Silicon wafer stacking device and unpacking apparatus thereof

Abstract

The application discloses a silicon wafer stacking device and unpacking equipment thereof and belongs to the technical field of silicon wafer processing. The silicon wafer stacking device comprises a stacking device, an opening box device, a material removing device and a discharging device. The stacking device is located between the material removing device and the discharging device. The stacking device comprises a first turnover module, a second turnover module, a third turnover module and a fourth turnover module. The first turnover module comprises a first bottom plate and first limiting blocks located at the edges of the first bottom plate. The second turnover module comprises a second bottom plate and second limiting blocks located at the edges of the second bottom plate. The third turnover module comprises a third bottom plate and third limiting blocks located at the edges of the third bottom plate. The fourth turnover module comprises a fourth bottom plate and fourth limiting blocks located at the edges of the fourth bottom plate. The application realizes rapid unpacking processing of silicon wafers, does not need manual operation and does not cause pollution to the silicon wafers due to manual operation, thereby guaranteeing the quality of the silicon wafers.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of silicon wafer processing, and particularly relates to a silicon wafer stacking device and a unpacking equipment thereof. BACKGROUND

[0002] A silicon wafer is a thin piece made of high-purity crystalline silicon. Existing finished silicon wafers are usually stored in boxes. When the silicon wafers need to be used, they need to be unpacked and stacked to meet the use requirements of the silicon wafers.

[0003] At present, the unpacking and stacking of silicon wafers are usually manually operated, that is, an operator holds a tool to unpack the silicon wafers. After unpacking, the operator stacks the silicon wafers manually. This method consumes a large amount of manpower, greatly increases the labor intensity of the operator, and has low efficiency in the process of manual operation. The silicon wafers are easily damaged and contaminated, which directly affects the quality of the silicon wafers. SUMMARY

[0004] The present application overcomes the shortcomings of the prior art and provides a silicon wafer stacking device and a unpacking equipment thereof to solve the problems in the prior art.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: a silicon wafer stacking device, comprising

[0006] A first turnover module, the first turnover module comprises a first bottom plate and a first limiting block located at the edge of the first bottom plate;

[0007] A second turnover module, the second turnover module comprises a second bottom plate and a second limiting block located at the edge of the second bottom plate;

[0008] A third turnover module, the third turnover module comprises a third bottom plate and a third limiting block located at the edge of the third bottom plate;

[0009] A fourth turnover module, the fourth turnover module comprises a fourth bottom plate and a fourth limiting block located at the edge of the fourth bottom plate;

[0010] Wherein:

[0011] The first bottom plate, the second bottom plate, the third bottom plate and the fourth bottom plate are all placed with silicon wafers, and are limited by the first limiting block, the second limiting block, the third limiting block and the fourth limiting block, respectively;

[0012] The first limiting block and the second limiting block are complementary in structure, the first bottom plate is provided with a first pressing plate above, and when the silicon wafers on the first bottom plate contact the silicon wafers on the second bottom plate, the first pressing plate presses the silicon wafers on the first bottom plate;

[0013] The third limiting block is complementary in structure to the fourth limiting block, and a third pressing plate is arranged above the third bottom plate, so that when the silicon wafer on the third bottom plate is in contact with the silicon wafer on the fourth bottom plate, the third pressing plate presses the silicon wafers on the third bottom plate.

[0014] The first limiting block is complementary in structure to the third limiting block, and when the silicon wafer on the first bottom plate is in contact with the silicon wafer on the third bottom plate, the third pressing plate presses the silicon wafers on the third bottom plate.

[0015] In a preferred embodiment of the present application, the first bottom plate and the third bottom plate are arranged in a staggered manner.

[0016] The number of the lateral driving modules is at least two, one of which drives the first turnover module to move close to the second turnover module, and the other of which drives the third turnover module to move close to the fourth turnover module.

[0017] The longitudinal driving module drives the third turnover module to move close to the first turnover module.

[0018] In a preferred embodiment of the present application, the longitudinal driving module is installed on one of the lateral driving modules to drive the third turnover module laterally or longitudinally.

[0019] In a preferred embodiment of the present application, a direction changing motor is arranged below the first bottom plate and below the third bottom plate, one of which drives the first bottom plate to change the stacking direction of the silicon wafers on the first bottom plate, and the other of which drives the third bottom plate to change the stacking direction of the silicon wafers on the third bottom plate.

[0020] In a preferred embodiment of the present application, a second pressing plate is arranged above the second bottom plate, and the second pressing plate is arranged in a staggered manner with the first pressing plate when the first bottom plate moves close to the second bottom plate for stacking silicon wafers; a fourth pressing plate is arranged above the fourth bottom plate, and the fourth pressing plate is arranged in a staggered manner with the third pressing plate when the third bottom plate moves close to the fourth bottom plate for stacking silicon wafers; and the third pressing plate is arranged in a staggered manner with the first pressing plate when the third bottom plate moves close to the first bottom plate for stacking silicon wafers.

[0021] The present application further discloses a silicon wafer unpacking device, which comprises the silicon wafer stacking device, an opening box device, a material removing device, and a material discharging device, and the stacking device is located between the material removing device and the material discharging device.

[0022] In a preferred embodiment of the present application, the box opening device comprises a box opening conveying line and a box opening mechanical arm, the box opening conveying line conveys the box containing the silicon wafer, the box opening mechanical arm is provided with a feeding suction cup and a box opening cutter at the end, the feeding suction cup adsorbs the box, and the box opening cutter cuts the tape on the box.

[0023] In a preferred embodiment of the present application, the box opening conveying line is provided with a plurality of box opening cylinders at the end, the box opening cylinder is provided with a box opening suction cup at the end, and the box opening cylinder drives the box opening suction cup to open the box.

[0024] In a preferred embodiment of the present application, the material removing device comprises a material removing mechanical arm, a bag removing part and a material removing conveying line, the material removing mechanical arm grabs the silicon wafer to the bag removing part to remove the bag on the surface of the silicon wafer, and the material removing conveying line is provided with a paper removing part, which removes the paper on the surface of the silicon wafer.

[0025] In a preferred embodiment of the present application, a material moving truss is further included, which grabs and moves the silicon wafer.

[0026] The present application solves the defects in the background art and has the following beneficial effects:

[0027] 1. The present application realizes rapid unpacking processing of the silicon wafer, can continuously open the box, remove the material, stack and discharge the silicon wafer, does not need manual operation in the process, reduces the labor consumption, effectively improves the processing efficiency of the silicon wafer, and does not cause pollution to the silicon wafer due to manual operation, thereby ensuring the quality of the silicon wafer.

[0028] 2. The present application cooperates with the first, second, third and fourth turnover modules to continuously turn four groups of silicon wafers, and finally stack the four groups of silicon wafers at the third turnover module position, completes the stacking processing of the silicon wafers, and meets the use requirement of the silicon wafers. BRIEF DESCRIPTION OF DRAWINGS

[0029] The present application will be further described below in combination with the drawings and embodiments.

[0030] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the present application.

[0031] Figure 2 It is a schematic diagram of the structure of the first and second turnover modules for stacking the silicon wafers in the first embodiment of the present application.

[0032] Figure 3 It is a schematic diagram of the structure of the first and third turnover modules for stacking the silicon wafers after changing direction in the first embodiment of the present application.

[0033] Figure 4 This is a schematic diagram of the structure of the first flipping module in the first embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the overall structure of the second embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram of the structure of the unpacking robotic arm according to the second embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the structure of the box-opening cylinder in the second embodiment of the present invention for opening the box;

[0037] Figure 8 This is a schematic diagram of the material removal device in the second embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of the bag-removing section in the second embodiment of the present invention;

[0039] Figure 10 This is a schematic diagram of the paper removal section in the second embodiment of the present invention;

[0040] In the diagram: 10. First flipping module; 11. First base plate; 12. First limiting block; 20. Second flipping module; 21. Second base plate; 22. Second limiting block; 30. Third flipping module; 31. Third base plate; 32. Third limiting block; 40. Fourth flipping module; 41. Fourth base plate; 42. Fourth limiting block; 50. First pressure plate; 60. Second pressure plate; 70. Third pressure plate; 80. Fourth pressure plate; 90. Horizontal drive module; 100. Vertical drive module; 110. Reversing motor; 120. Unpacking conveyor line; 130. Unpacking robotic arm; 131. 132. Feeding suction cup; 140. Box body; 150. Box opening cylinder; 151. Box opening suction cup; 160. Unloading robotic arm; 161. Clamp; 170. Bag removal section; 171. Bag removal cylinder; 172. Bag removal panel; 173. Bag removal suction cup; 180. Unloading conveyor line; 181. Paper removal section; 1811. Lateral movement cylinder; 1812. Paper picking cylinder; 1813. Paper picking suction cup; 190. Material transfer gantry; 200. Unloading conveyor line; 210. Rotary drive motor; 220. Pressure plate adjustment cylinder; 230. Feeding section; 240. Misalignment cylinder. Detailed Implementation

[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0042] Example 1

[0043] The embodiment provides a silicon wafer stacking device which can continuously flip and stack multiple groups of silicon wafers, has good stacking effect, high stability, does not cause damage to the silicon wafers, and does not need manual operation in the process, thereby improving efficiency and effectively reducing the labor intensity of operators.

[0044] In combination Figures 1 to 4 As shown in the figure, the silicon wafer stacking device of the embodiment comprises a first flipping module 10, a second flipping module 20, a third flipping module 30 and a fourth flipping module 40, the second flipping module 20 and the fourth flipping module 40 of the embodiment are fixedly arranged, the first flipping module 10 is flipped towards the second flipping module 20, the first flipping module 10 is close to the second flipping module 20, the silicon wafers on the second flipping module 20 are stacked on the first flipping module 10, the third flipping module 30 is flipped towards the fourth flipping module 40, the third flipping module 30 is close to the fourth flipping module 40, the silicon wafers on the fourth flipping module 40 are stacked on the third flipping module 30, then the first flipping module 10 is flipped towards the third flipping module 30, the third flipping module 30 is close to the first flipping module 10, the silicon wafers on the first flipping module 10 are stacked on the third flipping module 30, thereby completing the stacking of four groups of silicon wafers.

[0045] In the embodiment, the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41 are all placed with silicon wafers, wherein:

[0046] The first flipping module 10 comprises a first bottom plate 11 and a first limiting block 12 located at the edge of the first bottom plate 11, the first limiting block 12 is continuously and interval distributed around the first bottom plate 11 to form a first limiting structure for limiting the silicon wafers on the first bottom plate 11;

[0047] The second flipping module 20 comprises a second bottom plate 21 and a second limiting block 22 located at the edge of the second bottom plate 21, the second limiting block 22 is continuously and interval distributed around the second bottom plate 21 to form a second limiting structure for limiting the silicon wafers on the second bottom plate 21;

[0048] The third flipping module 30 comprises a third bottom plate 31 and a third limiting block 32 located at the edge of the third bottom plate 31, the third limiting block 32 is continuously and interval distributed around the third bottom plate 31 to form a third limiting structure for limiting the silicon wafers on the third bottom plate 31;

[0049] The fourth flipping module 40 comprises a fourth bottom plate 41 and a fourth limiting block 42 located at the edge of the fourth bottom plate 41, the fourth limiting block 42 is continuously and interval distributed around the fourth bottom plate 41 to form a fourth limiting structure for limiting the silicon wafers on the fourth bottom plate 41.

[0050] Specifically, the first limiting structure and the second limiting structure are complementary in structure, the third limiting structure and the fourth limiting structure are complementary in structure, and the first limiting structure and the third limiting structure are complementary in structure. When the first turnover module 10 and the second turnover module 20 are stacked with silicon wafers, the first limiting structure and the second limiting structure are complementary, so that the silicon wafers of the first turnover module 10 and the second turnover module 20 are smoothly stacked. When the third turnover module 30 and the fourth turnover module 40 are stacked with silicon wafers, the third limiting structure and the fourth limiting structure are complementary in structure, so that the silicon wafers of the third turnover module 30 and the fourth turnover module 40 are smoothly stacked. When the first turnover module 10 and the third turnover module 30 are stacked with silicon wafers, the first limiting structure and the third limiting structure are complementary in structure, so that the silicon wafers of the first turnover module 10 and the third turnover module 30 are smoothly stacked.

[0051] As shown in Figure 1 The first bottom plate 11 is provided with a first pressing plate 50 above, the second bottom plate 21 is provided with a second pressing plate 60 above, the third bottom plate 31 is provided with a third pressing plate 70 above, and the fourth bottom plate 41 is provided with a fourth pressing plate 80 above. The first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41 are provided with pressing plate adjusting cylinders 220 on the side surfaces.

[0052] In the initial state, the first pressing plate 50 is used to press and position the silicon wafers on the first bottom plate 11, the second pressing plate 60 is used to press and position the silicon wafers on the second bottom plate 21, the third pressing plate 70 is used to press and position the silicon wafers on the third bottom plate 31, and the fourth pressing plate 80 is used to press and position the silicon wafers on the fourth bottom plate 41. The corresponding pressing plate adjusting cylinders 220 can respectively adjust the positions of the first pressing plate 50, the second pressing plate 60, the third pressing plate 70 and the fourth pressing plate 80, so that the first pressing plate 50, the second pressing plate 60, the third pressing plate 70 and the fourth pressing plate 80 can be misaligned when stacking silicon wafers, to ensure the smooth operation of the silicon wafer stacking operation.

[0053] Specifically, when the first turnover module 10 and the second turnover module 20 are stacked with the silicon wafers, the first pressing plate 50 is pressed under the action of the pressing plate adjusting cylinder 220, the first pressing plate 50 is pressed under the action of the pressing plate adjusting cylinder 220, and then the first bottom plate 11 is moved close to the second bottom plate 21, so that the silicon wafers on the first bottom plate 11 and the silicon wafers on the second bottom plate 21 are stacked, and then the second pressing plate 60 is reset by the pressing plate adjusting cylinder 220, and the other pressing plate adjusting cylinder 220 drives the first pressing plate 50 to the pressing position. The first pressing plate 50 driven by the pressing plate adjusting cylinder 220 presses the stacked silicon wafers, so that the silicon wafers are pressed and stacked on the first bottom plate 11. Similarly, the third turnover module 30 and the fourth turnover module 40 are stacked with the same operation of the silicon wafers, and the third turnover module 30 and the first turnover module 10 are stacked with the same operation of the silicon wafers.

[0054] In this embodiment, when the first bottom plate 11 is close to the second bottom plate 21 for silicon wafer stacking, the second pressing plate 60 is arranged in a staggered manner with the first pressing plate 50; when the third bottom plate 31 is close to the fourth bottom plate 41 for silicon wafer stacking, the fourth pressing plate 80 is arranged in a staggered manner with the third pressing plate 70; when the third bottom plate 31 is close to the first bottom plate 11 for silicon wafer stacking, the third pressing plate 70 is arranged in a staggered manner with the first pressing plate 50. The pressing plates are arranged in a staggered manner to avoid interference between each other, so as to ensure the smooth stacking of the silicon wafers.

[0055] In this embodiment, the first turnover module 10, the second turnover module 20, the third turnover module 30 and the fourth turnover module 40 each include a rotating drive motor 210, which drives the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41 respectively, so as to turn the silicon wafers, and realize the smooth turning of the silicon wafers between the first turnover module 10 and the second turnover module 20, between the third turnover module 30 and the fourth turnover module 40, and between the third turnover module 30 and the first turnover module 10.

[0056] In combination Figure 2 With Figure 3As shown, the silicon wafer stacking device of this embodiment further includes a lateral driving module 90 and a longitudinal driving module 100. There are two sets of lateral driving modules 90. One set of lateral driving modules 90 drives the first flip module 10 to move closer to the second flip module 20 so that the silicon wafers of the first flip module 10 and the second flip module 20 can be stacked. The other set of lateral driving modules 90 drives the third flip module 30 to move closer to the fourth flip module 40 so that the silicon wafers of the third flip module 30 and the fourth flip module 40 can be stacked. The longitudinal driving module 100 of this embodiment is mounted on a lateral driving module 90. The longitudinal driving module 100 drives the third flip module 30 longitudinally so that the third flip module 30 moves closer to the first flip module 10. Therefore, the third flip module 30 can move laterally and longitudinally so that it moves closer to the fourth flip module 40 or the first flip module 10 so as to perform silicon wafer stacking.

[0057] In this embodiment, a reversing motor 110 is provided below the first base plate 11 and below the third base plate 31. One reversing motor 110 drives the first base plate 11 to change the stacking orientation of the silicon wafers on the first base plate 11, and the other reversing motor 110 drives the third base plate 31 to change the stacking orientation of the silicon wafers on the third base plate 31. In this embodiment, the silicon wafers on the first base plate 11 need to be stacked with the silicon wafers on the second base plate 21 and also with the silicon wafers on the third base plate 31. The silicon wafers on the third base plate 31 need to be stacked with the silicon wafers on the fourth base plate 41 and also with the silicon wafers on the first base plate 11. Therefore, it is necessary to use the reversing motor 110 to change the orientation of the first base plate 11 and the third base plate 31, thereby changing the orientation of the silicon wafers on the first base plate 11 and the third base plate 31 to meet the requirements of silicon wafer stacking.

[0058] like Figure 1 As shown, in this embodiment, the first base plate 11 is connected to a reversing motor 110 through a hollow platform, and the third base plate 31 is connected to another reversing motor 110 through another hollow platform. Under the drive of the reversing motor 110, the orientation of the first base plate 11 and the third base plate 31 is changed, thereby meeting the stacking requirements of silicon wafers.

[0059] In actual use, the second turnover module 20 and the fourth turnover module 40 are fixedly arranged (only capable of self-turnover), the first turnover module 10 is capable of lateral movement to approach the second turnover module 20, the third turnover module 30 is capable of lateral movement to approach the fourth turnover module 40 and is also capable of longitudinal movement to approach the first turnover module 10, a group of silicon wafers is placed on the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41 in the initial state, the silicon wafers on the first bottom plate 11 and the second bottom plate 21 are turned over, so that the two groups of silicon wafers are oppositely arranged, then the first bottom plate 11 is driven by a lateral drive module 90 to approach the second bottom plate 21, so that the turned-over silicon wafers on the first bottom plate 11 are stacked with the turned-over silicon wafers on the second bottom plate 21, the stacked silicon wafers are compressed by the first pressing plate 50, then the first bottom plate 11 is reset, at the same time, the same operation is performed between the third bottom plate 31 and the fourth bottom plate 41, so that the silicon wafers on the fourth bottom plate 41 are stacked on the third bottom plate 31, the stacked silicon wafers are compressed by the third pressing plate 70, the third bottom plate 31 is reset, then the first bottom plate 11 and the third bottom plate 31 are reversely arranged by a reversing motor 110, so that the silicon wafers on the first bottom plate 11 are oppositely arranged with the silicon wafers on the third bottom plate 31, the third bottom plate 31 is driven by a longitudinal drive module 100 to approach the first bottom plate 11, so that the turned-over silicon wafers on the third bottom plate 31 are stacked with the turned-over silicon wafers on the first bottom plate 11, the stacked silicon wafers are compressed and positioned by the third pressing plate 70, thereby completing the stacking of four groups of silicon wafers.

[0060] In the embodiment, a fifth turnover module is arranged on the side of the second turnover module 20 away from the first turnover module 10, and a sixth turnover module is arranged on the side of the fourth turnover module 40 away from the third turnover module 30, the fifth turnover module has the same structure as the first turnover module 10, the sixth turnover module has the same structure as the third turnover module 30, and the fifth turnover module and the sixth turnover module can cooperate with the second turnover module 20 and the fourth turnover module 40 respectively, thereby further improving the stacking efficiency of the silicon wafers.

[0061] Embodiment two

[0062] The silicon wafer unpacking equipment provided in the embodiment realizes rapid unpacking of silicon wafers, can continuously open boxes, remove materials, stack and discharge the silicon wafers, does not need manual operation in the process, reduces labor consumption, effectively improves the processing efficiency of the silicon wafers, does not cause pollution to the silicon wafers due to manual operation, and ensures the quality of the silicon wafers.

[0063] Combination Figures 5 to 10As shown, the wafer unpacking equipment of the embodiment includes a wafer stacking device, and further includes an opening box device, a material removing device, and a material discharging device. The stacking device is located between the material removing device and the material discharging device, so as to sequentially perform opening box, material removing, stacking, and material discharging processes on the wafer.

[0064] In the embodiment, the wafer unpacking equipment further includes a material moving truss 190 which grasps and moves the wafer. The material moving truss 190 of the embodiment moves between the material removing device, the stacking device, and the material discharging device to grasp and move the wafer. The material discharging device of the embodiment uses a material discharging conveying line 200 to convey the stacked wafer.

[0065] In combination Figures 5 to 7 As shown, the opening box device of the embodiment includes an opening box conveying line 120 and an opening box mechanical arm 130. The opening box conveying line 120 conveys the box 140 containing the wafer. The opening box mechanical arm 130 is provided at the end thereof with a material loading suction disc 131 and an opening box cutter 132. The material loading suction disc 131 sucks the box 140. The opening box cutter 132 cuts the adhesive tape on the box 140. A feeding part 230 is provided in the working area of the opening box mechanical arm 130 to continuously feed the box 140 containing the wafer. When the opening box mechanical arm 130 grasps the box 140 to the opening box conveying line 120 by using the material loading suction disc 131, the opening box cutter 132 at the end of the opening box mechanical arm 130 cuts the adhesive tape on the surface of the box 140, so as to facilitate subsequent opening of the box 140. Then, the opening box conveying line 120 conveys the box 140 to the end to wait for the opening box operation.

[0066] In the embodiment, the end of the opening box conveying line 120 is provided with a plurality of opening box cylinders 150. The end of the opening box cylinder 150 is provided with an opening box suction disc 151. The opening box cylinder 150 drives the opening box suction disc 151 to open the box 140. The number of the opening box cylinders 150 of the embodiment is four, and the opening box cylinders 150 are distributed around the box 140. The opening box cylinder 150 drives the opening box suction disc 151 to suck the top of the box 140. Then, the opening box cylinder 150 resets, and the opening box suction disc 151 pulls the top of the box 140 to open the box 140. The opening box cylinder 150 of the embodiment is an inclined angle cylinder, so as to smoothly drive the opening box suction disc 151 to open the box 140.

[0067] Further, the opening box conveying line 120 of the embodiment is provided with a misalignment cylinder 240 which drives one of the opening box cylinders 150 to move misalignment, so as to avoid interference between the opening box cylinder 150 and the box 140, and to smoothly move the box 140 to the opening box position of the conveying line, so as to facilitate smooth opening box operation.

[0068] In combination Figure 5 , Figure 8 ,Figure 9 and Figure 10 As shown in the figure, the material removing device of the embodiment comprises a material removing robot arm 160, a bag removing part 170 and a material removing conveying line 180. The material removing robot arm 160 picks up the silicon wafer to the bag removing part 170 to remove the bag on the surface of the silicon wafer. The material removing conveying line 180 is provided with a paper removing part 181 which removes the paper on the surface of the silicon wafer. After the box 140 is opened, the silicon wafer is picked up by the material removing robot arm 160 and is sequentially transferred to the bag removing part 170 and the material removing conveying line 180 to remove the bag and the paper on the surface of the silicon wafer.

[0069] In the embodiment, the material removing robot arm 160 is provided with a plurality of clamps 161 at the end. The bag removing part 170 comprises a bag removing cylinder 171, a bag removing panel 172 and a bag removing suction cup 173. The bag removing cylinder 171 drives the bag removing panel 172. The bag removing suction cup 173 is uniformly distributed on the bag removing panel 172. The paper removing part 181 comprises a horizontal moving cylinder 1811, a paper taking cylinder 1812 and a paper taking suction cup 1813. The horizontal moving cylinder 1811 and the paper taking cylinder 1812 drive the paper taking suction cup 1813 to approach the silicon wafer for paper taking treatment. The material removing robot arm 160 picks up a plurality of silicon wafers and transfers them to the position of the bag removing suction cup 173. The bag removing suction cup 173 sucks the bag on the surface of the silicon wafer. Then, the bag removing cylinder 171 flips the bag removing suction cup 173 through the bag removing panel 172 to facilitate the falling of the bag. After the bag removing is completed, the material removing robot arm 160 transfers the silicon wafer to the material removing conveying line 180. When reaching the paper taking position, the horizontal moving cylinder 1811 drives the paper taking suction cup 1813 to the corresponding position. The paper taking cylinder 1812 drives the paper taking suction cup 1813 to approach the silicon wafer to take away the paper on the surface of the silicon wafer.

[0070] Further, after the bag and the paper on the surface of the silicon wafer are removed, the material removing robot arm 160 transfers the silicon wafer to the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41 for silicon wafer stacking treatment. After the stacking device completes the stacking, the material removing robot arm 160 picks up the stacked silicon wafer to the discharging conveying line 200 to complete the discharging treatment.

[0071] In combination with the first and second embodiments, the present application realizes the rapid unpacking treatment of the silicon wafer. The silicon wafer can be continuously subjected to the opening box, material removing, stacking and discharging treatment. In this process, manual operation is not required. The labor consumption is reduced. The processing efficiency of the silicon wafer is effectively improved. The silicon wafer is not polluted by manual operation. The quality of the silicon wafer is ensured.

[0072] Obviously, the above embodiments are merely example for clearly illustrating, and are not limitation to the embodiments. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments need not and can not be exhausted. The obvious changes or variations derived therefrom are still within the scope of the present invention.

Claims

1. A silicon wafer stacking device, characterized in that, include The first flipping module (10) includes a first base plate (11) and a first limiting block (12) located at the edge of the first base plate (11); The second flipping module (20) includes a second base plate (21) and a second limiting block (22) located at the edge of the second base plate (21); The third flipping module (30) includes a third base plate (31) and a third limiting block (32) located at the edge of the third base plate (31); The fourth flipping module (40) includes a fourth base plate (41) and a fourth limiting block (42) located at the edge of the fourth base plate (41); in: Silicon wafers are placed on the first base plate (11), the second base plate (21), the third base plate (31) and the fourth base plate (41), and are respectively limited by the first limiting block (12), the second limiting block (22), the third limiting block (32) and the fourth limiting block (42); The first limiting block (12) and the second limiting block (22) are structurally complementary. A first pressure plate (50) is provided above the first base plate (11). When the silicon wafer on the first base plate (11) comes into contact with the silicon wafer on the second base plate (21), the first pressure plate (50) presses the silicon wafer onto the first base plate (11). The third limiting block (32) and the fourth limiting block (42) are structurally complementary. A third pressure plate (70) is provided above the third base plate (31). When the silicon wafer on the third base plate (31) comes into contact with the silicon wafer on the fourth base plate (41), the third pressure plate (70) presses the silicon wafer onto the third base plate (31). The first limiting block (12) and the third limiting block (32) are structurally complementary. When the silicon wafer on the first base plate (11) comes into contact with the silicon wafer on the third base plate (31), the third pressure plate (70) presses the silicon wafer onto the third base plate (31). It also includes a lateral drive module (90), the number of which is at least two. One lateral drive module (90) drives the first flip module (10) to move the first flip module (10) closer to the second flip module (20), and the other lateral drive module (90) drives the third flip module (30) to move the third flip module (30) closer to the fourth flip module (40). A longitudinal drive module (100) drives the third flip module (30) to move the third flip module (30) closer to the first flip module (10); A second pressure plate (60) is provided above the second base plate (21). When the first base plate (11) is close to the second base plate (21) for silicon wafer stacking, the second pressure plate (60) is offset from the first pressure plate (50). A fourth pressure plate (80) is provided above the fourth base plate (41). When the third base plate (31) is close to the fourth base plate (41) for silicon wafer stacking, the fourth pressure plate (80) and the third pressure plate (70) are staggered. When the third base plate (31) is close to the first base plate (11) for silicon wafer stacking, the third pressure plate (70) is offset from the first pressure plate (50).

2. The silicon wafer stacking device according to claim 1, characterized in that, The longitudinal drive module (100) is mounted on a transverse drive module (90) to drive the third flip module (30) either laterally or longitudinally.

3. The silicon wafer stacking device according to claim 1, characterized in that, A reversing motor (110) is provided below the first base plate (11) and below the third base plate (31). One of the reversing motors (110) drives the first base plate (11) to change the stacking orientation of the silicon wafers on the first base plate (11), and the other reversing motor (110) drives the third base plate (31) to change the stacking orientation of the silicon wafers on the third base plate (31).

4. A silicon wafer unpacking device, comprising a silicon wafer stacking apparatus as described in any one of claims 1-3, characterized in that, It also includes an unpacking device, a stripping device, and a unloading device, with the silicon wafer stacking device located between the stripping device and the unloading device.

5. A silicon wafer unpacking device according to claim 4, characterized in that, The unpacking device includes an unpacking conveyor line (120) and an unpacking robotic arm (130). The unpacking conveyor line (120) transports the box (140) containing silicon wafers. The unpacking robotic arm (130) is equipped with a feeding suction cup (131) and an unpacking cutter (132) at its end. The feeding suction cup (131) adsorbs the box (140), and the unpacking cutter (132) cuts the tape on the box (140).

6. A silicon wafer unpacking device according to claim 5, characterized in that, The box opening conveyor line (120) is provided with a plurality of box opening cylinders (150) at the end of the box opening cylinder (150), and a box opening suction cup (151) is provided at the end of the box opening cylinder (150). The box opening cylinder (150) drives the box opening suction cup (151) to open the box (140).

7. A silicon wafer unpacking device according to claim 4, characterized in that, The material removal device includes a material removal robotic arm (160), a bag removal section (170), and a material removal conveyor line (180). The material removal robotic arm (160) picks up the silicon wafer and places it into the bag removal section (170) to remove the bag from the surface of the silicon wafer. The material removal conveyor line (180) is provided with a paper removal section (181) to remove the paper from the surface of the silicon wafer.

8. A silicon wafer unpacking device according to claim 4, characterized in that, It also includes a material transfer gantry (190) that grabs and transfers silicon wafers.

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