A continuous coating machine for wafer processing

Abstract

The present invention relates to the technical field of coating processing, and particularly relates to a continuous coating machine for wafer processing. Its technical solution includes a machine base, a processing structure, a transfer structure, a chamber opening structure, and a vacuum structure. The processing structure includes a processing chamber, a first frame located inside the processing chamber, a first conveying roller rotatably installed inside the first frame, a first conveyor belt rotatably sleeved on the outer wall of the first conveying roller, a first valve seat located at one end of the processing chamber, and a first valve plate; the transfer structure includes a transfer chamber, a second frame located inside the transfer chamber, a second conveying roller rotatably installed inside the second frame, a second conveyor belt rotatably sleeved on the outer wall of the second conveying roller, a second valve seat located at one end of the transfer chamber, and a second valve plate; the chamber opening structure includes a motor. In the present invention, the processing chamber is connected through the transfer chamber, avoiding the influence of the external environment on the wafer during the transfer process, and each processing chamber does not interfere with each other when performing different coating processes, ensuring the coating effect of the wafer and improving the processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of continuous coating, and particularly relates to a continuous coating machine for wafer processing. Background Art

[0002] A wafer refers to a semiconductor chip, which is a basic component in an integrated circuit. It is usually made of semiconductor materials such as silicon and is used to integrate micro-components and circuits. A coating machine is a device used to coat the surface of an object, which can coat a thin film on the material surface to enhance functions, beautify the appearance or improve durability. The coating machine deposits atoms or molecules of the required materials (such as metals, polymers, etc.) on the wafer surface through various physical or chemical methods to form a thin film covering layer.

[0003] Generally, a vacuum environment is created in the coating machine to ensure that no oxidation reaction occurs during the deposition process, thereby ensuring the quality and uniformity of the thin film. When processing the wafer coating, multiple materials need to be coated, which leads to the need for transfer and transportation in different coating devices. Conducting the coating processing of multiple materials inside a single chamber will cause interference between different processes and affect the coating effect. Transferring to different coating devices will cause the wafer to be exposed to the outside, resulting in oxidation reactions, and dust, particles or other contaminants adhering to the wafer surface, affecting the coating effect and the quality of the wafer. Therefore, those skilled in the art have provided a continuous coating machine for wafer processing to solve the problems raised in the above background art. Summary of the Invention

[0004] The purpose of the present invention is to provide a continuous coating machine for wafer processing in view of the problems existing in the background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A continuous coating machine for wafer processing, including a machine base, a processing structure, a transfer structure, a chamber-opening structure and a vacuum structure. The processing structure includes processing chambers fixedly arranged at the upper end of the machine base and distributed at intervals, a first rack inside the processing chamber, a first conveying roller rotatably installed at both ends inside the first rack, a first conveyor belt rotatably sleeved on the outer wall of the first conveying roller, a first valve seat at an opening at one end of the processing chamber, and a first valve plate slidably installed with the first valve seat through a sealing sleeve;

[0006] The transfer structure includes transfer chambers fixedly arranged at the upper end of the machine base and staggered with the processing chambers, a second rack inside the transfer chamber, a second conveying roller rotatably installed at both ends inside the second rack, a second conveyor belt rotatably sleeved on the outer wall of the second conveying roller, a second valve seat at an opening at one end of the transfer chamber, and a second valve plate slidably installed with the second valve seat through a sealing sleeve;

[0007] The chamber-opening structure includes two sets of motors three fixedly arranged at the upper end of the machine base and turntables at the output ends of the motors three;

[0008] The vacuum structure includes a vacuum pump located at the upper end of the processing chamber.

[0009] Preferably, viewing windows are embedded and installed inside the front ends of the processing chamber and the transfer chamber. The wafers conveyed inside the processing chamber and the transfer chamber can be understood through the viewing windows.

[0010] Preferably, two sets of guide frames and guide racks are arranged above the machine base. A sliding sleeve is embedded and installed inside the guide rack. The sliding sleeve is slidably sleeved on the outer wall of the guide rack. A convex block located inside the guide frame is arranged on one side edge of the turntable. When the turntable rotates, it drives the convex block to rotate. Since the convex block is located on the side edge of the turntable, the distance between the position where the convex block is located and the center of the turntable is the vibration radius of the convex block. The guide frame slides on the outer wall of the guide rack through the sliding sleeve to obtain longitudinal sliding guidance.

[0011] Preferably, a collar is rotatably sleeved outside the convex block. A limiting ring with an outer diameter larger than the inner diameter of the collar is arranged at one end of the convex block. When the convex block vibrates and presses against the guide frame, it contacts the inner wall of the guide frame through the collar. The collar rotates on the outer wall of the convex block during extrusion, reducing the frictional resistance during rotation, and limiting the rotation of the rotating sleeve through the limiting ring to prevent the rotating sleeve from detaching from the guide frame.

[0012] Preferably, connecting rods are arranged at one end of each guide frame. A stroke rod is arranged at one end of the connecting rod. Equally spaced connecting blocks one and two are distributed at the lower ends of the two stroke rods. The connecting block one is connected to the valve plate one, and the connecting block two is connected to the valve plate two. When the stroke rod connected to the connecting block one moves longitudinally, it drives the valve plate one to perform synchronous longitudinal displacement. When the stroke rod connected to the connecting block two moves longitudinally, it drives the valve plate two to perform synchronous longitudinal displacement.

[0013] Preferably, upper supporting rollers one that are equally spaced and fit the inner wall of the upper end of the conveyor belt one are rotatably installed inside the frame one. Lower supporting rollers one that fit the inner wall of the lower end of the conveyor belt one are rotatably installed on both sides inside the frame one. The upper supporting rollers one rotatably support the inner wall of the upper end of the conveyor belt one, and the lower supporting rollers one rotatably support the inner wall of the lower end of the conveyor belt one, improving the rotation stability of the conveyor belt one.

[0014] Preferably, upper supporting rollers two that are equally spaced and fit the inner wall of the upper end of the conveyor belt two are rotatably installed inside the frame two. Lower supporting rollers two that fit the inner wall of the lower end of the conveyor belt two are rotatably installed on both sides inside the frame two. The upper supporting rollers two rotatably support the inner wall of the upper end of the conveyor belt two, and the lower supporting rollers two rotatably support the inner wall of the lower end of the conveyor belt two, improving the rotation stability of the conveyor belt two.

[0015] Preferably, one end of the conveying roller 1 is rotatably installed through a sealing ring inside the processing chamber. A first motor is provided at the upper end of the machine base. A first sprocket connected to one end of the conveying roller 1 is provided at the output end of the first motor. A first chain is rotatably sleeved on the outer wall of the first sprocket. When the first motor drives the first gear to rotate, the first chain is driven to rotate, thereby driving the conveying roller 1 to rotate synchronously and in the same direction, driving the conveying rollers 1 inside multiple processing chambers simultaneously, and enabling the first conveyor belt to operate synchronously.

[0016] Preferably, one end of the conveying roller 2 is rotatably installed through a sealing ring inside the transfer chamber. A second motor is provided at the upper end of the machine base. A second sprocket connected to one end of the conveying roller 2 is provided at the output end of the second motor. A second chain is rotatably sleeved on the outer wall of the second sprocket. When the second motor drives the second gear to rotate, the second chain is driven to rotate, thereby driving the conveying roller 2 to rotate synchronously and in the same direction, driving the conveying rollers 2 inside multiple transfer chambers simultaneously, and enabling the second conveyor belt to operate synchronously.

[0017] Preferably, a U-shaped pipe is connected to the suction end of the vacuum pump. A first solenoid valve and a second solenoid valve are respectively provided on the U-shaped pipe. A first connecting pipe that is equidistantly distributed and penetrates inside the transfer chamber is connected to one side of the lower end of the U-shaped pipe. A second connecting pipe that is equidistantly distributed and penetrates inside the processing chamber is connected to one side of the lower end of the U-shaped pipe. The two sections of the U-shaped pipe are separated and used through the first solenoid valve and the second solenoid valve, and the first connecting pipe and the second connecting pipe are used to vacuum suction the internal spaces of the transfer chamber and the processing chamber.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] The coating equipment of the present invention is installed inside the processing chamber to coat the wafers conveyed into the processing chamber. A transfer chamber is provided between the processing chambers, and the opening and closing are controlled by a first valve plate and a second valve plate. During the transfer process of the wafers on the first conveyor belt and the second conveyor belt, direct connection between the processing chambers is avoided, and the wafers are transferred through the transfer chamber. During the transfer process, the inside of the transfer chamber is vacuum-treated. Different materials are coated in different processing chambers, and there is no interference problem between the various processing processes. At the same time, it avoids the action of external pollutants on the wafers and the reaction therewith, ensures the coating effect of the wafers, and avoids frequent manual transfer between different coating equipments, improving the coating efficiency of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic three-dimensional structure diagram of the main cross-section of the present invention;

[0021] Figure 2 It is a schematic three-dimensional structure diagram of the front view of the present invention;

[0022] Figure 3 It is a schematic three-dimensional structure diagram of the side view of the present invention;

[0023] Figure 4 Schematic top-down three-dimensional structure diagram of the present invention;

[0024] Figure 5 Schematic top-down three-dimensional structure diagram of the second valve plate of the present invention;

[0025] Figure 6 Schematic top-down three-dimensional structure diagram of the first valve plate of the present invention;

[0026] Figure 7 Schematic internal three-dimensional structure diagram of the processing bin and transfer bin of the present invention;

[0027] Figure 8 Schematic side three-dimensional structure diagram of the transfer bin of the present invention;

[0028] Figure 9 Schematic top-down three-dimensional structure diagram of the vacuum structure of the present invention;

[0029] Figure 10 Schematic front three-dimensional structure diagram of the turntable of the present invention;

[0030] Figure 11 Schematic side three-dimensional structure diagram of the first valve seat and the second valve seat of the present invention;

[0031] Figure 12 Schematic rear three-dimensional structure diagram of the second sprocket of the present invention;

[0032] Figure 13 Schematic side three-dimensional structure diagram of the first chain and the second chain of the present invention;

[0033] Figure 14 Schematic side three-dimensional structure diagram of the bump of the present invention.

[0034] Reference numerals:

[0035] 100, machine base; 101, viewing window;

[0036] 200, processing structure; 201, first frame; 202, first conveying roller; 203, first lower supporting roller; 204, first upper supporting roller; 205, first conveyor belt; 206, processing bin; 207, first valve seat; 208, first valve plate; 209, first motor; 210, first sprocket; 211, first chain;

[0037] 300, transfer structure; 301, second frame; 302, second conveying roller; 303, second lower supporting roller; 304, second upper supporting roller; 305, second conveyor belt; 306, transfer bin; 307, second valve seat; 308, second valve plate; 309, second motor; 310, second sprocket; 311, second chain;

[0038] 400. Opening structure; 401. Motor III; 402. Guide frame; 403. Sliding sleeve; 404. Guide frame; 405. Connecting rod; 406. Stroke rod; 407. Connecting block I; 408. Connecting block II; 409. Turntable; 410. Convex block; 411. Limiting ring; 412. Collar

[0039] 500. Vacuum structure; 501. Vacuum pump; 502. U-shaped tube; 503. Solenoid valve I; 504. Solenoid valve II; 505. Connecting pipe I; 506. Connecting pipe II. Specific embodiments

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0041] Please refer to Figures 1 to 14 , three embodiments provided by the present invention:

[0042] Embodiment 1:

[0043] A continuous film coating machine for wafer processing includes a machine base 100, a processing structure 200, a transfer structure 300, an opening structure 400, and a vacuum structure 500. The processing structure 200 includes processing chambers 206 fixedly disposed at the upper end of the machine base 100 and spaced apart, a first frame 201 located inside the processing chamber 206, a first conveying roller 202 rotatably installed inside both ends of the first frame 201, a first conveyor belt 205 rotatably sleeved on the outer wall of the first conveying roller 202, a valve seat I 207 located at an opening at one end of the processing chamber 206, and a valve plate I 208 slidably installed with the valve seat I 207 through a sealing sleeve;

[0044] The transfer structure 300 includes a transfer chamber 306 fixedly disposed at the upper end of the machine base 100 and staggered with the processing chamber 206, a second frame 301 located inside the transfer chamber 306, a second conveying roller 302 rotatably installed inside both ends of the second frame 301, a second conveyor belt 305 rotatably sleeved on the outer wall of the second conveying roller 302, a valve seat II 307 located at an opening at one end of the transfer chamber 306, and a valve plate II 308 slidably installed with the valve seat II 307 through a sealing sleeve;

[0045] The vacuum structure 500 includes a vacuum pump 501 located at the upper end of the processing chamber 206;

[0046] Viewing windows 101 are embedded and installed inside the front ends of both the processing chamber 206 and the transfer chamber 306;

[0047] The suction end of the vacuum pump 501 is connected and installed with a U-shaped pipe 502. The U-shaped pipe 502 is respectively provided with a first solenoid valve 503 and a second solenoid valve 504. One side of the lower end of the U-shaped pipe 502 is connected and installed with a first connecting pipe 505 which is equidistantly distributed and penetrates through the inside of the transfer bin 306. One side of the lower end of the U-shaped pipe 502 is connected and installed with a second connecting pipe 506 which is equidistantly distributed and penetrates through the inside of the processing bin 206;

[0048] In this embodiment, it is worth noting that the processing bin 206 and the transfer bin 306 are used in combination. Both ends of the processing bin 206 are connected to the transfer bin 306. The first valve seat 207 and the second valve seat 307 are the connecting parts of the processing bin 206 and the transfer bin 306, and are connected and sealed to the processing bin 206 and the transfer bin 306 by welding or bolt fixing. After the connection, when the first valve plate 208 and the second valve plate 308 close the two ends of the processing bin 206 and the transfer bin 306, the sealing of the internal spaces of the processing bin 206 and the transfer bin 306 is ensured, providing a sealed environment for the film coating process of the wafers;

[0049] When the first valve plate 208 is opened, the second valve plate 308 is located inside the first valve seat 207. At this time, the processing bin 206 is communicated with the transfer bin 306, but the processing bins 206 are not communicated with each other. The evaporation medium inside the processing bin 206 is prevented from acting on the inside of the adjacent processing bin 206, thereby affecting the wafers in different processing processes. The wafers are conveyed through the first conveyor belt 205 and received by the second conveyor belt 305. The transfer bins 306 must be at both ends of the film coating production line for storing and taking out wafers. The transfer bins 306 at the open ends of both ends of the production line need to be manually loaded and unloaded. The wafers automatically conveyed by the first conveyor belt 205 are sent to the second conveyor belt 305 and then enter the transfer bin 306. During this process, because the first conveyor belt 205 and the second conveyor belt 305 are designed in a conical shape, the gap between the first conveyor belt 205 and the second conveyor belt 305 is reduced, enabling the effective conveyance of the wafers;

[0050] After the wafers are transferred in one process, the first valve plate 208 closes. At this time, the vacuum pump 501 operates, the first solenoid valve 503 is opened, and the second solenoid valve 504 is closed. The suction force is transmitted through the U-shaped pipe 502 and the first connecting pipe 505 to extract the inside of multiple transfer bins 306. Because the transfer bin 306 is communicated with the processing bin 206 at this time, the gas inside the processing bin 206 is also sucked, thereby ensuring the vacuum condition inside the transfer bin 306 and preventing the internal media from flowing among the various chambers after the second valve plate 308 is opened. When the second valve plate 308 is opened, the transferred wafers are conveyed to the first conveyor belt 205 on one side by the second conveyor belt 305 and then are subjected to film coating processing by the film coating mechanism inside the processing bin 206;

[0051] When depositing a silicon-based thin film on the wafer, the processing chamber 206 is in an oxygen-free environment. The silicon target is heated to evaporate or sputter, and then deposited on the surface of the wafer. When depositing an oxide film on the wafer, the processing chamber 206 is used in conjunction with a gas source supplier and a temperature controller. The gas source supplier is a system that provides a gas containing oxides, and the temperature controller controls the temperature in the reaction chamber to promote the reaction. The deposition of the oxide film is achieved by chemical vapor deposition. When depositing a metal film on the wafer, the deposition of the metal thin film can be achieved by physical vapor deposition. Heating the metal target causes the metal to evaporate or sputter, and then the metal particles are deposited on the surface of the wafer to form a metal thin film. An ion source can be used to generate metal ions to better control the quality and uniformity of the metal thin film. Each type of film deposition has different process requirements and required structural components, ensuring effective film deposition processing in a vacuum environment. Each processing environment is separated to avoid mutual influence between different processing processes. At the same time, the transfer wafer is vacuum-transferred under sealed conditions to avoid contamination of the wafer by the external environment and ensure the film deposition effect of the wafer.

[0052] Embodiment 2:

[0053] Inside the frame one 201, upper supporting rollers one 204 are rotatably installed at equal intervals and are in contact with the inner wall of the upper end of the conveyor belt one 205. On both sides inside the frame one 201, lower supporting rollers one 203 are rotatably installed and are in contact with the inner wall of the lower end of the conveyor belt one 205.

[0054] Inside the frame two 301, upper supporting rollers two 304 are rotatably installed at equal intervals and are in contact with the inner wall of the upper end of the conveyor belt two 305. On both sides inside the frame two 301, lower supporting rollers two 303 are rotatably installed and are in contact with the inner wall of the lower end of the conveyor belt two 305.

[0055] One end of the conveying roller one 202 is rotatably installed through the processing chamber 206 by means of a sealing ring. On the upper end of the machine base 100, a motor one 209 is provided. The output end of the motor one 209 is provided with a sprocket one 210 connected to one end of the conveying roller one 202, and a chain one 211 is rotatably sleeved on the outer wall of the sprocket one 210.

[0056] One end of the conveying roller two 302 is rotatably installed through the transfer chamber 306 by means of a sealing ring. On the upper end of the machine base 100, a motor two 309 is provided. The output end of the motor two 309 is provided with a sprocket two 310 connected to one end of the conveying roller two 302, and a chain two 311 is rotatably sleeved on the outer wall of the sprocket two 310.

[0057] In this embodiment, when the first motor 209 operates, it drives the first conveying roller 202 to rotate. The first conveying roller 202 conveys the first conveyor belt 205. The first conveying rollers 202 inside the multiple processing bins 206 are linked through the first sprocket 210 and the first chain 211, achieving synchronous movement, and uniformly conveying the wafers. During the process of wafer coating processing, the wafers are effectively transported. When the second motor 309 operates, it drives the second conveying roller 302 to rotate. The second conveying roller 302 conveys the second conveyor belt 305. The second conveying rollers 302 inside the multiple transfer bins 306 are linked through the second sprocket 310 and the second chain 311, achieving synchronous movement. During the process of wafer coating processing, the wafers are uniformly transported to the processing bin 206. Compartments with the same attributes are driven by the same power source, achieving synchronous operation while reducing the use of electrical equipment and energy consumption.

[0058] Embodiment Three:

[0059] The opening structure 400 includes two groups of third motors 401 fixed to the upper end of the machine base 100 and turntables 409 located at the output ends of the third motors 401;

[0060] There are two groups of guide frames 404 and guide brackets 402 arranged above the machine base 100. A sliding sleeve 403 is embedded and installed inside the guide bracket 402. The sliding sleeve 403 is slidably sleeved on the outer wall of the guide bracket 402. A convex block 410 located inside the guide frame 404 is arranged on one side edge of the turntable 409.

[0061] A collar 412 is rotatably sleeved outside the convex block 410. A limiting ring 411 with an outer diameter larger than the inner diameter of the collar 412 is arranged at one end of the convex block 410.

[0062] Connecting rods 405 are arranged at one end of each of the guide frames 404. A travel rod 406 is arranged at one end of the connecting rod 405. Equally spaced connecting blocks one 407 and connecting blocks two 408 are distributed at the lower ends of the two travel rods 406. The connecting block one 407 is connected to the first valve plate 208, and the connecting block two 408 is connected to the second valve plate 308.

[0063] In this embodiment, the motor three 401 drives the turntable 409 to rotate, driving the cam to rotate around the turntable 409. The collar 412 on the outer wall of the cam squeezes the guide frame 404. After the guide frame 404 is stressed, it slides on the outer wall of the guide frame 402 through the sliding sleeve 403, thereby realizing longitudinal movement. When the convex block 410 rotates one week, it is a cycle of longitudinal movement of the guide frame 404. Through the connecting rod 405, the stroke rod 406, the connecting block one 407 and the connecting block two 408, the valve plate one 208 and the valve plate two 308 are driven to move longitudinally synchronously. The valve plate one 208 moves longitudinally following the connecting block one 407, and the valve plate two 308 moves longitudinally following the connecting block two 408. Multiple valve plates one 208 are lifted synchronously, and there are two sets of the opening and closing structure 400, realizing the independent control of the valve plate one 208 and the valve plate two 308. When the valve plate one 208 and the valve plate two 308 control the opening and closing of the transfer bin 306 and the processing bin 206, the use of power equipment is reduced, the energy consumption and the later maintenance intensity of the power equipment are reduced. On the premise of realizing the above functions, the number of power equipment used in the process of wafer coating processing is reduced.

[0064] The above specific embodiments are only several preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant revelations of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0065] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A continuous coating machine for wafer processing, comprising a machine base (100), a processing structure (200), a transfer structure (300), a chamber opening structure (400) and a vacuum structure (500), characterized in that: The processing structure (200) includes processing bins (206) fixedly arranged at the upper end of the machine base (100) and distributed at intervals, a first frame (201) located inside the processing bins (206), first conveying rollers (202) rotatably installed inside both ends of the first frame (201), a first conveyor belt (205) rotatably sleeved on the outer wall of the first conveying rollers (202), a first valve seat (207) located at the opening at one end of the processing bins (206), and a first valve plate (208) slidably installed with the first valve seat (207) through a sealing sleeve; The transfer structure (300) includes transfer bins (306) fixedly arranged at the upper end of the machine base (100) and distributed alternately with the processing bins (206), a second frame (301) located inside the transfer bins (306), second conveying rollers (302) rotatably installed inside both ends of the second frame (301), a second conveyor belt (305) rotatably sleeved on the outer wall of the second conveying rollers (302), a second valve seat (307) located at the opening at one end of the transfer bins (306), and a second valve plate (308) slidably installed with the second valve seat (307) through a sealing sleeve; The bin opening structure (400) includes two groups of third motors (401) fixedly arranged at the upper end of the machine base (100), and turntables (409) located at the output ends of the third motors (401); The vacuum structure (500) includes a vacuum pump (501) located above the transfer bins (306); Two groups of guide frames (404) and guide racks (402) are arranged above the machine base (100). A sliding sleeve (403) is embedded and installed inside the guide rack (402). The sliding sleeve (403) is slidably sleeved on the outer wall of the guide rack (402). A convex block (410) located inside the guide frame (404) is arranged at one side edge of the turntable (409); A collar (412) is rotatably sleeved outside the convex block (410). A limiting ring (411) with an outer diameter larger than the inner diameter of the collar (412) is arranged at one end of the convex block (410); Connecting rods (405) are arranged at one end of each of the guide frames (404). A stroke rod (406) is arranged at one end of the connecting rod (405). Equally spaced first connecting blocks (407) and second connecting blocks (408) are arranged at the lower ends of the two stroke rods (406). The first connecting block (407) is connected to the second valve plate (308), and the second connecting block (408) is connected to the first valve plate (208); Both ends of the processing bins (206) are connected to the transfer bins (306). The first valve seat (207) and the second valve seat (307) are connecting components of the processing bins (206) and the transfer bins (306).

2. The continuous coating machine for wafer processing according to claim 1, wherein: Visual windows (101) are embedded and installed inside the front ends of the processing bins (206) and the transfer bins (306).

3. A continuous film coating machine for wafer processing according to claim 1, characterized in that: Equally spaced upper supporting rollers (204) that are rotatably installed inside the first frame (201) and are in contact with the inner wall of the upper end of the first conveyor belt (205), and lower supporting rollers (203) that are rotatably installed on both sides inside the first frame (201) and are in contact with the inner wall of the lower end of the first conveyor belt (205) are arranged inside the first frame (201).

4. A continuous coating machine for wafer processing according to claim 1, characterized in that: Inside the second frame (301), upper supporting rollers two (304) which are evenly distributed and are in contact with the inner wall of the upper end of the second conveyor belt (305) are rotatably installed, and lower supporting rollers two (303) which are in contact with the inner wall of the lower end of the second conveyor belt (305) are rotatably installed on both sides inside the second frame (301).

5. A continuous coating machine for wafer processing according to claim 1, characterized in that: One end of the first conveying roller (202) is rotatably installed through the processing chamber (206) by means of a sealing ring. An electric motor one (209) is arranged at the upper end of the machine base (100). A first sprocket (210) connected to one end of the first conveying roller (202) is arranged at the output end of the electric motor one (209), and a first chain (211) is rotatably sleeved on the outer wall of the first sprocket (210).

6. The continuous coating machine for wafer processing according to claim 1, wherein: One end of the second conveying roller (302) is rotatably installed through the transfer chamber (306) by means of a sealing ring. An electric motor two (309) is arranged at the upper end of the machine base (100). A second sprocket (310) connected to one end of the second conveying roller (302) is arranged at the output end of the electric motor two (309), and a second chain (311) is rotatably sleeved on the outer wall of the second sprocket (310).

7. A continuous film coating machine for wafer processing according to claim 1, characterized in that: The suction end of the vacuum pump (501) is connected and installed with a U-shaped pipe (502). The U-shaped pipe (502) is respectively provided with a first solenoid valve (503) and a second solenoid valve (504). A first connecting pipe (505) which is evenly distributed and penetrates through the inside of the transfer chamber (306) is connected and installed on one side of the lower end of the U-shaped pipe (502), and a second connecting pipe (506) which is evenly distributed and penetrates through the inside of the processing chamber (206) is connected and installed on one side of the lower end of the U-shaped pipe (502).

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