Cooling effect analysis system and method for packaging adhesive

Abstract

The invention relates to the technical field of electronic digital data processing, in particular to a cooling effect analysis system and method for packaging glue, and the method comprises the steps: collecting a book back image and paper material information of a book to be packaged, and collecting the temperature information of the packaging glue at the same time; obtaining a packaging adhesive contact coefficient according to the book back image; obtaining a material heat conductivity coefficient and a packaging adhesive cooling temperature uniformity coefficient according to the paper material information and the packaging adhesive temperature information; and according to the packaging adhesive contact coefficient, the material heat conductivity coefficient and the packaging adhesive cooling temperature uniformity coefficient, obtaining a packaging adhesive cooling index, and when the packaging adhesive cooling index is greater than a preset packaging adhesive cooling threshold, determining that packaging adhesive cooling is completed. According to the invention, the cooling effect of the packaging adhesive is quantified, so that the binding quality and the production efficiency of books are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic digital data processing, and in particular to a cooling effect analysis system and method for packaging glue. Background Art

[0002] Book sealing glue is a kind of adhesive specially used for book binding and protection, with good adhesion and weather resistance. By evenly applying the sealing glue on the back of the book, it can not only ensure that the inner pages of the book are firmly bonded to the cover and prevent the pages from falling off, but also form a smooth and tough protective layer between the cover and the inner pages of the book, effectively resisting the wear and stains caused by daily reading, and extending the service life of the book.

[0003] During the book packaging process, the packaging glue needs to undergo a transition from liquid to solid to achieve tight adhesion between the pages and between the cover and the inner pages. By cooling the packaging glue, the curing speed of the packaging glue can be accelerated, so that it can reach the required strength and stability in a short time. A good cooling effect not only helps to improve the binding quality of books, but also reduces the time consumed by waiting for the packaging glue to dry naturally, thereby improving the efficiency of book packaging.

[0004] During the cooling process of the encapsulating adhesive, the difference in the thickness of the inner pages and the paper material of the book will lead to different contact degrees between the encapsulating adhesive and the book back and different thermal conductivity coefficients of the materials, which will in turn affect the uniformity of the cooling temperature and ultimately affect the cooling effect of the encapsulating adhesive. The existing analysis method for the cooling effect of the encapsulating adhesive ignores the influence of the above factors on the cooling effect of the encapsulating adhesive, resulting in distorted evaluation of the cooling effect and reducing the binding quality and production efficiency of the book. Summary of the invention

[0005] In order to overcome the defects and shortcomings of the prior art, the present invention provides a cooling effect analysis system and method for packaging glue, which improves the binding quality and production efficiency of books by quantifying the cooling effect of the packaging glue.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The present invention provides a cooling effect analysis method for packaging glue, comprising the following steps:

[0008] S1, collecting the back image and paper material information of the book to be packaged, and collecting the packaging glue temperature information;

[0009] S2, obtaining a packaging adhesive contact coefficient according to the book back image;

[0010] S3, obtaining the thermal conductivity of the material and the uniformity coefficient of the cooling temperature of the packaging glue according to the paper material information and the packaging glue temperature information;

[0011] S4. Obtaining a packaging glue cooling index according to the packaging glue contact coefficient, the material thermal conductivity, and the packaging glue cooling temperature uniformity coefficient, and determining that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold.

[0012] As a preferred technical solution, step S2 includes the following specific steps:

[0013] S21, obtaining a back image of the book to be packaged;

[0014] S22, converting the book spine image into a book spine grayscale image;

[0015] S23, taking the pixel (x, y) in the grayscale image of the book back as the center, calculate the window size to be 2 k ×2 k The average gray value of pixels in the window, the calculation formula of the average gray value of pixels is:

[0016]

[0017] Where p(i,j) represents the grayscale value of pixel (i,j), G k (x,y) means the center is pixel (x,y) and the window size is 2 k ×2 k The average gray value of pixels in the window, k is used to control the size of the window;

[0018] S24, calculating the average grayscale difference of the first pixel in the horizontally symmetrical window and the average grayscale difference of the second pixel in the vertically symmetrical window of the pixel (x, y), the calculation formula of the first pixel average grayscale difference and the second pixel average grayscale difference is:

[0019]

[0020] Where D k,h (x, y) represents the average grayscale difference of the first pixel, D k,v (x, y) represents the average grayscale difference of the second pixel;

[0021] S25, by adjusting the k value to control the window size, and then control the size of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel, the k value when the sum of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel reaches the maximum is recorded as k', and the window size of the pixel (x, y) is L(x, y) = 2 k′ ;

[0022] S26, substituting the window size into the packaging glue contact coefficient calculation formula to calculate the packaging glue contact coefficient, the packaging glue contact coefficient calculation formula is:

[0023]

[0024] Where L(i,j) represents the window size of pixel (i,j), M represents the number of pixels of the grayscale image of the book back in the horizontal direction, N represents the number of pixels of the grayscale image of the book back in the vertical direction, and K R Represents the packaging adhesive contact coefficient.

[0025] As a preferred technical solution, obtaining the uniformity coefficient of the cooling temperature of the encapsulation glue in step S3 includes the following specific steps:

[0026] S31, obtaining the packaging glue temperature information, wherein the packaging glue temperature information includes the packaging glue real-time temperature information during the packaging glue cooling process and the packaging glue cooling temperature information after cooling;

[0027] S32, obtaining a cooling temperature variation uniformity coefficient of the packaging glue according to the real-time temperature information of the packaging glue;

[0028] S33, substituting the packaging glue cooling temperature information into the cooling temperature distribution uniformity coefficient calculation formula to calculate the cooling temperature distribution uniformity coefficient, the cooling temperature distribution uniformity coefficient calculation formula is:

[0029]

[0030] Where T max Indicates the maximum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, T min Indicates the minimum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, K TD represents the cooling temperature distribution uniformity coefficient;

[0031] S34, substituting the cooling temperature variation uniformity coefficient and the cooling temperature distribution uniformity coefficient into the packaging glue cooling temperature uniformity coefficient calculation formula to calculate the packaging glue cooling temperature uniformity coefficient, the packaging glue cooling temperature uniformity coefficient calculation formula is:

[0032] K T =α×K TC +(1-α)×K TD ;

[0033] Where K TC Indicates the cooling temperature uniformity coefficient, K TD represents the cooling temperature distribution uniformity coefficient, α represents the adjustment factor, K T Indicates the uniformity coefficient of packaging glue cooling temperature.

[0034] As a preferred technical solution, step S32 includes the following specific steps:

[0035] S321, obtaining real-time temperature information of the packaging glue;

[0036] S322, substituting the real-time temperature information of the packaging glue into a cooling rate calculation formula to calculate the cooling rate of the packaging glue, the cooling rate calculation formula is:

[0037]

[0038] Where T(t c ) represents the average temperature information of all temperature monitoring points of the packaging glue at time tc, T(t c+1 ) indicates t c+1 The average temperature information of all temperature monitoring points of the packaging glue at all times, R c represents the cooling rate at the cth monitoring time interval;

[0039] S323, substituting the cooling rate into an average cooling rate calculation formula to calculate an average cooling rate, the average cooling rate calculation formula is:

[0040]

[0041] Where R c represents the cooling rate in the cth time period, C represents the number of monitoring time intervals, and R represents the average cooling rate;

[0042] S324, substituting the cooling rate and the average cooling rate into a cooling rate standard deviation calculation formula to calculate the cooling rate standard deviation, the cooling rate standard deviation calculation formula is:

[0043]

[0044] Where R c represents the cooling rate at the cth monitoring time interval, R represents the average cooling rate, C represents the number of monitoring time intervals, and σ represents the standard deviation of the cooling rate;

[0045] S325, substituting the cooling rate standard deviation into the cooling temperature variation uniformity coefficient calculation formula to calculate the cooling temperature variation uniformity coefficient, the cooling temperature variation uniformity coefficient calculation formula is:

[0046]

[0047] Where σ represents the standard deviation of cooling rate, R represents the average cooling rate, and K TC Indicates the cooling temperature uniformity coefficient.

[0048] As a preferred technical solution, obtaining the packaging glue cooling index in step S4 includes the following specific steps:

[0049] S41, obtaining the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient;

[0050] S42, substituting the packaging glue contact coefficient, the material thermal conductivity coefficient and the packaging glue cooling temperature uniformity coefficient into the packaging glue cooling index calculation formula to calculate the packaging glue cooling index, the packaging glue cooling index calculation formula is:

[0051] K=ω1×K R +ω2×K H +ω3×K T ;

[0052] Where K R Indicates the packaging glue contact coefficient, K H Indicates the thermal conductivity of the material, K T represents the uniformity coefficient of packaging glue cooling temperature, ω1 represents the packaging glue contact weight, ω2 represents the material thermal conductivity weight, ω3 represents the packaging glue cooling temperature weight, and K represents the packaging glue cooling index.

[0053] As a preferred technical solution, obtaining the thermal conductivity of the material in step S3 includes the following specific steps:

[0054] S35, obtaining the paper material information of the book to be packaged;

[0055] S36, measuring the thermal conductivity of papers of different materials by a thermal conductivity analyzer, and constructing a paper thermal conductivity database;

[0056] S37, importing the paper material information into the paper thermal conductivity database, and querying the material thermal conductivity corresponding to the paper material information in the paper thermal conductivity database.

[0057] It should be noted here that the adjustment factor, encapsulation glue contact weight, material thermal conductivity weight, encapsulation glue cooling temperature weight and preset encapsulation glue cooling threshold are obtained as follows: 5000 sets of book back images, paper material information and encapsulation glue temperature information of the books to be encapsulated are collected, and whether the encapsulation glue cooling effect meets the production requirements is distinguished, and the book back images, paper material information and encapsulation glue temperature information are substituted into the encapsulation glue cooling index calculation formula for calculation, and the calculated encapsulation glue cooling index and the distinction result are simultaneously imported into the fitting software, and the optimal adjustment factor, encapsulation glue contact weight, material thermal conductivity weight, encapsulation glue cooling temperature weight and preset encapsulation glue cooling threshold that meet the distinction accuracy of the distinction result are output.

[0058] The present invention also provides a cooling effect analysis system for packaging glue, comprising:

[0059] An information collection module is used to collect the back image and paper material information of the book to be packaged, and also collect the temperature information of the packaging glue;

[0060] A contact coefficient calculation module, used for obtaining a packaging adhesive contact coefficient according to the book spine image;

[0061] A thermal conductivity and temperature uniformity coefficient calculation module, used to obtain the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient according to the paper material information and the packaging glue temperature information;

[0062] A cooling index calculation module, used to obtain a packaging glue cooling index according to the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient, and determine that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold;

[0063] The control module is used to control the operation of the information acquisition module, the contact coefficient calculation module, the thermal conductivity and temperature uniformity coefficient calculation module and the cooling index calculation module.

[0064] An electronic device of the present invention comprises: a processor and a memory, wherein the memory stores a computer program that can be called by the processor, and the processor executes a cooling effect analysis method for packaging glue by calling the computer program stored in the memory.

[0065] A computer-readable storage medium of the present invention stores instructions. When the instructions are executed on a computer, the computer is enabled to execute a cooling effect analysis method for packaging glue.

[0066] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0067] The present invention first obtains the packaging glue contact coefficient through the book spine image, quantifies the contact degree between the packaging glue and the book spine, then obtains the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient according to the paper material information and the packaging glue temperature information, quantifies the change uniformity and distribution uniformity of the packaging glue cooling temperature, finally obtains the packaging glue cooling index and evaluates the packaging glue cooling effect according to the packaging glue cooling index, thereby improving the accuracy and reliability of the packaging glue cooling effect evaluation, thereby improving the binding quality and production efficiency of books. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0069] Figure 1 It is a schematic diagram of the overall process of a cooling effect analysis method for packaging glue of the present invention;

[0070] Figure 2 It is a schematic diagram of a flow chart of calculating the uniformity coefficient of cooling temperature of packaging glue in a cooling effect analysis method for packaging glue of the present invention;

[0071] Figure 3 The present invention is a schematic structural diagram of a cooling effect analysis system for packaging adhesive. DETAILED DESCRIPTION

[0072] The technical solution of the present invention is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solution of the present invention, rather than limitations on the technical solution of the present invention. The embodiments of the present invention and the technical features in the embodiments may be combined with each other unless there is a conflict.

[0073] Example 1

[0074] like Figure 1 As shown, this embodiment provides a cooling effect analysis method for packaging glue, which specifically includes the following steps:

[0075] S1: Collect the back image and paper material information of the book to be packaged, and collect the packaging glue temperature information.

[0076] S2: Obtain the packaging glue contact coefficient based on the book back image;

[0077] The characteristics and texture of the book back surface are analyzed by converting the book back image into a grayscale image, calculating the average grayscale value and grayscale difference of the pixels, and adjusting the window size to maximize the grayscale difference, thereby determining the window size. The window size reflects the contact state between the encapsulation glue and the book back surface, namely, the encapsulation glue contact coefficient. The encapsulation glue contact coefficient has an important influence on the encapsulation glue cooling effect. The higher the encapsulation glue contact coefficient, the tighter the contact between the surface encapsulation glue and the book back, thereby improving the cooling effect, ensuring that the encapsulation glue can be cured evenly and quickly, and improving the overall quality and durability of the package. The encapsulation glue contact coefficient includes the following specific steps:

[0078] S21: Acquire the back image of the book to be packaged;

[0079] S22: converting the book back image into a book back grayscale image;

[0080] S23: Centered on the pixel (x, y) in the grayscale image of the book back, the calculation window size is 2 k ×2 k The average gray value of pixels in the window, the calculation formula of the average gray value of pixels is:

[0081]

[0082] Where p(i,j) represents the grayscale value of pixel (i,j), G k (x,y) means the center is pixel (x,y) and the window size is 2 k ×2 k The average gray value of pixels in the window, k is used to control the size of the window;

[0083] S24: Calculate the average grayscale difference of the first pixel in the horizontally symmetrical window and the average grayscale difference of the second pixel in the vertically symmetrical window of the pixel (x, y). The calculation formula of the first pixel average grayscale difference and the second pixel average grayscale difference is:

[0084]

[0085] Where D k,h (x, y) represents the average grayscale difference of the first pixel, D k,v (x, y) represents the average grayscale difference of the second pixel;

[0086] S25: Control the window size by adjusting the k value, and then control the size of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel. The k value when the sum of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel reaches the maximum is recorded as k'. Let the window size of the pixel (x, y) be L(x, y) = 2 k′ ;

[0087] S26: Substitute the window size into the encapsulation adhesive contact coefficient calculation formula to calculate the encapsulation adhesive contact coefficient. The encapsulation adhesive contact coefficient calculation formula is:

[0088]

[0089] Where L(i,j) represents the window size of pixel (i,j), M represents the number of pixels of the grayscale image of the book back in the horizontal direction, N represents the number of pixels of the grayscale image of the book back in the vertical direction, and K R Represents the packaging adhesive contact coefficient.

[0090] S3: Obtaining the thermal conductivity of the material and the uniformity coefficient of the cooling temperature of the packaging glue according to the paper material information and the packaging glue temperature information;

[0091] In the process of book packaging, the cooling effect of the packaging glue directly affects the bonding quality and durability of the books. By obtaining the temperature information of the packaging glue and calculating the cooling temperature change uniformity coefficient and the cooling temperature distribution uniformity coefficient, the temperature uniformity of the packaging glue during the cooling process can be more accurately evaluated. The cooling temperature change uniformity coefficient reflects the consistency of the temperature change of the packaging glue during the cooling process, while the cooling temperature distribution uniformity coefficient measures whether the temperature distribution after cooling is uniform, ensuring that the packaging glue can be uniformly solidified during the cooling process. Figure 2 As shown, obtaining the uniformity coefficient of the cooling temperature of the packaging glue includes the following specific steps:

[0092] S31: Acquire packaging glue temperature information, where the packaging glue temperature information includes the packaging glue real-time temperature information during the packaging glue cooling process and the packaging glue cooling temperature information after cooling;

[0093] S32: Obtaining a cooling temperature variation uniformity coefficient of the packaging glue according to the real-time temperature information of the packaging glue;

[0094] S33: Substituting the packaging glue cooling temperature information into the cooling temperature distribution uniformity coefficient calculation formula to calculate the cooling temperature distribution uniformity coefficient. The cooling temperature distribution uniformity coefficient calculation formula is:

[0095]

[0096] Where T max Indicates the maximum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, T min Indicates the minimum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, K TD represents the cooling temperature distribution uniformity coefficient;

[0097] S34: Substitute the cooling temperature variation uniformity coefficient and the cooling temperature distribution uniformity coefficient into the packaging glue cooling temperature uniformity coefficient calculation formula to calculate the packaging glue cooling temperature uniformity coefficient. The packaging glue cooling temperature uniformity coefficient calculation formula is:

[0098] K T =α×K TC +(1-α)×K TD ;

[0099] Where K TC Indicates the cooling temperature uniformity coefficient, K TD represents the cooling temperature distribution uniformity coefficient, α represents the adjustment factor, K T Indicates the uniformity coefficient of packaging glue cooling temperature;

[0100] By calculating the cooling rate in different time intervals, and then obtaining the average cooling rate and the standard deviation of the cooling rate, the cooling temperature uniformity coefficient is finally obtained. The cooling temperature uniformity coefficient reflects the stability of the temperature change of the encapsulation glue during the cooling process, and fully considers the dynamic characteristics of the temperature change of the encapsulation glue during the cooling process to avoid the problems of weak bonding, deformation or stress concentration caused by excessive temperature gradient. The specific steps for obtaining the cooling temperature uniformity coefficient of the encapsulation glue are as follows:

[0101] S321: Obtaining real-time temperature information of packaging glue;

[0102] S322: Substituting the real-time temperature information of the encapsulation glue into the cooling rate calculation formula to calculate the cooling rate of the encapsulation glue. The cooling rate calculation formula is:

[0103]

[0104] Where T(t c ) represents the average temperature information of all temperature monitoring points of the packaging glue at time tc, T(t c+1 ) indicates t c+1 The average temperature information of all temperature monitoring points of the packaging glue at all times, R c represents the cooling rate at the cth monitoring time interval;

[0105] S323: Substituting the cooling rate into the average cooling rate calculation formula to calculate the average cooling rate, the average cooling rate calculation formula is:

[0106]

[0107] Where R c represents the cooling rate in the cth time period, C represents the number of monitoring time intervals, and R represents the average cooling rate;

[0108] S324: Substitute the cooling rate and the average cooling rate into the cooling rate standard deviation calculation formula to calculate the cooling rate standard deviation. The cooling rate standard deviation calculation formula is:

[0109]

[0110] Where R c represents the cooling rate at the cth monitoring time interval, represents the average cooling rate, C represents the number of monitoring time intervals, and σ represents the standard deviation of the cooling rate;

[0111] S325: Substitute the cooling rate standard deviation into the cooling temperature variation uniformity coefficient calculation formula to calculate the cooling temperature variation uniformity coefficient. The cooling temperature variation uniformity coefficient calculation formula is:

[0112]

[0113] Where σ represents the standard deviation of cooling rate, represents the average cooling rate, K TC Indicates the cooling temperature uniformity coefficient;

[0114] Papers of different materials have different thermal conductivity characteristics. The thermal conductivity of the paper can be quantified by the thermal conductivity of the material. Paper with high thermal conductivity can more effectively dissipate the heat of the packaging glue, thereby accelerating the cooling process. The specific steps for obtaining the thermal conductivity of the material include the following:

[0115] S35: Acquire paper material information of the book to be packaged;

[0116] S36: Measure the thermal conductivity of papers of different materials by using a thermal conductivity analyzer and build a paper thermal conductivity database;

[0117] S37: Importing the paper material information into a paper thermal conductivity database, and querying the paper thermal conductivity database for the material thermal conductivity corresponding to the paper material information.

[0118] S4: obtaining a packaging glue cooling index according to a packaging glue contact coefficient, a material thermal conductivity coefficient, and a packaging glue cooling temperature uniformity coefficient, and determining that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold;

[0119] The encapsulation glue contact coefficient reflects the closeness of the contact between the encapsulation glue and the book back, the material thermal conductivity reflects the thermal conductivity of the paper, and thus determines the heat transfer rate, and the encapsulation glue cooling temperature uniformity coefficient measures the uniformity of temperature change and distribution during the cooling process. Therefore, the higher the encapsulation glue cooling index means that the encapsulation glue has good contact with the book back during the cooling process, the paper has excellent thermal conductivity, and the cooling temperature is uniform. The specific steps to obtain the encapsulation glue cooling index include the following:

[0120] S41: obtaining the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient;

[0121] S42: Substitute the packaging glue contact coefficient, the material thermal conductivity coefficient, and the packaging glue cooling temperature uniformity coefficient into the packaging glue cooling index calculation formula to calculate the packaging glue cooling index. The packaging glue cooling index calculation formula is:

[0122] K=ω1×K R +ω2×K H +ω3×K T ;

[0123] Where K R Indicates the packaging glue contact coefficient, K H Indicates the thermal conductivity of the material, K T represents the uniformity coefficient of packaging glue cooling temperature, ω1 represents the packaging glue contact weight, ω2 represents the material thermal conductivity weight, ω3 represents the packaging glue cooling temperature weight, and K represents the packaging glue cooling index.

[0124] Example 2

[0125] like Figure 3 As shown, this embodiment provides a cooling effect analysis system for packaging glue, including:

[0126] An information collection module is used to collect the back image and paper material information of the book to be packaged, and also collect the temperature information of the packaging glue;

[0127] A contact coefficient calculation module is used to obtain the contact coefficient of the packaging glue according to the book back image;

[0128] Thermal conductivity and temperature uniformity coefficient calculation module, used to obtain the thermal conductivity of the material and the uniformity of the cooling temperature of the packaging glue according to the paper material information and the packaging glue temperature information;

[0129] A cooling index calculation module is used to obtain a packaging glue cooling index according to a packaging glue contact coefficient, a material thermal conductivity coefficient, and a packaging glue cooling temperature uniformity coefficient, and to determine that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold;

[0130] The control module is used to control the operation of the information acquisition module, the contact coefficient calculation module, the thermal conductivity and temperature uniformity coefficient calculation module and the cooling index calculation module.

[0131] In this embodiment, the contact coefficient calculation module is used to obtain the contact coefficient of the packaging glue according to the book spine image. Obtaining the contact coefficient of the packaging glue includes the following specific steps:

[0132] Obtaining a back image of a book to be packaged;

[0133] Convert the book back image into a book back grayscale image;

[0134] Centered on the pixel (x,y) in the grayscale image of the book back, the calculation window size is 2 k ×2 k The average gray value of pixels in the window, the calculation formula of the average gray value of pixels is:

[0135]

[0136] Where p(i,j) represents the grayscale value of pixel (i,j), G k (x,y) means the center is pixel (x,y) and the window size is 2 k ×2 k The average gray value of pixels in the window, k is used to control the size of the window;

[0137] Calculate the average grayscale difference of the first pixel in the horizontally symmetrical window of the pixel (x, y) and the average grayscale difference of the second pixel in the vertically symmetrical window. The calculation formula for the average grayscale difference of the first pixel and the average grayscale difference of the second pixel is:

[0138]

[0139] Where D k,h(x, y) represents the average grayscale difference of the first pixel, D k,v (x, y) represents the average grayscale difference of the second pixel;

[0140] The window size is controlled by adjusting the k value, and then the size of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel is controlled. The k value when the sum of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel reaches the maximum is recorded as k'. Let the window size of the pixel (x, y) be L(x, y) = 2 k′ ;

[0141] Substitute the window size into the encapsulation glue contact coefficient calculation formula to calculate the encapsulation glue contact coefficient. The encapsulation glue contact coefficient calculation formula is:

[0142]

[0143] Where L(i,j) represents the window size of pixel (i,j), M represents the number of pixels of the grayscale image of the book back in the horizontal direction, N represents the number of pixels of the grayscale image of the book back in the vertical direction, and K R Represents the packaging adhesive contact coefficient.

[0144] In this embodiment, the thermal conductivity and temperature uniformity coefficient calculation module is used to obtain the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient according to the paper material information and the packaging glue temperature information. Obtaining the packaging glue cooling temperature uniformity coefficient includes the following specific steps:

[0145] Acquire packaging glue temperature information, the packaging glue temperature information includes packaging glue real-time temperature information during the packaging glue cooling process and packaging glue cooling temperature information after cooling;

[0146] Obtaining a cooling temperature variation uniformity coefficient of the packaging glue according to the real-time temperature information of the packaging glue;

[0147] Substitute the packaging glue cooling temperature information into the cooling temperature distribution uniformity coefficient calculation formula to calculate the cooling temperature distribution uniformity coefficient. The cooling temperature distribution uniformity coefficient calculation formula is:

[0148]

[0149] Where T max Indicates the maximum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, T min Indicates the minimum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, K TD represents the cooling temperature distribution uniformity coefficient;

[0150] Substitute the cooling temperature variation uniformity coefficient and the cooling temperature distribution uniformity coefficient into the packaging glue cooling temperature uniformity coefficient calculation formula to calculate the packaging glue cooling temperature uniformity coefficient. The packaging glue cooling temperature uniformity coefficient calculation formula is:

[0151] K T =α×K TC +(1-α)×K TD ;

[0152] Where K TC Indicates the cooling temperature uniformity coefficient, K TD represents the cooling temperature distribution uniformity coefficient, α represents the adjustment factor, K T Indicates the uniformity coefficient of packaging glue cooling temperature;

[0153] Obtaining the cooling temperature variation uniformity coefficient of the packaging glue includes the following specific steps:

[0154] Get the real-time temperature information of packaging glue;

[0155] Substitute the real-time temperature information of the encapsulation glue into the cooling rate calculation formula to calculate the cooling rate of the encapsulation glue. The cooling rate calculation formula is:

[0156]

[0157] In the formula Indicates t c The average temperature information of all temperature monitoring points of the packaging glue at all times, Indicates t c+1 The average temperature information of all temperature monitoring points of the packaging glue at all times, R c represents the cooling rate at the cth monitoring time interval;

[0158] Substitute the cooling rate into the average cooling rate calculation formula to calculate the average cooling rate. The average cooling rate calculation formula is:

[0159]

[0160] Where R c represents the cooling rate in the cth time period, C represents the number of monitoring time intervals, and R represents the average cooling rate;

[0161] Substitute the cooling rate and the average cooling rate into the cooling rate standard deviation calculation formula to calculate the cooling rate standard deviation. The cooling rate standard deviation calculation formula is:

[0162]

[0163] Where R c represents the cooling rate at the cth monitoring time interval, represents the average cooling rate, C represents the number of monitoring time intervals, and σ represents the standard deviation of the cooling rate;

[0164] Substitute the cooling rate standard deviation into the cooling temperature variation uniformity coefficient calculation formula to calculate the cooling temperature variation uniformity coefficient. The cooling temperature variation uniformity coefficient calculation formula is:

[0165]

[0166] Where σ represents the standard deviation of cooling rate, represents the average cooling rate, K TC Indicates the cooling temperature uniformity coefficient;

[0167] Obtaining the thermal conductivity of a material includes the following specific steps:

[0168] Get the paper material information of the book to be packaged;

[0169] The thermal conductivity of papers of different materials is measured by thermal conductivity analyzer, and a paper thermal conductivity database is constructed;

[0170] The paper material information is imported into the paper thermal conductivity database, and the material thermal conductivity corresponding to the paper material information is queried in the paper thermal conductivity database.

[0171] In this embodiment, the cooling index calculation module is used to obtain the packaging glue cooling index according to the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient. When the packaging glue cooling index is greater than the preset packaging glue cooling threshold, it is determined that the packaging glue cooling is completed. Obtaining the packaging glue cooling index includes the following specific steps:

[0172] Obtain the packaging glue contact coefficient, material thermal conductivity and packaging glue cooling temperature uniformity coefficient;

[0173] Substitute the packaging glue contact coefficient, material thermal conductivity and packaging glue cooling temperature uniformity coefficient into the packaging glue cooling index calculation formula to calculate the packaging glue cooling index. The packaging glue cooling index calculation formula is:

[0174] K=ω1×K R +ω2×K H +ω3×K T ;

[0175] Where K R Indicates the packaging glue contact coefficient, K H Indicates the thermal conductivity of the material, K T represents the uniformity coefficient of packaging glue cooling temperature, ω1 represents the packaging glue contact weight, ω2 represents the material thermal conductivity weight, ω3 represents the packaging glue cooling temperature weight, and K represents the packaging glue cooling index.

[0176] The above-mentioned parameters in the cooling effect analysis system for packaging glue of the present invention and the steps for each unit module to achieve corresponding functions can refer to the parameters and steps in the embodiment of the cooling effect analysis method for packaging glue mentioned above, and will not be repeated here.

[0177] Example 3

[0178] A computer-readable storage medium according to an embodiment of the present invention stores a computer program thereon, and when the computer program is executed by a processor, the above-mentioned method for analyzing the cooling effect of packaging glue is implemented. It should be noted that all computer programs of the method for analyzing the cooling effect of packaging glue are implemented using C language, wherein the information acquisition module, the contact coefficient calculation module, the thermal conductivity and temperature uniformity coefficient calculation module, the cooling index calculation module and the control module are all controlled by a remote server.

[0179] Example 4

[0180] This embodiment provides a computer-readable storage medium having a rewritable computer program stored thereon;

[0181] When the computer program is executed on a computer device, the computer device is caused to execute the above-mentioned method for analyzing the cooling effect of packaging glue.

[0182] For example, the computer readable storage medium can be a read-only memory (ROM), a random access memory (RAM), a compact disc (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, etc.

Claims

1. A method for analyzing the cooling effect of packaging glue, characterized in that: The steps include: S1, collecting the back image and paper material information of the book to be packaged, and collecting the packaging glue temperature information; S2, obtaining a packaging adhesive contact coefficient according to the book back image; S3, obtaining the thermal conductivity of the material and the uniformity coefficient of the cooling temperature of the packaging glue according to the paper material information and the packaging glue temperature information; S4. Obtaining a packaging glue cooling index according to the packaging glue contact coefficient, the material thermal conductivity, and the packaging glue cooling temperature uniformity coefficient, and determining that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold.

2. A cooling effect analysis method for packaging glue according to claim 1, characterized in that: The step S2 comprises the following specific steps: S21, obtaining a back image of the book to be packaged; S22, converting the book spine image into a book spine grayscale image; S23, taking the pixel (x, y) in the grayscale image of the book back as the center, calculate the window size to be 2 k ×2 k The average gray value of pixels in the window, the calculation formula of the average gray value of pixels is: Where p(i,j) represents the grayscale value of pixel (i,j), G k (x,y) means the center is pixel (x,y) and the window size is 2 k ×2 k The average gray value of pixels in the window, k is used to control the size of the window; S24, calculating the average grayscale difference of the first pixel in the horizontally symmetrical window and the average grayscale difference of the second pixel in the vertically symmetrical window of the pixel (x, y), the calculation formula of the first pixel average grayscale difference and the second pixel average grayscale difference is: Where D k,h (x, y) represents the average grayscale difference of the first pixel, D k,v (x, y) represents the average grayscale difference of the second pixel; S25, by adjusting the k value to control the window size, and then control the size of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel, the k value when the sum of the average grayscale difference of the first pixel and the average grayscale difference of the second pixel reaches the maximum is recorded as k', and the window size of the pixel (x, y) is L(x, y) = 2 k′ ; S26, substituting the window size into the packaging glue contact coefficient calculation formula to calculate the packaging glue contact coefficient, the packaging glue contact coefficient calculation formula is: Where L(i,j) represents the window size of pixel (i,j), M represents the number of pixels of the grayscale image of the book back in the horizontal direction, N represents the number of pixels of the grayscale image of the book back in the vertical direction, and K R Represents the packaging adhesive contact coefficient.

3. A cooling effect analysis method for packaging glue according to claim 1, characterized in that: Obtaining the uniformity coefficient of the cooling temperature of the packaging glue in step S3 includes the following specific steps: S31, obtaining the packaging glue temperature information, wherein the packaging glue temperature information includes the packaging glue real-time temperature information during the packaging glue cooling process and the packaging glue cooling temperature information after cooling; S32, obtaining a cooling temperature variation uniformity coefficient of the packaging glue according to the real-time temperature information of the packaging glue; S33, substituting the packaging glue cooling temperature information into the cooling temperature distribution uniformity coefficient calculation formula to calculate the cooling temperature distribution uniformity coefficient, the cooling temperature distribution uniformity coefficient calculation formula is: Where T max Indicates the maximum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, T min Indicates the minimum packaging glue cooling temperature information monitored by the packaging glue temperature monitoring point, K TD represents the cooling temperature distribution uniformity coefficient; S34, substituting the cooling temperature variation uniformity coefficient and the cooling temperature distribution uniformity coefficient into the packaging glue cooling temperature uniformity coefficient calculation formula to calculate the packaging glue cooling temperature uniformity coefficient, the packaging glue cooling temperature uniformity coefficient calculation formula is: K T =α×K TC +(1-a)×K TD ; Where K TC Indicates the cooling temperature uniformity coefficient, K TD represents the cooling temperature distribution uniformity coefficient, α represents the adjustment factor, K T Indicates the uniformity coefficient of packaging glue cooling temperature.

4. The cooling effect analysis method for packaging adhesive according to claim 1, characterized in that: The step S32 includes the following specific steps: S321, obtaining real-time temperature information of the packaging glue; S322, substituting the real-time temperature information of the packaging glue into a cooling rate calculation formula to calculate the cooling rate of the packaging glue, the cooling rate calculation formula is: In the formula Indicates t c The average temperature information of all temperature monitoring points of the packaging glue at all times, Indicates t c+1 The average temperature information of all temperature monitoring points of the packaging glue at all times, R c represents the cooling rate at the cth monitoring time interval; S323, substituting the cooling rate into an average cooling rate calculation formula to calculate an average cooling rate, the average cooling rate calculation formula is: Where R c represents the cooling rate in the cth time period, C represents the number of monitoring time intervals, represents the average cooling rate; S324, substituting the cooling rate and the average cooling rate into a cooling rate standard deviation calculation formula to calculate the cooling rate standard deviation, the cooling rate standard deviation calculation formula is: Where R c represents the cooling rate at the cth monitoring time interval, represents the average cooling rate, C represents the number of monitoring time intervals, and σ represents the standard deviation of the cooling rate; S325, substituting the cooling rate standard deviation into the cooling temperature variation uniformity coefficient calculation formula to calculate the cooling temperature variation uniformity coefficient, the cooling temperature variation uniformity coefficient calculation formula is: Where σ represents the standard deviation of cooling rate, represents the average cooling rate, K TC Indicates the cooling temperature uniformity coefficient.

5. The cooling effect analysis method for packaging glue according to claim 1, characterized in that: Obtaining the packaging glue cooling index in step S4 includes the following specific steps: S41, obtaining the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient; S42, substituting the packaging glue contact coefficient, the material thermal conductivity coefficient and the packaging glue cooling temperature uniformity coefficient into the packaging glue cooling index calculation formula to calculate the packaging glue cooling index, the packaging glue cooling index calculation formula is: K=ω1×K R +ω2×K H +ω3×K T ; Where K R Indicates the packaging glue contact coefficient, K H Indicates the thermal conductivity of the material, K T represents the uniformity coefficient of packaging glue cooling temperature, ω1 represents the packaging glue contact weight, ω2 represents the material thermal conductivity weight, ω3 represents the packaging glue cooling temperature weight, and K represents the packaging glue cooling index.

6. The cooling effect analysis method for packaging adhesive according to claim 1, characterized in that: Obtaining the thermal conductivity of the material in step S3 includes the following specific steps: S35, obtaining the paper material information of the book to be packaged; S36, measuring the thermal conductivity of papers of different materials by a thermal conductivity analyzer, and constructing a paper thermal conductivity database; S37, importing the paper material information into the paper thermal conductivity database, and querying the material thermal conductivity corresponding to the paper material information in the paper thermal conductivity database.

7. A cooling effect analysis system for packaging adhesive, which is implemented based on a cooling effect analysis method for packaging adhesive according to any one of claims 1 to 6, characterized in that: The system comprises: An information collection module is used to collect the back image and paper material information of the book to be packaged, and also collect the temperature information of the packaging glue; A contact coefficient calculation module, used for obtaining a packaging adhesive contact coefficient according to the book spine image; A thermal conductivity and temperature uniformity coefficient calculation module, used to obtain the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient according to the paper material information and the packaging glue temperature information; A cooling index calculation module, used to obtain a packaging glue cooling index according to the packaging glue contact coefficient, the material thermal conductivity and the packaging glue cooling temperature uniformity coefficient, and determine that the packaging glue cooling is completed when the packaging glue cooling index is greater than a preset packaging glue cooling threshold; The control module is used to control the operation of the information acquisition module, the contact coefficient calculation module, the thermal conductivity and temperature uniformity coefficient calculation module and the cooling index calculation module.

8. An electronic device, comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor; characterized in that the processor executes a cooling effect analysis method for packaging glue as described in any one of claims 1-6 by calling the computer program stored in the memory.

9. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute a cooling effect analysis method for packaging adhesive as described in any one of claims 1 to 6.

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