Automatic feeding and discharging system for coating machine and control method

Abstract

The invention discloses an automatic feeding and discharging system for a coating machine and a control method, and relates to the technical field of automatic feeding and discharging of the coating machine, the system comprises a sheet carrying hub and a sheet taking and placing station, and further comprises a controller and a manipulator used for transferring material sheets between the sheet carrying hub and the sheet taking and placing station, the material sheets are provided with positioning marks, and the controller is connected with the manipulator. The manipulator is provided with a camera used for acquiring images of the material pieces, the camera sends the acquired images of the material pieces to a controller, and the controller generates position information of the material pieces on the basis of the positioning marks on the images. The feeding method comprises the steps of A1, position adjustment of the wafer carrying hub, A2, wafer taking of the mechanical arm and A3, wafer hanging of the mechanical arm. The blanking method comprises the steps of B1, position adjustment of the wafer carrying hub, B2, wafer taking by the mechanical arm and B3, wafer placing by the mechanical arm. The automatic feeding and discharging device has the advantages that full automation of feeding and discharging operation is achieved, the labor intensity of workers is reduced, and the product quality consistency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic loading and unloading of coating machines, and in particular to an automatic loading and unloading system and a control method for coating machines. Background Art

[0002] The loading and unloading operations of existing coating machines are generally completed manually due to the complex operation process and high precision requirements for taking and hanging films during loading and unloading. When hanging and unloading films, it is necessary to take the coated films off the film hub one by one, and then hang the films waiting for coating on the film hub one by one. Not only is the operation intensity high, but when the operator is tired, it is easy to cause the film to be damaged, or the hanging position is not accurate, affecting the consistency of product quality. In order to solve the above problems, some auxiliary tooling is currently used to reduce the labor intensity during manual loading and unloading operations, but it cannot fundamentally solve the above problems. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and to provide an automatic loading and unloading system and control method for a coating machine, which realizes full automation of loading and unloading operations, reduces manual labor intensity, and is conducive to improving product quality consistency.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: An automatic loading and unloading system for a coating machine includes a wafer carrier hub and a wafer pick-up and placement station, and also includes a controller and a manipulator for transferring wafers between the wafer carrier hub and the wafer pick-up and placement station. The wafer is provided with a positioning mark, and the manipulator is provided with a camera for acquiring an image of the wafer. The camera sends the acquired wafer image to the controller, and the controller generates the wafer position information based on the positioning mark on the image.

[0005] As a further improvement of the above technical solution: When the robot moves to the sheet picking and placing station to prepare to pick up the sheet, the camera obtains a first image of the sheet on the sheet picking and placing station, the controller generates first position information of the sheet based on the positioning mark on the first image, and sends the first position information to the robot, and the robot grabs the sheet on the sheet picking and placing station based on the first position information.

[0006] When the robot moves to the wafer hub to prepare to take the film, the camera obtains a second image of the sheet on the wafer hub, the controller generates second position information of the sheet based on the positioning mark on the second image, and sends the second position information to the robot, and the robot grabs the sheet on the wafer hub based on the second position information.

[0007] After the robot moves to the wafer hub to complete the film hanging, the camera obtains a third image of the film on the wafer hub, and the controller generates third position information of the film based on the positioning mark on the third image, and compares the third position information with the standard position information stored in the controller. When the third position information matches the standard position information, it is determined that the film hanging is successful.

[0008] The wafer hub is equipped with a servo motor for driving the wafer hub to rotate and a photoelectric sensor component for detecting the indexing position of the wafer hub. The wafer hub is provided with a light hole that cooperates with the photoelectric sensor component.

[0009] The photoelectric sensor assembly is arranged above the wafer carrier hub, and a plurality of light through holes are arranged. The plurality of light through holes are evenly distributed along the circumference at the top of the wafer carrier hub and correspond one by one to the positions of the hanging films on the wafer carrier hub.

[0010] A position locking mechanism is provided at the bottom of the wafer carrier hub. A plurality of positioning holes cooperating with the position locking mechanism are provided at the bottom of the wafer carrier hub. The plurality of positioning holes are evenly distributed along the circumference and correspond one by one to each hanging film position on the wafer carrier hub.

[0011] The position locking mechanism comprises a positioning pin and a lifting driver for driving the positioning pin to rise and fall, and the positioning pin is installed at the lifting driving end of the lifting driver.

[0012] An automatic loading and unloading control method based on the automatic loading and unloading system for a coating machine comprises the following steps: A1: Adjust the position of the wafer hub. By driving the wafer hub to rotate, the position of the wafer without the wafer installed on the wafer hub is adjusted to the waiting area for wafer hanging. A2: The robot takes the sheet, adjusts the robot to the sheet picking and placing station, obtains a first image of the sheet on the sheet picking and placing station through a camera, and sends the first image to a controller, which generates first position information of the sheet based on the positioning mark on the first image, and sends the first position information to the robot, which grabs the sheet on the sheet picking and placing station based on the first position information; A3: Robotic arm hanging film, adjust the robot arm that grabs the film to the waiting hanging area of ​​the wafer hub, and hang the film on the hanging position of the wafer hub through the robot arm based on the pre-set hanging program.

[0013] As a further improvement of the above technical solution: When executing step A1, the servo motor drives the wafer carrier hub to rotate, controls the position of the unmounted sheet to be hung to the area to be hung, and when the photoelectric sensor assembly irradiates light through the light-transmitting hole, determines that the wafer carrier hub indexing position is accurate, and then drives the positioning pin to rise through the lifting drive, so that the positioning pin is inserted into the positioning hole to lock the position of the wafer carrier hub.

[0014] When executing step A3, after the sheet is mounted on the mounting position of the wafer hub by the robot, a third image of the sheet on the wafer hub is obtained by the camera, and the third image is sent to the controller; the controller generates third position information of the sheet based on the positioning mark on the third image, and compares the third position information with the standard position information stored in the controller. When the third position information matches the standard position information, it is determined that the mounting is successful.

[0015] An automatic material unloading control method based on the automatic material unloading system for a coating machine comprises the following steps: B1: Adjust the position of the wafer hub, by driving the wafer hub to rotate, adjust the position of the hanging film with the film mounted on the wafer hub to the film waiting area; B2: The robot takes the sheet, adjusts the robot to the sheet-to-be-taken area, obtains a second image of the sheet on the wafer hub through a camera, and sends the second image to a controller, which generates second position information of the sheet based on the positioning mark on the second image, and sends the second position information to the robot, which grabs the sheet on the wafer hub based on the second position information; B3: Robotic arm places the sheet. The robot that has grabbed the sheet is adjusted to the sheet placement station. Based on the pre-set sheet placement program, the robot places the sheet on the sheet placement position of the sheet placement station.

[0016] As a further improvement of the above technical solution: When executing step B1, the servo motor drives the wafer hub to rotate, controls the position of the hanging sheet on which the material sheet is installed to be adjusted to the sheet-to-be-taken area, and when the photoelectric sensor component irradiates light through the light-transmitting hole, determines that the wafer hub indexing position is accurate, and then drives the positioning pin to rise through the lifting drive, so that the positioning pin is inserted into the positioning hole to lock the position of the wafer hub.

[0017] Compared with the prior art, the advantages of the present invention are: The automatic loading and unloading system for the coating machine of the present invention realizes full automation of the loading and unloading operations of the coating machine by transferring the sheets between the wafer carrier hub and the wafer pick-up and placement station through a robot, reduces the intensity of manual labor, and is beneficial to improving the consistency of product quality; at the same time, a camera for acquiring images of the sheets is provided on the robot, so that one camera can photograph sheets at multiple positions as the robot is moved, thereby reducing the number of cameras arranged and saving the hardware cost of the system; a positioning mark is provided on the sheet, so that the controller can generate the position information of the sheet based on the positioning mark on the image.

[0018] The automatic loading and unloading control method and the automatic unloading control method of the present invention have technical features corresponding to the automatic loading and unloading system for the coating machine, and therefore have corresponding technical effects, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0020] Figure 1 It is a schematic diagram of the top view of the structure of Example 1 of the automatic loading and unloading system for a coating machine of the present invention.

[0021] Figure 2 It is a side structural schematic diagram of the wafer carrier hub in Example 1 of the automatic loading and unloading system for a coating machine of the present invention.

[0022] Figure 3 It is an enlarged schematic diagram of the positioning hole in Example 1 of the automatic loading and unloading system for a coating machine of the present invention.

[0023] Figure 4 It is an enlarged schematic diagram of the end of the sheet in Example 1 of the automatic loading and unloading system for a coating machine of the present invention.

[0024] Figure 5 It is a top view structural schematic diagram of Example 2 of the automatic loading and unloading system for a coating machine of the present invention.

[0025] Figure 6 It is a schematic flow chart of the automatic feeding control method of the present invention.

[0026] Figure 7 It is a schematic flow chart of the automatic material feeding control method of the present invention.

[0027] The reference numerals in the accompanying drawings represent: 1. Film carrier hub; 100. Film; 101. Positioning mark; 11. Servo motor; 12. Photoelectric sensor component; 13. Light hole; 14. Position locking mechanism; 141. Positioning pin; 142. Lifting drive; 15. Positioning hole; 2. Film pick-up and placement station; 3. Robot; 31. Camera. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways as defined and covered by the claims.

[0029] Automatic loading and unloading system example 1: like Figures 1 to 4As shown, the automatic loading and unloading system for the coating machine of this embodiment includes a wafer hub 1 and a wafer pick-up and placement station 2, and also includes a controller and a manipulator 3 for transferring the sheet 100 between the wafer hub 1 and the wafer pick-up and placement station 2. A positioning mark 101 is provided on the sheet 100, and the manipulator 3 is provided with a camera 31 for acquiring an image of the sheet 100. The camera 31 sends the acquired image of the sheet 100 to the controller, and the controller generates the position information of the sheet 100 based on the positioning mark 101 on the image. The automatic loading and unloading system for the coating machine of the present invention transfers the material 100 between the wafer hub 1 and the wafer pick-up and placement station 2 through the manipulator 3, thereby realizing full automation of the loading and unloading operations of the coating machine, reducing the intensity of manual labor, and being beneficial to improving the consistency of the quality of the finished product; at the same time, a camera 31 for acquiring an image of the material 100 is provided on the manipulator 3, so that one camera 31 can photograph the material 100 at multiple positions as the manipulator 3 is moved, thereby reducing the number of cameras 31 arranged and saving the hardware cost of the system; a positioning mark 101 is provided on the material 100, so that the controller can generate the position information of the material 100 based on the positioning mark 101 on the image.

[0030] In this embodiment, when the robot 3 moves to the sheet picking and placing station 2 to prepare to pick up the sheet, the camera 31 obtains a first image of the sheet 100 on the sheet picking and placing station 2, and the controller generates first position information of the sheet 100 based on the positioning mark 101 on the first image, and sends the first position information to the robot 3. The robot 3 grabs the sheet 100 on the sheet picking and placing station 2 based on the first position information. This method can ensure that the robot 3 can accurately grab the sheet 100 on the sheet picking and placing station 2.

[0031] In this embodiment, when the manipulator 3 moves to the wafer hub 1 to prepare to take the film, the camera 31 obtains a second image of the sheet 100 on the wafer hub 1, and the controller generates second position information of the sheet 100 based on the positioning mark 101 on the second image, and sends the second position information to the manipulator 3. The manipulator 3 grabs the sheet 100 on the wafer hub 1 based on the second position information. This method can ensure that the manipulator 3 can accurately grab the sheet 100 on the wafer hub 1.

[0032] In this embodiment, after the manipulator 3 moves to the wafer hub 1 to complete hanging the film, the camera 31 obtains a third image of the film 100 on the wafer hub 1, and the controller generates third position information of the film 100 based on the positioning mark 101 on the third image, and compares the third position information with the standard position information stored in the controller. When the third position information matches the standard position information, it is determined that the hanging is successful. This method can ensure that the manipulator 3 can promptly discover any errors in hanging the film on the wafer hub 1 to avoid serious losses.

[0033] In this embodiment, the wafer hub 1 is equipped with a servo motor 11 for driving the wafer hub 1 to rotate and a photoelectric sensor component 12 for detecting the indexing position of the wafer hub 1. A light hole 13 cooperating with the photoelectric sensor component 12 is provided on the wafer hub 1. The photoelectric sensor component 12 is arranged above the wafer hub 1. There are multiple light holes 13. The multiple light holes 13 are evenly distributed along the circumferential direction on the top of the wafer hub 1 and correspond one by one to each hanging position on the wafer hub 1. Through the cooperation between the photoelectric sensor component 12 and the light holes 13, the rotation indexing position of the wafer hub 1 can be accurately positioned, providing a stable position basis for the robot 3 to perform film picking and hanging operations on the wafer hub 1.

[0034] In this embodiment, a position locking mechanism 14 is provided at the bottom of the wafer carrier hub 1, and a plurality of positioning holes 15 cooperating with the position locking mechanism 14 are provided at the bottom of the wafer carrier hub 1. The plurality of positioning holes 15 are evenly distributed along the circumference and correspond one by one to each hanging position on the wafer carrier hub 1. The position locking mechanism 14 includes a positioning pin 141 and a lifting driver 142 for driving the positioning pin 141 to rise and fall. The positioning pin 141 is installed at the lifting driving end of the lifting driver 142. Through the cooperation between the position locking mechanism 14 and the positioning holes 15, it can be ensured that when the manipulator 3 performs the film picking and hanging operation on the wafer carrier hub 1, the wafer carrier hub 1 will not be deflected due to touching, and further provide a stable position basis for the manipulator 3 to perform the film picking and hanging operation on the wafer carrier hub 1.

[0035] Automatic loading and unloading system example 2: like Figure 5 As shown, the automatic loading and unloading system for the coating machine of this embodiment is basically the same as the automatic loading and unloading system embodiment 1, and the only difference is that the film taking station and the film placing station in the film taking and placing station 2 of this embodiment are arranged separately, and the robot 3 takes the film at the film taking station of the film taking and placing station 2, and places the film at the film placing station.

[0036] Automatic feeding control method embodiment: like Figure 6 As shown, the automatic loading control method for the automatic loading and unloading system of the coating machine of this embodiment includes the following steps: A1: Adjustment of the position of the wafer hub. The servo motor 11 drives the wafer hub 1 to rotate, controls the position of the unmounted sheet 100 to be adjusted to the waiting area, and when the photoelectric sensor assembly 12 irradiates light through the light hole 13, it is determined that the indexing position of the wafer hub 1 is accurate, and then the lifting driver 142 drives the positioning pin 141 to rise, so that the positioning pin 141 is inserted into the positioning hole 15 to lock the position of the wafer hub 1; A2: The robot takes the sheet, adjusts the robot 3 to the sheet picking and placing station 2, obtains a first image of the sheet 100 on the sheet picking and placing station 2 through the camera 31, and sends the first image to the controller, the controller generates first position information of the sheet 100 based on the positioning mark 101 on the first image, and sends the first position information to the robot 3, and the robot 3 grabs the sheet 100 on the sheet picking and placing station 2 based on the first position information; A3: Robotic arm hanging, the robot 3 that has grasped the sheet 100 is adjusted to the waiting hanging area of ​​the wafer hub 1, and the sheet 100 is hung on the hanging position of the wafer hub 1 by the robot 3 based on the pre-set hanging program. After the sheet 100 is hung on the hanging position of the wafer hub 1, the third image of the sheet 100 on the wafer hub 1 is obtained by the camera 31, and the third image is sent to the controller; the controller generates third position information of the sheet 100 based on the positioning mark 101 on the third image, and compares the third position information with the standard position information stored in the controller. When the third position information matches the standard position information, it is determined that the hanging is successful.

[0037] Automatic feeding control method embodiment: like Figure 7 As shown, the automatic unloading control method for the automatic loading and unloading system of the coating machine of this embodiment includes the following steps: B1: Adjustment of the position of the wafer hub. The servo motor 11 drives the wafer hub 1 to rotate, controls the position of the hanging sheet with the sheet 100 installed to be adjusted to the sheet-to-be-taken area, and when the photoelectric sensor assembly 12 irradiates light through the light-through hole 13, it is determined that the indexing position of the wafer hub 1 is accurate, and then the lifting driver 142 drives the positioning pin 141 to rise, so that the positioning pin 141 is inserted into the positioning hole 15 to lock the position of the wafer hub 1; B2: The robot takes the sheet, adjusts the robot 3 to the sheet-to-be-taken area, obtains a second image of the sheet 100 on the wafer hub 1 through the camera 31, and sends the second image to the controller. The controller generates second position information of the sheet 100 based on the positioning mark 101 on the second image, and sends the second position information to the robot 3. The robot 3 grabs the sheet 100 on the wafer hub 1 based on the second position information. B3: The robot places the sheet. The robot 3 that has grasped the sheet 100 is adjusted to the sheet placement station 2. Based on a pre-set sheet placement program, the robot 3 places the sheet 100 at the sheet placement position of the sheet placement station 2.

[0038] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any technician familiar with the art can make many possible changes and modifications to the technical solution of the present invention by using the technical content disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention should fall within the scope of protection of the technical solution of the present invention.

Claims

1. An automatic loading and unloading system for a coating machine, comprising a wafer hub (1) and a wafer loading and unloading station (2), characterized in that: The invention also includes a controller and a robot (3) for transferring a sheet (100) between a sheet carrier hub (1) and a sheet pick-up and placement station (2), wherein a positioning mark (101) is provided on the sheet (100), and the robot (3) is provided with a camera (31) for acquiring an image of the sheet (100). The camera (31) sends the acquired image of the sheet (100) to the controller, and the controller generates position information of the sheet (100) based on the positioning mark (101) on the image.

2. The automatic loading and unloading system for coating machine according to claim 1, characterized in that: When the robot (3) moves to the sheet picking and placing station (2) to prepare to pick up a sheet, the camera (31) obtains a first image of the sheet (100) on the sheet picking and placing station (2), the controller generates first position information of the sheet (100) based on the positioning mark (101) on the first image, and sends the first position information to the robot (3), and the robot (3) grabs the sheet (100) on the sheet picking and placing station (2) based on the first position information.

3. The automatic loading and unloading system for a coating machine according to claim 2, characterized in that: When the manipulator (3) moves to the wafer carrier hub (1) to prepare for taking a film, the camera (31) obtains a second image of the material (100) on the wafer carrier hub (1), the controller generates second position information of the material (100) based on the positioning mark (101) on the second image, and sends the second position information to the manipulator (3), and the manipulator (3) grabs the material (100) on the wafer carrier hub (1) based on the second position information.

4. The automatic loading and unloading system for a coating machine according to claim 3 is characterized in that: After the robot (3) moves to the wafer carrier hub (1) to complete the film hanging, the camera (31) obtains a third image of the material (100) on the wafer carrier hub (1), the controller generates third position information of the material (100) based on the positioning mark (101) on the third image, and compares the third position information with the standard position information stored in the controller, and when the third position information matches the standard position information, it is determined that the film hanging is successful.

5. The automatic loading and unloading system for a coating machine according to any one of claims 1 to 4, characterized in that: The wafer hub (1) is equipped with a servo motor (11) for driving the wafer hub (1) to rotate and a photoelectric sensor component (12) for detecting the indexing position of the wafer hub (1). The wafer hub (1) is provided with a light hole (13) that cooperates with the photoelectric sensor component (12).

6. The automatic loading and unloading system for a coating machine according to claim 5, characterized in that: The photoelectric sensor assembly (12) is arranged above the wafer carrier hub (1), and a plurality of light through holes (13) are provided. The plurality of light through holes (13) are evenly distributed along the circumference at the top of the wafer carrier hub (1) and correspond one by one to the positions of the hanging pieces on the wafer carrier hub (1).

7. The automatic loading and unloading system for a coating machine according to claim 6, characterized in that: A position locking mechanism (14) is provided at the bottom of the wafer carrier hub (1), and a plurality of positioning holes (15) cooperating with the position locking mechanism (14) are provided at the bottom of the wafer carrier hub (1). The plurality of positioning holes (15) are evenly distributed along the circumference and correspond one by one to each hanging film position on the wafer carrier hub (1).

8. The automatic loading and unloading system for a coating machine according to claim 7, characterized in that: The position locking mechanism (14) comprises a positioning pin (141) and a lifting driver (142) for driving the positioning pin (141) to rise and fall, and the positioning pin (141) is mounted on a lifting driving end of the lifting driver (142).

9. An automatic loading control method based on the automatic loading and unloading system for a coating machine according to any one of claims 1 to 8, characterized in that: The following steps are involved: A1: adjusting the position of the wafer carrier hub, by driving the wafer carrier hub (1) to rotate, adjusting the position of the wafer carrier hub (1) on which the wafer (100) is not mounted to the waiting wafer mounting area; A2: The robot takes the sheet, the robot (3) is adjusted to the sheet picking and placing station (2), a first image of the sheet (100) on the sheet picking and placing station (2) is acquired through the camera (31), and the first image is sent to the controller, the controller generates first position information of the sheet (100) based on the positioning mark (101) on the first image, and the first position information is sent to the robot (3), and the robot (3) grabs the sheet (100) on the sheet picking and placing station (2) based on the first position information; A3: Robotic arm hanging film, adjusting the robot arm (3) that has grasped the material sheet (100) to the waiting hanging area of ​​the wafer carrier hub (1), and hanging the material sheet (100) on the hanging position of the wafer carrier hub (1) through the robot arm (3) based on a pre-set hanging program.

10. The automatic feeding control method according to claim 9, characterized in that: When executing step A1, the servo motor (11) is used to drive the carrier hub (1) to rotate, and the position of the unmounted material (100) is controlled to be adjusted to the waiting area for mounting, and when the photoelectric sensor component (12) irradiates light through the light-transmitting hole (13), it is determined that the indexing position of the carrier hub (1) is accurate, and then the positioning pin (141) is driven to rise by the lifting driver (142), so that the positioning pin (141) is inserted into the positioning hole (15) to lock the position of the carrier hub (1).

11. The automatic feeding control method according to claim 10, characterized in that: When executing step A3, after the material sheet (100) is mounted on the mounting position of the wafer carrier hub (1) by the robot (3), a third image of the material sheet (100) on the wafer carrier hub (1) is obtained by the camera (31), and the third image is sent to the controller; the controller generates third position information of the material sheet (100) based on the positioning mark (101) on the third image, and compares the third position information with the standard position information stored in the controller, and when the third position information matches the standard position information, it is determined that the mounting is successful.

12. An automatic material unloading control method based on the automatic material unloading system for a coating machine according to any one of claims 1 to 8, characterized in that: The following steps are involved: B1: adjusting the position of the wafer hub, by driving the wafer hub (1) to rotate, adjusting the position of the hanging film on which the material film (100) is mounted on the wafer hub (1) to the film waiting area; B2: The robot takes the sheet, the robot (3) is adjusted to the sheet-to-be-taken area, a second image of the sheet (100) on the sheet-carrying hub (1) is acquired through the camera (31), and the second image is sent to the controller, the controller generates second position information of the sheet (100) based on the positioning mark (101) on the second image, and the second position information is sent to the robot (3), and the robot (3) grabs the sheet (100) on the sheet-carrying hub (1) based on the second position information; B3: The robot places the sheet, and adjusts the robot (3) that has grasped the sheet (100) to the sheet placement station (2). Based on a pre-set sheet placement program, the robot (3) places the sheet (100) at the sheet placement position of the sheet placement station (2).

13. The automatic feeding control method according to claim 12, characterized in that: When executing step B1, the servo motor (11) drives the carrier hub (1) to rotate, controls the position of the hanging sheet on which the material sheet (100) is installed to be adjusted to the sheet-to-be-taken area, and when the photoelectric sensor component (12) irradiates light through the light-transmitting hole (13), it is determined that the indexing position of the carrier hub (1) is accurate, and then the positioning pin (141) is driven to rise by the lifting driver (142), so that the positioning pin (141) is inserted into the positioning hole (15) to lock the position of the carrier hub (1).

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