Powder atomic layer deposition equipment

Abstract

The invention belongs to the technical field of atomic layer deposition, and relates to powder atomic layer deposition equipment which comprises a first gas input assembly used for inputting first reaction gas; the second gas input assembly is used for inputting second reaction gas; the reaction assembly is used for providing a reaction space; the reaction assembly is respectively connected with the first gas input assembly and the second gas input assembly; the heating assembly is used for heating a reaction substance in the reaction assembly; the heating assembly is arranged in the reaction assembly; the output assembly is used for outputting reaction substances in the reaction assembly; the output assembly is connected with the reaction assembly; the collecting assembly is used for collecting products; and the collecting assembly is connected with the output assembly. According to the equipment provided by the invention, a powder sample can be in a fluidized state under the action of airflow, gaps among particles are promoted to be opened, a precursor source is in full contact with each particle, the wrapping uniformity is ensured, and the uneven thickness of a coating is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of atomic layer deposition, and in particular to a powder atomic layer deposition device. Background Art

[0002] Atomic layer deposition (ALD), also known as atomic layer epitaxy (ALE) or atomic layer chemical vapor deposition (ALCVD), was first proposed by Finnish scientists in 1974. It has the advantages of sequential deposition of single atomic layers, extremely uniform thickness of the deposited layer, and high three-dimensional conformality. It has become a key link in the development of advanced semiconductor process technology.

[0003] In the atomic layer deposition process, the chemical reaction of the new atomic layer is directly related to the previous layer. Atomic layer deposition forms a deposited film by alternately passing two or more gas-phase precursor sources into the reactor and performing chemical adsorption reactions on the surface of the deposition substrate. It uses chemical bonds to alternately adsorb substances A and B to achieve surface reaction growth. Atomic layer deposition has the characteristics of self-limitation, that is, in each pulse cycle, the gas-phase precursor can only react at the atomic bonding sites on the surface of the deposition substrate and just cover the substrate surface with a saturated amount, and can repeat atomic layer by atomic layer in a very wide process window.

[0004] Traditional ALD deposition is generally suitable for smaller objects or substrates, while fluidized bed ALD can process larger particles and is suitable for some samples with larger particle sizes. Its production efficiency is much higher than that of traditional ALD, and it is suitable for large-scale industrial applications. It can also process various types of particles and irregularly shaped objects, and is suitable for catalysts, nanomaterials, powder coatings, and other fields. In equipment manufacturing, traditional ALD requires a complex vacuum system to maintain a low-pressure environment during the reaction process, and also requires precise temperature and flow control, which is relatively complicated to operate. Summary of the invention

[0005] In view of this, the present invention provides a powder atomic layer deposition device.

[0006] Specifically, the present invention is achieved through the following technical solutions:

[0007] According to a first aspect of the present invention, there is provided a powder atomic layer deposition apparatus, comprising:

[0008] A first gas input component, used for inputting a first reaction gas;

[0009] A second gas input component, used for inputting a second reaction gas;

[0010] A reaction component, used for providing a reaction space; the reaction component is connected to the first gas input component and the second gas input component respectively;

[0011] A heating component, used for heating the reaction material inside the reaction component; the heating component is arranged in the reaction component;

[0012] An output component, used to output the reaction substances in the reaction component; the output component is connected to the reaction component;

[0013] The collecting component is used to collect the product; the collecting component is connected to the output component.

[0014] Optionally, the first gas input component includes: a first pipeline and a first precursor source bottle, wherein the gas outlet of the first pipeline is connected to the reaction component, and the first precursor source bottle is connected to the first pipeline.

[0015] Optionally, the first gas input component further includes: a first regulating valve, and the first regulating valve is arranged on the first pipeline.

[0016] Optionally, the second gas input component includes: a second pipeline and a second precursor source bottle, wherein the gas outlet of the second pipeline is connected to the reaction component, and the second precursor source bottle is connected to the second pipeline.

[0017] Optionally, the second gas input component further includes: a second regulating valve, and the second regulating valve is arranged on the second pipeline.

[0018] Optionally, the reaction assembly includes: a fluidized bed and a gas distribution plate, the bottom end of the fluidized bed is respectively connected to the gas outlet of the first pipe in the first gas input assembly and the gas outlet of the second pipe in the second gas input assembly, the top of the fluidized bed is connected to the feed port of the gas-solid separator in the output assembly, a storage bin is formed inside the bottom end of the fluidized bed, the gas distribution plate is arranged inside the fluidized bed and is higher than the storage bin, and an inlet is arranged on the bottom side wall of the fluidized bed, the inlet is connected to the storage bin and is lower than the gas distribution plate.

[0019] Optionally, the heating component comprises: a heating plate, and the heating plate is arranged on the inner wall of the fluidized bed in the reaction component.

[0020] Optionally, the output component includes: a gas-solid separator and a vacuum pump, wherein the feed port of the gas-solid separator is connected to the fluidized bed in the reaction component, the discharge port of the gas-solid separator is connected to the collection component, the gas outlet of the gas-solid separator is facing the air, and the gas-solid separator is connected to the vacuum pump.

[0021] Optionally, the output component further includes: a discharge lock, and the discharge lock is arranged at the feed port of the gas-solid separator.

[0022] Optionally, the collecting component includes: a collecting bin, and the collecting bin is connected to the discharge port of the gas-solid separator in the output component.

[0023] The technical solution provided by the present invention brings at least the following beneficial effects:

[0024] The powder atomic layer deposition equipment provided in the present application can fluidize the powder sample under the action of airflow, promote the opening of gaps between particles, make the precursor source fully contact with each particle, ensure the uniformity of the package, and avoid uneven coating thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0027] Figure 1 A schematic structural diagram of a powder atomic layer deposition device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Figure 1 A powder atomic layer deposition device suitable for an embodiment of the present invention is schematically shown.

[0030] Reference Figure 1 As shown, the present application provides a powder atomic layer deposition device, comprising:

[0031] A first gas input assembly 10, used for inputting a first reaction gas;

[0032] A second gas input assembly 20, used for inputting a second reaction gas;

[0033] A reaction component 30 is used to provide a reaction space; the reaction component 30 is connected to the first gas input component 10 and the second gas input component 20 respectively;

[0034] A heating component 40 is used to heat the reaction material inside the reaction component 30; the heating component 40 is disposed in the reaction component 30;

[0035] The output component 50 is used to output the reaction substances in the reaction component 30; the output component 50 is connected to the reaction component 30;

[0036] The collecting component 60 is used to collect the product; the collecting component 60 is connected to the output component 50 .

[0037] In the embodiment of the present application, the powder particles to be coated are placed in the reaction assembly 30, the first reaction gas and the second reaction gas are respectively input into the reaction assembly 30 through the first gas input assembly 10 and the second gas input assembly 20, and then the heating assembly 40 heats the powder particles, the first reaction gas and the second reaction gas, the reaction material is output through the output assembly 50, the gas after the reaction is discharged, and the reaction product is stored in the collection assembly 60. The powder atomic layer deposition device provided in the embodiment of the present application shows significant creativity in structural design and functional realization, which is specifically reflected in the following aspects:

[0038] 1. Modular and integrated design

[0039] Modular design: The device is cleverly divided into multiple functional components, including gas input, reaction, heating, output and collection modules. This design not only improves the maintainability and scalability of the device, but also makes the connection between the components more flexible and efficient. Integrated design: The heating component 40 is directly set inside the reaction component 30, realizing the close integration of the reaction space and the heating source. This design not only reduces energy loss, but also improves heating efficiency and reaction rate.

[0040] 2. Precise gas control and reaction management

[0041] Dual gas input system: Through the first gas input assembly 10 and the second gas input assembly 20, the input amount and input timing of the two reaction gases can be accurately controlled, thereby achieving precise regulation of the reaction process. Optimization of reaction assembly: The reaction assembly 30 not only provides sufficient reaction space, but also ensures uniform distribution and effective reaction of the reaction gas through reasonable structural design.

[0042] 3. Efficient reaction material processing and collection

[0043] Flexibility of output assembly: Output assembly 50 can efficiently output the reacted substances while maintaining the pressure inside reaction assembly 30 stable, providing the possibility for continuous reaction. Practicality of collection assembly: Collection assembly 60 can conveniently collect the products after the reaction, avoiding waste and pollution of the products and improving the overall efficiency of the equipment.

[0044] 4. Innovation in coating process

[0045] Coating of powder particles: This invention uses powder particles as coating objects for the first time, and achieves high-quality coating of powder particles through atomic layer deposition technology. This method not only improves the uniformity and adhesion of the coating, but also expands the application field of atomic layer deposition technology.

[0046] 5. Potential for automation and intelligence

[0047] Potential automatic control: Although not explicitly shown in the figure, the device structure of the present invention provides the possibility of automatic control. By introducing intelligent components such as sensors and controllers, real-time monitoring and precise control of the working status of the device can be achieved, further improving the production efficiency and product quality of the device.

[0048] In summary, the powder atomic layer deposition device provided in the embodiment of the present application has shown remarkable creativity in both structural design and functional realization. The device not only improves the efficiency and quality of the coating process, but also expands the application field of atomic layer deposition technology, and has broad market prospects and practical value.

[0049] Exemplarily, the first gas input component 10 includes: a first pipeline 11 and a first precursor source bottle 12 , wherein the gas outlet of the first pipeline 11 is connected to the reaction component 30 , and the first precursor source bottle 12 is connected to the first pipeline 11 .

[0050] In the embodiment of the present application, the inert gas is transported to the reaction assembly 30 through the first pipe 11. When the inert gas flows through the first pipe 11, the first precursor source bottle 12 is also brought into the reaction assembly 30 by the inert gas.

[0051] Exemplarily, the first gas input component 10 further includes: a first regulating valve 13 , and the first regulating valve 13 is disposed on the first pipeline 11 .

[0052] In the embodiment of the present application, the first regulating valve 13 is used to adjust the flow rate of the first pipeline 11 .

[0053] Exemplarily, the second gas input component 20 includes: a second pipeline 21 and a second precursor source bottle 22 , wherein the gas outlet of the second pipeline 21 is connected to the reaction component 30 , and the second precursor source bottle 22 is connected to the second pipeline 21 .

[0054] In the embodiment of the present application, the oxygen source is transported to the reaction component 30 through the second pipe 21. When the oxygen source flows through the second pipe 21, the second precursor source bottle 22 is also brought into the reaction component 30 through the oxygen source.

[0055] Exemplarily, the second gas input component 20 further includes: a second regulating valve 23 , and the second regulating valve 23 is disposed on the second pipeline 21 .

[0056] In the embodiment of the present application, the second regulating valve 23 is used to adjust the flow rate of the second pipeline 21 .

[0057] Exemplarily, the reaction component 30 includes: a fluidized bed 31 and a gas distribution plate 32, the bottom end of the fluidized bed 31 is respectively connected to the gas outlet of the first pipe 11 in the first gas input component 10 and the gas outlet of the second pipe 21 in the second gas input component 20, the top of the fluidized bed 31 is connected to the feed port of the gas-solid separator 51 in the output component 50, a storage bin 33 is formed inside the bottom end of the fluidized bed 31, the gas distribution plate 32 is arranged inside the fluidized bed 31 and is higher than the storage bin 33, and an inlet 34 is provided on the bottom side wall of the fluidized bed 31, the inlet 34 is connected to the storage bin 33 and is lower than the gas distribution plate 32.

[0058] In the embodiment of the present application, the powder particles to be coated enter the storage bin 33 through the inlet 34. When the fluid in the first pipe 11 and the second pipe 21 flows through the storage bin 33, the powder particles are carried to the middle space of the fluidized bed 31. When the fluid in the first pipe 11 and the second pipe 21 flows through the gas distribution plate 32, the gas distribution plate 32 can make the fluid flow rate balanced and stable to prevent the chaotic fluid from impacting the powder. The heating component 40 in the middle space of the fluidized bed 31 heats the reaction object, promotes the reaction, and obtains the product.

[0059] Exemplarily, the heating component 40 includes: a heating plate 41 , and the heating plate 41 is arranged on the inner wall of the fluidized bed 31 in the reaction component 30 .

[0060] In the embodiment of the present application, the heating plate 41 is arranged on the inner wall of the fluidized bed 31, and can generate heat in the surrounding space to heat the fluid input by the first pipe 11 and the second pipe 21 and the powder particles to be coated, thereby accelerating the reaction.

[0061] Exemplarily, the output component 50 includes: a gas-solid separator 51 and a vacuum pump 52, wherein the feed port of the gas-solid separator 51 is connected to the fluidized bed 31 in the reaction component 30, the discharge port of the gas-solid separator 51 is connected to the collection component 60, the gas outlet of the gas-solid separator 51 is facing the air, and the gas-solid separator 51 is connected to the vacuum pump 52.

[0062] In an embodiment of the present application, the vacuum pump 52 can form a vacuum inside the gas-solid separator 51, and the reacted gas and product are separated by the gas-solid separator 51. The solid product enters the collection component 60 through the discharge port of the gas-solid separator 51, and the gaseous unreacted gas is discharged through the outlet port of the gas-solid separator 51.

[0063] Exemplarily, the output component 50 further includes: a discharge lock 53 , and the discharge lock 53 is arranged at the feed inlet of the gas-solid separator 51 .

[0064] In the embodiment of the present application, the discharge lock 53 is used to open or disconnect the communication between the gas-solid separator 51 and the fluidized bed 31 .

[0065] Exemplarily, the collecting component 60 includes: a collecting bin 61 , and the collecting bin 61 is connected to the discharge port of the gas-solid separator 51 in the output component 50 .

[0066] In the embodiment of the present application, the solid product enters the collection bin 61 through the discharge port of the gas-solid separator 51 for collection.

[0067] In the embodiment of the present application, the powder particles to be coated are added from the inlet 34 to the storage bin 33 for storage. The storage bin 33 contains a heater, which is set to the corresponding heating temperature. The powder sample is left to stand for a period of time so that the powder sample reaches the temperature. At the same time, the heating plate 41 inside the fluidized bed 31 is also set to the corresponding temperature. A gas distribution plate 32 of suitable size is selected and installed above the storage bin 33. After the coating starts, the flow rate of the nitrogen introduced is controlled by the first regulating valve 13 and the second regulating valve 23 connected to the storage bin 33. After the particles are blown into the cavity of the fluidized bed 31, the manual valves of the first precursor source bottle 12 and the second precursor source bottle 22 are opened, and then the precursor sources in the precursor source are brought into the cavity of the fluidized bed 31 by nitrogen in turn to start coating. During the reaction, the discharge lock 53 at the lower end of the gas-solid separator 51 is in a locked state to prevent the solid particles that have not been plated from entering the gas-solid separator 51. When the particles have completed the corresponding number of ALD cycles, the discharge lock 53 of the gas-solid separator 51 is opened, the manual valves of the first precursor source bottle 12 and the second precursor source bottle 22 are closed, and nitrogen continues to be introduced into the fluidized bed 31 cavity to accelerate the solid particles to enter the gas-solid separator 51. After passing through the gas-solid separator 51, the coated particles are separated into the collection bin 61, and the excess gas is discharged. The connection between the storage bin 33 and the fluidized bed 31 can be disassembled to facilitate the installation of gas distribution plates 32 of different sizes.

[0068] The creativity of the powder atomic layer deposition device provided in this application is not only reflected in the ingenious design of the overall architecture, but also in the meticulous optimization and functional coordination of each component. The following is an in-depth analysis of its creativity:

[0069] 1. Innovative design of gas input components

[0070] Integration of precursor source bottle and pipeline: The first gas input assembly 10 and the second gas input assembly 20 both cleverly combine the precursor source bottle (12, 22) and the pipeline (11, 21), realizing the stable delivery of the precursor gas. This design not only simplifies the equipment structure, but also improves the utilization efficiency of the precursor gas. Introduction of regulating valve: The setting of the first regulating valve 13 and the second regulating valve 23 enables the gas flow to be precisely controlled, thereby ensuring the stability and repeatability of the reaction process.

[0071] 2. Innovation of React Components

[0072] Combination of fluidized bed and gas distribution plate: The ingenious combination of fluidized bed 31 and gas distribution plate 32 in reaction assembly 30 realizes uniform distribution and efficient reaction of powder particles in the reaction space. Gas distribution plate 32 can balance and stabilize the flow rate of fluid and prevent chaotic fluid from impacting powder, thereby improving reaction efficiency and coating quality. Design of storage bin: The setting of storage bin 33 is not only convenient for the storage and preheating of powder particles, but also connected to fluidized bed 31 through inlet 34 below it, realizing continuous transportation and reaction of powder particles.

[0073] 3. Efficient use of heating components

[0074] Clever arrangement of heating plates: The heating plates 41 in the heating assembly 40 are arranged on the inner wall of the fluidized bed 31, and can generate heat in the surrounding space to uniformly heat the fluid and powder particles, thereby accelerating the reaction process.

[0075] 4. Intelligent design of output components

[0076] Collaboration between gas-solid separator and vacuum pump: The coordinated work of gas-solid separator 51 and vacuum pump 52 in output component 50 realizes the effective separation of gas and product after reaction. Gas-solid separator 51 can separate solid product, while vacuum pump 52 can form a vacuum environment to accelerate the discharge of gas. Introduction of discharge lock: The setting of discharge lock 53 ensures the stability during coating process. During coating process, discharge lock 53 is in a locked state to prevent uncoated solid particles from entering gas-solid separator 51. When coating is completed, discharge lock 53 is opened to allow the coated particles to enter collection component 60.

[0077] 5. Collection Components Practicality

[0078] Convenient collection in the collection bin: The collection bin 61 in the collection assembly 60 is connected to the discharge port of the gas-solid separator 51, so that the coated particles can be conveniently collected. This design not only improves the collection efficiency, but also avoids waste and pollution of the product.

[0079] 6. Automation and intelligence of the overall process

[0080] Potential automatic control: Although not explicitly shown in the figure, the device structure of the present invention provides a wide space for automatic control. By introducing intelligent components such as sensors and controllers, real-time monitoring and precise control of the working status of the device can be achieved, thereby further improving the production efficiency and product quality of the device.

[0081] In summary, the powder atomic layer deposition equipment provided in this application has demonstrated remarkable creativity in various links such as gas input, reaction, heating, output and collection. This equipment not only improves the efficiency and quality of the coating process, but also expands the application field of atomic layer deposition technology, and has broad market prospects and practical value. At the same time, its modular, integrated and intelligent design concept also provides unlimited possibilities for future equipment upgrades and expansions. A powder atomic layer deposition equipment provided in this application allows the powder sample to be fluidized under the action of airflow, promotes the opening of gaps between particles, allows the precursor source to fully contact each particle, ensures the uniformity of the package, and avoids uneven coating thickness.

[0082] It should be noted that, in the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0083] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0084] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0085] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0086] The foregoing is merely a specific embodiment of the present invention, which enables those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A powder atomic layer deposition device, characterized in that: include: A first gas input component, used for inputting a first reaction gas; A second gas input component, used for inputting a second reaction gas; A reaction component, used for providing a reaction space; the reaction component is connected to the first gas input component and the second gas input component respectively; A heating component, used for heating the reaction material inside the reaction component; the heating component is arranged in the reaction component; An output component, used to output the reaction substances in the reaction component; the output component is connected to the reaction component; The collecting component is used to collect the product; the collecting component is connected to the output component.

2. The powder atomic layer deposition device according to claim 1, characterized in that: The first gas input component includes: a first pipeline and a first precursor source bottle, wherein the gas outlet of the first pipeline is connected to the reaction component, and the first precursor source bottle is connected to the first pipeline.

3. The powder atomic layer deposition device according to claim 2, characterized in that: The first gas input component further includes: a first regulating valve, and the first regulating valve is arranged on the first pipeline.

4. The powder atomic layer deposition device according to claim 1, characterized in that: The second gas input component includes: a second pipeline and a second precursor source bottle, wherein the gas outlet of the second pipeline is connected to the reaction component, and the second precursor source bottle is connected to the second pipeline.

5. The powder atomic layer deposition device according to claim 4, characterized in that: The second gas input component further includes: a second regulating valve, and the second regulating valve is arranged on the second pipeline.

6. The powder atomic layer deposition device according to claim 1, characterized in that: The reaction component includes: a fluidized bed and a gas distribution plate, the bottom end of the fluidized bed is respectively connected to the gas outlet of the first pipeline in the first gas input component and the gas outlet of the second pipeline in the second gas input component, the top of the fluidized bed is connected to the feed port of the gas-solid separator in the output component, a storage bin is formed inside the bottom end of the fluidized bed, the gas distribution plate is arranged inside the fluidized bed and is higher than the storage bin, and an inlet is arranged on the bottom side wall of the fluidized bed, the inlet is connected to the storage bin and is lower than the gas distribution plate.

7. The powder atomic layer deposition device according to claim 1, characterized in that: The heating component comprises a heating plate, and the heating plate is arranged on the inner side wall of the fluidized bed in the reaction component.

8. The powder atomic layer deposition device according to claim 1, characterized in that: The output component includes: a gas-solid separator and a vacuum pump, wherein the feed port of the gas-solid separator is connected to the fluidized bed in the reaction component, the discharge port of the gas-solid separator is connected to the collection component, the gas outlet of the gas-solid separator is facing the air, and the gas-solid separator is connected to the vacuum pump.

9. The powder atomic layer deposition device according to claim 8, characterized in that: The output component further includes: a discharge lock, which is arranged at the feed inlet of the gas-solid separator.

10. The powder atomic layer deposition device according to claim 1, characterized in that: The collecting component comprises: a collecting bin, and the collecting bin is connected to the discharge port of the gas-solid separator in the output component.

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