Equipment for detecting deformation quantity of nickel-titanium alloy gasket at different temperatures

Abstract

The invention discloses deformation quantity detection equipment for nickel-titanium alloy gaskets at different temperatures, and relates to the field of gasket detection.The deformation quantity detection equipment comprises an operation base, a supporting frame and a machining table are installed at the top end of the operation base, and a torsion motor is installed at the top end of the supporting frame; the output end of the torsion motor faces downwards and is connected with an extrusion air cylinder, the extrusion air cylinder is located over the machining table, a torsion table is installed at the top end of the machining table, and a plurality of limiting mechanisms are evenly distributed on the portion, located at the top end of the machining table, of the outer side of the torsion table. Through the arrangement of the machining table, the torsion motor, the extrusion air cylinder, the limiting mechanism, the torsion table and the positioning mechanism, when a gasket is machined, the positioning mechanism drives the limiting mechanism to move, the limiting mechanism positions and clamps the gasket, the gasket can be conveniently aligned with all sets of equipment, then the extrusion air cylinder is started to drive a pressing plate to move downwards, and therefore the gasket is machined. And the gasket is clamped between the fixed plate and the torsion table.

Description

Technical Field

[0001] The invention relates to the field of gasket detection, in particular to a deformation amount detection device of a nickel-titanium alloy gasket at different temperatures. Background Art

[0002] Nitinol gasket is an alloy material composed of nickel and titanium, usually called "memory alloy" or "shape memory alloy", which has unique properties. It can restore its original shape under certain temperature changes, so it is widely used in equipment that requires temperature response or shape recovery. In the gasket production process, the gasket deformation needs to be measured. The existing measurement usually uses a variety of equipment such as stretching, extrusion, and bending. Especially for Nitinol gaskets, due to their special physical properties, the temperature needs to be adjusted during the detection process, and the deformation degree of Nitinol alloy needs to be detected at different temperatures.

[0003] Prior art such as China Publication No. CN219694721U discloses a torque testing machine for a DNC friction pad, comprising a casing, a motor installed inside the casing, a support rod installed on the upper surface of the casing, a bracket installed on the upper end of the support rod, limiting grooves are provided on both sides of the middle of the bracket, a fixing valve for fixing to the support rod is installed on one side of the bracket, a fixing rod is installed in the middle of the bracket, a fixing plate is installed inside the fixing rod, and a group of fixing components are arranged below the fixing plate.

[0004] During use, the gasket is not treated by temperature changes, so the changes of the gasket at different temperatures cannot be detected. Moreover, in the prior art, the gasket is usually treated only by heating, but the use environment of the gasket usually also includes a low temperature environment, so the detection range of the prior art is relatively small. Secondly, in the process of detecting the gasket, the gasket is detected by torsional friction. At this time, the gasket is fixed by a clamping mechanism at the edge, but in a normal use environment, the fixing force on the gasket is fixed by the friction force of the fit with the external components. Therefore, during the torsion process, clamping the gasket from the edge will interfere with the detection effect of the gasket. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a deformation amount detection device for nickel-titanium alloy gaskets at different temperatures to solve the technical problems that the prior art cannot perform different temperature treatments on the gaskets and the clamping device causes interference to the gaskets during detection.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a deformation amount detection device of a nickel-titanium alloy gasket at different temperatures, comprising an operating base, a support frame and a processing table are installed on the top of the operating base, a torsion motor is installed on the top of the support frame, the output end of the torsion motor faces downward and the output end of the torsion motor is connected to an extrusion cylinder, and the extrusion cylinder is located directly above the processing table, a torsion table is installed on the top of the processing table, the outer side of the torsion table is located at the top of the processing table and multiple groups of limit mechanisms are evenly distributed, a top plate is installed inside the torsion table, and multiple groups of grooves running through the top plate are provided on the top of the top plate, and the top plate Semiconductor cooling sheets are rotatably connected in multiple groups of grooves. The operating base is located below the processing table and is equipped with an adjusting cylinder. The output end of the adjusting cylinder is connected to a driving disk. The top of the driving disk is connected to a movable disk. The bottom end of the movable disk is connected to a supporting column. The movable disk is fixedly connected to the driving disk through the supporting column. Multiple groups of heat exchangers are installed on the top of the movable disk, and each group of heat exchangers is aligned with the bottom of the semiconductor cooling sheet. The top plate is located on the side of each group of semiconductor cooling sheets and is connected to a power supply structure. The power supply structure supplies power to the semiconductor cooling sheets. The outer side of the processing table is connected to a ventilation mechanism, and the ventilation mechanism is connected to the heat exchanger.

[0007] By adopting the above technical solution, the gasket can be conveniently positioned, and after positioning, the temperature of the gasket can be adjusted by a semiconductor refrigeration sheet, so that the gasket can be conveniently treated at different temperatures.

[0008] The present invention is further configured such that a support plate is provided on the outer side of the processing table, the support plate supports the processing table, and the ventilation mechanism is installed on the outer wall of the support plate.

[0009] As a preferred embodiment, the ventilation mechanism can facilitate gas exchange with the outside air.

[0010] The present invention is further configured such that the output end of the extrusion cylinder is connected to a pressure plate, and the bottom end of the pressure plate is connected to a fixed plate, and a temperature sensor is installed on the top of the fixed plate, the detection end of the temperature sensor extends to the bottom of the fixed plate, and the fixed plate is aligned with the top of the torsion table.

[0011] As a preferred embodiment, the gasket is conveniently clamped, and after clamping, the temperature of the gasket is detected by a temperature sensor.

[0012] The present invention is further configured such that the ventilation mechanism includes a first ventilator and a second ventilator, the end of the first ventilator is connected to a first pipe, the end of the second ventilator is connected to a second pipe, the first ventilator and the second ventilator are connected to the heat exchanger through the first pipe, the second pipe and the heat exchanger, shielding nets are installed at the ends of the first ventilator and the second ventilator, ventilation components are installed inside the first ventilator and the second ventilator, and the ventilation components are composed of a motor and fan blades.

[0013] Preferably, the conveying direction of the ventilator can be adjusted according to demand, so as to facilitate the airflow to enter the heat exchanger from different directions, so that the airflow can lift the adjustment plate in different directions.

[0014] The present invention is further configured such that a side pressure sensing mechanism is installed on the side of the limiting mechanism, and an extrusion block is installed on the side of the side pressure sensing mechanism, the side pressure sensing mechanism is fitted with the edge of the gasket through the extrusion block, the interior of the limiting mechanism is hollow, the side pressure sensing mechanism is installed in the hollow interior of the limiting mechanism, two sets of outer shells are installed on the outside of the limiting mechanism, and a positioning rod is installed inside the outer shell, and the outer shell is fixed by the positioning rod.

[0015] Preferably, the position of the gasket can be adjusted conveniently, so as to facilitate the alignment of the gasket.

[0016] The present invention is further configured as follows: the positioning mechanism includes an adjusting cylinder, a fixing rod and a base plate, the fixing rod is fixed to the output end of the adjusting cylinder, the limiting mechanism is sleeved on the top end of the fixing rod, the limiting mechanism is movably connected to the fixing rod through a reset spring, the top end of the base plate is connected to an output wire, the output wire is connected to the side pressure sensing mechanism, and the bottom end of the base plate is connected to multiple groups of reinforcing ribs.

[0017] Preferably, the position of the limiting mechanism can be adjusted by a positioning mechanism to facilitate clamping of the gasket.

[0018] The present invention is further configured such that the top plate is provided with grooves on the side surfaces of each group of semiconductor refrigeration sheets, a flexible power transmission sheet is installed in the middle of the grooves, the flexible power transmission sheet comprises a fixed insulating sheet, a power connection rod and a torsion spring rod, the two ends of the flexible power transmission sheet are respectively fixedly connected to the fixed insulating sheet and the power connection rod, the fixed insulating sheet is fixed to the top end of the torsion spring rod, the torsion spring rod is rotatably connected to the inner wall of the top plate, the side surface of the flexible power transmission sheet is connected to a power supply, the power connection rod is inserted into the inside of the power supply, the bottom end of the power supply is connected to a power transmission line, and the power transmission line is connected to an external power supply.

[0019] As a preferred embodiment, it is convenient to supply power to the semiconductor refrigeration sheet, and when the semiconductor refrigeration sheet is rotated, the flexible power transmission sheet can be attached to the semiconductor refrigeration sheet at different angles, thereby facilitating power supply.

[0020] The present invention is further configured such that two groups of power connection rods are connected to the side of the semiconductor refrigeration plate, each group of the power connection rods is located inside the slot, and a rotating shaft is provided on the side of the semiconductor refrigeration plate, and the semiconductor refrigeration plate is rotatably connected to the top plate via the rotating shaft, and a slide groove matching the rotation trajectory of the power connection rod is provided inside the slot.

[0021] Preferably, the semiconductor refrigeration sheet can be easily attached to the flexible power transmission sheet.

[0022] The present invention is further configured such that two groups of adjustment plates are symmetrically installed at the top of the heat exchanger, the adjustment plates are rotatably connected to the heat exchanger, and the bottom end of each group of adjustment plates is connected to a guide surface, and two groups of connecting heads are installed at the bottom end of the connecting head, and the connecting heads are respectively connected to the first ventilator and the second ventilator, and the two groups of connecting heads are respectively aligned with the bottom ends of the two groups of adjustment plates.

[0023] Preferably, the heat exchanger is convenient for adjusting the angle of the semiconductor refrigeration plate.

[0024] In summary, the present invention mainly has the following beneficial effects:

[0025] 1. The present invention is equipped with a processing table, a torsion motor, an extrusion cylinder, a limit mechanism, a torsion table and a positioning mechanism. When processing the gasket, the positioning mechanism can drive the limit mechanism to move, and the limit mechanism can position and clamp the gasket to facilitate the alignment of the gasket with each group of equipment. Then, the extrusion cylinder is started to drive the pressure plate to move downward, and the gasket is clamped between the fixed plate and the torsion table. Then, the torsion motor is started, and the torsion motor performs a torsion test on the gasket.

[0026] 2. The setting adjustment cylinder, semiconductor refrigeration sheet, ventilation mechanism, movable disk, top plate, flexible power transmission sheet and heat exchanger can start the ventilation mechanism before placing the gasket according to the gasket processing method, such as heating or cooling. The ventilation mechanism pushes the adjustment sheets at different positions to rotate, and the adjustment sheets at different positions will contact different positions of the semiconductor refrigeration sheet. The adjustment cylinder pushes the movable disk to move upward, so that the adjustment sheet rotates the semiconductor refrigeration sheet. When cooling, the cooling surface of the semiconductor refrigeration sheet faces upward, and the heat generating surface is in contact with the heat exchanger. When heating, the heat generating surface of the semiconductor refrigeration sheet faces upward, and the cooling surface is in contact with the heat exchanger, thereby realizing heating or cooling of the gasket and improving the detection range. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the torsion motor and the extrusion cylinder of the present invention;

[0029] Figure 3 It is a structural schematic diagram of the cross section of the processing table of the present invention;

[0030] Figure 4 It is a structural schematic diagram of the positioning mechanism of the present invention;

[0031] Figure 5 It is a schematic diagram of the exploded structure of the positioning mechanism of the present invention;

[0032] Figure 6 It is a structural schematic diagram of the ventilation mechanism of the present invention;

[0033] Figure 7 It is a structural schematic diagram of the cross section of the ventilation mechanism of the present invention;

[0034] Figure 8 It is a structural schematic diagram of the torsion platform of the present invention;

[0035] Fig. 9 It is a structural schematic diagram of the top plate of the present invention;

[0036] Fig.10 It is a structural schematic diagram of the top plate and the movable disk of the present invention;

[0037] Fig.11 For the present invention Fig.11 A schematic diagram of the local enlarged structure at point A in the middle;

[0038] Fig.12 It is a schematic diagram of the structure of the flexible power transmission sheet of the present invention;

[0039] Fig.13 It is a schematic diagram of the structure of the semiconductor refrigeration sheet of the present invention when it rotates;

[0040] Fig.14 It is a schematic diagram of the structure of the heat exchanger and the semiconductor refrigeration sheet of the present invention;

[0041] Fig.15 It is a schematic structural diagram of the cross section of the heat exchanger of the present invention.

[0042] Description of reference numerals:

[0043] 1. Operating base; 101. Support frame; 102. Adjustment cylinder; 2. Processing table; 201. Support plate; 3. Torsion motor; 4. Extrusion cylinder; 401. Press plate; 402. Fixing plate; 403. Temperature sensor; 5. Operation panel; 6. Ventilation mechanism; 601. First ventilator; 602. Second ventilator; 603. First pipeline; 604. Second pipeline; 605. Shielding net; 606. Ventilation assembly; 7. Limiting mechanism; 701. Side pressure sensing mechanism; 7011. Extrusion block; 702. Reset spring; 703. Positioning rod; 8. Torsion Turntable; 9, positioning mechanism; 901, adjusting cylinder; 902, fixing rod; 903, output wire; 904, bottom plate; 905, reinforcing rib; 10, driving disk; 11, semiconductor cooling plate; 1101, connecting pole; 12, movable disk; 1201, supporting column; 13, top plate; 1301, slotting; 14, flexible power transmission plate; 1401, fixed insulating plate; 1402, connecting pole; 1403, torsion spring rod; 15, power supply; 1501, power transmission line; 16, heat exchanger; 1601, adjustment plate; 1602, guide surface; 1603, connector. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] The following describes an embodiment of the present invention based on its overall structure.

[0046] Example:

[0047] See also Figures 1 to 4, including an operating base 1, a support frame 101 and a processing table 2 are installed on the top of the operating base 1, a torsion motor 3 is installed on the top of the support frame 101, the output end of the torsion motor 3 faces downward and the output end of the torsion motor 3 is connected to an extrusion cylinder 4, and the extrusion cylinder 4 is located directly above the processing table 2, and a torsion table 8 is installed on the top of the processing table 2, the output end of the extrusion cylinder 4 is connected to a pressing plate 401, and the bottom end of the pressing plate 401 is connected to a fixing plate 402, and a temperature sensor 403 is installed on the top of the fixing plate 402, the detection end of the temperature sensor 403 extends to the bottom of the fixing plate 402, and the fixing plate 402 is aligned with the top of the torsion table 8. When the gasket is tested, the gasket is first placed on the torsion table 8, and the outer side of the torsion table 8 is located at the top of the processing table 2 and has multiple groups of limit mechanisms 7 evenly distributed, and the side of the limit mechanism 7 is installed with a side pressure sensing mechanism 701, and the side of the side pressure sensing mechanism 701 is installed with an extrusion block 7 011, the side pressure sensing mechanism 701 is fitted with the edge of the gasket through an extrusion block 7011, the interior of the limiting mechanism 7 is hollow, and the side pressure sensing mechanism 701 is installed in the hollow interior of the limiting mechanism 7, two groups of shells are installed on the outside of the limiting mechanism 7, and a positioning rod 703 is installed inside the shell, and the shell is fixed by the positioning rod 703, the positioning mechanism 9 includes an adjusting cylinder 901, a fixing rod 902 and a bottom plate 904, the fixing rod 902 is fixed to the output end of the adjusting cylinder 901, the limiting mechanism 7 is sleeved on the top of the fixing rod 902, the limiting mechanism 7 is movably connected to the fixing rod 902 through a reset spring 702, the top of the bottom plate 904 is connected with an output wire 903, the output wire 903 is connected to the side pressure sensing mechanism 701, and the bottom end of the bottom plate 904 is connected with multiple groups of reinforcing ribs 905, which can drive the limiting mechanism 7 to move through the adjusting cylinder 901 after the gasket is placed, so that the limiting mechanism 7 clamps and positions the gasket.

[0048] See also Figures 6 to 11A top plate 13 is installed inside the torsion table 8, and a plurality of grooves penetrating the top plate 13 are provided at the top of the top plate 13, and semiconductor cooling sheets 11 are rotatably connected in the plurality of grooves of the top plate 13. An operating base 1 is provided below the processing table 2 and an adjusting cylinder 102 is provided thereon. A driving disk 10 is connected to the output end of the adjusting cylinder 102, a movable disk 12 is connected to the top of the driving disk 10, a supporting column 1201 is connected to the bottom end of the movable disk 12, and the movable disk 12 is fixedly connected to the driving disk 10 through the supporting column 1201. A plurality of heat exchangers 16 are installed at the top of the movable disk 12, and each heat exchanger 16 is aligned with the bottom of the semiconductor cooling sheet 11. A groove 1301 is provided on the side of each group of semiconductor cooling sheets 11 of the top plate 13, and a flexible power transmission sheet 14 is provided in the middle of the groove 1301. The flexible power transmission sheet 14 includes a fixed insulating sheet 1401, a power connecting rod 1402 and The torsion spring rod 1403 and the two ends of the flexible power transmission sheet 14 are fixedly connected to the fixed insulating sheet 1401 and the power connection rod 1402 respectively, the fixed insulating sheet 1401 is fixed on the top of the torsion spring rod 1403, the torsion spring rod 1403 is rotatably connected to the inner wall of the top plate 13, the side of the flexible power transmission sheet 14 is connected to the power supply 15, the power connection rod 1402 is inserted into the power supply 15, the bottom end of the power supply 15 is connected to the power supply line 1501, and the power transmission line 1501 is connected to the external power supply, the side of the semiconductor refrigeration sheet 11 is connected to two groups of power connection rods 1101, each group of power connection rods 1101 is located inside the slot 1301, and a rotating shaft is provided on the side of the semiconductor refrigeration sheet 11, the semiconductor refrigeration sheet 11 is rotatably connected to the top plate 13 through the rotating shaft, and a sliding groove matching the rotation trajectory of the power connection rod 1101 is provided inside the slot 1301, so that the semiconductor refrigeration sheet 11 can be easily rotated.

[0049] For further information, see Figures 6 to 15The outside of the processing table 2 is connected to a ventilation mechanism 6, and the ventilation mechanism 6 includes a first ventilation machine 601 and a second ventilation machine 602. The end of the first ventilation machine 601 is connected to a first pipe 603, and the end of the second ventilation machine 602 is connected to a second pipe 604. The first ventilation machine 601 and the second ventilation machine 602 are connected to the heat exchanger 16 through the first pipe 603 and the second pipe 604. The ends of the first ventilation machine 601 and the second ventilation machine 602 are both installed with a shielding net 605. The inside of the first ventilation machine 601 and the second ventilation machine 602 is both installed with a ventilation component 606, and the ventilation component 606 is composed of a motor and a fan blade. Two groups of adjustment plates 1601 are symmetrically installed on the top of the heat exchanger 16. The adjustment plates 1601 are rotatably connected to the heat exchanger 16, and the bottom of each group of adjustment plates 1601 is connected to the guide surface 16. 02, two groups of connectors 1603 are installed at the bottom of the connector 1603, and the connectors 1603 are respectively connected to the first ventilator 601 and the second ventilator 602, and the two groups of connectors 1603 are respectively aligned with the bottom ends of the two groups of adjustment plates 1601, so that the airflow can circulate in the heat exchanger 16, and the temperature change generated by the semiconductor refrigeration plate 11 can be exchanged with the outside world to improve the heat exchange effect. Before the heat exchange, the direction of the airflow can be changed according to the treatment method of the gasket, so that the airflow pushes different adjustment plates 1601 to unfold. During the rising process of the adjustment cylinder 102, the heat exchanger 16 will be pushed to move upward, so that different adjustment plates 1601 can push the semiconductor refrigeration plate 11 to rotate at different angles, so that the semiconductor refrigeration plate 11 can face different sides upward according to needs, thereby facilitating different prices for the gasket.

[0050] In the above embodiments, please refer to Figure 1 A support plate 201 is provided on the outside of the processing table 2 to support the processing table 2. The ventilation mechanism 6 is installed on the outer wall of the support plate 201 to facilitate the support of the ventilation mechanism 6 and enable the ventilation mechanism 6 to exchange air and heat with the outside air.

[0051] Before use, first adjust the position of the semiconductor refrigeration sheet 11 according to whether the gasket detects high temperature or low temperature. If cooling is required, start the first ventilator 601 in the forward direction and start the second ventilator 602 in the reverse direction. The first ventilator 601 draws outside air into the heat exchanger 16, and the airflow blows up the adjustment sheet 1601 on the right side. Then start the adjustment cylinder 102 to move upward, and the adjustment sheet 1601 on the right side first contacts the side of the semiconductor refrigeration sheet 11, thereby first pushing the semiconductor refrigeration sheet 11 to rotate, so that the cooling surface of the semiconductor refrigeration sheet 11 rotates upward. When the heat exchanger 16 is fitted with the semiconductor refrigeration sheet 11, the right adjustment sheet 1601 is closed by squeezing, and the heat exchanger 16 and the ventilation mechanism 6 form a complete ventilation channel, and the heat exchanger 16 is fitted with the heat generating surface of the semiconductor refrigeration sheet 11.

[0052] When heating is required, the first ventilator 601 is started in reverse, and the second ventilator 602 is started in forward. The second ventilator 602 draws outside air into the heat exchanger 16, and the airflow blows up the adjustment piece 1601 on the left. Then the above operation is repeated, and the adjustment piece on the left first contacts the side of the semiconductor refrigeration sheet 11, thereby first pushing the semiconductor refrigeration sheet 11 to rotate, so that the heat generating surface of the semiconductor refrigeration sheet rotates upward. When the heat exchanger 16 is attached to the semiconductor refrigeration sheet 11, the adjustment piece 1601 on the left is squeezed and closed, and the heat exchanger 16 is attached to the cooling surface of the semiconductor refrigeration sheet 11.

[0053] When testing the gasket, first place the gasket on the processing table 2, and place the gasket above the torsion table 8, then start the adjusting cylinder 901, the adjusting cylinder 901 drives the fixing rod 902 to move, and the fixing rod 902 drives the top limit mechanism 7 to move to clamp and limit the gasket, so that the gasket can be aligned with the torsion detection equipment. After the adjustment is completed, start the adjusting cylinder 901 again to separate the limit mechanism 7 from the gasket slightly until the side pressure sensor mechanism 701 senses that the pressure returns to zero, and then stop moving;

[0054] Then, the extrusion cylinder 4 is started, and the extrusion cylinder 4 drives the pressure plate 401 at the output end to approach the gasket. At this time, the edge of the pressure plate 401 pushes the limit mechanism 7 to move downward, and the limit mechanism 7 slides downward at the top of the fixing rod 902 and squeezes the return spring 702 until the fixing plate 402 fits with the gasket. At this time, the side pressure sensor mechanism 701 is still in contact with the outer side of the gasket.

[0055] Then, the power supply 15 is powered through the transmission line 1501, and the power supply 15 powers each group of flexible power transmission sheets 14. At this time, different temperatures are generated at the two ends of the semiconductor refrigeration sheet 11. The cooling surface of the semiconductor refrigeration sheet 11 generates a low temperature, and the heat-generating surface generates a high temperature. When cooling, the cooling surface of the semiconductor refrigeration sheet 11 faces upward, and the heat-generating surface fits the heat exchanger 16. At this time, the ventilation mechanism 6 is started, and the first ventilator 601 and the second ventilator 602 in the ventilation mechanism run in opposite directions, thereby driving the airflow to flow through the first ventilator 601, the first pipeline 603, the heat exchanger 16, the second pipeline 604 and the second ventilator 602, and the heat exchanger 16 is located below the semiconductor refrigeration sheet 11. At this time, the heat exchanger The airflow in 16 will dissipate the heat of the heat-generating surface of the semiconductor refrigeration sheet 11, thereby cooling down. At this time, the cooling surface of the semiconductor refrigeration sheet 11 cools down the gasket. During the cooling process, the temperature sensor 403 at the top of the fixing plate 402 will measure the temperature of the gasket. When the appropriate temperature is reached, the cooling of the semiconductor refrigeration sheet 11 is stopped. If heating is required, the heat-generating surface of the semiconductor refrigeration sheet 11 faces upward, and the cooling surface is attached to the heat exchanger 16. The subsequent operation is the same as the above operation, but at this time, the cooling surface continuously absorbs the heat of the external air, thereby achieving heating. The heat-generating surface of the semiconductor refrigeration sheet 11 heats up the gasket. During the heating process, the temperature sensor 403 also detects the temperature.

[0056] When the temperature reaches the appropriate range, the torsion motor 3 is started, and the torsion motor 3 drives the extrusion cylinder 4 at the bottom to rotate, and the extrusion cylinder 4 drives the pressure plate 401 and the fixed plate 402 to rotate, so as to perform a torsion test on the gasket. The gasket can be temperature treated as required without the need for additional temperature treatment equipment, thereby improving the treatment effect.

[0057] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A device for detecting deformation of a nickel-titanium alloy gasket at different temperatures, comprising an operating base (1), characterized in that: A support frame (101) and a processing table (2) are installed at the top of the operating base (1); a torsion motor (3) is installed at the top of the supporting frame (101); the output end of the torsion motor (3) faces downward and the output end of the torsion motor (3) is connected to an extrusion cylinder (4), and the extrusion cylinder (4) is located directly above the processing table (2); a torsion table (8) is installed at the top of the processing table (2); the outer side of the torsion table (8) is located at the top of the processing table (2) and a plurality of groups of limit mechanisms (7) are evenly distributed; a top plate (13) is installed inside the torsion table (8), and a plurality of groups of grooves penetrating the top plate (13) are provided at the top of the top plate (13), and semiconductor cooling plates (11) are rotatably connected in the plurality of groups of grooves of the top plate (13); the operating base (1) is located at the processing table (2) An adjusting cylinder (102) is installed below the processing table (2); the output end of the adjusting cylinder (102) is connected to a driving disk (10); the top end of the driving disk (10) is connected to a movable disk (12); the bottom end of the movable disk (12) is connected to a support column (1201); the movable disk (12) is fixedly connected to the driving disk (10) via the support column (1201); a plurality of groups of heat exchangers (16) are installed on the top end of the movable disk (12); each group of heat exchangers (16) is aligned with the bottom of the semiconductor cooling plate (11); the top plate (13) is located on the side of each group of semiconductor cooling plates (11) and is connected to a power supply structure; the power supply structure supplies power to the semiconductor cooling plates (11); the outer side of the processing table (2) is connected to a ventilation mechanism (6); the ventilation mechanism (6) is connected to the heat exchanger (16).

2. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: A support plate (201) is provided on the outside of the processing table (2), the support plate (201) supports the processing table (2), and the ventilation mechanism (6) is installed on the outer wall of the support plate (201).

3. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: The output end of the extrusion cylinder (4) is connected to a pressing plate (401), and the bottom end of the pressing plate (401) is connected to a fixing plate (402), and a temperature sensor (403) is installed at the top end of the fixing plate (402), and the detection end of the temperature sensor (403) extends to the bottom of the fixing plate (402), and the fixing plate (402) is aligned with the top end of the twisting platform (8).

4. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: The ventilation mechanism (6) comprises a first ventilator (601) and a second ventilator (602); the end of the first ventilator (601) is connected to a first pipe (603); the end of the second ventilator (602) is connected to a second pipe (604); the first ventilator (601) and the second ventilator (602) are connected to a heat exchanger (16) via the first pipe (603), the second pipe (604) and the heat exchanger (16); shielding nets (605) are installed at the ends of the first ventilator (601) and the second ventilator (602); ventilation components (606) are installed inside the first ventilator (601) and the second ventilator (602); the ventilation components (606) are composed of a motor and fan blades.

5. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: A side pressure sensing mechanism (701) is installed on the side of the limiting mechanism (7), and an extrusion block (7011) is installed on the side of the side pressure sensing mechanism (701). The side pressure sensing mechanism (701) is fitted with the edge of the gasket via the extrusion block (7011). The interior of the limiting mechanism (7) is hollow, and the side pressure sensing mechanism (701) is installed in the hollow interior of the limiting mechanism (7). Two sets of outer shells are installed on the outside of the limiting mechanism (7), and positioning rods (703) are installed inside the outer shells. The outer shells are fixed by the positioning rods (703).

6. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 5, characterized in that: The positioning mechanism (9) comprises an adjusting cylinder (901), a fixing rod (902) and a bottom plate (904); the fixing rod (902) is fixed to the output end of the adjusting cylinder (901); the limiting mechanism (7) is sleeved on the top end of the fixing rod (902); the limiting mechanism (7) is movably connected to the fixing rod (902) via a return spring (702); the top end of the bottom plate (904) is connected to an output wire (903); the output wire (903) is connected to the side pressure sensing mechanism (701); and the bottom end of the bottom plate (904) is connected to a plurality of groups of reinforcing ribs (905).

7. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: The top plate (13) is provided with a slot (1301) on the side of each group of semiconductor cooling sheets (11); a flexible power transmission sheet (14) is installed in the middle of the slot (1301); the flexible power transmission sheet (14) comprises a fixed insulating sheet (1401), a power connection rod (1402) and a torsion spring rod (1403); two ends of the flexible power transmission sheet (14) are respectively fixedly connected to the fixed insulating sheet (1401) and the power connection rod (1402); the fixed insulating sheet (1401) is fixed to the top of the torsion spring rod (1403); the torsion spring rod (1403) is rotatably connected to the inner wall of the top plate (13); a power supply (15) is connected to the side of the flexible power transmission sheet (14); the power connection rod (1402) is inserted into the power supply (15); the bottom end of the power supply (15) is connected to a power transmission line (1501); and the power transmission line (1501) is connected to an external power source.

8. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 7, characterized in that: Two groups of power connection rods (1101) are connected to the side of the semiconductor cooling plate (11), each group of the power connection rods (1101) is located inside the slot (1301), and a rotating shaft is provided on the side of the semiconductor cooling plate (11), the semiconductor cooling plate (11) is rotatably connected to the top plate (13) via the rotating shaft, and a sliding groove matching the rotation trajectory of the power connection rod (1101) is provided inside the slot (1301).

9. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 4, characterized in that: Two groups of adjustment plates (1601) are symmetrically installed at the top of the heat exchanger (16), and the adjustment plates (1601) are rotatably connected to the heat exchanger (16), and the bottom end of each group of adjustment plates (1601) is connected to a guide surface (1602). Two groups of connection heads (1603) are installed at the bottom end of the connection head (1603), and the connection heads (1603) are respectively connected to the first ventilator (601) and the second ventilator (602), and the two groups of connection heads (1603) are respectively aligned with the bottom ends of the two groups of adjustment plates (1601).

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