Novel silicon wafer electroplating device
By designing a new silicon wafer electroplating device including cover plate components, product stages and elastic floating contact cathode parts, the problems of high product crushing rate and uneven conductivity during silicon wafer electroplating are solved, and the effect of improving the pass rate and efficiency of silicon wafer electroplating is achieved.
Patent Information
- Application Number
- CN202411835687.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-03-28
AI Technical Summary
During the existing silicon wafer electroplating process, the silicon wafer product is horizontally driven in the plating tank, which increases the probability of product breaking and leads to a low pass rate; the hard contact between the cathode and the product is unadjusted, which increases the risk of fragmentation; the poor connection position between the cathode and the product leads to uneven conductivity, affecting the plating quality and efficiency.
A new type of silicon wafer electroplating device is designed, including anode plate, cathode piece, conductive screw, cover plate assembly, product stage, circulating liquid tank and rotating assembly. The device fixes the silicon wafer through the compression mechanism of the cover plate assembly, the cathode part adopts elastic floating contact, and the product platform is equipped with limited bevel angles and grooves to ensure the stable position and effective contact of the silicon wafer.
Through the design of fixing silicon wafers and elastic floating contact, the probability of product breakage is reduced and the pass rate is improved; the elastic contact of the cathode parts adjusts the contact pressure, reduces the risk of fragmentation, and improves the plating efficiency; the limit angle and groove of the product platform ensure uniform conductivity and improves the plating quality.
Smart Images
Figure CN119710871A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of silicon wafer electroplating, and in particular to a novel silicon wafer electroplating device. Background Art
[0002] Silicon wafers are an important component in photovoltaic products. Photovoltaic silicon wafers require surface electroplating. In the current silicon wafer electroplating process, the silicon wafer products are horizontally transmitted in the electroplating tank and a closed loop is formed when power is turned on. The defects are: first, since the silicon wafer products are always moving, the probability of product breakage increases, resulting in a low product qualification rate; second, since the contact between the silicon wafer products and the cathode is hard contact and cannot be adjusted, the probability of product fragmentation is further increased; third, the connection position between the cathode and the product is poor, and there is uneven conductivity, which affects the product electroplating quality and efficiency. Summary of the invention
[0003] In order to solve one or more of the above problems, the present invention provides a novel silicon wafer electroplating device.
[0004] According to one aspect of the present invention, the novel silicon wafer electroplating device comprises: an anode plate, a plurality of cathode components, a plurality of conductive screws, a cover plate assembly all made of insulating materials, a product carrier, a circulating liquid tank, and a rotating assembly;
[0005] The cover body of the cover plate assembly is fixedly connected to the rotating shaft through an upper connecting arm, the upper wall of the liquid distribution cavity of the cover body is provided with a liquid inlet hole and the lower wall is provided with a liquid separation hole, and the upper end of the liquid inlet hole is fixedly connected to the liquid inlet pipe;
[0006] The product carrier is fixed in the inner cavity of the circulating liquid tank. The loading groove of the product carrier is provided with limit angles around it. The lower end of the product carrier is provided with a guide channel connecting the collecting groove and the inner cavity of the circulating liquid tank.
[0007] A protruding overflow pipe is provided on one side of the open cavity of the circulating liquid tank, and the liquid collecting tank on its lower wall is located below the product carrier, and the lower end of the liquid discharge hole in the center of the liquid collecting tank is fixedly connected to the liquid discharge pipe;
[0008] The rotating shaft of the rotating assembly is hinged to one end of the circulating fluid tank;
[0009] The anode plate is located below the first protrusions of the four rectangular arrays of the cover body and is fixedly connected by four conductive screws, and the upper ends of the conductive screws are electrically connected to the anode wires;
[0010] A plurality of cathode components are elastically and floatingly connected to both sides of the lower surface of the cover body, the upper ends of the cathode components are electrically connected to the cathode wires and the contact ends of the lower ends are located below both sides of the anode plate;
[0011] The shaft rotates to open the cover assembly and place the product in the loading trough; the shaft rotates to close the cover assembly, the anode plate is located above the product and the cathode piece elastically contacts both sides of the product, the two are energized to form a circuit and electroplating occurs on the surface of the product.
[0012] In some embodiments, the upper end of the cylindrical boss of the cathode component is an upper guide column with a small diameter and the lower end is an inverted cone-shaped contact end, and the upper end of the upper guide column passes through the lower cover of the cover body and is threadedly connected to a limit nut; the spring sleeve is arranged outside the upper guide column, and its upper end fits the lower cover and the lower end fits the boss.
[0013] In some embodiments, a plurality of second bosses are symmetrically connected to both sides of the lower end of the cover body, the second bosses are longer than the first bosses, the second bosses and the bosses are slidably matched with equal diameters, and the spring is located in the shaft hole of the second boss.
[0014] In some embodiments, the cover body includes an upper cover and a lower cover, and four conductive screws pass through the first through hole of the anode plate, the shaft hole of the first boss, the third through hole of the lower cover, and the second through hole of the upper cover to connect with the fixing nut;
[0015] Or the third through hole is a countersunk hole, and the conductive screw is a countersunk screw.
[0016] In some embodiments, both ends of the lower cover protrude from the upper cover to form wing plates, and the lower ends of the wing plates are integrally connected to the second protruding pillars.
[0017] A plurality of cathode components are symmetrically and vertically elastically floatingly connected to the lower surface of the wing plate of the lower cover.
[0018] In some embodiments, the liquid dispensing cavity is a plurality of oblong hole grooves in a circumferential array, and the lower ends of the oblong hole grooves are open;
[0019] Or a plurality of radial grooves in a circumferential array are provided between the central groove and the annular groove of the liquid collecting tank.
[0020] In some embodiments, the overflow pipe is vertically height-adjustable and threadedly connected to one side of the inner cavity of the circulating liquid tank.
[0021] In some embodiments, two ear plates are symmetrically arranged on the side plates at both ends of the circulating liquid tank, and the two ends of the rotating shaft are rotatably connected to the ear plates, and one end thereof extends outward to connect to the driving power;
[0022] Or the two ends of the rotating shaft are rotatably connected to the ear plates through oil-free bearings or deep groove ball bearings.
[0023] In some embodiments, a protruding rectangular end foot is provided in the middle of the lower end of the four side surfaces of the product carrier, and rectangular inlets of the guide channel are provided on both sides.
[0024] In some embodiments, the insulating material of the cover assembly, the product carrier, the circulating liquid tank, and the rotating assembly is PP polypropylene synthetic plastic.
[0025] The beneficial effects of the novel silicon wafer electroplating device are as follows: first, during electroplating, due to the upward pressure of the cover plate assembly, the product will not float up after being immersed. During the product electroplating process, it is fixed in the product carrier. The silicon wafer product of this structure is fixed and does not need to be moved, which reduces the probability of product breakage and effectively improves the product qualification rate; second, the silicon wafer product and the cathode part are in elastic floating contact. When the cover plate assembly is pressed down, the cathode part in elastic floating contact can float vertically, and the pressure on the contact surface can be adjusted to reduce the reaction force of the product, reduce the risk of fragments, and improve the efficiency of electroplating; third, the product carrier is provided with a groove, and a limit angle is set at the same time to prevent the product from sliding forward, backward, left and right, effectively ensuring the position of the product and the effective contact between the two. At the same time, the cathode parts symmetrically arranged on both sides effectively ensure the contact reliability between the two, ensure uniform conductivity, and improve the electroplating quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 A three-dimensional schematic diagram of a novel silicon wafer electroplating device according to one embodiment of the present invention;
[0027] Figure 2 for Figure 1 A three-dimensional exploded schematic diagram of the novel silicon wafer electroplating device shown;
[0028] Figure 3 for Figure 1 A three-dimensional schematic diagram of the lower cover shown;
[0029] Figure 4 for Figure 1 A three-dimensional schematic diagram of the upper cover shown;
[0030] Figure 5 for Figure 1 A partial cross-sectional schematic diagram of the cover plate assembly shown;
[0031] Cover plate assembly 1, cover body 10, liquid distribution cavity 100, liquid inlet hole 101, liquid separation hole 102, upper cover 103, lower cover 104, oblong hole groove 105, liquid inlet pipe 11, upper connecting arm 12, first convex column 13, second convex column 14, spring 15;
[0032] Product carrier 2, material loading slot 20, limiting angle 21, flow guide channel 22, rectangular end foot 23, rectangular hole 24;
[0033] Circulating liquid tank 3, liquid collecting tank 30, central groove 300, liquid drain hole 301, annular groove 302, radial groove 303, overflow pipe 31, liquid drain pipe 32, ear plate 33;
[0034] Rotating assembly 4, rotating shaft 40, anti-rotation section 401, retaining spring 41;
[0035] Anode plate 5;
[0036] Cathode member 6, boss 61, contact end 62, upper guide pin 63, limiting nut 64;
[0037] Conductive screw 7, fixing nut 71;
[0038] Anode line 8; cathode line 9. DETAILED DESCRIPTION
[0039] The present invention will be further described in detail below with reference to the accompanying drawings. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.
[0040] Figures 1 to 5 A novel silicon wafer electroplating device according to an embodiment of the present invention is schematically shown. As shown in the figure, the novel silicon wafer electroplating device comprises: an anode plate 5, a plurality of cathode components 6, a plurality of conductive screws 7, and a cover plate assembly 1, a product carrier 2, a circulating liquid tank 3, and a rotating assembly 4, all of which are made of insulating materials; the insulating materials of the cover plate assembly 1, the product carrier 2, the circulating liquid tank 3, and the rotating assembly 4 are preferably PP polypropylene synthetic plastic.
[0041] The cover body 10 of the cover plate assembly 1 is fixedly connected to the rotating shaft 40 through the upper connecting arm 12. The upper wall of the liquid distribution cavity 100 of the cover body 10 is provided with a liquid inlet hole 101 and the lower wall is provided with a liquid separation hole 102. The upper end of the liquid inlet hole 101 is fixedly connected to the liquid inlet pipe 11. The electroplating liquid flows into the circulating liquid tank 3 from the liquid inlet pipe 11, the liquid inlet hole 101, the liquid distribution cavity 100, and the liquid separation hole 102.
[0042] The product carrier 2 is fixed in the inner cavity of the circulating liquid tank 3, and the loading groove 20 of the product carrier 2 is provided with a limiting angle 21 around it, and the lower end of the product carrier 2 is provided with a guide channel 22 connecting the collecting tank 30 and the inner cavity of the circulating liquid tank 3. The size of the loading groove 20 of the product carrier 2 and the contour of the product and the cover 10 are preferably matched with clearance.
[0043] A protruding overflow pipe 31 is provided on one side of the open cavity of the circulating liquid tank 3, and the collecting tank 30 on the lower wall thereof is located below the product carrier 2. The lower end of the drainage hole 301 in the center of the collecting tank 30 is fixedly connected to the drainage pipe 32, and the electroplating liquid is discharged through the guide channel 22, the collecting tank 30, and the drainage hole 301. The diameter of the overflow pipe 31 is preferably larger than the diameter of the drainage pipe 32 to ensure that the electroplating liquid in the circulating liquid tank 3 is at a set height. Preferably, the overflow pipe 31 is vertically height-adjustable and threadedly connected to one side of the inner cavity of the circulating liquid tank 3 to ensure that its set height can be quickly adjusted according to process requirements.
[0044] The rotating shaft 40 of the rotating assembly 4 is hinged to one end of the circulating liquid tank 3;
[0045] The anode plate 5 is located below the first protrusions 13 of the four rectangular arrays of the cover body 10 and is fixedly connected by four conductive screws 7, and the upper ends of the conductive screws 7 are electrically connected to the anode wires 8;
[0046] A plurality of cathode components 6 are elastically and floatingly connected to both sides of the lower surface of the cover body 10, the upper end of the cathode component 6 is electrically connected to the cathode line 9 and the contact end 62 of the lower end is located below both sides of the anode plate 5; preferably, there are 8 cathode components 6, 4 on each side.
[0047] The shaft 40 rotates to open the cover assembly 1 and place the product in the loading trough 30; the shaft 40 rotates to close the cover assembly 1, the anode plate 5 is located above the product and the cathode member 6 elastically contacts both sides of the product, and the two are energized to form a circuit and generate electroplating on the surface of the product.
[0048] The product is directly placed in the product platform through an automatic loading machine. After the product is placed in the product platform 2, the cover assembly 1 is closed, the cathode component 6 is pressed on the product, and then the electroplating liquid enters the product platform 2 from the liquid inlet pipe 11 of the cover assembly 1, and then forms an immersion area in the circulating liquid tank 3. When the immersion height completely immerses the anode plate 5 and the cathode component 6, the anode and cathode wires are connected to form a loop, and electroplating occurs on the surface of the product.
[0049] The beneficial effects of the novel silicon wafer electroplating device are as follows: first, during electroplating, due to the upward pressure of the cover plate assembly 1, the product will not float up after being immersed, and during the product electroplating process, it is fixed in the product carrier 2. The silicon wafer product of this structure is fixed and does not need to be moved, which reduces the probability of product breakage and effectively improves the product qualification rate; second, the silicon wafer product and the cathode component are in elastic floating contact. When the cover plate assembly 1 is pressed down, the cathode component 6 in elastic floating contact can float vertically, and the pressure of the contact surface can be adjusted to reduce the reaction force of the product, reduce the risk of fragments, and improve the efficiency of electroplating; third, the product carrier 2 is provided with a groove, and a limit bevel 21 is set at the same time to prevent the product from sliding forward, backward, left and right, effectively ensuring the position of the product and the effective contact between the two. At the same time, the cathode components 6 symmetrically arranged on both sides effectively ensure the contact reliability between the two, ensure uniform conductivity, and improve the electroplating quality and efficiency.
[0050] Further, the cathode member 6 comprises a cylindrical boss 61, the upper end of the boss 61 is an upper guide column 63 with a small diameter and the lower end is an inverted cone-shaped contact end 62, the upper end of the upper guide column 63 passes through the through holes on both sides of the lower cover 104 of the cover body 10 and is threadedly connected to the limit nut 64; the spring 15 is sleeved outside the upper guide column 63, the upper end of which fits the lower cover 104 and the lower end fits the boss 61. The beneficial effects are: the spring 15 has good compression and recovery capabilities, the sliding guide performance of the upper guide column 63 and the boss 61 further effectively guarantees the accuracy of vertical floating, well adjusts the pressure of the contact surface, reduces the reaction force of the product, reduces the risk of fragments, and improves the efficiency of electroplating.
[0051] Preferably, a plurality of vertical second protrusions 14 are symmetrically connected to both sides of the lower end of the cover body 10, the second protrusions 14 are longer than the first protrusions 13, the second protrusions 14 and the bosses 61 are slidably matched with equal diameters, and the spring 15 is located in the axial hole of the second protrusion 14. The beneficial effect is that the arrangement protects the spring 15, and at the same time effectively realizes the arrangement of the cathode member 6 being higher than the anode plate 5, thereby realizing a good electroplating circuit.
[0052] Furthermore, the cover body 10 includes an upper cover 103 and a lower cover 104. Four conductive screws 7 pass through the first through hole of the anode plate 5, the axial hole of the first boss 13, the third through hole of the lower cover 104, and the second through hole of the upper cover 103 to connect the fixing nut 71, so as to fix the anode plate 5, the lower cover 104, and the upper cover 103 together; preferably, the third through hole is a countersunk hole, and the conductive screw 7 is a countersunk screw; the beneficial effect is that the structure of the arrangement is compact and the overall size is small.
[0053] Preferably, the lower cover 104 has the same width as the upper cover 103 and a length greater than that of the upper cover 103. The lower cover 104 protrudes from both sides of the upper cover 103 to form a wing plate, and the lower end of the wing plate is integrally connected to the second protruding column 14.
[0054] Several cathode members 6 are symmetrically and vertically elastically connected to the lower surface of the wing plate of the lower cover 104, and a spring 15 is arranged between the lower end of the cathode member 6 and the wing plate. The beneficial effect is that this arrangement further reduces the volume of the device and effectively realizes the elastic floating effect.
[0055] Furthermore, the liquid distribution cavity 100 is a plurality of oblong hole grooves 105 in a circumferential array, and the lower ends of the oblong hole grooves 105 are open; the beneficial effect is that this arrangement ensures the uniformity of the liquid spray.
[0056] The liquid collecting tank 30 comprises a central groove 300 and an annular groove 302, and a plurality of radial grooves 303 in a circumferential array are arranged between the central groove 300 and the annular groove 302. The beneficial effect is that the arrangement effectively ensures that the electroplating liquid is discharged quickly.
[0057] Furthermore, two ear plates 33 are symmetrically provided on the side plates at both ends of the circulating liquid tank 3, and the ear plates 33 are rotatably connected to the two ends of the rotating shaft 40, and one end thereof extends outward to connect the driving power; the driving power is preferably a transmission wheel driven by a direct-connected servo servo motor or a servo motor; its beneficial effect is: this setting is beneficial to automatic control, the overall intermediate process is small, and it is also beneficial to control the position accuracy of the downward pressure.
[0058] Preferably, both ends of the rotating shaft 40 are rotatably connected to the ear plate 33 through oil-free bearings or deep groove ball bearings, and a retaining spring 41 is provided on the outer side of the bearing. The beneficial effect is that this arrangement further ensures the softness of rotation and reduces friction resistance.
[0059] Preferably, one end of the two upper connecting arms 12 is symmetrically fixedly connected to the upper cover 103 and the other end is provided with an arc groove matching the rotating shaft 40, and the rotating shaft 40 is provided with an anti-rotation section 401. The beneficial effect is that this arrangement effectively ensures the convenience of installation and the position accuracy.
[0060] The liquid inlet pipe 11 is located between the two upper connecting arms 12 .
[0061] Furthermore, a protruding rectangular end foot 23 is provided in the middle of the lower end of the four side surfaces of the product carrier 2, and both sides of the rectangular end foot 23 are rectangular inlets of the guide channel 22;
[0062] Four rectangular holes 24 are arranged in a rectangular array in the middle of the product carrier 2. The beneficial effect is that the arrangement ensures that the electroplating solution is discharged quickly without clogging or accumulation.
[0063] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A novel silicon wafer electroplating device, characterized in that: It comprises: an anode plate (5), a plurality of cathode components (6), a plurality of conductive screws (7), a cover plate assembly (1) all made of insulating materials, a product carrier (2), a circulating liquid tank (3), and a rotating assembly (4); The cover body (10) of the cover plate assembly (1) is fixedly connected to the rotating shaft (40) via an upper connecting arm (12); the upper wall of the liquid distribution cavity (100) of the cover body (10) is provided with a liquid inlet hole (101) and the lower wall is provided with a liquid separation hole (102); the upper end of the liquid inlet hole (101) is fixedly connected to the liquid inlet pipe (11); The product carrier (2) is fixed in the inner cavity of the circulating liquid tank (3), the material loading groove (20) of the product carrier (2) is provided with a limiting angle (21) around it, and the lower end of the product carrier (2) is provided with a guide channel (22) connecting the liquid collecting groove (30) and the inner cavity of the circulating liquid tank (3); A protruding overflow pipe (31) is provided on one side of the open cavity of the circulating liquid box (3), and a liquid collecting tank (30) on the lower wall thereof is located below the product carrier (2), and a liquid discharge hole (301) in the center of the liquid collecting tank (30) is fixedly connected to a liquid discharge pipe (32) at the lower end; The rotating shaft (40) of the rotating assembly (4) is hinged to one end of the circulating liquid tank (3); The anode plate (5) is located below the first protrusions (13) of the four rectangular arrays of the cover body (10) and is fixedly connected via four conductive screws (7), wherein the upper ends of the conductive screws (7) are electrically connected to the anode wires (8); A plurality of cathode components (6) are elastically and floatingly connected to both sides of the lower surface of the cover body (10), the upper end of the cathode component (6) is electrically connected to the cathode line (9) and the contact end (62) of the lower end is located below both sides of the anode plate (5); The rotating shaft (40) rotates to open the cover assembly (1) and place the product in the loading trough (30); the rotating shaft (40) rotates to close the cover assembly (1), the anode plate (5) is located above the product and the cathode member (6) elastically contacts both sides of the product, and the two are energized to form a circuit and generate electroplating on the surface of the product.
2. The novel silicon wafer electroplating device according to claim 1 is characterized in that: The upper end of the cylindrical boss (61) of the cathode component (6) is an upper guide column (63) with a small diameter and the lower end is an inverted cone-shaped contact end (62); the upper end of the upper guide column (63) passes through the lower cover (104) of the cover body (10) and is threadedly connected to a limit nut (64); the spring (15) is sleeved outside the upper guide column (63), with its upper end abutting against the lower cover (104) and its lower end abutting against the boss (61).
3. The novel silicon wafer electroplating device according to claim 2 is characterized in that: A plurality of second protrusions (14) are symmetrically connected to both sides of the lower end of the cover body (10); the second protrusions (14) are longer than the first protrusions (13); the second protrusions (14) and the bosses (61) are slidably matched with equal diameters; and the spring (15) is located in the shaft hole of the second protrusion (14).
4. The novel silicon wafer electroplating device according to claim 1 is characterized in that: The cover body (10) comprises an upper cover (103) and a lower cover (104); four conductive screws (7) pass through a first through hole of the anode plate (5), an axial hole of the first convex column (13), a third through hole of the lower cover (104), and a second through hole of the upper cover (103) to connect to a fixing nut (71); Or the third through hole is a countersunk hole, and the conductive screw (7) is a countersunk screw.
5. The novel silicon wafer electroplating device according to claim 4 is characterized in that: The lower cover (104) protrudes from the upper cover (103) at both ends of its length to form a wing plate, and the lower end of the wing plate is integrally connected to the second protruding column (14). A plurality of cathode components (6) are symmetrically and vertically elastically floatingly connected to the lower surface of the wing plate of the lower cover (104).
6. The novel silicon wafer electroplating device according to claim 4 is characterized in that: The liquid dispensing cavity (100) is a plurality of oblong hole grooves (105) arranged in a circumferential array, and the lower ends of the oblong hole grooves (105) are open; A plurality of radial grooves (303) in a circumferential array are provided between the central groove (300) and the annular groove (302) of the liquid collecting groove (30).
7. The novel silicon wafer electroplating device according to claim 6 is characterized in that: The overflow pipe (31) is vertically height-adjustable and is threadedly connected to one side of the inner cavity of the circulating liquid tank (3).
8. The novel silicon wafer electroplating device according to claim 1 is characterized in that: Two ear plates (33) are symmetrically arranged on the side plates at both ends of the circulating liquid tank (3); the two ends of the rotating shaft (40) are rotatably connected to the ear plates (33), and one end thereof extends outwardly to connect to the driving power; Or the two ends of the rotating shaft (40) are rotatably connected to the ear plates (33) via oil-free bearings or deep groove ball bearings.
9. The novel silicon wafer electroplating device according to claim 1 is characterized in that: A protruding rectangular end foot (23) is provided in the middle of the lower ends of the four side surfaces of the product carrier (2), and rectangular inlets of the guide channel (22) are provided on both sides.
10. The novel silicon wafer electroplating device according to any one of claims 1 to 9, characterized in that: The insulating material of the cover plate assembly (1), the product carrier (2), the circulating liquid tank (3) and the rotating assembly (4) is PP polypropylene synthetic plastic.