate, the width of the control groove 431 is greater than the rotation diameter of the connecting plate 451, so as to prevent the connecting plate 451 from contacting the inner wall of the control groove 431 during rotation.

[0061] When the first electric push rod 44 operates, it can push the control frame 43 to slide to the right inside the control box 4. During the sliding process, the control frame 43 can drive the end of the adjusting plate 46 to move to the right through the connecting hole 432. At the same time, the rotating shaft of the adjusting plate 46 rotates with the connecting hole 432, and the adjusting plate 46 rotates directly with the connecting plate 451. Through the transmission of the adjusting plate 46 and the connecting plate 451, the clamping block 42 can be driven to rotate around the control shaft 45, thereby driving the ceramic chip 23 to drive. When the control frame 43 moves to the maximum distance, the clamping block 42 can be rotated 180°, so as to convert the two ends of the ceramic chip 23, which is convenient for processing the end face of the ceramic chip 23, and further optimize the capping quality of the MLCC ceramic capacitor.

[0062] In addition, during the turning process, in order to ensure the stability of the ceramic chip 23, the suction cup 631 is always in close contact with the upper surface of the ceramic chip 23. The top of the suction pipe 63 rotates on the vacuum suction plate 62 through the movable head 64, so that the suction cup 631 and the clamping block 42 cooperate with each other to clamp and control the ceramic chip 23 during the turning process, avoiding loosening of the ceramic chip 23.

[0063] Furthermore, the top of the clamping block 42 has an opening structure that is symmetric left and right. When the clamping block 42 clamps the ceramic chip 23, the end of the ceramic chip 23 is located outside the processing table 3, ensuring that when the laser cutter head 82 processes the end face of the ceramic chip 23, it will not affect other structures. Anti-slip pads 421 are provided on both the left and right side walls of the clamping block 42, and spring clips 422 are installed on the side wall of the clamping block 42 near the bottom end. Through the cooperation of the anti-slip pads 421 and the spring clips 422, the fixing effect of the clamping block 42 on the ceramic chip 23 can be improved, so as to improve the stability of the ceramic chip 23.

[0064] Such as Figure 2 , Figures 12 - 13As shown in the figure, the guide frame 6 is fixedly connected to the inner top wall of the equipment box body 1. The top of the third electric push rod 61 is provided with a guide block 611 that is slidably connected to the guide frame 6. The top end of the guide frame 6 is equipped with a rotatable first lead screw 65. The first lead screw 65 passes through the guide block 611 and is threadedly connected to the guide block 611. The top of the guide frame 6 is installed with a second motor 651 that drives the first lead screw 65 to rotate. The top of the vacuum suction plate 62 is fixedly connected to the push rod end of the third electric push rod 61. A vacuum generator 621 is installed at the top of the equipment box body 1 and near the left end. A connecting pipe 622 is provided between the vacuum generator 621 and the vacuum suction plate 62 for connection. When the vacuum generator 621 operates, vacuum suction can be generated at the bottom of the front and rear groups of suction pipes 63 through the connecting pipe 622 and the vacuum suction plate 62, and the front and rear groups of suction pipes 63 can be independently controlled.

[0065] When the second motor 651 operates to drive the first lead screw 65 to rotate, it can drive the guide block 611 to slide back and forth along the guide frame 6, and drive the third electric push rod 61 and the picking mechanism to move. When the picking mechanism moves forward above the ceramic chip 23, the third electric push rod 61 drives the vacuum suction plate 62 to move downward, so that the suction cup 631 at the bottom of the suction pipe 63 contacts the upper surface of the ceramic chip 23. At this time, when the vacuum generator 621 operates, the suction cup 631 can vacuum adsorb the ceramic chip 23. After that, the third electric push rod 61 drives the vacuum suction plate 62 to move upward, and the third electric push rod 61 moves backward along the guide frame 6 above the control box 4, and the third electric push rod 61 pushes the vacuum suction plate 62 to move downward, so that the ceramic chips 23 at the bottom of each suction cup 631 can be placed inside the clamping block 42, facilitating the end treatment of the two groups of ceramic chips 23 at the same time.

[0066] The movable head 64 is rotatably connected to the bottom of the vacuum suction plate 62, and a sealing ring is provided between the movable head 64 and the vacuum suction plate 62, so that there is a good sealing effect between the top of the suction pipe 63, the movable head 64 and the vacuum suction plate 62. When the control frame 43 moves and drives the clamping block 42 to rotate through the connecting plate 451 and the adjusting plate 46, the suction cup 631 is kept in close contact with the upper surface of the ceramic chip 23. During the rotation process, the top of the suction pipe 63 rotates on the vacuum suction plate 62 through the movable head 64. With the cooperation of the suction cup 631 and the clamping block 42, it can ensure that the ceramic chip 23 has sufficient stability during the turning process.

[0067] As Figure 2 and Figure 15As shown, a laser generator 83 is installed on the inner top wall of the equipment box body 1 near the right end. The laser generator 83 is connected to two groups of laser cutter heads 82 through wires. A rotatable second lead screw 84 is provided on the guide rail 8. The second lead screw 84 penetrates through the slide seat 81 and is threadedly connected to the slide seat 81. A third motor 85 for driving the second lead screw 84 to rotate is installed on the left side of the guide rail 8. When the laser generator 83 operates, the laser cutter heads 82 can perform laser cutting on the surface of the ceramic chip 23. At this time, the third motor 85 is operated to drive the second lead screw 84 to rotate, so that the slide seat 81 slides along the guide rail 8, which can drive the laser cutter heads 82 to move, and during the movement, the ends of multiple ceramic chips 23 are surface-treated.

[0068] Working principle: When the equipment is in use, first, the conveyor belt 21 is connected to the production line of MLCC ceramic capacitors. The pallet 22 is continuously conveyed into the conveying area 11 through the conveyor belt 21. When the left end of the pallet 22 contacts and aligns with the limit baffle 24, the second motor 651 is operated to drive the first lead screw 65 to rotate, and the guide block 611 is driven to move along the guide frame 6, so that the third electric push rod 61 drives the vacuum suction plate 62 to move forward. At this time, the bottom of the vacuum suction plate 62 can be photographed by the high-definition camera 71 to facilitate the control of the position of the vacuum suction plate 62, so that the vacuum suction plate 62 drives the suction pipe 63 to the directly above the ceramic chip 23. Then, the third electric push rod 61 is operated to drive the vacuum suction plate 62 to move downward, so that the suction cup 631 at the bottom of the suction pipe 63 is in close contact with the upper surface of the ceramic chip 23. Then, the vacuum generator 621 is operated, and a vacuum suction force is generated at the bottom of the suction pipe 63 through the connecting pipe 622 and the vacuum suction plate 62, so as to suck the ceramic chip 23 to facilitate the control of the movement of the ceramic chip 23.

[0069] Furthermore, the third electric push rod 61 is controlled to drive the vacuum suction plate 62 to move backward, so that the vacuum suction plate 62 moves to the directly above the control box 4. The third electric push rod 61 is operated to drive the vacuum suction plate 62 to move downward, and the ceramic chip 23 at the bottom of the suction cup 631 is placed into the corresponding clamping block 42. Then, the third motor 85 is operated to drive the second lead screw 84 to rotate, so that the slide seat 81 drives the laser cutter heads 82 to slide to the left, and the ends of the ceramic chips 23 can be surface-treated by the laser cutter heads 82.

[0070] After the laser tool head 82 moves to the leftmost end, the first electric push rod 44 is used to push the control frame 43 to slide, and the transmission is carried out through the connecting plate 451 and the adjusting plate 46, driving the clamping block 42 to rotate around the control shaft 45, and driving the ceramic chip 23 to rotate. When the control frame 43 slides to the maximum distance, the two groups of ceramic chips 23 are rotated 180° simultaneously, so that the untreated end of the ceramic chip 23 faces the guide rail 8. After that, the control slide 81 drives the laser tool head 82 to slide to the right, and the other end of the ceramic chip 23 can be surface-treated to remove the surface defects of the ceramic chip 23, thereby optimizing the capping quality of the ceramic chip 23 MLCC ceramic capacitor.

[0071] Embodiment 2:

[0072] This embodiment is an improvement based on Embodiment 1:

[0073] As Figures 6 - 11 shown, in order to improve the alignment effect of the ceramic chips 23 on the same side and facilitate the regulation of the end to be cut of the ceramic chips 23, positioning plates 5 symmetrically distributed front and back are arranged above the control box 4 and between the front and rear groups of clamping blocks 42. Limiting frames 51 are arranged at both the left and right ends of the positioning plate 5. The bottom of the limiting frame 51 is integrally formed with the upper surface of the control box 4. A first spring 52 is installed between the limiting frame 51 and the positioning plate 5. The opposite sides of the bottom of the positioning plate 5 are in an inclined shape. A receiving groove 47 penetrating up and down is opened on the control frame 43 and near the center. A wedge-shaped push block 53 is arranged inside the receiving groove 47. The wedge-shaped push block 53 penetrates through the support plate 41, and the top of the wedge-shaped push block 53 contacts the inclined surface at the bottom of the positioning plate 5. A second electric push rod 54 for pushing the wedge-shaped push block 53 to move up and down is installed at the bottom of the control box 4 and inside the receiving groove 47.

[0074] When the wedge-shaped push block 53 is located inside the control box 4, under the elastic action of the first spring 52, the opposite surfaces of the two groups of positioning plates 5 are in contact. At this time, the top of the wedge-shaped push block 53 contacts the inclined surface at the bottom of the positioning plate 5. When the second electric push rod 54 operates to drive the wedge-shaped push block 53 to move upward, the wedge-shaped push block 53 pushes the positioning plate 5 to move to both sides, so that the positioning plate 5 aligns the ceramic chips 23 on the clamping block 42.

[0075] In addition, in order to prevent the wedge-shaped push block 53 from affecting the left-right sliding of the control frame 43, the length difference between the receiving groove 47 and the wedge-shaped push block 53 is greater than the maximum sliding distance of the control frame 43.

[0076] As Figures 13 - 14As shown, since the top of the straw 63 is rotatably connected to the vacuum suction plate 62 through the movable head 64, in order to prevent the movable head 64 from moving randomly and causing the ceramic chip 23 to rotate, triangular ridges 641 are symmetrically distributed front and back on the outer wall of the movable head 64. A locking seat 7 is installed at the bottom of the vacuum suction plate 62 and near the center. High-definition cameras 71 are symmetrically arranged left and right at the bottom of the locking seat 7, which is convenient for positioning when picking up the ceramic chip 23. Symmetrically distributed front and back locking plates 72 are slidably connected inside the locking seat 7. Triangular grooves 721 corresponding to the triangular ridges 641 are provided on the locking plates 72. Locking grooves 73 are arranged in an array inside the locking seat 7. Symmetrically distributed front and back sliding shafts 74 are slidably connected inside the locking grooves 73. The ends of the front and back groups of sliding shafts 74 are respectively fixedly connected to the front and back locking plates 72. A second spring 75 is arranged inside the locking grooves 73 and between the front and back sliding shafts 74.

[0077] Under the elastic action of the second spring 75, the triangular grooves 721 on the locking plates 72 are engaged with the triangular ridges 641, thereby locking and fixing the movable head 64, preventing the movable head 64 from rotating randomly and causing the straw 63 to drive the ceramic chip 23 to rotate. When adjusting the rotation of the ceramic chip 23, due to the close contact between the suction cup 631 and the ceramic chip 23, there is a large frictional resistance between the two, which allows the movable head 64 at the top of the straw 63 to rotate on the vacuum suction plate 62. At this time, the triangular ridges 641 on the movable head 64 and the triangular grooves 721 slide relative to each other, squeezing the locking plates 72, causing the locking plates 72 to slide towards the inside of the locking seat 7 and compressing the second spring 75. After the rotation of the ceramic chip 23 is completed, the movable head 64 rotates 180°, so that the triangular ridges 641 on the other side of the movable head 64 are engaged with the triangular grooves 721. Under the elastic action of the second spring 75, the locking plates 72 can continue to lock and fix the movable head 64.

[0078] Finally, it should be noted that: Obviously, the above embodiments are merely examples for clearly illustrating the present invention and are not limitations on the embodiments. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the embodiments here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. An automated device for optimizing the end - sealing quality of MLCC ceramic capacitors, characterized in that, Including: An equipment box body (1), inside which there is a conveying area (11) and a processing area (12). The conveying area (11) is located on the front side of the processing area (12), and a conveying rack (2) is arranged at the bottom of the conveying area (11). A tray (22) is arranged on the top of the conveying rack (2), and ceramic chips (23) distributed in a rectangular array are supported on the tray (22). A limit baffle (24) is arranged above the conveying rack (2) and near the left end; A processing table (3) is arranged at the center inside the processing area (12). A control box (4) is arranged on the top of the processing table (3). Above the control box (4), there are two groups of clamping blocks (42) symmetrically distributed front and back. Each clamping block (42) is rotatably connected to the control box (4). Inside the control box (4), there is a control mechanism for driving the clamping block (42) to rotate 180°. The control mechanism includes a control frame (43), a connecting plate (451) and an adjusting plate (46). The control frame (43) is slidably arranged inside the control box (4). The connecting plate (451) is fixedly connected to the clamping block (42). The two ends of the adjusting plate (46) are respectively rotatably connected to the control frame (43) and the connecting plate (451); A guiding frame (6) is arranged inside the equipment box body (1). A third electric push rod (61) is slidably connected to the guiding frame (6). A picking mechanism is installed at the bottom of the third electric push rod (61) for moving a whole group of ceramic chips (23) on the tray (22) to the inside of the clamping block (42) for fixing. The picking mechanism includes a vacuum suction plate (62). At the bottom of the vacuum suction plate (62), there are two groups of suction pipes (63) symmetrically distributed front and back. Each suction pipe (63) corresponds to the clamping block (42). A suction cup (631) is arranged at the bottom of the suction pipe (63). An active head (64) rotatably connected to the vacuum suction plate (62) is arranged at the top of the suction pipe (63); Cutting assemblies are symmetrically arranged inside the processing area (12). The cutting assemblies include guide rails (8) and laser cutter heads (82) symmetrically arranged on the front and back sides of the control box (4). A sliding seat (81) is slidably connected to the guide rail (8). The laser cutter head (82) is installed on the sliding seat (81); The guiding frame (6) is fixedly connected to the inner top wall of the equipment box body (1). A guiding block (611) slidably connected to the guiding frame (6) is arranged at the top of the third electric push rod (61). A rotatable first lead screw (65) is installed at the top end of the guiding frame (6). The first lead screw (65) penetrates through the guiding block (611) and is threadedly connected to the guiding block (611). A second motor (651) for driving the first lead screw (65) to rotate is installed at the top of the guiding frame (6). The top of the vacuum suction plate (62) is fixedly connected to the push rod end of the third electric push rod (61). A vacuum generator (621) is installed at the top of the equipment box body (1) and near the left end. A connecting pipe (622) is provided for connecting the vacuum generator (621) and the vacuum suction plate (62). The movable head (64) is rotatably connected to the bottom of the vacuum suction plate (62), and a sealing ring is arranged between the movable head (64) and the vacuum suction plate (62). Triangular ridges (641) symmetrically distributed front and back are arranged on the outer wall of the movable head (64). A locking seat (7) is installed at the bottom of the vacuum suction plate (62) and near the center. High-definition cameras (71) symmetrically distributed left and right are arranged at the bottom of the locking seat (7). Symmetrically distributed front and back locking plates (72) are slidably connected inside the locking seat (7). A number of triangular grooves (721) corresponding to the triangular ridges (641) are arranged on the locking plates (72). Locking grooves (73) distributed in an array are arranged inside the locking seat (7). Symmetrically distributed front and back sliding shafts (74) are slidably connected inside the locking grooves (73). The ends of the front and back groups of sliding shafts (74) are respectively fixedly connected to the front and back locking plates (72). A second spring (75) is arranged inside the locking grooves (73) and between the front and back sliding shafts (74).

2. The automated equipment for optimizing the capping quality of an MLCC ceramic capacitor according to claim 1, wherein: A partition plate (13) is arranged between the conveying area (11) and the processing area (12), and there is a space for the picking mechanism to move between the upper part of the partition plate (13) and the inner top wall of the equipment box body (1). The front inner wall of the equipment box body (1) is of a hollow structure, and a control system is arranged inside it. A display screen (14) is installed at the front side of the equipment box body (1) and near the top. A number of uniformly distributed control buttons (15) are arranged at the bottom of the display screen (14). Heat dissipation holes (16) are opened on the side walls of the equipment box body (1) and on the left and right sides of the processing area (12).

3. The automated equipment for optimizing the capping quality of an MLCC ceramic capacitor according to claim 1, wherein: Inside the conveying frame (2) and near the top, a conveyor belt (21) is installed. A first motor (211) for driving the conveyor belt (21) is installed on the left front side of the conveying frame (2). The tray (22) is placed on the upper surface of the conveyor belt (21). A rectangular array of receiving grooves (221) is provided on the top of the tray (22). Each of the ceramic chips (23) is respectively arranged inside the receiving groove (221). Both ends of the limiting baffle (24) are provided with movable feet (241). The movable feet (241) are rotatably connected to the inner wall of the equipment box body (1). A control motor (242) for driving the movable feet (241) to rotate 90° is installed in the front inner wall of the equipment box body (1).

4. The automated equipment for optimizing the capping quality of an MLCC ceramic capacitor according to claim 1, wherein: A chip removal box (31) is installed on the inner bottom wall of the equipment box body (1) and below the processing table (3). Chip inlet openings (32) are provided on the top of the chip removal box (31) and on the front and rear sides of the processing table (3). A protective cover (33) is provided on the top of the chip removal box (31) and outside the chip inlet openings (32). The top end of the protective cover (33) is located between the laser cutter head (82) and the slide block (81).

5. An automated device for optimizing the capping quality of an MLCC ceramic capacitor as described in claim 1, characterized in that: A support plate (41) is installed on the top of the control box (4). The clamping blocks (42) are symmetrically arranged in an array in the front and rear above the support plate (41). A control shaft (45) rotatably connected to the support plate (41) is provided at the center of the bottom of the clamping block (42). The end of the connecting plate (451) is fixedly connected to the bottom of the control shaft (45). The control frame (43) is slidably arranged inside the control box (4). Control grooves (431) symmetrically distributed in the front and rear are provided on the top of the control frame (43). Connecting holes (432) arranged in an array are provided inside the control grooves (431). The adjusting plates (46) are arranged in an array inside the control grooves (431). One end of the adjusting plate (46) is rotatably connected to the connecting hole (432) through a rotating shaft. The other end of the adjusting plate (46) is rotatably connected to the connecting plate (451) through a rotating shaft. A first electric push rod (44) for pushing the control frame (43) to slide is installed on the left side of the control box (4).

6. The automated equipment for optimizing the capping quality of an MLCC ceramic capacitor as described in claim 5, characterized in that: The top of the clamping block (42) has an open structure symmetrically arranged on the left and right. Anti-slip pads (421) are provided on the left and right side walls of the clamping block (42). Spring clips (422) are installed on the side walls of the clamping block (42) and near the bottom end.

7. An automated device for optimizing the capping quality of an MLCC ceramic capacitor according to claim 1, characterized in that: Above the control box (4) and between the front and rear sets of clamping blocks (42), positioning plates (5) symmetrically distributed front and back are provided. At both left and right ends of the positioning plate (5), limit frames (51) are provided. The bottom of the limit frame (51) is integrally formed with the upper surface of the control box (4). A first spring (52) is installed between the limit frame (51) and the positioning plate (5). The opposite sides of the bottom of the positioning plate (5) are bevel-shaped. On the control frame (43) and near the center, an accommodation groove (47) penetrating up and down is opened. Inside the accommodation groove (47), a wedge-shaped push block (53) is provided. The wedge-shaped push block (53) penetrates through the support plate (41), and the top of the wedge-shaped push block (53) contacts the bevel of the bottom of the positioning plate (5). At the bottom of the control box (4) and inside the accommodation groove (47), a second electric push rod (54) for pushing the wedge-shaped push block (53) to move up and down is installed.

8. The automated equipment for optimizing the capping quality of an MLCC ceramic capacitor according to claim 1, characterized in that: On the inner top wall of the equipment box body (1) and near the right end, a laser generator (83) is installed. The laser generator (83) is connected to the two laser cutter heads (82) through a circuit. On the guide rail (8), a rotatable second lead screw (84) is provided. The second lead screw (84) penetrates through the sliding seat (81) and is threadedly connected to the sliding seat (81). On the left side of the guide rail (8), a third motor (85) for driving the second lead screw (84) to rotate is installed.

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